Protective film, preparation method thereof, and display module

Abstract

The present application provides a protective film, a preparation method thereof, and a display module. The protective film includes a heat dissipation layer having a notch at an edge thereof; and a sealing edge layer disposed around the heat dissipation layer and filling the notch. Wherein, a first opening is formed in the sealing edge layer, and the position of the first opening corresponds to that of the notch. By providing a notch at the edge of the heat dissipation layer; and disposing the sealing edge layer around the heat dissipation layer and filling the notch, it is possible to integrally connect the part of the sealing edge layer for filling the notch and the part for surrounding the heat dissipation layer, and when cutting the heat dissipation layer and the sealing edge layer, it is possible to avoid as much as possible the misalignment of the two edges where the heat dissipation layer and the sealing edge layer need to contact, make the two edges where the heat dissipation layer and the sealing edge layer need to contact as flush as possible, reduce the risk of generating a gap between the two edges in contact after the heat dissipation layer and the sealing edge layer are laminated, and further reduce the risk of generating a mold mark.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly to a protective film, a preparation method thereof, and a display module. Background Art

[0002] Organic Light-Emitting Diode (OLED) display modules are favored by the market due to their characteristics of being thin, light, and bendable. However, due to their thin and light characteristics, OLED display modules are easily interfered by the outside world. Conventionally, a protective film (SCF Tape) is usually provided on the back of an OLED display module as a protective layer.

[0003] For a protective film that needs to be edge-sealed, gaps are likely to be generated during edge-sealing, resulting in a moire problem. Summary of the Invention

[0004] In view of this, the purpose of the present application is to provide a protective film, a preparation method thereof, and a display module to reduce the problem that gaps are likely to be generated during edge-sealing of the protective film, resulting in a moire.

[0005] Based on the above purpose, the present application provides a protective film, including:

[0006] A heat dissipation layer, having a notch at an edge thereof;

[0007] An edge-sealing layer, disposed around the heat dissipation layer and filling the notch;

[0008] Wherein, a first opening is formed in the edge-sealing layer, and the position of the first opening corresponds to that of the notch.

[0009] In some embodiments, with a plane parallel to the protective film as a reference plane, the shape of the positive projection of the notch on the reference plane is a rectangle, a triangle, a trapezoid, or a sector.

[0010] In some embodiments, the first opening is disposed at a position away from the edge of the notch.

[0011] In some embodiments, the minimum distance between the first opening and the notch is greater than 3 mm.

[0012] In some embodiments, the material of the heat dissipation layer is graphite.

[0013] In some embodiments, the material of the edge-sealing layer is polyester resin.

[0014] In some embodiments, the thickness of the heat dissipation layer is 24 - 26 mm, the thickness of the edge-sealing layer is 24 - 26 mm, and the thickness of the heat dissipation layer is the same as that of the edge-sealing layer.

[0015] An embodiment of the present application further provides a display module, including: a display panel and the protective film described in any one of the preceding items; the protective film is disposed on the backlight side of the display panel.

[0016] In some embodiments, it further includes a buffer layer, and the buffer layer is disposed on a side of the protective film close to the display panel;

[0017] Wherein, a second opening is formed in the buffer layer; the second opening is coaxially arranged with the first opening, and a positive projection of the second opening on a reference plane overlaps with a positive projection of the first opening on the reference plane.

[0018] In some embodiments, it further includes a metal layer, and the metal layer is disposed on a side of the protective film away from the display panel;

[0019] Wherein, a third opening is formed in the metal layer; the third opening is coaxially arranged with the first opening, and a positive projection of the first opening on a reference plane at least partially overlaps with a positive projection of the third opening on the reference plane.

[0020] An embodiment of the present application further provides a method for preparing a protective film, including:

[0021] Providing a stacked heat dissipation layer substrate and a sealing edge layer substrate;

[0022] Integrally cutting the stacked heat dissipation layer substrate and the sealing edge layer substrate to form a heat dissipation layer with a notch at the edge and a sealing edge layer for surrounding the heat dissipation layer and filling the notch; wherein, a first opening is formed in the sealing edge layer, and the first opening corresponds to the position of the notch;

[0023] Pressing the heat dissipation layer and the sealing edge layer so that the sealing edge layer surrounds the heat dissipation layer and fills the notch.

[0024] In some embodiments, taking a plane parallel to the protective film as a reference plane, a shape of a positive projection of the notch on the reference plane is a rectangle, a triangle, a trapezoid or a sector.

[0025] In some embodiments, the first opening is disposed at a position of the notch away from the edge.

[0026] In some embodiments, the material of the heat dissipation layer is graphite.

[0027] In some embodiments, the material of the sealing edge layer is polyester resin.

[0028] As can be seen from the above, for the protective film provided in the present application, a notch is provided at the edge of the heat dissipation layer; the edge sealing layer is disposed around the heat dissipation layer and fills the notch, enabling the part of the edge sealing layer for filling the notch to be integrally connected to the part for surrounding the heat dissipation layer, minimizing the dislocation of the two edges where the heat dissipation layer and the edge sealing layer need to be in contact during cutting, making the two edges where the heat dissipation layer and the edge sealing layer need to be in contact as flush as possible, reducing the risk of gaps occurring at the two edges in contact after the heat dissipation layer and the edge sealing layer are laminated, and thus reducing the risk of die marks. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the present application or related technologies, the following will briefly introduce the drawings required for use in the description of the embodiments or related technologies. Obviously, the drawings in the following description are only embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0030] Figure 1a The front view of an exemplary protective film;

[0031] Figure 1b is Figure 1a A sectional view along the AA' direction;

[0032] Figure 2a A sectional structure diagram of an exemplary heat dissipation structure layer substrate and an edge sealing structure layer substrate laminated;

[0033] Figure 2b is Figure 2a A sectional structure diagram of the heat dissipation structure layer and the edge sealing structure layer after cutting, laminated.

[0034] Figure 3a The front view of an exemplary protective film according to an embodiment of the present application;

[0035] Figure 3b The front view of an exemplary heat dissipation layer according to an embodiment of the present application;

[0036] Figure 3c The front view of an exemplary edge sealing layer according to an embodiment of the present application;

[0037] Figure 3d is Figure 3a A sectional view along the CC' direction;

[0038] Figure 4 A schematic diagram showing that the shape of the notch of the heat dissipation layer according to an embodiment of the present application is fan-shaped;

[0039] Figure 5 A schematic diagram showing that the shape of the notch of the heat dissipation layer according to an embodiment of the present application is trapezoidal;

[0040] Figure 6 Schematic diagram of the notch of the heat dissipation layer in the embodiment of the present application being triangular;

[0041] Figure 7 For Figure 3a The enlarged view at position B in

[0042] Figure 8 Structural diagram of an exemplary display module in the embodiment of the present application;

[0043] Figure 9 Another structural diagram of an exemplary display module in the embodiment of the present application;

[0044] Figure 10 Another structural diagram of an exemplary display module in the embodiment of the present application;

[0045] Figure 11 Flow chart of the preparation method of an exemplary protective film in the embodiment of the present application;

[0046] Figure 12a Cross-sectional structural diagram of an exemplary heat dissipation layer substrate and a sealing edge layer substrate stacked in the embodiment of the present application;

[0047] Figure 12b Cross-sectional structural diagram of an exemplary heat dissipation layer and a sealing edge layer stacked after cutting in the embodiment of the present application. Detailed implementation manners

[0048] To make the objectives, technical solutions and advantages of the present application clearer and more understandable, the following further elaborates on the present application in detail with reference to specific embodiments and the accompanying drawings.

[0049] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should have the ordinary meanings understood by those with ordinary skills in the field to which the present application belongs. The "first", "second" and similar terms used in the embodiments of the present application do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "including" or "comprising" mean that the elements or objects appearing before this word cover the elements or objects listed after this word and their equivalents, without excluding other elements or objects. Words such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Upper", "lower", "left", "right", etc. are only used to represent relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0050] Some OLED display modules (such as terminals like mobile phones and tablets) attach a protective film to the back of the display panel, and the protective film structure designs adopted by different levels of models are also different. In the case of high-end models, with the continuous increase in the refresh rate, the terminal pays more and more attention to the heat dissipation problem of the whole machine. And the display module is an important part of the heat generation of the terminal. Therefore, it is of great significance for the display module itself to carry out corresponding heat dissipation design.

[0051] Figures 1a - 1b The structure of a protective film of an exemplary OLED display module with a fingerprint recognition function is shown. Among them, Figure 1a is the front view of the protective film; Figure 1b is Figure 1a the cross-sectional view along the AA' direction.

[0052] As Figure 1a and Figure 1b shown, the protective film may include a heat dissipation structure layer 110 and a sealing edge structure layer 210 arranged on the same layer. Openings 310 are formed on the heat dissipation structure layer 110 to avoid the fingerprint recognition module of the display module. The sealing edge structure layer 210 is used to seal the outer edge and inner edge of the heat dissipation structure layer 110 to prevent the heat dissipation structure layer 110 from chipping and so on.

[0053] Figures 2a - 2b An exemplary Figure 1a and Figure 1b process diagram of the protective film in is shown. Among them, Figure 2a is the cross-sectional structure diagram of an exemplary heat dissipation structure layer substrate 111 and a sealing edge structure layer substrate 211 stacked. Figure 2b is the cross-sectional structure diagram of the heat dissipation structure layer 110 and the sealing edge structure layer 210 stacked after cutting. After pressing the heat dissipation structure layer 110 and the sealing edge structure layer 210 in Figure 2b , the cross-sectional structure diagram of the obtained protective film is obtained, that is, the protective film shown in Figure 1b is obtained.

[0054] The manufacturing process of the protective film may be, as Figure 2a shown, stack the heat dissipation structure layer substrate 111 and the sealing edge structure layer substrate 211 with the same size. Cut and remove the cut part to obtain the heat dissipation structure layer 110 and the sealing edge structure layer 210 stacked, as Figure 2b shown. Press the heat dissipation structure layer 110 and the sealing edge structure layer 210, and then the Figure 1bThe protective film in it. During the manufacturing process, since the parts of the heat dissipation structure layer substrate 111 that need to be adhered and removed are multiple isolated and discontinuous structures, and at the same time, the parts of the edge sealing structure layer substrate 211 that need to be adhered and removed are multiple isolated and discontinuous structures, it is very easy for the heat dissipation structure layer 110 and the edge sealing structure layer 210 to shift, so that the two edges where the heat dissipation structure layer 110 and the edge sealing structure layer 210 need to contact are misaligned, and it is very difficult to make the two edges where the heat dissipation structure layer 110 and the edge sealing structure layer 210 need to contact flush, resulting in a gap being formed between the two edges that come into contact after the heat dissipation structure layer 110 and the edge sealing structure layer 210 are pressed together. The air in the gap will expand when heated or contract when cooled, and it is very easy to form concave and convex deformations, resulting in the problem of die stamping.

[0055] Based on this, the embodiment of the present application provides a protective film 30, which can solve the die stamping problem at the joint of the protective film 30 at the heat dissipation layer 320 and the edge sealing layer 330 to a certain extent.

[0056] Figures 3a - 3d The structural schematic diagram of the exemplary protective film 30 of the embodiment of the present application is shown. Among them, Figure 3a is the front view of the protective film 30 of the embodiment of the present application. Figure 3b is the front view of the heat dissipation layer 320 of the embodiment of the present application. Figure 3c is the front view of the edge sealing layer 330 of the embodiment of the present application. Figure 3d is Figure 3a the sectional view along the CC' direction in

[0057] As Figure 3a shown, the protective film 30 provided by the embodiment of the present application may include a heat dissipation layer 320 and an edge sealing layer 330. Among them, the edge sealing layer 330 may be disposed around the heat dissipation layer 320. Specifically, as Figure 3b shown, a notch 322 is provided at the edge of the heat dissipation layer 320. As Figure 3c shown, the edge sealing layer 330 is provided with corresponding protrusions 332. Taking the plane parallel to the protective film 30 as the reference plane, the shape of the protrusions 332 is consistent with the shape of the notch 322, and the sizes are basically the same, so that the protrusions 332 fill the notch 322. That is to say, the edge sealing layer 330 is disposed around the heat dissipation layer 320 and fills the notch 322. The edge of the protrusion 332 contacts the inner edge of the notch 322. A first opening 311 may be provided at the protrusion 332 to avoid the fingerprint recognition module of the display module (as Figure 8 shown). That is to say, the edge sealing layer 330 is provided with a first opening 311, and the first opening 311 corresponds to the position of the notch 322. It should be understood that adhesive layers are respectively provided on the same side of the heat dissipation layer 320 and the edge sealing layer 330 to facilitate the attachment of the protective film 30. The thicknesses of the heat dissipation layer 320 and the edge sealing layer 330 may be basically the same, such asFigure 3d as shown

[0058] For the protective film 30 provided by the embodiment of the present application, by providing a notch 322 at the edge of the heat dissipation layer 320; the edge sealing layer 330 is arranged around the heat dissipation layer 320 and fills the notch 322, so that the part of the edge sealing layer 330 for filling the notch 322 (i.e., the convex part 332) is integrally connected to the part for surrounding the heat dissipation layer 320. When cutting the heat dissipation layer 320 and the edge sealing layer 330, it is possible to avoid the dislocation of the two edges that need to be in contact between the heat dissipation layer 320 and the edge sealing layer 330 as much as possible, make the two edges that need to be in contact between the heat dissipation layer 320 and the edge sealing layer 330 as flush as possible, reduce the risk of generating a gap between the two edges in contact after the heat dissipation layer 320 and the edge sealing layer 330 are pressed together, and further reduce the risk of generating die marks.

[0059] In some embodiments, the material of the heat dissipation layer 320 can be graphite, that is, the heat dissipation layer 320 can be a graphite layer. Using a graphite layer for heat dissipation has a good heat dissipation effect.

[0060] In some embodiments, the thickness of the heat dissipation layer 320 can be 24-26 mm.

[0061] In some embodiments, taking the plane parallel to the protective film 30 as the reference plane, the shape of the positive projection of the notch 322 on the reference plane can be a polygon. The included angle between two adjacent sides of the polygon can be a rounded corner to facilitate the preparation of the heat dissipation layer 320. In a specific application scenario, the optimal shape can be obtained through simulation according to actual needs and set accordingly.

[0062] Figures 3b - 6 shows a schematic diagram of the shape of an exemplary polygon. As Figures 3b - 6 shown, the polygon can be a rectangle, a triangle, a trapezoid or a sector, etc.

[0063] Figure 3b shows a schematic diagram of the shape of the notch 322 of the heat dissipation layer 320 in the embodiment of the present application being a rectangle (i.e., the polygon is a rectangle).

[0064] Please refer to Figure 3b , in some embodiments, the shape of the notch 322 of the heat dissipation layer 320 can be a rectangle. The rectangle has the advantages of simple cutting, etc.

[0065] Figure 4 shows a schematic diagram of the shape of the notch 322 of the heat dissipation layer 320 in the embodiment of the present application being a sector (i.e., the polygon is a rectangle).

[0066] Please refer to Figure 4, on the premise that the depression depth of the notch 322 is fixed, the notch 322 is fan-shaped, which can increase the area of the heat dissipation layer 320 to a certain extent (for example, compared with a rectangle), improve the heat dissipation efficiency, etc.

[0067] Figure 5 The figure shows a schematic diagram of the shape of the notch 322 of the heat dissipation layer 320 in the embodiment of the present application being trapezoidal (i.e., the polygon is trapezoidal).

[0068] Please refer to Figure 5 , in some embodiments, the shape of the notch 322 of the heat dissipation layer 320 can be trapezoidal. On the premise that the depression depth of the notch 322 is fixed, the notch 322 being trapezoidal can increase the area of the heat dissipation layer 320 to a certain extent (for example, compared with a rectangle), improve the heat dissipation efficiency, etc.

[0069] Figure 6 The figure shows a schematic diagram of the shape of the notch 322 of the heat dissipation layer 320 in the embodiment of the present application being triangular (i.e., the polygon is rectangular).

[0070] Please refer to Figure 6 , in some embodiments, the shape of the notch 322 of the heat dissipation layer 320 can be triangular. On the premise that the depression depth of the notch 322 is fixed, the notch 322 being triangular can increase the area of the heat dissipation layer 320 to a certain extent (for example, compared with a rectangle or a trapezoid, etc.), improve the heat dissipation efficiency, etc.

[0071] Return to Figure 3c , in some embodiments, the first opening 311 provided on the edge sealing layer 330 can be specifically provided at a position away from the edge of the notch 322 of the heat dissipation layer 320. That is, along the depression direction of the notch 322, the distance from the first opening 311 to the inner edge of the notch 322 (for example, the inner edge in Figure 3b or the inner edge in Figure 5 ) is less than the distance from the first opening 311 to the edge where the notch 322 is located. In this way, along the depression direction of the notch 322, the first opening 311 can be arranged in the middle of the protective film 30, improving the heat dissipation effect of the protective film 30.

[0072] Figure 7 The figure shows Figure 3a an enlarged view of point B in

[0073] Please refer to Figure 7 , the minimum distance d between the first opening 311 and the notch 322 can be greater than 3 mm, for example, about 5 mm.

[0074] In some embodiments, the material of the edge sealing layer 330 can be resin. The resin can be polyethylene glycol terephthalate (PET) or polyimide resin (PI) etc. according to the actual application situation.

[0075] In some embodiments, the thickness of the edge sealing layer 330 can be 24 - 26 mm.

[0076] For the protective film 30 provided by the embodiments of the present application, by setting the edge of the heat dissipation layer 320 to have a notch 322 and arranging the edge sealing layer 330 around the heat dissipation layer 320 to fill the notch 322, it can make the part of the edge sealing layer 330 for filling the notch 322 (i.e., the protruding part 332) integrally connected with the part for surrounding the heat dissipation layer 320, reducing the risk of generating a gap between the two edges where the heat dissipation layer 320 and the edge sealing layer 330 are in contact, and further reducing the risk of generating die marks. By setting the heat dissipation layer 320 as a graphite layer, the protective film 30 can have a good heat dissipation effect.

[0077] Based on the same inventive concept, corresponding to the protective film 30 in any of the above embodiments, the present application further provides a display module 40. The display module 40 includes the protective film 30 as described in any of the previous embodiments.

[0078] Figure 8 The structure diagram of an exemplary display module 40 provided by the embodiments of the present application is shown.

[0079] Reference Figure 8 , the display module 40 may include: a display panel 410 and a protective film 30. The protective film 30 can be arranged on the backlight side of the display panel 410. That is, the protective film 30 is arranged away from the light - emitting side of the display panel 410. The protective film 30 is attached to the backlight side of the display panel 410, which can play a role in heat dissipation, helping the heat generated during the operation of the display panel 410 to be quickly dissipated. In addition, it can play a role in light shielding.

[0080] In some embodiments, a fingerprint recognition area 411 can be arranged on the display panel 410. The first opening 311 of the protective film 30 corresponds to the position of the fingerprint recognition area 411. The shape of the display panel 410 can be rectangular etc. The display panel 410 can be a flexible display panel 410 etc.

[0081] Figure 9 The structure diagram of another exemplary display module 40 provided by the embodiments of the present application is shown.

[0082] As Figure 9As shown, in some embodiments, on the light-emitting side of the display panel 410, the display module 40 may further include a polarizer 420 (POL), an optically clear adhesive (OCA) layer 430, a cover plate 440, etc., which are stacked. The cover plate 440 may be, for example, a cover glass (CG), etc.

[0083] In some embodiments, the thickness of the cover glass may be 0.5 - 0.7 mm. The thickness of the OCA layer 430 may be 0.1 mm. The thickness of the polarizer 420 may be 99 - 106 mm. The thickness of the display panel 410 may be 0.13 mm.

[0084] Figure 10 Another structural diagram of the exemplary display module 40 provided by the embodiments of the present application is shown.

[0085] Reference Figure 10 , in some embodiments, the display module 40 may further include a buffer layer 50 and a metal layer 60 disposed on the backlight side of the display panel 410.

[0086] Specifically, the buffer layer 50 may be disposed on the side of the protective film 30 close to the display panel 410. By providing the buffer layer 50, external forces can be buffered, and damage to the display panel 410 caused by the pressure during the attachment of the protective film 30 can be prevented. The material of the buffer layer 50 may be foam, that is, the buffer layer 50 may be a foam layer. The buffer layer 50 can have good shock absorption, surface following, step following, and good stress release capabilities, and can better complete the buffering function. Among them, shock absorption refers to the ability to absorb the impact force, deformation, etc. of the impact; surface following and step following refer to the ability to follow the same changes well when bending or having a cross-section.

[0087] It should be understood that on the side of the buffer layer 50 close to the display panel 410, an adhesive layer may be provided to facilitate the attachment of the buffer layer 50 to the display panel 410.

[0088] In some embodiments, the buffer layer 50 is provided with a second opening 51. The second opening 51 corresponds to the position of the fingerprint recognition area 411 of the display panel 410. The second opening 51 and the first opening 311 are coaxially arranged, and the orthographic projection of the second opening 51 on a reference plane (for example, a plane parallel to the protective film 30, or the plane where the display panel 410 is located) overlaps (for example, completely overlaps) with the orthographic projection of the first opening 311 on the reference plane (for example, a plane parallel to the protective film 30, or the plane where the display panel 410 is located).

[0089] In some embodiments, the metal layer 60 may be disposed on a side of the protective film 30 away from the display panel 410. The material of the metal layer 60 may be copper foil. That is, the metal layer 60 may be a copper foil layer. The copper foil layer can enhance the heat conduction and electrical conductivity of the heat dissipation layer 320 and achieve a certain degree of electromagnetic shielding to avoid the mutual influence of free charges scattered from the display panel 410.

[0090] In some embodiments, it should be understood that an adhesive layer may be provided on a side of the metal layer 60 close to the protective film 30 to facilitate the attachment of the metal layer 60 to the display panel 410.

[0091] In some embodiments, the metal layer 60 is provided with a third opening 61. The third opening 61 corresponds to the position of the fingerprint recognition area 411 of the display panel 410. The third opening 61 is coaxially arranged with the first opening 311, and the orthographic projection of the first opening 311 on a reference plane (for example, a plane parallel to the protective film 30, or the plane where the display panel 410 is located) and the orthographic projection of the third opening 61 on the reference plane (for example, a plane parallel to the protective film 30, or the plane where the display panel 410 is located) at least partially overlap.

[0092] In some embodiments, the orthographic projection of the first opening 311 on the reference plane and the orthographic projection of the third opening 61 on the reference plane (for example, a plane parallel to the protective film 30, or the plane where the display panel 410 is located) may partially overlap. For example, the orthographic projection of the third opening 61 on the reference plane (for example, a plane parallel to the protective film 30, or the plane where the display panel 410 is located) may cover the orthographic projection of the first opening 311 on the reference plane (for example, a plane parallel to the protective film 30, or the plane where the display panel 410 is located), etc.

[0093] The display module 40 of the above embodiments has the protective film 30 in any of the foregoing embodiments and has the beneficial effects of the corresponding protective film 30 embodiments, which will not be elaborated herein.

[0094] Based on the same inventive concept, an embodiment of the present application also provides a method for preparing a protective film 30 for preparing the protective film 30 in any of the foregoing embodiments.

[0095] Figure 11 The flowchart of an exemplary method for preparing the protective film 30 according to an embodiment of the present application is shown.

[0096] As Figure 11 shown, the method for preparing the protective film 30 according to an embodiment of the present application may include,

[0097] S1010, providing a stacked heat dissipation layer substrate 321 and a sealing edge layer substrate 331;

[0098] S1020, integrally cut the stacked heat dissipation layer substrate 321 and the edge sealing layer substrate 331 to form a heat dissipation layer 320 with a notch 322 at the edge and an edge sealing layer 330 for surrounding the heat dissipation layer 320 and filling the notch 322; wherein, a first opening 311 is formed in the edge sealing layer 330, and the position of the first opening 311 corresponds to that of the notch 322;

[0099] S1030, press the heat dissipation layer 320 and the edge sealing layer 330 so that the edge sealing layer 330 is arranged around the heat dissipation layer 320 and fills the notch 322.

[0100] Figures 12a - 12b The figure shows a process diagram of manufacturing an exemplary protective film 30 according to an embodiment of the present application.

[0101] Figure 12a It is a cross-sectional structure diagram of an exemplary stacked heat dissipation layer substrate 321 and edge sealing layer substrate 331 according to an embodiment of the present application.

[0102] In some embodiments, in step S1010, the stacked heat dissipation layer substrate 321 and edge sealing layer substrate 331 can be as Figure 12a shown. Among them, the shapes and sizes of the heat dissipation layer substrate 321 and the edge sealing layer substrate 331 can be the same. The material of the heat dissipation layer substrate 321 can be graphite, and the material of the edge sealing layer substrate 331 can be polyester resin (Polyethylene terephthalate, PET) or polyimide resin (Polyimide, PI), etc. The thickness of the heat dissipation layer substrate 321 can be 24 - 26 mm, and the thickness of the edge sealing layer substrate 331 can be 24 - 26 mm.

[0103] Figure 12b It is a cross-sectional structure diagram of an exemplary stacked heat dissipation layer 320 and edge sealing layer 330 after cutting according to an embodiment of the present application.

[0104] In some embodiments, in step S1020, it may specifically include:

[0105] Integrally cut the heat dissipation layer substrate 321 and the edge sealing layer substrate 331, so that the heat dissipation layer substrate 321 forms a notch 322 at the cut edge, and the edge sealing layer substrate 331 forms a protrusion 332 at the cut edge. Then cut the protrusion 332 to form a first opening 311. In this way, the cutting is completed.

[0106] In some embodiments, taking the plane parallel to the protective film 30 as the reference plane, the shape of the orthographic projection of the notch 322 on the reference plane can be a rectangle, a triangle, a trapezoid, a sector, etc. The shape can be determined according to specific circumstances.

[0107] In some embodiments, the first opening 311 may be disposed at a position away from the edge of the notch 322.

[0108] In some embodiments, the minimum distance between the first opening 311 and the notch 322 (e.g., Figure 7 d in ) is greater than 3 mm.

[0109] Remove the cut edge portion of the heat dissipation layer substrate 321 by means of adhesion removal or the like, and at the same time remove the cut middle portion of the edge sealing layer substrate 331. Refer to Figure 12b , thus, the heat dissipation layer 320 and the edge sealing layer 330 are obtained.

[0110] In this manufacturing process, since the cut portion to be removed by adhesion in the heat dissipation layer substrate 321 is a whole, and the cut portion to be removed by adhesion in the edge sealing layer substrate 331 is also a whole, the heat dissipation layer substrate 321 and the edge sealing layer substrate 331 can be removed by adhesion as a whole, so as to make the remaining heat dissipation layer substrate portion and the remaining edge sealing layer substrate portion receive as consistent forces as possible, and make the two edges of the remaining heat dissipation layer substrate portion and the remaining edge sealing layer substrate portion that need to contact as flush as possible, thereby minimizing the formation of a gap between the two edges of the heat dissipation layer 320 and the edge sealing layer 330 that come into contact after lamination. In this way, the risk of generating die marks can be reduced.

[0111] Laminate the heat dissipation layer 320 and the edge sealing layer 330 into one layer by means of lamination or the like, that is, obtain Figure 3d the protective film 30 in.

[0112] The protective film 30 provided by the present application, its preparation method, and the display module 40, by providing the heat dissipation layer 320 having a notch 322 at the edge; an edge sealing layer 330 disposed around the heat dissipation layer 320 and filling the notch 322; the edge sealing layer 330 is provided with a first opening 311, and the position of the first opening 311 corresponds to that of the notch 322. It can make the part of the edge sealing layer 330 for filling the notch 322 and the part for surrounding the heat dissipation layer 320 integrally connected, and minimize the misalignment of the two edges of the heat dissipation layer 320 and the edge sealing layer 330 that need to contact when cutting the heat dissipation layer 320 and the edge sealing layer 330, make the two edges of the heat dissipation layer 320 and the edge sealing layer 330 that need to contact as flush as possible, reduce the risk of generating a gap between the two edges of the heat dissipation layer 320 and the edge sealing layer 330 that come into contact after lamination, and further reduce the risk of generating die marks.

[0113] Those of ordinary skill in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of the present application (including the claims) is limited to these examples; within the concept of the present application, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations in different aspects of the embodiments of the present application as described above, and they are not provided in detail for the sake of brevity.

[0114] In addition, for simplicity of explanation and discussion, and in order not to make the embodiments of the present application difficult to understand, the well-known power / ground connections to integrated circuit (IC) chips and other components may or may not be shown in the provided drawings. Further, the devices may be shown in block diagram form in order to avoid making the embodiments of the present application difficult to understand, and this also takes into account the fact that the details of the implementation of these block diagram devices are highly dependent on the platform on which the embodiments of the present application are to be implemented (i.e., these details should be fully within the understanding of those skilled in the art). In cases where specific details (such as circuits) are set forth to describe exemplary embodiments of the present application, it will be apparent to those skilled in the art that the embodiments of the present application may be implemented without these specific details or with variations of these specific details. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0115] Although the present application has been described in connection with specific embodiments of the present application, many alternatives, modifications, and variations of these embodiments will be apparent to those of ordinary skill in the art based on the foregoing description.

[0116] The embodiments of the present application are intended to cover all such alternatives, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application shall be included within the protection scope of the present application.

Claims

1. A protective film, characterized in that, The protective film is disposed on the backlight side of the display panel; the protective film includes: a heat dissipation layer, with a notch at the edge of the heat dissipation layer; a sealing layer, disposed around the heat dissipation layer and filling the notch; the part of the sealing layer for filling the notch is integrally connected to the part of the sealing layer for surrounding the heat dissipation layer; wherein, the sealing layer is provided with a first opening, the first opening corresponds to the position of the notch; the first opening is disposed at a position away from the edge of the notch; the first opening is used to avoid the fingerprint recognition module.

2. The protective film according to claim 1, characterized in that, Taking the plane parallel to the protective film as the reference plane, the shape of the positive projection of the notch on the reference plane is rectangular, triangular, trapezoidal or fan-shaped.

3. The protective film according to claim 1, characterized in that, The minimum distance between the first opening and the notch is greater than 3 mm.

4. The protective film according to claim 1, characterized in that, The material of the heat dissipation layer is graphite.

5. The protective film according to claim 1, characterized in that, The material of the sealing layer is polyester resin.

6. The protective film according to claim 1, characterized in that, The thickness of the heat dissipation layer is 24 - 26 mm, the thickness of the sealing layer is 24 - 26 mm, and the thicknesses of the heat dissipation layer and the sealing layer are the same.

7. A display module, characterized in that, including: a display panel and the protective film according to any one of claims 1 - 6.

8. The display module according to claim 7, wherein It further includes a buffer layer, and the buffer layer is disposed on the side of the protective film close to the display panel; wherein, the buffer layer is provided with a second opening; the second opening is coaxially arranged with the first opening, and the positive projection of the second opening on the reference plane overlaps with the positive projection of the first opening on the reference plane.

9. The display module according to claim 7, wherein It further includes a metal layer, and the metal layer is disposed on the side of the protective film away from the display panel; wherein, the metal layer is provided with a third opening; the third opening is coaxially arranged with the first opening, and at least part of the positive projection of the first opening on the reference plane overlaps with the positive projection of the third opening on the reference plane.

10. A method for preparing a protective film, characterized in that, The protective film is disposed on the backlight side of the display panel; the manufacturing method includes: providing a heat dissipation layer substrate and a sealing layer substrate which are stacked; integrally cutting the stacked heat dissipation layer substrate and sealing layer substrate to form a heat dissipation layer with a notch at the edge and a sealing layer for surrounding the heat dissipation layer and filling the notch; wherein, the part of the sealing layer for filling the notch is integrally connected to the part of the sealing layer for surrounding the heat dissipation layer; the sealing layer is provided with a first opening, the first opening corresponds to the position of the notch; the first opening is disposed at a position away from the edge of the notch; the first opening is used to avoid the fingerprint recognition module; pressing the heat dissipation layer and the sealing layer so that the sealing layer is disposed around the heat dissipation layer and fills the notch.

11. The method for preparing the protective film according to claim 10, wherein, Taking the plane parallel to the protective film as the reference plane, the shape of the positive projection of the notch on the reference plane is rectangular, triangular, trapezoidal or fan-shaped.

12. The method for preparing the protective film according to claim 10, wherein The material of the heat dissipation layer is graphite.

13. The method for preparing the protective film according to claim 10, wherein The material of the sealing layer is polyester resin.

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