Substrate processing apparatus

Abstract

A substrate processing apparatus is provided. In a substrate processing apparatus that supplies a processing liquid to a rotating substrate (9) to process the substrate (9), an upper support body (31) as an annular member is detachably placed on a lower support body (21) that supports the substrate (9). The upper support body (31) covers an outer edge portion of the substrate (9) and rotates together with the lower support body (21). The upper support body (31) includes an annular side wall portion (311) that opposes the outer periphery of the substrate (9) and the outer periphery of the upper support body (31) in a radial direction, and an annular upper portion (312) that extends radially inward from the annular side wall portion (311) and opposes an outer edge portion of an upper surface of the substrate (9) in a vertical direction. An opening area of the annular upper portion (312) is 1 / 2 or more of an area of the substrate (9).

Description

[0001] Related applications

[0002] This application claims the benefit of priority to Japanese Patent Application JP2021-155615, filed on September 24, 2021, all disclosures of which are incorporated herein by reference. Technical Field

[0003] This invention relates to a technique for treating a substrate by supplying a processing liquid to the substrate. Background Technology

[0004] In the past, during the manufacturing process of substrates such as semiconductor substrates or glass substrates (hereinafter referred to as "substrate"), the substrate is rotated while a processing liquid is supplied to it. At this time, it is known to have a member positioned above the substrate and facing it, and to perform processing while rotating the member together with the substrate. For example, in JP Patent Application Publication No. 2019-021675, the facing member is mounted on a rotating base and faces the upper surface of the substrate. In JP Patent Application Publication No. 2016-039282, a top plate faces the upper surface of the substrate and rotates together with it.

[0005] On the other hand, it is also known to perform specific treatments on the outer edge of a generally circular substrate. For example, Japanese Patent Application Publication No. 2009-266951 discloses a technique of supplying an etching solution to the lower surface of a substrate and using the etching solution that wraps around the outer peripheral end (i.e., the beveled portion) of the upper surface for etching.

[0006] Furthermore, in order to stably process the outer edge of the substrate, it is required to set the airflow in the outer edge to a desired value. However, it is difficult to set the airflow to the desired value simply by controlling the flow rate of the gas supplied to the substrate. Even when the substrate is covered with a shielding plate, it is difficult to set the airflow to the desired value at the outer edge of the substrate. Summary of the Invention

[0007] The purpose of this invention is to easily set the airflow in the outer edge of the substrate to a desired value.

[0008] Aspect 1 of the present invention is a substrate processing apparatus for processing a substrate by supplying a processing liquid to the substrate, the substrate processing apparatus comprising: a support portion for directly or indirectly supporting the substrate in a horizontal position; a rotating portion for rotating the support portion about a central axis in the vertical direction; an annular member that is mounted on the support portion with the support portion off the ground, covers the outer edge of the substrate supported by the support portion and rotates together with the support portion; and a processing liquid supply portion for supplying processing liquid to the upper or lower surface of the substrate supported by the support portion, the annular member comprising: an annular sidewall portion that is radially opposed to the outer periphery of the substrate supported by the support portion and the outer periphery of the support portion; and an annular upper portion that extends radially inward from the annular sidewall portion and is vertically opposed to the outer edge of the upper surface of the substrate supported by the support portion, the opening area of ​​the annular upper portion above the substrate being at least 1 / 2 of the area of ​​the substrate.

[0009] In this invention, the airflow in the outer edge of the substrate can be easily set to a desired value.

[0010] In addition to the substrate processing apparatus of aspect 1, aspect 2 of the present invention further includes an airflow generating section that generates a downward airflow toward the opening in the annular upper part.

[0011] In aspect 3 of the present invention, based on the substrate processing apparatus of aspect 1 or aspect 2, the annular upper portion includes an annular protrusion protruding downward in the inner periphery of the lower surface.

[0012] In aspect 4 of the present invention, based on any one of aspects 1 to 3 of the substrate processing apparatus, the processing liquid supply unit supplies etching liquid to the lower surface of the substrate supported by the support unit.

[0013] In addition to any one of aspects 1 to 4, aspect 5 of the present invention further includes an annular cover disposed in a static state on the radially outer side of the annular member, wherein the upper part of the annular cover is closer to the outer peripheral surface of the annular sidewall portion as it moves radially inward.

[0014] In aspect 6 of the present invention, based on any one of aspects 1 to 5 of the substrate processing apparatus, the opening area of ​​the annular upper portion above the substrate is 3 / 4 or more of the area of ​​the substrate.

[0015] In aspect 7 of the present invention, based on any one of aspects 1 to 6 of the substrate processing apparatus, the range above the annular upper portion covering the substrate extends radially inward by 20 mm or less from the outer peripheral end of the substrate.

[0016] In aspect 8 of the present invention, based on any one of aspects 1 to 7 of the substrate processing apparatus, the processing liquid supply unit supplies processing liquid to the upper surface of the substrate at a position closer to the inner peripheral end of the annular upper portion than the central axis, or at a position where the annular upper portion overlaps with the substrate in the vertical direction.

[0017] The aforementioned objectives, as well as their features, aspects, and advantages, will become clear from the following detailed description of the invention with reference to the accompanying drawings. Attached Figure Description

[0018] Figure 1 This is a side view showing the configuration of a substrate processing apparatus according to one embodiment.

[0019] Figure 2 This is a plan view showing a portion of the substrate processing apparatus.

[0020] Figure 3A It is a longitudinal sectional view of the upper support body placed on the lower support body.

[0021] Figure 3B It is a longitudinal sectional view showing the upper support body being lifted from the lower support body.

[0022] Figure 4 This is a flowchart illustrating an example of the operation of a substrate processing apparatus.

[0023] Figure 5A This is a diagram showing the state of the substrate processing apparatus.

[0024] Figure 5B This is a diagram showing the state of the substrate processing apparatus.

[0025] Figure 5C This is a diagram showing the state of the substrate processing apparatus.

[0026] Figure 5D This is a diagram showing the state of the substrate processing apparatus.

[0027] Figure 6 This is a diagram showing the state of the etching solution.

[0028] Figure 7A This is a diagram showing another example of the construction of the lifting upper support.

[0029] Figure 7B This is a diagram showing another example of the construction of the lifting upper support.

[0030] Figure 8A This is another example of the construction of the lifting upper support.

[0031] Figure 8B This is another example of the construction of the lifting upper support.

[0032] Figure 9 This is a longitudinal sectional view showing a substrate processing apparatus with the lower holding member omitted.

[0033] Figure 10 It is shown Figure 9 A plan view of a portion of the substrate processing apparatus.

[0034] Figure 11 This is a diagram showing the ejection direction of the treatment liquid from the nozzle.

[0035] The reference numerals in the attached figures are explained as follows:

[0036] 1. Substrate processing apparatus

[0037] 2 Lower support section

[0038] 4. Processing fluid supply unit

[0039] 9 substrate

[0040] 12 Rotating part

[0041] 16. Circular cover

[0042] 21 Lower support body

[0043] 31. Upper support (ring-shaped component)

[0044] 41 Lower nozzle

[0045] 42 Upper nozzle

[0046] 111 Airflow Generating Unit

[0047] 311 Annular sidewall portion

[0048] 312 Upper circumferential part

[0049] 313 Opening

[0050] 314 Annular protrusion

[0051] J1 central axis Detailed Implementation

[0052] Figure 1 This is a side view showing the configuration of a substrate processing apparatus 1 according to an embodiment of the present invention. The substrate processing apparatus 1 is a single-sheet apparatus for processing semiconductor substrates 9 (hereinafter simply referred to as "substrate 9") one by one. The substrate processing apparatus 1 supplies processing liquid to the substrate 9 for processing. Figure 1 The diagram shows a portion of the structure of the substrate processing apparatus 1 in cross-section. Furthermore, the parallel diagonal lines representing the cross-section appropriately omit details.

[0053] The substrate processing apparatus 1 includes a housing 11, a lower support 2, an upper support 3, a rotating part 12, a lifting part 13, a liquid receiving part 15, an annular cover 16, a processing liquid supply part 4, and a control part (not shown in the figure). The housing 11 houses the lower support 2, the upper support 3, the rotating part 12, the lifting part 13, the liquid receiving part 15, the annular cover 16, and the processing liquid supply part 4. Figure 1 The housing 11 is depicted in cross-section. An airflow generating section 111 is provided at the top cover of the housing 11 to supply gas to the internal space, forming a downward airflow (so-called a downdraft). The airflow generating section 111 may be, for example, an FFU (fan filter unit).

[0054] The control unit is located outside the housing 11 and controls the lower support 2, upper support 3, rotating part 12, lifting part 13, and processing fluid supply part 4. The control unit may include, for example, a typical computer with a processor, memory, input / output unit, and bus. The bus is a signal circuit connecting the processor, memory, and input / output unit. The memory stores programs and various information. The processor performs various processes (e.g., numerical calculations) using the memory according to the programs stored therein. The input / output unit includes a keyboard and mouse for receiving input from the operator, a display for showing output from the processor, and a transmitter for sending output from the processor.

[0055] The lower support portion 2 supports the substrate 9 in a horizontal position. In this embodiment, the lower support portion 2 directly supports the substrate 9, but as described later, the lower support portion 2 can also indirectly support the substrate 9. "Indirectly supporting the substrate 9" means supporting the substrate 9 by means of a component that can be detached from or cannot be detached from the lower support portion 2. The lower support portion 2 includes a lower support body 21, a plurality of lower gripping members 22, and a lower gripping drive portion 23. Figure 1 In the image, a lower holding member 22 is shown on the left. The lower support 21 is opposite to the lower surface of the substrate 9. That is, the upper surface of the lower support 21 is separate from the substrate 9 and is opposite to the lower surface of the substrate 9.

[0056] Multiple lower gripping members 22 protrude upward from the lower support body 21 and engage with the outer edge of the substrate 9, thereby gripping the substrate 9. The lower gripping members 22 are so-called "support pins." Each lower gripping member 22 is pin-shaped, with its upper portion thinner than its lower portion. The lower gripping member 22 moves by rotating about a central axis in the vertical direction, causing its upper portion to be misaligned with the central axis, and engages with the outer edge of the substrate 9. The lower gripping members 22 mechanically support the substrate 9.

[0057] Figure 2 This is a plan view showing a portion of the annular cover 16 of the substrate processing apparatus 1 and its inner side. Figure 2The left side shows the upper surface of the lower support 21, and the right side shows the state in which the upper support 31 (described later) is mounted on the lower support 21. Figure 2 As shown, in this embodiment, three lower gripping members 22 are provided on the lower support body 21. The three lower gripping members 22 are arranged at equal intervals in the circumferential direction with respect to the central axis J1 when the substrate 9 is rotated. Figure 1 As shown, each lower gripping member 22 passes through the lower support body 21 in the vertical direction and is rotatably supported on the lower support body 21 by means of bearings (not shown). In the following description, the circumferential direction centered on the central axis J1 will be simply referred to as "circumferential direction", the radial direction centered on the central axis J1 will be simply referred to as "radial direction", and the direction parallel to the central axis J1 will be simply referred to as "axial direction".

[0058] like Figure 1 As shown, the lower gripping drive unit 23 (refer to) Figure 1 The left side includes a holding-side magnetic body 231, a driving-side magnetic body 232, and a magnetic body moving part 233 (see reference). Figure 1 The right side of the figure, and the restored part of the position omitted in the figure. The gripping side magnetic body 231 is mechanically connected to the lower end of the lower gripping member 22. In this embodiment, the gripping side magnetic body 231 is a magnet. The driving side magnetic body 232 is annular about the central axis J1. In this embodiment, the driving side magnetic body 232 is a magnet. The magnetic body moving part 233 raises and lowers the driving side magnetic body 232. In fact, the two magnetic body moving parts 233 are arranged opposite each other about the central axis J1 (see the following description). Figure 2 The magnetic moving part 233). Three or more magnetic moving parts 233 may be arranged circumferentially. The number of magnetic moving parts 233 may also be one. As the magnetic moving part 233, various mechanisms can be used, such as a mechanism combined with a cylinder, a ball screw in a rotary motor, a linear motor, etc. The position returning part in this embodiment is a magnet fixed to the lower surface of the lower support 21. The position returning part is close to the magnetic part 231 on the gripping side. In addition, in Figure 2 The diagram shows the position restoration section 334 of the upper grip drive unit 33, which will be described later. The position restoration section of the lower grip drive unit 23 is set according to the position restoration section 334 of the upper grip drive unit 33.

[0059] When the drive-side magnetic body 232 is lowered by the magnetic body moving part 233, the lower gripping member 22 is positioned to grip the substrate 9 by the magnetic force between the gripping-side magnetic body 231 and the position restoration part. That is, the upper part of the lower gripping member 22 is in contact with the outer edge of the substrate 9. The magnetic force can be either an attractive force or a repulsive force, as will be explained below. When the drive-side magnetic body 232 is raised by the magnetic body moving part 233, the magnetic force between the gripping-side magnetic body 231 and the drive-side magnetic body 232 and the magnetic force between the gripping-side magnetic body 231 and the position restoration part cancel each other out, thereby rotating the lower gripping member 22 to a position where it does not grip the substrate 9. That is, the upper part of the lower gripping member 22 separates from the outer edge of the substrate 9.

[0060] When the drive-side magnetic body 232 is lowered from the above state by the magnetic body moving part 233, the lower gripping member 22 is returned to the position of gripping the substrate 9 by the magnetic force between the gripping side magnetic body 231 and the position restoration part. The lower gripping drive part 23 moves the plurality of lower gripping members 22 to a position where they can separate from or connect with the outer edge of the substrate 9. The drive-side magnetic body 232 is annular about the central axis J1, so the lower gripping member 22 can grip or not grip the substrate 9 during the rotation of the substrate 9. By using magnets, the lower gripping member 22 can be moved with a simple structure.

[0061] Furthermore, the gripping-side magnetic body 231, the driving-side magnetic body 232, and the position-restoring part do not necessarily all have to be magnets. Within the range where magnetic force can be generated, one of them can be a magnetic body such as iron. That is, at least one of the gripping-side magnetic body 231 and the driving-side magnetic body 232 is a magnet, and at least one of the gripping-side magnetic body 231 and the position-restoring part is a magnet. Moreover, the position-restoring part may not be a magnetic body, for example, it can be an elastic body such as a spring. In this case, the elastic force acting between the lower gripping member 22 and the position-restoring part is used to move the lower gripping member 22 from a position where it does not grip the substrate 9 to a position where it grips the substrate 9. Moreover, as long as the substrate 9 can be gripped by a configuration that can use, for example, centrifugal force to position the lower gripping member 22 in the position where it grips the substrate 9 while the substrate 9 is rotating, the position-restoring part can be omitted.

[0062] The upper support portion 3 supports the substrate 9 in a horizontal position. In this embodiment, the upper support portion 3 directly supports the substrate 9. The upper support portion 3 includes an upper support body 31, a plurality of upper gripping members 32, and an upper gripping drive portion 33 (see reference). Figure 1 (On the right side). Figure 1In the image, an upper holding member 32 is shown on the right. An upper support 31 is positioned opposite the upper surface of the substrate 9. That is, the upper support 31 is separate from the substrate 9 and is positioned opposite the upper surface of the substrate 9. More precisely, the upper support 31 is positioned opposite a portion of the upper surface of the substrate 9 in a vertically separated manner.

[0063] In this embodiment, the upper support 31 is an annular member centered on the central axis J1. The upper support 31 is detachably mounted on the lower support portion 2 (the lower support 21). The upper support 31 covers the outer edge of the substrate 9 supported on the lower support portion 2 and rotates together with the lower support portion 2 (excluding the non-rotating portion). In the following description, when referring to the rotation of the lower support portion 2, the rotating portion of the lower support portion 2 specifically refers to the lower support 21 and the lower holding member 22. In addition, "the substrate 9 supported by the lower support portion 2" means, for ease of explanation when considering the replacement operation described later, "the substrate 9 supported only by the lower support portion 2", "the substrate 9 indirectly supported on the lower support portion 2 by means of the upper support portion 3", and "the substrate 9 supported by the lower support portion 2 and the upper support portion 3". The same applies below unless the support is specifically described.

[0064] Figure 3A This is a diagram showing a longitudinal cross-section (here, only one side relative to the central axis J1) of the upper support 31 mounted on the lower support 21. The upper support 31, as an annular member, includes an annular sidewall portion 311 radially opposed to the outer periphery of the substrate 9 supported by the lower support portion 2 and the outer periphery of the lower support portion 2 (excluding the lower gripping drive portion 23), and an annular upper portion 312 extending radially inward from the annular sidewall portion 311 and opposed vertically to the outer edge of the upper surface of the substrate 9. The opening 313 of the annular upper portion 312 above the substrate 9 (see reference...) Figure 1 as well as Figure 2 The area of ​​the substrate 9 is preferably more than 1 / 2 of the area of ​​the substrate 9 (more precisely, the area of ​​the substrate 9 when viewed from above. The same applies below).

[0065] The opening 313 is relatively large above the substrate 9, and preferably, the area of ​​the opening 313 is more than 3 / 4 of the area of ​​the substrate 9. Especially when the substrate processing apparatus 1 processes the outer edge of the substrate 9, and more preferably when etching the outer edge of the substrate 9, the range of the annular upper portion 312 covering the upper part of the substrate 9 is preferably 20 mm or less from the outer peripheral end (edge) of the outer periphery of the substrate 9 inwardly. More preferably, the above range is 10 mm or less.

[0066] Figure 3BThis is a longitudinal sectional view showing the upper support 31 lifted from the lower support 21 by the lifting part 13 (described later). Multiple upwardly projecting protrusions 215 are provided on the upper surface of the lower support 21. The protrusions 215 are connected to the upper holding member 32 (see reference 32). Figure 1 Compared to being located radially outward, multiple protrusions 215 are arranged at equal intervals in the circumferential direction. For example, the number of protrusions 215 is 3 or 6, preferably located between the upper gripping member 32 and the lower gripping member 22 in the circumferential direction. The number of protrusions 215 is not limited to 3 or 6, as long as there are 2 or more, preferably 3 or more. A pin-shaped small protrusion 216 is provided at the upper end of the protrusion 215. Figure 2 The description of protrusion 215 is omitted in the text.

[0067] On the other hand, such as Figure 3B As shown, a plurality of downwardly protruding portions 315 are provided on the lower surface of the annular upper portion 312 of the upper support body 31. The protruding portions 315 are positioned corresponding to the protruding portions 215 of the lower support body 21. The number of protruding portions 315 is the same as the number of protruding portions 215. A small upwardly recessed portion 316 is provided at the lower end of each protruding portion 315. When the upper support body 31 is placed on the lower support body 21, the positions of the protruding portions 215 and 315 are aligned, and the small protrusions 216 are inserted into the small recesses 316 by lowering the upper support body 31. Figure 3A As shown, protrusion 215 connects with protrusion 315. Thus, the position of the upper support body 31 relative to the lower support body 21 is fixed circumferentially and radially. When the lower support body 21 (and the lower gripping member 22) is rotated about the central axis J1 by the rotating part 12, the upper support body 31 (and the upper gripping member 32) also rotates about the central axis J1. In other words, when the lower support 2 rotates about the central axis J1, the upper support 3 (excluding the non-rotating parts) also rotates about the central axis J1. In the following description, when referring to the rotation of the upper support 3, the same applies as with the lower support 2; it refers to the rotating parts of the upper support 3, specifically the upper support body 31 and the upper gripping member 32.

[0068] If the preferred positions of the engaging portions (protrusions 215, 315) that engage the upper support 31 and the lower support 21 are expressed in the usual manner, the engaging portions are located radially further outward than the position of the holding substrate 9, and circumferentially located among multiple positions of the holding substrate 9.

[0069] When the upper support 31 is mounted on the lower support 21, the structure that fixes the position of the upper support 31 relative to the lower support 21 in the circumferential and radial directions can be modified in various ways. For example, a small recess can be provided in the protrusion 215, and a small protrusion can be provided in the protrusion 315. The protrusion can be provided only in the lower support 21 or the upper support 31. Moreover, a structure that fixes the relative position of the upper support 31 relative to the lower support 21 only in the circumferential direction and a structure that fixes the relative position of the upper support 31 relative to the lower support 21 only in the radial direction can be provided between the lower support 21 and the upper support 31. A structure that fixes the position of the upper support 31 relative to the lower support 21 in both the circumferential and radial directions can also be provided between the annular sidewall portion 311 of the lower support 21 and the upper support 31.

[0070] like Figure 3A As shown, with the upper support 31 resting on the lower support 21, the annular sidewall portion 311 separates radially outward from the lower support 21. The lower end of the annular sidewall portion 311 is located below the upper surface of the lower support 21. Alternatively, the lower end of the annular sidewall portion 311 may be located below the lower surface of the lower support 21. The lower surface of the annular upper portion 312 is preferably smoothly connected to the inner circumferential surface of the annular sidewall portion 311. That is, the lower surface of the annular upper portion 312 and the inner circumferential surface of the annular sidewall portion 311 are connected in a longitudinal section via a generally arcuate or generally elliptical arcuate portion. Therefore, even if liquid adheres to the lower surface of the annular upper portion 312, the liquid will be smoothly guided by the inner circumferential surface of the annular sidewall portion 311 and discharged downward from the annular sidewall portion 311.

[0071] The upper end of the inner circumferential surface of the annular sidewall portion 311 can be appropriately defined, but if the lower surface of the annular upper portion 312 is connected to the inner circumferential surface of the annular sidewall portion 311 by a smooth surface or an inclined surface (hereinafter referred to as a "connecting surface"), the connecting surface can also be considered as part of the inner circumferential surface of the annular sidewall portion 311. That is, the upper end of the inner circumferential surface of the annular sidewall portion 311 can be understood as the boundary between the lower surface of the annular upper portion 312 and the connecting surface. Thus, when the connecting surface is located to the side of the upper and lower surfaces of the substrate 9, the annular sidewall portion 311 is located radially outward of the substrate 9, and it can be said that the annular sidewall portion 311 receives droplets flying from the substrate 9. Under this understanding, the upper end of the inner circumferential surface of the annular sidewall portion 311 is located above the upper surface of the substrate 9.

[0072] like Figure 3AAs shown, an annular protrusion 314 protruding downwards is provided on the inner periphery of the lower surface of the annular upper portion 312. The annular protrusion 314 is annular about the central axis J1. The annular protrusion 314 can be provided at the inner periphery end of the annular upper portion 312, or at a position slightly radially outward compared to the inner periphery end. The radial width of the annular protrusion 314 and the height extending downwards from the lower surface of the annular upper portion 312 are appropriately set according to the airflow to be generated at the outer edge of the substrate 9 being processed, as described later. Due to the presence of the annular protrusion 314, the airflow velocity between the upper surface of the substrate 9 and the upper support 31 is increased to a higher level than in the case where the annular protrusion 314 is not present. Furthermore, the annular protrusion 314, together with the annular upper portion 312, generates the desired airflow at the outer edge of the substrate 9. If the desired airflow at the outer edge of the substrate 9 can be generated using the annular upper portion 312 without the annular protrusion 314, the annular protrusion 314 can be omitted.

[0073] The term "outer edge" of substrate 9 refers to a certain width of area extending from the outer peripheral end of substrate 9 toward the center of substrate 9. This width can be very small or it can have a certain size. For example, "outer edge" can be simply an arc-shaped region at the outer peripheral end in a longitudinal section of substrate 9, or it can be an arc-shaped region plus a region extending inward toward the center of substrate 9 by several centimeters. As will be described later, the area from the lower surface of substrate 9 to the upper surface (e.g., a range of 0.5 to 3 mm) can also be considered the outer edge, as can the area where substrate 9 overlaps with the annular upper portion 312 in the vertical direction. Alternatively, the radially outer region of the annular protrusion 314 on substrate 9 can be considered the outer edge. Of course, the term "outer edge" should be understood appropriately according to the context in which it is used.

[0074] like Figure 1 As shown, multiple upper gripping members 32 protrude downward from the upper support 31 and contact the outer edge of the substrate 9, thereby gripping the substrate 9. The upper gripping members 32 are so-called "support pins." They are pin-shaped, with a lower portion thinner than the upper portion. By rotating the upper gripping member 32 about a central axis in the vertical direction, its lower portion, which is misaligned with the central axis, moves and contacts the outer edge of the substrate 9. The upper gripping members 32 mechanically support the substrate 9. Furthermore, to ensure that the substrate 9 can be gripped without falling using only the upper gripping members 32, a recess is provided on the lower side of the upper gripping member 32 where it contacts the substrate 9, corresponding to the outer edge of the substrate 9.

[0075] like Figure 2As shown, in this embodiment, three upper gripping members 32 are provided on the upper support body 31. The three upper gripping members 32 are arranged at equal intervals in the circumferential direction centered on the central axis J1 when the substrate 9 is rotated. The upper gripping members 32 are positioned between the lower gripping members 22. Figure 2 In this example, the upper grip member 32 and the lower grip member 22 are alternately arranged at a 60-degree interval. The number of upper grip members 32 and lower grip members 22 is not limited to three; it can also be four or more. The number of upper grip members 32 and the number of lower grip members 22 can be different. For example... Figure 1 As shown, each upper holding member 32 passes through the upper support body 31 in the vertical direction and is rotatably supported on the upper support body 31 by means of bearings (not shown).

[0076] The upper grip drive unit 33 has a structure based on the grip drive unit 23. Upper grip drive unit 33 (refer to...) Figure 1 The right side includes a holding-side magnetic body 331, a driving-side magnetic body 332, and a magnetic body moving part 333 (see reference). Figure 1 (left side), and position restoration part 334 (refer to) Figure 2 Holding side magnetic body 331 as Figure 1 As shown, it is mechanically connected to the upper end of the upper gripping member 32. In this embodiment, the gripping-side magnetic body 331 is a magnet. The driving-side magnetic body 332 is an annular shape centered on the central axis J1 (see reference). Figure 2 In this embodiment, the driving-side magnetic body 332 is a magnet. The magnetic body moving part 333 causes the driving-side magnetic body 332 to rise and fall. Figure 2 As shown, two magnetic moving parts 333 are arranged opposite each other with the central axis J1 as the center. Three or more magnetic moving parts 333 can be arranged circumferentially. The number of magnetic moving parts 333 can be one. Various mechanisms can be used as the magnetic moving parts 333, such as cylinders, mechanisms that assemble ball screws into rotary motors, linear motors, etc. In this embodiment, the position returning part 334 is a magnet fixed to the upper surface of the upper support 31. The position returning part 334 is located near the gripping side magnetic part 331.

[0077] When the drive-side magnetic body 332 is raised by the magnetic body moving part 333, the upper gripping member 32 is positioned to grip the substrate 9 by the magnetic force between the gripping-side magnetic body 331 and the position restoration part 334. That is, the lower part of the upper gripping member 32 is in contact with the outer edge of the substrate 9. When the drive-side magnetic body 332 is lowered by the magnetic body moving part 333, the magnetic force between the gripping-side magnetic body 331 and the drive-side magnetic body 332 cancels out the magnetic force between the gripping-side magnetic body 331 and the position restoration part 334, thereby rotating the upper gripping member 32 to a position where it does not grip the substrate 9. That is, the lower part of the upper gripping member 32 separates from the outer edge of the substrate 9.

[0078] When the driving-side magnetic body 332 is raised from this state by the magnetic body moving part 333, the upper gripping member 32 is returned to the position of gripping the substrate 9 by the magnetic force between the gripping-side magnetic body 331 and the position restoration part 334. In this way, the upper gripping driving part 33 can move multiple upper gripping members 32 separately from or in contact with the outer edge of the substrate 9. The driving-side magnetic body 332 is annular about the central axis J1, so the upper gripping member 32 can grip or not grip the substrate 9 during the rotation of the substrate 9. By using magnets, the upper gripping member 32 can be moved with a simple structure.

[0079] Furthermore, the gripping-side magnetic body 331, the driving-side magnetic body 332, and the position-restoring part 334 do not necessarily all have to be magnets. Within the range where magnetic force can be generated, one of them can also be a magnetic body such as iron. That is, at least one of the gripping-side magnetic body 331 and the driving-side magnetic body 332 is a magnet, and at least one of the gripping-side magnetic body 331 and the position-restoring part 334 is a magnet. Moreover, the position-restoring part 334 may not be a magnetic body, for example, it can be an elastic body such as a spring. In this case, the upper gripping member 32 is moved from a position where it does not grip the substrate 9 to a position where it grips the substrate 9 by utilizing the elastic force acting between the upper gripping member 32 and the position-restoring part 334. Moreover, as long as the substrate 9 can be gripped by a configuration in which the upper gripping member 32 is positioned in the position of gripping the substrate 9 by means of centrifugal force during the period when the substrate 9 is rotating, the position-restoring part 334 can also be omitted.

[0080] like Figure 1 As shown, the rotation shaft of the rotating part 12 is connected to the lower support body 21. The rotating part 12 rotates the lower support body 2 around the central shaft J1. The rotating shaft is hollow, and its upper end becomes the lower nozzle 41, which will be described later.

[0081] The lifting unit 13 raises and lowers the upper support body 31 relative to the lower support body 21. The upper support body 31 is a mounting member placed on the lower support body 21. That is, the lifting unit 13 raises and lowers the upper support body 31, which serves as the mounting member, relative to the lower support unit 21. The lifting unit 13 includes a lifting drive unit 131 and a front end portion 132 that is raised and lowered by the lifting drive unit 131. As the lifting drive unit 131, various mechanisms can be used, such as a cylinder, a mechanism combining a ball screw with a rotary motor, a linear motor, etc. Figure 2 As shown, in practice, the two lifting parts 13 are positioned opposite each other with the central axis J1 as the center. Three or more lifting parts 13 can be arranged circumferentially.

[0082] A groove 34, recessed radially inward, is provided along the entire circumference of the outer periphery of the upper support 31. The front end portion 132 of the lifting part 13 extends radially outward into the groove 34 of the support 31. Figure 3B As shown, when the front end 132 rises, the downward-facing surface 341 on the upper side of the groove 34 comes into contact with the upper surface 133 of the front end 132, and the upper support 31 separates from the lower support 21 upwards. Hereinafter, the groove 34 will be referred to as the "first abutting part", the front end 132 as the "second abutting part", the surface 341 as the "first abutting surface", and the upper surface 133 as the "second abutting surface".

[0083] When the second abutment part 132 is lowered by the lifting drive unit 131, as Figure 3A As shown, the upper support 31 is placed on the lower support 21, and the second abutment surface 133 is separated from the first abutment surface 341. That is, the second abutment portion 132 is separated from the first abutment portion 34. The first abutment portion 34 is formed around the entire circumference, so the lower support 2 can rotate in the state where the first abutment portion 34 and the second abutment portion 132 are separated. The first abutment surface 341 is an annular surface centered on the central axis J1, so the upper support 31 can be raised or lowered using the lifting part 13 at any rotational position.

[0084] The lifting part 13 supports the outer periphery of the upper support body 31 and raises and lowers the upper support body 31. Therefore, in the substrate processing apparatus 1, there is no mechanism for raising and lowering the upper support body 31 directly above it. As a result, the height of the substrate processing apparatus 1 can be kept very low. To achieve this configuration, preferably, with the upper support body 31 mounted on the lower support part 2, the position of the first abutment part 34 in the height direction is preferably 150 mm or less away from the upper surface of the lower support body 21. This ensures processing space and keeps the height of processing-related parts very low. In addition, the space above the upper support body 31 can be utilized effectively. More preferably, the position of the first abutment part 34 in the height direction is 100 mm or less away from the upper surface of the upper support body 31. More preferably, the height of the upper support body 31 is 150 mm or less.

[0085] like Figure 1 As shown, an annular liquid receiving portion 15 is provided below the gap between the lower support body 21 and the annular sidewall portion 311 of the upper support body 31. The liquid receiving portion 15 is annular with the central axis J1 as its center. The liquid receiving portion 15 receives liquid falling from the gap between the lower support body 21 and the annular sidewall portion 311.

[0086] The annular cover 16 is positioned in a stationary state on the radially outer side of the upper support 31, which serves as an annular member. The annular cover 16 is annular about the central axis J1. The upper part of the annular cover 16 is closer to the outer peripheral surface of the annular sidewall portion 311 of the upper support 31 as it moves radially inward. The inner peripheral end of the annular cover 16 is separated from the outer peripheral surface of the annular sidewall portion 311. The lifting drive portion 131 of the lifting portion 13 is provided on the annular cover 16. As a result, the size (so-called occupied area) of the substrate processing apparatus 1 in the horizontal plane can be minimized. In the substrate processing apparatus 1, the magnetic moving portion 333 of the upper holding drive portion 33 is also provided on the annular cover 16 (see reference). Figure 2 Therefore, the size within the horizontal plane of the substrate processing device 1 can be kept very small.

[0087] In this embodiment, the upper support 31 directly receives droplets flying from the substrate 9; therefore, an annular cover 16 is provided to help prevent droplet scattering. This reduces the radial width of the annular cover 16 compared to the case where droplets are directly received, and eliminates the need for a mechanism to move the annular cover 16 vertically, simplifying the device structure. The upper support 31 rotates together with the substrate 9; therefore, compared to the case without the annular sidewall portion 311, the amount of droplets generated when they collide with the annular sidewall portion 311 is also suppressed. The fixed configuration of the annular cover 16 facilitates the provision of a lifting drive unit 131 or a magnetic moving part 333 on the annular cover 16. An exhaust portion for venting air to the outside of the substrate processing apparatus 1 is provided below the annular cover 16.

[0088] like Figure 1 As shown, the processing liquid supply unit 4 includes a lower nozzle 41, an upper nozzle 42, a nozzle moving part (not shown), and a processing liquid supply source (not shown). The lower nozzle 41 is located at the upper end of the rotation axis of the rotating part 12, as described above. The processing liquid ejected from the lower nozzle 41 is supplied to the lower surface of the substrate 9 supported by the lower support part 2. The upper nozzle 42 moves between a position above the substrate 9 and a position away from the substrate 9 via the nozzle moving part. The processing liquid ejected from the upper nozzle 42 is supplied to the upper surface of the substrate 9 supported by the lower support part 2. The processing liquid supply source supplies processing liquid from a storage tank containing processing liquid to the lower nozzle 41 and the upper nozzle 42 respectively using a pump or the like. In this embodiment, the processing liquid supplied to the lower nozzle 41 is a rinsing liquid such as deionized water or an etching solution. The processing liquid supplied to the upper nozzle 42 is a rinsing liquid such as deionized water. Carbonated water, hydrogen water, ozone water, SC1, SC2, etc., can be used as the rinsing liquid. The etching solution is, for example, an aqueous solution of hydrofluoric acid, nitric acid, hydrochloric acid, sulfuric acid or hydrogen peroxide solution, or a mixture of two or more of these selected from the above, or a solution including these aqueous solutions or mixtures.

[0089] The processing solution is not limited to rinsing solution or etching solution. Furthermore, in this embodiment, the upper nozzle 42 can be omitted. Depending on the type of processing, the lower nozzle 41 may also be omitted, and only the upper nozzle 42 is provided on the substrate processing apparatus 1. When the upper support 31 rises to move the substrate 9 in or out, the upper nozzle 42 is retracted to a position that does not interfere with the upper support 31 by means of the nozzle moving part.

[0090] Figure 4 This is a flowchart illustrating an example of the operation of the substrate processing apparatus 1. Figures 5A to 5D This diagram shows the state of the substrate processing apparatus 1. The substrate processing apparatus 1 operates according to the control of the control unit (not shown in the diagram).

[0091] First, such as Figure 5A As shown, with the upper support 31 raised, the drive-side magnetic body 332 of the upper gripping drive unit 33 close to the gripping-side magnetic body 331, and the drive-side magnetic body 232 of the lower gripping drive unit 23 close to the gripping-side magnetic body 231, the substrate 9 is moved in by an external transport mechanism (step S11). Thereafter, the drive-side magnetic body 232 is lowered by the magnetic body moving part 233 of the lower gripping drive unit 23, and the substrate 9 is gripped by the lower gripping member 22 (step S12).

[0092] By using the magnetic moving part 333 and the lifting part 13 of the upper gripping drive unit 33, the upper support body 31 is lowered while maintaining the driving-side magnetic body 332 and the gripping-side magnetic body 331 close together. Thus, the upper support body 31 is placed on the lower support body 21 (step S13). Thereafter, the driving-side magnetic body 332 is raised by the magnetic moving part 333, as... Figure 5B As shown, the substrate 9 is held by the upper holding member 32 (step S14). That is, the substrate 9 is held by the upper support portion 3 and the lower support portion 2.

[0093] The rotating part 12 rotates the lower support part 2. As a result, the substrate 9 rotates (step S15). The upper nozzle 42 moves upward from a position retracted to the side of the upper support 31. First, rinsing liquid is supplied from the lower nozzle 41 and the upper nozzle 42 of the processing liquid supply part 4 to the lower and upper surfaces of the rotating substrate 9. The supplied rinsing liquid flows radially outward on the lower and upper surfaces of the substrate 9, scattering from the outer periphery of the substrate 9 and being received by the annular sidewall part 311 of the upper support 31. The liquid falls downward from the annular sidewall part 311 and is received by the liquid receiving part 15. After this, the supply of rinsing liquid is stopped.

[0094] Next, etching solution is supplied to the lower surface of substrate 9 from lower nozzle 41. The supplied etching solution flows radially outward on the lower surface of substrate 9, and is dispersed from the outer peripheral end of substrate 9 and received by annular sidewall portion 311. The liquid falls downward from annular sidewall portion 311 and is received by liquid receiving portion 15.

[0095] Figure 6 This diagram illustrates the state of the etching solution 8. The etching solution 8 flowing on the lower surface of the substrate 9 slightly wraps around the upper surface from the outer periphery of the substrate 9. Hereinafter, the radial distance 5 by which the etching solution 8 wraps around the upper surface from the outer periphery of the substrate 9 is referred to as the "wrap-in amount". The wrap-in amount 5 is affected by various main factors, one of which is the velocity of the airflow tending to move radially outward on the upper surface of the substrate 9. The cross-sectional shape of the annular upper portion 312 of the upper support 31 is designed to achieve this desired airflow velocity. Specifically, refer to... Figure 3A The shape of the longitudinal section of the upper support 31 is designed by adjusting the width of the overlap between the annular upper portion 312 and the outer edge of the substrate 9 in the vertical direction, the distance between the upper surface of the substrate 9 and the annular upper portion 312, the radial width of the annular protrusion 314, the height of the annular protrusion 314 from the lower surface of the annular upper portion 312 downwards, and the radial position of the annular protrusion 314. In particular, the annular protrusion 314 makes it easy to set the airflow speed on the outer edge of the substrate 9 to the desired speed, and the inset amount 5 is set to an appropriate distance.

[0096] Based on this, in this embodiment, the airflow from the airflow generating section 111 is directly guided to the upper surface of the substrate 9 through the opening 313 of the upper support 31. Therefore, it is easier to set the airflow velocity on the outer edge of the substrate 9 to the desired velocity. The direct introduction of the airflow from the airflow generating section 111 to the upper surface of the substrate 9 is achieved by directly opposing at least a portion of the airflow generating section 111 and at least a portion of the upper surface of the substrate 9 in the vertical direction (without any object in between).

[0097] With the diameter and thickness of substrate 9 being 300 mm and 775 μm respectively, the calculated winding amount 5 is 2 mm to 3 mm.

[0098] During the period when the etching solution is supplied to the substrate 9, the substrate 9 is replaced in the substrate processing apparatus 1. Specifically, as follows: Figure 5C As shown, the magnetic moving part 233 of the lower gripping drive unit 23 raises the drive-side magnetic body 232, releasing the lower gripping member 22 from the substrate 9, and only the upper gripping member 32 grips the substrate 9. Thereafter, the magnetic moving part 233 lowers the drive-side magnetic body 232, returning it to the state of gripping the substrate 9 using the lower gripping member 22 and the upper gripping member 32. Next, as... Figure 5D As shown, the magnetic moving part 333 of the upper gripping drive unit 33 lowers the drive-side magnetic body 332, releasing the upper gripping member 32 from the substrate 9, leaving the substrate 9 held only by the lower gripping member 22. Thereafter, the magnetic moving part 333 raises the drive-side magnetic body 332, returning it to the state of holding the substrate 9 using both the lower gripping member 22 and the upper gripping member 32. This process is repeated to replace the substrate 9. Afterward, the supply of etching solution to the substrate 9 is stopped.

[0099] Typically, the amount of winding increases near the point where the substrate 9 contacts the holding member. By replacing the substrate 9, the increase in the amount of winding is reduced.

[0100] Furthermore, the time for holding the substrate 9 using only the upper gripping member 32 and the time for holding the substrate 9 using only the lower gripping member 22 do not need to be the same. Also, the states of holding the substrate 9 using only the upper gripping member 32 and holding the substrate 9 using only the lower gripping member 22 do not need to alternate. It is sufficient that during the processing of the substrate 9, there exist states where multiple upper gripping members 32 are used to hold the substrate 9 without using multiple lower gripping members 22, and states where multiple lower gripping members 22 are used to hold the substrate 9 without using multiple upper gripping members 32. Therefore, processing can be performed using the processing liquid at the gripping position.

[0101] Rinsing liquid is supplied again to the lower and upper surfaces of the substrate 9 from the lower nozzle 41 and upper nozzle 42 of the processing liquid supply unit 4. The supplied rinsing liquid flows radially outward on the lower and upper surfaces of the substrate 9, and is dispersed from the outer peripheral end of the substrate 9 and received by the annular sidewall portion 311 of the upper support 31. The liquid falls downward from the annular sidewall portion 311 and is received by the liquid receiving portion 15. Thereafter, the supply of rinsing liquid is stopped. Through the above process, the process of supplying processing liquid to the substrate 9 is completed (step S16). The substrate 9 can also be replaced during the period when the rinsing liquid is supplied to the substrate 9. The substrate 9 can also be replaced when the rinsing liquid is supplied to the substrate 9 before the etching liquid is supplied to the substrate 9.

[0102] In the substrate processing apparatus 1, a substrate 9 is held by three lower gripping members 22 and three upper gripping members 32. When processing liquid is supplied to the lower surface of the substrate 9, a portion of the processing liquid flowing radially outward collides with the lower gripping members 22. Assuming that six lower gripping members 22 are provided instead of the upper gripping members 32, the amount of processing liquid colliding with the lower gripping members 22 increases. As a result, the amount of mist or droplets generated by the processing liquid also increases. In the substrate processing apparatus 1, by providing the upper gripping members 32, the generation of mist or droplets of the processing liquid can be reduced, thereby improving the processing quality.

[0103] The rotation of substrate 9 is stopped (step S17). The drive-side magnetic body 232 of the lower gripping drive unit 23 rises, releasing the lower gripping member 22 from gripping substrate 9. Simultaneously, the drive-side magnetic body 332 of the upper gripping drive unit 33 descends, also releasing the upper gripping member 32 from gripping substrate 9. The upper nozzle 42 retracts to the side, as... Figure 5A As shown, the upper support 31 and the drive-side magnetic body 332 are raised by the lifting part 13 and the magnetic body moving part 333 (step S18). Then, the substrate 9 is moved out by an external conveying mechanism (step S19).

[0104] Various modifications can be made in the substrate processing apparatus 1.

[0105] Figure 7A as well as Figure 7B This is a diagram showing another example of a structure for raising and lowering the upper support 31, and... Figure 3A as well as Figure 3B Each corresponds to one another. Figure 7A This is a diagram showing a longitudinal section of the upper support 31 mounted on the lower support 21 (here, only one side relative to the central axis J1). Figure 7B This is a longitudinal sectional view showing the state in which the upper support 31 is lifted from the lower support 21 by the lifting part 13.

[0106] like Figure 7A as well as Figure 7BAs shown, the upper support 31, which serves as a mounting member, has a radially outwardly projecting engaging portion 34a along its entire circumference. The outer peripheral end of the engaging portion 34a also has a portion that projects downward. The front end portion 132 of the lifting portion 13 extends radially outward toward the outer peripheral surface of the upper support 31 below the engaging portion 34a. The front end portion 132 has a portion that projects upward. Figure 7B As shown, when the front end 132 rises, the radially inner side of the downward-protruding portion of the engaging portion 34a, facing downwards, comes into contact with the upper surface 133 of the portion protruding upwards towards the front end 132, and the upper support 31 separates from the lower support 21 upwards. Hereinafter, the engaging portion 34a will be referred to as the "first abutting portion", the front end 132 as the "second abutting portion", the surface 341 as the "first abutting surface", and the upper surface 133 as the "second abutting surface".

[0107] When the second abutment part 132 is lowered by the lifting drive part 131, as Figure 7A As shown, the upper support 31 is placed on the lower support 21, causing the second abutment surface 133 to separate from the first abutment surface 341. That is, the second abutment portion 132 is separated from the first abutment portion 34a. The first abutment portion 34a is formed around the entire circumference, therefore, the lower support 2 can rotate while the first abutment portion 34a and the second abutment portion 132 are separated. The first abutment surface 341 is an annular surface centered on the central axis J1, therefore, the upper support 31 can be raised or lowered by the lifting part 13 regardless of its rotational position.

[0108] Figure 8A as well as Figure 8B This is another example of the construction of the lifting upper support 31, and... Figure 3A as well as Figure 3B Each corresponds to one another. Figure 8A This is a view from the lifting section 13 side showing the upper support 31 and front end 132 mounted on the lower support 21 (not shown). Figure 8A The image shows a portion of the outer peripheral surface of the upper support 31 and a cross-section of the front end portion 132. Figure 8B This is a diagram of the upper support body 31 and its front end 132, viewed from the side of the lifting part 13, showing the upper support body 31 being lifted from the lower support body 21 by the lifting part 13.

[0109] like Figure 8A as well as Figure 8BAs shown, the outer circumference of the upper support 31, which serves as a mounting member, is provided with a radially inward recessed groove 34. A portion of the groove 34 forms an upwardly expanding portion 342, and two downwardly protruding portions 343 are provided on the sidewall facing downwards from the expanding portion, i.e., on the upper side of the expanded groove. On the other hand, two downwardly recessed portions 134 are provided on the upper surface 133 of the front end portion 132 of the lifting portion 13. The protruding portions 343 are generally conical, and the recessed portions 134 are also generally conical. Other structures are similar to... Figure 3A as well as Figure 3B same.

[0110] like Figure 8B As shown, when the front end portion 132 rises, the protrusion 343 of the enlarged portion 342 engages with the recess 134 of the front end portion 132, and the upper support body 31 separates from the lower support body 21 upwards. Hereinafter, the enlarged portion 342 will be referred to as the "first abutting portion", the front end portion 132 as the "second abutting portion", the protrusion 343 as the "first abutting element", and the recess 134 as the "second abutting element".

[0111] When the second abutment part 132 is lowered by the lifting drive part 131, the upper support body 31 is placed on the lower support body 21, such as Figure 8A As shown, the second abutting element 134 separates from the first abutting element 343. That is, the second abutting portion 132 separates from the first abutting portion 342. Moreover, the second abutting portion 132 is located within the groove 34, which is formed around the entire circumference. Therefore, the lower support portion 2 can rotate in the state where the first abutting portion 342 and the second abutting portion 132 are separated. When the rotation of the lower support body 21 and the upper support body 31 stops, the lower support body 21 stops at a rotational position that coincides with the circumferential position of the first abutting portion 342 and the second abutting portion 132.

[0112] The first abutting portion 342 and the second abutting portion 132 include a misalignment prevention structure that engages when they abut against each other, namely, the first abutting element 343 and the second abutting element 134. Therefore, misalignment of the upper support 31 relative to the support 21 is reliably prevented when the upper support 31 rises. Furthermore, the number of the first abutting element 343 and the second abutting element 134 corresponding to one lifting portion 13 can each be one. Of course, the number of the first abutting element 343 and the second abutting element 134 corresponding to one lifting portion 13 can each be three or more. As described above, the multiple lifting portions 13 are provided in the circumferential direction; therefore, the multiple first abutting elements 343 and the multiple second abutting elements 134 are arranged in the circumferential direction. The arrangement of the first abutting elements 343 does not need to be equally spaced in the circumferential direction, nor does the arrangement of the second abutting elements 134 need to be equally spaced in the circumferential direction.

[0113] Figure 9This is a longitudinal cross-sectional view showing a portion of the substrate processing apparatus 1 with the lower holding member 22 omitted. Figure 10 This is a plan view showing a portion of the annular cover 16 of the substrate processing apparatus 1 and its inner side. (See diagram below.) Figure 10 As shown, in the substrate processing apparatus 1, six upper gripping members 32 are provided, and a first driving-side magnetic body 332a and a second driving-side magnetic body 332b are provided as driving-side magnetic bodies. The first driving-side magnetic body 332a is annular about the central axis J1 and is located radially inside the six gripping-side magnetic bodies 331a and 331b. The second driving-side magnetic body 332b is also annular about the central axis J1 and is located radially outside the six gripping-side magnetic bodies 331a and 331b. The first driving-side magnetic body 332a moves up and down via two magnetic body moving parts 333a. The second driving-side magnetic body 332b moves up and down via two magnetic body moving parts 333b. The configuration of the magnetic body moving parts 333a and 333b is the same as that of the driving-side magnetic bodies 332a and 332b, except that their positions are different. Figure 1 as well as Figure 2 The magnetic moving part 333 shown is the same. Figure 9 as well as Figure 10 In the middle, to and Figure 1 as well as Figure 2 The same constituent elements are labeled with the same reference numerals.

[0114] The three gripping-side magnetic bodies 331a (hereinafter referred to as "first gripping-side magnetic bodies") and three gripping-side magnetic bodies 331b (hereinafter referred to as "second gripping-side magnetic bodies") have different magnetization states and are arranged alternately in the circumferential direction. For example... Figure 9 As shown, when the first driving side magnetic body 332a and the second driving side magnetic body 332b are raised, the magnetic force between the first holding side magnetic body 331a and the second holding side magnetic body 331b and the position restoration part 334 makes the six upper holding members 32 hold the substrate 9.

[0115] When the second driving-side magnetic body 332b is maintained in an upward state, and the first driving-side magnetic body 332a is lowered by the magnetic body moving part 333a, the magnetic force between the first gripping-side magnetic body 331a and the first driving-side magnetic body 332a cancels out the magnetic force between the first gripping-side magnetic body 331a and the position restoration part 334, resulting in a state where the three upper gripping members 32 connected to the first gripping-side magnetic body 331a do not grip the substrate 9. At this time, the magnetic force between the second gripping-side magnetic body 331b and the first driving-side magnetic body 332a is sufficiently small compared to the magnetic force between the second gripping-side magnetic body 331b and the position restoration part 334, or it acts in the gripping direction, and the three upper gripping members 32 connected to the second gripping-side magnetic body 331b maintain the state of gripping the substrate 9.

[0116] When the first driving-side magnetic body 332a is maintained in an upward state, and the second driving-side magnetic body 332b is lowered by the magnetic body moving part 333b, the magnetic force between the second gripping-side magnetic body 331b and the second driving-side magnetic body 332b cancels out the magnetic force between the second gripping-side magnetic body 331b and the position restoration part 334, resulting in a state where the three upper gripping members 32 connected to the second gripping-side magnetic body 331b do not grip the substrate 9. At this time, the magnetic force between the first gripping-side magnetic body 331a and the second driving-side magnetic body 332b is sufficiently small compared to the magnetic force between the first gripping-side magnetic body 331a and the position restoration part 334, or it acts in the gripping direction, and the three upper gripping members 32 connected to the first gripping-side magnetic body 331a maintain the state of gripping the substrate 9.

[0117] Furthermore, when the substrate 9 is being moved in, with the upper support 31 in a raised state, multiple upward pushing mechanisms 24 disposed below the lower support 21 (in Figure 2 (The pin, not shown in the diagram), rises from the hole in the lower support 21, and the substrate 9 is placed on the pin. Then, while maintaining the position of the six upper holding members 32 not holding the substrate 9 by a mechanical mechanism not shown in the diagram, the upper support 31 is lowered, and the substrate 9 is held by the six upper holding members 32. The pin of the push mechanism 24 descends.

[0118] Subsequently, while rotating the substrate 9 as described above, processing liquid is supplied to the upper and lower surfaces of the substrate 9, causing the first driving-side magnetic body 332a and the second driving-side magnetic body 332b to descend alternately, thereby performing the substrate 9 replacement operation. The removal of the substrate 9 is the opposite of the loading of the substrate 9.

[0119] As described above, the substrate 9 can be held solely by the upper holding member 32. In this case, the processing liquid supplied to the back side of the substrate 9 will not interfere with the lower holding member, thus reducing the amount of mist or droplets caused by the scattering of the processing liquid. As a result, the quality of the processing can be improved.

[0120] exist Figure 9 as well as Figure 10 In the substrate processing apparatus 1 shown, the substrate 9 is supported by the upper support portion 3. On the other hand, the upper support body 31 of the upper support portion 3 is supported by the lower support portion 2. Therefore, the substrate 9 is indirectly supported by the lower support portion 2. Figure 1 as well as Figure 2In the substrate processing apparatus 1 shown, the substrate 9 is basically supported by the lower support portion 2, but during replacement operations, the substrate 9 is temporarily supported indirectly by the lower support portion 2. The structure in which the substrate 9 is indirectly supported is not limited to the above-described structure. For example, a component other than the upper support portion 31 may be mounted on the lower support portion 21, and the substrate 9 may be supported by that component. Furthermore, in the substrate processing apparatus 1, by making the upper support portion 31 an annular member, the upper support portion 31 is made lightweight. From this viewpoint, it is not necessary to support the substrate 9 from above, and the substrate 9 can be supported solely by the lower support portion 2. That is, the upper gripping member 32 or its driving configuration can be omitted, and the substrate 9 is supported solely by the lower gripping member 22.

[0121] Furthermore, the support of the substrate 9 is not limited to the method of holding it using the upper holding member 32 or the lower holding member 22. For example, the substrate 9 may also be supported by attraction at the center or outer periphery of its lower surface. Regardless of the method of support of the substrate 9, by making the upper support body 31 an annular member, the desired airflow can be generated at the outer edge of the upper surface of the substrate 9 during the process of rotating the substrate 9. In addition, the upper support body 31 is only required to be an annular member and is not limited to a circular shape. That is, the outer periphery of the upper support body 31 or the inner periphery of the opening 313 is not limited to a circle.

[0122] As described above, in the substrate processing apparatus 1, by making various modifications to the shape of the longitudinal section of the upper support 31, the desired airflow can be easily obtained at the outer edge of the substrate 9. The annular sidewall portion 311 of the upper support 31 only needs to exist on the side of the substrate 9 like a wall portion; its shape itself does not need to be wall-shaped. That is, the radial width of the annular sidewall portion 311 can be large; for example, the radial width of the annular sidewall portion 311 can be larger than its axial height. Furthermore, the inner surface of the annular sidewall portion 311 is not limited to a cylindrical surface; an annular recess or protrusion centered on the central axis J1 can be appropriately provided.

[0123] The annular sidewall portion 311 only needs to be radially opposed to the outer periphery of the substrate 9 supported by the lower support portion 2 and the outer periphery of the lower support portion 2 (more precisely, the outer periphery of the lower support body 21). However, it does not need to be axially opposed to the outer periphery of the lower support body 21 as a whole; it is sufficient that the annular sidewall portion 311 is located lower than the height of the upper surface of the lower support body 21.

[0124] The annular upper portion 312 is not limited to a plate shape. The annular upper portion 312 can simply extend radially inward from the annular sidewall portion 311 and be positioned vertically opposite to the outer edge of the upper surface of the substrate 9 supported by the lower support portion 2. Here, "opposite" means opposite without contact. Figure 3AIn the annular upper portion 312, the inner circumference of the lower surface includes a downwardly projecting annular protrusion 314. However, in addition to the annular protrusion, an annular recess centered on the central axis J1 may also be provided on the lower surface of the annular upper portion 312. Moreover, two or more annular protrusions or two or more annular recesses may be provided. In a conventional manner, by providing at least one annular protrusion (i.e., a protrusion), recess, or layer difference portion centered on the central axis J1 on the lower surface of the annular upper portion 312, the airflow in the outer edge of the substrate 9 can be set to the desired airflow. In a more conventional manner, in a longitudinal section, the lower surface of the annular upper portion 312 does not need to be a straight line along the horizontal direction.

[0125] The airflow generating section 111 preferably generates a downward-directing airflow directly toward the opening 313 of the annular upper portion 312. As described above, the airflow generating section 111 does not need to be entirely opposed to the opening 313 in the vertical direction; only a portion of it needs to be opposed. Preferably, more than one-third of the opening is directly opposed to the airflow generating section 111 in the vertical direction. More preferably, more than one-half of the opening is directly opposed to the airflow generating section 111 in the vertical direction. As long as the airflow flowing into the opening 313 is increased compared to the case where the airflow generating section 111 is not present, gas flows into the opening 313 indirectly from the airflow generating section 111.

[0126] The technique of setting the airflow in the outer edge of the substrate 9 to a desired airflow is particularly suitable for introducing etching solution into the outer edge of the substrate 9. Furthermore, it is suitable for supplying etching solution to the lower surface of the substrate 9 and guiding the etching solution to a region including the outer edge of the upper surface of the substrate 9.

[0127] When the upper support 31 can adequately receive the liquid splashed from the substrate 9, the annular cover 16 can be omitted. Instead, multiple annular covers 16 can be provided radially. Moreover, like a cover (so-called a cup) that directly receives droplets from the substrate 9, the annular cover 16 can be raised and lowered. Preferably, the upper part of the annular cover 16 approaches the outer peripheral surface of the annular sidewall portion 311 while tending radially inward, but the upper part of the annular cover 16 may also be located above the upper end of the annular sidewall portion 311. In the substrate processing apparatus 1, by providing the upper support 31, the generation of mist or droplets of the processing liquid can be suppressed, and therefore, the amount of airflow from the airflow generation unit 111 and the amount of exhaust from the exhaust unit provided at the bottom of the apparatus can also be reduced. By miniaturizing the annular cover 16 and reducing the airflow, the manufacturing cost of the substrate processing apparatus 1 can be reduced.

[0128] Because the annular upper portion 312 has a large opening 313, processing liquid can also be supplied from the upper nozzle 42 to the upper surface of the outer edge of the substrate 9. The upper nozzle 42 of the processing liquid supply unit 4 can supply processing liquid at a position closer to the inner circumferential end of the annular upper portion 312 (i.e., the edge of the opening 313) than the central axis J1, such as... Figure 11 As shown, by tilting the ejection direction of the processing liquid from the upper nozzle 42, the processing liquid can be supplied to the upper surface of the substrate 9 at a position where the annular upper portion 312 overlaps with the substrate 9 in the vertical direction. The processing liquid ejected from the upper nozzle 42 can be a variety of processing liquids. The processing liquid can be a rinsing liquid or an etching liquid.

[0129] In the substrate processing apparatus 1, the gripping-side magnetic body 331 is mechanically connected to the upper gripping member 32 in the upper gripping drive unit 33. "Mechanically connected" means that the movement of the gripping-side magnetic body 331 is transmitted to the upper gripping member 32 directly or via a contacting member. For example... Figure 1 As shown, the grip-side magnetic body 331 is not limited to being directly coupled to the upper grip member 32; the dynamics of the grip-side magnetic body 331 can also be transmitted to the upper grip member 32 via gears, belts, cams, levers, etc. The same applies to the grip-side magnetic body 231 in the lower grip drive unit 23 and the lower grip member 22.

[0130] The magnetization configuration of the holding-side magnetic body 331 or the driving-side magnetic body 332 can also utilize various configurations. The annular driving-side magnetic body 332 centered on the central axis J1 can have N poles (or S poles) and S poles (or N poles) on the inner and outer sides, or N poles (or S poles) and S poles (or N poles) on the top and bottom. The magnetic body moving part 333 can also move in other directions instead of moving the driving-side magnetic body 332 vertically. For example, the driving-side magnetic body 332 can be divided into four equal parts circumferentially, and the magnetic body moving part 333 can move each magnetic piece radially forward and backward, thereby allowing the magnetic pieces to approach or move away from the side or top of the holding-side magnetic body 331. The above description applies to the lower holding driving part 23, except that the vertical direction is reversed.

[0131] As described above, at least one of the gripping-side magnetic body 331 and the driving-side magnetic body 332 is a magnet. From the viewpoint of obtaining a large attractive and repulsive force, the gripping-side magnetic body 331 and the driving-side magnetic body 332 are preferably magnets. The position restoration part 334, as described above, can be a magnet, or a non-magnetic magnetic body, or an elastic body such as a coil spring or leaf spring. The position restoration part 334 can also be omitted. The same applies to the lower gripping drive part 23. By using a magnet, the upper gripping member 32 or the lower gripping member 22 can be moved easily.

[0132] The upper gripping member 32 is not limited to rotating around an axis in the vertical direction. For example, it can grip the outer edge of the substrate 9 by rotating around an axis in the horizontal direction. The same applies to the lower gripping member 22.

[0133] It is not necessary to replace the substrate 9 with different holding members when the substrate 9 is being processed.

[0134] In the substrate processing apparatus 1, the upper gripping member 32 or the lower gripping member 22 can move (including rotate) without using magnets, but by means of mechanical force transmission, such as transmission via gears, belts, cams, levers, etc. That is, the upper gripping member 32 and the lower gripping member 22 can move between a position holding the substrate 9 and a position not holding the substrate 9 by means of force transmission through contact between the members. For example, the upper gripping member 32 or the lower gripping member 22 can hold the substrate 9 using the force of a spring or the like, and when stationary, contact an additionally provided drive mechanism, thereby moving to a position where the substrate 9 is not held. In this case, the substrate 9 can be replaced or not.

[0135] From the perspective of reducing the scattering of the processing liquid flowing to the back of the substrate 9 by supporting the upper substrate 9, the upper support 31 may not have an opening 313. Furthermore, if it is not necessary to receive the processing liquid through the upper support 31, it is not necessary to provide an annular sidewall portion 311 on the upper support 31. In this case, the processing liquid scattering from the substrate 9 is received, for example, by the lower support 21 and an annular cup disposed on the outer periphery of the substrate 9. The annular upper portion 312 also does not need to be plate-shaped.

[0136] From the viewpoint that the number of lower gripping members 22 can be reduced by setting the upper gripping member 32, the structure of setting the upper gripping member 32 on the upper support 31 is particularly suitable for supplying processing liquid to the lower surface of the substrate 9, regardless of whether the lower gripping member 22 is present.

[0137] Furthermore, with the upper gripping drive unit 33 provided, a large force is required for raising and lowering the upper support body 31. Therefore, it is preferable to make the upper support body 31 a ring-shaped member to reduce its weight. In addition, from the viewpoint of weight reduction, the upper support body 31 is preferably formed of resin (e.g., PEEK resin).

[0138] In the substrate processing apparatus 1, the upper support 31 is raised and lowered while supporting its outer edge. This allows for the simple raising and lowering of the upper support 31, which serves as a mounting member relative to the lower support 21, and enables the space above the substrate 9 to be used for various purposes. From this perspective, the upper support 31 does not necessarily need to have an opening 313. That is, the upper support 31 can be detachably mounted on the lower support 2, covering at least the outer edge of the substrate 9 supported by the lower support 2. In the substrate processing apparatus 1, processing liquid is supplied to the upper or lower surface of the substrate 9 supported by the lower support 2. Since the space above the upper support 31 can be effectively utilized by supporting the outer edge of the upper support 31 and raising and lowering it, it is preferable to configure the upper support 31, which serves as a mounting member, as an annular shape so that processing liquid or gas can be supplied to the substrate 9 from above. Furthermore, the substrate 9 can be held using only the lower holding member 22. That is, the upper holding member 32 and the upper holding drive unit 33 can be omitted.

[0139] The number of lifting portions 13 that serve as the mounting members of the upper support body 31, which rises and falls relative to the lower support portion 2, is preferably multiple. However, the number of lifting portions 13 may be only one. For example, the upper support body 31 can be raised and lowered using a single lifting portion 13 by fitting the two arm portions of a highly rigid, U-shaped member that is large when viewed from above into the slot 34. In the case where the number of lifting portions 13 is one or more, in a conventional manner, the upper support body 31 includes a first abutting portion that can abut against the lifting portion 13 in the vertical direction on the radially outer side of the outer periphery of the substrate 9 supported by the lower support portion 2, and the lifting portion 13 includes a second abutting portion that extends radially outward toward the first abutting portion of the upper support body 31. Then, when the lifting drive unit 131 raises the second abutment, the second abutment comes into contact with the first abutment, and the upper support 31 separates from the lower support 2 upwards. When the lifting drive unit 131 lowers the second abutment, the upper support 31 is placed on the lower support 2, and the second abutment separates from the first abutment.

[0140] After the upper support 31 is placed on the lower support 2, the second abutment portion can also retract radially outward, but it is preferable not to retract the second abutment portion. The lower support 2 and the upper support 3 can rotate while the first abutment portion and the second abutment portion are separated. This allows for the raising and lowering of the upper support 31 with a simple structure. Specifically, when the first abutment portion and the second abutment portion are in contact, the annular surface of the first abutment portion centered on the central axis J1 contacts the second abutment portion. Therefore, the upper support 31 can be raised and lowered regardless of its rotational direction. Normally, when the first abutment portion and the second abutment portion are in contact, the annular downward surface facing the upper support 31 contacts the surface facing the upper lifting portion 13. However, these surfaces are not limited to horizontal surfaces. For example, the upper support 31 can have a surface protruding downward in an annular shape and a surface recessed downward towards the lifting portion 13, and these surfaces can contact each other.

[0141] On the other hand, if the rotational position of the rotating part 12 can be controlled, the first abutment part can be provided only on a portion of the upper support 31 in the circumferential direction. In this case, as... Figure 8A as well as Figure 8B As shown, the first and second abutting portions can be easily incorporated into a misalignment prevention structure that engages when they abut against each other. The misalignment prevention structure is preferably one that prevents circumferential and radial misalignment of the upper support 31 relative to the lower support 21. The misalignment prevention structure can also be one that only prevents radial misalignment. For example, if the upper support 31 is not provided with the upper gripping member 32 and the upper support 31 can be placed in any rotational position relative to the lower support 21, radial misalignment can be prevented only. Misalignment prevention is achieved by engaging a portion of the other abutting portion with a protrusion, recess, layer difference, or the like provided on at least one of the first and second abutting portions.

[0142] In the substrate processing apparatus 1, an annular cover 16, which is positioned in a stationary state, is provided radially outward of the upper support 31, and a lifting drive unit 131 is provided on the annular cover 16, thereby achieving miniaturization of the substrate processing apparatus 1. If the annular cover 16 has sufficient rigidity, the lifting drive unit 131 can be directly provided on the annular cover 16. If the rigidity of the annular cover 16 is insufficient, a reinforcing member can be provided on the annular cover 16, and the lifting drive unit 131 can be provided on the annular cover 16. Alternatively, a platform with high rigidity, such as a frame, can be provided above the annular cover 16, and the lifting unit 131 can be provided on it. That is, "providing the lifting drive unit 131 on the annular cover 16" means, from the viewpoint of reducing the area occupied by the substrate processing apparatus 1, that includes the case where the lifting drive unit 131 is provided above the annular cover 16. The same mechanism is provided on the annular cover 16 to retract the magnetic moving part 333 of the upper holding drive part 33 or the upper nozzle 42.

[0143] Regardless of the presence or absence of an opening 313 in the upper support body 31 or an upper holding member 32, the upper support body 3 is preferably detachably mounted on the lower support body 21 (lower support portion 2) by moving the upper support body 31 in the vertical direction. Of course, the upper support body 31 can also be detachably mounted on the lower support body 21 by moving it in a direction other than the vertical direction. "Detachably mounted" means that the upper support body 31 is attached to the lower support body 21 primarily by gravity (or solely by gravity).

[0144] As described above, the rotating part 12 of the substrate processing apparatus 1 is preferably a hollow motor, but if the lower nozzle 41 is not required, a through hole is not necessary on the rotating shaft. Alternatively, the rotating part 12 may also be a motor in which the rotor floats relative to the stator.

[0145] In addition to processing semiconductor substrates, the aforementioned substrate processing apparatus 1 can also be used to process glass substrates used in flat panel displays such as liquid crystal displays or organic EL (electro luminescence) displays, or glass substrates used in other display devices. Furthermore, the aforementioned substrate processing apparatus 1 can also be used to process substrates for optical discs, magnetic disks, optical disc drives, photomasks, ceramic substrates, and solar cells.

[0146] The above-described embodiments and their variations can be appropriately combined within the scope of not contradicting each other.

[0147] The present invention has been described in detail above, but the above description is illustrative and not limiting. Therefore, it can be said that various modifications or forms can be achieved without departing from the scope of the present invention.

Claims

1. A substrate processing apparatus that supplies a processing liquid to a substrate to process the substrate, the substrate processing apparatus characterized by comprising: a support portion that directly or indirectly supports a substrate in a horizontal posture; a rotating portion that rotates the support portion about a central axis in an up-down direction; a ring-shaped member that is capable of being placed on the support portion separately from the support portion, covers an outer edge portion of a substrate supported by the support portion, and rotates together with the support portion; and a processing liquid supply portion that supplies a processing liquid to an upper surface or a lower surface of a substrate supported by the support portion, the ring-shaped member including: a ring-shaped side wall portion that opposes a peripheral edge of a substrate supported by the support portion and a peripheral edge of the support portion in a radial direction; and a ring-shaped upper portion that extends from the ring-shaped side wall portion toward a radially inner side and opposes an outer edge portion of an upper surface of a substrate supported by the support portion in the up-down direction, an opening area of the ring-shaped upper portion above the substrate being 1 / 2 or more of an area of the substrate, the ring-shaped upper portion including: a lower surface that opposes the outer edge portion of the upper surface of the substrate supported by the support portion in the up-down direction; and a ring-shaped protruding portion that protrudes downward at an inner peripheral portion of the lower surface.

2. The substrate processing apparatus according to claim 1, further comprising an airflow generation portion that generates an airflow that tends to be downward toward an opening of the ring-shaped upper portion.

3. The substrate processing apparatus according to claim 1, wherein the processing liquid supply portion supplies an etching liquid to a lower surface of a substrate supported by the support portion.

4. The substrate processing apparatus according to claim 1, further comprising a ring-shaped cover that is disposed at a radially outer side of the ring-shaped member in a stationary state, wherein an upper portion of the ring-shaped cover is closer to an outer peripheral surface of the ring-shaped side wall portion the more it tends to be radially inward.

5. The substrate processing apparatus according to claim 1, wherein an opening area of the ring-shaped upper portion above a substrate is 3 / 4 or more of an area of the substrate.

6. The substrate processing apparatus according to claim 1, wherein a range of the ring-shaped upper portion that covers above a substrate is 20 mm or less that extends toward a radially inner side from a peripheral edge of the substrate.

7. The substrate processing apparatus according to any one of claims 1 to 6, wherein the processing liquid supply portion supplies a processing liquid to an upper surface of a substrate at a position closer to an inner peripheral end of the ring-shaped upper portion than the central axis, or at a position where the ring-shaped upper portion overlaps the substrate in the up-down direction. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​

Images