Substrate processing apparatus

Abstract

The present invention provides a substrate processing apparatus. In a substrate processing apparatus that supplies a processing liquid to a rotating substrate (9) to process the substrate (9), an upper support body (31) serving as a mounting member is detachably mounted on a lower support body (21) that supports the substrate (9). The upper support body (31) is lifted and lowered by a lifting unit. The upper support body (31) includes a first contact portion (34) on the radially outer side of the outer periphery of the substrate (9). When a second contact portion (132) of the lifting unit rises, the second contact portion (132) contacts the first contact portion (34) to lift the upper support body (31). When the second contact portion (132) descends, the upper support body (31) is mounted on the lower support body (21), the second contact portion (132) is separated from the first contact portion (34), and in this state, the lower support body (21) can rotate.

Description

[0001] Related Application

[0002] This application claims the benefit of priority of Japanese Patent Application JP2021-155617 filed on September 24, 2021, and all the disclosures of this application are incorporated herein by reference. Technical Field

[0003] The present invention relates to a technique for supplying a processing liquid to a substrate to process the substrate. Background Art

[0004] Conventionally, in a manufacturing process of a substrate such as a semiconductor substrate or a glass substrate (hereinafter simply referred to as "substrate"), a process of supplying a processing liquid to the substrate is performed while rotating the substrate. At this time, a technique is known in which a member opposed to the substrate is disposed above the substrate and the member is rotated together with the substrate for processing. For example, in Japanese Unexamined Patent Application Publication No. JP2019-021675 (hereinafter referred to as "Document 1"), the opposed member is placed on a rotating base, and the opposed member is opposed to the upper surface of the substrate. In Japanese Unexamined Patent Application Publication No. JP2016-039282 (hereinafter referred to as "Document 2"), the top plate is opposed to the upper surface of the substrate and rotates together with the substrate.

[0005] In addition, conventionally, a member opposed to the upper surface of the substrate is supported from above the center of the substrate as described in Document 1 and Document 2. Therefore, the space above the center of the substrate can be used only within a range that does not interfere with the support of the member above the substrate. Summary of the Invention

[0006] An object of the present invention is to enable the member covering at least a part of the space above the substrate to be lifted and lowered with a simple structure and to use the space above the substrate for various purposes when the member is placed on a support portion that supports the substrate.

[0007] Aspect 1 of the present invention is a substrate processing apparatus that supplies a processing liquid to a substrate to process the substrate. The substrate processing apparatus includes: a support portion that supports the substrate directly or indirectly in a horizontal posture; a rotating portion that rotates the support portion about a central axis in the vertical direction; a mounting member that can be mounted on the support portion in a spaced-apart manner from the support portion and covers at least the outer edge portion of the substrate supported by the support portion; a lifting portion that lifts and lowers the mounting member relative to the support portion; and a processing liquid supply portion that supplies the processing liquid to the upper surface or the lower surface of the substrate supported by the support portion. The mounting member includes a first contact portion that can contact the lifting portion in the vertical direction on the radially outer side of the outer circumference of the substrate supported by the support portion. The lifting portion includes: a second contact portion that extends from the radially outer side toward the first contact portion of the mounting member; and a lifting drive portion that lifts and lowers the second contact portion. When the second contact portion is lifted by the lifting drive portion, the second contact portion contacts the first contact portion, and the mounting member separates upward from the support portion. When the second contact portion is lowered by the lifting drive portion, the mounting member is mounted on the support portion, and the second contact portion separates from the first contact portion. The support portion can rotate in a state where the first contact portion and the second contact portion are separated.

[0008] In the present invention, the mounting member can be lifted and lowered with a simple structure, and the space above the substrate can be used for various purposes.

[0009] Aspect 2 of the present invention is based on the substrate processing apparatus of Aspect 1. In a state where the mounting member is mounted on the support portion, the position of the first contact portion in the height direction is 150 mm or less from the upper surface of the support portion.

[0010] Aspect 3 of the present invention is based on the substrate processing apparatus of Aspect 1 or Aspect 2. The mounting member is annular.

[0011] Aspect 4 of the present invention is based on the substrate processing apparatus of any one of Aspects 1 to 3. The first contact portion and the second contact portion include a misalignment prevention structure that fits when they contact each other.

[0012] Aspect 5 of the present invention is based on the substrate processing apparatus of any one of Aspects 1 to 3. When the first contact portion and the second contact portion are in contact, the annular surface of the first contact portion centered on the central axis contacts the second contact portion.

[0013] Aspect 6 of the present invention is based on any one of the substrate processing apparatuses of Aspects 1 to 5, and further includes an annular cover. The annular cover is disposed in a stationary state on the radially outer side of the placement member. The upper portion of the annular cover approaches the outer peripheral surface of the placement member more closely as it tends radially inward. The lifting drive unit is provided on the annular cover.

[0014] The above object and other objects, features, aspects and advantages will become apparent from the following detailed description of the invention with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a side view showing the configuration of a substrate processing apparatus according to an embodiment.

[0016] Figure 2 It is a plan view showing a part of the substrate processing apparatus.

[0017] Figure 3A It is a longitudinal sectional view of the upper support body placed on the lower support body.

[0018] Figure 3B It is a longitudinal sectional view showing the state where the upper support body is lifted from the lower support body.

[0019] Figure 4 It is a diagram showing the flow of an operation example of the substrate processing apparatus.

[0020] Figure 5A It is a diagram showing the state of the substrate processing apparatus.

[0021] Figure 5B It is a diagram showing the state of the substrate processing apparatus.

[0022] Figure 5C It is a diagram showing the state of the substrate processing apparatus.

[0023] Figure 5D It is a diagram showing the state of the substrate processing apparatus.

[0024] Figure 6 It is a diagram showing the state of the etching solution.

[0025] Figure 7A It is a diagram showing another example of the structure for lifting the upper support body.

[0026] Figure 7B It is a diagram showing another example of the structure for lifting the upper support body.

[0027] Figure 8A It is a diagram showing still another example of the structure for lifting the upper support body.

[0028] Figure 8B It is a diagram showing still another example of the structure for lifting the upper support body.

[0029] Figure 9 is a longitudinal sectional view showing a substrate processing apparatus in which the lower gripping member is omitted.

[0030] Figure 10 is a view showing Figure 9 a part of the configuration of the substrate processing apparatus.

[0031] Figure 11 is a view showing the ejection direction of the processing liquid ejected from the upper nozzle.

[0032] Among them, the reference numerals are explained as follows:

[0033] 1 Substrate processing apparatus

[0034] 2 Lower support portion

[0035] 4 Processing liquid supply portion

[0036] 9 Substrate

[0037] 12 Rotating portion

[0038] 13 Lifting portion

[0039] 16 Annular cover

[0040] 21 Lower support body

[0041] 31 Upper support body (mounting member)

[0042] 34 (As the first contact portion) groove

[0043] 34a (As the first contact portion) engaging portion

[0044] 131 Lifting drive portion

[0045] 132 (As the second contact portion) front end portion

[0046] 134 (As a part of the misalignment prevention structure) concave portion

[0047] 342 (As the first contact portion) enlarged portion

[0048] 343 (As a part of the misalignment prevention structure) protruding portion Detailed implementation mode

[0049] Figure 1 is a side view showing the configuration of the substrate processing apparatus 1 according to an embodiment of the present invention. The substrate processing apparatus 1 is a single-sheet type apparatus that processes semiconductor substrates 9 (hereinafter simply referred to as "substrates 9") one by one. The substrate processing apparatus 1 supplies a processing liquid to the substrate 9 for processing. In Figure 1In the figure, a part of the configuration of the substrate processing apparatus 1 is shown in cross-section. In addition, the parallel slashes indicating the cross-section appropriately omit details.

[0050] The substrate processing apparatus 1 includes a housing 11, a lower support portion 2, an upper support portion 3, a rotating portion 12, a lifting portion 13, a liquid receiving portion 15, an annular cover 16, a processing liquid supply portion 4, and a control portion (not shown). The housing 11 houses the lower support portion 2, the upper support portion 3, the rotating portion 12, the lifting portion 13, the liquid receiving portion 15, the annular cover 16, the processing liquid supply portion 4, etc. In Figure 1 In the figure, the housing 11 is depicted in cross-section. An air flow generating portion 111 that supplies gas to the internal space to form an air flow flowing downward (so-called downward flow) is provided in the top cover portion of the housing 11. As the air flow generating portion 111, for example, an FFU (Fan Filter Unit) is used.

[0051] The control portion is disposed outside the housing 11 and controls the lower support portion 2, the upper support portion 3, the rotating portion 12, the lifting portion 13, the processing liquid supply portion 4, etc. The control portion includes, for example, a general computer including a processor, a memory, an input / output portion, and a bus. The bus is a signal circuit that connects the processor, the memory, and the input / output portion. The memory stores programs and various information. The processor executes various processes (for example, numerical calculations) using the memory, etc., in accordance with the programs stored in the memory. The input / output portion includes a keyboard and a mouse that receive inputs from an operator, a display that displays outputs from the processor, etc., and a transmitting portion that transmits outputs from the processor, etc.

[0052] The lower support portion 2 supports the substrate 9 in a horizontal posture. In the present embodiment, the lower support portion 2 directly supports the substrate 9, but as will be described later, the lower support portion 2 may indirectly support the substrate 9. "Indirectly supporting the substrate 9" means supporting the substrate 9 by means of a member that can be separated from or inseparably connected to the lower support portion 2. The lower support portion 2 includes a lower support body 21, a plurality of lower gripping members 22, and a lower gripping drive portion 23. In Figure 1 In the figure, one lower gripping member 22 is shown on the left side. The lower support body 21 faces the lower surface of the substrate 9. That is, the upper surface of the lower support body 21 is separated from the substrate 9 and faces the lower surface of the substrate 9.

[0053] The plurality of lower gripping members 22 project upward from the lower support body 21 and come into contact with the outer edge portion of the substrate 9, thereby gripping the substrate 9. The lower gripping members 22 are so-called "support pins". The lower gripping members 22 are pin-shaped with the upper part being thinner than the lower part. The lower gripping members 22 rotate about a central axis along the vertical direction, and the upper part that is displaced from the central axis moves to come into contact with the outer edge portion of the substrate 9. The lower gripping members 22 mechanically support the substrate 9.

[0054] Figure 2 This is a plan view showing a part of the annular cover 16 of the substrate processing apparatus 1 and its internal structure. Figure 2 The upper surface of the lower support 21 is shown on the left side, and the state where the upper support 31 described later is placed on the lower support 21 is shown on the right side. As Figure 2 shown, in the present embodiment, three lower gripping members 22 are provided on the lower support 21. The three lower gripping members 22 are arranged at equal intervals in the circumferential direction around the central axis J1 when the substrate 9 is rotated. As Figure 1 shown, each lower gripping member 22 penetrates the lower support 21 in the vertical direction and is rotatably supported by the lower support 21 by means of a bearing (not shown). In the following description, the circumferential direction around the central axis J1 will also be simply referred to as the "circumferential direction", the radial direction around the central axis J1 will be simply referred to as the "radial direction", and the direction parallel to the central axis J1 will be simply referred to as the "axial direction".

[0055] As Figure 1 shown, the lower gripping drive unit 23 (refer to the left side of Figure 1 ) includes a gripping-side magnetic body 231, a drive-side magnetic body 232, a magnetic body moving unit 233 (refer to the right side of Figure 1 ), and a position restoring unit (not shown). The gripping-side magnetic body 231 is mechanically connected to the lower end of the lower gripping member 22. In the present embodiment, the gripping-side magnetic body 231 is a magnet. The drive-side magnetic body 232 is annular with the central axis J1 as the center. In the present embodiment, the drive-side magnetic body 232 is a magnet. The magnetic body moving unit 233 moves the drive-side magnetic body 232 up and down. In fact, two magnetic body moving units 233 are arranged opposite to each other around the central axis J1 (refer to the magnetic body moving unit 333 of Figure 2 described later). More than three magnetic body moving units 233 may also be arranged in the circumferential direction. The number of magnetic body moving units 233 may also be one. As the magnetic body moving unit 233, various mechanisms can be used, and it can be a mechanism combined with a cylinder, a ball screw combined with a rotary motor, a linear motor, etc. The position restoring unit is a magnet fixed to the lower surface of the lower support 21 in the present embodiment. The position restoring unit is close to the gripping-side magnetic body 231. In addition, in Figure 2 , the position restoring unit 334 of the upper gripping drive unit 33 described later is shown. The position restoring unit of the lower gripping drive unit 23 is set according to the position restoring unit 334 of the upper gripping drive unit 33.

[0056] In a state where the driving-side magnet 232 is lowered by the magnet moving portion 233, the lower holding member 22 is positioned at the position of the holding substrate 9 by the magnetic force acting between the holding-side magnet 231 and the position restoration portion. That is, the upper portion of the lower holding member 22 is in contact with the outer edge portion of the substrate 9. The magnetic force acting may be an attractive force or a repulsive force, and the same applies to the following description. When the driving-side magnet 232 is raised by the magnet moving portion 233, the magnetic force acting between the holding-side magnet 231 and the driving-side magnet 232 and the magnetic force acting between the holding-side magnet 231 and the position restoration portion cancel each other out, so that the lower holding member 22 rotates to a position where it does not hold the substrate 9. That is, the upper portion of the lower holding member 22 is separated from the outer edge portion of the substrate 9.

[0057] When the driving-side magnet 232 is lowered from the above state by the magnet moving portion 233, the lower holding member 22 returns to the position of holding the substrate 9 by the magnetic force acting between the holding-side magnet 231 and the position restoration portion. The lower holding drive portion 23 moves a plurality of lower holding members 22 to be separable from or in contact with the outer edge portion of the substrate 9. Since the driving-side magnet 232 is annular with the central axis J1 as the center, the lower holding member 22 can hold or not hold the substrate 9 during the rotation of the substrate 9. By using a magnet, the lower holding member 22 can be moved with a simple structure.

[0058] In addition, the holding-side magnet 231, the driving-side magnet 232, and the position restoration portion do not all have to be magnets. Within the range where a magnetic force can be generated, one of them may be a magnetic body such as iron. That is, at least one of the holding-side magnet 231 and the driving-side magnet 232 is a magnet, and at least one of the holding-side magnet 231 and the position restoration portion is a magnet. Moreover, the position restoration portion may not be a magnetic body. For example, it may be an elastic body such as a spring. In this case, the lower holding member 22 is moved from the position where it does not hold the substrate 9 to the position where it holds the substrate 9 by the elastic force acting between the lower holding member 22 and the position restoration portion. And as long as the substrate 9 can be held during its rotation by a configuration that can, for example, use centrifugal force to position the lower holding member 22 at the position of holding the substrate 9, the position restoration portion may be omitted.

[0059] The upper support portion 3 supports the substrate 9 in a horizontal posture. In the present embodiment, the upper support portion 3 directly supports the substrate 9. The upper support portion 3 includes an upper support body 31, a plurality of upper holding members 32, and an upper holding drive portion 33 (refer to Figure 1 the right side of). In Figure 1In [the figure], an upper gripping member 32 is shown on the right side. The upper support 31 is opposed to the upper surface of the substrate 9. That is, the upper support 31 is separated from the substrate 9 and is opposed to the upper surface of the substrate 9. More precisely, a part of the upper surface of the upper support 31 and the upper surface of the substrate 9 are opposed to each other in the vertical direction with a separation therebetween.

[0060] In the present embodiment, the upper support 31 is an annular member centered on the central axis J1. The upper support 31 is detachably placed on the lower support part 2 (the lower support 21 thereof). The upper support 31 rotates together with the lower support part 2 (here, excluding the non-rotating part) while covering the outer edge part of the substrate 9 supported by the lower support part 2. In the following description, when referring to the rotation of the lower support part 2, the rotating part in the lower support part 2 particularly refers to the lower support 21 and the lower gripping member 22. In addition, "the substrate 9 supported by the lower support part 2" means that, when considering the replacement operation described later, for the sake of convenience of explanation, it refers to "the substrate 9 supported only by the lower support part 2", "the substrate 9 indirectly supported by the lower support part 2 with the aid of the upper support part 3", and "the substrate 9 supported by the lower support part 2 and the upper support part 3" from the perspective of the lower support part 2. The same applies hereinafter when there is no special explanation regarding the support.

[0061] Figure 3A It is a diagram showing a longitudinal section of the upper support 31 placed on the lower support 21 (here, only one side with respect to the central axis J1). The annular member upper support 31 includes an annular side wall part 311 that is opposed to the outer circumference of the substrate 9 supported by the lower support part 2 and the outer circumference of the lower support part 2 (here, excluding the lower gripping drive part 23) in the radial direction, and an annular upper part 312 that extends inward in the radial direction from the annular side wall part 311 and is opposed to the outer edge part of the upper surface of the substrate 9 in the vertical direction. The opening 313 (refer to Figure 1 and Figure 2 ) above the substrate 9 of the annular upper part 312 preferably has an area of 1 / 2 or more of the area of the substrate 9 (more precisely, the area of the substrate 9 when viewed from above. The same applies hereinafter).

[0062] The opening 313 opens relatively large above the substrate 9, and preferably the area of the opening 313 is 3 / 4 or more of the area of the substrate 9. Particularly when the substrate processing apparatus 1 processes the outer edge part of the substrate 9, more preferably when etching the outer edge part of the substrate 9, the range where the annular upper part 312 covers above the substrate 9 preferably has a distance from the outer peripheral end (edge) of the outer circumference of the substrate 9 toward the inner side in the radial direction of 20 mm or less. More preferably, the above range is preferably 10 mm or less.

[0063] Figure 3BIt is a longitudinal sectional view showing a state in which the upper support body 31 is lifted from the lower support body 21 by a lifting part 13 described later. A plurality of protruding parts 215 protruding upward are provided on the upper surface of the lower support body 21. The protruding parts 215 are located radially outward compared with the upper holding member 32 (refer to Figure 1 ). The plurality of protruding parts 215 are arranged at equal intervals in the circumferential direction. For example, the number of the protruding parts 215 is 3 or 6, and preferably, it is located between the upper holding member 32 and the lower holding member 22 in the circumferential direction. The number of the protruding parts 215 is not limited to 3 or 6, as long as it is 2 or more, and preferably 3 or more. A pin-shaped small protrusion 216 is provided at the upper end of the protruding part 215. In Figure 2 , the description of the protruding part 215 is omitted.

[0064] On the other hand, as shown in Figure 3B , a plurality of protruding parts 315 protruding downward are provided on the lower surface of the annular upper part 312 of the upper support body 31. The protruding parts 315 are provided at positions corresponding to the protruding parts 215 of the lower support body 21. The number of the protruding parts 315 is the same as the number of the protruding parts 215. A small concave part 316 recessed upward is provided at the lower end of the protruding part 315. When the upper support body 31 is placed on the lower support body 21, the positions of the protruding part 215 and the protruding part 315 are aligned, and the small protrusion 216 is inserted into the small concave part 316 by lowering the upper support body 31. As shown in Figure 3A , the protruding part 215 and the protruding part 315 are in contact with each other. Thus, the position of the upper support body 31 relative to the lower support body 21 is fixed in the circumferential direction and the radial direction. When the lower support body 21 (and the lower holding member 22) is rotated about the central axis J1 by the rotating part 12, the upper support body 31 (and the upper holding member 32) also rotates about the central axis J1. In other words, when the lower support part 2 rotates about the central axis J1, the upper support part 3 (here, excluding the non-rotating part) also rotates about the central axis J1. In the following description, when referring to the rotation of the upper support part 3, it is the same as the case of the lower support part 2, referring to the rotating part of the upper support part 3, especially referring to the upper support body 31 and the upper holding member 32.

[0065] If the preferred position of the engaging part (the protruding parts 215, 315) that engages the upper support body 31 with the lower support body 21 is expressed in a normal manner, the engaging part is located radially outside the position of the holding substrate 9 and is located between a plurality of positions of the holding substrate 9 in the circumferential direction.

[0066] When the upper support body 31 is placed on the lower support body 21, the structure for fixing the position of the upper support body 31 relative to the lower support body 21 in the circumferential direction and the radial direction can be variously changed. For example, a small recess can be provided in the protrusion 215, and a small protrusion can be provided in the protrusion 315. The protrusion can be provided only on the lower support body 21 or the upper support body 31. Moreover, a structure for fixing only the relative position of the upper support body 31 relative to the lower support body 21 in the circumferential direction and a structure for fixing only the relative position of the upper support body 31 relative to the lower support body 21 in the radial direction can be respectively provided between the lower support body 21 and the upper support body 31. A structure for fixing the position of the upper support body 31 relative to the lower support body 21 in the circumferential direction and the radial direction can also be provided between the lower support body 21 and the annular side wall portion 311 of the upper support body 31.

[0067] As Figure 3A shown, in the state where the upper support body 31 is placed on the lower support body 21, the annular side wall portion 311 is separated from the lower support body 21 toward the radially outer side. The lower end of the annular side wall portion 311 is located below the upper surface of the lower support body 21. The lower end of the annular side wall portion 311 can also be located below the lower surface of the lower support body 21. The lower surface of the annular upper portion 312 is preferably smoothly connected to the inner circumferential surface of the annular side wall portion 311. That is, the lower surface of the annular upper portion 312 and the inner circumferential surface of the annular side wall portion 311 are connected together via a substantially arc-shaped or substantially elliptical arc-shaped portion in the longitudinal cross-section. Thus, even when liquid adheres to the lower surface of the annular upper portion 312, the liquid will be smoothly guided by the inner circumferential surface of the annular side wall portion 311 and discharged downward of the annular side wall portion 311.

[0068] The upper end of the inner circumferential surface of the annular side wall portion 311 can be appropriately defined, but when the lower surface of the annular upper portion 312 and the inner circumferential surface of the annular side wall portion 311 are connected together by a smooth surface or an inclined surface (hereinafter, these surfaces are referred to as "connection surfaces"), the connection surface can also be regarded as a part of the inner circumferential surface of the annular side wall portion 311. That is, the upper end of the inner circumferential surface of the annular side wall portion 311 can be understood as the boundary between the lower surface of the annular upper portion 312 and the connection surface. Thus, when the connection surface is located on the side of the upper surface and the lower surface of the substrate 9, the annular side wall portion 311 is located radially outside the substrate 9, and it can be said that the annular side wall portion 311 receives the droplets scattered from the substrate 9. In this understanding, the upper end of the inner circumferential surface of the annular side wall portion 311 is located above the upper surface of the substrate 9.

[0069] As Figure 3AAs shown, a ring-shaped protruding portion 314 protruding downward is provided on the inner peripheral portion of the lower surface of the ring-shaped upper portion 312. The ring-shaped protruding portion 314 is a ring centered on the central axis J1. The ring-shaped protruding portion 314 can be provided at the inner peripheral end of the ring-shaped upper portion 312, or can be provided at a position slightly radially outward from the inner peripheral end. The width in the radial direction of the ring-shaped protruding portion 314 and the height extending downward from the lower surface of the ring-shaped upper portion 312 are appropriately set according to the airflow generated at the outer edge portion of the substrate 9 during processing, as described later. Due to the presence of the ring-shaped protruding portion 314, the velocity of the airflow between the upper surface of the substrate 9 and the upper support 31 is increased to a higher level than in the case where the ring-shaped protruding portion 314 does not exist. In addition, the ring-shaped protruding portion 314 and the ring-shaped upper portion 312 together generate a desired airflow at the outer edge portion of the substrate 9. When the ring-shaped upper portion 312 without the ring-shaped protruding portion 314 can generate a desired airflow at the outer edge portion of the substrate 9, the ring-shaped protruding portion 314 can be omitted.

[0070] The "outer edge portion" of the substrate 9 refers to a range with a certain width extending from the outer peripheral end of the substrate 9 toward the center side of the substrate 9. This width can be very small or can have a certain size. For example, the "outer edge portion" can be only the arc-shaped region at the outer peripheral end in the longitudinal section of the substrate 9, or can be a region that, on the basis of the arc-shaped region, extends several centimeters inward toward the center of the substrate 9. As described later, the range where the etching solution wraps from the lower surface to the upper surface of the substrate 9 (for example, a range of 0.5 to 3 mm) can also be regarded as the outer edge portion, and the range where the substrate 9 and the ring-shaped upper portion 312 overlap in the vertical direction can also be regarded as the outer edge portion. Or, on the substrate 9, the region radially outside the ring-shaped protruding portion 314 can be regarded as the outer edge portion. Of course, the term "outer edge portion" is appropriately understood according to the context in which the term is used.

[0071] As Figure 1 As shown, a plurality of upper gripping members 32 protrude downward from the upper support 31 and are in contact with the outer edge portion of the substrate 9, thereby gripping the substrate 9. The upper gripping members 32 are so-called "support pins". They are in the shape of pins that are thinner at the lower part than at the upper part. By rotating the upper gripping members 32 around the central axis along the vertical direction, the lower part that is misaligned with the central axis moves and comes into contact with the outer edge portion of the substrate 9. The upper gripping members 32 mechanically support the substrate 9. In addition, in such a way that the substrate 9 can be gripped without falling only by the upper gripping members 32, recesses are provided at the portions of the lower side surfaces of the upper gripping members 32 that are in contact with the substrate 9, corresponding to the outer edge portion of the substrate 9.

[0072] As Figure 2As shown, in the present embodiment, three upper gripping members 32 are provided on the upper support 31. The three upper gripping members 32 are arranged at equal intervals in the circumferential direction centered on the central axis J1 when the substrate 9 is rotated. The upper gripping members 32 are arranged between the lower gripping members 22. In the example of Figure 2 , the upper gripping members 32 and the lower gripping members 22 are alternately arranged at an interval of 60 degrees. The number of the upper gripping members 32 and the lower gripping members 22 is not limited to three respectively, and may be four or more. The number of the upper gripping members 32 and the number of the lower gripping members 22 may be different. As Figure 1 shown, each upper gripping member 32 penetrates the upper support 31 in the vertical direction and is rotatably supported by the upper support 31 by means of a bearing (not shown).

[0073] The upper gripping drive unit 33 has a structure based on the following gripping drive unit 23. The upper gripping drive unit 33 (refer to the right side of Figure 1 ) includes a gripping-side magnetic body 331, a drive-side magnetic body 332, a magnetic body moving unit 333 (refer to the left side of Figure 1 ), and a position restoring unit 334 (refer to Figure 2 ). As Figure 1 shown, the gripping-side magnetic body 331 is mechanically connected to the upper end of the upper gripping member 32. In the present embodiment, the gripping-side magnetic body 331 is a magnet. The drive-side magnetic body 332 is annular centered on the central axis J1 (refer to Figure 2 ). In the present embodiment, the drive-side magnetic body 332 is a magnet. The magnetic body moving unit 333 raises and lowers the drive-side magnetic body 332. As Figure 2 shown, two magnetic body moving units 333 are oppositely arranged centered on the central axis J1. Three or more magnetic body moving units 333 may be arranged in the circumferential direction. The number of the magnetic body moving units 333 may be one. As the magnetic body moving unit 333, various mechanisms can be used, and it may be a cylinder, a mechanism in which a ball screw is assembled to a rotary motor, a linear motor, etc. The position restoring unit 334 is a magnet fixed to the upper surface of the upper support 31 in the present embodiment. The position restoring unit 334 is close to the gripping-side magnetic body 331.

[0074] In a state where the drive-side magnet 332 is lifted by the magnet moving unit 333, the upper gripping member 32 is positioned at the position of gripping the substrate 9 by the magnetic force between the gripping-side magnet 331 and the position restoring unit 334. That is, the lower part of the upper gripping member 32 is in contact with the outer edge of the substrate 9. When the drive-side magnet 332 is lowered by the magnet moving unit 333, the magnetic force between the gripping-side magnet 331 and the drive-side magnet 332 cancels out the magnetic force between the gripping-side magnet 331 and the position restoring unit 334, so that the upper gripping member 32 rotates to a position where it does not grip the substrate 9. That is, the lower part of the upper gripping member 32 is separated from the outer edge of the substrate 9.

[0075] When the drive-side magnet 332 is lifted from this state by the magnet moving unit 333, the upper gripping member 32 returns to the position of gripping the substrate 9 by the magnetic force between the gripping-side magnet 331 and the position restoring unit 334. In this way, the upper gripping drive unit 33 can move the plurality of upper gripping members 32 while being separated from or in contact with the outer edge of the substrate 9. Since the drive-side magnet 332 is annular with the central axis J1 as the center, the upper gripping member 32 can grip and not grip the substrate 9 during the rotation of the substrate 9. By using magnets, the upper gripping member 32 can be moved with a simple structure.

[0076] In addition, it is not necessary for all of the gripping-side magnet 331, the drive-side magnet 332, and the position restoring unit 334 to be magnets. Within the range where a magnetic force can be generated, one of them can be a magnetic material such as iron. That is, at least one of the gripping-side magnet 331 and the drive-side magnet 332 is a magnet, and at least one of the gripping-side magnet 331 and the position restoring unit 334 is a magnet. Moreover, the position restoring unit 334 may not be a magnetic material. For example, it can be an elastic body such as a spring. In this case, the upper gripping member 32 is moved from the position where it does not grip the substrate 9 to the position where it grips the substrate 9 by the elastic force acting between the upper gripping member 32 and the position restoring unit 334. And as long as the substrate 9 can be gripped by a configuration such as being able to use centrifugal force to position the upper gripping member 32 at the position of gripping the substrate 9 during the rotation of the substrate 9, the position restoring unit 334 can also be omitted.

[0077] As Figure 1 shown, the rotation axis of the rotating unit 12 is connected to the lower support 21. The rotating unit 12 rotates the lower support 2 with the central axis J1 as the center. The rotation axis is hollow, and the upper end becomes the lower nozzle 41 described later.

[0078] The lifting part 13 raises and lowers the upper support body 31 relative to the lower support body 21. The upper support body 31 is a placement member placed on the lower support body 21. That is, the lifting part 13 raises and lowers the upper support body 31 as a placement member relative to the lower support part 2. The lifting part 13 includes a lifting drive part 131 and a front end part 132 lifted by the lifting drive part 131. As the lifting drive part 131, various mechanisms can be used, such as a cylinder, a mechanism combining a rotary motor and a ball screw, a linear motor, etc. As Figure 2 shown, actually, two lifting parts 13 are provided at positions opposed to each other with the central axis J1 as the center. Three or more lifting parts 13 can be arranged in the circumferential direction.

[0079] A groove 34 recessed radially inward is provided on the entire circumference of the outer peripheral surface of the upper support body 31. The front end part 132 of the lifting part 13 extends from the outside in the radial direction to the groove 34 of the upper support body 31. As Figure 3B shown, when the front end part 132 rises, the downward-facing surface 341 on the upper side of the groove 34 contacts the upper surface 133 of the front end part 132, and the upper support body 31 separates from the lower support body 21 upward. Hereinafter, the groove 34 will be referred to as the "first contact part", the front end part 132 will be referred to as the "second contact part", the surface 341 will be referred to as the "first contact surface", and the upper surface 133 will be referred to as the "second contact surface".

[0080] When the second contact part 132 is lowered by the lifting drive part 131, as Figure 3A shown, the upper support body 31 is placed on the lower support body 21, and the second contact surface 133 separates from the first contact surface 341. That is, the second contact part 132 separates from the first contact part 34. Since the first contact part 34 is formed in the entire circumference, the lower support part 2 can rotate in a state where the first contact part 34 and the second contact part 132 are separated. Since the first contact surface 341 is an annular surface with the central axis J1 as the center, the rotation position of the upper support body 31 can be raised and lowered by the lifting part 13 at any position.

[0081] The lifting unit 13 supports the outer peripheral portion of the upper support body 31 and raises and lowers the upper support body 31. Therefore, in the substrate processing apparatus 1, there is no mechanism for raising and lowering the upper support body 31 directly above the upper support body 31. As a result, the height of the substrate processing apparatus 1 can be suppressed to be very low. To achieve such a configuration, preferably, when the upper support body 31 is placed on the lower support portion 2, the position of the first contact portion 34 in the height direction is preferably 150 mm or less from the upper surface of the lower support body 21. Thereby, a processing space can be ensured and the height of the parts related to processing can be suppressed to be very low. In addition, the space above the upper support body 31 can be effectively utilized. More preferably, the position of the first contact portion 34 in the height direction is 100 mm or less from the upper surface of the upper support body 31. More preferably, the height of the upper support body 31 is 150 mm or less.

[0082] As Figure 1 shown, a ring-shaped liquid receiving portion 15 is provided below the gap between the lower support body 21 and the annular side wall portion 311 of the upper support body 31. The liquid receiving portion 15 is annular with the central axis J1 as the center. The liquid receiving portion 15 receives the liquid falling from the gap between the lower support body 21 and the annular side wall portion 311.

[0083] The annular cover body 16 is arranged in a stationary state on the radially outer side of the upper support body 31 which is a ring-shaped member. The annular cover body 16 is annular with the central axis J1 as the center. The upper part of the annular cover body 16 approaches the outer peripheral surface of the annular side wall portion 311 of the upper support body 31 more as it goes radially inward. The inner peripheral end of the annular cover body 16 is separated from the outer peripheral surface of the annular side wall portion 311. The lifting drive portion 131 of the lifting unit 13 is provided on the annular cover body 16. Thereby, the size in the horizontal plane (so-called occupied area) of the substrate processing apparatus 1 can be suppressed to be very small. In the substrate processing apparatus 1, the magnetic body moving portion 333 of the upper gripping drive portion 33 is also provided on the annular cover body 16 (refer to Figure 2 ). Thereby, the size of the substrate processing apparatus 1 in the horizontal plane can also be suppressed to be very small.

[0084] In addition, in the present embodiment, since the upper support body 31 directly receives the droplets scattered from the substrate 9, the annular cover body 16 is provided to assist in preventing the scattering of droplets. Therefore, compared with the case of directly receiving droplets, the radial width of the annular cover body 16 can be reduced, and in addition, there is no need for a mechanism for moving the annular cover body 16 up and down, simplifying the device structure. The upper support body 31 rotates together with the substrate 9, so that the amount of droplets generated when the droplets scattered on the substrate 9 collide with the annular side wall portion 311 is also suppressed compared with the case where there is no annular side wall portion 311. By the fixed arrangement of the annular cover body 16, it is easy to provide the lifting drive portion 131 or the magnetic body moving portion 333 on the annular cover body 16. An exhaust portion for exhausting to the outside of the substrate processing apparatus 1 is provided below the annular cover body 16.

[0085] As Figure 1 shown, the processing liquid supply unit 4 includes a lower nozzle 41, an upper nozzle 42, a nozzle moving unit (not shown), and a processing liquid supply source (not shown). The lower nozzle 41 is provided at the upper end of the rotation axis of the rotation unit 12 as described above. The processing liquid ejected from the lower nozzle 41 is supplied to the lower surface of the substrate 9 supported by the lower support unit 2. The upper nozzle 42 moves between a position above the substrate 9 and a position above and away from the substrate 9 through the nozzle moving unit. The processing liquid ejected from the upper nozzle 42 is supplied to the upper surface of the substrate 9 supported by the lower support unit 2. The processing liquid supply source supplies the processing liquid to the lower nozzle 41 and the upper nozzle 42 respectively from a liquid storage tank storing the processing liquid using a pump or the like. In the present embodiment, the processing liquid supplied to the lower nozzle 41 is a rinsing liquid such as deionized water, an etching liquid, or the like. The processing liquid supplied to the upper nozzle 42 is a rinsing liquid such as deionized water. As the rinsing liquid, carbonated water, hydrogen water, ozone water, SC1, SC2, or the like can be used. The etching liquid is, for example, an aqueous solution of hydrofluoric acid, nitric acid, hydrochloric acid, sulfuric acid, or hydrogen peroxide solution, or a mixed solution of two or more selected from these, and also includes a solution including these aqueous solutions or mixed solutions.

[0086] The processing liquid is not limited to the rinsing liquid or the etching liquid. In addition, in the present embodiment, the upper nozzle 42 can be omitted. Depending on the type of processing, the lower nozzle 41 can also be omitted, and only the upper nozzle 42 can be provided in the substrate processing apparatus 1. When the upper support 31 rises to carry in and out the substrate 9, the upper nozzle 42 is retracted to a position where it does not interfere with the upper support 31 by the nozzle moving unit.

[0087] Figure 4 is a diagram showing the flow of an operation example of the substrate processing apparatus 1. Figures 5A to 5D is a diagram showing the state of the substrate processing apparatus 1. The substrate processing apparatus 1 operates under the control of a control unit (not shown).

[0088] First, as Figure 5A shown, in a state where the upper support 31 is raised, the drive-side magnetic body 332 of the upper gripping drive unit 33 approaches the gripping-side magnetic body 331, and in a state where the drive-side magnetic body 232 of the lower gripping drive unit 23 approaches the gripping-side magnetic body 231, the substrate 9 is carried in by an external transfer mechanism (step S11). Thereafter, the drive-side magnetic body 232 is lowered by the magnetic body moving unit 233 of the lower gripping drive unit 23, and the substrate 9 is gripped by the lower gripping member 22 (step S12).

[0089] Through the magnet moving part 333 and the lifting part 13 of the upper gripping drive part 33, while maintaining the state where the drive-side magnet 332 of the upper gripping drive part 33 is close to the gripping-side magnet 331, the upper support 31 is lowered. Thus, the upper support 31 is placed on the lower support 21 (step S13). After that, the drive-side magnet 332 is raised by the magnet moving part 333, and as shown in Figure 5B , the substrate 9 is gripped by the upper gripping member 32 (step S14). That is, the substrate 9 is gripped by the upper support part 3 and the lower support part 2.

[0090] The rotating part 12 rotates the lower support part 2. Thus, the substrate 9 rotates (step S15). The upper nozzle 42 moves from the position retracted to the side of the upper support 31 above the upper support 31. First, rinse liquid is supplied from the lower nozzle 41 and the upper nozzle 42 of the processing liquid supply part 4 to the lower surface and the upper surface of the rotating substrate 9. The supplied rinse liquid flows radially outward on the lower surface and the upper surface of the substrate 9, scatters from the outer peripheral end of the substrate 9, and is received by the annular side wall part 311 of the upper support 31. The liquid falls downward from the annular side wall part 311 and is received by the liquid receiving part 15. After that, the supply of the rinse liquid is stopped.

[0091] Next, etching liquid is supplied from the lower nozzle 41 to the lower surface of the substrate 9. The supplied etching liquid flows radially outward on the lower surface of the substrate 9, scatters from the outer peripheral end of the substrate 9, and is received by the annular side wall part 311. The liquid falls downward from the annular side wall part 311 and is received by the liquid receiving part 15.

[0092] Figure 6 FIG. is a diagram showing the state of the etching liquid 8. The etching liquid 8 flowing on the lower surface of the substrate 9 slightly wraps around to the upper surface side at the outer peripheral end of the substrate 9. Hereinafter, the radial distance 5 at which the etching liquid 8 wraps from the outer peripheral end of the substrate 9 to the upper surface is referred to as the "wrapping-in amount". The wrapping-in amount 5 is affected by various main factors, one of which is the velocity of the airflow tending radially outward on the upper surface of the substrate 9. In order to set this airflow velocity to a desired velocity, the cross-sectional shape of the annular upper part 312 of the upper support 31 is designed. Specifically, referring to Figure 3A , the width of the annular upper part 312 overlapping with the outer edge part of the substrate 9 in the vertical direction, the distance between the upper surface of the substrate 9 and the annular upper part 312, the radial width of the annular protruding part 314, the height of the annular protruding part 314 downward from the lower surface of the annular upper part 312, the radial position of the annular protruding part 314, etc. are adjusted, and the shape of the longitudinal section of the upper support 31 is designed. In particular, by using the annular protruding part 314, it is possible to easily set the velocity of the airflow on the outer edge part of the substrate 9 to a desired velocity, and the wrapping-in amount 5 becomes an appropriate distance.

[0093] On this basis, in the case of the present embodiment, the air flow from the air flow generating unit 111 is directly guided to the upper surface of the substrate 9 through the opening 313 of the upper support 31. Therefore, it is possible to more easily set the speed of the air flow on the outer edge portion of the substrate 9 to a desired speed. The direct introduction of the air flow from the air flow generating unit 111 to the upper surface of the substrate 9 is achieved by directly opposing at least a part of the air flow generating unit 111 and at least a part of the upper surface of the substrate 9 in the vertical direction (with no object therebetween).

[0094] In the case where the diameter and thickness of the substrate 9 are 300 mm and 775 μm respectively, an example of the winding amount 5 obtained is 2 mm to 3 mm.

[0095] During the supply of the etching solution to the substrate 9, in the substrate processing apparatus 1, a replacement operation of the substrate 9 is performed. Specifically, as Figure 5C shown, the magnetic body moving portion 233 of the lower gripping drive portion 23 raises the drive side magnetic body 232 to release the gripping of the substrate 9 by the lower gripping member 22, and only the upper gripping member 32 grips the substrate 9. Thereafter, the magnetic body moving portion 233 lowers the drive side magnetic body 232, and the lower gripping member 22 and the upper gripping member 32 return to the state of gripping the substrate 9. Next, as Figure 5D shown, the magnetic body moving portion 333 of the upper gripping drive portion 33 lowers the drive side magnetic body 332 to release the gripping of the substrate 9 by the upper gripping member 32, and only the lower gripping member 22 grips the substrate 9. Thereafter, the magnetic body moving portion 333 raises the drive side magnetic body 332, and the lower gripping member 22 and the upper gripping member 32 return to the state of gripping the substrate 9. By repeating the above process, the replacement operation of the substrate 9 is performed. Thereafter, the supply of the etching solution to the substrate 9 is stopped.

[0096] Generally, in the vicinity of the position where the substrate 9 is in contact with the gripping member, the winding amount increases. By the replacement operation of the substrate 9, the increase amount of the winding amount is reduced.

[0097] In addition, the time for gripping the substrate 9 only by the upper gripping member 32 and the time for gripping the substrate 9 only by the lower gripping member 22 do not need to be of the same length. Further, the state of gripping the substrate 9 only by the upper gripping member 32 and the state of gripping the substrate 9 only by the lower gripping member 22 do not need to be alternated. As long as there is a state in which the substrate 9 is gripped by a plurality of upper gripping members 32 and not gripped by a plurality of lower gripping members 22, and a state in which the substrate 9 is gripped by a plurality of lower gripping members 22 and not gripped by a plurality of upper gripping members 32 during the processing of the substrate 9. Thereby, it is possible to perform processing using the processing liquid at the gripping position.

[0098] The rinsing liquid is supplied again to the lower surface and the upper surface of the substrate 9 from the lower nozzle 41 and the upper nozzle 42 of the processing liquid supply unit 4. The supplied rinsing liquid flows radially outward on the lower surface and the upper surface of the substrate 9, scatters from the outer peripheral end of the substrate 9, and is received by the annular side wall portion 311 of the upper support body 31. The liquid drops downward from the annular side wall portion 311 and is received by the liquid receiving portion 15. Thereafter, the supply of the rinsing liquid is stopped. Through the above processing, the processing of supplying the processing liquid to the substrate 9 is completed (step S16). The replacement operation of the substrate 9 can also be performed during the period when the rinsing liquid is supplied to the substrate 9. The replacement operation of the substrate 9 can also be performed when the rinsing liquid is supplied to the substrate 9 before the etching liquid is supplied to the substrate 9.

[0099] In the substrate processing apparatus 1, the substrate 9 is held by three lower holding members 22 and three upper holding members 32. When the processing liquid is supplied to the lower surface of the substrate 9, a part of the processing liquid flowing radially outward collides with the lower holding member 22. Assuming that six lower holding members 22 are provided while omitting the upper holding members 32, the amount of the processing liquid colliding with the lower holding member 22 increases. As a result, the generated mist or droplets of the processing liquid also increase. In the substrate processing apparatus 1, by providing the upper holding members 32, the generation of the mist or droplets of the processing liquid can be reduced, and the quality of the processing can be improved.

[0100] The rotation of the substrate 9 is stopped (step S17), the driving side magnetic body 232 of the lower holding drive unit 23 rises, and the holding of the substrate 9 by the lower holding member 22 is released. Moreover, the driving side magnetic body 332 of the upper holding drive unit 33 descends, and the holding of the substrate 9 by the upper holding member 32 is also released. The upper nozzle 42 retracts to the side. As Figure 5A shown, the upper support body 31 and the driving side magnetic body 332 are raised by the lifting unit 13 and the magnetic body moving unit 333 (step S18). Then, the substrate 9 is carried out by an external transfer mechanism (step S19).

[0101] In the substrate processing apparatus 1, various modifications can be made.

[0102] Figure 7A And Figure 7B is a diagram showing another example of the structure for lifting the upper support body 31, corresponding to Figure 3A And Figure 3B respectively. Figure 7A is a diagram showing a longitudinal section (here, only one side with respect to the central axis J1) of the upper support body 31 placed on the lower support body 21. Figure 7B is a longitudinal sectional view showing a state in which the upper support body 31 is lifted from the lower support body 21 by the lifting unit 13.

[0103] As Figure 7A And Figure 7BAs shown, on the outer peripheral surface of the upper support body 31 serving as a mounting member, an engaging portion 34a protruding radially outward is provided over the entire circumference. The outer peripheral end of the engaging portion 34a has a portion protruding downward. The front end portion 132 of the lifting portion 13 extends from the radially outer side toward the outer peripheral surface of the upper support body 31 below the engaging portion 34a. The front end of the front end portion 132 has a portion protruding upward. As Figure 7B shown, when the front end portion 132 rises, the lower surface 341 facing downward on the radially inner side of the portion protruding downward of the engaging portion 34a comes into contact with the upper surface 133 of the portion protruding upward of the front end portion 132, and the upper support body 31 separates upward from the lower support body 21. Hereinafter, the engaging portion 34a will be referred to as the "first abutting portion", the front end portion 132 will be referred to as the "second abutting portion", the surface 341 will be referred to as the "first abutting surface", and the upper surface 133 will be referred to as the "second abutting surface".

[0104] When the second abutting portion 132 is lowered by the lifting drive portion 131, as Figure 7A shown, the upper support body 31 is mounted on the lower support body 21 and the second abutting surface 133 separates from the first abutting surface 341. That is, the second abutting portion 132 separates from the first abutting portion 34a. Since the first abutting portion 34a is formed over the entire circumference, the lower support portion 2 can rotate in a state where the first abutting portion 34a and the second abutting portion 132 are separated. Since the first abutting surface 341 is an annular surface centered on the central axis J1, the upper support body 31 can be lifted and lowered by the lifting portion 13 at any rotational position of the upper support body 31.

[0105] Figure 8A And Figure 8B is a view showing another example of the structure for lifting and lowering the upper support body 31, corresponding to Figure 3A And Figure 3B respectively. Figure 8A is a view of the upper support body 31 and the front end portion 132 in a state where the upper support body 31 is mounted on the lower support body 21 (not shown) as viewed from the side of the lifting portion 13. In Figure 8A it shows a part of the outer peripheral surface of the upper support body 31 and a cross section of the front end portion 132. Figure 8B is a view of the upper support body 31 and the front end portion 132 in a state where the upper support body 31 is lifted from the lower support body 21 by the lifting portion 13 as viewed from the side of the lifting portion 13.

[0106] As Figure 8A And Figure 8BAs shown in the figure, a groove 34 that recesses inward in the radial direction is provided on the entire outer peripheral surface of the upper support 31 as a placement member. A part of the groove 34 forms an enlarged portion 342 that extends upward, and two protrusions 343 that protrude downward are provided on the surface facing downward of the enlarged portion, that is, the upper side wall of the enlarged groove. On the other hand, two recesses 134 that recess downward are provided on the upper surface 133 of the front end portion 132 of the lifting portion 13. The protrusion 343 is substantially conical, and the recess 134 is also substantially conical. Other structures are the same as those in Figure 3A and Figure 3B Same.

[0107] As Figure 8B shown, when the front end portion 132 rises, the protrusion 343 of the enlarged portion 342 engages with the recess 134 of the front end portion 132, and the upper support 31 separates upward from the lower support 21. Hereinafter, the enlarged portion 342 will be referred to as the "first abutting portion", the front end portion 132 will be referred to as the "second abutting portion", the protrusion 343 will be referred to as the "first abutting element", and the recess 134 will be referred to as the "second abutting element".

[0108] When the second abutting portion 132 is lowered by the lifting drive portion 131, the upper support 31 is placed on the lower support 21. As Figure 8A shown, the second abutting element 134 separates from the first abutting element 343. That is, the second abutting portion 132 separates from the first abutting portion 342. Moreover, since the second abutting portion 132 is located within the groove 34 and the groove 34 is formed in the entire circumference, the lower support portion 2 can rotate in a state where the first abutting portion 342 and the second abutting portion 132 are separated. When the rotation of the lower support 21 and the upper support 31 stops, the lower support 21 stops at a rotation position where the circumferential positions of the first abutting portion 342 and the second abutting portion 132 coincide.

[0109] The first abutting portion 342 and the second abutting portion 132 include a misalignment prevention structure that engages when they abut against each other, that is, the first abutting element 343 and the second abutting element 134. Therefore, misalignment of the upper support 31 relative to the support 21 when the upper support 31 rises is reliably prevented. In addition, the number of the first abutting elements 343 and the second abutting elements 134 corresponding to one lifting portion 13 can each be one. Of course, the number of the first abutting elements 343 and the second abutting elements 134 corresponding to one lifting portion 13 can each be 3 or more. As described above, a plurality of lifting portions 13 are provided in the circumferential direction. Therefore, a plurality of first abutting elements 343 and a plurality of second abutting elements 134 are arranged in the circumferential direction. The arrangement of the first abutting elements 343 does not need to be equally spaced in the circumferential direction, and the arrangement of the second abutting elements 134 does not need to be equally spaced in the circumferential direction.

[0110] Figure 9It is a longitudinal sectional view showing a part of the substrate processing apparatus 1 in which the lower holding member 22 is omitted. Figure 10 It is a plan view showing a part of the annular cover 16 of the substrate processing apparatus 1 and its internal configuration. As Figure 10 shown, in the substrate processing apparatus 1, six upper holding members 32 are provided, and a first drive-side magnet 332a and a second drive-side magnet 332b are provided as drive-side magnets. The first drive-side magnet 332a is annular with the central axis J1 as the center and is located radially inside the six holding-side magnets 331a, 331b. The second drive-side magnet 332b is also annular with the central axis J1 as the center and is located radially outside the six holding-side magnets 331a, 331b. The first drive-side magnet 332a is lifted and lowered by two magnet moving parts 333a. The second drive-side magnet 332b is lifted and lowered by two magnet moving parts 333b. The configuration of the magnet moving parts 333a, 333b is the same as that of the Figure 1 and Figure 2 shown magnet moving part 333 except for the different positions of the drive-side magnets 332a, 332b. In Figure 9 and Figure 10 , the same reference numerals are given to the same components as those in Figure 1 and Figure 2 .

[0111] The magnetization states of the three holding-side magnets 331a (hereinafter referred to as "first holding-side magnets") and the three holding-side magnets 331b (hereinafter referred to as "second holding-side magnets") are different, and they are alternately arranged in the circumferential direction. As Figure 9 shown, in the state where the first drive-side magnet 332a and the second drive-side magnet 332b are raised, the six upper holding members 32 are brought into a state of holding the substrate 9 by the magnetic force between the first holding-side magnet 331a and the second holding-side magnet 331b and the position restoration part 334.

[0112] When the state where the second drive-side magnet 332b is raised is maintained and the first drive-side magnet 332a is lowered by the magnet moving part 333a, the magnetic force between the first holding-side magnet 331a and the first drive-side magnet 332a cancels out the magnetic force between the first holding-side magnet 331a and the position restoration part 334, and the three upper holding members 32 connected to the first holding-side magnet 331a are brought into a state of not holding the substrate 9. At this time, the magnetic force between the second holding-side magnet 331b and the first drive-side magnet 332a is sufficiently small compared to the magnetic force between the second holding-side magnet 331b and the position restoration part 334, or acts in the holding direction, and the three upper holding members 32 connected to the second holding-side magnet 331b maintain the state of holding the substrate 9.

[0113] When the second driving-side magnetic body 332b is lowered by the magnetic body moving portion 333b while the first driving-side magnetic body 332a is maintained in the raised state, the magnetic force between the second holding-side magnetic body 331b and the second driving-side magnetic body 332b is offset by the magnetic force between the second holding-side magnetic body 331b and the position recovery portion 334, resulting in a state in which the three upper holding members 32 connected to the second holding-side magnetic body 331b no longer hold the substrate 9. At this time, the magnetic force between the first holding-side magnetic body 331a and the second driving-side magnetic body 332b is sufficiently smaller than the magnetic force between the first holding-side magnetic body 331a and the position recovery portion 334, or acts in the holding direction, and the three upper holding members 32 connected to the first holding-side magnetic body 331a continue to hold the substrate 9.

[0114] When the substrate 9 is carried in, the upper support 31 is in the raised state, and the plurality of push-up mechanisms 24 (in the lower portion of the lower support 21) are arranged below the lower support 21. Figure 2 Pins (not shown) rise from holes in the lower support 21, placing the substrate 9 on the pins. Then, while a mechanical mechanism (not shown) maintains the six upper holding members 32 in a position free from holding the substrate 9, the upper support 31 is lowered, holding the substrate 9 with the six upper holding members 32. The pins of the push-up mechanism 24 then descend.

[0115] Thereafter, as described above, the substrate 9 is rotated while the processing liquid is supplied to the upper and lower surfaces of the substrate 9, causing the first drive-side magnetic body 332a and the second drive-side magnetic body 332b to alternately descend, thereby performing the replacement operation of the substrate 9. The unloading of the substrate 9 is the reverse operation of the loading of the substrate 9.

[0116] As described above, the substrate 9 can be held only by the upper holding member 32. In this case, the processing liquid supplied to the back surface of the substrate 9 does not collide with the lower holding member, thereby reducing mist or droplets generated by the scattering of the processing liquid. As a result, the quality of the processing can be improved.

[0117] exist Figure 9 as well as Figure 10 In the substrate processing apparatus 1 shown, the substrate 9 is supported by the upper support portion 3. On the other hand, the upper support body 31 of the upper support portion 3 is supported by the lower support portion 2. Therefore, the substrate 9 is indirectly supported by the lower support portion 2. Figure 1 as well as Figure 2In the substrate processing apparatus 1 shown, the substrate 9 is basically supported by the lower support portion 2, but during the replacement operation, the substrate 9 is temporarily supported indirectly by the lower support portion 2. The structure in which the substrate 9 is indirectly supported is not limited to the above structure. For example, components other than the upper support body 31 may be placed on the lower support body 21, and the substrate 9 may be supported by using such components. In addition, in the substrate processing apparatus 1, by forming the upper support body 31 as an annular member, the weight of the upper support body 31 is reduced. From this perspective, it is not necessary to support the substrate 9 from above, and the substrate 9 may be supported only by the lower support portion 2. That is, the upper gripping member 32 or its driving configuration may be omitted, and the substrate 9 is supported only by the lower gripping member 22.

[0118] Moreover, the support of the substrate 9 is not limited to the method of gripping by the upper gripping member 32 or the lower gripping member 22. For example, the substrate 9 may be supported by suction at the center or the outer peripheral portion of its lower surface. In the case of how the substrate 9 is supported, by forming the upper support body 31 as an annular member, a desired air flow can be generated at the outer edge portion of the upper surface of the substrate 9 during the processing accompanied by the rotation of the substrate 9. In addition, the upper support body 31 only needs to be an annular member and is not limited to a circular ring shape. That is, the outer periphery of the upper support body 31 or the inner periphery of the opening 313 is not limited to a circular shape.

[0119] As described above, in the substrate processing apparatus 1, by variously changing the shape of the longitudinal section of the upper support body 31, it is possible to easily obtain a desired air flow at the outer edge portion of the substrate 9. The annular side wall portion 311 of the upper support body 31 only needs to exist beside the substrate 9 like a wall portion, and it is not necessary for its shape itself to be wall-shaped. That is, the width of the annular side wall portion 311 in the radial direction may be large. For example, the width of the annular side wall portion 311 in the radial direction may be larger than the height in the axial direction. In addition, the inner surface of the annular side wall portion 311 is not limited to a cylindrical surface, and annular concave portions or convex portions centered on the central axis J1 may be appropriately provided.

[0120] The annular side wall portion 311 only needs to be radially opposed to the outer periphery of the substrate 9 supported by the lower support portion 2 and the outer periphery of the lower support portion 2 (specifically, the outer periphery of the lower support body 21). However, it is not necessary to be axially opposed to the outer periphery of the lower support body 21 as a whole, and as long as the annular side wall portion 311 is located below the height of the upper surface of the lower support body 21.

[0121] The annular upper portion 312 is also not limited to a plate shape. The annular upper portion 312 only needs to extend radially inward from the annular side wall portion 311 and be vertically opposed to the outer edge portion of the upper surface of the substrate 9 supported by the lower support portion 2. The "opposition" here means non-contact but relative. Figure 3AIn [description], the annular upper portion 312 includes an annular protruding portion 314 protruding downward at the inner peripheral portion of the lower surface. However, in addition to the annular protruding portion, an annular concave portion centered on the central axis J1 may be provided on the lower surface of the annular upper portion 312. Moreover, two or more annular protruding portions or two or more annular concave portions may be provided. In a general expression, by providing at least one annular convex portion (i.e., protruding portion), concave portion, or step portion centered on the central axis J1 on the lower surface of the annular upper portion 312, the airflow at the outer edge portion of the substrate 9 can be set to a desired airflow. In a more general expression, in a longitudinal cross-section, the lower surface of the annular upper portion 312 does not need to be a straight line along the horizontal direction.

[0122] The airflow generating portion 111 preferably directly generates a downward-directed airflow toward the opening 313 of the annular upper portion 312. As described above, the airflow generating portion 111 does not need to be vertically opposed to the entire opening 313, and it is sufficient if it is opposed to a part thereof. Preferably, more than 1 / 3 of the opening and the airflow generating portion 111 are directly opposed in the vertical direction. More preferably, more than 1 / 2 of the opening and the airflow generating portion 111 are directly opposed in the vertical direction. As long as the airflow flowing into the opening 313 increases compared to the case where there is no airflow generating portion 111, the gas indirectly flows into the opening 313 from the airflow generating portion 111.

[0123] The technique of setting the airflow at the outer edge portion of the substrate 9 to a desired airflow is particularly suitable for the technique of introducing an etching solution into the outer edge portion of the substrate 9. Moreover, it is suitable for the case where an etching solution is supplied to the lower surface of the substrate 9 and the etching solution is guided to a region including the outer edge portion of the upper surface of the substrate 9.

[0124] When the upper support 31 can sufficiently receive the liquid scattered from the substrate 9, the annular cover 16 can be omitted. On the contrary, a plurality of annular covers 16 can be provided radially in multiple layers. Moreover, the annular cover 16 can be lifted and lowered like a cover (so-called cup) that directly receives the droplets of the substrate 9. The upper portion of the annular cover 16 preferably approaches the outer peripheral surface of the annular side wall portion 311 while tending radially inward, but the upper portion of the annular cover 16 may also be located above the upper end of the annular side wall portion 311. In the substrate processing apparatus 1, by providing the upper support 31, the generation of mist or droplets of the processing liquid can be suppressed. Therefore, the amount of airflow from the airflow generating portion 111 and the exhaust volume from the exhaust portion provided at the lower part of the apparatus can also be reduced. By miniaturizing the annular cover 16 and reducing the airflow rate, the manufacturing cost of the substrate processing apparatus 1 can be reduced.

[0125] Since the annular upper part 312 has a large opening 313, it is also possible to supply the processing liquid from the upper nozzle 42 to the upper surface of the outer edge portion of the substrate 9. The upper nozzle 42 of the processing liquid supply unit 4 can supply the processing liquid at a position closer to the inner peripheral end of the annular upper part 312 (i.e., the edge of the opening 313) than the central axis J1. As Figure 11 shown, by inclining the ejection direction of the processing liquid from the upper nozzle 42, it is possible to supply the processing liquid to the upper surface of the substrate 9 at a position where the annular upper part 312 and the substrate 9 overlap in the vertical direction. The processing liquid ejected from the upper nozzle 42 can be various processing liquids. The processing liquid can be a rinsing liquid or an etching liquid.

[0126] In the substrate processing apparatus 1, in the upper holding drive unit 33, the holding-side magnetic body 331 is mechanically connected to the upper holding member 32. "Mechanically connected" means that the movement of the holding-side magnetic body 331 is transmitted to the upper holding member 32 directly or via a contacting member. As Figure 1 shown, the holding-side magnetic body 331 is not limited to being directly joined to the upper holding member 32, and the movement of the holding-side magnetic body 331 can also be transmitted to the upper holding member 32 by means of gears, belts, cams, levers, etc. The same applies to the holding-side magnetic body 231 and the lower holding member 22 in the lower holding drive unit 23.

[0127] The magnetization pattern of the holding-side magnetic body 331 or the drive-side magnetic body 332 can also take various forms. The annular drive-side magnetic body 332 centered on the central axis J1 can have an N pole (or S pole) and an S pole (or N pole) on the inner and outer sides, or an N pole (or S pole) and an S pole (or N pole) above and below. The magnetic body moving unit 333 can also move the drive-side magnetic body 332 not along the vertical direction but in other directions. For example, by dividing the drive-side magnetic body 332 into four equal parts in the circumferential direction and making each magnetic body piece move forward and backward in the radial direction by the magnetic body moving unit 333, it is possible to make the magnetic body piece approach or move away from the side or above of the holding-side magnetic body 331. The above description also applies to the lower holding drive unit 23 except for the opposite vertical direction.

[0128] As described above, at least one of the holding-side magnetic body 331 and the drive-side magnetic body 332 is a magnet. From the viewpoint of obtaining a large attractive force and repulsive force, the holding-side magnetic body 331 and the drive-side magnetic body 332 are preferably magnets. The position restoration unit 334 can be a magnet as described above, can be a magnetic body that is not a magnet, or can be an elastic body such as a spiral spring or a leaf spring. The position restoration unit 334 can also be omitted. The same applies to the lower holding drive unit 23. By using a magnet, it is possible to easily move the upper holding member 32 or the lower holding member 22.

[0129] The upper gripping member 32 is not limited to rotating about an axis along the vertical direction. For example, the outer edge portion of the substrate 9 can be gripped by rotating about an axis along the horizontal direction. The same applies to the lower gripping member 22.

[0130] When the substrate 9 is being processed, it is not necessary to replace the substrate 9 using different gripping members.

[0131] In the substrate processing apparatus 1, the upper gripping member 32 or the lower gripping member 22 can move (including rotate) without using a magnet but by transmitting mechanical force, for example, by transmitting force through gears, belts, cams, levers, etc. That is, the upper gripping member 32 and the lower gripping member 22 can move between a position where the substrate 9 is gripped and a position where the substrate 9 is not gripped by transmitting force using contact between members. For example, the upper gripping member 32 or the lower gripping member 22 can grip the substrate 9 using the force of a spring or the like and contact an additionally provided drive mechanism at rest, thereby moving to a position where the substrate 9 is not gripped. In this case, it is possible to replace the substrate 9 or not to replace the substrate 9.

[0132] From the viewpoint of reducing the scattering of the processing liquid flowing toward the back surface of the substrate 9 by supporting the substrate 9 from above, the upper support 31 may not have the opening 313. Also, when it is not necessary for the upper support 31 to receive the processing liquid, it is not necessary to provide the annular side wall portion 311 on the upper support 31. In this case, the processing liquid scattered from the substrate 9 is received, for example, by the lower support 21 and an annular cup disposed on the outer periphery of the substrate 9. The annular upper portion 312 does not need to be plate-shaped either.

[0133] By providing the upper gripping member 32, from the viewpoint of reducing the number of lower gripping members 22, the structure of providing the upper gripping member 32 on the upper support 31 is particularly suitable for the case of supplying the processing liquid to the lower surface of the substrate 9 regardless of the presence or absence of the lower gripping member 22.

[0134] In addition, when the upper gripping drive unit 33 is provided, a large force for lifting the upper support 31 is required. Therefore, it is preferable to lighten the upper support 31 by forming the upper support 31 as an annular member. Further, from the viewpoint of weight reduction, the upper support 31 is preferably formed of a resin (for example, PEEK (polyether ether ketone) resin).

[0135] In the substrate processing apparatus 1, the outer edge portion of the upper support body 31 is supported while the upper support body 31 is lifted and lowered. Thereby, the upper support body 31 as a placement member relative to the lower support body 21 can be lifted and lowered with a simple structure, and the space above the substrate 9 can be used for various purposes. From this viewpoint, the upper support body 31 does not necessarily have to have an opening 313. That is, the upper support body 31 is detachably placed on the lower support portion 2 and covers at least the upper part of the outer edge portion of the substrate 9 supported by the lower support portion 2. In the substrate processing apparatus 1, a processing liquid is supplied to the upper surface or the lower surface of the substrate 9 supported by the lower support portion 2. Of course, when the outer edge portion of the upper support body 31 is supported and lifted and lowered, the space above the upper support body 31 can be effectively utilized. Therefore, it is preferably arranged such that the upper support body 31 as a placement member is annular and a processing liquid or gas can be supplied to the substrate 9 from above. In addition, the substrate 9 can be held only by the lower holding member 22. That is, the upper holding member 32 and the upper holding drive portion 33 can be omitted.

[0136] The number of lifting portions 13 for lifting and lowering the upper support body 31 as a placement member relative to the lower support portion 2 is preferably plural. However, the number of lifting portions 13 can be only one. For example, by fitting the two arm portions of a very large U-shaped member with high rigidity in a plan view into the grooves 34, the upper support body 31 can be lifted and lowered by one lifting portion 13. When the number of lifting portions 13 is one or two or more, in a normal expression, the upper support body 31 includes a first abutting portion that can abut against the lifting portion 13 in the vertical direction on the radially outer side of the outer periphery of the substrate 9 supported by the lower support portion 2, and the lifting portion 13 includes a second abutting portion that extends from the radially outer side toward the first abutting portion of the upper support body 31. Then, when the lifting drive portion 131 raises the second abutting portion, the second abutting portion abuts against the first abutting portion, and the upper support body 31 separates upward from the lower support portion 2. When the lifting drive portion 131 lowers the second abutting portion, the upper support body 31 is placed on the lower support portion 2, and the second abutting portion separates from the first abutting portion.

[0137] After the upper support 31 is placed on the lower support portion 2, the second abutting portion may also retract radially outward, but it is preferably not retracted, and the lower support portion 2 and the upper support portion 3 can rotate in a state where the first abutting portion and the second abutting portion are separated. Thereby, the upper support 31 can be lifted and lowered with a simple structure. In particular, when the first abutting portion and the second abutting portion are in contact, the annular surface of the first abutting portion centered on the central axis J1 is in contact with the second abutting portion. Thereby, the upper support 31 can be lifted and lowered regardless of the position in the rotation direction of the upper support 31. Usually, when the first abutting portion and the second abutting portion are in contact, the annular lower surface facing the upper support 31 is in contact with the upper surface facing the lifting portion 13. However, these surfaces are not limited to horizontal surfaces. For example, a surface protruding downward in a ring shape may be provided on the upper support 31, and a surface recessed downward toward the lifting portion 13 may be provided, and these surfaces may be in contact with each other.

[0138] On the other hand, when the rotation position of the rotating portion 12 can be controlled, the first abutting portion can also be provided only on a part in the circumferential direction of the upper support 31. In this case, as Figure 8A and Figure 8B shown, the first abutting portion and the second abutting portion can easily include a misalignment prevention structure that fits when they abut against each other. The misalignment prevention structure is preferably a structure that prevents misalignment in the circumferential direction and misalignment in the radial direction of the upper support 31 with respect to the lower support 21. The misalignment prevention structure may also be a structure that only prevents misalignment in the radial direction. For example, when the upper support 31 is not provided with the upper gripping member 32 and the upper support 31 can be placed on the lower support 21 at an arbitrary rotation position, it is only necessary to prevent misalignment in the radial direction. Misalignment prevention is achieved by fitting a convex portion, a concave portion, a step difference, etc. provided on at least one of the first abutting portion and the second abutting portion to a part of the other.

[0139] In the substrate processing apparatus 1, an annular cover 16 is provided on the radial outer side of the upper support 31 in a stationary state, and the lifting drive unit 131 is provided on the annular cover 16, thereby miniaturizing the substrate processing apparatus 1. When the annular cover 16 has sufficient rigidity, the lifting drive unit 131 can also be directly provided on the annular cover 16. When the rigidity of the annular cover 16 is insufficient, a reinforcing member can be provided on the annular cover 16 and the lifting drive unit 131 can be provided on the annular cover 16. In addition, a pedestal such as a frame with high rigidity can be provided above the annular cover 16, and the lifting portion 13 can be provided thereon. That is, "providing the lifting drive unit 131 on the annular cover 16" means, from the viewpoint of reducing the occupied area of the substrate processing apparatus 1, including the case of providing the lifting drive unit 131 above the annular cover 16. The same applies to providing a mechanism for retracting the magnetic body moving portion 333 of the upper gripping drive unit 33 or the upper nozzle 42 on the annular cover 16.

[0140] Regardless of the presence or absence of the opening 313 in the upper support 31 or the upper gripping member 32, the upper support 3 is preferably "detachably placed" relative to the lower support 21 (lower support portion 2) by moving the upper support 31 in the vertical direction so that the upper support 31 is detachably placed on the lower support 21. Of course, the upper support 31 may also be detachably placed on the lower support 21 by moving in a direction other than the vertical direction. "Detachably placed" means that the upper support 31 is coupled to the lower support 21 mainly by gravity (or only by gravity).

[0141] The rotating portion 12 of the substrate processing apparatus 1 is preferably a hollow motor as described above, but when it is not necessary to provide the lower nozzle 41, there is no need to provide a through hole in the rotating shaft. In addition, the rotating portion 12 may also be a motor in which the rotor floats relative to the stator.

[0142] In addition to being able to be used for processing semiconductor substrates, the above-described substrate processing apparatus 1 can also be used for processing glass substrates used in flat panel displays such as liquid crystal display devices or organic EL (Electro Luminescence) display devices, or glass substrates used in other display devices. In addition, the above-described substrate processing apparatus 1 can also be used for processing substrates for optical discs, substrates for magnetic disks, substrates for magneto-optical discs, substrates for photomasks, ceramic substrates, and substrates for solar cells.

[0143] The configurations in the above-described embodiments and each modification can be appropriately combined within a range where they do not contradict each other.

[0144] As described above, the present invention has been described in detail, but the above description is illustrative and not restrictive. Therefore, it can be said that various modifications or forms can be achieved as long as they are within the scope of the present invention.

Claims

1. A substrate processing apparatus that supplies a processing liquid to a substrate to process the substrate, wherein the substrate processing apparatus is characterized by comprising: a support portion that directly or indirectly supports the substrate in a horizontal posture; a rotating portion that rotates the support portion about a central axis in the vertical direction; a mounting member that can be mounted on the support portion in a separated manner from the support portion and covers at least the outer edge portion of the substrate supported by the support portion above; a lifting portion that lifts and lowers the mounting member relative to the support portion; and a processing liquid supply portion that supplies the processing liquid to the upper surface or the lower surface of the substrate supported by the support portion, the mounting member includes a first abutting portion that can abut against the lifting portion in the vertical direction on the radially outer side of the outer periphery of the substrate supported by the support portion; the lifting portion includes: a second abutting portion that extends from the radially outer side toward the first abutting portion of the mounting member; and a lifting drive portion that lifts and lowers the second abutting portion, when the second abutting portion is lifted by the lifting drive portion, the second abutting portion abuts against the first abutting portion, and the mounting member separates upward from the support portion; when the second abutting portion is lowered by the lifting drive portion, the mounting member is mounted on the support portion, and the second abutting portion separates from the first abutting portion; the support portion can rotate in a state where the first abutting portion and the second abutting portion are separated.

2. The substrate processing apparatus according to claim 1, wherein in a state where the mounting member is mounted on the support portion, the position of the first abutting portion in the height direction is 150 mm or less from the upper surface of the support portion.

3. The substrate processing apparatus according to claim 1, wherein the mounting member is annular.

4. The substrate processing apparatus according to claim 1, wherein the first abutting portion and the second abutting portion include a misalignment prevention structure that engages when abutting against each other.

5. The substrate processing apparatus according to claim 1, wherein when the first abutting portion and the second abutting portion abut against each other, the annular surface of the first abutting portion centered on the central axis abuts against the second abutting portion.

6. The substrate processing apparatus according to any one of claims 1 to 5, wherein it further includes an annular cover body that is disposed in a stationary state on the radially outer side of the mounting member, the upper portion of the annular cover body is closer to the outer peripheral surface of the mounting member as it approaches the radially inner side; the lifting drive portion is provided on the annular cover body.

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