A reinforcing structure of a semiconductor chip and a semiconductor chip

Abstract

The application relates to the technical field of semiconductors, and provides a reinforcing structure of a semiconductor chip, which comprises a buffer plate arranged at the connecting position of two adjacent side edges of a chip body, at least one stress groove arranged on the buffer plate, a plurality of outer auxiliary grooves arranged on the two sides of the stress groove, and a plurality of inner auxiliary grooves arranged on the two sides of the stress groove. The reinforcing structure of the semiconductor chip can protect the structure of the semiconductor chip.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, in particular to a reinforcing structure of semiconductor chip and semiconductor chip. BACKGROUND

[0002] In the process of semiconductor chip, the material of dielectric layer between metal lines in the back-end-of-line process needs to use low dielectric constant dielectric material when the technology node enters smaller nanometer level.

[0003] However, the low dielectric constant dielectric material is a porous material with a relatively fragile structure. When the semiconductor chip is cut, the corners of the semiconductor chip bear a large stress, which causes the structure to be easily damaged. SUMMARY

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide a reinforcing structure of semiconductor chip and semiconductor chip, which can protect the structure of the semiconductor chip.

[0005] To achieve the above-mentioned purpose and other related purposes, the present application provides a reinforcing structure of semiconductor chip, comprising:

[0006] A buffer plate is arranged at the connection of two adjacent sides of the chip body;

[0007] At least one stress groove is arranged on the buffer plate;

[0008] A plurality of outer auxiliary grooves are arranged on both sides of the stress groove; and

[0009] A plurality of inner auxiliary grooves are arranged on both sides of the stress groove.

[0010] In an embodiment of the present application, the reinforcing structure further comprises a buffer cutout arranged on one side of the buffer plate, and the buffer plate has an isosceles trapezoidal shape.

[0011] In an embodiment of the present application, the stress groove has a regular octagonal shape.

[0012] In an embodiment of the present application, the outer auxiliary groove has an isosceles trapezoidal shape.

[0013] In an embodiment of the present application, when the number of stress grooves is one, the inner auxiliary groove has an isosceles right triangle shape.

[0014] In an embodiment of the present application, when the number of stress grooves is one and the number of outer auxiliary grooves is two, the two outer auxiliary grooves are symmetrically arranged along the center line of the buffer plate.

[0015] In an embodiment of the present application, when the number of the stress grooves is more than one, the inner auxiliary grooves are in the shape of a square, and the stress grooves are cooperated to form an isosceles right triangle.

[0016] In an embodiment of the present application, the two adjacent sides of the chip body are respectively a first side and a second side, and the outer auxiliary grooves are located on one side of the first side and one side of the second side.

[0017] In an embodiment of the present application, the inner auxiliary grooves are arranged between two adjacent stress grooves parallel to the first side, and / or the inner auxiliary grooves are arranged between two adjacent stress grooves parallel to the second side.

[0018] The present application also provides a semiconductor chip, characterized in comprising:

[0019] a chip body having a plurality of sides; and

[0020] at least one reinforcing structure arranged at the junction of two adjacent sides of the chip body, the reinforcing structure comprising:

[0021] a buffer plate arranged at the junction of two adjacent sides of the chip body;

[0022] at least one stress groove arranged on the buffer plate;

[0023] a plurality of outer auxiliary grooves arranged on both sides of the stress groove; and

[0024] a plurality of inner auxiliary grooves arranged on both sides of the stress groove.

[0025] As described above, the present application provides a reinforcing structure of a semiconductor chip and a semiconductor chip, which can enhance the structural strength of the corners of the semiconductor chip, reduce the stress borne by the corners of the semiconductor chip, disperse the stress borne by the corners of the semiconductor chip when the semiconductor chip is cut, and thus protect the structure of the semiconductor chip from being damaged. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed for the embodiment description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0027] Figure 1 A structural schematic diagram of a semiconductor chip of the present application is shown.

[0028] Figure 2Fig. 1 shows a schematic diagram of a structure of a reinforcing structure of a semiconductor chip according to the present application.

[0029] Figure 3 Fig. 2 shows another schematic diagram of a structure of a reinforcing structure of a semiconductor chip according to the present application.

[0030] Figure 4 Fig. 3 shows still another schematic diagram of a structure of a reinforcing structure of a semiconductor chip according to the present application.

[0031] Element No. Explanation

[0032] 10 chip body

[0033] 20 first side

[0034] 30 second side

[0035] 40 reinforcing structure; 41 buffer plate; 42 stress groove; 43 outer auxiliary groove; 44 inner auxiliary groove; 45 buffer cutout DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0037] Please refer to Figures 1-4 It should be noted that the diagrams provided in the embodiments only schematically illustrate the basic concept of the present application, and the diagrams only show the components related to the present application, rather than the components number, shape and size when actually implemented. The actual implementation of each component type, number and proportion can be arbitrarily changed, and the component layout type can be more complex.

[0038] Please refer to Figure 1 and Figure 2As shown, the present application provides a semiconductor chip, when the semiconductor chip is cut, the corner of the semiconductor chip bears a large stress, the stress generated can cause damage to the structure of the semiconductor chip. In order to be able to reduce the stress borne by the corner of the semiconductor chip, the semiconductor chip can include a chip body 10, a plurality of side edges and a reinforcing structure 40. Among them, the outer side of the chip body 10 can be provided with a plurality of side edges, and the reinforcing structure 40 can be arranged at the connection of the adjacent two side edges of the chip body 10. Taking four side edges as an example, the four side edges can be respectively represented as a first edge 20, a second edge 30, a third edge and a fourth edge, and the four side edges cooperate to form a rectangular sealing structure. The chip body 10 can be arranged in the sealing structure. The reinforcing structure 40 can be arranged at the connection of the first edge 20 and the second edge 30, the reinforcing structure 40 can also be arranged at the connection of the second edge 30 and the third edge, the reinforcing structure 40 can also be arranged at the connection of the third edge and the fourth edge, and the reinforcing structure 40 can also be arranged at the connection of the fourth edge and the first edge 20. The number of reinforcing structures 40 can be one, two, three, four, etc. Taking four reinforcing structures 40 as an example, the four reinforcing structures 40 can be arranged on the four corners of the chip body 10, that is, the four reinforcing structures 40 can be respectively located at the connection of the first edge 20 and the second edge 30, the connection of the second edge 30 and the third edge, the connection of the third edge and the fourth edge, and the connection of the fourth edge and the first edge 20.

[0039] As shown in Figure 1 and Figure 2 As shown, the present application also provides a reinforcing structure of a semiconductor chip. The material of the reinforcing structure 40 can be a low dielectric constant dielectric material, which can reduce the leakage current, heat generation, and capacitive effect between metal lines of the semiconductor chip. Taking the reinforcing structure 40 arranged at the connection of the first edge 20 and the second edge 30 as an example, the reinforcing structure 40 can include a buffer plate 41, a stress groove 42, an outer auxiliary groove 43, an inner auxiliary groove 44 and a buffer cutout 45. Among them, the buffer plate 41 can be installed at the connection of the first edge 20 and the second edge 30, so that the buffer plate 41, the first edge 20 and the second edge 30 cooperate to form a shape similar to a triangle, and the triangle can be a right triangle. The stress groove 42 can be arranged on the buffer plate 41 to reduce the stress borne by the buffer plate 41 and prevent the structure of the semiconductor chip from being damaged when the semiconductor chip is cut. The number of stress grooves 42 can be at least one, for example, one, four, nine, etc., and the number of stress grooves 42 can be represented as N 2, N can be a non-zero natural number. In order to further reduce the stress borne by the buffer plate 41, the buffer plate 41 can be further provided with an outer auxiliary groove 43 and an inner auxiliary groove 44. The number of outer auxiliary grooves 43 can be multiple, for example, two, four, eight, etc., and the number of inner auxiliary grooves 44 can also be multiple, for example, two, four, eight, etc. The number of outer auxiliary grooves 43 can be represented as 2N, and N can be a non-zero natural number. The number of inner auxiliary grooves 44 can also be represented as 2N, and N can be a non-zero natural number. The buffer cutout 45 can be provided on one side of the buffer plate 41, for example, the buffer cutout 45 can be provided at the connection between the first edge 20 and the second edge 30, and the hypotenuse of the buffer cutout 45 can be parallel to the hypotenuse of the buffer plate 41, so that the first edge 20, the buffer cutout 45, the second edge 30 and the buffer plate 41 cooperate to form an isosceles trapezoidal shape. The buffer cutout 45 can further reduce the stress borne by the buffer plate 41.

[0040] Referring to Figure 1 In one embodiment of the present application, the number of stress grooves 42 is one, and the number of outer auxiliary grooves 43 can be two, and the number of inner auxiliary grooves 44 can also be two. The shape of the stress groove 42 can be triangular, quadrilateral, hexagonal, octagonal, and other polygons, or circular. Taking the shape of the stress groove 42 as an octagon as an example, the edges of the stress groove 42 can be parallel to the first edge 20, the second edge 30 and the hypotenuse of the buffer plate 41, respectively. However, it is not limited thereto, and the edges of the stress groove 42 can also be not parallel to the first edge 20, the second edge 30 and the hypotenuse of the buffer plate 41. The stress groove 42 can be located on one side of the center of the buffer plate 41.

[0041] Referring to Figure 1As shown, in an embodiment of the present application, the shape of the outer auxiliary groove 43 can be quadrilateral, pentagon, hexagon, and other polygons, or circular. Taking the shape of the outer auxiliary groove 43 as an isosceles trapezoid as an example, the short bottom edge of the outer auxiliary groove 43 is equal in size to the edge of the stress groove 42. The included angle between the short bottom edge and the oblique edge of the outer auxiliary groove 43 is denoted as a, and the included angle between the two adjacent edges of the stress groove 42 is denoted as b, a = b. Two outer auxiliary grooves 43 can be distributed on both sides of the stress groove 42. One of the outer auxiliary grooves 43 can be located on one side of the first edge 20, and the upper / long bottom edge of the outer auxiliary groove 43 can be parallel to the first edge 20, respectively. The long bottom edge of the outer auxiliary groove 43 can be located on the same straight line as one edge of the stress groove 42, and one oblique edge of the outer auxiliary groove 43 can be parallel to the oblique edge of the buffer plate 41, and the oblique edge of the outer auxiliary groove 43 can be located on the same straight line as one edge of the stress groove 42. The other outer auxiliary groove 43 can be located on one side of the second edge 30, and the upper / long bottom edge of the outer auxiliary groove 43 can be parallel to the second edge 30, respectively. The long bottom edge of the outer auxiliary groove 43 can be located on the same straight line as one edge of the stress groove 42, and one oblique edge of the outer auxiliary groove 43 can be parallel to the oblique edge of the buffer plate 41, and the oblique edge of the outer auxiliary groove 43 can be located on the same straight line as one edge of the stress groove 42. The two outer auxiliary grooves 43 can be symmetrically arranged along the center line of the buffer plate 41.

[0042] Please refer to Figure 1 As shown, in an embodiment of the present application, the shape of the inner auxiliary groove 44 can be triangular, quadrilateral, pentagonal, hexagonal, and other polygons, or circular. Taking the shape of the inner auxiliary groove 44 as an isosceles right triangle as an example, two inner auxiliary grooves 44 can be arranged on one side of the two outer auxiliary grooves 43. One of the inner auxiliary grooves 44 can be located on one side of the first edge 20, and one right angle edge of the inner auxiliary groove 44 can be parallel to the first edge 20, and the other right angle edge of the inner auxiliary groove 44 can be parallel to the second edge 30. The oblique edge of the inner auxiliary groove 44 can be parallel to the oblique edge of the buffer plate 41, and the oblique edge of the inner auxiliary groove 44 can be located on the same straight line as one edge of the stress groove 42 and one oblique edge of the outer auxiliary groove 43. The other inner auxiliary groove 44 can be located on one side of the second edge 30, and one right angle edge of the inner auxiliary groove 44 can be parallel to the first edge 20, and the other right angle edge of the inner auxiliary groove 44 can be parallel to the second edge 30. The oblique edge of the inner auxiliary groove 44 can be parallel to the oblique edge of the buffer plate 41, and the oblique edge of the inner auxiliary groove 44 can be located on the same straight line as one edge of the stress groove 42 and one oblique edge of the outer auxiliary groove 43. The oblique edges of the two inner auxiliary grooves 44 can be located on the same straight line.

[0043] Please refer to Figure 3As shown, in one embodiment of the present invention, taking four stress grooves 42 as an example, the number of outer auxiliary grooves 43 can be four, and the number of inner auxiliary grooves 44 can be two. The four stress grooves 42 can be arranged in the shape of an isosceles right triangle, and adjacent stress grooves 42 can be symmetrically arranged along their center lines. The four stress grooves 42 can be divided into two rows, with one stress groove 42 in the first row and three stress grooves 42 in the second row. The straight line containing the three stress grooves 42 in the second row can be parallel to the hypotenuse of the buffer plate 41. The right-angled isosceles trapezoid formed by the four stress grooves 42 can be located on one side of the center of the buffer plate 41.

[0044] Please see Figure 3 As shown, in one embodiment of the present invention, the shape of the external auxiliary groove 43 is an isosceles trapezoid, wherein two external auxiliary grooves 43 can be arranged on one side of the first side 20, and the other two external auxiliary grooves 43 can be arranged on one side of the second side 30. The two external auxiliary grooves 43 located on the same side can be symmetrically arranged on both sides of a stress groove 42. The external auxiliary grooves 43 located on the first side 20 and the external auxiliary grooves 43 located on the second side 30 can be symmetrically arranged along the center line.

[0045] Please see Figure 3 As shown, in one embodiment of the present invention, the inner auxiliary groove 44 can be triangular, quadrilateral, pentagonal, hexagonal, or other polygons, or circular. Taking a square shape as an example, the inner auxiliary groove 44 can be parallel to two of the parallel sides of the inner auxiliary groove 44, and the other two parallel sides of the inner auxiliary groove 44 can be parallel to the second side 30. One inner auxiliary groove 44 can be located on one side of the first side 20, and the other inner auxiliary groove 44 can be located on one side of the second side 30. The two inner auxiliary grooves 44 can be respectively disposed on the two right-angled sides of the right-angled isosceles trapezoid formed by the four stress grooves 42. The inner auxiliary groove 44 can be located on the central portion between two stress grooves 42, so that the two stress grooves 42 located on the right-angled sides can be symmetrically arranged along the inner auxiliary groove 44.

[0046] Please see Figure 4As shown, in one embodiment of the present application, the number of stress grooves 42 is nine, and the number of outer auxiliary grooves 43 can be six, and the number of inner auxiliary grooves 44 can also be six. The nine stress grooves 42 can be arranged in the shape of an isosceles right triangle, and two adjacent stress grooves 42 can be symmetrically arranged along the center lines of the two stress grooves 42. At this time, the nine stress grooves 42 can be divided into three rows, the first row has one stress groove 42, the second row has three stress grooves 42, and the third row has five stress grooves 42. The straight line on which the five stress grooves 42 in the third row are located can be parallel to the hypotenuse of the buffer plate 41. The isosceles right triangle formed by the nine stress grooves 42 can be located on one side of the center of the buffer plate 41.

[0047] As shown in FIG. 4, Figure 4 As shown, in one embodiment of the present application, the shape of the outer auxiliary groove 43 is an isosceles trapezoid, and three outer auxiliary grooves 43 can be arranged on one side of the first side 20, and another three outer auxiliary grooves 43 can be arranged on one side of the second side 30. Two adjacent outer auxiliary grooves 43 on the same side can be symmetrically arranged on both sides of a stress groove 42. The outer auxiliary grooves 43 on one side of the first side 20 and the outer auxiliary grooves 43 on one side of the second side 30 can be symmetrically arranged along the center line.

[0048] As shown in FIG. 4, Figure 4 As shown, in one embodiment of the present application, the shape of the inner auxiliary groove 44 is a square, and six inner auxiliary grooves 44 can cooperate to form an isosceles trapezoidal shape. The six inner auxiliary grooves 44 can be divided into two rows, the first row can have two inner auxiliary grooves 44, and the second row can have four inner auxiliary grooves 44. Between two adjacent stress grooves 42 parallel to the first side 20, an inner auxiliary groove 44 can be arranged, and between two adjacent stress grooves 42 parallel to the second side 30, an inner auxiliary groove 44 can also be arranged. The inner auxiliary grooves 44 on both sides of a stress groove 42 can be symmetrically arranged along the stress groove 42, that is, two adjacent inner auxiliary grooves 44 can be symmetrically arranged on both sides of a stress groove 42.

[0049] As shown in FIG. 4, Figure 2 , Figure 3 and Figure 4 As shown, in one embodiment of the present application, the number of stress grooves 42 included in the reinforcing structure 40 can be represented as N 2, N can be a non-zero natural number, the number of outer auxiliary grooves 43 can be represented as 2N, and the number of inner auxiliary grooves 44 can also be represented as 2N. When N is equal to one, the number of stress grooves 42 is one, the number of outer auxiliary grooves 43 is two, and the number of inner auxiliary grooves 44 is two. At this time, the stress groove 42 can be located in the center part of the buffer plate 41, the two outer auxiliary grooves 43 can be located on the two sides of the stress groove 42, and the two inner auxiliary grooves 44 can be located on the two sides of the stress groove 42. When N is greater than one, multiple stress grooves 42 cooperate with each other to form an isosceles right triangle shape. At this time, the multiple stress grooves 42 can be divided into multiple rows, the first row has one stress groove 42, the second row has three stress grooves 42, the third row has five stress grooves 42, the fourth row has seven stress grooves 42, the fifth row has nine stress grooves 42, and the Mth row has (2M-1) stress grooves 42. Half of the outer auxiliary grooves 43 can be located on one side of the first edge 20, and the other half of the outer auxiliary grooves 43 can be located on one side of the second edge 30. Adjacent two outer auxiliary grooves 43 located on one side of the first edge 20 can be symmetrically arranged on the two sides of a certain stress groove 42, and adjacent two outer auxiliary grooves 43 located on one side of the second edge 30 can be symmetrically arranged on the two sides of a certain stress groove 42, that is, adjacent two outer auxiliary grooves 43 located on the same side can be symmetrically arranged on the two sides of a certain stress groove 42. The outer auxiliary grooves 43 located on one side of the first edge 20 and the outer auxiliary grooves 43 located on one side of the second edge 30 can be symmetrically arranged along the center line. The 2N inner auxiliary grooves 44 can be located within the isosceles right triangle formed by the multiple stress grooves 42. Specifically, between adjacent two stress grooves 42 parallel to the first edge 20, one inner auxiliary groove 44 can be arranged. Between adjacent two stress grooves 42 parallel to the second edge 30, one inner auxiliary groove 44 can also be arranged. That is, the inner auxiliary grooves 44 can be arranged between adjacent two stress grooves 42 parallel to the first edge 20, and / or the inner auxiliary grooves 44 can also be arranged between adjacent two stress grooves 42 parallel to the second edge 30. The inner auxiliary grooves 44 located on the two sides of a certain stress groove 42 can be symmetrically arranged along the stress groove 42, that is, adjacent two inner auxiliary grooves 44 can be symmetrically arranged on the two sides of a certain stress groove 42.

[0050] In summary, the semiconductor chip reinforcing structure and the semiconductor chip provided by the application can enhance the structural strength of the corners of the semiconductor chip and reduce the stress borne by the corners of the semiconductor chip. When the semiconductor chip is cut, the stress borne by the corners of the semiconductor chip is dispersed, thereby protecting the structure of the semiconductor chip from being damaged.

[0051] In the description of the specification, the description with reference to the terms "the embodiment", "an example", "a specific example" and the like means that the specific feature, structure, material or the like described in connection with the embodiment or example is included in at least one embodiment or example of the present application. Illustrative expressions of the above terms in the specification do not necessarily refer to the same embodiment or example. Also, the specific feature, structure, material or the like described can be combined in an appropriate manner in any one or more embodiments or examples.

[0052] The embodiments of the application disclosed above are only used for helping to explain the present application. The embodiments do not describe all the details and limit the present application to the specific embodiments. Obviously, according to the content of the specification, many modifications and changes can be made. The specification selects and specifically describes these embodiments in order to better explain the principles and practical application of the present application, so that the persons skilled in the art can well understand and utilize the present application. The present application is limited by the claims and the whole scope and equivalents thereof.

Claims

1. A reinforcing structure of a semiconductor chip, characterized by comprising: The semiconductor chip's reinforcing structure comprises: a buffer plate, which is arranged at the joint of two adjacent sides of the chip body; the two sides are respectively referred to as the first side and the second side; at least one stress groove is arranged on the buffer plate; a plurality of outer auxiliary grooves are arranged on both sides of the stress groove; a plurality of inner auxiliary grooves are arranged on both sides of the stress groove; when the number of stress grooves is more than one, the plurality of stress grooves cooperates to form an isosceles right triangle shape; the two adjacent stress grooves are symmetric along the center line of the two stress grooves; The number of the stress grooves is N 2 The number of the outer auxiliary grooves is 2N, the number of the inner auxiliary grooves is 2N, and N is a non-zero natural number. the plurality of outer auxiliary grooves are respectively arranged on one side of the first side and one side of the second side; the outer auxiliary grooves arranged on one side of the first side and the outer auxiliary grooves arranged on one side of the second side are symmetric along the center line of the buffer plate; the inner auxiliary grooves are arranged between the two adjacent stress grooves parallel to the first side, and / or the inner auxiliary grooves are arranged between the two adjacent stress grooves parallel to the second side. The buffer plate is in the shape of an isosceles trapezoid.

2. The reinforcing structure of a semiconductor chip according to claim 1, wherein The stress groove is in the shape of a regular octagon.

3. The reinforcing structure of a semiconductor chip according to claim 1, wherein The outer auxiliary groove is in the shape of an isosceles trapezoid.

4. The reinforcing structure for a semiconductor chip according to claim 1, wherein When the number of stress grooves is one, the inner auxiliary groove is in the shape of an isosceles right triangle.

5. The reinforcing structure of a semiconductor chip according to claim 1, wherein When the number of stress grooves is one and the number of outer auxiliary grooves is two, the two outer auxiliary grooves are symmetric along the center line of the buffer plate.

6. The reinforcing structure of a semiconductor chip according to claim 5, wherein The inner auxiliary groove is in the shape of a square.

7. The reinforcing structure of a semiconductor chip according to claim 1, wherein The semiconductor chip comprises:

8. A semiconductor chip, characterized by a chip body with a plurality of sides; and at least one semiconductor chip's reinforcing structure as claimed in claims 1-7. ​

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