An integrated component for power systems and control systems

Abstract

This invention provides an integrated component for a power system and control system, including power conversion and isolation circuits, point-of-load circuits, power management circuits, control system circuits, planar busbars, output connectors, etc. This integrated component integrates multiple functional circuits on a single PCB, realizing power conversion, transmission, and management, while simultaneously performing system control. Its conformal design with the housing structure enhances heat dissipation and reduces the overall thickness and weight of the power system and control system.

Description

Technical Field

[0001] This invention belongs to the field of power electronics and electrical engineering technology, and specifically relates to an integrated component for a power system and a control system. Background Technology

[0002] Power systems encompass power conversion and isolation, point-of-load (POW) transformation, power delivery, and power management. Power conversion utilizes high-power-density power conversion circuits, high-current power delivery employs bus configurations, power management utilizes digital chips for power management and monitoring, and the control system employs high-speed circuits for real-time system control and communication. Currently, commonly used power systems, power management, power delivery, and control systems are mostly designed independently, then integrated to achieve power and signal interconnection, thereby completing the system's functions. However, for systems with high integration, thin dimensions, light weight, numerous loads, and randomly distributed spaces, conventional design methods result in large dimensions and heavy weight, making it impossible to power and control multiple loads within a limited space. Summary of the Invention

[0003] To address the aforementioned problems, the present invention aims to provide an integrated design method for power systems and control systems, reducing space height, achieving thinness and light weight, and meeting the requirements of multiple loads with random spatial distribution.

[0004] To achieve the above objectives, the present invention provides the following technical solution: an integrated component of a power system and a control system, the integrated component comprising: a power conversion and isolation circuit for realizing voltage conversion and electrical isolation, and providing the intermediate voltage required for distributed power supply; multiple output connectors for transmitting the output power and control signals of the integrated component to the load, and correspondingly configured with the loads; multiple point-of-load circuits for converting the intermediate voltage provided by the power conversion and isolation circuit into the supply voltage of the load, the point-of-load circuits being distributed around the output connectors; a control system circuit for receiving signals from a host computer, generating control commands for the power conversion and isolation circuit, the point-of-load circuits, and the loads, and simultaneously feeding back the operating status of the integrated component and the status of the loads to the host computer; a power management circuit for receiving control commands from the control system circuit for the power conversion and isolation circuit and the point-of-load circuits, controlling the power conversion and isolation circuit and the point-of-load circuits, and simultaneously monitoring the operating status of the power conversion and isolation circuit and the point-of-load circuits and feeding back the status to the control system circuit; and a planar bus for transmitting the input power of the integrated component, wherein the power conversion and isolation circuit, the point-of-load circuit, the power management circuit, the control system circuit, the planar bus, and the output connectors are integrated on the same PCB.

[0005] The integrated power system and control system component provided by this invention also has the following features: in the PCB, the power and control signals are layered and routed in separate areas, with copper layers of unequal thickness and symmetrical stacked arrangement between the layers.

[0006] The integrated power system and control system component provided by the present invention also has the feature that the power management circuit is arranged between the control system circuit and the power conversion and isolation circuit.

[0007] The integrated power system and control system component provided by the present invention also has the following features: the planar bus is uniformly and symmetrically distributed on the PCB; the input end of the planar bus is interconnected with the outside through copper bosses; the output end is interconnected with the PCB pads through protruding copper pins; and the bottom surface of the planar bus is integrally welded to the PCB.

[0008] The integrated power system and control system component provided by this invention also has the feature that the planar bus has a flat design and the height of the planar bus is not higher than the highest height of the devices in the power conversion and isolation circuit, the point-of-load circuit, the power management circuit, the control system circuit, and the output connector.

[0009] The integrated power system and control system provided by the present invention also has the following features: the PCB is conformally aligned with the application structure housing of the integrated component, and a thermally conductive medium is filled between the integrated component and the structure housing.

[0010] Beneficial effects

[0011] The integrated power system and control system component provided by this invention integrates multiple functional circuits on the same PCB to realize power conversion, transmission and management, and complete system control. It is also conformally designed with the housing structure, which enhances heat dissipation performance and reduces the overall thickness and weight of the power system and control system. Attached Figure Description

[0012] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a structural diagram of the integrated components of the power system and control system in an embodiment of the present invention;

[0014] Figure 2 This is a schematic diagram of symmetrical stacked layers with unequal thickness of layered traces in an embodiment of the present invention;

[0015] Figure 3 This is a partial schematic diagram of the busbar in an embodiment of the present invention. Detailed Implementation

[0016] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. However, it should be noted that these embodiments are not intended to limit the present invention. Equivalent transformations or substitutions in function, method, or structure made by those skilled in the art based on these embodiments are all within the protection scope of the present invention.

[0017] In the description of the embodiments of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the invention.

[0018] Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0019] The terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art will understand the specific meaning of these terms in this invention based on the specific circumstances.

[0020] like Figures 1-3As shown, this embodiment of the invention provides an integrated component for a power system and a control system. The integrated component includes: a power conversion and isolation circuit for voltage conversion and electrical isolation, and for providing the intermediate voltage required for distributed power supply; multiple output connectors ① for transmitting the output power and control signals of the integrated component to the load, each corresponding to a load; multiple load point circuits for converting the intermediate voltage provided by the power conversion and isolation circuit into the supply voltage of the load, the load point circuits being distributed around the output connectors ①; a control system circuit for receiving signals from a host computer and generating control commands for the power conversion and isolation circuit, load point circuits, and loads, while simultaneously feeding back the operating status of the integrated component and the load status to the host computer; a power management circuit for receiving control commands from the control system circuit for the power conversion and isolation circuit and load point circuits, controlling the power conversion and isolation circuit and load point circuits, and simultaneously monitoring the operating status of the power conversion and isolation circuit and load point circuits and feeding back the status to the control system circuit; and a planar bus for transmitting the input power of the integrated component. The power conversion and isolation circuit, load point circuit, power management circuit, control system circuit, planar bus, and output connectors ① are integrated on the same PCB. Figure 1 ① in the diagram represents the output connector.

[0021] In the above embodiments, the power conversion and isolation circuit is designed with corresponding conversion circuits according to the input and output voltages and power requirements to achieve voltage conversion and electrical isolation, providing the intermediate voltage required for distributed power supply; the load point circuit is distributed near the output connector ①, converting the intermediate voltage into the power supply voltage required by the load. The power management circuit controls the power on / off, monitors the power circuit status, and communicates with the control system; the control system is designed with control circuits and communication circuits for real-time control and communication of the system, and includes signal integrity design; during the design of the power and control system, the PCB is designed with signal layering, and the copper thickness is designed with unequal thickness according to current carrying capacity and impedance matching, while ensuring balanced heat dissipation between PCB layers, and the power layer and signal layer are designed symmetrically. Figure 2 The diagram shows an 8-layer stack-up. The planar bus is designed as a flat bus integrated onto the PCB based on the structure and component heights, ensuring the bus height does not exceed the height of the tallest component on the PCB. Inputs are interconnected to external components via copper bosses, and outputs are interconnected to PCB pads via protruding copper studs. Simultaneously, the entire bottom surface of the bus is soldered to the PCB. Finally, high-power energy is transmitted to each output connector ① via the PCB. Figure 3 The diagram shows a partial view of the busbar; the output connectors ① are distributed throughout the PCB, corresponding to the respective load locations, to achieve power and signal interconnection.

[0022] In some embodiments, power and control signals are layered and routed separately on the PCB, with unequal copper thicknesses and symmetrical stacking between layers. The integrated power and control system components provided in the aforementioned embodiments ensure balanced heat generation between PCB layers, and the power and signal layers are symmetrically designed, such as... Figure 2 The diagram shows an 8-layer stack-up, achieving power current carrying and signal integrity. The power management circuit, located on the same printed circuit board, detects the various states of the power conversion circuit locally and communicates with the control system in real time, eliminating the need for system interconnection cables and enhancing the reliability of system status detection and communication.

[0023] In some embodiments, the power management circuit is arranged between the control system circuit and the power conversion and isolation circuit.

[0024] In some embodiments, the planar bus is evenly and symmetrically distributed on the PCB. The input end of the planar bus is interconnected with the outside through copper bosses, and the output end is interconnected with the PCB pads through protruding copper pins. At the same time, the bottom surface of the planar bus is welded to the PCB as a whole.

[0025] In some embodiments, the planar bus is designed with a flat profile, and its height is no higher than the highest height of the devices in the power conversion and isolation circuit, point-of-load circuit, power management circuit, control system circuit, and output connector ①. In the above embodiments, the planar bus is symmetrically and extensively distributed on the printed circuit board, which not only ensures effective power transmission but also enhances the overall strength and heat dissipation performance of the large-size printed circuit board, ensuring uniform heat dissipation across the entire board.

[0026] In some embodiments, the PCB conforms to the application structure housing of the integrated component, and a thermally conductive medium is filled between the integrated component and the structural housing. In the above embodiments, the structural housing serves as the heat dissipation plane, and the heat generated by the power conversion and load point circuits is distributed across multiple areas of the structure, resulting in less heat concentration and better heat dissipation performance. The thermally conductive medium filling the space between the planar bus and the structural housing further enhances the system's heat dissipation capacity. The conformal design with the structural housing eliminates the need for a separate heat sink for the power system, effectively reducing thickness and weight.

[0027] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention. The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the protection scope of the present invention.

Claims

1. An integrated assembly of a power system and a control system, characterized by, The integrated assembly comprises: a power conversion and isolation circuit for realizing voltage conversion and electrical isolation and providing an intermediate voltage required by distributed power supply; a plurality of output connectors for transmitting output power and control signals of the integrated assembly to loads corresponding to the respective loads; a plurality of load point circuits for converting the intermediate voltage provided by the power conversion and isolation circuit into power supply voltage of the loads, the load point circuits being distributed around the output connectors; a control system circuit for receiving signals issued by an upper computer, generating control instructions of the power conversion and isolation circuit, the load point circuits and the loads, and feeding back working states of the integrated assembly and states of the loads to the upper computer; a power management circuit for controlling the power conversion and isolation circuit and the load point circuits after receiving control instructions of the power conversion and isolation circuit and the load point circuits issued by the control system circuit, and simultaneously monitoring working state feedback of the power conversion and isolation circuit and the load point circuits to the control system circuit; a planar busbar for transmitting input power of the integrated assembly, the power conversion and isolation circuit, the load point circuits, the power management circuit, the control system circuit, the planar busbar and the output connectors are integrated on the same PCB.

2. The integrated assembly of power systems and control systems of claim 1, wherein, In the PCB, power and control signals are layered and zoned, and different wiring layers are arranged in different thicknesses and are stacked symmetrically.

3. The integrated assembly of power systems and control systems of claim 1, wherein, The power management circuit is arranged between the control system circuit and the power conversion and isolation circuit.

4. The integrated assembly of power systems and control systems of claim 1, wherein, The planar busbar is uniformly and symmetrically distributed on the PCB, the input end of the planar busbar is interconnected with the outside through a copper boss, the output end is interconnected with a PCB pad by welding a protruding copper nail, and the bottom surface of the planar busbar is integrally welded with the PCB.

5. The integrated assembly of power systems and control systems of claim 1, wherein, The planar busbar is designed to be flat, and the height of the planar busbar is not higher than the maximum height of the devices in the power conversion and isolation circuit, the load point circuits, the power management circuit, the control system circuit and the output connectors.

6. The integrated assembly of power systems and control systems of claim 1, wherein, The PCB is conformal with the application structure shell of the integrated assembly, and a thermally conductive medium is filled between the integrated assembly and the structure shell.

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