An electronic component heat dissipation system and method

Abstract

The application relates to the field of heat dissipation, and discloses an electronic component heat dissipation system, which comprises a sealed box body, a pressure sensor, a control device and a pumping device. The sealed box body is used for placing electronic components and two-phase cooling medium. The pressure sensor is arranged on the inner side of the top of the sealed box body. The control device is connected with the pressure sensor and the pumping device. The pressure sensor is used for measuring the pressure in the sealed box body and sending the pressure to the control device. The control device is used for receiving the pressure and sending a pumping amount reduction instruction to the pumping device when the pressure is greater than a first preset pressure threshold value and smaller than a second preset pressure threshold value. The pumping device is used for receiving the pumping amount reduction instruction and reducing the pumping amount of the cooling liquid. The first preset pressure threshold value is the upper limit value of the pressure in the sealed box body when the electronic components are normally working. The pressure in the sealed box body measured by the pressure sensor is used as control information, the accuracy of the control information is improved, and the heat dissipation power consumption is reduced under short-term high-load working conditions.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat dissipation, in particular to an electronic component heat dissipation system and method. BACKGROUND

[0002] With the rapid development of new generation information technology, as the carrier of information data, the development and market size of data center are also expanding. Especially when high-power density large data centers gradually become the mainstream, the immersion cooling heat dissipation technology with better heat dissipation effect gradually becomes the research focus.

[0003] The two-phase immersion cooling method relies on the boiling vaporization of the cooling liquid to take away the heat of the server, that is, the heat exchange between the two-phase electronic fluorination liquid and the server is mainly based on boiling phase change, and the heat transfer coefficient and heat dissipation limit are high. It is the development trend of future immersion cooling heat dissipation technology. The two-phase immersion cooling system is generally a sealed box structure, filled with a certain amount of two-phase electronic fluorination liquid, and the server is immersed in the fluorination liquid. A certain space is left at the upper part of the sealed box to accommodate the fluorination gas generated by phase change after boiling and install the corresponding condensing equipment.

[0004] At present, when using two-phase immersion cooling technology to dissipate heat from the server, temperature is used as the input signal of the measurement physical quantity and the control system. A plurality of temperature sensors are arranged on the inner surface of the sealed box to monitor the temperature of the server chip and the two-phase electronic fluorination liquid in the box. When the temperature of the server chip exceeds the set temperature, the flow of the cooling liquid in the condenser pipe is increased, so as to use the cooling liquid to cool and liquefy the fluorination gas, reduce the pressure at the upper part of the sealed box, and then cool the server. The current heat dissipation system has the following defects: first, the power consumption of the server is dynamic, and the temperature of the server rises sometimes only for a short time, for example, running a larger algorithm model. For the power fluctuation in a short time, the flow of the cooling liquid in the condenser pipe is still increased to achieve cooling, which will increase the operating power consumption of the cooling liquid pumping device, increase the power consumption, and further increase the operating cost. Second, since a plurality of temperature sensors need to be arranged, not only the cost of the heat dissipation system is high, but also the complexity of the heat dissipation system is increased. Third, the temperature information cannot accurately reflect the working condition of the two-phase immersion cooling system, so that the control device obtains inaccurate control information.

[0005] Therefore, how to solve the above technical problems should be the focus of attention of those skilled in the art. SUMMARY

[0006] The purpose of the present application is to provide an electronic component heat dissipation system and method to reduce the complexity of the heat dissipation system, improve the accuracy of the control information, and reduce the power consumption and operating cost of the heat dissipation system when the electronic component is cooled in the case of short-time power consumption increase.

[0007] To solve the above technical problems, the application provides an electronic component heat dissipation system, comprising:

[0008] a sealed box, a pressure sensor, a control device, and a pumping device;

[0009] The sealed box is used for placing electronic components and two-phase cooling medium, the pressure sensor is arranged on the inner side of the top of the sealed box, and the control device is connected with the pressure sensor and the pumping device respectively.

[0010] The pressure sensor is used for measuring the pressure in the sealed box and sending the pressure to the control device, the control device is used for receiving the pressure and sending a pumping amount reduction instruction to the pumping device when the pressure is greater than a first preset pressure threshold and less than a second preset pressure threshold, and the pumping device is used for receiving the pumping amount reduction instruction and reducing the pumping amount of the cooling liquid; wherein the first preset pressure threshold is an upper limit value of the pressure in the sealed box when the electronic components are normally working.

[0011] Optionally, the electronic component heat dissipation system further comprises:

[0012] a condensing pipeline, the ports of the condensing pipeline are arranged outside the sealed box, and the pumping device is connected to the part of the condensing pipeline outside the sealed box.

[0013] Optionally, in the electronic component heat dissipation system, the part of the condensing pipeline inside the sealed box is distributed in a curved shape.

[0014] Optionally, in the electronic component heat dissipation system, the part of the condensing pipeline inside the sealed box is distributed in a straight line shape.

[0015] Optionally, in the electronic component heat dissipation system, the part of the condensing pipeline inside the sealed box is distributed in a spiral shape.

[0016] Optionally, the electronic component heat dissipation system further comprises:

[0017] an external cooling device connected with the two ports of the condensing pipeline, used for reducing the temperature of the cooling liquid circulating into the condensing pipeline.

[0018] Optionally, the electronic component heat dissipation system further comprises:

[0019] the two-phase cooling medium filled in the sealed box and used for immersing the electronic components.

[0020] Optionally, in the electronic component heat dissipation system, the control device is further configured to send a pump amount decreasing instruction to the pumping device when the pressure is less than a third preset pressure threshold; wherein the third preset pressure threshold is a lower limit of the pressure in the sealed box when the electronic component is working normally.

[0021] Optionally, in the electronic component heat dissipation system, the control device is further configured to send a pump amount increasing instruction to the pumping device when the pressure is greater than or equal to the second preset pressure threshold.

[0022] The application further provides an electronic component heat dissipation method, comprising:

[0023] receiving a pressure in a sealed box in which electronic components and two-phase cooling medium are placed;

[0024] determining whether the pressure is greater than a first preset pressure threshold and less than a second preset pressure threshold; wherein the first preset pressure threshold is an upper limit of the pressure in the sealed box when the electronic component is working normally;

[0025] when the pressure is greater than the first preset pressure threshold and less than the second preset pressure threshold, sending a pump amount decreasing instruction to the pumping device so that the pumping device decreases the pump amount of the cooling liquid.

[0026] An electronic component heat dissipation system provided by the application comprises a sealed box, a pressure sensor, a control device and a pumping device; the sealed box is used for placing electronic components and two-phase cooling medium; the pressure sensor is arranged on the inner side of the top of the sealed box; the control device is connected with the pressure sensor and the pumping device respectively; the pressure sensor is used for measuring the pressure in the sealed box and sending the pressure to the control device; the control device is used for receiving the pressure and sending a pump amount decreasing instruction to the pumping device when the pressure is greater than a first preset pressure threshold and less than a second preset pressure threshold; the pumping device is used for receiving the pump amount decreasing instruction and decreasing the pump amount of the cooling liquid; wherein the first preset pressure threshold is an upper limit of the pressure in the sealed box when the electronic component is working normally.

[0027] It can be seen that the electronic component heat dissipation system in the application measures the pressure inside the sealed box through the pressure sensor, adjusts the heat dissipation of the electronic component through the pressure, and the pressure value can more accurately reflect the working condition of the heat dissipation system, thereby improving the accuracy of the control information obtained by the control device. In the application, only one pressure sensor needs to be arranged, which can reduce the cost of the heat dissipation system, reduce the control input circuit, reduce the complexity of the heat dissipation system, simplify the control strategy, and avoid the influence of local hot spots on the control strategy. In addition, in the application, when the pressure in the sealed box is greater than the first preset pressure threshold and less than the second preset pressure threshold, the pumping amount of the cooling liquid is still reduced, the heat flux density of the two-phase cooling medium is increased, and the heat dissipation effect is strengthened, so that the heat dissipation capacity of the two-phase cooling medium per unit volume is improved under the short-term high-load working condition of the electronic component, the problem of increased power consumption caused by increasing the pumping amount of the cooling liquid is avoided, the operation cost is reduced, and the PUE value of the system can be improved to a certain extent.

[0028] In addition, the application also provides an electronic component heat dissipation method with the above advantages. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description. Obviously, the drawings in the following description are only some embodiments of the application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0030] Figure 1 A structural schematic diagram of an electronic component heat dissipation system provided by the application;

[0031] Figure 2 A relationship curve between the heat flux density of the two-phase cooling medium and the pressure in the sealed box provided by the application;

[0032] Figure 3 A flowchart of an electronic component heat dissipation method provided by the application;

[0033] In the figure, 1 is a sealed box, 2 is a pressure sensor, 3 is a control device, 4 is a pumping device, 5 is a condensing pipeline, 6 is an external cooling device, 7 is a cooling liquid, 8 is an electronic component, and 9 is a two-phase cooling medium. DETAILED DESCRIPTION

[0034] For the person skilled in the art to better understand the present application, the present application will be further described in detail below in combination with the drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work belong to the scope of protection of the present application.

[0035] In the following description, many specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in other ways different from those described herein without departing from the scope of the present application, and those skilled in the art can make similar extensions without departing from the concept of the present application, so the present application is not limited to the specific embodiments disclosed below.

[0036] As described in the background section, when the electronic components are cooled at present, the temperature information is collected, and the flow of the cooling liquid in the condenser is increased as long as the temperature exceeds the set temperature. This cooling method has the following defects: first, for the temperature rise in a short time, it will lead to the increase of the cooling operation cost, second, since multiple temperature sensors need to be arranged, not only the cost of the cooling system is high, but also the complexity of the cooling system is increased, third, the temperature information cannot accurately reflect the working condition of the two-phase immersion cooling system, so that the control device obtains inaccurate control information.

[0037] Therefore, the present application provides an electronic component cooling system, please refer to Figure 1 , comprising:

[0038] a sealed box 1, a pressure sensor 2, a control device 3, a pumping device 4;

[0039] The sealed box 1 is used to place electronic components 8 and two-phase cooling medium 9, the pressure sensor 2 is arranged on the inner side of the top of the sealed box 1, and the control device 3 is connected with the pressure sensor 2 and the pumping device 4 respectively;

[0040] The pressure sensor 2 is used to measure the pressure in the sealed box 1 and send the pressure to the control device 3; the control device 3 is used to receive the pressure and send a pumping amount reduction instruction to the pumping device 4 when the pressure is greater than a first preset pressure threshold and less than a second preset pressure threshold; the pumping device 4 is used to receive the pumping amount reduction instruction and reduce the pumping amount of the cooling liquid 7; wherein the first preset pressure threshold is the upper limit value of the pressure in the sealed box 1 when the electronic components 8 are working normally.

[0041] Since the gas has isotropic properties, the pressure of the gas is equal everywhere in the sealed box 1 in thermal equilibrium, so the number of pressure sensors 2 in the application only needs one. The pressure sensor 2 is arranged inside the top of the sealed box 1, for example, the inner surface of the top or a certain distance from the inner surface. The position of the pressure sensor 2 on the inner surface of the top of the sealed box 1 in the application is not limited, for example, the pressure sensor 2 can be arranged at the corner, or arranged in the middle of the inner surface of the top, etc.

[0042] It should be noted that the connection mode of the pressure sensor 2 and the control device 3 in the application is not limited, which is determined according to the situation. For example, the pressure sensor 2 and the control device 3 are connected by wireless connection, or the pressure sensor 2 and the control device 3 are connected by wired connection. The wireless connection mode includes but is not limited to Bluetooth, WiFi, 4G, 5G, and the wired connection mode includes but is not limited to USB (Universal Serial Bus), serial port.

[0043] Further, the connection mode of the control device 3 and the pumping device 4 in the application is not limited and can be set by itself. For example, the control device 3 and the pumping device 4 are connected by wireless connection, or the control device 3 and the pumping device 4 are connected by wired connection. The wireless connection mode includes but is not limited to Bluetooth, WiFi, 4G, 5G, and the wired connection mode includes but is not limited to USB, serial port.

[0044] The pumping device 4 can be a circulating pump.

[0045] The control device 3 includes but is not limited to CPU (Central Processing Unit), single-chip microcomputer.

[0046] The electronic component 8 can be a server or any high-power device.

[0047] The sealed box 1 is filled with two-phase cooling medium 9, but there is still a certain space at the top of the sealed box 1, that is, the sealed box 1 is not filled with two-phase cooling medium 9. When the temperature of the electronic component 8 rises, the two-phase cooling medium 9 is boiled and vaporized to cool the electronic component 8, and the pressure of the space at the top of the sealed box 1 increases.

[0048] The first preset pressure threshold is less than the second preset pressure threshold. This application does not limit the magnitude of the first and second preset pressure thresholds; they can be set independently. The heat dissipation system of electronic component 8 has a maximum permissible operating pressure. Optionally, the first preset pressure threshold can be set to 85% of the maximum permissible operating pressure of the heat dissipation system, and the second preset pressure threshold can be set to 95% of the maximum permissible operating pressure of the heat dissipation system; or, the first preset pressure threshold can be set to 80% of the maximum permissible operating pressure of the heat dissipation system, and the second preset pressure threshold can be set to 90% of the maximum permissible operating pressure of the heat dissipation system, etc.

[0049] The relationship between the heat flux density of the two-phase cooling medium 9 and the pressure in the top space inside the sealed housing 1 is as follows: Figure 2 As shown, the X-axis represents the instantaneous pressure at any point in the top space within the sealed housing 1, and the Y-axis represents the heat flux density of the two-phase cooling medium 9. The critical heat flux density of the two-phase cooling medium 9 corresponds to the maximum permissible operating pressure of the system. Figure 2 In this diagram, X1 represents the maximum allowable operating pressure of the system, and Y1 represents the critical heat flux density of the two-phase cooling medium 9; X2 represents the pressure corresponding to 95% of the maximum allowable operating pressure of the system at the critical heat flux density, and Y2 represents the heat flux density corresponding to the two-phase cooling medium 9 at 95% of the maximum allowable operating pressure of the system; X3 represents the pressure corresponding to 85% of the maximum allowable operating pressure of the system at the critical heat flux density, and Y3 represents the heat flux density corresponding to the two-phase cooling medium 9 at 85% of the maximum allowable operating pressure of the system; X4 represents the pressure corresponding to 75% of the maximum allowable operating pressure of the system at the critical heat flux density, and Y4 represents the heat flux density corresponding to the two-phase cooling medium 9 at 75% of the maximum allowable operating pressure of the system.

[0050] Before the pressure in the top space inside the sealed enclosure 1 reaches the maximum allowable operating pressure of the heat dissipation system, the heat flux density of the two-phase cooling medium 9 gradually increases with the increase of pressure in the top space inside the sealed enclosure 1. After the pressure in the top space inside the sealed enclosure 1 reaches the maximum allowable operating pressure of the heat dissipation system, the heat flux density of the two-phase cooling medium 9 decreases sharply with the increase of pressure in the top space inside the sealed enclosure 1. The greater the heat flux density of the two-phase cooling medium 9, the better the cooling effect of the two-phase cooling medium 9 on the electronic components 8.

[0051] When the pressure of the top space in the sealed box 1 exceeds the first preset threshold, the prior art increases the pumping amount of the pumping device 4, but the present application does not, but continues to reduce the pumping amount of the pumping device 4 when the pressure of the top space in the sealed box 1 exceeds the first preset threshold and is less than the second preset pressure threshold, so that the pressure of the top space in the sealed box 1 continues to increase, thereby increasing the heat flux density (i.e. the heat dissipation limit) of the two-phase cooling medium 9, achieving heat dissipation, reducing the energy consumption of the pumping device 4, saving electricity, solving the problem of short-time load increase of the electronic components 8 and increased heat generation. When the short-time load of the electronic components 8 ends, the heat generation of the electronic components 8 decreases, the boiling and vaporization of the two-phase cooling medium 9 weakens, and the pressure in the sealed box 1 decreases, and the pressure will fall back to the normal pressure interval.

[0052] In order to enhance the accuracy of the pressure of the top space in the sealed box 1 obtained by the control device 3, the control device 3 is also used to determine the average value of the pressure transmitted by the pressure sensor 2 within a preset time period as the pressure of the top space in the sealed box 1. Wherein, the length of the preset time period can be set by itself, for example, the preset time period can be 5 seconds, 8 seconds, 10 seconds, 15 seconds, etc.

[0053] The length of the preset time period is positively correlated with the volume of the top space in the sealed box 1. When the volume of the top space in the sealed box 1 is large, the preset time period can be set to 15 seconds or 10 seconds; when the volume of the top space in the sealed box 1 is small, the preset time period can be set to 5 seconds.

[0054] The electronic component 8 heat dissipation system in the application measures the pressure inside the sealed box 1 through the pressure sensor 2, adjusts the heat dissipation of the electronic component 8 through the pressure, and the pressure value can more accurately reflect the working condition of the heat dissipation system, thereby improving the accuracy of the control information obtained by the control device 3. In the application, only one pressure sensor 2 needs to be provided, which can reduce the cost of the heat dissipation system, reduce the control input circuit, reduce the complexity of the heat dissipation system, simplify the control strategy, and avoid the influence of local hot spots on the control strategy. In addition, in the application, when the pressure in the sealed box 1 is greater than the first preset pressure threshold and less than the second preset pressure threshold, the pumping amount of the cooling liquid 7 is still reduced, the heat flow density of the two-phase cooling medium 9 is increased, thereby enhancing the heat dissipation effect, and the heat dissipation capacity of the two-phase cooling medium 9 per unit volume under the short-term high-load working condition of the electronic component 8 is improved, thereby avoiding the problem of increased power consumption caused by increasing the pumping amount of the cooling liquid 7, reducing the operating cost, and improving the PUE value of the system to a certain extent. In addition, since the pressure in the top space of the sealed box 1 in the application exceeds the first preset threshold and is less than the second preset pressure threshold, the pressure in the top space of the sealed box 1 is continuously increased, so the application has a certain design redundancy under the premise of ensuring the heat dissipation effect of the system. The PUE (Power Usage Effectiveness, power usage effectiveness) is the ratio of all energy consumed by the data center to the energy consumed by the IT load, and the closer the PUE value is to 1, the better the energy efficiency.

[0055] On the basis of the above-mentioned embodiments, in an embodiment of the application, the electronic component 8 heat dissipation system further comprises:

[0056] The condensing pipeline 5 is provided with a port outside the sealed box 1, and the pumping device 4 is connected to the part of the condensing pipeline 5 located outside the sealed box 1.

[0057] The condensing pipeline 5 is filled with cooling liquid 7 for cooling the steam after the two-phase cooling medium 9 is boiled. In order to reduce the operating cost of the electronic component 8 heat dissipation system, the cooling liquid 7 filled in the condensing pipeline 5 can be water or ethylene glycol and other easily obtained and low-cost media.

[0058] The part of the condensing pipeline 5 located in the sealed box 1 is in the space reserved at the top of the sealed box 1. Optionally, as a kind of implementable way, the part of the condensing pipeline 5 located in the sealed box 1 is distributed in a straight line, and the setting mode is simple. However, the application is not limited thereto, and as another implementable way, the part of the condensing pipeline 5 located in the sealed box 1 is distributed in a curved shape.

[0059] When the part of the condensing pipeline 5 inside the sealed box 1 is in a curved distribution, the length of the part of the condensing pipeline 5 inside the sealed box 1 is relatively long, and thus the volume of the cooling liquid 7 inside the sealed box 1 is relatively large, and the cooling effect on the steam after the two-phase cooling medium 9 is boiled by heat absorption is better.

[0060] Further, when the part of the condensing pipeline 5 inside the sealed box 1 is in a curved distribution, the distribution shape of the condensing pipeline 5 is not limited in the present application. For example, the part of the condensing pipeline 5 inside the sealed box 1 is in a spiral distribution, or the part of the condensing pipeline 5 inside the sealed box 1 is in an S-shaped distribution, and the like.

[0061] On the basis of any of the above embodiments, in an embodiment of the present application, the electronic component 8 heat dissipation system further comprises:

[0062] An external cooling device 6 connected with the two ports of the condensing pipeline 5, for reducing the temperature of the cooling liquid 7 circulating into the condensing pipeline 5.

[0063] After the cooling liquid 7 in the condensing pipeline 7 flows out of the sealed box 1 after cooling the steam after the two-phase cooling medium 9 is boiled by heat absorption, the temperature of the cooling liquid 7 flowing out of the sealed box 1 is increased. The external cooling device 6 can cool the cooling liquid 7 flowing out of the sealed box 1, and the cooled cooling liquid 7 can flow into the sealed box 1 again to cool the steam after the two-phase cooling medium 9 is boiled by heat absorption, so that the cooling liquid 7 can be recycled, the amount of the cooling liquid 7 is reduced, and the operation cost of the electronic component 8 heat dissipation system is reduced.

[0064] The external cooling device 6 is not limited in the present application. For example, the external cooling device 6 can be a sink or a box containing cold water. When the cooling liquid 7 in the condensing pipeline 5 flows out of the sealed box 1, it enters the external cooling device 6, and the cold water in the external cooling device 6 exchanges heat with the cooling liquid 7 in the condensing pipeline 5, to complete the cooling of the cooling liquid 7 in the condensing pipeline 5.

[0065] On the basis of any of the above embodiments, in an embodiment of the present application, the electronic component 8 heat dissipation system further comprises:

[0066] The two-phase cooling medium 9 filled in the sealed box 1 for immersing the electronic component 8.

[0067] The two-phase cooling medium 9 completely immerses the electronic components 8, but does not fill the sealed box 1, and a certain space is still left in the sealed box 1. The electronic components 8 conduct heat to the two-phase cooling medium 9 in direct contact with the electronic components 8, and the two-phase cooling medium 9 is vaporized by absorbing heat to generate steam, which fills the space above the liquid level of the two-phase cooling medium 9, so that the pressure in the sealed box 1 increases.

[0068] The two-phase cooling medium 9 filled in the sealed box 1 can be an electronic fluorinated liquid with a low boiling point, and the specific type of the electronic fluorinated liquid is not limited in the present application and can be selected by the user. For example, the electronic fluorinated liquid includes but is not limited to the following liquids: FC-72, Novec 7100, Novec 649, etc. of 3M Company. TM 7100, Novec TM 649, etc. Each two-phase cooling medium 9 has its own curve of the relationship between the heat flux density and the pressure in the sealed box 1.

[0069] In one embodiment of the present application based on any of the above embodiments, the control device 3 is further configured to send a pump-down instruction to the pumping device 4 when the pressure is less than a third preset pressure threshold; wherein the third preset pressure threshold is a lower limit of the pressure in the sealed box 1 when the electronic components 8 are normally working.

[0070] Since the working of the electronic components 8 is a dynamic process, the pressure in the sealed box 1 when the electronic components 8 are normally working can be stabilized in a pressure interval composed of a first preset pressure threshold and a third preset pressure threshold. The first preset pressure threshold is an upper limit of the pressure in the sealed box 1 when the electronic components 8 are normally working, and the third preset pressure threshold is a lower limit of the pressure in the sealed box 1 when the electronic components 8 are normally working. The control device 3 controls the pumping amount of the pumping device 4 to the cooling liquid 7, so that the pressure in the sealed box 1 is stabilized in the pressure interval composed of the first preset pressure threshold and the third preset pressure threshold.

[0071] The third preset pressure threshold is not limited in the present application and can be set by the user. Optionally, the third preset pressure threshold can be set to 75% of the maximum working pressure allowed by the heat dissipation system, or the third preset pressure threshold can be set to 70% of the maximum working pressure allowed by the heat dissipation system, etc.

[0072] When the short-time load of the electronic components 8 decreases, the heat generated by the electronic components 8 decreases, and the vaporization of the two-phase cooling medium 9 weakens, so that the pressure in the sealed box 1 is lower than the third preset pressure threshold. At this time, the control device 3 reduces the flow of the cooling liquid 7 pumped into the condenser pipe by the pumping device 4 to increase the pressure in the sealed box 1, and stabilizes the pressure in the sealed box 1 between the first preset pressure threshold and the third preset pressure threshold.

[0073] In the above embodiment, when the short-time load of the electronic component 8 increases, the heat generated by the electronic component 8 increases, and the boiling vaporization of the two-phase cooling medium 9 is enhanced, resulting in that the pressure in the sealed box 1 is higher than the first preset pressure threshold. At this time, the control device 3 reduces the flow of the cooling liquid 7 pumped into the condenser pipe by the pumping device 4, increases the pressure in the sealed box 1, and further increases the heat flux density of the two-phase cooling medium 9, so as to stabilize the pressure in the sealed box 1 between the first preset pressure threshold and the third preset pressure threshold. Further, when the flow of the cooling liquid 7 pumped into the condenser pipe by the pumping device 4 is reduced, the pressure in the sealed box 1 gradually increases and is greater than the second preset pressure threshold, and the control device 3 is further configured to send an increase in the pumping amount instruction to the pumping device 4 when the pressure is greater than or equal to the second preset pressure threshold.

[0074] When the flow of the cooling liquid 7 pumped into the condenser pipe by the pumping device 4 is reduced to increase the pressure in the sealed box 1 to be greater than or equal to the second preset pressure threshold, it indicates that the cooling of the electronic component 8 by the two-phase cooling medium 9 is not enough. At this time, the control device 3 increases the flow of the cooling liquid 7 pumped into the condenser pipe by the pumping device 4, strengthens the condensation of the two-phase cooling medium 9 vapor above the sealed box 1, reduces the pressure in the sealed box 1, and stabilizes the pressure in the sealed box 1 between the first preset pressure threshold and the third preset pressure threshold, so as to avoid the temperature of the electronic component being too high to cause damage to the device.

[0075] The electronic component 8 cooling system provided in the present application is described below.

[0076] The electronic component 8 cooling system includes a sealed box 1, a pressure sensor 2, a control device 3, a pumping device 4, a condenser pipe 5, an external cooling device 6, a two-phase cooling medium 9, and a cooling liquid 7 filled in the condenser pipe 5. The pressure sensor 2 is connected to the control device 3, and the pumping device 4 is connected to the control device 3.

[0077] The electronic component 8 and the two-phase cooling medium 9 are located in the sealed box 1, the two-phase cooling medium 9 completely immerses the electronic component 8, and a certain space is reserved at the top of the sealed box 1, that is, the liquid surface of the two-phase cooling medium 9 is a certain distance from the inner side surface of the top of the sealed box 1; the pressure sensor 2 is arranged on the top inner surface, wherein the critical heat flux density (maximum critical heat flux density) of the two-phase cooling medium 9 corresponds to the highest working pressure allowed by the system.

[0078] In the heat dissipation process, the pressure sensor 2 measures the pressure in the sealed box 1; the pressure sensor 2 transmits the pressure signal to the control device 3, and the control device 3 calculates the average pressure value in the sealed box 1 within 5-15 seconds; in normal operation, the flow of the cooling liquid 7 pumped into the condenser pipeline 5 above the sealed box 1 by the pumping device 4 is adjusted by the control device 3 to stabilize the pressure in the sealed box 1 at 75%-85% of the maximum allowable working pressure; after the pressure sensor 2 transmits the pressure signal to the control device 3, when the average pressure in the sealed box 1 is lower than 75% of the maximum allowable working pressure, the control device 3 controls the pumping device 4 to reduce the flow of the cooling liquid 7 pumped into the condenser pipeline 5; after the pressure sensor 2 transmits the pressure signal to the control device 3, when the average pressure in the sealed box 1 exceeds 85% of the maximum allowable working pressure, the control device 3 controls the pumping device 4 to reduce the flow of the cooling liquid 7 pumped into the condenser pipeline 5; after the pressure sensor 2 transmits the pressure signal to the control device 3, when the average pressure in the sealed box 1 exceeds 95% of the maximum allowable working pressure, the control device 3 controls the pumping device 4 to increase the flow of the cooling liquid 7 pumped into the condenser pipeline 5.

[0079] When the sealed box pressure slightly rises and falls, the cooling liquid flow is reduced to regulate the heat flux density of the two-phase cooling medium, and the dynamic balance of the sealed box pressure is realized. The problem of system redundancy design and power consumption increase caused by increasing the flow of cooling liquid in the condenser pipeline is avoided, and on the basis of making the heat dissipation system have higher anti-disturbance ability, the PUE value of the whole heat dissipation system is improved.

[0080] The application also provides an electronic component heat dissipation method, please refer to Figure 3 , the method comprises:

[0081] Step S101: receiving the pressure in the sealed box for placing electronic components and two-phase cooling medium.

[0082] Step S102: determining whether the pressure is greater than a first preset pressure threshold and less than a second preset pressure threshold.

[0083] The first preset pressure threshold is the upper limit of the pressure in the sealed box when the electronic component is working normally.

[0084] The first preset pressure threshold is less than the second preset pressure threshold. The first preset pressure threshold and the second preset pressure threshold are not limited in size in the application, and can be set by the user. The electronic component heat dissipation system has a maximum allowable working pressure. Optionally, the first preset pressure threshold can be set to 85% of the maximum allowable working pressure of the heat dissipation system, and the second preset pressure threshold can be set to 95% of the maximum allowable working pressure of the heat dissipation system; or the first preset pressure threshold can be set to 80% of the maximum allowable working pressure of the heat dissipation system, and the second preset pressure threshold can be set to 90% of the maximum allowable working pressure of the heat dissipation system, etc.

[0085] Step S103: When the pressure is greater than the first preset pressure threshold and less than the second preset pressure threshold, a reduced pumping amount instruction is sent to the pumping device, so that the pumping device reduces the pumping amount of the cooling liquid.

[0086] When the pressure in the sealed box does not satisfy the condition of being greater than the first preset pressure threshold and less than the second preset pressure threshold, two cases are divided, which are introduced as follows.

[0087] Step S104: When the pressure is greater than or equal to the second preset pressure threshold, an increased pumping amount instruction is sent to the pumping device, so that the pumping device increases the pumping amount of the cooling liquid.

[0088] Step S105: When the pressure is less than the first preset pressure threshold and less than the third preset pressure threshold, a reduced pumping amount instruction is sent to the pumping device, so that the pumping device reduces the pumping amount of the cooling liquid.

[0089] The third preset pressure threshold is the lower limit of the pressure in the sealed box when the electronic component is normally working.

[0090] Since the working of the electronic component is a dynamic process, the pressure in the sealed box when the electronic component is normally working can be stabilized in a pressure interval, which is composed of the first preset pressure threshold and the third preset pressure threshold.

[0091] The electronic component heat dissipation method in the application measures the pressure inside the sealed box through the pressure sensor, adjusts the heat dissipation of the electronic component through the pressure, and the pressure value can more accurately reflect the working condition of the heat dissipation system, thereby improving the accuracy of the control information obtained by the control device. In the application, only one pressure sensor needs to be provided, which can reduce the cost of the heat dissipation system, reduce the control input circuit, reduce the complexity of the heat dissipation system, simplify the control strategy, and avoid the influence of local hot spots on the control strategy. Moreover, in the application, when the pressure in the sealed box is greater than the first preset pressure threshold and less than the second preset pressure threshold, the pumping amount of the cooling liquid is still reduced, the heat flux density of the two-phase cooling medium is increased, thereby enhancing the heat dissipation effect, and the heat dissipation capacity of the two-phase cooling medium per unit volume can be improved under the short-term high-load working condition of the electronic component, thereby avoiding the problem of increased power consumption caused by increasing the pumping amount of the cooling liquid, reducing the operating cost, and improving the PUE value of the system to a certain extent. In addition, since the pressure in the top space of the sealed box in the application continues to increase when the pressure in the top space of the sealed box exceeds the first preset threshold and is less than the second preset pressure threshold, the application has a certain design redundancy under the premise of ensuring the heat dissipation effect of the system.

[0092] The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0093] The electronic component heat dissipation system and method provided by the application are described in detail above. Specific examples are applied in this paper to explain the principles and implementation methods of the application. The above description of the embodiments is only used to help understand the method and its core idea. It should be pointed out that for ordinary skilled persons in the technical field, some improvements and modifications can be made without departing from the principles of the application, and these improvements and modifications also fall within the protection scope of the claims of the application.

Claims

1. An electronic component heat dissipation system, characterized by, The application relates to a sealed box, a pressure sensor, a control device and a pumping device. The sealed box is used for placing electronic components and two-phase cooling medium, the pressure sensor is arranged on the inner side of the top of the sealed box, and the control device is connected with the pressure sensor and the pumping device respectively. The pressure sensor is used for measuring the pressure in the sealed box and sending the pressure to the control device. The control device is used for receiving the pressure and sending a pumping amount reducing instruction to the pumping device when the pressure is greater than a first preset pressure threshold value and smaller than a second preset pressure threshold value, and the pumping device is used for receiving the pumping amount reducing instruction and reducing the pumping amount of the cooling liquid, wherein the first preset pressure threshold value is the upper limit value of the pressure in the sealed box when the electronic components are normally working, and the cooling liquid is used for cooling the steam after the two-phase cooling medium is heat-absorbed and boiled. The application further relates to a condensing pipeline, the ports of the condensing pipeline are arranged outside the sealed box, and the pumping device is connected with the part of the condensing pipeline outside the sealed box.

2. The electronic component heat dissipation system of claim 1, wherein, The part of the condensing pipeline inside the sealed box is arranged in a curved shape. The part of the condensing pipeline inside the sealed box is arranged in a straight line.

3. The electronic component heat dissipation system of claim 2, wherein, The part of the condensing pipeline inside the sealed box is arranged in a spiral shape.

4. The electronic component heat dissipation system of claim 2, wherein, The application further relates to an external cooling device connected with the two ports of the condensing pipeline and used for reducing the temperature of the cooling liquid circulating into the condensing pipeline.

5. The electronic component heat dissipation system of claim 3, wherein the heat dissipation system is configured to be mounted on a printed circuit board. The application further relates to the two-phase cooling medium filled in the sealed box and used for immersing the electronic components.

6. The electronic component heat dissipation system of claim 2, wherein, The control device is further used for sending a pumping amount reducing instruction to the pumping device when the pressure is smaller than a third preset pressure threshold value, wherein the third preset pressure threshold value is the lower limit value of the pressure in the sealed box when the electronic components are normally working. The control device is further used for sending a pumping amount increasing instruction to the pumping device when the pressure is greater than or equal to the second preset pressure threshold value.

7. The electronic component heat dissipation system of claim 1, wherein, The application relates to receiving the pressure in the sealed box used for placing electronic components and two-phase cooling medium. The application relates to judging whether the pressure is greater than a first preset pressure threshold value and smaller than a second preset pressure threshold value, wherein the first preset pressure threshold value is the upper limit value of the pressure in the sealed box when the electronic components are normally working.

8. The electronic component heat dissipation system of claim 1, wherein, The application relates to sending a pumping amount reducing instruction to the pumping device when the pressure is greater than the first preset pressure threshold value and smaller than the second preset pressure threshold value, so that the pumping device reduces the pumping amount of the cooling liquid, wherein the cooling liquid is used for cooling the steam after the two-phase cooling medium is heat-absorbed and boiled.

9. The electronic component heat dissipation system of any one of claims 1 to 8, wherein, ​ 10. An electronic component heat dissipation method characterized by comprising: ​ ​ ​ ​

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