Wafer polishing transfer method, system, and storage medium

Abstract

The application provides a wafer polishing and conveying method, a system and a storage medium, wherein a wafer conveying mechanism is used to convey each wafer to be processed once and to the upper and lower head positions of a conveying unit; the conveying unit receives the wafer to be processed conveyed by the wafer conveying mechanism and conveys a polishing head in a polishing device to a taking position; and the polishing device is used to receive the wafer to be processed taken by the polishing head and polish the wafer to be processed. The wafer polishing and conveying process of the embodiment of the present application ensures that there is only one wafer in the upper and lower head positions, so that the robot only takes and puts down the wafer once, and the wafer can be directly transferred from one polishing device to another polishing device when the wafer polishing heads are handed over, thereby reducing the number of times of wafer reciprocating placement or storage and saving time, such as more than 20 seconds of time saved when each wafer polishing head is handed over, so that the polishing efficiency is greatly improved and the wafer polishing capacity is improved.

Description

Technical Field

[0001] This application relates to the field of wafer manufacturing technology, specifically to a wafer grinding and transfer method, system, and storage medium. Background Technology

[0002] The wafer manufacturing process results in uneven surfaces on both the front and back sides of the wafer. The placement of integrated circuit layouts on the front side creates significant height differences, while the thick protective film on the back side contributes to unevenness. Therefore, chemical mechanical polishing (CMP) is used to press the wafer onto a polishing pad and rotate it, thus smoothing both the front and back sides.

[0003] In the prior art, a double-sided grinding device is used to grind multiple loaded wafers independently. However, the grinding system of the prior art will cause a long time to be spent on the transfer of wafers between the grinding heads each time, resulting in low grinding efficiency and failing to meet the wafer grinding requirements.

[0004] Therefore, a new wafer grinding transfer solution is needed. Summary of the Invention

[0005] In view of this, embodiments of this specification provide a wafer grinding and conveying method, system, and storage medium, which are applied to the wafer grinding and conveying process.

[0006] The embodiments in this specification provide the following technical solutions:

[0007] This specification provides a wafer grinding and conveying system, which includes:

[0008] Wafer transport mechanism, grinding equipment and transport unit;

[0009] The wafer transfer mechanism is used to transfer each wafer to be processed once and to the upper and lower head positions of the transfer unit.

[0010] The transmission unit receives the wafer to be processed from the wafer transfer mechanism and is also used to transfer the grinding head in the grinding equipment to the pick-up position.

[0011] The grinding equipment is used to receive the wafer to be processed picked up by the grinding head and grind the front or back of the wafer to be processed; wherein, each wafer to be processed corresponds to one grinding head throughout the grinding process; each wafer to be processed is picked up from the first position to the second position by the grinding head at the picking position when the grinding equipment is alternately grinding; different wafers to be processed are alternately ground on each grinding equipment using the same grinding head.

[0012] The transmission unit receives at least two wafers to be processed. The wafers to be processed are picked up by the grinding head through the transmission unit according to the control unit's operating program and are ground on the grinding equipment.

[0013] This specification also provides a wafer grinding and conveying method, employing a wafer grinding and conveying system as described in any of the technical solutions in the embodiments of this specification. The wafer grinding and conveying method includes:

[0014] The first wafer is determined from the positions of the first upper and lower heads based on the relative distance between the first grinding head and each wafer;

[0015] The first grinding head moves to the first picking position to pick up the first wafer from the first upper and lower head positions, and grinds the first wafer on the front and / or back sides on the first grinding device corresponding to the first grinding head;

[0016] After the front and / or back sides of the first wafer are ground on the first grinding equipment, the first grinding head grinds the first wafer on the back and / or front sides on the second grinding equipment.

[0017] After the back side and / or front side of the first wafer are ground on the second grinding equipment, the first grinding head returns to the first upper and lower head position.

[0018] This specification also provides a wafer grinding and transfer control unit, including a memory, a processor, and a computer program. The computer program is stored in the memory, and the processor runs the computer program to execute the wafer grinding and transfer method in any of the technical solutions of this specification's embodiments.

[0019] This specification also provides a readable storage medium storing a computer program, which, when executed by a processor, is used to implement the wafer grinding and transfer method in any of the technical solutions of this specification's embodiments.

[0020] Compared with the prior art, the beneficial effects that can be achieved by the above-mentioned at least one technical solution adopted in the embodiments of this specification include at least the following: by picking up and putting down the wafer in one go, the grinding head can directly pick up the wafer from one grinding device to another grinding device, and reduce the number of times the wafer is put back and forth or placed when it is being ground between grinding devices, thereby saving time, improving the time and energy consumption of the entire wafer grinding process, and improving the efficiency and production capacity of wafer grinding. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a top view of a wafer grinding and conveying system according to this application;

[0023] Figure 2 This is a schematic diagram of the movement of the wafer base on the transmission unit in this application;

[0024] Figure 3 This is a front view of a wafer grinding and conveying system according to this application;

[0025] Figure 4 This is a schematic diagram illustrating the determination of travel distance and rotation angle in this application;

[0026] Figure 5 This is a schematic diagram of a wafer grinding and transfer method according to this application. Figure 1 ;

[0027] Figure 6 This is a schematic diagram of a wafer grinding and transfer method according to this application. Figure 2 ;

[0028] Figure 7 This is a schematic diagram of a wafer grinding and transfer method according to this application. Figure 3 ;

[0029] Figure 8 This is a schematic diagram of another wafer grinding and conveying system in this application;

[0030] Figure 9 This is a flowchart of a wafer grinding and transfer method according to this application;

[0031] Figure 10 This is a schematic diagram of an existing bilateral grinding conveyor system. Figure 1 ;

[0032] Figure 11 This is a schematic diagram of an existing bilateral grinding conveyor system. Figure 2 ;

[0033] Figure 12 This is a schematic diagram of an existing bilateral grinding conveyor system. Figure 3 . Detailed Implementation

[0034] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0035] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0036] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0037] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0038] Additionally, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that practice can be carried out without these specific details.

[0039] like Figures 10-12 The existing dual-sided independent grinding machines in the examples have long processing times for each wafer grinding head handover process, resulting in long grinding times for both the front and back sides of each wafer, thus failing to improve the production efficiency of each grinding machine. Specifically, as follows... Figure 10 The wafer's working positions are 3->4->3->2->5->6, with a total time of 35 seconds. For example... Figure 11 The wafer's working positions are 2->3->4->5->6, with a total time of 35 seconds. For example... Figure 12The wafer working position is 2->3->2->4->5->4, with a total time of 35 seconds. The numerous repetitions and pauses during wafer grinding head handover between different devices result in a lengthy handover process, which cannot meet production requirements.

[0040] The study on the time consumption of the entire wafer grinding process revealed that the specific grinding time for each wafer is almost the same, except for the longer time spent during each wafer grinding head handover process. This results in a long overall wafer grinding time, and even high energy consumption and low grinding efficiency for each grinding machine, failing to unleash the true grinding efficiency of each machine. This leads to problems such as high time and energy consumption and low efficiency in the entire wafer grinding process.

[0041] Based on this, the embodiments of this specification propose a wafer grinding and transfer scheme: such as Figure 1 As shown, the wafer transfer mechanism 10 transfers each wafer to be processed once to the upper and lower head positions (such as 2 and 3) of the transfer unit 40. The transfer unit receives the wafers to be processed transferred by the wafer transfer mechanism 10 and can also transfer the grinding head from the grinding equipment 50 to the pick-up position. The grinding equipment is used to receive the wafers to be processed picked up by the grinding head and grind the front and / or back sides of the wafers to be processed. Each wafer to be processed is picked up from the first position to the second position by the grinding head at the pick-up position during alternating grinding in the grinding equipment. Different wafers to be processed are alternately ground on each grinding equipment using the same grinding head. The transfer unit receives at least two wafers to be processed. The wafers to be processed are picked up by the grinding head through the transfer unit according to the control unit's operating program and the grinding is completed on the grinding equipment. By saving the time spent transferring wafers between grinding heads, the time and energy consumption of the entire wafer grinding process are reduced, thereby improving the efficiency and throughput of wafer grinding.

[0042] In some embodiments, the wafer pedestal on the transmission unit 40 can move between two upper and lower positions, such as Figure 2 As shown, the wafer substrate on the transmission unit 40 can move between the first upper and lower head positions 2 and the second upper and lower head positions 3. (Reference) Figure 1 After the robotic arm of the wafer transfer mechanism takes the wafer from the wafer transfer mechanism 10, it places it in the first upper and lower head position 2. The wafer base in the first upper and lower head position can move to the second upper and lower head position 3.

[0043] The technical solutions provided by the various embodiments of this application are described below with reference to the accompanying drawings.

[0044] like Figure 1As shown in the embodiments of this specification, a wafer grinding and conveying system is provided, which may include a wafer conveying mechanism 10, a grinding device 50, and a transmission unit 40. The wafer conveying mechanism is used to convey each wafer to be processed once to the upper and lower head positions (such as 2 and 3) of the transmission unit 40. The transmission unit receives the wafer to be processed conveyed by the wafer conveying mechanism and is also used to convey the grinding head in the grinding device to a pick-up position. This pick-up position facilitates the grinding head to move to this position and rotate a preset angle to pick up the wafer to be processed from the upper and lower head positions or the current wafer position of the grinding device. The grinding device is used to receive the wafer to be processed picked up by the grinding head and grind the front and / or back sides of the wafer to be processed. Each wafer to be processed is picked up from the pick-up position to the second position by the grinding head at a first position during alternating grinding by the grinding devices; different wafers to be processed are alternately ground on different grinding devices in sequence. Each grinding device can grind at least one side of the wafer, either the front or the back side.

[0045] During the grinding process, the transmission unit receives at least two wafers to be processed. The wafers to be processed are picked up by the grinding head through the transmission unit according to the control unit's operating program and are ground on the grinding equipment.

[0046] The pick-up position includes multiple different pick-up positions, such as a first preset pick-up position, a second preset pick-up position, etc. In some embodiments, the pick-up positions corresponding to the same wafer to be processed being alternately polished on the polishing equipment can be the same or different; the preset pick-up positions corresponding to different wafers to be processed being alternately polished on different polishing equipment can be the same or different, depending on the distance between the polishing head and the upper and lower heads or the current position of the wafer on the polishing equipment. In some embodiments, the pick-up position is obtained by an algorithm, that is, the wafer to be processed is picked up after the polishing head is positioned at the center point of the pick-up position.

[0047] The position and rotation angle of the grinding head when picking up the wafer are determined on the transmission unit to reduce the number of times the wafer is placed or rested, thereby saving the time spent on wafer transfer between grinding heads, improving the time and energy consumption of the entire wafer grinding process, and increasing the efficiency and production capacity of wafer grinding.

[0048] In some embodiments, the grinding apparatus includes a first grinding apparatus and a second grinding apparatus, the first grinding apparatus and the second grinding apparatus being arranged opposite to each other, and a transmission unit being arranged between the first grinding apparatus and the second grinding apparatus.

[0049] refer to Figure 1 The wafer grinding and conveying system includes two grinding devices, such as a first grinding device and a second grinding device, which are arranged opposite to each other. The transmission unit 40 is arranged between the two grinding devices, such as the first grinding device and the second grinding device, which can be arranged opposite to each other on the left and right or front and back sides of the transmission unit 40.

[0050] In some embodiments, the two grinding devices can operate simultaneously, or a single grinding device can operate. Some embodiments, for example... Figure 8 The linear grinding head's movement area allows for pre-setting the wafer's position on the grinding pad according to the different working areas of the grinding head. This ensures optimal setting of process conditions such as the grinding slurry, guaranteeing that each wafer is positioned identically when it meets the grinding pad. This reduces the time spent on wafer handover during grinding head contact, thereby improving grinding efficiency. The specific operation process is as follows: Figure 3 and Figure 4 The implementation process and principle described below are consistent. During the alternating grinding of each wafer on the grinding pads, the same grinding head directly picks up the wafer from one position on one grinding pad and transfers it to the corresponding position on another grinding pad. In other embodiments, the grinding equipment can be expanded, such as by adding a third or fourth grinding device. The process of alternating grinding of wafers on two grinding pads is the same as the implementation process of two grinding devices, and will not be repeated here.

[0051] In some embodiments, the transmission unit includes, but is not limited to, a pulley guide rail, a magnetic levitation guide rail, or a high-pressure cylinder. A driving mechanism moves and rotates the grinding head along the transmission unit. The transmission unit can be equidistantly positioned between two grinding devices. The transmission unit may be equipped with an annular slide rail, etc.

[0052] In some embodiments, the wafer polishing conveying system further includes a drive mechanism and a lead screw structure. The polishing head is driven to move and rotate via the drive mechanism, and the lead screw structure is used to determine the conveying distance of the polishing head so that the polishing head moves to the pick-up position.

[0053] In some embodiments, the drive mechanism is connected to two guide rails, with the first and second guide rails respectively positioned at the upper and lower ends of the drive mechanism. The second guide rail is movable left-right / back-forward relative to the grinding equipment. The drive mechanism can swing the first guide rail to the wafer position so that the grinding head on the first guide rail can pick up the wafer. The grinding head is positioned at the end of the first guide rail away from the drive mechanism. The wafer position includes an upper / lower head position, a first position, and a second position. See also... Figure 3 For each wafer grinding and transfer process, the wafer transfer mechanism transfers the wafer to be processed once to the upper and lower head positions of the transfer unit, as shown in steps 1-3 of the figure. That is, the wafer transfer mechanism picks up / places the wafer to be processed to the upper and lower head positions only once. Then, step 1 is implemented: the transfer unit transfers the left grinding head to the first pick-up position, so that the left grinding head picks up the wafer to be processed from the upper and lower head positions and places it onto the left grinding disk, where grinding is performed. Figure 3 Step 1 is the process. Step 2: After the wafer to be processed is finished grinding on the grinding equipment on the left, as shown... Figure 3The process in step 2. Step 3: The transfer unit transfers the left grinding head to the second pick-up position, so that the left grinding head picks up the wafer to be processed from the wafer position on the left grinding disk and transfers it to the right grinding disk, where it performs grinding. Figure 3 The process in step 3. Therefore, in the wafer grinding conveyor system of this embodiment, the grinding working position of each wafer to be processed changes as follows: one upper and lower head position -> one grinding device position -> another grinding device position -> the initial upper and lower head position. That is, the position of each wafer to be processed when the grinding devices alternate is one grinding device position -> another grinding device position. This process is performed by the same grinding head. In this embodiment, the wafer only undergoes one pick-up or put-down, and the total time is less than 15 seconds, thereby significantly reducing the number of times the wafer is placed or placed. Compared with the prior art, it saves more than 20 seconds of time, thereby reducing the time consumption and improving the efficiency of wafer grinding.

[0054] The pick-up positions of the left and right grinding devices can be the same or different, such as the first pick-up position and the second pick-up position, respectively. The above process specifically describes how each wafer to be processed is picked up from its current position on one grinding device and transferred to another by the grinding head during alternating grinding by the grinding pads. The grinding head is the same grinding head and is in the pick-up position. The grinding device includes the grinding head (see...). Figure 1 60), grinding disc (see...) Figure 1 (70) and wafer fixtures (see Figure 1 (e.g., 80)

[0055] In some embodiments, each wafer to be processed can be ground starting from one side of the grinding equipment according to the process procedure, and then ground using the other side of the grinding equipment. For example, the grinding is first performed on the right side of the grinding equipment and then on the left side of the grinding equipment. For example, the right side of the grinding equipment performs rough grinding on the wafer, and the left side of the grinding equipment performs fine grinding on the wafer. However, the actual grinding process is not limited to this grinding process sequence.

[0056] Adopting such Figure 1 The wafer grinding and conveying system shown describes the grinding and conveying process of two wafers to be processed as follows: The wafer conveying mechanism conveys the wafers to be processed once, and the robotic arm conveys them from the wafer conveying mechanism 10 to the first upper and lower head positions 2 of the conveying unit 40. In some embodiments, the wafer pedestal moves along the conveying unit 40 to transport the wafers to be processed to the second upper and lower head positions 3. The system control unit can calculate the distance between the idle grinding head and the first and second upper and lower head positions; in some embodiments, the grinding head determines the wafer to be processed based on proximity.

[0057] For the grinding process, please refer to Figures 5-7 ,like Figure 5As shown, the first wafer to be processed is placed at the second upper / lower head position 3 of the transmission unit, and the second wafer to be processed is placed at the first upper / lower head position 2. When the grinding head is unloaded, the two grinding heads are respectively positioned at the first upper / lower head positions 2 and 3 at both ends of the transmission unit, so that the grinding heads can quickly pick up the placed wafers at the corresponding upper / lower head positions. That is, when the grinding head is unloaded, each upper / lower head position has one grinding head placed close to it. During the grinding and conveying process, the system calculates that the right grinding head is closest to the wafer to be processed at the second upper / lower head position 3, then the transmission unit conveys the right grinding head to the fixed center point (see [reference]). Figure 4 This corresponds to a specific pick-up position, where the right-side grinding head rotates by a preset angle (see [reference]). Figure 4 Take the first wafer to be processed from the second top and bottom positions, and perform front and / or back grinding on the first wafer to be processed using the grinding disk on the right side, such as... Figure 5 A, Figure 5 B. At this point, the second wafer to be processed is placed on the first upper and lower head positions 2. For example... Figure 6 A, Figure 6 As shown in Figure B, after the first wafer on the right-side grinding device has finished grinding its front and / or back sides, the right-side grinding head picks up the first wafer and transfers it to the left-side grinding device for back and / or front grinding. The left-side grinding head then moves the second wafer to the right-side grinding device to begin grinding, allowing the left-side grinding head to grind the front and / or back sides of the second wafer on the right-side grinding device. After the right-side grinding head finishes grinding the first wafer on the left-side grinding pad, it moves the first wafer to the second upper / lower head position 3, so that the first wafer is sent to downstream equipment, such as a cleaning unit. After the second wafer corresponding to the left-side grinding head has finished grinding on the right-side grinding pad, it is carried by the left-side grinding head to the left-side grinding pad. At this time, a new third wafer is delivered to the second upper / lower head position 3, and the right-side grinding head handles the entire grinding process of this third wafer. For example, it may first be picked up and ground on the right-side grinding pad, and then the grinding process is repeated. This will not be elaborated further here.

[0058] Specifically, such as Figure 7 Example A: During the grinding process of the second wafer to be processed by the left grinding head on the left grinding disk, the right grinding disk reloads a wafer to be processed via the right grinding head to start the grinding process. The specific process is the same as the overall grinding process of the first wafer to be processed, and will not be repeated here. Figure 7 Example B: After the left grinding disk finishes grinding the second wafer, the left grinding head returns the second wafer to position 2 of the first upper and lower head. This is the entire process of grinding the two wafers sequentially. Figures 5-7 In this context, RH stands for Rotation Head, meaning RH1 represents the first rotation head, and similarly, RH2 represents the second rotation head.

[0059] During the alternating grinding process of the two different wafers to be processed described above, the process of each wafer being picked up from a preset pick-up position by the grinding head at its current position on the corresponding current grinding equipment and transferred to another grinding equipment is as follows: Figure 4 For example, based on the relative distance and angle between the upper and lower grinding heads and each grinding head, the system can determine the position of the currently idle grinding head that is closest to the upper and lower grinding heads, and determine the wafer to be processed on that position. It then determines the preset pick-up position and preset rotation angle for the idle grinding head to pick up the wafer to be processed. The drive mechanism, such as a motor, moves the grinding head to the preset pick-up position, i.e., the pick-up position determined at the positioning center point O, and rotates the grinding head by a preset rotation angle to pick up the wafer to be processed onto the grinding pad, or to pick up the wafer from its current position on one grinding device to another. Specifically, as shown... Figure 4 The drive mechanism moves and rotates via guide rails respectively located at its upper and lower ends. The second guide rail 100 can move left and right relative to the grinding equipment along the annular slide rail of the transmission unit 40, ensuring that the drive mechanism swings the grinding head, positioned on the first guide rail, to the wafer position. The drive mechanism can swing the first guide rail 90 to the wafer position so that the grinding head on the first guide rail 90 can pick up the wafer. The grinding head is located at the end of the first guide rail furthest from the drive mechanism. In this embodiment, the drive mechanism and the correspondingly connected guide rails enable accurate movement and rotation of the grinding head, thereby improving the accuracy of grinding head pickup. During the grinding head movement, the lead screw structure can precisely control the travel distance to reach the pickup position. In some embodiments, such as... Figure 4 The third guide rail 110 is used to make a small rotation of the grinding head.

[0060] In some embodiments, the transmission unit is set at equal distances between the two grinding devices, which makes it easier for the system to calculate the distance between the grinding head and the wafer to be processed to determine the preset pick-up position and preset rotation angle.

[0061] The overall wafer grinding and conveying system described in this specification is designed for dual-sided or even multi-sided independent grinding equipment. When using multi-wafer grinding, the grinding head picks up and places the wafer directly from one grinding equipment to another in a single operation. This reduces the number of times the wafer is repeatedly placed or rested during the grinding process between equipment, thereby saving time and improving the efficiency and capacity of the entire wafer grinding process.

[0062] In some embodiments, the wafer polishing transport system further includes a robotic arm that picks up the wafer to be processed from the wafer transport mechanism to the upper or lower head position of the transport unit, or picks up the processed wafer from the upper or lower head position of the transport unit to the wafer transport mechanism, so as to transport the processed wafer to downstream equipment, such as a cleaning unit. Each wafer to be processed only needs to be transported once by the wafer transport mechanism. When each wafer is alternately polished, there is no need to transport the wafer back and forth, reducing the number of times the wafer is placed or rested. The polishing head directly picks up the wafer from one polishing device to another for polishing. Alternatively, when different wafers are alternately polished in the polishing devices, there is also no need to transport the wafer back and forth. The polishing head corresponding to each wafer is directly picked up from one polishing device to another for polishing. In some embodiments, the system assigns a specific polishing head to polish a wafer to be processed and the front / back side of the wafer to be processed based on the distance between each polishing head and the wafer to be processed. Compared to existing technologies, this method saves more than 20 seconds of time per wafer during the handover between grinding heads. For mass production processes involving wafer grinding, this time saving significantly improves grinding efficiency, increasing the grinding efficiency and capacity of each grinding machine. This, in turn, enhances the overall efficiency and capacity of the wafer manufacturing process.

[0063] In conjunction with the above-described wafer grinding and conveying system, this specification provides a wafer grinding and conveying method as follows: Figure 9 As shown, the system can determine the wafer closest to the currently idle grinding head based on the relative distance and relative angle between the wafer's current position and each grinding head. This wafer grinding and transfer method includes: Step S901: Determine the first wafer from the first upper and lower head positions based on the relative distance between the first grinding head and each wafer. Step S902: The first grinding head moves to the first pick-up position, picks up the first wafer from the first upper and lower head positions, and grinds the front and / or back sides of the first wafer on the first grinding device corresponding to the first grinding head. Step S903: After grinding the front and / or back sides of the first wafer on the first grinding device, the first grinding head carries and transfers the first wafer to the second grinding device, where it grinds the back and / or front sides. Step S904: After grinding the back and / or front sides of the first wafer on the second grinding device, it returns to the first upper and lower head positions. The wafer is combined during the grinding device handover process. Figure 3 and Figure 4 The process and principles are not described here. The first and second pick-up positions can be the same or different, depending on the actual needs.

[0064] In some embodiments, the wafer grinding and conveying method further includes: when the first grinding head grinds the front and / or back sides of the first wafer on the first grinding device, determining the nearest second upper and lower head position for the second grinding head, moving the second grinding head to a second pick-up position and rotating it by a preset angle to pick up the second wafer from the second upper and lower head position. When the first wafer finishes grinding on the first grinding device, the first grinding head carries the first wafer to the second grinding device for grinding, and the second grinding head moves the second wafer to the first grinding device to begin grinding, so that the second grinding head grinds the front and / or back sides of the second wafer on the first grinding device. When the first wafer finishes grinding on the second grinding device, the first grinding head moves the first wafer to a first upper and lower head position and puts down the first wafer so that the first wafer is sent to a downstream device; when the second wafer finishes grinding on the first grinding device, the second grinding head carries the second wafer to the second grinding device; the first grinding head picks up a third wafer and sends it to the first grinding device for grinding; when the second wafer finishes grinding on the second grinding device, the second grinding head returns the second wafer to the corresponding upper and lower head position. See the detailed implementation process below. Figures 4-7 The process and principles are not described here.

[0065] In conjunction with the above embodiments, only one grinding device performs the process operation in the above wafer grinding and conveying system. At this time, the grinding heads corresponding to the upper and lower head positions at both ends of the conveying unit determine the wafer closest to the upper and lower head positions, referring to... Figure 1 A right-side grinding head is located near the second upper / lower head position 3, close to the rear of the transmission unit. This right-side grinding head is closest to the first wafer placed on the second upper / lower head position 3. The right-side grinding head picks up the first wafer from the second upper / lower head position 3, grinds it on the right-side working grinding disk, and then returns the first wafer to the second upper / lower head position 3 for subsequent cleaning and other processes. Similarly, following the sequence of processes, the right-side grinding head continues to grind and transfer the second and even third wafers on the right-side working grinding disk. Likewise, if the left-side working grinding disk is being processed, the corresponding right-side grinding head, which is closer to it, can repeat the above process. Figure 1 The first upper and lower head position 2, which is close to the front of the transmission unit 40, can also use the working left grinding head placed close to it to complete the grinding, conveying, and grinding process described above as the right grinding head, which will not be elaborated here. Similarly, the left grinding head can be closest to the right working side grinding disc. Specifically, the working grinding equipment that is closest to which upper and lower head position the left and right grinding heads are can be set according to the actual situation.

[0066] Some embodiments of the wafer grinding transfer control unit may include a processor, a memory, and a computer program; wherein the memory is used to store the computer program, and the memory may also be flash memory. The computer program is, for example, an application program, functional module, etc., that implements the above-described methods. The processor is used to execute the computer program stored in the memory to implement the various steps performed by the device in the above-described methods. See the relevant descriptions in the preceding method embodiments for details.

[0067] Alternatively, the memory can be either standalone or integrated with the processor.

[0068] When the memory is a device independent of the processor, the device may further include:

[0069] A bus is used to connect the memory and the processor.

[0070] The present invention also provides a readable storage medium storing a computer program, which, when executed by a processor, is used to implement the methods provided in the various embodiments described above.

[0071] The readable storage medium can be a computer storage medium or a communication medium. A communication medium includes any medium that facilitates the transfer of computer programs from one location to another. A computer storage medium can be any available medium accessible to a general-purpose or special-purpose computer. For example, a readable storage medium is coupled to a processor, enabling the processor to read information from and write information to the readable storage medium. Of course, the readable storage medium can also be a component of the processor. The processor and the readable storage medium can reside in an Application-Specific Integrated Circuit (ASIC). Alternatively, the ASIC can be located in a user equipment. Of course, the processor and the readable storage medium can also exist as discrete components in a communication device. The readable storage medium can be a read-only memory (ROM), random access memory (RAM), CD-ROM, magnetic tape, floppy disk, and optical data storage device, etc.

[0072] It should be noted that the terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein.

[0073] The same or similar parts between the various embodiments in this specification can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. In particular, the product embodiments described later are relatively simple in description since they correspond to the methods, and relevant parts can be referred to the descriptions in the system embodiments.

[0074] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A wafer polishing transfer system, comprising: The wafer grinding and conveying system includes: Wafer transport mechanism, grinding equipment and transport unit; The wafer transfer mechanism is used to transfer each wafer to be processed once and to the upper and lower head positions of the transfer unit; the wafer base on the transfer unit moves between the first upper and lower head positions and the second upper and lower head positions of the transfer unit. The transmission unit receives the wafer to be processed from the wafer transfer mechanism and is also used to transfer the grinding head in the grinding equipment to the pick-up position. The grinding equipment is used to receive the wafer to be processed picked up by the grinding head, and to grind the front and / or back sides of the wafer to be processed; wherein, each wafer to be processed corresponds to one grinding head throughout the grinding process; each wafer to be processed is picked up from a first position to a second position by the grinding head at the pick-up position during the alternating grinding of the grinding equipment; different wafers to be processed are alternately ground on each grinding equipment using the same grinding head; the grinding equipment consists of a first grinding equipment and a second grinding equipment, the first grinding equipment and the second grinding equipment are arranged opposite to each other, and the transmission unit is arranged between the first grinding equipment and the second grinding equipment; The transmission unit receives at least two wafers to be processed. The wafers to be processed are picked up by the grinding head through the transmission unit according to the control unit's operating program and are ground on the grinding equipment. The control unit calculates the distance between the idle grinding head and the first and second upper and lower head positions, and the grinding head determines the wafer to be processed based on the nearest position.

2. The wafer polishing transfer system according to claim 1, characterized by, The wafer grinding and conveying system includes a drive mechanism and a lead screw structure. The grinding head is driven to move and rotate by the drive mechanism, and the lead screw structure is used to determine the moving distance of the grinding head so that the grinding head moves to the pick-up position.

3. The wafer polishing transfer system of claim 2, wherein, The transmission unit includes: a pulley guide rail, a magnetic levitation guide rail, or a high-pressure cylinder; the driving mechanism moves and rotates the grinding head along the transmission unit; the transmission unit is equidistantly arranged between two grinding devices.

4. The wafer polishing transfer system of claim 3, wherein, The drive mechanism is connected to two guide rails, with the first guide rail and the second guide rail respectively located at the upper and lower ends of the drive mechanism; the second guide rail moves left and right relative to the grinding equipment, and the drive mechanism swings the first guide rail to the wafer position so that the grinding head on the first guide rail can pick up the wafer, wherein the grinding head is located at the end of the first guide rail away from the drive mechanism; wherein the wafer position includes the upper and lower head positions, the first position, and the second position.

5. The wafer polishing transfer system of any of claims 1-4, wherein, The wafer grinding and conveying system also includes a robotic arm, which is used to pick up the wafer to be processed from the wafer conveying mechanism to the upper and lower head positions of the conveying unit, or to pick up the processed wafer from the upper and lower head positions of the conveying unit to the wafer conveying mechanism, so as to convey the processed wafer to the downstream equipment.

6. A wafer polishing transfer method characterized by, The wafer grinding and conveying system as described in any one of claims 1-5, wherein the wafer grinding and conveying method comprises: The first wafer is determined from the positions of the first upper and lower heads based on the relative distance between the first grinding head and each wafer; The first grinding head moves to the first picking position to pick up the first wafer from the first upper and lower head positions, and grinds the first wafer on the front and / or back sides on the first grinding device corresponding to the first grinding head; After the first wafer is ground on the front and / or back side on the first grinding equipment, the first grinding head carries the first wafer to the second grinding equipment, where the back and / or front side are ground. After the back side and / or front side of the first wafer are ground on the second grinding equipment, the first grinding head returns to the first upper and lower head position.

7. The wafer polishing transfer method of claim 6, wherein The wafer grinding and transfer method further includes: When the first grinding head grinds the first wafer on the first grinding equipment, the second grinding head is determined to be at the nearest second upper and lower head position, and the second grinding head moves to the second pick-up position to pick up the second wafer from the second upper and lower head position. When the first wafer is finished being ground on the first grinding equipment, the first grinding head carries the first wafer to the second grinding equipment for grinding, and the second grinding head moves the second wafer to the first grinding equipment for grinding, so that the second grinding head grinds the front and / or back of the second wafer on the first grinding equipment. When the first wafer finishes grinding in the second grinding equipment, the first grinding head moves the first wafer to the first upper and lower head position and puts the first wafer down so that the first wafer can be sent to the downstream equipment; when the second wafer finishes grinding in the first grinding equipment, the second grinding head carries the second wafer to the second grinding equipment; the first grinding head picks up the third wafer and puts it into the first grinding equipment for grinding. After the second wafer has been ground on the second grinding equipment, the second grinding head returns the second wafer to the corresponding upper and lower head positions.

8. A control unit for wafer grinding and conveying, characterized in that, include: The device includes a memory, a processor, and a computer program, the computer program being stored in the memory, and the processor running the computer program to perform the wafer grinding and transfer method according to claim 6 or 7.

9. A readable storage medium, characterized by, The readable storage medium stores a computer program that, when executed by a processor, is used to implement the wafer grinding and transfer method of claim 6 or 7.

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