Hybrid cooling device for a hydrogen compressor

Abstract

The application discloses a mixed cooling device of a hydrogen compressor, which comprises multiple mixed cooling units, any of which comprises: an inner layer cooling device comprising an inner layer air pipe which is continuously bent upwards along an arc surface and has a top opening in communication with the outside; multiple semiconductor cooling plates which respectively fill gaps of multiple bent segments in a height direction and jointly form an arc plate structure, an inner arc surface of which is attached to a compressor cylinder; and an outer layer cooling device which is a gas-liquid heat exchanger and comprises an outer layer air pipe in communication with a bottom opening of the inner layer air pipe; and a cooling liquid pipe coaxially sleeved on the outer layer air pipe and attached to an outer arc surface of the inner layer cooling device. The application focuses on cooling the hydrogen compression environment in the supercharged cylinder by multiple different sources of cooling medium and forms an integrated mixed cooling device, so that the compressor cylinder and the internal working environment thereof are simultaneously cooled, the cooling and heat exchange capacity is ensured, and the working stability of the compressor is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of hydrogen compressor cooling. More particularly, the present application relates to a mixed cooling device for hydrogen compressor. BACKGROUND

[0002] With the development of production technology, the design of hydrogen compressor is also developing towards high power and large displacement to adapt to the hydrogen compression demand in a larger pressure range. Facing high pressure working conditions, in addition to the requirement for the pressurization capacity of the hydrogen compressor itself, the cooling and heat exchange capacity of the cooling system matched with it is also crucial. In the prior art, the cooling system of the hydrogen compressor usually adopts a single water cooling method, and a liquid with cooling capacity is used as a medium to circulate heat exchange in the pressurization system of the hydrogen compressor to realize cooling of the overall hydrogen compressor. The cooler in the cooling system mainly includes a pre-cooler, an inter-stage cooler, an exhaust cooler, a cooling water jacket, a hydraulic oil cooler, and a cooling liquid pipeline and pipe valve for connecting various components. Among them, the cooling water jacket is a cooling flow channel arranged between the cylinder sleeve and the pressurization cylinder, and usually needs to be pre-reserved in the cylinder body design, which makes the machining of the compressor shell more complex and the quality difficult to control, and is prone to quality problems such as shell liquid leakage, which causes the compressor to be unable to work normally. Moreover, the heat exchange capacity of the cooling water jacket itself is limited, and it needs to be matched with multiple coolers in the system to cool the overall compressor. The remaining coolers need to be arranged on different pressurization pipelines or hydraulic oil pipelines of the compressor according to different cooling positions and cooling methods, and the overall structure is complicated and the installation steps are complex, which is not conducive to the overall pry design. Moreover, the connection of different coolers and the pressurization cylinder needs to be considered in the design, which further increases the potential leakage risk in the system and is not conducive to maintaining the working stability of the compressor.

[0003] To solve the above problems, a mixed cooling device for hydrogen compressor is needed to be designed to optimize the cooling system structure of the hydrogen compressor and improve the heat exchange capacity of the cooling system and the working stability of the compressor. SUMMARY

[0004] The purpose of the present application is to provide a mixed cooling device for hydrogen compressor, which cools the hydrogen compression environment in the pressurization cylinder from the outside of the compressor by using multiple different sources of cooling medium to form an overall mixed cooling device, and simultaneously cools the cylinder body and the internal working environment of the compressor. The use amount of cooling liquid is greatly reduced while ensuring the heat exchange capacity of the cooling system, and the working stability of the compressor is improved.

[0005] To achieve the objects and other advantages according to the present application, a mixed cooling device of a hydrogen compressor is provided, comprising a plurality of mixed cooling units which are arranged continuously along the circumference of a compressor cylinder and jointly form a sleeve structure which is sleeved outside the compressor cylinder, any mixed cooling unit comprising:

[0006] a base which is a horizontally arranged fan-shaped ring plate structure;

[0007] an inner layer cooling device which comprises an inner layer air pipe, one end of which is fixed to the inner side top of the base, the other end of which is arranged continuously upward along an arc surface and the top end opening of which is communicated with the outside, the inner layer air pipe comprising a plurality of bending segments which are arranged at intervals along the height direction, any bending segment being arranged on the same horizontal plane and the projection of the bending segment on the base coinciding with the inner arc edge thereof, two adjacent bending segments being communicated in series by a vertical elbow pipe; a plurality of semiconductor cooling plates which respectively fill the gaps of the bending segments in the height direction and jointly form an arc plate structure with the inner layer air pipe, the inner arc surface of the arc plate structure being fitted to the outer side wall of the compressor cylinder;

[0008] an outer layer cooling device which is fixed to the outer side top of the base, the outer layer cooling device being a gas-liquid heat exchanger which comprises an outer layer air pipe, one end of which is communicated with the bottom end opening of the inner layer air pipe; a cooling liquid pipe which is coaxially sleeved on the outer layer air pipe and is arranged in an arc plate structure, the arc plate structure being fitted to the outer arc surface of the inner layer cooling device;

[0009] a cooling liquid unit which is communicated with both ends of the cooling liquid pipe through the inlet and outlet ports thereof;

[0010] a gas pump which is communicated with the other end of the outer layer air pipe.

[0011] Preferably, in the mixed cooling device of the hydrogen compressor, the two side edges of the arc plate structure of the inner layer cooling device are vertically arranged, any bending segment and semiconductor cooling plate are arranged along the arc length direction, the length of each bending segment is the same, the length of each semiconductor cooling plate is the same, and the length of the bending segment is greater than the length of the semiconductor cooling plate.

[0012] Preferably, in the mixed cooling device of the hydrogen compressor, in the inner layer cooling devices of two adjacent mixed cooling units, the plurality of semiconductor cooling plates of one mixed cooling device correspond one-to-one to the plurality of semiconductor cooling plates of the other mixed cooling device, the two corresponding semiconductor cooling plates are arranged at intervals in the height direction, and all the semiconductor cooling plates of the two mixed cooling units are arranged continuously in the height direction.

[0013] Preferably, the mixed cooling device of the hydrogen compressor, the top openings of the inner layer air pipes of two adjacent mixed cooling units are communicated through a gas connection pipe, the gas pump of one mixed cooling unit is used as an air inlet pump, and the gas pump of the other mixed cooling unit is used as an air exhaust pump.

[0014] Preferably, the mixed cooling device of the hydrogen compressor further comprises an assembling platform, which comprises a pedestal, which is an internal hollow structure; a mounting base arranged in the middle of the top surface of the pedestal and used for positioning and mounting the compressor cylinder; and a plurality of sliding rails corresponding to the plurality of mixed cooling units, any sliding rail being arranged on the top surface of the pedestal along the radial direction thereof, and the corresponding mixed cooling unit being slidingly connected to the sliding rail through a sliding block.

[0015] Preferably, the mixed cooling device of the hydrogen compressor, any mixed cooling unit further comprises a heat conduction device, which comprises one or more heat conduction silica gel plates arranged continuously on the inner arc surface of the inner layer cooling device of the mixed cooling unit and attached to the outer sidewall of the compressor cylinder.

[0016] Preferably, the mixed cooling device of the hydrogen compressor, any mixed cooling unit further comprises an air cooling device located on the outer side of the outer layer cooling device and fixed on the base, the air cooling device comprising an air cooling cabin sleeved on the outer arc surface of the outer layer cooling device and forming an air cooling channel, and an air cooler arranged on the outer sidewall of the air cooling cabin and used for air inlet or air exhaust into the air cooling channel.

[0017] The present application at least includes the following beneficial effects:

[0018] The present application forms an integrated mixed cooling device by cooling the working environment of hydrogen compression in the booster cylinder from the outside of the compressor through a plurality of different sources of cooling medium, realizes the simultaneous cooling of the compressor cylinder and the high-pressure hydrogen and hydraulic oil in the internal working environment thereof, greatly reduces the amount of cooling liquid while ensuring the heat exchange capacity of the cooling system, reduces the safety risk caused by the leakage of the cooling liquid, and thus effectively improves the working stability of the compressor.

[0019] Other advantages, objects, and features of the present application will be apparent to those skilled in the art from the following description, and will be understood by those skilled in the art through practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 A mixed cooling device of a hydrogen compressor according to an embodiment of the present application before assembly;

[0021] Figure 2 A mixed cooling device of a hydrogen compressor according to another embodiment of the present application before assembly;

[0022] Figure 3 This is a schematic diagram of the assembled planar structure of the mixing and cooling device of the hydrogen compressor described in the above embodiments.

[0023] Explanation of reference numerals in the attached figures:

[0024] 1. Base; 2. Inner cooling device; 21. Inner air pipe; 22. Semiconductor cooling plate; 23. Gas connection pipe; 3. Outer cooling device; 31. Outer air pipe; 32. Coolant pipe; 4. Coolant unit; 5. Air pump; 61. Platform; 62. Slide rail; 7. Heat conduction device; 81. Air-cooled chamber; 82. Air cooler. Detailed Implementation

[0025] The present invention will now be described in further detail with reference to the accompanying drawings, so that those skilled in the art can implement it based on the description.

[0026] It should be noted that, unless otherwise specified, the experimental methods described in the following embodiments are all conventional methods, and the reagents and materials described are all commercially available unless otherwise specified. In the description of this invention, the terms "lateral", "longitudinal", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0027] like Figures 1-3 As shown, the present invention provides a mixing and cooling device for a hydrogen compressor, comprising multiple mixing and cooling units, which are continuously arranged along the circumference of the compressor cylinder and together form a sleeve structure sleeved on the outside of the compressor cylinder. Each mixing and cooling unit includes:

[0028] Base 1 is a horizontally arranged fan-shaped ring plate structure;

[0029] The inner cooling device 2 includes an inner air pipe 21, one end of which is fixed to the inner top of the base, and the other end is continuously bent upward along an arc-shaped surface with its top opening communicating with the outside. The inner air pipe includes multiple bent segments, which are spaced apart along the height direction. Any bent segment is set on the same horizontal plane and its projection on the base coincides with its inner arc edge. Two adjacent bent segments are connected end to end by a vertical bend. Multiple semiconductor cooling plates 22 fill the gaps in the height direction of the multiple bent segments and together with the inner air pipe form an arc plate structure. Their inner arc surfaces are in contact with the outer wall of the compressor cylinder.

[0030] An outer layer cooling device 3 is fixed on the outer top of the base, which is a gas-liquid heat exchanger, including an outer layer gas pipe 31, one end of which is in communication with the bottom end opening of the inner layer gas pipe; a cooling liquid pipe 32 is coaxially sleeved on the outer layer gas pipe and is arranged in an arc plate structure, which is arranged on the outer arc surface of the inner layer cooling device;

[0031] A cooling liquid unit 4, whose inlet and outlet are in communication with the two ends of the cooling liquid pipe respectively;

[0032] A gas pump 5 is in communication with the other end of the outer layer gas pipe.

[0033] In the above technical solution, a plurality of mixed cooling units are assembled outside the compressor cylinder body to form a whole sleeve, which is more convenient to install than the conventional cooling water jacket in the prior art, and can be applied to compressors of larger size, specifications and different installation environments. Any mixed cooling unit cools the surface of the supercharged cylinder body through the inner layer gas pipe arranged in a continuous bending manner along the arc surface, and a gas cooling medium (such as air) is introduced into the gas pipe, at the same time, the gap between adjacent layers of bending segments is filled with a semiconductor cooling plate, which supports the adjacent bending segments to ensure the overall stability, and at the same time, the semiconductor cooling plate can (after being powered on) efficiently (thermally) dissipate heat from the supercharged cylinder body, so that the semiconductor cooling plate and the bending segment form a whole arc plate structure arranged in a staggered manner along the height direction, and the inner arc surface (i.e. the refrigeration surface of the semiconductor cooling plate and one side of the inner layer gas pipe) is attached to the compressor cylinder body. In addition, in order to accelerate the heat dissipation of the heat dissipation surface of the semiconductor cooling plate (the outer arc surface away from the compressor cylinder body) and improve the cooling effect of the inner layer gas pipe, an outer layer cooling device is arranged on the outer side of the inner layer cooling device along the radial direction, which can adopt a plate heat exchanger structure or a sleeve heat exchanger structure, and an external cooling liquid is used to pre-cool the gas cooling medium flowing in the inner layer gas pipe, and at the same time, the heat dissipation surface of the semiconductor cooling plate is attached, quickly taking away the heat conducted out by the semiconductor cooling plate, to ensure the cooling effect and efficiency of the semiconductor cooling plate. In this embodiment, as shown in Figure 1 two mixed cooling units are used for splicing, in any mixed cooling unit, the external gas cooling medium is pumped into the outer layer gas pipe of the outer layer cooling device by the gas pump, cooled by the cooling liquid pipe of the outer layer cooling device, and then sent into the inner layer gas pipe to cool the cylinder body, at the same time, the semiconductor cooling plate is powered on, so that the refrigeration surface of the semiconductor cooling plate quickly conducts the heat at the compressor cylinder body and dissipates it through the heat dissipation surface.

[0034] Specifically, the bottom bending section of the inner layer gas pipe is supported and fixed on the top surface of the base, and the remaining inner layer gas pipe is continuously bent in a serpentine structure along the arc-shaped curved surface upward, and the top end opening is located at the top of the overall inner layer cooling device, facilitating exhaust. The bottom end opening of the inner layer gas pipe can be communicated with the end of the outer layer gas pipe through the gas pipe in the base. The two (inlet and outlet) ends of the outer layer gas pipe are arranged at the bottom, facilitating communication with the outer gas pump and the inner layer gas pipe, and improving the cooling effect. The winding direction of the inner tube (outer layer gas pipe, cooling liquid pipe) of the gas-liquid heat exchanger can be selected and designed according to actual needs, such as winding layer by layer upward along the height direction or winding from one end to the other end along the arc length direction, not limited to Figure 1 the gas winding direction shown in the figure. Like the end of the outer layer gas pipe, the two ends of the cooling liquid pipe are also arranged at the bottom, facilitating connection with the external cooling liquid unit. The cooling liquid unit, gas pump and other conventional pipe fittings in the system can be arranged on the base (on the outside of the outer layer cooling device), forming an integrated structure with the cooling device through the base without affecting the operation of the cooling device. When the mixed cooling unit is spliced, it can be moved synchronously, avoiding the inconvenience of pipe connection after moving. The gas cooling medium shown can be air, which is convenient for recycling and conducive to energy saving and environmental protection.

[0035] Thus, after the multiple mixed cooling units are assembled, an overall cooling environment can be formed around the cylinder body of the booster cylinder, the cooling process is cooled from the hydrogen compression source, and the high-pressure hydrogen and hydraulic oil in the cylinder body and its internal working environment are simultaneously cooled. While ensuring the heat exchange capacity of the cooling system, the amount of cooling liquid is greatly reduced, only a small amount of cooling liquid circulating in the cooling liquid pipe can ensure the cooling effect of the inner layer cooling device, and the outer layer cooling device containing the cooling liquid pipe does not directly contact the cylinder body of the compressor, reducing the safety risk caused by cooling liquid leakage, thereby effectively improving the working stability of the compressor.

[0036] In another technical solution, the hydrogen compressor's mixing cooling device has two vertically arranged sides of the arc plate structure of the inner cooling device. Each bent segment and semiconductor cooling plate is arranged along the arc length direction, with each bent segment and semiconductor cooling plate having the same length. The length of the bent segment is greater than the length of the semiconductor cooling plate. In this solution, the inner arc surface of each inner cooling device's arc plate faces inward (towards the compressor cylinder axis) and is vertically arranged, with both sides also vertically arranged. This allows adjacent mixing cooling units to be smoothly joined at the sides. After joining, conventional fastening or limiting devices can be used to lock the two mixing cooling units, ensuring their inner sides are tightly fitted to the compressor cylinder for cooling. Meanwhile, since the ends of each bent segment are aligned (of the same length), multiple semiconductor cooling plates are staggered and abut against the two sides of the arc plate structure of the inner cooling device, aligning with the ends of the (upper and lower) adjacent bent segments. This allows the vertical bends of the inner air pipe to be smoothly installed and connected to the corresponding bent segments, forming an arc plate structure covering the entire surface of the compressor cylinder on the corresponding side. In the height direction of the arc plate, the bent segments and semiconductor cooling plates are alternately arranged, causing the inner air pipe to surround the circumferential outer side of each semiconductor cooling plate. This further accelerates the heat dissipation of the semiconductor cooling plates and improves their cooling effect.

[0037] In another technical solution, in the mixing and cooling device of the hydrogen compressor, in the inner cooling device of two adjacent mixing and cooling units, multiple semiconductor cooling plates of one mixing and cooling device correspond one-to-one with multiple semiconductor cooling plates of the other mixing and cooling device. The corresponding two semiconductor cooling plates are staggered in the height direction, and all semiconductor cooling plates of the two mixing and cooling units are continuously arranged along the height direction. In the above technical solution, the number of mixing and cooling units must be even. Specifically, as shown... Figures 1-2 As shown, the bottom semiconductor cooling plates of two adjacent hybrid cooling units correspond to each other and are staggered in the height direction. The height of the inner gas pipe is set to be equal to the height of the semiconductor cooling plate. That is, after the two hybrid cooling units are spliced, the height position of the inner gas pipe on any hybrid cooling unit corresponds to the position of the semiconductor cooling plate in the other hybrid cooling unit, and the height position of the semiconductor cooling plate corresponds to the position of the inner gas pipe in the other hybrid cooling unit. Thus, a relatively uniform overall heat dissipation system is formed on the outside of the cylinder, which minimizes the impact of uneven cooling effect on the compressor housing and ensures that the relatively efficient semiconductor cooling plate covers the entire stroke position of the compressor cylinder, improving the cooling effect on the internal piston movement, hydrogen compression and hydraulic oil drive.

[0038] In another technical solution, the mixing and cooling device of the hydrogen compressor has the top openings of the inner gas pipes of two adjacent mixing and cooling units connected by a gas connecting pipe 23. One mixing and cooling unit's gas pump is used as an intake pump, and the other mixing and cooling unit's gas pump is used as a suction pump. In the above technical solutions, as... Figures 2-3 As shown, another embodiment of the hybrid cooling unit connection method is provided, still using two hybrid cooling units spliced ​​together (the solid arrows indicate the direction of gas cooling medium flow): the gas cooling pipes of the two adjacent hybrid cooling units are connected, that is, a gas connecting pipe connects the openings at the top of the two inner gas pipes, so that the gas pump of one hybrid cooling unit acts as an intake pump to pump the gas cooling medium into the outer cooling device for pre-cooling, and then inputs it into the inner gas pipe to cool the cylinder. After being output from the top of the inner gas pipe, it is not directly discharged into the external environment, but enters the inner gas pipe of the adjacent hybrid cooling unit through the gas connecting pipe to continue cooling the cylinder, and after being cooled by the outer cooling device of the other hybrid cooling unit, it is extracted by the extraction pump. The above structure improves the gas flow rate and cooling efficiency in the gas pipes, and allows the specific gas cooling medium to circulate between the gas pumps of the two hybrid cooling units when using non-air gas cooling medium for gas cooling, avoiding waste (in this case, an additional gas station and pipeline are required for gas storage and connection of the intake pump and extraction pump). In addition, for a mixed cooling device that includes two or more mixed cooling units, one mixed cooling unit can be selected as the input end (i.e., its air pump is used as the intake pump), and the rest are output ends (i.e., their air pumps are used as suction pumps). The gas cooling medium from the inner air pipe of the input end can be input into the inner air pipe of the other output ends through different gas connection pipes, and then cooled by the outer cooling device of each output end before being returned to the gas station for circulation by the suction pump.

[0039] In another technical solution, the mixed cooling device of the hydrogen compressor further comprises an assembly platform, which comprises a pedestal 61, which is an internal hollow structure; a mounting base arranged in the middle of the top surface of the pedestal and used for positioning and mounting the compressor cylinder; and a plurality of sliding rails 62 corresponding to the plurality of mixed cooling units, any sliding rail being arranged on the top surface of the pedestal along the radial direction of the pedestal, and the corresponding mixed cooling unit being slidably connected to the sliding rail through a sliding block. In the above technical solution, the plurality of mixed cooling units are mounted on the pedestal through the sliding rails. During mounting, the compressor cylinder can be positioned and mounted in the middle of the pedestal through the mounting base, and then the corresponding plurality of mixed cooling devices can be pushed inwards along the radial direction and pressed against the outer sidewall of the cylinder through the sliding rails. Through the assembly platform, the mixed cooling units can be more conveniently and accurately positioned and assembled, the accuracy of the connection between the compressor and the mixed cooling device is improved, and thus the cooling effect is ensured. Meanwhile, various connectors and pipelines of the compressor and various pipelines of the mixed cooling device can be connected from the inside of the pedestal of the assembly platform, avoiding exposure to the external environment and ensuring the working stability of the compressor and the cooling system.

[0040] In another technical solution, any mixed cooling unit of the mixed cooling device of the hydrogen compressor further comprises a heat conduction device 7, which comprises one or more heat-conducting silica gel plates arranged in series on the inner arc surface of the inner cooling device of the mixed cooling unit and attached to the outer sidewall of the compressor cylinder. In the above technical solution, the heat-conducting silica gel plates can be arranged in a structure that is attached to the inner arc surface of the inner cooling device as a whole, or a plurality of heat-conducting silica gel plates can be arranged in series to cover the entire inner arc surface. On the one hand, the heat-conducting silica gel plates can efficiently conduct heat, so that the compressor and the inner cooling device can be better attached and connected to ensure the cooling effect. On the other hand, since the silica gel plates have a certain elasticity, the problem of damage to the cylinder during installation of the mixed cooling unit is avoided.

[0041] In another technical solution, any mixed cooling unit of the mixed cooling device of the hydrogen compressor further comprises an air cooling device, which is located on the outer side of the outer cooling device and fixed to the base. The air cooling device comprises an air cooling cabin 81, which is sleeved on the outer arc surface of the outer cooling device and forms an air cooling channel; and an air cooling machine 82, which is arranged on the outer sidewall of the air cooling cabin and used for air intake or air exhaust of the air cooling channel. In the above technical solution, the air cooling machine can be a fan, and the number of the air cooling machine can be determined according to the size of the air cooling cabin. In the present embodiment, two air cooling machines are arranged in a single mixed cooling device, so as to further accelerate the diffusion of heat carried out by the outer cooling device. The air pump, the water chiller and other structures in the mixed cooling unit can be arranged in the air cooling cabin and subjected to heat dissipation treatment, which helps to ensure the stable and efficient operation of the components in the system.

[0042] While embodiments of the application have been disclosed in connection with the above specification and drawings this description is not intended to limit the scope of the application and many modifications, enhancements, alternatives, and variations will become apparent to those skilled in the art from this disclosure. Accordingly, it is intended that the application not be limited to the described embodiments, but that it include all variations falling within the scope of the claims, and their equivalents.

Claims

1. A mixing and cooling device for a hydrogen compressor, characterized in that, It includes multiple hybrid cooling units, which are continuously arranged along the circumference of the compressor cylinder and together form a sleeve structure sleeved on the outside of the compressor cylinder. Each hybrid cooling unit includes: The base is a horizontally arranged fan-shaped ring plate structure; An inner cooling device includes an inner air pipe, one end of which is fixed to the inner top of the base, and the other end is continuously bent upwards along an arc-shaped surface with its top opening communicating with the outside. The inner air pipe includes multiple bent segments spaced apart along the height direction. Any bent segment is positioned on the same horizontal plane, and its projection on the base coincides with its inner arc edge. Adjacent bent segments are connected end to end by a vertical bend. Multiple semiconductor cooling plates fill the gaps in the height direction of the multiple bent segments and together with the inner air pipe form an arc plate structure. The inner arc surface of the plate is in contact with the outer wall of the compressor cylinder. Both sides of the arc plate structure of the inner cooling device are vertically arranged. Any bent segment and semiconductor cooling plate are arranged along the arc length direction. The lengths of the bent segments and semiconductor cooling plates are the same, and the lengths of the bent segments and semiconductor cooling plates are the same. The length of the bent segments is greater than the length of the semiconductor cooling plates. An outer cooling device is fixed to the top of the outer side of the base. The outer cooling device is a gas-liquid heat exchanger, which includes an outer gas pipe, one end of which is connected to the bottom opening of the inner gas pipe; and a coolant pipe, which is coaxially sleeved on the outer gas pipe and wound around to form an arc plate structure, and is attached to the outer arc surface of the inner cooling device. The coolant unit has its inlet and outlet connected to both ends of the coolant pipe, respectively. An air pump, which is connected to the other end of the outer air tube; In the inner cooling device of two adjacent hybrid cooling units, multiple semiconductor cooling plates of one hybrid cooling device correspond one-to-one with multiple semiconductor cooling plates of the other hybrid cooling device. The corresponding two semiconductor cooling plates are staggered in the height direction, and all semiconductor cooling plates of the two hybrid cooling units are continuously arranged along the height direction.

2. The mixing and cooling device for a hydrogen compressor as described in claim 1, characterized in that, The top openings of the inner air pipes of two adjacent hybrid cooling units are connected by a gas connection pipe. The air pump of one hybrid cooling unit is used as an air intake pump, and the air pump of the other hybrid cooling unit is used as a suction pump.

3. The mixing and cooling device for a hydrogen compressor as described in claim 1, characterized in that, It also includes an assembly platform, which includes a base with an internally hollow structure; a mounting base, which is located in the middle of the top surface of the base and is used to position and install the compressor cylinder; and multiple slide rails, which correspond one-to-one with the multiple hybrid cooling units. Each slide rail is arranged radially on the top surface of the base, and the corresponding hybrid cooling unit is slidably connected to the slide rail by a slider.

4. The mixing and cooling device for a hydrogen compressor as described in claim 1, characterized in that, Any hybrid cooling unit also includes a heat-conducting device comprising one or more heat-conducting silicone plates, which are continuously disposed on the inner arc surface of the inner cooling device of the hybrid cooling unit and are in contact with the outer wall of the compressor cylinder.

5. The mixing and cooling device for a hydrogen compressor as described in claim 1, characterized in that, Any hybrid cooling unit also includes an air-cooling device located outside the outer cooling device and fixed to the base. The air-cooling device includes an air-cooling chamber, which is fitted over the outer arc surface of the outer cooling device to form an air-cooling channel; and an air-cooling machine, which is disposed on the outer wall of the air-cooling chamber and used to intake or exhaust air into the air-cooling channel.

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