Temporary Substrate, Transfer System, and Method for Transferring Micro-Components

Abstract

The present application provides a temporary substrate, a transfer system, and a transfer method for microcomponents, wherein the temporary substrate comprises: a first substrate; an adhesive layer, located on the first surface of the first substrate, the adhesive layer is used to receive the microcomponent, and the adhesive layer has resilience; wherein, under the action of pressure toward the first substrate, the microcomponent is embedded in the adhesive layer; after the pressure is removed, the surface of the microcomponent facing away from the first substrate protrudes out of the surface of the adhesive layer facing away from the first substrate. Through the above-mentioned design method, the present application can ensure that after the microcomponent is transferred to the temporary substrate, the side of the microcomponent is not completely wrapped by the adhesive layer, which is conducive to the subsequent transfer device picking up the microcomponent and improving the transfer efficiency of the microcomponent.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and specifically relates to a temporary substrate, a transfer system and a transfer method for micro-components. Background Art

[0002] LED (Light Emitting Diode) chip display technology has the advantages of high brightness, high response speed, low power consumption, and long life, and has become a research hotspot in the pursuit of a new generation of display technology.

[0003] At present, laser stripping and batch transfer are two very important processes in the preparation of LED display panels. The specific process of laser stripping is: first, multiple LED chips with a transparent substrate are completely pressed into the adhesive layer of the temporary substrate so that the multiple LED chips are fixed by the adhesive layer; then the laser is irradiated from one side of the transparent substrate to separate the multiple LED chips from the transparent substrate. The specific process of batch transfer is: multiple LED chips are transferred using a pick-up transfer head.

[0004] The inventors of the present application have discovered during long-term research that, since the LED chip is completely sunken into the adhesive layer during laser stripping, it is difficult for the subsequent pick-up transfer head to pick up the LED chip, and the transfer is laborious. Summary of the invention

[0005] The present application provides a temporary substrate, a transfer system and a transfer method for micro-components, which can prevent all micro-components from being sunken into a glue layer after laser stripping of a second substrate of a growth substrate.

[0006] In order to solve the above technical problems, a technical solution adopted in the present application is: to provide a temporary substrate for the micro-component transfer process, including: a first substrate; an adhesive layer, located on the first surface of the first substrate, the adhesive layer is used to receive the micro-component, and the adhesive layer has resilience; wherein, under the action of pressure toward the first substrate, the micro-component is embedded in the adhesive layer; after the pressure is removed, the surface of the micro-component facing away from the first substrate protrudes out of the surface of the adhesive layer facing away from the first substrate.

[0007] In order to solve the above technical problems, another technical solution adopted in the present application is: providing a transfer system, comprising: a growth substrate, comprising a second substrate and a plurality of microcomponents located on the second surface of the second substrate; a temporary substrate as described in any of the above embodiments; a peeling device, used for separating the second substrate and the plurality of microcomponents after the plurality of microcomponents and the adhesive layer are arranged relative to each other and the plurality of microcomponents are embedded in the adhesive layer; a transfer device, used for applying force to the surface of the microcomponent protruding from the adhesive layer to pick up the microcomponent after removing the second substrate.

[0008] To solve the above technical problems, another technical solution adopted in the present application is: to provide a method for transferring microcomponents, comprising: providing a temporary substrate and a growth substrate as described in any of the above embodiments; wherein the growth substrate comprises a second substrate and a plurality of microcomponents located on the second surface of the second substrate; the adhesive layer and the plurality of microcomponents are arranged opposite to and close to each other until the second surface contacts the adhesive layer and the plurality of microcomponents are embedded in the adhesive layer; the second substrate is separated from the microcomponents by a peeling device, and the second substrate is removed, and the surface of the microcomponent facing away from the first substrate protrudes out of the surface of the adhesive layer facing away from the first substrate under the action of the resilience of the adhesive layer; a transfer device is used to apply a force to the surface of the microcomponent protruding from the adhesive layer to pick up the microcomponent.

[0009] Different from the prior art, the beneficial effects of the present application are as follows: the adhesive layer on the temporary substrate provided by the present application has resilience; under the pressure of the first substrate facing the temporary substrate, the microcomponent can be embedded in the adhesive layer; after the pressure is removed, the adhesive layer rebounds, and the surface of the microcomponent facing away from the first substrate protrudes from the surface of the adhesive layer facing away from the first substrate. This design method can ensure that after the microcomponent is transferred to the temporary substrate, the side of the microcomponent is not completely wrapped by the adhesive layer, which is conducive to the subsequent transfer device picking up the microcomponent and improving the transfer efficiency of the microcomponent. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0011] Figure 1 This is a structural schematic diagram of an implementation method of a temporary substrate of the present application;

[0012] Figure 2 This is a structural schematic diagram of another embodiment of the temporary substrate of the present application;

[0013] Figure 3 This is a structural schematic diagram of another embodiment of the temporary substrate of the present application;

[0014] Figure 4 This is a schematic diagram of the structure of an implementation method of the transfer system of this application;

[0015] Figure 5 A schematic structural diagram of an embodiment of peeling off the second substrate;

[0016] Figure 6A schematic diagram of the structure of an embodiment of transferring a micro-component;

[0017] Figure 7 for Figure 4 A schematic structural diagram of another embodiment of a middle growth substrate;

[0018] Figure 8 FIG. 1 is a schematic diagram of a process of transferring a micro-component according to an embodiment of the present invention. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0020] See also Figure 1 , Figure 1 The temporary substrate 1 is a schematic diagram of a temporary substrate of the present application. The temporary substrate 1 is used in a micro-component transfer process (for example, the laser lift-off and batch transfer process mentioned in the background technology). The micro-component may be an LED, etc. The temporary substrate 1 specifically includes a first substrate 10 and an adhesive layer 12.

[0021] The first substrate 10 may be a glass substrate or the like; the adhesive layer 12 is located on the first surface 100 of the first substrate 10, the adhesive layer 12 is used to receive and fix the micro-component, and the adhesive layer 12 has resilience. Optionally, in this embodiment, the orthographic projection of the adhesive layer 12 on the first substrate 10 may cover the first surface 100 of the first substrate 10. The material of the adhesive layer 12 may be silicone, polydimethylsiloxane, etc. Under the pressure toward the first substrate 10, the micro-component is embedded in the adhesive layer 12, and the adhesive layer 12 undergoes compression deformation; after the pressure is removed, due to the resilience of the adhesive layer 12, the surface of the micro-component facing away from the first substrate 10 protrudes from the surface of the adhesive layer 12 facing away from the first substrate 10. In this embodiment, in the process of designing the adhesive layer 12, its viscosity and resilience need to be comprehensively considered, and the sum of the adhesion force of the adhesive layer 12 to the micro-component embedded therein and the gravity of the micro-component needs to be less than the resilience of the adhesive layer 12, so that the side of the micro-component facing away from the first substrate 10 can protrude from the adhesive layer 12 after the pressure is removed.

[0022] The above design ensures that after the micro-component is transferred to the temporary substrate 1 , the side surface of the micro-component is not completely wrapped by the adhesive layer 12 , which is beneficial for the subsequent transfer device to pick up the micro-component and improves the transfer efficiency of the micro-component.

[0023] In one embodiment, if Figure 1As shown, a plurality of grooves 120 are provided on the side of the adhesive layer 12 facing away from the first substrate 10. One groove 120 is used to accommodate one micro-element, and the depth of the groove 120 is less than the thickness of the micro-element to be accommodated therein. The introduction of the groove 120 can make the resistance smaller when the micro-element is embedded in the adhesive layer 12, and can make the micro-element protrude from the adhesive layer 12 more conveniently after the pressure is removed. Of course, in some embodiments, the side of the adhesive layer 12 facing away from the first substrate 10 may also be a plane, and the present application does not limit this.

[0024] Optionally, in this embodiment, the orthographic projection of the groove 120 on the first substrate 10 may coincide with the orthographic projection of the micro-element embedded therein on the first substrate 10. This design can make the side wall of the micro-element contact the inner wall of the groove 120 when the micro-element is embedded in the adhesive layer 12, so as to reduce the probability of the position of the micro-element shifting during the laser lift-off process.

[0025] Optionally, as Figure 1 shown, the material of the entire adhesive layer 12 may be the same, and the entire adhesive layer 12 is formed of a resilient substance. This design can reduce the formation process of the adhesive layer 12.

[0026] Another option is, as Figure 2 shown, Figure 2 is a schematic structural diagram of another embodiment of the temporary substrate of the present application. The adhesive layer 12 includes a first sub-adhesive layer 122 and a second sub-adhesive layer 124 arranged in a stacked manner, and the first sub-adhesive layer 122 is located between the first substrate 10 and the second sub-adhesive layer 124; wherein, only the first sub-adhesive layer 122 has resilience, and the groove 120 penetrates the second sub-adhesive layer 124. Optionally, in this embodiment, the second sub-adhesive layer 124 does not have resilience, and its material may be polyimide PI, optical adhesive OCA, etc. The above structural design of the adhesive layer 12 is relatively simple, and the design of the first sub-adhesive layer 122 and the second sub-adhesive layer 124 can reduce the difficulty of the micro-element protruding from the adhesive layer 12. In addition, the groove 120 may further extend into the first sub-adhesive layer 122 as long as the depth of the entire groove 120 is less than the height of the micro-element.

[0027] Yet another option is, as Figure 3 shown, Figure 3It is a schematic structural diagram of another embodiment of the temporary substrate of the present application. The adhesive layer 12 includes a first sub - adhesive layer 122 and a second sub - adhesive layer 124 arranged in the same layer; among them, only the first sub - adhesive layer 122 has resilience, and the second sub - adhesive layer 124 is provided with a plurality of vias (not labeled); the first sub - adhesive layer 122 fills the bottom of the plurality of vias, and the thickness of the first sub - adhesive layer 122 is less than the depth of the vias, and the via regions not filled by the first sub - adhesive layer 122 form grooves 120. The structural design of the adhesive layer 12 is relatively simple, and the design of the first sub - adhesive layer 122 and the second sub - adhesive layer 124 can reduce the difficulty of the micro - components protruding from the adhesive layer 12.

[0028] Further, please continue to refer to Figure 1 or Figure 2 or Figure 3 , the temporary substrate 1 provided by the present application further includes a plurality of adhesive members 14, and an adhesive member 14 is provided at the bottom of each groove 120. The introduction of the adhesive member 14 can reduce the probability of the micro - components detaching from the adhesive layer 12 during the resilience of the adhesive layer 12. Optionally, the adhesiveness of the adhesive member 14 can be greater than the maximum adhesiveness of the adhesive layer 12. Optionally, in this embodiment, the material of the adhesive member 14 can be vinyl acetate, acrylate, polyurethane, polystyrene, etc.

[0029] Please refer to Figure 4 , Figure 4 It is a schematic structural diagram of an embodiment of the transfer system of the present application. The transfer system 2 includes a growth substrate 20, the temporary substrate 1 mentioned in any of the above - mentioned embodiments, a peeling device 22, and a transfer device 24.

[0030] Specifically, the growth substrate 20 includes a second substrate 200 and a plurality of micro - components 202 located on the second surface 2000 of the second substrate 200. Optionally, in this embodiment, the second substrate 200 can be a sapphire substrate, etc., and the micro - components 202 can be LEDs, which can grow from the surface of the sapphire substrate, and the micro - components 202 can be red LEDs or blue LEDs or green LEDs, and the colors of the light emitted by adjacent micro - components 202 can be the same or different, and the present application does not limit this.

[0031] As Figure 4 and 5 shown, Figure 5Schematic structural diagram of an embodiment for peeling off a second substrate. The peeling device 22 is used to separate the second substrate 200 from the plurality of micro-components 202 after the plurality of micro-components 202 and the adhesive layer 12 are oppositely arranged and the plurality of micro-components 202 are embedded in the adhesive layer 12. Optionally, in this embodiment, the peeling device 22 includes a laser, which can irradiate from the side of the second substrate 200 facing away from the plurality of micro-components 202, so that the material on the side of the micro-components 202 facing the second substrate 200 evaporates, and then the micro-components 202 are separated from the second substrate 200. In addition, the above-mentioned peeling device 22 can separate all the micro-components 202 from the second substrate 200; or, the peeling device 22 can also only separate some of the micro-components 202 from the second substrate 200, and this application does not limit this.

[0032] As Figure 4 and Figure 6 shown, Figure 6 Schematic structural diagram of an embodiment for transferring micro-components. The transfer device 24 is used to apply a force to the surface of the micro-components 202 protruding from the adhesive layer 12 to pick up the micro-components 202 after the second substrate 200 is removed. In this embodiment, when the plurality of micro-components 202 are embedded in the adhesive layer 12, the adhesive layer 12 will be subjected to a pressure toward the first substrate 10, and the adhesive layer 12 will be compressed and deformed. In particular, the adhesive layer 12 at the position of the groove (not marked) is compressed and deformed to a greater extent; when the second substrate 200 is removed, this pressure is removed. Since the adhesive layer 12 has resilience, it will deform to its initial state (that is, the state before being compressed); at this time, the micro-components 202 will protrude from the adhesive layer 12, and the transfer device 24 can conveniently apply a force to the surface of the micro-components 202 protruding from the adhesive layer 12 to pick up the micro-components 202. Optionally, in this embodiment, the transfer device 24 can be a vacuum adsorption device or an electrostatic adsorption device, etc.; and the transfer device 24 can transfer a plurality of micro-components 202 at the same time to improve the transfer efficiency.

[0033] In one embodiment, please refer to Figure 4 again, a plurality of protrusions 204 are provided on the second surface 2000 of the second substrate 200, and at least one protrusion 204 is provided between two adjacent micro-components 202. The protrusions 204 are used to be embedded in the adhesive layer 12 (as Figure 5 shown), and are removed together with the second substrate 200. The introduction of the protrusions 204 can increase the contact area between the growth substrate 20 and the adhesive layer 12, enhance the firmness of the micro-components 202 and the adhesive layer 12 being buckled together during the peeling process, and reduce the probability of the position of the micro-components 202 shifting.

[0034] Optionally, in this embodiment, the material of the protrusion 204 may include organic materials, such as benzocyclobutene (BCB), polyimide (PI), etc.; of course, the material of the protrusion 204 may also include metals, such as gold (Au), aluminum (Al), nickel (Ni), titanium (Ti), etc.; or, the material of the protrusion 204 includes inorganic non-metals, such as silicon dioxide (SiO2), silicon nitride (SiNx), gallium nitride (GaN), gallium arsenide (GaAs), aluminum oxide (Al2O3), aluminum gallium indium phosphide (AlGaAsP). Preferably, the material of the protrusion 204 is the same as that of the second substrate 200. This design can prevent the protrusion 204 from detaching from the second substrate 200 during full-surface laser irradiation, improving the peeling efficiency. In addition, a plurality of protrusions 204 may be arranged around the periphery of the microelement 202 to further enhance the fastening strength of the microelement 202 and the adhesive layer 12 during the peeling process, reducing the probability of the microelement 202 shifting in position.

[0035] Further, please refer to Figure 4 again. In the direction away from the second substrate 200, the height of the protrusion 204 is less than 1 / 2 of the height of the microelement 202; for example, the height of the protrusion 204 is 1 / 3, 1 / 4, etc. of the height of the microelement 202; this design can reduce the resistance when removing the second substrate 200.

[0036] In addition, please refer to Figure 4 again. The outer surface of the protrusion 204 may be a plane, and at this time, the protrusion 204 may be a prism, a pyramid, or other structures. Of course, in other embodiments, the outer surface of the protrusion 204 may also include a curved surface. For example, as Figure 7 shown, Figure 7 is Figure 4 a schematic structural diagram of another embodiment of the growth substrate. The surface of the protrusion 204 facing away from the second substrate 200 is a convex surface (as shown in Figure 7 ); of course, in other embodiments, the surface of the protrusion 204 facing away from the second substrate 200 may also be a concave surface. Or, the protrusion 204 may directly be a cylinder, a cone, etc.

[0037] Further, please continue to refer to Figure 4 again. The shapes of all the protrusions 204 may be the same, and in the direction away from the second substrate 200, the extending directions of all the protrusions 204 are arranged parallel to each other. The above design can not only reduce the difficulty of forming the protrusions 204 on the second substrate 200; but also when removing the second substrate 200 subsequently, the second substrate 200 can be removed along the extending direction of the protrusions 204 to reduce the resistance when removing the second substrate 200.

[0038] Optionally, as Figure 4As shown, in the direction away from the second substrate 200, the protrusion 204 includes a relatively arranged first end face 2040 and a second end face 2042 (or second end point). The first end face 2040 is closer to the second substrate 200 than the second end face 2042 (or second end point). At this time, the direction of the line connecting the center point of the first end face 2040 and the center point (or second end point) of the second end face 2042 can be defined as the extending direction of the protrusion 204. Of course, in other embodiments, the definition of the extending direction of the protrusion 204 can also be other; for example, when the side surface of the protrusion 204 includes a plurality of planes, the extending direction of the protrusion 204 can be defined by the extending direction of one of the side surfaces A; it should be noted that since all the protrusions 204 have the same shape, the side surface A selected to define the extending direction for each protrusion 204 must also be the same one.

[0039] Further, as Figure 4 shown, the included angle between the extending direction of the protrusion 204 and the second surface 2000 is an acute angle. Preferably, the included angle between the extending direction of the protrusion 204 and the second surface 2000 is 30° - 60° (for example, 35°, 45°, 55°, etc.). In this design, the protrusion 204 can be obliquely inserted into the glue layer 12 subsequently to improve the bonding force between the growth substrate 20 and the temporary substrate 1 during laser lift-off and reduce the probability of the microelement 202 shifting in position.

[0040] Please refer to Figure 8 , Figure 8 which is a schematic flow chart of an embodiment of the transfer method of the microelement of the present application. The transfer method specifically includes:

[0041] S101: Provide a temporary substrate 1 and a growth substrate 20; wherein, the temporary substrate 1 includes a first substrate 10 and a glue layer 12 located on the first surface 100 of the first substrate 10, and the glue layer 12 has resilience; the growth substrate 20 includes a second substrate 200 and a plurality of microelements 202 located on the second surface 2000 of the second substrate 200.

[0042] Specifically, the present application does not limit the sequence of the steps of providing the temporary substrate 1 and providing the growth substrate 20.

[0043] Optionally, when the structure of the temporary substrate 1 is as Figure 1 shown, the specific process of providing the temporary substrate 1 can be: coating a layer of glue on the first surface 100 of the first substrate 10 and curing the glue to form the glue layer 12. When there is a groove 120 on the glue layer 12, the groove 120 can also be formed on the glue before the glue is completely cured, and then the glue is completely cured.

[0044] Another option is that when the structure of the temporary substrate 1 is as Figure 2When shown as in [the figure], the specific process of providing the temporary substrate 1 may be: forming a first sub - adhesive layer 122 on the first surface 100 of the first substrate 10, and forming a patterned second sub - adhesive layer 124 on the first sub - adhesive layer 122.

[0045] Optionally, when the structure of the temporary substrate 1 is as Figure 3 shown in [the figure], the specific process of providing the temporary substrate 1 may be: forming a patterned second sub - adhesive layer 124 on the first surface 100 of the first substrate 10, and forming a first sub - adhesive layer 122 in the vias of the second sub - adhesive layer 124.

[0046] Further, after forming the adhesive layer 12 in the above - mentioned several embodiments, a sticky member 14 may also be formed at the bottom of the groove 120.

[0047] In addition, please refer to Figure 4 , the steps of providing the growth substrate 20 may be: forming a plurality of micro - elements 202 on the second surface 2000 of the second substrate 200; then forming at least one protrusion 204 in the space between adjacent micro - elements 202 by means of evaporation deposition or coating lithography, etc.

[0048] S102: Align the adhesive layer 12 with the plurality of micro - elements 202 and set them close to each other until the second surface 2000 contacts the adhesive layer 12, and the plurality of micro - elements 202 are embedded in the adhesive layer 12.

[0049] Specifically, please refer to Figure 4 and Figure 5 ; when there is a groove 120 ( Figure 5 not marked in [the figure]) on the adhesive layer 12 in step S101, since the depth of the groove 120 is less than the height of the micro - element 202, in order to embed the plurality of micro - elements 202 into the adhesive layer 12, a certain pressure needs to be applied to the side of the second substrate 200 away from the micro - elements 202, and the adhesive layer 12 undergoes a certain amount of compressive deformation. When there are a plurality of protrusions 204 on the second substrate 200, the plurality of protrusions 204 will be embedded in the adhesive layer 12 together. At this time, due to the action of the protrusions 204, the bonding force between the micro - elements 202 and the adhesive layer 12 can be increased, and the probability of the micro - elements 202 shifting in position can be reduced.

[0050] S103: Use the peeling device 22 to separate the second substrate 200 from the micro - elements 202, and remove the second substrate 200; under the action of the resilience of the adhesive layer 12, the surface of the micro - elements 202 on the side away from the first substrate 10 protrudes from the surface of the adhesive layer 12 on the side away from the first substrate 10.

[0051] Specifically, please refer to Figure 5 and Figure 6; When there are multiple protrusions 204 provided on the second substrate 200, the multiple protrusions 204 will not separate from the second substrate 200; when the second substrate 200 is removed, the multiple protrusions 204 are removed together with the second substrate 200, so that the subsequent protrusions 204 will not affect the transfer process of the micro-components 202.

[0052] In addition, before the second substrate 200 is removed, the adhesive layer 12 is in a compressed deformation state; after the second substrate 200 is removed, due to the resilience of the adhesive layer 12, the micro-components 202 will protrude from the surface of the adhesive layer 12.

[0053] S104: Apply a force to the surface of the micro-components 202 protruding from the adhesive layer 12 by using the transfer device 24 to pick up the micro-components 202.

[0054] Specifically, please refer to Figure 6 , the transfer device 24 can selectively pick up the micro-components 202 one by one, or pick them up in batches, and this application does not make any limitations in this regard.

[0055] The above are only the embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied to other related technical fields, shall be included in the patent protection scope of the present application by the same token.

Claims

1. A temporary substrate for use in a micro-component transfer process, characterized in that, Comprising: A first substrate; An adhesive layer located on a first surface of the first substrate. The adhesive layer is used to receive the micro-components, and the adhesive layer has resilience. A plurality of grooves are provided on a side of the adhesive layer facing away from the first substrate. One groove is used to accommodate one micro-component, and the depth of the groove is less than the thickness of the micro-component. Wherein, under the action of a pressure towards the first substrate, the micro-component is embedded into the adhesive layer; after the pressure is removed, a surface of the micro-component facing away from the first substrate protrudes from a surface of the adhesive layer facing away from the first substrate.

2. The temporary substrate according to claim 1, wherein The adhesive layer comprises: A first sub-adhesive layer and a second sub-adhesive layer which are stacked, and the first sub-adhesive layer is located between the first substrate and the second sub-adhesive layer; wherein, only the first sub-adhesive layer has resilience, and the groove penetrates through the second sub-adhesive layer; or, A first sub-adhesive layer and a second sub-adhesive layer which are arranged in the same layer. A plurality of through-holes are provided on the second sub-adhesive layer, and the bottom of the plurality of through-holes is filled with the first sub-adhesive layer; wherein, only the first sub-adhesive layer has resilience, the height of the first sub-adhesive layer is less than the depth of the through-hole, and the area of the through-hole not filled with the first sub-adhesive layer forms the groove.

3. The temporary substrate according to claim 2, characterized in that, Further comprising: A plurality of adhesive members, and each adhesive member is provided at the bottom of each groove.

4. A transfer system, characterized in that, Comprising: A growth substrate, comprising a second substrate and a plurality of micro-components located on a second surface of the second substrate; The temporary substrate according to any one of claims 1-3; A peeling device, configured to separate the second substrate and the plurality of micro-components after the plurality of micro-components and the adhesive layer are oppositely arranged and the plurality of micro-components are embedded into the adhesive layer; A transfer device, configured to apply a force to a surface of the micro-component protruding from the adhesive layer to pick up the micro-component after the second substrate is removed.

5. The transfer system according to claim 4, wherein A plurality of protrusions are provided on the second surface, and at least one protrusion is provided between two adjacent micro-components; the protrusion is configured to be embedded into the adhesive layer and is removed together with the second substrate.

6. The transfer system according to claim 5, wherein In a direction away from the second substrate, the height of the protrusion is less than 1 / 2 of the height of the micro-component.

7. The transfer system according to claim 5, wherein All the protrusions have the same shape, and in a direction away from the second substrate, the extending directions of all the protrusions are arranged parallel to each other.

8. The transfer system according to claim 7, wherein The extending direction of the protrusion forms an acute angle with the second surface.

9. The transfer system according to claim 8, wherein The extending direction of the protrusion forms an angle of 30°-60° with the second surface.

10. A method for transferring a micro-component, characterized in that, Comprising: Providing the temporary substrate according to any one of claims 1-3 and a growth substrate; wherein, the growth substrate comprises a second substrate and a plurality of micro-components located on a second surface of the second substrate; The adhesive layer and the plurality of micro-components are arranged opposite to each other and close to each other until the second surface contacts the adhesive layer and the plurality of micro-components are embedded in the adhesive layer; The second substrate is separated from the micro-component by a peeling device, and the second substrate is removed, and under the elasticity of the adhesive layer, the surface of the micro-component facing away from the first substrate protrudes out of the surface of the adhesive layer facing away from the first substrate; A transfer device is used to apply force to the surface of the micro-component protruding from the adhesive layer to pick up the micro-component.

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