Semiconductor process chamber and its loadlock device

Abstract

The present application provides a carrier device, which comprises a carrier plate and a plurality of supports, the carrier plate has a plurality of avoiding holes corresponding to the positions of the supports and penetrating the carrier plate in the height direction, and the carrier plate can be lifted relative to the supports, so that the top end of the support can be extended out of the avoiding hole to above the carrier plate and hold a wafer on the carrier plate, or be retracted into the avoiding hole and place the wafer on the carrier plate, the carrier device further comprises a plurality of matching sleeves, the matching sleeves are arranged in the avoiding holes one by one, the outer surface of the matching sleeve is matched with the outer wall of the avoiding hole, and the support can pass through the matching sleeve at the corresponding position. In the present application, the support passes through the matching sleeve to extend out of or retract into the avoiding hole, so that the particles will adhere to the matching sleeve after entering the avoiding hole, and the matching sleeve can be taken down for separate cleaning when cleaning is needed, thereby simplifying the maintenance operation of the carrier device and the semiconductor process chamber. The present application also provides a semiconductor process chamber.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor process equipment, in particular, to a bearing device and a semiconductor process chamber comprising the bearing device. BACKGROUND

[0002] Physical Vapor Deposition (PVD) process refers to a semiconductor processing technology for depositing metal film on a wafer by physical method. In the field of semiconductor processing technology, a wafer is generally carried by a susceptor or a wafer support rod. When the wafer back surface has been deposited with metal film except for the edge area, and the wafer front surface needs to be deposited with metal film, in order to avoid damaging the metal film on the wafer back surface, the wafer can only be supported by contacting the edge position of the wafer.

[0003] In the existing semiconductor process chamber, the wafer is generally taken and placed by the cooperation of the top pin and the bearing disc, that is, the top pin can pass through the top pin hole on the bearing disc to the upper side of the bearing surface of the bearing disc. When the wafer is transmitted into the semiconductor process chamber, the robot first places the wafer on the top of the top pin, and then the bearing disc is raised to make the top pin retract below the bearing surface of the bearing disc, so that the bearing disc supports the wafer for corresponding process. After the process is completed, the bearing disc is lowered, so that the top pin passes out again and lifts the wafer, so that the robot takes away the wafer.

[0004] However, the cleanliness of the bearing disc in the existing semiconductor process chamber will gradually decrease with the process, and the bearing disc needs to be disassembled and maintained regularly to avoid the influence of the pollutants and particulate matters on the bearing disc on the semiconductor process effect. The bearing disc has many components, and the disassembly and assembly take a long time, which seriously affects the machine capacity. Therefore, how to improve the maintenance efficiency of the bearing disc and ensure the machine capacity has become a technical problem to be solved in the field. SUMMARY

[0005] The present application aims to provide a bearing device and a semiconductor process chamber, which can improve the maintenance efficiency of the bearing disc and improve the machine capacity.

[0006] To achieve the above object, as one aspect of the present application, a carrier device is provided for being arranged in a cavity of a semiconductor process chamber, the carrier device comprising a carrier plate having a plurality of avoiding holes corresponding to positions of a plurality of support members and penetrating through the carrier plate in a height direction, and the carrier plate being capable of lifting movement relative to the support members so that top ends of the support members can be passed out of the avoiding holes to above the carrier plate and lift a wafer on the carrier plate or be retracted into the avoiding holes and place the wafer on the carrier plate, the carrier device further comprising a plurality of fitting sleeves, the plurality of fitting sleeves being arranged in the plurality of avoiding holes one by one, an outer surface of the fitting sleeve being fitted with an outer wall of the avoiding hole, and the support member being capable of passing through the fitting sleeve at a corresponding position.

[0007] Optionally, the carrier device further comprises a lifting assembly for driving the lifting movement of the carrier plate, the carrier plate comprising a radio frequency feeding plate and an insulation assembly connected between the lifting assembly and the radio frequency feeding plate.

[0008] The avoiding hole comprises an insulation avoiding structure formed in the insulation assembly, the fitting sleeve comprises an insulation sleeve arranged in the insulation avoiding structure, and the support member is capable of passing through a first sleeve hole in the insulation sleeve in a vertical direction.

[0009] Optionally, the insulation assembly comprises an insulation plate, a middle insulation ring and a top insulation ring, a bottom of the insulation plate being connected with the lifting assembly, a bottom of the middle insulation ring being arranged on the insulation plate, the radio frequency feeding plate being arranged above the middle insulation ring, the top insulation ring being arranged on a top of the middle insulation ring and surrounding the radio frequency feeding plate, an inner side of the top insulation ring being formed with a plurality of first avoiding notches corresponding to positions of the plurality of support members, the top insulation ring having a support surface for supporting a wafer, the support surface being higher than a top surface of the radio frequency feeding plate and being used for supporting the wafer carried on the support member when top ends of the plurality of support members are relatively lowered below the support surface.

[0010] An edge of the middle insulation ring is formed with a plurality of second avoiding notches, and the plurality of insulation sleeves are arranged in the plurality of second avoiding notches one by one.

[0011] Optionally, the middle insulation ring comprises an insulation ring main body and an extension part arranged around an outer side of a top end of the insulation ring main body, and the second avoiding notches are formed in the extension part.

[0012] The carrier disk further comprises a shielding assembly, the avoiding hole further comprises a shielding avoiding structure formed in the shielding assembly, the fitting sleeve comprises a conductive sleeve set arranged in the shielding avoiding structure, and the conductive sleeve set one-to-one supports the insulating sleeve set, and the supporting piece can pass through a second sleeve hole in the conductive sleeve set in a vertical direction;

[0013] The cavity comprises a loading cavity and a process cavity located on top of the loading cavity, a shielding cylinder is arranged on the sidewall of the process cavity, the bottom end of the shielding cylinder extends to the loading cavity, and the lifting assembly can drive the carrier disk to be raised to the bottom end of the shielding cylinder to be in contact with the shielding assembly, so as to separate the process cavity inside the process cavity from the loading cavity inside the loading cavity through the shielding cylinder and the carrier disk, and make the shielding cylinder and the shielding assembly electrically connected.

[0014] Optionally, the shielding assembly comprises a supporting connecting plate, a grounding shielding ring and a top shielding piece, the supporting connecting plate is arranged at the bottom of the insulating plate and grounded through the lifting assembly, the grounding shielding ring is arranged on the outer side of the main body part of the insulating ring, and the top shielding piece is arranged on the top surface of the grounding shielding ring and surrounds the outer extension part of the middle insulating ring; the shielding avoiding structure is formed in the grounding shielding ring;

[0015] The lifting assembly can drive the carrier disk to be raised to the bottom end of the shielding cylinder to be in contact with the top shielding piece, so as to separate the process cavity inside the process cavity from the loading cavity inside the loading cavity through the shielding cylinder and the carrier disk, and make the shielding cylinder and the supporting connecting plate electrically connected through the top shielding piece.

[0016] Optionally, the hole wall of the first sleeve hole and the hole wall of the second sleeve hole are both surface treated, the roughness of the hole wall of the first sleeve hole is greater than the roughness of the rest surface of the insulating sleeve set, and the roughness of the hole wall of the second sleeve hole is greater than the roughness of the rest surface of the conductive sleeve set.

[0017] Optionally, the top of the conductive sleeve set is formed with at least one positioning protrusion, the bottom of the insulating sleeve set is formed with at least one positioning groove, and the positioning protrusion is accommodated in the corresponding positioning groove of the insulating sleeve set one-to-one.

[0018] Optionally, the conductive sleeve set comprises a conductive main body part and a conductive extension part, the second sleeve hole is formed in the conductive main body part, and the conductive extension part is located on the outer side of the conductive main body part in the radial direction;

[0019] The shielding avoidance structure comprises a kit positioning groove formed on the top surface of the grounding shielding ring and a kit positioning hole penetrating from the bottom of the kit positioning groove to the bottom of the grounding shielding ring, the kit positioning groove extends along the radial direction of the grounding shielding ring to the side surface of the grounding shielding ring, the conductive main body part is arranged in the kit positioning hole and the conductive extension part is fixedly arranged in the kit positioning groove.

[0020] Optionally, the bearing device further comprises a plurality of first positioning pins and a plurality of first fixing screws, the bottom of the kit positioning groove is formed with a first pin hole and a first threaded hole penetrating to the bottom of the grounding shielding ring, the conductive extension part is formed with a first positioning hole and a first mounting hole penetrating the conductive extension part along the axis direction of the bearing disc, a plurality of the first positioning pins pass through a plurality of the first positioning holes and corresponding first pin holes one by one, and a plurality of the first fixing screws pass through a plurality of the first mounting holes and corresponding first threaded holes one by one, so as to fixedly connect the grounding shielding ring and the plurality of conductive kits.

[0021] Optionally, the top surface of the top insulating ring is formed with an annular support groove connected with the inner hole of the top insulating ring, the bottom surface of the annular support groove is formed as the support surface, and the side wall of the annular support groove is used for limiting the wafer placed on the support surface.

[0022] Optionally, the bearing device further comprises a connecting ring, the connecting ring is arranged around the axis of the bearing disc and is used for fixedly connecting with the cavity;

[0023] The support part comprises a columnar part and a connecting part, the connecting part is fixedly connected with the connecting ring, the columnar part extends along the vertical direction, and the top end of the columnar part is used for penetrating through the corresponding avoidance hole and supporting the wafer, the connecting part extends along the radial direction of the bearing disc, and one end of the connecting part towards the axis of the bearing disc is fixedly connected with the bottom end of the columnar part.

[0024] Optionally, the top end surface of the columnar part is formed with an accommodation groove, the accommodation groove extends to the side surface of the columnar part towards one side of the axis of the bearing disc, the accommodation groove is used for supporting the wafer, and the side wall of the accommodation groove is used for limiting the edge of the wafer.

[0025] Optionally, the horizontal projection shape of the columnar part is a square, and the horizontal projection shape of the inner hole of the matching sleeve corresponds to the horizontal projection shape of the columnar part.

[0026] Optionally, the top of the connecting ring is formed with a plurality of support positioning grooves, the bearing device further comprises a plurality of second positioning pins and a plurality of second fixing screws, the connecting parts are arranged in the support positioning grooves in one-to-one correspondence, the bottom of the support positioning groove is formed with a second pin hole and a second threaded hole penetrating to the bottom of the connecting ring, the connecting part is formed with a second positioning hole and a second mounting hole penetrating the connecting part along the axis direction of the bearing disc, the plurality of second positioning pins pass through the plurality of second positioning holes and the corresponding second pin holes in one-to-one correspondence, and the plurality of second fixing screws pass through the plurality of second mounting holes and the corresponding second threaded holes in one-to-one correspondence, so as to fixedly connect the connecting ring and the plurality of support parts.

[0027] As a second aspect of the present application, a semiconductor process chamber is provided, comprising a cavity and the bearing device as described above.

[0028] In the bearing device and the semiconductor process chamber provided by the present application, the accommodating sleeve is arranged in the avoiding hole of the bearing disc, and the support part penetrates through the accommodating sleeve and extends out of or shrinks into the avoiding hole, so that when the particles floating from above the bearing disc enter the avoiding hole, the particles will adhere to the accommodating sleeve, when the particles adhered in the avoiding hole are too much and need to be cleaned to restore the cleanliness of the bearing disc, only the accommodating sleeve can be taken down for cleaning, without disassembling and assembling each part in the bearing disc, so that the maintenance operation of the semiconductor process chamber is simplified, the time spent in disassembling and assembling the bearing disc in the maintenance operation is shortened, and the maintenance efficiency of the bearing disc is improved and the machine table productivity is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0029] The accompanying drawings are included to provide a further understanding of the present application, and constitute a part of the specification, and together with the specific embodiments described below, serve to explain the present application, but do not constitute a limitation on the present application. In the drawings:

[0030] Fig. 1(a) is a structural schematic diagram of a semiconductor process chamber in the related art;

[0031] Fig. 1(b) is a schematic diagram of the semiconductor process chamber in Fig. 1(a) in another state;

[0032] Figure 2 is a structural schematic diagram of a wafer support assembly in Fig. 1(a);

[0033] Figure 3 is a structural schematic diagram of a semiconductor process chamber provided by an embodiment of the present application;

[0034] Figure 4 is Figure 3 is a partial enlarged schematic diagram of the semiconductor process chamber in Fig. 1(a);

[0035] Figure 5 This is a top view of the top insulating ring in the semiconductor process chamber provided in an embodiment of the present invention;

[0036] Figure 6 yes Figure 3 A partially enlarged schematic diagram of a semiconductor process chamber;

[0037] Figure 7 This is a top view schematic diagram of the connection relationship between the grounding shielding ring and the conductive kit in the semiconductor process chamber provided in an embodiment of the present invention;

[0038] Figure 8 This is a cross-sectional schematic diagram of the connection relationship between the grounding shielding ring and the conductive kit in the semiconductor process chamber provided in an embodiment of the present invention;

[0039] Figure 9 This is a top view schematic diagram of a semiconductor process chamber provided in an embodiment of the present invention;

[0040] Figure 10 This is a schematic diagram of the connecting ring structure in the semiconductor process chamber provided in an embodiment of the present invention;

[0041] Figure 11 yes Figure 10 A cross-sectional view of the connecting ring;

[0042] Figure 12 This is a schematic diagram of the structure of the support member in the semiconductor process chamber provided in an embodiment of the present invention;

[0043] Figure 13 yes Figure 12 Top view of the central support component;

[0044] Figure 14 This is a schematic diagram of the structure of the insulating kit in the semiconductor process chamber provided in an embodiment of the present invention;

[0045] Figure 15 yes Figure 14 A top view of the insulation kit. Detailed Implementation

[0046] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0047] To address the aforementioned technical problems, as one aspect of the present invention, a carrier device is provided, disposed within the cavity 100 of a semiconductor process chamber, such as... Figure 3 , Figure 9As shown, the carrier device includes a carrier plate 200 and multiple support members 400. The carrier plate 200 has multiple clearance holes that correspond one-to-one with the positions of the multiple support members 400 and penetrate through the carrier plate 200 along the height direction. The carrier plate 200 can move up and down relative to the support members 400 so that the top of the support member 400 can pass through the clearance hole to the top of the carrier plate 200 and lift the wafer 10 on the carrier plate 200, or retract into the clearance hole and place the wafer 10 on the carrier plate 200. The carrier device also includes multiple mating sleeves 209, which are arranged one-to-one in the multiple clearance holes. The outer surface of the mating sleeve 209 fits against the outer wall of the clearance hole, and the support member 400 can pass through the mating sleeve 209 at the corresponding position.

[0048] In the carrier device provided by the present invention, a mating sleeve 209 is provided in the clearance hole of the carrier disk 200. The support member 400 extends out of or retracts into the clearance hole through the mating sleeve 209. Thus, during semiconductor processing, particles falling from above the carrier disk 200 will adhere to the mating sleeve 209 after entering the clearance hole. When there are too many particles attached to the clearance hole and cleaning is required to restore the cleanliness of the carrier disk 200, only the mating sleeve 209 can be removed for separate cleaning. It is not necessary to disassemble each component in the carrier disk 200 one by one. This simplifies the maintenance operation of the carrier device and the semiconductor process chamber, shortens the time spent on disassembling and assembling the carrier disk 200 during maintenance, and thus improves the maintenance efficiency of the carrier disk and ensures the machine's production capacity.

[0049] As an optional embodiment of the present invention, the bearing device further includes a lifting assembly for driving the bearing plate 200 to move up and down.

[0050] As an optional embodiment of the present invention, such as Figure 3 As shown, the lifting assembly may include a drive assembly (not shown) and a lifting shaft 310. A clearance through hole is formed on the bottom wall of the cavity 100. The bottom end of the lifting shaft 310 is connected to the drive assembly, and the top end of the lifting shaft 310 passes through the clearance through hole into the cavity 100 and is fixedly connected to the bottom of the support plate 200.

[0051] To ensure the hermeticity of the semiconductor process chamber, preferably, such as Figure 3 As shown, the lifting assembly also includes a bellows 321, which is sleeved on the lifting shaft 310. The top end of the bellows 321 is sealed to the bottom of the support plate 200, and the bottom end of the bellows 321 is sealed to the clearance through hole, thereby isolating the interior of the cavity 100 from the external space. Optionally, as shown... Figure 3 As shown, the lifting assembly also includes a bottom flange 322, which is fixedly installed at the bottom of the bearing plate 200 and is used to seal the bottom end of the bellows 321 to the clearance through hole.

[0052] Preferably, such as Figure 3 As shown, the interior of the lifting shaft 310 has a wiring hole that runs through the axis of the lifting shaft 310. Cables and pipes of external components can be connected to the carrier plate 200 through the wiring hole to provide electrical signals or cooling water to the carrier plate 200.

[0053] As an optional embodiment of the present invention, such as Figures 3 to 6 As shown, the carrier plate 200 includes an RF feed plate 240 and an insulating assembly, with the insulating assembly connected between the lifting assembly and the RF feed plate 240.

[0054] The clearance hole includes an insulating clearance structure formed in the insulating assembly, and the mating sleeve 209 includes an insulating kit 250 disposed in the insulating clearance structure. The support member 400 is capable of passing through a first set hole 251 in the insulating kit 250 in a vertical direction.

[0055] In this embodiment of the invention, the clearance hole includes a clearance structure formed in the insulating component. An insulating sleeve 250 is provided in the clearance structure, thereby replacing the inner wall of the clearance hole and forming a gap with the support member 400. During semiconductor processing, particles falling from the top of the carrier disk adhere to the inner wall of the first set of holes 251 in the insulating sleeve 250. When there is excessive particle matter requiring cleaning, only the insulating sleeve 250 can be removed for separate cleaning, without having to remove the insulating component and other structures from the carrier disk 200, simplifying the maintenance of the carrier device and the semiconductor process chamber.

[0056] The inventors of this invention also discovered in their research that in existing solutions, when the carrier disk 200 rises to a certain position (when the top surface of the carrier disk 200 is higher than the support surface B of the support rod 22), as shown in Figure 1(b), the support for the wafer 10 is provided by the top surface of the carrier disk 200. At this time, the top surface of the carrier disk 200 will still damage the metal film deposited on the back side of the wafer.

[0057] To solve the above-mentioned technical problems, as a preferred embodiment of the present invention, such as Figures 3 to 6As shown, the insulating assembly includes an insulating plate 210, a middle insulating ring 220, and a top insulating ring 230. The bottom of the insulating plate 210 is connected to the lifting assembly. The bottom of the middle insulating ring 220 is disposed on the insulating plate 210. The RF feed plate 240 is disposed above the middle insulating ring 220. The top insulating ring 230 surrounds the RF feed plate 240 and is disposed on the top of the middle insulating ring 220. The inner side of the top insulating ring 230 has a plurality of first clearance notches 234 corresponding one-to-one with the positions of the plurality of support members 400. The top insulating ring 230 has a support surface C for supporting the wafer 10. The support surface C is higher than the top surface of the RF feed plate 240 and is used to support the wafer 10 carried on the plurality of support members 400 when the tops of the plurality of support members 400 are relatively lowered to below the support surface C.

[0058] The edge of the central insulating ring 220 has multiple second clearance notches, and multiple insulating kits 250 are respectively arranged in the multiple second clearance notches.

[0059] In this embodiment of the invention, the top insulating ring 230 surrounds the RF feed board 240, and the support surface C of the top insulating ring 230 is higher than the top surface of the RF feed board 240. Thus, when the support plate rises to a position higher than the top of the support member 400, the wafer will be supported by the support surface C of the top insulating ring 230. This ensures that the RF feed board 240 is always in direct contact with the bottom surface of the wafer, thus guaranteeing the integrity of the back film layer of the wafer 10 and improving the wafer product yield.

[0060] Furthermore, in this embodiment of the invention, the clearance structure includes a second clearance notch formed at the edge of the central insulating ring 220, thereby utilizing the insulating kit 250 to replace the central insulating ring 220, providing the inner wall of the first set of holes 251 that form a gap with the support member 400. During semiconductor processing, particles falling from the top of the carrier tray adhere to the inner wall of the first set of holes 251 of the insulating kit 250. When there is too much particle material and cleaning is required, only the insulating kit 250 can be removed for separate cleaning, without having to remove the central insulating ring 220 and other structures from the carrier tray 200, simplifying the maintenance of the semiconductor process chamber.

[0061] As an optional embodiment of the present invention, such as Figure 5 , Figure 6 As shown, an annular support groove 233 is formed on the top surface of the top insulating ring 230, which is connected to the inner hole of the top insulating ring 230. The bottom surface of the annular support groove 233 is formed as a support surface C, and the sidewall of the annular support groove 233 is used to limit the wafer 10 placed on the support surface C.

[0062] In this embodiment of the invention, the insulating plate 210, the middle insulating ring 220, the top insulating ring 230, and the multiple insulating kits 250 are all made of insulating material, for example, ceramic material. The RF feed board 240 is used to connect to the lower power supply via a cable inside the lifting shaft 310 to provide RF signals to the wafer 10 above it in the semiconductor process.

[0063] As an optional embodiment of the present invention, such as Figures 4 to 6 As shown, the top insulating ring 230 includes an insulating ring extension portion 231 and an insulating ring body portion 232. The insulating ring extension portion 231 is disposed around the outside of the insulating ring body portion 232, and the bottom surface of the insulating ring extension portion 231 is flush with the bottom surface of the insulating ring body portion 232.

[0064] As an optional embodiment of the present invention, such as Figure 3 , Figure 4 , Figure 6 As shown, a first annular receiving groove is formed on the top edge of the central insulating ring 220, and the central insulating ring 220 supports the top insulating ring 230 through the bottom of the first annular receiving groove. The radial dimension of the second clearance notch of the central insulating ring 220 is larger than the radial dimension of the first annular receiving groove of the central insulating ring 220. Figure 14 , Figure 15 As shown, the insulating kit 250 includes an insulating body portion 252 and an insulating extension portion 253. The top of the insulating body portion 252 is flush with the top of the central insulating ring 220, and the top of the insulating extension portion 253 is flush with the bottom of the first annular receiving groove.

[0065] As a preferred embodiment of the present invention, such as Figure 3 , Figure 6 As shown, the central insulating ring 220 includes an insulating ring body and an extension 221 surrounding the outer side of the top of the insulating ring body, and a second clearance notch is formed in the extension 221.

[0066] The carrier plate 200 also includes a shielding assembly, and the clearance hole also includes a shielding clearance structure formed in the shielding assembly. The mating sleeve 209 includes a conductive kit 290 disposed in the shielding clearance structure, and the conductive kit 290 supports the insulating kit 250 in a one-to-one correspondence. The support member 400 can pass through the second set of holes 291 in the conductive kit 290 in the vertical direction.

[0067] like Figure 3As shown, the cavity 100 includes a loading cavity 110 and a process cavity 120 located at the top of the loading cavity 110. A shielding cylinder 123 is provided on the side wall of the process cavity 120. The bottom end of the shielding cylinder 123 extends to the loading cavity 110. The lifting assembly can drive the carrier plate 200 to rise until the shielding assembly contacts the bottom end of the shielding cylinder 123, so as to separate the process cavity inside the process cavity 120 from the loading cavity inside the loading cavity 110 through the shielding cylinder 123 and the carrier plate 200, and to electrically connect the shielding cylinder 123 to the shielding assembly.

[0068] In this embodiment of the invention, the shielding component can separate the process cavity inside the process cavity 120 from the loading cavity inside the loading cavity 110 when the carrier disk 200 is raised to contact the bottom end of the shielding cylinder 123, and at the same time separate the electric field in the process cavity from the electric field below, so as to ensure the process effect of the semiconductor process inside the semiconductor process cavity.

[0069] Furthermore, in this embodiment of the invention, the shielding component has a clearance structure corresponding to the support member 400, and a conductive kit 290 is provided in the clearance structure, so that the clearance hole portion is formed in the conductive kit 290. That is, the conductive kit 290 replaces the shielding component to provide the inner wall of the second set of holes 291 that form a gap between the shielding component and the support member 400. During semiconductor processing, particles falling from the top of the carrier disk adhere to the inner wall of the second set of holes 291 of the conductive kit 290. When there are too many particles and cleaning is required, only the conductive kit 290 can be removed for separate cleaning, without having to remove the shielding component and other structures from the carrier disk 200, thus simplifying the maintenance of the carrier device and the semiconductor process chamber.

[0070] In one optional embodiment of the present invention, the shielding assembly includes a supporting connecting plate 260, a grounding shielding ring 270, and a top shielding member 280. The supporting connecting plate 260 is disposed at the bottom of the insulating plate 210 and grounded via a lifting assembly. The grounding shielding ring 270 is disposed around the outer side of the main body of the insulating ring. The top shielding member 280 is disposed around the outer extension 221 of the central insulating ring 220 on the top surface of the grounding shielding ring 270 (i.e., the edge of the top surface of the grounding shielding extends beyond the outer extension 221 and supports the bottom of the grounding shielding ring 270). Figure 3 , Figure 7 , Figure 8 As shown, the clearance structure is formed in the grounding shield ring 270;

[0071] The lifting assembly can drive the carrier plate 200 to rise until the top shield 280 contacts the bottom end of the shielding cylinder 123, so as to separate the process cavity inside the process cavity 120 from the loading cavity inside the loading cavity 110 through the shielding cylinder 123 and the carrier plate 200, and make the shielding cylinder 123 electrically connected to the support connecting plate 260 through the top shield 280.

[0072] In this embodiment of the invention, the support connecting plate 260, the grounding shielding ring 270, the top shielding member 280, and the conductive kit 290 are all conductors (e.g., they can be made of metal). The top shielding member 280 is electrically connected to the support connecting plate 260 through the grounding shielding ring 270 and the conductive kit 290. Furthermore, the support connecting plate 260 is grounded through the corresponding circuit inside the lifting shaft 310. Thus, when the carrying plate 200 is raised to the point where the top shielding member 280 contacts the bottom end of the shielding cylinder 123, the process cavity inside the process cavity 120 is separated from the loading cavity inside the loading cavity 110. At the same time, the electric field in the process cavity is separated from the electric field below, ensuring the process effect of the semiconductor process performed inside the semiconductor process cavity.

[0073] Furthermore, in this embodiment of the invention, the grounding shield ring 270 has a clearance structure corresponding to the support member 400, and a conductive kit 290 is provided in the clearance structure, so that the clearance hole portion is formed in the conductive kit 290. That is, the conductive kit 290 replaces the grounding shield ring 270 to provide the inner wall of the second set of holes 291 that form a gap with the support member 400. During semiconductor processing, particles falling from the top of the carrier disk adhere to the inner wall of the second set of holes 291 of the conductive kit 290. When there are too many particles and cleaning is required, only the conductive kit 290 can be removed for separate cleaning, without having to remove the grounding shield ring 270 and other structures from the carrier disk 200, simplifying the maintenance of the carrier device and the semiconductor process chamber.

[0074] As an optional embodiment of the present invention, such as Figure 3 , Figure 9 As shown, the process chamber 120 includes a support ring 121 and a ceramic ring 122. The bottom end of the ceramic ring 122 is sealed to the top opening of the loading chamber 110 through the support ring 121. The shielding cylinder 123 is coaxial with the ceramic ring 122 and is disposed on the inner wall of the ceramic ring 122.

[0075] To improve the adsorption capacity of the insulating kit 250 and the conductive kit 290 for pollutants and particulate matter, in a preferred embodiment of the present invention, the walls of the first set of holes 251 and the walls of the second set of holes 291 are both surface treated, and the roughness of the wall of the first set of holes 251 is greater than the roughness of the rest of the surface of the insulating kit 250, and the roughness of the wall of the second set of holes 291 is greater than the roughness of the rest of the surface of the conductive kit 290.

[0076] In this embodiment of the invention, the walls of the first set of holes 251 and the walls of the second set of holes 291 are both surface treated to increase their roughness, thereby increasing the adsorption capacity of the insulating kit 250 and the conductive kit 290 for contaminants and particulate matter, reducing the cleaning and maintenance frequency of the bearing plate, and further ensuring the machine's production capacity.

[0077] To further ensure the alignment accuracy between the columnar portion 410 and the clearance hole, as a preferred embodiment of the present invention, such as Figures 6 to 8 As shown, at least one positioning protrusion 294 is formed on the top of the conductive kit 290, and at least one positioning groove is formed on the bottom of the insulating kit 250. The positioning protrusion 294 is correspondingly housed in the positioning groove of the corresponding insulating kit 250.

[0078] As an optional embodiment of the present invention, such as Figure 6 , Figure 7 As shown, the conductive kit 290 includes a conductive body portion 292 and a conductive extension portion 293. A second sleeve hole 291 is formed in the conductive body portion 292, and the conductive extension portion 293 is located on the radially outer side of the conductive body portion 292.

[0079] like Figure 7 As shown, the clearance structure includes a kit positioning groove 271 formed on the top surface of the grounding shield ring 270 and a kit positioning hole 272 extending from the bottom of the kit positioning groove 271 to the bottom of the grounding shield ring 270. The kit positioning groove 271 extends radially along the grounding shield ring 270 to connect with the side of the grounding shield ring 270. The conductive body portion 292 is disposed in the kit positioning hole 272 and the conductive extension portion 293 is fixedly disposed in the kit positioning groove 271.

[0080] Optionally, such as Figure 3 As shown, the carrier plate 200 also includes an RF connection plate 201, a lower cooling plate 202, and an upper cooling plate 203, which are stacked sequentially from bottom to top between the insulating plate 210 and the RF feed plate 240. The RF connection plate 201 is used to transmit the signal in the cable inside the lifting shaft 310 to the RF feed plate 240. The lower cooling plate 202 and the upper cooling plate 203 are used to connect to the cooling pipe inside the lifting shaft 310 so as to cool the RF feed plate 240 through circulating coolant.

[0081] As an optional embodiment of the present invention, the conductive kit 290 can be fixedly connected to the grounding shield ring 270 by means of a pin and a threaded fastener, specifically, as shown in the example below. Figures 6 to 8 As shown, the support device also includes a plurality of first positioning pins 273 and a plurality of first fixing screws 274. The bottom of the kit positioning groove 271 is formed with a first pin hole and a first threaded hole that penetrate to the bottom of the grounding shield ring 270. The conductive extension 293 is formed with a first positioning hole and a first mounting hole that penetrate the conductive extension 293 along the axial direction of the support plate 200. The plurality of first positioning pins 273 pass through the plurality of first positioning holes and the corresponding first pin holes in a one-to-one correspondence. The plurality of first fixing screws 274 pass through the plurality of first mounting holes and the corresponding first threaded holes in a one-to-one correspondence, so as to fix the grounding shield ring 270 to the plurality of conductive kits 290.

[0082] As an optional embodiment of the present invention, such as Figure 3 , Figure 6 As shown, the bearing device also includes a connecting ring 500, which is arranged around the axis of the bearing disk 200 and fixedly connected to the cavity 100; as Figure 3 , Figure 6 , Figure 12 As shown, the support member 400 includes a columnar portion 410 and a connecting portion 420. The connecting portion 420 is fixedly connected to the connecting ring 500. The columnar portion 410 extends in a vertical direction, and the top end of the columnar portion 410 is used to pass through the corresponding clearance hole and support the wafer. The connecting portion 420 extends radially along the carrier disk 200, and one end of the connecting portion 420 facing the axis of the carrier disk 200 is fixedly connected to the bottom end of the columnar portion 410.

[0083] Figures 1(a) and 1(b) are schematic diagrams of a semiconductor process chamber in the related art. As shown in Figures 1(a) and 1(b), the reaction chamber structure includes a chamber 100, a carrier disk 200 disposed in the chamber 100, and a wafer support assembly 20. The wafer support assembly 20 includes a connecting ring 21 and three support rods 22 (i.e., ejector pins) fixedly disposed on the connecting ring 21 and evenly distributed along the circumference. The connecting ring 21 is fixedly connected to the bottom surface of the chamber 100, and the carrier disk 200 can move up and down within the chamber 100.

[0084] Figure 2 This is a schematic diagram of the wafer support assembly 20. The top of the support rod 22 has a support limiting part 23, which has a limiting surface A and a support surface B. When a metal thin film has been deposited on the back side of the wafer 10 except for the edge region, the support surface B of the support rod 22 provides support to the edge of the wafer 10, preventing damage to the metal thin film already deposited on the back side of the wafer. Furthermore, the limiting surface A is an inclined surface, which guides and limits the wafer, ensuring the stability of the wafer's horizontal position.

[0085] The inventors of this invention also discovered during their research that the main reason for the rapid contamination of the carrier disk when using the existing semiconductor process chamber for semiconductor processes is that the clearance hole formed on the carrier disk 200 to cooperate with the support rod 22 needs to be designed to allow the support rod 22 and its top support limiting part 23 to pass freely. Therefore, a large gap needs to be left between the inner wall of the clearance hole and the support rod 22. However, when the wafer 10 is placed on the support rod 22, as shown in Figure 1(a), this gap cannot be completely covered. As a result, particles in the cavity 100 can easily fall into the gap and be adsorbed on the hole wall of the clearance hole and the surface of the carrier disk components, causing contamination of the carrier disk. When the number of particles accumulates to a certain extent, the components in the carrier disk that adsorb particles need to be replaced and cleaned as a whole, which shortens the maintenance cycle, affects production efficiency, and brings inconvenience to the use and maintenance of the semiconductor process chamber.

[0086] To solve the above-mentioned technical problems, as a preferred embodiment of the present invention, such as Figure 3 , Figure 6 As shown, the cross-sectional area of ​​the columnar portion 410 at any height is no greater than the cross-sectional area at any height below it.

[0087] In this embodiment of the invention, the cross-sectional area of ​​the columnar portion 410 at any height is not greater than the cross-sectional area at any height below it. Therefore, after the top of the columnar portion 410 passes upward through the clearance hole, the cross-section of the portion within the clearance hole is not less than the cross-section of the portion extending above the support plate 200. Consequently, when the shape and size of the clearance hole correspond to the maximum cross-section of the columnar portion 410, the columnar portion 410 can always maintain a filling effect on the internal space of the clearance hole. That is, the gap between the columnar portion 410 and the inner wall of the clearance hole will not expand after the top of the columnar portion 410 extends above the support plate 200, thereby reducing the number of particles entering the gap between the columnar portion 410 and the inner wall of the clearance hole. This ensures the surface cleanliness of structures such as the support plate 200, extends the maintenance cycle of the semiconductor process chamber, and guarantees machine production efficiency.

[0088] As an optional embodiment of the present invention, such as Figure 12 , Figure 13 As shown, a receiving groove 411 is formed on the top end face of the columnar portion 410. The receiving groove 411 extends to the side of the columnar portion 410 on one side facing the axis of the support disk 200. The receiving groove 411 is used to support the wafer 10, and the sidewall of the receiving groove 411 is used to limit the edge of the wafer 10.

[0089] To ensure the surface cleanliness of structural components such as the bearing plate 200, as a preferred embodiment of the present invention, such as Figure 9 , Figure 13As shown, the horizontal projection shape of the columnar part 410 is square, and the horizontal projection shape of the inner hole of the fitting sleeve 209 (i.e., the first sleeve hole 251 and the second sleeve hole 291) corresponds to the horizontal projection shape of the columnar part 410.

[0090] In this embodiment of the invention, the horizontal projection shape of the inner hole of the columnar part 410 and the mating sleeve 209 is square. This allows the ridge structure on the inner wall of the mating sleeve 209 to improve the adsorption effect of the mating sleeve 209 on particulate matter, thereby reducing the number of particles attached to the surface of other components and further ensuring the surface cleanliness of structural components such as the bearing disk 200.

[0091] As an optional embodiment of the present invention, the connecting portion 420 of the support member 400 can be fixedly connected to the connecting ring 500 by means of a pin and a threaded fastener, specifically, as shown in the example below. Figure 6 , Figure 13 As shown, the top of the connecting ring 500 has a plurality of support positioning grooves 510. The bearing device also includes a plurality of second positioning pins 520 and a plurality of second fixing screws 530. The connecting part 420 is correspondingly disposed in the support positioning groove 510. The bottom of the support positioning groove 510 has a second pin hole 511 and a second threaded hole 512 that penetrate to the bottom of the connecting ring 500. The connecting part 420 has a second positioning hole 430 and a second mounting hole 440 that penetrate the connecting part 420 along the axial direction of the bearing plate 200. The plurality of second positioning pins 520 pass through the plurality of second positioning holes 430 and the corresponding second pin holes 511, and the plurality of second fixing screws 530 pass through the plurality of second mounting holes 440 and the corresponding second threaded holes 512, so as to fix the connecting ring 500 to the plurality of support members 400.

[0092] In this embodiment of the invention, the second positioning pin 520 and the support positioning groove 510 on the connecting ring 500 together limit the horizontal position of the connecting part 420 of the support member 400, and the second threaded hole 512 securely connects the connecting part 420 and the connecting ring 500, thereby ensuring the relative position accuracy between the columnar part 410 of the support member 400 and the connecting ring 500, and further ensuring the alignment accuracy between the columnar part 410 and the clearance hole.

[0093] Preferably, such as Figure 10 As shown, the support positioning groove 510 extends radially along the connecting ring 500, and each support positioning groove 510 has a second pin hole 511 and a second threaded hole 512 formed therein.

[0094] In this embodiment of the invention, the support positioning groove 510 extends radially along the connecting ring 500, and each support member 400 is aligned with the connecting ring 500 only by a second positioning pin 520. Thus, the sidewall of the support positioning groove 510 and the second positioning pin 520 are combined to limit the horizontal position of the connecting part 420, which simplifies the device structure while ensuring the alignment accuracy between the columnar part 410 and the clearance hole.

[0095] As an optional embodiment of the present invention, such as Figure 13 As shown, the connecting portion 420 includes an extension portion 421 and a limiting portion 422 that are connected to each other. The extension portion 421 and the limiting portion 422 are distributed radially along the connecting ring 500. The extension portion 421 is connected between the limiting portion 422 and the bottom end of the columnar portion 410. The dimension of the extension portion 421 in the radial direction perpendicular to the connecting ring 500 is larger than the dimension of the extension portion 421 in the radial direction perpendicular to the connecting ring 500. The side wall of the support positioning groove 510 is used to limit the side wall of the extension portion 421 to limit the circumferential position of the support member 400.

[0096] As a preferred embodiment of the present invention, such as Figure 6 , Figure 10 As shown, the inner wall of the connecting ring 500 has multiple protrusions 550 extending along the axis of the connecting ring 500 and corresponding one-to-one with the circumferential positions of the multiple support positioning grooves 510. The support positioning grooves 510 extend to the protrusions 550. That is, the connecting ring 500 is widened only at the position where the support member 400 is provided, and the cross-section is narrowed at other positions, thereby reducing the overall weight of the connecting ring 500, ensuring the verticality of the multiple columnar portions 410, and further ensuring the alignment accuracy between the columnar portions 410 and the clearance holes.

[0097] As an optional embodiment of the present invention, such as Figure 3 As shown, the bearing device also includes a support adapter 600. The bottom of the connecting ring 500 is fixedly connected to the bottom wall of the cavity 100 through the support adapter 600, so that the bottom surface of the connecting ring 500 and the bottom wall of the cavity 100 are spaced apart in the vertical direction.

[0098] As an optional embodiment of the present invention, such as Figure 3 As shown, the support adapter 600 includes an upper flange, a lower flange, and a connecting post connecting the two. Figure 10 As shown, the connecting ring 500 has a connecting portion 540, which is fastened to the upper flange of the support adapter 600 by fasteners (e.g., bolts), and the lower flange of the support adapter 600 is fastened to the bottom wall of the gas 100 by fasteners (e.g., bolts).

[0099] As a second aspect of the present invention, a semiconductor process chamber is provided, such asFigure 3 As shown, the semiconductor process chamber includes a cavity 100 and a carrier device provided in this embodiment of the invention.

[0100] In the semiconductor process chamber provided by this invention, a mating sleeve 209 is provided in the clearance hole of the carrier disk 200. The support member 400 extends out of or retracts into the clearance hole through the mating sleeve 209. Thus, during semiconductor processing, particles falling from above the carrier disk 200 will adhere to the mating sleeve 209 after entering the clearance hole. When there are too many particles attached to the clearance hole and cleaning is required to restore the cleanliness of the carrier disk 200, only the mating sleeve 209 can be removed for separate cleaning, without having to disassemble each component in the carrier disk 200. This simplifies the maintenance operation of the semiconductor process chamber, shortens the time spent on disassembling and assembling the carrier disk 200 during maintenance, and thus improves the maintenance efficiency of the carrier disk and ensures the machine's production capacity.

[0101] As an optional embodiment of the present invention, such as Figure 3 As shown, the lifting assembly may include a drive assembly and a lifting shaft 310. A clearance through hole is formed on the bottom wall of the cavity 100. The bottom end of the lifting shaft 310 is connected to the drive assembly, and the top end of the lifting shaft 310 passes through the clearance through hole into the cavity 100 and is fixedly connected to the bottom of the support plate 200.

[0102] To ensure the hermeticity of the semiconductor process chamber, preferably, such as Figure 3 As shown, the lifting assembly also includes a bellows 321, which is sleeved on the lifting shaft 310. The top end of the bellows 321 is sealed to the bottom of the support plate 200, and the bottom end of the bellows 321 is sealed to the clearance through hole, thereby isolating the interior of the cavity 100 from the external space. Optionally, as shown... Figure 3 As shown, the lifting assembly also includes a bottom flange 322, which is fixedly installed at the bottom of the bearing plate 200 and is used to seal the bottom end of the bellows 321 to the clearance through hole.

[0103] As a preferred embodiment of the present invention, such as Figure 3 As shown, the carrier plate 200 also includes a shielding assembly, and the clearance hole also includes a shielding clearance structure formed in the shielding assembly. The mating sleeve 209 includes a conductive kit 290 disposed in the shielding clearance structure, and the conductive kit 290 supports the insulating kit 250 in a one-to-one correspondence. The support member 400 can pass through the second set hole 291 in the conductive kit 290 in the vertical direction.

[0104] The cavity 100 includes a loading cavity 110 and a process cavity 120 located at the top of the loading cavity 110. A shielding cylinder 123 is provided on the side wall of the process cavity 120. The bottom end of the shielding cylinder 123 extends to the loading cavity 110. The lifting assembly can drive the carrier plate 200 to rise until the shielding assembly contacts the bottom end of the shielding cylinder 123, so as to separate the process cavity inside the process cavity 120 from the loading cavity inside the loading cavity 110 through the shielding cylinder 123 and the carrier plate 200, and to electrically connect the shielding cylinder 123 to the shielding assembly.

[0105] As an optional embodiment of the present invention, such as Figure 3 , Figure 9 As shown, the process chamber 120 includes a support ring 121 and a ceramic ring 122. The bottom end of the ceramic ring 122 is sealed to the top opening of the loading chamber 110 through the support ring 121. The shielding cylinder 123 is coaxial with the ceramic ring 122 and is disposed on the inner wall of the ceramic ring 122.

[0106] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A carrier device for being disposed within a cavity of a semiconductor process chamber, characterized in that, The carrier device includes a carrier plate and multiple support members. The carrier plate has multiple clearance holes that correspond one-to-one with the positions of the multiple support members and penetrate through the carrier plate along the height direction. The carrier plate can move up and down relative to the support members so that the top of the support member can protrude through the clearance hole to the top of the carrier plate and lift the wafer on the carrier plate, or retract into the clearance hole and place the wafer on the carrier plate. The carrier device also includes multiple mating sleeves, which are correspondingly disposed in the multiple clearance holes. The outer surface of the mating sleeve fits against the outer wall of the clearance hole, and the support member can pass through the mating sleeve at the corresponding position. The mating sleeve includes an insulating kit and a conductive kit. The conductive kit supports the insulating kit one-to-one, and the conductive kit is detachably fixed to the shielding assembly by fasteners.

2. The bearing device according to claim 1, characterized in that, The carrying device further includes a lifting assembly for driving the lifting motion of the carrying plate. The carrying plate includes an RF feed plate and an insulating assembly, and the insulating assembly is connected between the lifting assembly and the RF feed plate. The clearance hole includes an insulating clearance structure formed in the insulating assembly, the insulating kit is disposed in the insulating clearance structure, and the support member is capable of passing through a first set of holes in the insulating kit in a vertical direction.

3. The bearing device according to claim 2, characterized in that, The insulating assembly includes an insulating plate, a middle insulating ring, and a top insulating ring. The bottom of the insulating plate is connected to the lifting assembly. The bottom of the middle insulating ring is disposed on the insulating plate. The radio frequency feed plate is disposed above the middle insulating ring. The top insulating ring surrounds the radio frequency feed plate and is disposed on the top of the middle insulating ring. The inner side of the top insulating ring has a plurality of first clearance notches corresponding one-to-one with the positions of the plurality of support members. The top insulating ring has a support surface for supporting the wafer. The support surface is higher than the top surface of the radio frequency feed plate and is used to support the wafer carried on the support member when the tops of the plurality of support members are relatively lowered to below the support surface. The edge of the central insulating ring has multiple second clearance notches, and multiple insulating components are respectively disposed in the multiple second clearance notches.

4. The bearing device according to claim 3, characterized in that, The central insulating ring includes an insulating ring body and an extension portion surrounding the outer side of the top end of the insulating ring body, and the second clearance notch is formed in the extension portion; The carrier plate also includes a shielding assembly, the clearance hole further includes a shielding clearance structure formed in the shielding assembly, the conductive kit is disposed in the shielding clearance structure, and the support member can pass through the second set of holes in the conductive kit in the vertical direction; The cavity includes a loading cavity and a process cavity located at the top of the loading cavity. A shielding cylinder is provided on the side wall of the process cavity, and the bottom end of the shielding cylinder extends to the loading cavity. The lifting assembly can drive the carrier plate to rise until the shielding assembly contacts the bottom end of the shielding cylinder, so as to separate the process cavity inside the process cavity from the loading cavity inside the loading cavity through the shielding cylinder and the carrier plate, and to electrically connect the shielding cylinder to the shielding assembly.

5. The bearing device according to claim 4, characterized in that, The shielding assembly includes a supporting connecting plate, a grounding shielding ring, and a top shielding component. The supporting connecting plate is disposed at the bottom of the insulating plate and grounded through the lifting assembly. The grounding shielding ring is disposed around the outside of the main body of the insulating ring. The top shielding component is disposed around the outer extension of the middle insulating ring on the top surface of the grounding shielding ring. The shielding clearance structure is formed in the grounding shielding ring. The lifting assembly can drive the carrier plate to rise until the top shielding member contacts the bottom end of the shielding cylinder, so as to separate the process cavity inside the process cavity from the loading cavity inside the loading cavity through the shielding cylinder and the carrier plate, and make the shielding cylinder electrically connected to the support connecting plate through the top shielding member.

6. The bearing device according to claim 4, characterized in that, The walls of both the first and second sets of holes have undergone surface treatment, and the roughness of the wall of the first set of holes is greater than the roughness of the rest of the surfaces of the insulating kit, and the roughness of the wall of the second set of holes is greater than the roughness of the rest of the surfaces of the conductive kit.

7. The bearing device according to claim 4, characterized in that, The conductive kit has at least one positioning protrusion on its top and at least one positioning groove on its bottom, with the positioning protrusion being received in the corresponding positioning groove of the insulating kit.

8. The bearing device according to claim 5, characterized in that, The conductive kit includes a conductive body and a conductive extension, wherein the second aperture is formed in the conductive body and the conductive extension is located on the radially outer side of the conductive body; The shielding and avoidance structure includes a kit positioning groove formed on the top surface of the grounding shield ring and a kit positioning hole extending from the bottom of the kit positioning groove to the bottom of the grounding shield ring. The kit positioning groove extends radially along the grounding shield ring to connect with the side of the grounding shield ring. The conductive main body is disposed in the kit positioning hole and the conductive extension is fixedly disposed in the kit positioning groove.

9. The bearing device according to claim 8, characterized in that, The supporting device further includes a plurality of first positioning pins and a plurality of first fixing screws. The bottom of the kit positioning groove is formed with a first pin hole and a first threaded hole that penetrate to the bottom of the grounding shield ring. The conductive extension is formed with a first positioning hole and a first mounting hole that penetrate the conductive extension along the axial direction of the supporting plate. The plurality of first positioning pins pass through the plurality of first positioning holes and the corresponding first pin holes in a one-to-one correspondence. The plurality of first fixing screws pass through the plurality of first mounting holes and the corresponding first threaded holes in a one-to-one correspondence, so as to fix the grounding shield ring to the plurality of conductive kits.

10. The bearing device according to claim 3, characterized in that, An annular support groove is formed on the top surface of the top insulating ring, which is connected to the inner hole of the top insulating ring. The bottom surface of the annular support groove is formed as the support surface, and the sidewall of the annular support groove is used to limit the position of the wafer placed on the support surface.

11. The bearing device according to any one of claims 1 to 10, characterized in that, The bearing device further includes a connecting ring, which is arranged around the axis of the bearing disk and is used for fixed connection with the cavity; The support includes a columnar portion and a connecting portion. The connecting portion is fixedly connected to the connecting ring. The columnar portion extends vertically, and the top end of the columnar portion is used to pass through the corresponding clearance hole and support the wafer. The connecting portion extends radially along the carrier disk, and one end of the connecting portion facing the axis of the carrier disk is fixedly connected to the bottom end of the columnar portion.

12. The bearing device according to claim 11, characterized in that, A receiving groove is formed on the top end face of the columnar portion. The receiving groove extends to the side of the columnar portion on one side facing the axis of the support disk. The receiving groove is used to support the wafer, and the sidewall of the receiving groove is used to limit the edge of the wafer.

13. The bearing device according to claim 12, characterized in that, The horizontal projection shape of the columnar portion is square, and the horizontal projection shape of the inner hole of the mating sleeve corresponds to the horizontal projection shape of the columnar portion.

14. The bearing device according to claim 13, characterized in that, The top of the connecting ring has multiple support positioning grooves. The bearing device also includes multiple second positioning pins and multiple second fixing screws. The connecting parts are correspondingly arranged in the support positioning grooves. The bottom of the support positioning grooves has a second pin hole and a second threaded hole that penetrate to the bottom of the connecting ring. The connecting parts have a second positioning hole and a second mounting hole that penetrate the connecting parts along the axial direction of the bearing plate. Multiple second positioning pins pass through multiple second positioning holes and corresponding second pin holes, and multiple second fixing screws pass through multiple second mounting holes and corresponding second threaded holes, so as to fix the connecting ring to multiple supporting members.

15. A semiconductor process chamber, characterized in that, It includes the cavity and the support device as described in any one of claims 1 to 14.

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