Method for polishing titanium alloys and device therefor

Abstract

The application discloses a method and device for polishing titanium alloy, and the device for polishing titanium alloy comprises a supporting part, a column, a guide part, a main shaft, a polishing part, a pressure sensing device and a workbench, wherein the guide part can move reciprocatingly along the Z direction on the column, the main shaft can move reciprocatingly along the Y direction on the guide part, the polishing part is used for placing a polishing equipment, the pressure sensing device is used for detecting the pressure between the polishing equipment and the material to be polished, and the workbench is used for setting the material to be polished and can move reciprocatingly along the X direction on the supporting part. The power device is used for providing power for the reciprocating movement of the workbench along the X direction on the supporting part, the reciprocating movement of the guide part along the Z direction on the column and the reciprocating movement of the main shaft along the Y direction on the guide part. Thus, the titanium alloy polishing process is realized by using a single device, the titanium alloy polishing process is better controlled, the titanium alloy polishing efficiency is remarkably improved, and the titanium alloy polishing cost is greatly reduced.

Description

Technical Field

[0001] This invention belongs to the field of alloy polishing technology, and specifically relates to a method and apparatus for polishing titanium alloys. Background Technology

[0002] Before certain processes, titanium alloy parts require a mirror-like surface finish, meaning the surface roughness must not exceed Ra0.4. Titanium alloys are characterized by high chemical reactivity during polishing, low thermal conductivity, and high viscosity. During grinding, they readily react with abrasive tools, making many abrasives unsuitable for polishing titanium alloys. Furthermore, at high temperatures, titanium alloys readily react with atmospheric nitrogen (N2), hydrogen (H2), carbon dioxide (CO), carbon dioxide (CO2), and water vapor; therefore, the polishing temperature must be kept relatively low during polishing.

[0003] Traditional polishing processes are complex, primarily involving grinding and polishing. The grinding process uses 30-grit, 320-grit, and 1000-grit abrasive paper to grind the titanium alloy material, while the polishing process includes rough polishing, polishing, and mirror polishing. The equipment used for grinding is typically a horizontal grinder or a semi-automatic grinder, while the equipment used for polishing is typically a polishing machine. Using a horizontal grinder or semi-automatic grinder for grinding results in low polishing efficiency and poor surface roughness of the titanium alloy after grinding, requiring a complex subsequent polishing process to meet the process requirements, which is unsuitable for industrial mass production. Furthermore, using different equipment for grinding and polishing processes leads to low polishing efficiency and significantly increases operating costs. Summary of the Invention

[0004] This invention aims to at least partially solve one of the technical problems in related technologies. Therefore, one object of this invention is to provide a method and apparatus for polishing titanium alloys. This allows for the realization of the titanium alloy polishing process using a single device, better control of the titanium alloy polishing process, significantly improved titanium alloy polishing efficiency, and greatly reduced titanium alloy polishing costs.

[0005] In one aspect of the invention, an apparatus for polishing titanium alloys is provided. According to an embodiment of the invention, the apparatus includes:

[0006] Support section;

[0007] A column is provided on one side of the support portion and is perpendicular to the support portion;

[0008] A guide portion is disposed on the column and is arranged parallel to the support portion. The guide portion can reciprocate along the Z direction on the column.

[0009] a main shaft, which is arranged on the guide part and is parallel to the column, and which is reciprocally movable along the Y direction on the guide part;

[0010] a polishing part, which is arranged on the main shaft and is close to the supporting part, and which is used for placing a polishing device;

[0011] a pressure sensing device, which is arranged on the polishing part and is used for detecting the pressure between the polishing device and the material to be polished;

[0012] a workbench, which is arranged on the supporting part and is below the polishing device, and which is used for placing the material to be polished, and which is reciprocally movable along the X direction on the supporting part;

[0013] a power device, which is used for providing power for the reciprocally movement of the workbench along the X direction on the supporting part, the reciprocally movement of the guide part along the Z direction on the column, and the reciprocally movement of the main shaft along the Y direction on the guide part.

[0014] The device for polishing titanium alloy according to the embodiments of the present application provides power for the reciprocally movement of the workbench along the X direction on the supporting part, the reciprocally movement of the guide part along the Z direction on the column, and the reciprocally movement of the main shaft along the Y direction on the guide part by arranging the power device, so that only the type of the polishing device arranged on the polishing part needs to be changed during the polishing process of the material to be polished, and the grinding and polishing of the material to be polished can be realized; the pressure sensing device arranged on the polishing part can better grind and polish the material to be polished by adjusting and controlling the pressure between different polishing devices and the material to be polished. Thus, the titanium alloy polishing process is realized by using a single device, the titanium alloy polishing process is better controlled, the titanium alloy polishing efficiency is significantly improved, and the titanium alloy polishing cost is greatly reduced.

[0015] In addition, the device according to the above embodiments of the present application can have the following additional technical features:

[0016] In some embodiments of the present application, a control unit is further included, which is connected with the power device.

[0017] In some embodiments of the present application, a driving device is further included, which drives the polishing part to rotate.

[0018] In some embodiments of the present application, the polishing device includes a grinding part and a polishing part.

[0019] In some embodiments of the present application, the grinding part includes a rough grinding part and a fine grinding part.

[0020] In some embodiments of the application, the coarse grinding member comprises at least one of 30 grit sandpaper and a fiber buffing wheel.

[0021] In some embodiments of the application, the fine grinding member comprises 320 grit sandpaper and 1000 grit sandpaper.

[0022] In some embodiments of the application, the polishing member comprises at least one of a wool wheel, a nylon wheel, a cloth wheel, a hemp wheel, and a wire wheel.

[0023] In yet another aspect of the application, the application provides a method for polishing titanium alloy using the device described in the above embodiments. According to embodiments of the application, the method comprises:

[0024] (1) placing the material to be polished on the worktable;

[0025] (2) mounting the polishing equipment on the polishing part, moving the guide part along the Z direction on the column reciprocally, until the pressure between the polishing equipment and the material to be polished reaches a first preset pressure, moving the worktable along the X direction on the support part reciprocally, moving the spindle along the Y direction on the guide part reciprocally, so as to achieve grinding and polishing of the material to be polished.

[0026] According to the method of embodiments of the application, by setting the guide part to move along the Z direction on the column reciprocally, the worktable to move along the X direction on the support part reciprocally, and the spindle to move along the Y direction on the guide part reciprocally, only the polishing equipment provided by the polishing part needs to be replaced, and grinding and polishing of the material to be polished can be achieved; the pressure between different polishing equipment and the material to be polished is regulated in sequence, so that grinding and polishing of the material to be polished is better. Thus, the polishing process of titanium alloy is better regulated, the polishing efficiency of titanium alloy is significantly improved, and the polishing cost of titanium alloy is greatly reduced.

[0027] In addition, the method according to the above embodiments of the application can also have the following additional technical features: In some embodiments of the application, step (2) comprises:

[0028] (2-1) mounting a coarse grinding member on the polishing part, moving the guide part along the Z direction on the column reciprocally until the pressure between the coarse grinding member and the material to be polished reaches a second preset pressure, moving the worktable along the X direction on the support part reciprocally, and moving the spindle along the Y direction on the guide part reciprocally, so as to achieve

[0029] coarse grinding of the material to be polished;

[0030] 5(2-2) mounting a fine grinding member on the polishing part, moving the guide part along the Z direction on the column reciprocally,

[0031] When the pressure between the grinding part and the material to be polished reaches a third preset pressure, the worktable reciprocates along the X direction on the support, and the spindle reciprocates along the Y direction on the guide, so as to achieve...

[0032] The material to be polished is then finely ground;

[0033] (2-3) Install the polishing part on the polishing unit, and move the guide part back and forth along the Z direction on the column until the pressure between the polishing part and the material to be polished reaches the fourth preset pressure, so that the worktable is on the column.

[0034] The support moves back and forth along the X direction, causing the main shaft to move back and forth along the Y direction on the guide, so as to polish the material to be polished.

[0035] In some embodiments of the present invention, the second preset pressure is 20-35N.

[0036] In some embodiments of the present invention, the third preset pressure is 15-25N.

[0037] 5. In some embodiments of the present invention, the fourth preset pressure is 15-25N.

[0038] In some embodiments of the present invention, after the rough grinding of the material to be polished is completed, the roughness of the material to be polished is not greater than Ra1.2.

[0039] In some embodiments of the present invention, after the fine grinding of the material to be polished is completed, the roughness of the material to be polished is not greater than Ra0.8.

[0040] 0 In some embodiments of the present invention, after the polishing of the material to be polished is completed, the roughness of the material to be polished is not greater than Ra0.4.

[0041] In some embodiments of the present invention, during the fine grinding process of the material to be polished, polishing paste is added between the fine grinding part and the material to be polished.

[0042] In some embodiments of the present invention, during the polishing process of the material to be polished, polishing paste is added between the polishing part and the material to be polished.

[0043] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0044] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0045] Figure 1 This is a schematic diagram of an apparatus for polishing titanium alloys according to an embodiment of the present invention;

[0046] Figure 2 This is a flowchart of a method for polishing titanium alloy according to an embodiment of the present invention;

[0047] Figure 3 This is a flowchart of a method for polishing titanium alloys according to another embodiment of the present invention.

[0048] Figure label:

[0049] 1-Support section; 2-Column; 3-Guide section; 4-Spindle; 5-Connecting rod; 6-Polishing section; 7-Pressure sensing device; 8-Worktable; 9-Power unit. Detailed Implementation

[0050] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0051] This invention provides an apparatus for polishing titanium alloys. According to an embodiment of the invention, refer to the attached drawing. Figure 1The aforementioned device includes: a support part 1; a column 2, which is disposed on one side of the support part 1 and is perpendicular to the support part 1; a guide part 3, which is disposed on the column 2 and is parallel to the support part 1, and the guide part 3 can reciprocate along the Z direction on the column 2, thereby enabling different polishing devices on the polishing part 6 to reciprocate along the Z direction; a main shaft 4, which is disposed on the guide part 3 and is parallel to the column 2, and the main shaft 4 can reciprocate along the Y direction on the guide part 3, thereby enabling different polishing devices on the polishing part 6 to reciprocate along the Y direction; and a polishing part 6, which is used to place polishing devices and is disposed at the end of the main shaft 4 near the support part 1. During the polishing process of the material to be polished, it is only necessary to change the type of polishing device provided in the polishing part 6. This means that grinding and polishing of the material to be polished can be achieved; a pressure sensing device 7 is installed on the polishing part 6 and is used to detect the pressure between the polishing equipment and the material to be polished; a worktable 8 is installed on the support part 1 and is located below the polishing equipment. The worktable 8 is used to place the material to be polished. By adjusting the pressure between different polishing equipment and the material to be polished, grinding and polishing of the material to be polished can be achieved better. The worktable 8 can reciprocate along the X direction on the support part 1, thereby driving the material to be polished to reciprocate along the X direction; a power device 9 is used to provide power for the column 2 to reciprocate along the X direction on the support part 1, the guide part 3 to reciprocate along the Z direction on the column 2, and the spindle 4 to reciprocate along the Y direction on the guide part 3.

[0052] Specifically, a slide rail is provided on the worktable and a corresponding track is provided on the support, thereby enabling the worktable to reciprocate along the X direction on the support 1, and thus enabling the material to be polished to reciprocate along the X direction. Similarly, a slide rail is provided on the guide 3 and a corresponding track is provided on the column 2, thereby enabling the guide 3 to reciprocate along the Z direction on the column 2, and thus enabling the different polishing devices on the polishing section 6 to reciprocate along the Z direction. Similarly, a slide rail is provided on the spindle and a corresponding track is provided on the guide, thereby enabling the spindle 4 to reciprocate along the Y direction on the guide 3, and thus enabling the different polishing devices on the polishing section 6 to reciprocate along the Y direction.

[0053] In embodiments of the present invention, the position of the power unit 9 is not particularly limited. As a specific example, refer to the attached diagram. Figure 1The power unit 9 can be installed inside the main shaft.

[0054] According to some specific embodiments of the present invention, the above-mentioned device further includes: a control unit, the control unit being connected to the power device, the control unit controlling the power device to provide power for the worktable to reciprocate along the X direction on the support, the guide to reciprocate along the Z direction on the column, and the spindle to reciprocate along the Y direction on the guide.

[0055] In the embodiments of the present invention, the specific type of the control unit is not particularly limited. As a specific example, the control unit may include at least one of a computer and a mobile phone.

[0056] According to some specific embodiments of the present invention, the above-mentioned device further includes: a driving device, which drives the polishing part to rotate, and the polishing part drives different polishing devices to rotate, thereby better realizing the grinding and polishing of the material to be polished.

[0057] According to some specific embodiments of the present invention, see attached drawing. Figure 1 One end of the spindle is connected to one end of the connecting rod, and the other end of the connecting rod is connected to the polishing part. This allows for better grinding and polishing of the material to be polished.

[0058] In the embodiments of the present invention, the specific type of the driving device is not particularly limited. As a specific example, the driving device may be a motor.

[0059] In embodiments of the present invention, the position of the drive device is not particularly limited. As a specific example, the drive device may be located inside the spindle.

[0060] In embodiments of the present invention, the specific type of polishing equipment is not particularly limited. As a specific example, the polishing equipment includes grinding parts and polishing parts. Similarly, the specific type of grinding parts is not particularly limited. As a specific example, grinding parts include coarse grinding parts and fine grinding parts. Similarly, the specific type of coarse grinding parts is not particularly limited. As a specific example, coarse grinding parts include at least one of 30-grit sandpaper and fiber polishing wheels. Similarly, the specific type of fine grinding parts is not particularly limited. As a specific example, fine grinding parts include 320-grit sandpaper and 1000-grit sandpaper. Similarly, the specific type of polishing parts is not particularly limited. As a specific example, polishing parts include at least one of wool wheels, nylon wheels, cloth wheels, sisal wheels, and thread wheels.

[0061] The apparatus for polishing titanium alloys according to embodiments of the present invention provides power for the reciprocating movement of the worktable along the X direction on the support, the reciprocating movement of the guide section along the Z direction on the column, and the reciprocating movement of the spindle along the Y direction on the guide section. During the polishing process, only the type of polishing equipment in the polishing section needs to be changed to achieve grinding and polishing of the material. By installing a pressure sensing device in the polishing section and adjusting the pressure between different polishing equipment and the material, the grinding and polishing of the material can be better achieved. Therefore, a single device realizes the titanium alloy polishing process, better controls the titanium alloy polishing process, significantly improves the titanium alloy polishing efficiency, and greatly reduces the titanium alloy polishing cost.

[0062] In another aspect of the invention, a method for polishing titanium alloys is provided. According to embodiments of the invention, refer to the accompanying drawings. Figure 2 The above methods include:

[0063] S100: Place the material to be polished on the worktable.

[0064] In this step, the material to be polished is fixed on the fixture, and then the fixture with the material to be polished is placed on the worktable. This allows for better subsequent polishing of the material and avoids contaminants on the worktable from contaminating the material.

[0065] S200: The material to be polished is ground and polished using a polishing device installed on the polishing section.

[0066] In this step, the polishing equipment is installed on the polishing section, and the guide section moves back and forth on the column in the Z direction until the pressure between the polishing equipment and the material to be polished reaches the first preset pressure. Then, the worktable moves back and forth on the support section in the X direction, and the spindle moves back and forth on the guide section in the Y direction, so as to achieve grinding and polishing of the material to be polished.

[0067] According to some specific embodiments of the present invention, refer to the appendix Figure 3 The above methods also include:

[0068] S201: The material to be polished is coarsely ground using a coarse grinding tool mounted on the polishing section.

[0069] In this step, the coarse grinding part is installed on the polishing part, and the guide part is moved back and forth on the column along the Z direction until the pressure between the coarse grinding part and the material to be polished reaches the second preset pressure. The worktable is then moved back and forth on the support part along the X direction, and the spindle is moved back and forth on the guide part along the Y direction to achieve coarse grinding of the material to be polished. Large protrusions on the surface of the material to be polished can be removed by coarse grinding.

[0070] According to further embodiments of the present invention, the second preset pressure is 20-35 N. By limiting the second preset pressure within this range, it is ensured that large protrusions on the surface of the material to be polished can be removed by coarse grinding. The inventors have found that if the second preset pressure is too high, the friction between the material to be polished and the coarse grinding tool may be too great, increasing the difficulty of operation. Conversely, if the second preset pressure is too low, the friction between the material to be polished and the coarse grinding tool may be too small, potentially preventing the removal of large protrusions on the surface of the material to be polished by coarse grinding.

[0071] According to some specific embodiments of the present invention, after the above-mentioned rough grinding is performed on the material to be polished, the roughness of the material to be polished is not greater than Ra1.2.

[0072] S202: The material to be polished is finely ground using a fine grinding tool installed on the polishing section.

[0073] In this step, the grinding part is installed on the polishing part, and the guide part is moved back and forth on the column along the Z direction until the pressure between the grinding part and the material to be polished reaches the third preset pressure. The worktable is moved back and forth on the support part along the X direction, and the spindle is moved back and forth on the guide part along the Y direction, so as to achieve fine grinding of the material to be polished. The tool marks on the surface of the material to be polished can be removed by fine grinding.

[0074] According to some specific embodiments of the present invention, the third preset pressure is 15-25N. Thus, by limiting the third preset pressure to the above range, it is ensured that the tool marks on the surface of the material to be polished can be removed by fine grinding, and the third preset pressure is avoided from being too high, which would cause excessive friction between the material to be polished and the fine grinding part, thereby increasing the difficulty of operation.

[0075] According to some specific embodiments of the present invention, during the fine grinding process of the material to be polished, abrasive paste is added between the fine grinding part and the material to be polished, which facilitates better fine grinding of the material to be polished and improves the efficiency of fine grinding.

[0076] According to some specific embodiments of the present invention, after the above-mentioned fine grinding is performed on the material to be polished, the roughness of the material to be polished is not greater than Ra0.8.

[0077] S203: Polishing the material to be polished using a polishing component mounted on the polishing unit.

[0078] In this step, the polishing part is installed on the polishing section, and the guide part is moved back and forth on the column along the Z direction until the pressure between the polishing part and the material to be polished reaches the second preset pressure. The worktable is moved back and forth on the support section along the X direction, and the spindle is moved back and forth on the guide section along the Y direction, so as to polish the material to be polished.

[0079] According to some specific embodiments of the present invention, the fourth preset pressure is 15-25N. Thus, the second preset pressure is limited to the above range, ensuring that the polishing of the material to be polished can be completed, and avoiding excessive fourth preset pressure, which would lead to excessive friction between the material to be polished and the polishing part, thereby resulting in a poor polishing effect.

[0080] According to some specific embodiments of the present invention, during the polishing process of the material to be polished, polishing paste is added between the polishing part and the material to be polished, which facilitates better polishing of the material to be polished and thus improves the polishing efficiency.

[0081] According to some specific embodiments of the present invention, after the above-mentioned polishing is performed on the material to be polished, the roughness of the material to be polished is not greater than Ra0.4.

[0082] According to the method of this invention, by setting the guide part to reciprocate along the Z direction on the column, the worktable to reciprocate along the X direction on the support part, and the spindle to reciprocate along the Y direction on the guide part, only the polishing equipment in the polishing part needs to be changed to achieve grinding and polishing of the material to be polished. By sequentially adjusting the pressure between different polishing equipment and the material to be polished, the grinding and polishing of the material to be polished can be improved. Therefore, the titanium alloy polishing process is better controlled, the titanium alloy polishing efficiency is significantly improved, and the titanium alloy polishing cost is greatly reduced.

[0083] The embodiments of the present invention are described in detail below. It should be noted that the embodiments described below are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. In addition, unless otherwise specified, all reagents used in the following embodiments are commercially available or can be synthesized according to the methods described herein or known to others. For reaction conditions not listed, they are also readily available to those skilled in the art.

[0084] Example 1

[0085] A method for polishing titanium alloys, comprising the following steps:

[0086] (1) Fix the titanium alloy material to be polished onto the magnetic fixture with bolts, and then attach the fixture with the titanium alloy material to the center of the magnetic worktable.

[0087] (2) The fiber grinding wheel is installed on the polishing part. The power device is controlled by a computer to control the guide part to move back and forth along the Z direction on the column until the pressure between the rough grinding part and the titanium alloy material is 27N. The power device is controlled by a computer to control the worktable to move back and forth along the X direction on the support part and the spindle to move back and forth along the Y direction on the guide part. At the same time, the polishing part is rotated by a motor to achieve rough grinding of the titanium alloy material. The roughness of the titanium alloy material after rough grinding is Ra1.2.

[0088] (3) First, install 320-grit sandpaper on the polishing part. Use a computer-controlled power unit to control the guide part to move back and forth along the Z direction on the column until the pressure between the 320-grit sandpaper and the titanium alloy material is 20N. Use a computer-controlled power unit to control the worktable to move back and forth along the X direction on the support part and the spindle to move back and forth along the Y direction on the guide part. At the same time, use a motor to control the polishing part to rotate so as to achieve the initial fine grinding of the material to be polished. Then, install 1000-grit sandpaper on the polishing part. Use a computer-controlled power unit to control the guide part to move back and forth along the Z direction on the column until the pressure between the 1000-grit sandpaper and the titanium alloy material is 20N. Use a computer-controlled power unit to control the worktable to move back and forth along the X direction on the support part and the spindle to move back and forth along the Y direction on the guide part. At the same time, use a motor to control the polishing part to rotate so as to achieve the secondary fine grinding of the material to be polished. The roughness of the titanium alloy material after the secondary fine grinding is Ra0.8.

[0089] (4) Install the wool wheel on the polishing part, and use a computer-controlled power device to control the guide part to move back and forth along the Z direction on the column until the pressure between the wool wheel and the material to be polished reaches the second preset pressure; use a computer-controlled power device to control the worktable to move back and forth along the X direction on the support part and the spindle to move back and forth along the Y direction on the guide part. At the same time, use a motor to control the polishing part to rotate, thereby completing the polishing of the material to be polished. The roughness of the polished titanium alloy material is Ra0.4.

[0090] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. An apparatus for polishing of titanium alloys, characterized by, The application relates to a polishing device, comprising: a support part; a column arranged on one side of the support part and arranged perpendicularly to the support part; a guide part arranged on the column and arranged in parallel to the support part, the guide part being capable of reciprocating along a Z direction on the column; a main shaft arranged on the guide part and arranged in parallel to the column, the main shaft being capable of reciprocating along a Y direction on the guide part; a polishing part for placing a polishing device, the polishing part being arranged on one end of the main shaft close to the support part; a pressure sensing device arranged on the polishing part, the pressure sensing device being used to detect the pressure between the polishing device and a material to be polished; a workbench arranged on the support part and arranged below the polishing device, the workbench being used to place the material to be polished, the workbench being capable of reciprocating along an X direction on the support part; a power device used to provide power for the reciprocating movement of the workbench along the X direction on the support part, the reciprocating movement of the guide part along the Z direction on the column and the reciprocating movement of the main shaft along the Y direction on the guide part; one end of the main shaft is connected with one end of a connecting rod, and the other end of the connecting rod is connected with the polishing part; the polishing device comprises a grinding part and a polishing part; the grinding part comprises a rough grinding part and a fine grinding part; the rough grinding part is installed on the polishing part, the guide part is reciprocated along the Z direction on the column until the pressure between the rough grinding part and the material to be polished reaches a second preset pressure, the fine grinding part is installed on the polishing part, the guide part is reciprocated along the Z direction on the column until the pressure between the fine grinding part and the material to be polished reaches a third preset pressure, and the polishing part is installed on the polishing part, the guide part is reciprocated along the Z direction on the column until the pressure between the polishing part and the material to be polished reaches a fourth preset pressure.

2. The apparatus of claim 1, wherein, Further comprising: a control unit connected with the power device.

3. The apparatus of claim 1, wherein, Further comprising: a driving device used to drive the polishing part to rotate.

4. The apparatus of claim 1, wherein, Optionally, the rough grinding part comprises at least one of 30-mesh sandpaper and a fiber polishing wheel; optionally, the fine grinding part comprises 320-mesh sandpaper and 1000-mesh sandpaper; optionally, the polishing part comprises at least one of a wool wheel, a nylon wheel, a cloth wheel, a hemp wheel and a wire wheel.

5. A method of polishing a titanium alloy using the apparatus of any one of claims 1-4, wherein, The application further relates to a polishing method, comprising: (1) placing a material to be polished on a workbench; (2) installing a polishing device on a polishing part, reciprocating a guide part along a Z direction on a column until the pressure between the polishing device and the material to be polished reaches a first preset pressure, reciprocating the workbench along an X direction on a support part, and reciprocating a main shaft along a Y direction on the guide part, so as to grind and polish the material to be polished; step (2) comprises: (2-1) mounting a rough grinding piece on the polishing part, reciprocating the guide part along the Z direction on the column until the pressure between the rough grinding piece and the material to be polished reaches a second preset pressure, reciprocating the worktable along the X direction on the support part, and reciprocating the spindle along the Y direction on the guide part, so as to achieve rough grinding on the material to be polished; (2-2) mounting a fine grinding piece on the polishing part, reciprocating the guide part along the Z direction on the column until the pressure between the fine grinding piece and the material to be polished reaches a third preset pressure, reciprocating the worktable along the X direction on the support part, and reciprocating the spindle along the Y direction on the guide part, so as to achieve fine grinding on the material to be polished; (2-3) mounting a polishing piece on the polishing part, reciprocating the guide part along the Z direction on the column until the pressure between the polishing piece and the material to be polished reaches a fourth preset pressure, reciprocating the worktable along the X direction on the support part, and reciprocating the spindle along the Y direction on the guide part, so as to achieve polishing on the material to be polished.

6. The method of claim 5, wherein, The second preset pressure is 20-35 N; Optionally, the third preset pressure is 15-25 N; Optionally, the fourth preset pressure is 15-25 N.

7. The method of claim 5, wherein, After the rough grinding on the material to be polished is completed, the roughness of the material to be polished is not greater than Ra1.2; Optionally, after the fine grinding on the material to be polished is completed, the roughness of the material to be polished is not greater than Ra0.8; Optionally, after the polishing on the material to be polished is completed, the roughness of the material to be polished is not greater than Ra0.

4.

8. The method of claim 5, wherein, During the fine grinding on the material to be polished, grinding paste is added between the fine grinding piece and the material to be polished; Optionally, during the polishing on the material to be polished, grinding paste is added between the polishing piece and the material to be polished.

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