Array drilling processing method, equipment and medium

Abstract

An embodiment of the present application provides an array drilling processing method, equipment and medium, wherein the method includes obtaining an initial total vertical hole processing plan and an initial total side hole processing plan, defining parameters for the total vertical hole processing plan and the total side hole processing plan, using the parameters to assist in sorting the vertical holes and the side holes, and performing drilling processing according to the sorting results; so that the sorting results meet the requirements of interference between vertical holes and side holes, priority processing of vertical holes and post-processing of side holes, and orderly sorting of vertical drill packages and side drills, and the minimum maximum value of the number of vertical drill package processing times and the number of side drill processing times, and meet the requirement of completing the small hole first and then the large hole when there are large and small vertical holes in the sorting, and determine the key greedy strategy of sorting by x size after the constraints are met in the vertical hole sorting.

Description

Technical Field

[0001] The embodiments of the present application relate to, but are not limited to, the field of drilling processing technology, and in particular to array drilling processing methods, equipment, and media. Background Art

[0002] Array drilling systems are widely used in the wood panel drilling industry. Compared to single drills and linear drilling systems, they offer higher efficiency for drilling multiple holes in wood. Each drill bit in an array drilling system has multiple drill bits and a flat surface structure, allowing it to engage more holes at a time. Therefore, optimizing the hole sorting method is necessary. However, current hole sorting methods primarily consider ordered sorting, with less consideration given to sorting under constraints. This can result in sorting results that fail to meet processing requirements or result in excessive drilling cycles, reducing processing efficiency. Summary of the Invention

[0003] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

[0004] The embodiments of the present application aim to solve at least one of the technical problems existing in the prior art. The embodiments of the present application provide an array drilling processing method, equipment and medium, which can enable the drilling of the array drilling to meet the processing requirements and reduce the number of processing times.

[0005] An embodiment of the first aspect of the present application is an array drilling method, comprising:

[0006] Obtain an initial total vertical hole processing plan and an initial total side hole processing plan, wherein the total vertical hole processing plan includes the first vertical hole processing plan for each processing, the first vertical hole processing plan includes the second vertical hole processing plan for each drill package, the total vertical hole processing plan includes the first side hole processing plan for each processing, the second vertical hole processing plan includes the vertical hole name, the vertical hole position, the number of side holes interfered with by the vertical hole, the second vertical hole processing plan for the small holes interfered with when the vertical hole is a large hole, the second vertical hole processing plan for the large holes interfered with when the vertical hole is a small hole, and the number of the second processing plan for the vertical hole; the first side hole processing plan includes the side hole name, the side hole position, and the processing plan for the vertical holes interfered with by the side holes, the vertical holes are divided into large holes and small holes, and the diameter of the large hole is larger than the diameter of the small hole;

[0007] According to the second vertical hole processing scheme for the small hole that interferes when the vertical hole is a large hole, the second vertical hole processing scheme for the large hole that interferes when the vertical hole is a small hole, and the number of the second vertical hole processing scheme, a total vertical hole processing scheme that meets the requirements for the order of processing the large and small holes is selected;

[0008] According to the number of side hole processing schemes and the number of vertical hole processing schemes, the number of side holes interfered by the vertical holes is updated;

[0009] Obtaining a vertical hole position sequence requirement, selecting different first target solutions and second target solutions from a plurality of first vertical hole processing solutions according to the position sequence requirement, replacing the first target solution with the second target solution, and obtaining a vertical hole sorting result;

[0010] Obtaining a side hole position sequence requirement, sorting the first side hole processing solutions according to the side hole position sequence requirement to obtain a plurality of second side hole processing solutions, and forming a sorted second total side hole processing solution from the plurality of second side hole processing solutions;

[0011] Initializing an empty third total side hole processing plan, wherein the number of third side hole processing plans in the third total side hole processing plan is the sum of the number of the first vertical hole processing plans and the number of the first side hole processing plans;

[0012] When the machining plan of the vertical hole interfered with by the side hole in the second side hole machining plan has no intersection with the first vertical hole machining plan of the vertical hole sorting result, the corresponding third side hole machining plan is updated to the second side hole machining plan to obtain a target third total side hole machining plan, and the second side hole machining plan is deleted from the second total side hole machining plan to obtain a target second total side hole machining plan;

[0013] Obtaining a side hole sorting result based on the target second total side hole processing plan and the target third total side hole processing plan;

[0014] Drilling is performed according to the vertical hole sorting result and the side hole sorting result.

[0015] In certain embodiments of the first aspect of the present application, selecting a total vertical hole processing scheme that meets the requirements for the order of processing large and small holes based on the second vertical hole processing scheme for the small hole that interferes when the vertical hole is a large hole, the second vertical hole processing scheme for the large hole that interferes when the vertical hole is a small hole, and the number of the second vertical hole processing scheme includes:

[0016] When the vertical hole is a large hole, if the number of the second vertical hole processing plan of the small hole that interferes when the vertical hole is a large hole is greater than or equal to the number of the second processing plan of the vertical hole, the total vertical hole processing plan corresponding to the vertical hole is deleted; when the vertical hole is a small hole, if the number of the second vertical hole processing plan of the large hole that interferes when the vertical hole is a small hole is less than or equal to the number of the second processing plan of the vertical hole, the total vertical hole processing plan corresponding to the vertical hole is deleted; and thus a total vertical hole processing plan that meets the requirements of the processing order of large and small holes is obtained.

[0017] In certain embodiments of the first aspect of the present application, updating the number of side holes interfered with by the vertical holes according to the number of side hole processing solutions and the number of vertical hole processing solutions includes:

[0018] When the number of the first side hole processing schemes is greater than the number of the first vertical hole processing schemes, the number of side holes interfered with by the initial vertical hole is added to the number of the first vertical hole processing schemes and subtracted from the number of the first side hole processing schemes to obtain the number of side holes interfered with by the new vertical hole;

[0019] When the number of side holes interfered by the new vertical hole is less than 0, the number of side holes interfered by the new vertical hole is set to 0.

[0020] In certain embodiments of the first aspect of the present application, selecting different first target solutions and second target solutions from a plurality of first vertical hole processing solutions according to the position sequence requirement, replacing the first target solution and the second target solution to obtain a vertical hole sorting result includes:

[0021] When the sequence requirement of the vertical hole positions is to sort the vertical hole positions from large to small, different first target solutions and second target solutions are selected from multiple first vertical hole processing solutions according to the first replacement rule corresponding to the sorting of the vertical hole positions from large to small, the first target solution and the second target solution are replaced to obtain the vertical hole sorting result, and the number of replaced drill packages gradually increases.

[0022] In certain embodiments of the first aspect of the present application, selecting different first target solutions and second target solutions from a plurality of first vertical hole processing solutions according to the position sequence requirement, replacing the first target solution and the second target solution to obtain a vertical hole sorting result includes:

[0023] When the sequence requirement of the vertical hole positions is to sort the vertical hole positions from small to large, different first target solutions and second target solutions are selected from multiple first vertical hole processing solutions according to a second replacement rule corresponding to the sorting of the vertical hole positions from small to large, the first target solution and the second target solution are replaced to obtain the vertical hole sorting result, and the number of replaced drill packages gradually increases.

[0024] In certain embodiments of the first aspect of the present application, the replacing of the first target solution and the second target solution to obtain a vertical hole sorting result includes:

[0025] The first target solution and the second target solution are replaced to obtain a replaced first target solution and a replaced second target solution, and the replaced first target solution and the replaced second target solution constitute a vertical hole sorting result to be tested;

[0026] Testing the ordering results of the vertical holes to be tested according to preset replacement test requirements;

[0027] The drop hole sorting result is determined according to the drop hole sorting result to be tested that meets the replacement test requirement.

[0028] In certain embodiments of the first aspect of the present application, the testing of the to-be-tested vertical hole sorting results according to a preset replacement test requirement includes:

[0029] According to the positions of the vertical holes in the vertical hole sorting result to be tested, determining whether the distance between two adjacent drill packages in the vertical hole sorting result to be tested is greater than or equal to a preset distance threshold;

[0030] According to the second vertical hole processing scheme of the small hole that interferes when the vertical hole is a large hole, the second vertical hole processing scheme of the large hole that interferes when the vertical hole is a small hole, and the number of the second processing scheme of the vertical hole in the vertical hole sorting result to be tested, it is judged whether the vertical hole sorting result to be tested meets the requirements for the order of processing large and small holes.

[0031] In certain embodiments of the first aspect of the present application, determining the drop hole sorting result according to the drop hole sorting result to be tested that meets the replacement test requirement includes:

[0032] The maximum value of the number of side holes interfered by the vertical holes of the first target solution after replacement in the vertical hole sorting results to be tested that meet the replacement test requirements is taken as the first maximum value;

[0033] The maximum value of the number of side holes interfered by the vertical holes of the second target solution after replacement in the vertical hole sorting results to be tested that meet the replacement test requirements is used as the second maximum value;

[0034] According to the comparison result of the numerical values ​​between the first maximum value and the second maximum value, the drop hole sorting result is determined by the sorting results of the drop holes to be tested that meet the replacement test requirement.

[0035] An embodiment of the second aspect of the present application is an electronic device, comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the array drilling method as described above is implemented when the processor executes the computer program.

[0036] An embodiment of the third aspect of the present application is a computer-readable storage medium storing computer-executable instructions, wherein the computer-executable instructions are used to execute the array drilling processing method as described above.

[0037] The above scheme has at least the following beneficial effects: by defining the parameters of the vertical holes and side holes, and using the parameters of the vertical holes and side holes to assist in sorting, the sorting result satisfies the requirements of interference between vertical holes and side holes, priority processing of vertical holes and later processing of side holes, and orderly sorting of vertical drill packages and side drills, and the minimum maximum number of vertical drill package processing times and side drill processing times. It also satisfies the requirement of completing small holes before large holes in sorting when there are large and small vertical holes, and determines the key greedy strategy of sorting by x size after the constraints are met in the vertical hole sorting. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The accompanying drawings are used to provide a further understanding of the technical solution of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present application and do not constitute a limitation on the technical solution of the present application.

[0039] Figure 1 This is a step diagram of the array drilling processing method provided in an embodiment of the present application;

[0040] Figure 2 This is an example diagram of a side hole;

[0041] Figure 3 This is an example diagram of a drill package;

[0042] Figure 4 This is an example diagram of vertical hole processing once;

[0043] Figure 5 This is an example diagram of side hole machining once. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0045] It should be noted that although the device schematics illustrate functional module divisions and the flowcharts illustrate logical sequences, in certain circumstances, the steps shown or described may be performed in a sequence that differs from the module divisions in the device or the sequence in the flowcharts. The terms "first," "second," and the like in the specification, claims, or accompanying drawings are used to distinguish similar items and are not necessarily used to describe a specific sequence or precedence.

[0046] The embodiments of the present application are further described below with reference to the accompanying drawings.

[0047] Reference Figure 1 , an array drilling processing method, comprising:

[0048] Step S100, obtaining an initial total vertical hole processing plan and an initial total side hole processing plan, wherein the total vertical hole processing plan includes the first vertical hole processing plan of each processing, the first vertical hole processing plan includes the second vertical hole processing plan of each drill package, the total vertical hole processing plan includes the first side hole processing plan of each processing, the second vertical hole processing plan includes the vertical hole name, the vertical hole position, the number of side holes interfered with by the vertical hole, the second vertical hole processing plan for the small holes interfered with when the vertical hole is a large hole, the second vertical hole processing plan for the large holes interfered with when the vertical hole is a small hole, and the number of the second processing plan for the vertical hole; the first side hole processing plan includes the side hole name, the side hole position, and the processing plan for the vertical holes interfered with by the side hole. Vertical holes are divided into large holes and small holes, and the diameter of the large hole is larger than the diameter of the small hole;

[0049] Step S200, selecting a total vertical hole processing plan that meets the requirements for the order of processing the large and small holes based on the second vertical hole processing plan for the small hole that interferes when the vertical hole is a large hole, the second vertical hole processing plan for the large hole that interferes when the vertical hole is a small hole, and the number of the second vertical hole processing plan;

[0050] Step S300, updating the number of side holes interfered with by the vertical holes according to the number of side hole processing solutions and the number of vertical hole processing solutions;

[0051] Step S400: Obtaining a vertical hole position sequence requirement, selecting different first target solutions and second target solutions from a plurality of first vertical hole processing solutions according to the position sequence requirement, replacing the first target solution and the second target solution to obtain a vertical hole sorting result;

[0052] Step S500: Obtaining a side hole position sequence requirement, sorting the first side hole processing solutions according to the side hole position sequence requirement to obtain a plurality of second side hole processing solutions, and forming a sorted second total side hole processing solution from the plurality of second side hole processing solutions;

[0053] Step S600, initializing an empty third total side hole processing plan, wherein the number of third side hole processing plans in the third total side hole processing plan is the same as the number of the first side hole processing plans;

[0054] Step S700: When the machining plan of the vertical hole interfered with by the side hole in the second side hole machining plan has no intersection with the first vertical hole machining plan in the vertical hole sorting result, the corresponding third side hole machining plan is updated to the second side hole machining plan to obtain a target third total side hole machining plan, and the second side hole machining plan is deleted from the second total side hole machining plan to obtain a target second total side hole machining plan;

[0055] Step S800, obtaining a side hole sorting result based on the target second total side hole processing plan and the target third total side hole processing plan;

[0056] Step S900 , performing drilling processing according to the vertical hole sorting result and the side hole sorting result.

[0057] In step S100, the initial total vertical hole processing plan and the initial total side hole processing plan are obtained, specifically as follows:

[0058] Define P = {H1, H2, ..., H n Where P is the total vertical hole processing plan, J is the total side hole processing plan, H i is the first vertical hole processing plan of the i-th vertical hole processing, n is the total number of vertical hole processing times, i∈n. Figure 4 , Figure 4 This is an example diagram of vertical hole processing once.

[0059] Define J = {S1, S2, ..., S m}, J is the total side hole processing plan, S j is the first side hole processing plan for the jth side hole processing, m is the total number of side hole processing times, j∈m. Figure 5 , Figure 5 This is an example diagram of side hole machining once.

[0060] Define H i ={V i,1 ,V i,2 ,…,V i,t}, where V i,k Denotes the second vertical hole processing plan of the kth drill package in the i-th vertical hole processing, t is the maximum number of drill packages used, k∈t. Define dx as the minimum distance between drill packages to prevent interference between drill packages. V i,1 ,V i,2 ,…,V i,t They are sorted from small to large in the x direction. Figure 3 , Figure 3 This is an example picture of a drill package.

[0061] Define V i,k ={hole,x,side_cout,pre_v,next_v,row}, where V i,k .hole represents the name of the vertical hole processed by the kth drill package in the i-th vertical hole processing, V i,k .x represents the vertical hole position processed by the kth drill package in the i-th vertical hole processing, V i,k .side_cout indicates the number of side holes that the vertical hole interferes with, V i,k .pre_v represents the second vertical hole processing plan for the small hole that interferes when the vertical hole is a large hole, V i,k .next_v indicates the second vertical hole processing plan for the large hole that interferes when the vertical hole is a small hole, and row indicates the number of the second vertical hole processing plan.

[0062] Define S j={hole,y,pre_v}, where S j .hole indicates the name of the side hole processed for the jth time, S j .y represents the side hole position of the jth side hole processing, S j .pre_v indicates the processing plan of the vertical hole that interferes with the side hole. Figure 2 , Figure 2 This is an example diagram of a side hole.

[0063] For the initial total vertical hole processing plan P = {H1, H2, ..., H n} and the initial total side hole processing plan J = {S1, S2, ..., S m},

[0064] For each second vertical hole processing plan V i,k (1≤i≤n,1≤k≤t), retrieve all the corresponding vertical holes that can be processed and put them into V i,k .hole, place the position corresponding to the vertical hole into V i,k .x, and make V i,k .row=i.

[0065] For each first side hole processing plan S j (1≤j≤m), retrieve all corresponding side holes that can be processed and put them into S j .hole, place the position corresponding to the side hole into S j .y in.

[0066] In step S200, based on the second vertical hole processing plan for the small hole that interferes when the vertical hole is a large hole, the second vertical hole processing plan for the large hole that interferes when the vertical hole is a small hole, and the number of the second vertical hole processing plan, a total vertical hole processing plan that meets the requirements for the order of processing the large and small holes is selected, specifically as follows:

[0067] When the vertical hole is a large hole, if the number of the second vertical hole processing plan of the small hole that interferes with the vertical hole is greater than or equal to the number of the second processing plan of the vertical hole, the total vertical hole processing plan corresponding to the vertical hole is deleted; when the vertical hole is a small hole, if the number of the second vertical hole processing plan of the large hole that interferes with the vertical hole is less than or equal to the number of the second processing plan of the vertical hole, the total vertical hole processing plan corresponding to the vertical hole is deleted; and then the total vertical hole processing plan that meets the requirements of the processing order of large and small holes is obtained.

[0068] In this embodiment, for V i,k .hole, if there is a large hole in the large and small holes, then re-search each drill package processing plan in the total vertical hole processing plan P to find the second vertical hole processing plan for the small hole that the large hole interferes with, assuming it is V j,p , if V j,p .row≥Vi,k .row, it indicates that the initial total vertical hole processing plan P does not meet the requirements of the order of large and small hole processing, an error is reported and the sorting is stopped; otherwise, V j,p Put V i,k If there is a small hole in the large and small holes, then re-search each drilling package processing plan in the total vertical hole processing plan P to find the second vertical hole processing plan for the large hole that the small hole interferes with, assuming it is V j,p , if V j,p .row≤V i,k .row, it indicates that the initial total vertical hole processing plan P does not meet the requirements of the order of large and small hole processing, an error is reported and the sorting is stopped; otherwise, V j,p Put V i,k .next_v. Then, retrieve V i,k .hole, find all the side holes that interfere with it, and find the side hole processing solutions for these side holes. i ,S j ,…,S k}, Statistics {S i ,S j ,…,S k}, and put it into V i,k .side_cout. Finally, for each S j (1≤j≤m), search S j .hole corresponds to the drilling package processing plan of the vertical hole with interference {V i ,V j ,…,V k}, and {V i ,V j ,…,V k}Put in S j .pre_v.

[0069] In step S300, the number of side holes interfered with by the vertical holes is updated according to the number of side hole processing solutions and the number of vertical hole processing solutions, as follows:

[0070] When the number of the first side hole processing scheme is greater than the number of the first vertical hole processing scheme, the number of side holes interfered with by the initial vertical hole is added to the number of the first vertical hole processing scheme and subtracted from the number of the first side hole processing scheme to obtain the number of side holes interfered with by the new vertical hole;

[0071] When the number of side holes interfered by the new vertical hole is less than 0, the number of side holes interfered by the new vertical hole is set to 0.

[0072] In this embodiment, if m>n, then for the total vertical hole processing plan P={H1, H2, ..., H nSecond vertical hole processing plan V for each drill package i,k (1≤i≤n,1≤k≤t), set the number of side holes interfered by the new vertical hole to V i, k .side_cout = V i,k .side_cout+nm; In addition, if V i,k .side_cout<0, then let V i,k .side_cout=0.

[0073] In step S400, different first target solutions and second target solutions are selected from a plurality of first vertical hole processing solutions according to the position sequence requirement, and the first target solution and the second target solution are replaced to obtain the vertical hole sorting result, which is as follows:

[0074] When the vertical hole position sequence requirement is to sort the vertical holes from largest to smallest, different first target solutions and second target solutions are selected from a plurality of first vertical hole processing solutions according to a first replacement rule corresponding to the sorting of the vertical holes from largest to smallest, the first target solution and the second target solution are replaced to obtain a vertical hole sorting result, and the number of replaced drill packages gradually increases;

[0075] When the order requirement of the vertical hole positions is to sort the vertical hole positions from small to large, different first target plans and second target plans are selected from multiple first vertical hole processing plans according to the second replacement rule corresponding to the sorting according to the vertical hole positions from small to large, the first target plan and the second target plan are replaced to obtain the vertical hole sorting result, and the number of replaced drill packages gradually increases.

[0076] In this embodiment, when the vertical hole position sequence is required to be sorted from large to small, k = t, t-1, ..., 1 is taken; at the same time, the total vertical hole processing plan P = {H1, H2, ..., H n Each first vertical hole processing scheme H i The second vertical hole processing solution V of the drill package i,k At the same time, for each second vertical hole processing solution V i,k , extract the second vertical hole processing plan V of another drill package in the order j=i+1,i+2,…,n j,k .

[0077] When the vertical hole position sequence is required to be sorted from small to large, k is taken as 1, 2, ..., t; at the same time, the total vertical hole processing plan P is extracted in the order of i = 1, 2, ..., n-1. n Each first vertical hole processing scheme H i The second vertical hole processing solution V of the drill package i,kAt the same time, for each second vertical hole processing solution V i,k , extract the second vertical hole processing plan V of another drill package in the order j=i+1,i+2,…,n j,k .

[0078] According to the second vertical hole processing scheme V i,k And the second vertical hole processing solution V j,k , construct the vertical hole sorting result to be tested, that is, the possible replacement scheme.

[0079] When the order of the pendant holes is required to be sorted from large to small, the constructed pendant hole sorting result to be tested is: During the construction process, one drill pack, two drill packs, ..., are replaced each time until k drill packs are replaced, and the number of replaced drill packs gradually increases.

[0080] When the order of the pendant holes is required to be sorted from small to large, the constructed pendant hole sorting result to be tested is: During the construction process, one drill pack, two drill packs, ..., are replaced each time until t-k+1 drill packs are replaced, and the number of replaced drill packs gradually increases.

[0081] in, Here, a is the first target solution, and b is the second target solution.

[0082] In addition, the vertical hole sorting result to be tested needs to be tested to determine whether it meets the preset replacement test requirements. The first target solution and the second target solution are replaced to obtain the vertical hole sorting result, including but not limited to the following steps:

[0083] The first target solution and the second target solution are replaced to obtain a replaced first target solution and a replaced second target solution, and the replaced first target solution and the replaced second target solution constitute a vertical hole sorting result to be tested;

[0084] Test the sorting results of the vertical holes to be tested according to the preset replacement test requirements;

[0085] The drop hole sorting result is determined according to the sorting result of the drop holes to be tested that meet the replacement test requirements.

[0086] In this embodiment, press M i,j,k Extract a solution from the possible solutions in sequence for replacement test. If it can be replaced, replace it and do not test M again. i,j,k Test the remaining solutions in the test. If they cannot be replaced, further test M in sequence. i,j,k The remaining solutions in the test are tested until all are completed. If they cannot be replaced, it means that V i,k Not replaceable.

[0087] Assume that the current test M i,j,k Medium option That is, the vertical processing plan H i With H j The corresponding drill package p is replaced with the drill package q, and the replacement result is as follows: The first target solution after replacement is The second target solution after replacement is

[0088] The vertical hole sorting results to be tested are tested according to the preset replacement test requirements, including but not limited to the following steps:

[0089] According to the positions of the vertical holes in the vertical hole sorting result to be tested, determining whether the distance between two adjacent drill packages in the vertical hole sorting result to be tested is greater than or equal to a preset distance threshold;

[0090] According to the second vertical hole processing plan for the small hole that interferes when the vertical hole is a large hole, the second vertical hole processing plan for the large hole that interferes when the vertical hole is a small hole, and the number of the second processing plan for the vertical hole in the vertical hole sorting result to be tested, it is judged whether the vertical hole sorting result to be tested meets the requirements for the order of processing large and small holes.

[0091] In this embodiment, check If the x distance difference between any two adjacent drill packages is less than dx, it means that the replacement plan Not feasible; otherwise it is feasible. The specific test plan is: Take r=1,2,…,t-1 in sequence, and V j,r ,V j,r+1 , if V j,r+1 .xV j,r If .x<dx, it means that the replacement plan is not feasible; otherwise it is feasible.

[0092] Since i<j, Extract {V j,p ,V j,p+1 ,…,V j,q} corresponding to all W={V j,p .pre_v,V j,p+ 1.pre_v,…,V j,q .pre_v}, if the row number row corresponding to any drill package in W is greater than or equal to i, it means Not feasible; otherwise it is feasible. Extract {V i,p ,V i,p+1 ,…,V i,q} corresponding to all W={V j,p .next_v,V j,p+ 1.next_v,…,Vj,q .next_v}, if the row number of any drill package in W is less than or equal to j, it means It is not feasible; otherwise it is feasible.

[0093] Determining the drop hole sorting result based on the drop hole sorting result to be tested that meets the replacement test requirements includes but is not limited to the following steps:

[0094] The maximum value of the number of side holes interfered by the vertical holes of the first target solution after replacement in the vertical hole sorting results to be tested that meet the replacement test requirements is taken as the first maximum value;

[0095] The maximum value of the number of side holes interfered by the vertical holes of the second target solution after replacement in the ranking results of the vertical holes to be tested that meet the replacement test requirements is taken as the second maximum value;

[0096] According to the comparison result of the numerical values ​​between the first maximum value and the second maximum value, the hanging hole sorting result is determined by the sorting result of the hanging holes to be tested that meets the replacement test requirement.

[0097] After the distance test and the large and small hole processing are tested, if Can be replaced, then find the first maximum value, the first maximum value is And find the second maximum value, the second maximum value is

[0098] If cout i >cout j , then replace it with If cout i <cout j No replacement is made; if cout i ==cout j , then determine V i,k .x and V j,k .x size, if you want to sort from small to large, then V i,k .x<V j,k .x means no replacement, otherwise it will be replaced with If you want to sort from largest to smallest, then V i,k .x<V j,k .x means change to Otherwise, do not replace. When the replacement is successful, modify H i ,H j The parameters row of all drill packages in H i The number of the second processing plan for all vertical holes in row=i, H j The number of the second processing plan for all vertical holes in row=j.

[0099] Repeat step S400 and the testing step until all drill packages have been tested, and the vertical processing plan sorting is completed.

[0100] For step S500, the side hole position sequence requirement is obtained, and the first side hole processing schemes are sorted according to the side hole position sequence requirement to obtain multiple second side hole processing schemes. The second total side hole processing plan after sorting composed of multiple second side hole processing plans

[0101] In this embodiment, the first side hole processing scheme J={S1, S2, ..., S m} to sort and get the second total side hole processing plan The order of the side hole positions must be in ascending order of y or in descending order of y.

[0102] For step S600, initialize the empty third total side hole processing plan J opt , the third side hole processing scheme in the third total side hole processing scheme The number is the sum of the number of the first vertical hole processing solutions and the number of the first side hole processing solutions.

[0103] definition in If it is empty, it means that the side drilling of layer i is not processed. Let i=1, j=1.

[0104] In step S700, when the processing plan of the vertical hole interfered with by the side hole in the second side hole processing plan has no intersection with the first vertical hole processing plan of the vertical hole sorting result, the corresponding third side hole processing plan is updated to the second side hole processing plan to obtain the target third total side hole processing plan, and the second side hole processing plan is deleted from the second total side hole processing plan to obtain the target second total side hole processing plan.

[0105] P={H1,H2,…,H n} is the sorted vertical processing plan. Extract H in P i ={V i,1 ,V i,2 ,…,V i,t},extract middle if With H i There is an intersection, that is, there are the same diamond packages, which means Cannot be in the i-th layer, j=j+1, if j≤m, repeat this step, if j>m, it means all All side drilling processing solutions in cannot be in the i-th layer. With H i If there is no intersection, then At the same time from Delete from . Let i=i+1 and repeat this step until Is empty or i>t. Get the target second total side hole processing plan J and the target third total side hole processing plan J opt .

[0106] Step S800: Obtain the side hole sorting result based on the target second total side hole processing plan and the target third total side hole processing plan. When it is empty, J opt This is the result of the side hole sorting. If i>t, then take This is the side hole sorting result.

[0107] In step S900 , the vertical hole sorting result and the side hole sorting result are input into a drilling processing device, and the drilling processing device performs processing according to the vertical hole sorting result and the side hole sorting result.

[0108] By defining the side_cout parameter and going through step S100, step S200 and the third step of the test step, the requirements of interference between vertical holes and side holes, priority processing of vertical holes and post-processing of side holes are met, as well as the requirements of orderly sorting of vertical drill packages and side drills, and the minimum maximum number of vertical drill package processing times and side drill processing times are met.

[0109] The priority relationship between large and small holes is described by defining the pre_v parameter and the next_v parameter in the drilling package processing plan, and the requirement of completing the small hole first and then the large hole is achieved through step S100 and the second step of the test step when there are large and small vertical holes.

[0110] By defining M i,j,k To describe the case of any two drill packages V i,k 、V j,k This determines the key greedy strategy of sorting the vertical holes by x size after the constraints are met.

[0111] An embodiment of the present application further provides an electronic device comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the above array drilling method when executing the computer program.

[0112] The memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer executable programs, such as the function construction in the above-mentioned embodiments of the present invention. The processor implements the function construction in the above-mentioned embodiments of the present invention by running the non-transitory software programs and programs stored in the memory.

[0113] The memory may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data required for executing the function construction in the above-mentioned embodiment of the present invention, etc. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory may optionally include a memory remotely arranged relative to the processor, and these remote memories may be connected to the terminal via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof.

[0114] An embodiment of the present application further provides a computer-readable storage medium storing computer-executable instructions for executing the above array drilling method.

[0115] Those skilled in the art will appreciate that all or some of the steps and systems in the method disclosed above can be implemented as software, firmware, hardware, and appropriate combinations thereof. Some physical components or all physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or implemented as hardware, or implemented as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, and the computer-readable medium can include computer storage media (or non-transitory media) and communication media (or temporary media). As known to those skilled in the art, the term computer storage media is included in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data) and is volatile and non-volatile, removable, and non-removable. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory, or other memory technology, CD-ROM, digital versatile disks (DVD), or other optical disk storage, magnetic cassettes, magnetic tapes, disk storage, or other magnetic storage devices, or any other medium that can be used to store desired information and can be accessed by a computer. In addition, it is well known to those skilled in the art that communication media generally contain computer-readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transmission mechanism, and may include any information delivery medium. In the above description of this specification, the reference terms "one embodiment / example", "another embodiment / example" or "certain embodiments / examples" and the like are intended to mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0116] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is limited by the embodiments and their equivalents.

[0117] The above is a specific description of the preferred implementation of the present application, but the present application is not limited to the embodiments. Technical personnel familiar with the field can make various equivalent modifications or substitutions without violating the spirit of the present application. These equivalent modifications or substitutions are all included in the scope defined by the present embodiment.

Claims

1. An array drilling method, comprising: Obtain an initial total vertical hole processing plan and an initial total side hole processing plan, wherein the total vertical hole processing plan includes the first vertical hole processing plan for each processing, the first vertical hole processing plan includes the second vertical hole processing plan for each drill package, the total vertical hole processing plan includes the first side hole processing plan for each processing, the second vertical hole processing plan includes the vertical hole name, the vertical hole position, the number of side holes interfered with by the vertical hole, the second vertical hole processing plan for the small holes interfered with when the vertical hole is a large hole, the second vertical hole processing plan for the large holes interfered with when the vertical hole is a small hole, and the number of the second processing plan for the vertical hole; the first side hole processing plan includes the side hole name, the side hole position, and the processing plan for the vertical holes interfered with by the side holes, the vertical holes are divided into large holes and small holes, and the diameter of the large hole is larger than the diameter of the small hole; According to the second vertical hole processing scheme for the small hole that interferes when the vertical hole is a large hole, the second vertical hole processing scheme for the large hole that interferes when the vertical hole is a small hole, and the number of the second vertical hole processing scheme, a total vertical hole processing scheme that meets the requirements for the order of processing the large and small holes is selected; According to the number of side hole processing schemes and the number of vertical hole processing schemes, the number of side holes interfered by the vertical holes is updated; Obtaining a vertical hole position sequence requirement, selecting different first target solutions and second target solutions from a plurality of first vertical hole processing solutions according to the position sequence requirement, replacing the first target solution with the second target solution, and obtaining a vertical hole sorting result; Obtaining a side hole position sequence requirement, sorting the first side hole processing solutions according to the side hole position sequence requirement to obtain a plurality of second side hole processing solutions, and forming a sorted second total side hole processing solution from the plurality of second side hole processing solutions; Initializing an empty third total side hole processing plan, wherein the number of third side hole processing plans in the third total side hole processing plan is the sum of the number of the first vertical hole processing plans and the number of the first side hole processing plans; When the machining plan of the vertical hole interfered with by the side hole in the second side hole machining plan has no intersection with the first vertical hole machining plan of the vertical hole sorting result, the corresponding third side hole machining plan is updated to the second side hole machining plan to obtain a target third total side hole machining plan, and the second side hole machining plan is deleted from the second total side hole machining plan to obtain a target second total side hole machining plan; Obtaining a side hole sorting result based on the target second total side hole processing plan and the target third total side hole processing plan; Drilling is performed according to the vertical hole sorting result and the side hole sorting result.

2. The array drilling method according to claim 1, characterized in that: The overall vertical hole processing scheme that meets the requirements for the order of processing the large and small holes is selected based on the second vertical hole processing scheme for the small hole that interferes when the vertical hole is a large hole, the second vertical hole processing scheme for the large hole that interferes when the vertical hole is a small hole, and the number of the second vertical hole processing scheme, including: When the vertical hole is a large hole, if the number of the second vertical hole processing plan of the small hole that interferes when the vertical hole is a large hole is greater than or equal to the number of the second processing plan of the vertical hole, the total vertical hole processing plan corresponding to the vertical hole is deleted; when the vertical hole is a small hole, if the number of the second vertical hole processing plan of the large hole that interferes when the vertical hole is a small hole is less than or equal to the number of the second processing plan of the vertical hole, the total vertical hole processing plan corresponding to the vertical hole is deleted; and thus a total vertical hole processing plan that meets the requirements of the processing order of large and small holes is obtained.

3. The array drilling method according to claim 1, characterized in that: The updating of the number of side holes interfered with by the vertical holes according to the number of side hole processing schemes and the number of vertical hole processing schemes includes: When the number of the first side hole processing schemes is greater than the number of the first vertical hole processing schemes, the number of side holes interfered with by the initial vertical hole is added to the number of the first vertical hole processing schemes and subtracted from the number of the first side hole processing schemes to obtain the number of side holes interfered with by the new vertical hole; When the number of side holes interfered by the new vertical hole is less than 0, the number of side holes interfered by the new vertical hole is set to 0.

4. The array drilling method according to claim 1, characterized in that: The step of selecting different first target solutions and second target solutions from a plurality of first vertical hole processing solutions according to the position sequence requirement, replacing the first target solution and the second target solution to obtain a vertical hole sorting result includes: When the sequence requirement of the vertical hole positions is to sort the vertical hole positions from large to small, different first target solutions and second target solutions are selected from multiple first vertical hole processing solutions according to the first replacement rule corresponding to the sorting of the vertical hole positions from large to small, the first target solution and the second target solution are replaced to obtain the vertical hole sorting result, and the number of replaced drill packages gradually increases.

5. The array drilling method according to claim 4, characterized in that: The step of selecting different first target solutions and second target solutions from a plurality of first vertical hole processing solutions according to the position sequence requirement, replacing the first target solution and the second target solution to obtain a vertical hole sorting result includes: When the sequence requirement of the vertical hole positions is to sort the vertical hole positions from small to large, different first target solutions and second target solutions are selected from multiple first vertical hole processing solutions according to a second replacement rule corresponding to the sorting of the vertical hole positions from small to large, the first target solution and the second target solution are replaced to obtain the vertical hole sorting result, and the number of replaced drill packages gradually increases.

6. The array drilling method according to claim 5, characterized in that: The step of replacing the first target solution with the second target solution to obtain a vertical hole sorting result includes: The first target solution and the second target solution are replaced to obtain a replaced first target solution and a replaced second target solution, and the replaced first target solution and the replaced second target solution constitute a vertical hole sorting result to be tested; Testing the ordering results of the vertical holes to be tested according to preset replacement test requirements; The drop hole sorting result is determined according to the drop hole sorting result to be tested that meets the replacement test requirement.

7. The array drilling method according to claim 6, characterized in that: The step of testing the ordering results of the vertical holes to be tested according to the preset replacement test requirements includes: According to the positions of the vertical holes in the vertical hole sorting result to be tested, determining whether the distance between two adjacent drill packages in the vertical hole sorting result to be tested is greater than or equal to a preset distance threshold; According to the second vertical hole processing scheme of the small hole that interferes when the vertical hole is a large hole, the second vertical hole processing scheme of the large hole that interferes when the vertical hole is a small hole, and the number of the second processing scheme of the vertical hole in the vertical hole sorting result to be tested, it is judged whether the vertical hole sorting result to be tested meets the requirements for the order of processing large and small holes.

8. The array drilling method according to claim 6, characterized in that: The determining of the vertical hole sorting result according to the vertical hole sorting result to be tested that meets the replacement test requirement includes: The maximum value of the number of side holes interfered by the vertical holes of the first target solution after replacement in the vertical hole sorting results to be tested that meet the replacement test requirements is taken as the first maximum value; The maximum value of the number of side holes interfered by the vertical holes of the second target solution after replacement in the vertical hole sorting results to be tested that meet the replacement test requirements is used as the second maximum value; According to the comparison result of the numerical values ​​between the first maximum value and the second maximum value, the drop hole sorting result is determined by the sorting results of the drop holes to be tested that meet the replacement test requirement.

9. An electronic device comprising: A memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the array drilling method according to any one of claims 1 to 8 when executing the computer program.

10. A computer-readable storage medium, characterized in that Computer-executable instructions are stored, and the computer-executable instructions are used to execute the array drilling processing method according to any one of claims 1 to 8.

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