A method for manufacturing a step-difference printing screen

Abstract

The present invention relates to a step-difference printing screen manufacturing method, comprising the following implementation steps: 1) obtaining an ink printing area A and calculating an ink control distance B; 2) opening a printing screen according to area A; 3) opening a stamping die according to control distance B, wherein control distance B is a stamping area of ​​the die; and filling an area of ​​the printing screen that is not to be printed with ink with latex. The present invention can be widely used in the field of printing screen technology.

Description

Technical Field

[0001] The invention relates to the technical field of printing screens, in particular to a method for manufacturing a step-difference printing screen. Background Art

[0002] With the continuous development of electronic products and technologies, the design concept of electronic products is gradually moving towards thinness and narrow borders. In order to meet the requirements of the electronic industry market, circuit boards are also constantly developing in the direction of high density and fine circuits. The circuit board is connected to the IC and the glass screen through the binding process. If the pin area of ​​the circuit board is affected by ink overflow, it will affect the bonding performance of the binding. Therefore, with the continuous sophistication of electronic products, the ink overflow tolerance requirements for circuit boards are getting smaller and smaller, and the ink thickness requirements are becoming more and more stringent. And because of the influence of the capillary effect, the thinner the line, the more serious the overflow, so the difficulty of the ink printing process is becoming more and more severe. The overflow control of the current ink printing stencil is mainly to continuously collect overflow information during the production process, calculate the overflow value, and use the results of old data statistics to compensate for the overflow of new products before making the printing stencil. The maximum control accuracy of the compensated printing stencil overflow is ±100um, but the instability is high. Therefore, whether the overflow caused by the manufactured printing stencil to the product meets the specifications can only be determined after the product is printed. The actual confirmation of the product's ink overflow value can determine whether the printing stencil meets the requirements. If it does not meet the specifications, the printing stencil needs to be re-opened.

[0003] The existing printing screens are as follows Figure 1 Side view, bottom Figure 2 As shown in the top view, steel wires with a diameter of H of 30um are woven into a mesh with warp and weft lines, the distance E between the screens is 100um, and the mesh opening rate is 70%. During the printing process, the screen thickness C and the mesh opening rate determine the ink thickness in the printing area. At present, the diameter and spacing of the printing screen are the specification values ​​for ink thickness printing calculated by the industry, but the maximum control accuracy of ink overflow can only reach ±100um. As mentioned above, since the thickness and opening rate of the printing screen determine the thickness of the ink, under the condition of ensuring the ink thickness specification requirements, the maximum control accuracy of ink overflow can only reach ±100um, and the overflow value is unstable and difficult to control. And because the overflow value is also affected by the size of the product and the thickness of the line, according to the capillary efficiency, the smaller the line, the greater the ink overflow value. With the continuous development of electronic product technology, the requirements for the line will become more and more precise, so the current printing screen will not meet the needs of future circuit board development. Therefore, new processes are needed to match the development needs. Summary of the invention

[0004] In order to solve the above technical problems, the technical solution provided by the present invention is:

[0005] A method for manufacturing a step-difference printing screen includes the following steps:

[0006] 1) Obtain the ink printing area A and calculate the ink control distance B;

[0007] 2) Open the printing screen according to area A;

[0008] 3) A stamping die is opened according to the B control distance, where the B control distance is the stamping area of ​​the die; the area of ​​the printing screen that is not used for printing ink is filled with latex.

[0009] Preferably, in step 1), the following sub-steps are included:

[0010] 1.1) Obtain ink area A in the product drawing;

[0011] 1.2) According to the size of the product line, obtain the ink control distance. According to experiments, the ink control distance for line widths between 100um and 500um is 1mm. As the line width decreases, the control distance is increased by 4um for every 1um decrease to obtain the control distance B.

[0012] Preferably, in step 3), the printed screen is punched with a pressure of 25 to 1000 tons and a downward pressure of 3 to 5 um. After punching, the screen in the B control distance area is flat, the screen height difference D is lower than the screen height difference C before punching, and the screen mesh F value after punching is smaller than the E value before punching.

[0013] Preferably, the ink overflow control accuracy is ±50um.

[0014] Preferably, the wire mesh is steel wire.

[0015] Preferably, the side length of the mesh plate is 6 mm to 20 mm.

[0016] After adopting the above method, the present invention has the following advantages:

[0017] The screen outside the control distance does not change, so the ink thickness inside remains unchanged;

[0018] The thickness of the screen at the controlled distance becomes smaller, and the amount of ink applied becomes slower, which can effectively reduce ink splashing;

[0019] The screen with controlled distance is punched by the die, and the mesh becomes smaller, so the amount of ink applied becomes less. Therefore, the ink thickness here gradually becomes thinner, and the overflow of ink in the edge area can be effectively controlled; the ink overflow accuracy can be controlled to ±50um;

[0020] Since the ink overflow is effectively reduced, the uncontrollability of the ink is indirectly reduced, and the probability of secondary production of the printing screen is reduced;

[0021] It ensures the production demand time, reduces the binding failure rate, and provides a new method for the development of future technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a side view of a conventional network cable in an embodiment of the present invention;

[0023] Figure 2 is a top view of a conventional network cable in an embodiment of the present invention;

[0024] Figure 3 is a side view of the network cable after punching in an embodiment of the present invention;

[0025] Figure 4 is a side view of the ink layer of the product in the embodiment of the present invention;

[0026] Figure 5 is a side view of the mesh cable before stamping in an embodiment of the present invention;

[0027] Figure 6 is a top view of the mesh wire before stamping in an embodiment of the present invention;

[0028] Figure 7 is a side view of an ink layer of an ink overflow product in an embodiment of the present invention;

[0029] Figure 8 is a structural diagram of an ink overflow binding area in an embodiment of the present invention;

[0030] Fig. 9 is a side view of the network cable after punching in an embodiment of the present invention;

[0031] Fig.10 is a structural diagram of latex filling in an embodiment of the present invention;

[0032] Fig.11 The ink layer structure of the ink overflow product in the embodiment of the present invention Figure 1 ;

[0033] Fig.12 The ink layer structure of the ink overflow product in the embodiment of the present invention Figure 2 ;

[0034] Fig.13 Schematic diagram of ink overflow product control distance in an embodiment of the present invention. DETAILED DESCRIPTION

[0035] The following is combined with Figure 1-13 The present invention is described in further detail.

[0036] 1. Get the ink printing area and calculate the ink control distance.

[0037] 1.1 Obtain ink area A in the product drawing;

[0038] 1.2 The inner / outer pin area is the area that is bound to the IC and the glass screen. If the ink overflow value exceeds the tolerance, the ink will overflow into the binding area, affecting the adhesion of the binding and causing the binding to fail. And because the more precise the circuit, the greater the ink overflow according to the capillary effect, so the thinner the circuit, the greater the impact of the ink overflow. Therefore, it is necessary to obtain the ink control distance according to the size of the product circuit. According to experiments, the ink control distance for line widths between 100um and 500um is 1mm. As the line width decreases, the control distance is increased by 4um for every 1um reduction to obtain the control distance B;

[0039] Open the printing screen according to area A;

[0040] Open the stamping die according to the B control distance, and the B control distance is the stamping area of ​​the die;

[0041] The printing screen is punched with a pressure of 25 tons to 1000 tons and a pressure of 3um to 5um. After punching, the screen in the B control distance area is flat, and the screen height difference D is lower than the screen height difference C before punching. Therefore, the screen mesh F value after punching is smaller than the E value before punching, and the ink deposit is also smaller than before punching;

[0042] After the stamping, the height of the printing screen in the area where the ink is stamped by the die becomes slower and the mesh becomes smaller.

[0043] The areas of the printing screen that are not printed with ink are filled with latex.

[0044] The printing screen designed with this step difference can achieve an ink overflow control accuracy of ±50um, which effectively improves ink overflow and reduces the binding failure rate.

[0045] By implementing the technical solution proposed in the present invention, ink overflow can be effectively improved and ink printing difficulties can be solved.

[0046] In summary, the present invention controls the amount of ink applied by changing the thickness and mesh size of the printing screen, thereby controlling overflow; the screen outside the control distance does not change, so the internal ink thickness remains unchanged; the screen thickness at the control distance becomes smaller, and the amount of ink applied becomes slower, which can effectively reduce ink splashing; the screen at the control distance is punched by a mold, the mesh becomes smaller, and the amount of ink applied becomes less, so the ink thickness here gradually becomes thinner, and the overflow of ink in the edge area can be effectively curbed. The ink overflow accuracy can be controlled to ±50um; due to the effective reduction of ink overflow, the uncontrollability of ink is indirectly reduced, the probability of secondary production of the printing screen is reduced, the production demand time is guaranteed, the binding failure rate is reduced, and a new process is provided for the development of future technology.

Claims

1. A method for manufacturing a step-type printing screen, characterized in that: The implementation steps include: 1) Obtain the ink printing area A and calculate the ink control distance B; 2) Open the printing screen according to the ink printing area A; 3) A stamping die is opened according to the ink control distance B, and the ink control distance B is the stamping area of ​​the die; the area in the printing screen that is not printed with ink is filled with latex; In step 1), the following sub-steps are included: 1.1) Obtain the ink printing area A in the product drawing; 1.2) According to the size of the product line, obtain the ink control distance B. According to the experiment, the ink control distance B for line widths between 100um and 500um is 1mm. As the line width decreases, the ink control distance B increases by 4um for every 1um decrease. In step 3), the printing screen is punched with a pressure of 25 tons to 1000 tons and a pressure of 3um to 5um. After punching, the screen at the ink control distance B is flat, the screen height difference D is lower than the screen height difference C before punching, and the screen mesh F value after punching is smaller than the screen mesh E value before punching. The amount of ink applied is controlled by changing the thickness and mesh size of the printing screen, thereby controlling overflow. The screen outside the ink control distance B remains unchanged, so the internal ink thickness remains unchanged. The screen thickness at the ink control distance B becomes smaller, and the amount of ink applied becomes slower, which can effectively reduce ink splashing. The screen at the ink control distance B is punched by a mold, and the mesh becomes smaller, and the amount of ink applied becomes less, so the ink thickness here gradually becomes thinner, and the overflow of ink in the edge area can be effectively curbed.

2. The method for manufacturing a step-difference printing screen according to claim 1, characterized in that: The wire mesh is steel wire.

3. The method for manufacturing a step-difference printing screen according to claim 2, characterized in that: The side length of the mesh plate is 6 mm to 20 mm.

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