Control unit and substrate processing apparatus including the same

Abstract

This invention provides a control unit capable of predicting and maximizing the lifespan of an inkjet head unit, and a substrate processing apparatus including the same. The control unit is used to maintain an inkjet head unit that ejects substrate processing liquid onto a substrate, and includes: a counting module for counting the number of ejections from each nozzle of the inkjet head unit; a comparison module for comparing the number of ejections with a reference value to determine whether the number of ejections exceeds the reference value; and an evaluation module for evaluating whether the lifespan of the inkjet head unit has reached its expected lifespan based on whether the number of ejections from each nozzle exceeds the reference value.

Description

Technical Field

[0001] This invention relates to a control unit and a substrate processing apparatus including the same. More specifically, it relates to a control unit applicable to an apparatus for manufacturing a display device and a substrate processing apparatus including the same. Background Technology

[0002] When performing printing processes (e.g., RGB patterning) on ​​transparent substrates to manufacture display devices such as LCD panels, PDP panels, and LED panels, printing equipment with an inkjet head unit can be used. Summary of the Invention

[0003] An inkjet head unit may include multiple nozzles to eject ink onto a substrate. However, if even one of the nozzles malfunctions, the printing quality on the substrate may be reduced, potentially resulting in a waste of resources and time.

[0004] The replacement time for existing inkjet head units depends on the manufacturer's manual. However, the timing of inkjet head unit performance degradation may vary depending on the usage environment, making it impossible to predict performance degradation using the methods described above, and thus difficult to prevent print quality from deteriorating in advance.

[0005] The technical problem to be solved by the present invention is to provide a control unit capable of predicting the lifespan of an inkjet head unit and maximizing that lifespan, and a substrate processing apparatus including the control unit.

[0006] The technical problems of this invention are not limited to those described above. Those skilled in the art can clearly understand other technical problems not mentioned in the following description.

[0007] An aspect of the control unit of the present invention for solving the above-mentioned technical problems is used to maintain an inkjet head unit that ejects substrate processing liquid onto a substrate, and includes: a counting module for counting the number of ejections of each nozzle of the inkjet head unit; a comparison module for comparing the number of ejections with a reference value to determine whether the number of ejections is greater than or equal to the reference value; and an evaluation module for evaluating whether the lifespan of the inkjet head unit has reached its service life based on whether the number of ejections of each nozzle is greater than or equal to the reference value.

[0008] The counting module can count the number of ejections based on whether voltage is applied to the piezoelectric element involved in the operation of the nozzle.

[0009] The piezoelectric elements can be set to the same number as the nozzles, and the counting module can count the number of ejections based on whether a voltage is applied to the piezoelectric element corresponding to the nozzle.

[0010] The reference value may be related to at least one of the printing quality of the substrate and the nozzles that do not participate in the printing of the substrate.

[0011] When the reference value is related to the printing quality, the reference value may be the amount of nozzles used in relation to the formation of patterns on the substrate, or it may be the amount of nozzles used in relation to the failure of the flatness of the layers formed on the substrate by printing to meet the reference.

[0012] When the reference value is related to the nozzles that do not participate in substrate printing, the reference value may be the amount of defective nozzles that are judged to be defective.

[0013] The defective nozzle may be associated with at least one of satellite ejection, failure to eject, and inaccurate ejection position.

[0014] The control unit may further include any one of a memory module for storing the reference value, an input module for inputting the reference value, and a communication module for receiving the reference value from an external source, wherein the reference value may be provided to the comparison module through any one of the memory module, the input module, and the communication module.

[0015] The evaluation module can compare the number of nozzles that eject more than the baseline value with the baseline number to evaluate whether the lifespan of the inkjet head unit has reached its service life.

[0016] When the number of nozzles is greater than or equal to the baseline number, the evaluation module can assess that the lifespan of the inkjet head unit has reached its service life and can request the replacement of the inkjet head unit that has reached its service life.

[0017] The control unit can select nozzles with relatively low usage to participate in the printing of the substrate based on the usage of each nozzle.

[0018] The control unit may further include: an extraction module for extracting nozzles with relatively low usage based on the usage of each nozzle; and a control module for controlling the extracted nozzles to participate in the printing of the substrate, wherein the extraction module and the control module may operate when it is assessed that the lifespan of the inkjet head unit has not reached its service life.

[0019] The extraction module can extract nozzles with usage below the baseline amount or nozzles with the least usage.

[0020] The control unit can determine whether the number of ejections matches the number of times voltage is applied to the piezoelectric element involved in the operation of the nozzle.

[0021] The control unit can determine whether the components are compatible based on whether the nozzle normally sprays the substrate processing liquid onto the substrate when a voltage is applied to the piezoelectric element.

[0022] The control unit may further include: a camera module for capturing images of the space between the nozzle and the substrate using a camera sensor; and a processing module for determining whether the nozzle has sprayed the substrate processing liquid onto the substrate based on the image information acquired by the capture.

[0023] When voltage is applied to the piezoelectric element, the camera module can capture images of the space.

[0024] Another aspect of the control unit of the present invention for solving the above-mentioned technical problems is for maintaining an inkjet head unit that ejects substrate processing liquid onto a substrate, and includes: a counting module for counting the number of ejections of each nozzle of the inkjet head unit, and counting the number of ejections based on whether a voltage is applied to a piezoelectric element involved in the operation of the nozzle; a comparison module for comparing the number of ejections with a reference value to determine whether the number of ejections is greater than or equal to the reference value; and an evaluation module for evaluating whether the lifespan of the inkjet head unit has reached its service life based on whether the number of ejections of each nozzle is greater than or equal to the reference value, wherein nozzles with relatively low usage are selected to participate in the printing of the substrate based on the usage of each nozzle, and the reference value is related to at least one of the printing quality of the substrate and nozzles that do not participate in the substrate printing.

[0025] An aspect of the substrate processing apparatus of the present invention for solving the above-mentioned technical problems includes: a process processing unit for supporting the substrate during substrate processing; an inkjet head unit including a plurality of nozzles and for ejecting substrate processing liquid onto the substrate through the plurality of nozzles; a gantry unit for moving the position of the inkjet head unit; a substrate processing liquid supply unit for supplying the substrate processing liquid to the inkjet head unit; and a control unit for maintaining the inkjet head unit, wherein the control unit includes: a counting module for counting the number of ejections from each nozzle of the inkjet head unit; a comparison module for comparing the number of ejections with a reference value to determine whether the number of ejections is greater than or equal to the reference value; and an evaluation module for evaluating whether the lifespan of the inkjet head unit has reached its service life based on whether the number of ejections from each nozzle is greater than or equal to the reference value.

[0026] The substrate processing apparatus may further include a camera sensor for capturing images of the space between the at least one nozzle and the substrate when at least one of the plurality of nozzles sprays the substrate processing liquid onto the substrate.

[0027] Specific details of other embodiments are included in the detailed description and accompanying drawings. Attached Figure Description

[0028] Figure 1 This is a schematic diagram illustrating the structure of a substrate processing apparatus according to an embodiment of the present invention.

[0029] Figure 2 This is a first example diagram schematically illustrating the internal modules of a control unit constituting a substrate processing apparatus according to an embodiment of the present invention.

[0030] Figure 3 This is a second example diagram schematically illustrating the internal modules of a control unit constituting a substrate processing apparatus according to an embodiment of the present invention.

[0031] Figure 4 This is an example diagram illustrating the function of the control unit constituting a substrate processing apparatus according to an embodiment of the present invention.

[0032] Figure 5 This is a third example diagram schematically illustrating the internal modules of a control unit constituting a substrate processing apparatus according to an embodiment of the present invention.

[0033] Figure 6 This is a fourth example diagram schematically illustrating the internal modules of a control unit constituting a substrate processing apparatus according to an embodiment of the present invention.

[0034] Figure 7 This is a reference diagram used to illustrate the effects of the present invention.

[0035] Explanation of reference numerals in the attached figures

[0036] 100: Substrate processing apparatus; 110: Processing unit

[0037] 120: Maintenance unit; 130: Gantry unit

[0038] 140: Inkjet head unit; 150: Substrate processing solution supply unit

[0039] 160: Control unit; 210: Counting module

[0040] 220: Comparison module; 230: Memory module

[0041] 240: Evaluation Module; 310: Camera Module

[0042] 320: Processing module; 330: Input module

[0043] 340: Communication module; 410: Camera sensor

[0044] 420: Nozzle; 430: Substrate processing liquid

[0045] 440: Piezoelectric element; 510: Extraction module

[0046] 520: Control Module Detailed Implementation

[0047] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The advantages and features of the present invention, as well as methods for achieving these advantages and features, will be explained by referring to the following description in conjunction with the accompanying drawings. Figure 1 The invention becomes clear from the detailed description of the embodiments. However, the invention is not limited to the embodiments disclosed below, but can be implemented in many different forms. These embodiments are provided only to make the disclosure of the invention complete and to fully inform those skilled in the art of the scope of the invention, which is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same constituent elements.

[0048] When an element or layer is referred to as "on" or "above" another element or layer, it includes not only that it is directly above another element or layer, but also that other layers or elements are in between. Conversely, when an element is referred to as "directly" on or directly above another element, it indicates that there are no other elements or layers in between.

[0049] To readily describe the relationship between one element or component and another, as shown in the figure, spatial relative terms such as "below," "below," "lower," "above," and "upper" can be used. It should be understood that, in addition to the orientation shown in the figure, spatial relative terms also include terms indicating the different orientations of the elements during use or operation. For example, when the element shown in the figure is flipped, an element described as "below" or "below" of another element may be located "above" of that element. Therefore, the exemplary term "below" can include both "below" and "above" orientations. An element may also be oriented in another direction, thus allowing the spatial relative terms to be interpreted according to orientation.

[0050] Although the terms "first," "second," etc., are used to describe various elements, constituent elements, and / or parts, these elements, constituent elements, and / or parts are obviously not limited by these terms. These terms are only used to distinguish one element, constituent element, and / or part from another element, constituent element, and / or part. Therefore, the first element, first constituent element, or first part mentioned below can obviously also be a second element, second constituent element, or second part within the technical concept of the present invention.

[0051] The terminology used in this specification is for illustrative purposes and is not intended to limit the invention. In this specification, the singular form includes the plural form unless specifically stated otherwise. The terms "comprises" and / or "comprising" as used in this specification do not exclude the presence or addition of one or more other constituent elements, steps, operations, and / or components in addition to those mentioned.

[0052] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) may be used in the sense that can be commonly understood by one of ordinary skill in the art to which this invention pertains. Furthermore, terms defined in commonly used dictionaries are not to be ideally or excessively interpreted unless explicitly defined otherwise.

[0053] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing the invention with reference to the drawings, the same or corresponding constituent elements are given the same reference numerals regardless of the reference numerals, and repeated descriptions thereof are omitted.

[0054] This invention relates to a control unit capable of predicting the lifespan of an inkjet head unit and maximizing the lifespan of the inkjet head unit, and a substrate processing apparatus including the same. The invention will now be described in detail with reference to the accompanying drawings.

[0055] Figure 1 This is a schematic diagram illustrating the structure of a substrate processing apparatus according to an embodiment of the present invention.

[0056] The substrate processing apparatus 100 processes a substrate G (e.g., a glass substrate) used to manufacture a display device. This substrate processing apparatus 100 can be implemented as an inkjet device that jettisons substrate processing liquid onto the substrate G using an inkjet head unit 140, and particularly as a circulating inkjet device to prevent nozzle clogging by the substrate processing liquid. The substrate processing apparatus 100 can, for example, be configured as a QD (Quantum Dot) CF (Color Filter) inkjet system.

[0057] according to Figure 1The substrate processing apparatus 100 may include a process processing unit 110, a maintenance unit 120, a gantry unit 130, an inkjet head unit 140, a substrate processing liquid supply unit 150, and a control unit or controller 160.

[0058] The process processing unit 110 supports the substrate G during the PT operation. This process processing unit 110 can support the substrate G in a non-contact manner. For example, the process processing unit 110 can use air to suspend the substrate G in the air to support it. However, this embodiment is not limited to this. The process processing unit 110 can also support the substrate G in a contact manner. For example, the process processing unit 110 can use a support member with a mounting surface on its upper part to support the substrate G.

[0059] On the other hand, in the above text, PT operation refers to printing on substrate G using a substrate processing solution, and the substrate processing solution refers to a chemical solution used to print on substrate G. The substrate processing solution can, for example, be QD ink containing ultrafine semiconductor particles.

[0060] When using an air-supported substrate G, the process unit 110 may include a first (1 st Stage 111 and Air Hole 112.

[0061] The first unit 111 is a base, which is configured such that the substrate G can be placed on top of it. The vents 112 can be formed through the upper surface of the first unit 111, and can be formed in multiples within the PT zone of the first unit 111.

[0062] The vent 112 can spray air upwards (to the third direction 30) towards the first unit 111. The vent 112 can thereby suspend the substrate G mounted on the first unit 111 in the air.

[0063] On the other hand, although Figure 1 Although not shown, the process unit 110 may also include a clamp. The clamp is used to prevent the substrate G from detaching from the first machine 111 when it moves along the length direction (first direction 10) of the first machine 111. The clamp can hold the substrate G to prevent it from detaching from the first machine 111, and while the substrate G is moving, the clamp can slide along the guide rail (not shown) while holding the substrate G.

[0064] The maintenance unit 120 measures the ejection position (i.e., dotting) of the substrate processing liquid on the substrate G, and whether the substrate processing liquid is ejected. The maintenance unit 120 can measure the ejection position and whether the substrate processing liquid is ejected for each of the plurality of nozzles provided in the inkjet head unit 140, and can provide the measurement results obtained in this way to the control unit 160.

[0065] Maintenance unit 120 may include, for example, a second (2) nd Stage 121, Third guide rail (3) rd Guide Rail) 122, First Board (1 st Plate 123, Calibration Board 124, and Vision Module 125.

[0066] The second unit 121 can be a base like the first unit 111, and can be arranged parallel to the first unit 111. The second unit 121 can be the same size as the first unit 111, but it can also be smaller or larger than the first unit 111. The second unit 121 can include an MT area (Maintenance Zone) on its upper part.

[0067] The third guide rail 122 guides the movement path of the first plate 123. This third guide rail 122 can be configured as at least one line along the length direction (first direction 10) of the second plate 121. The third guide rail 122 can be implemented, for example, as an LM guide system (Linear Motor Guide System).

[0068] On the other hand, although Figure 1 Not shown in the diagram, but the maintenance unit 120 may also include a fourth guide rail (4). th The fourth guide rail can guide the movement path of the first plate 123 in the same way as the third guide rail 122, and can be set as at least one line on the second plate 121 along the width direction (second direction 20) of the second plate 121. The fourth guide rail can also be implemented as an LM guide system in the same way as the third guide rail 122.

[0069] The first plate 123 can move along the third guide rail 122 and / or the fourth guide rail on the second stage 121. The first plate 123 can move parallel to the substrate G along the third guide rail 122, and can move closer to or further away from the substrate G along the fourth guide rail.

[0070] The calibration plate 124 is used to measure the ejection position of the substrate processing liquid on the substrate G. This calibration plate 124 may include alignment marks, scales, etc., and is disposed on the first plate 123, and may be disposed along the length direction (first direction 10) of the first plate 123.

[0071] The vision module 125 acquires image information about the substrate G to measure the ejection position of the substrate processing liquid, whether the substrate processing liquid has been ejected, etc. The vision module 125 may include an area scan camera, a line scan camera, etc., and can acquire image information about the substrate G in real time. On the other hand, the vision module 125 can acquire and provide information about the substrate G to which the substrate processing liquid has been ejected and information about the calibration plate 124.

[0072] The vision module 125 can be disposed on the side or bottom of the gantry unit 130 to photograph the substrate G, etc. The vision module 125 can be disposed, for example, attached to the side of the inkjet head unit 140. However, this embodiment is not limited to this. The vision module 125 can also be disposed on the first plate 123. On the other hand, multiple vision modules 125 can be disposed within the substrate processing apparatus 100, and can be fixedly disposed or movably disposed.

[0073] The gantry unit 130 supports the inkjet head unit 140. This gantry unit 130 can be disposed above the first unit 111 and the second unit 121 so that the inkjet head unit 140 can spray substrate processing liquid onto the substrate G.

[0074] The gantry unit 130 can be disposed on the first gantry 111 and the second gantry 121 with the width direction (second direction 20) as its length direction. The gantry unit 130 can move along the first guide rail 170a and the second guide rail 170b in the length direction (first direction 10) of the first gantry 111 and the second gantry 121. On the other hand, the first guide rail 170a and the second guide rail 170b can be disposed outside the first gantry 111 and the second gantry 121 along the length direction (first direction 10) of the first gantry 111 and the second gantry 121.

[0075] On the other hand, although Figure 1Although not shown, the substrate processing apparatus 100 may further include a gantry moving unit. The gantry moving unit moves the gantry unit 130 along the first guide rail 170a and the second guide rail 170b. The gantry moving unit may be disposed inside the gantry unit 130 and may include a first moving module (not shown) and a second moving module (not shown). The first moving module and the second moving module may be disposed at two ends within the gantry unit 130 and may allow the gantry unit 130 to slide along the first guide rail 170a and the second guide rail 170b.

[0076] The inkjet head unit 140 ejects substrate processing liquid onto the substrate G in the form of droplets. This inkjet head unit 140 can be disposed on the side or the bottom of the gantry unit 130.

[0077] At least one inkjet head unit 140 may be provided at the gantry unit 130. When multiple inkjet head units 140 are provided at the gantry unit 130, the multiple inkjet head units 140 may be arranged in a row along the length direction (second direction 20) of the gantry unit 130.

[0078] The inkjet head unit 140 can move along the length direction (second direction 20) of the gantry unit 130 to be located at a desired point on the substrate G. However, this embodiment is not limited thereto. The inkjet head unit 140 can move along the height direction (third direction 30) of the gantry unit 130, and can also rotate clockwise or counterclockwise.

[0079] On the other hand, the inkjet head unit 140 can also be fixedly mounted on the gantry unit 130. In this case, the gantry unit 130 can be movably mounted.

[0080] On the other hand, although Figure 1 Although not shown, the substrate processing apparatus 100 may also include an inkjet head moving unit. The inkjet head moving unit causes the inkjet head unit 140 to move linearly or rotate. When the substrate processing apparatus 100 includes multiple inkjet head units 140, the inkjet head moving units may be arranged within the substrate processing apparatus 100 in a manner corresponding to the number of inkjet head units 140, so that the multiple inkjet head units 140 can operate independently. Alternatively, the inkjet head moving unit may be configured as a single unit within the substrate processing apparatus 100, so that the multiple inkjet head units 140 can operate uniformly.

[0081] On the other hand, although Figure 1Although not shown, the inkjet head unit 140 may include a nozzle plate, multiple nozzles, piezoelectric elements, etc. The nozzle plate constitutes the main body of the inkjet head unit 140. Multiple nozzles (e.g., 128, 256, etc.) can be arranged in multiple rows and columns at predetermined intervals on the lower part of such a nozzle plate, and the number of piezoelectric elements can be arranged in the nozzle plate in a number corresponding to the number of nozzles. With such a configuration, the inkjet head unit 140 can eject substrate processing liquid onto the substrate G through the nozzles according to the operation of the piezoelectric elements.

[0082] On the other hand, the inkjet head unit 140 can also independently control the amount of substrate processing liquid ejected through each nozzle according to the voltage applied to the piezoelectric element.

[0083] The substrate processing liquid supply unit 150 supplies ink to the inkjet head unit 140. This substrate processing liquid supply unit 150 may include a storage tank 150a and a pressure control module 150b.

[0084] Storage tank 150a stores substrate processing liquid, and pressure control module 150b regulates the internal pressure of storage tank 150a. Storage tank 150a can supply an appropriate amount of substrate processing liquid to inkjet head unit 140 based on the pressure provided by pressure control module 150b.

[0085] The control unit 160 is used to perform maintenance on the inkjet head unit 140. This control unit 160 can, based on measurements from the maintenance unit 120, correct the substrate processing liquid ejection position of each nozzle in the inkjet head unit 140, or detect defective nozzles (i.e., nozzles that do not eject substrate processing liquid) among a plurality of nozzles in order to perform cleaning operations on the defective nozzles. For this purpose, the control unit 160 can control the operation of each component constituting the substrate processing apparatus 100.

[0086] The control unit 160 can be implemented as a computer or server including a process controller, a control program, an input module, an output module (or a display module), a memory module, etc. As described above, the process controller may include a microprocessor that performs control functions on each component of the substrate processing apparatus 100, and the control program may execute various processes of the substrate processing apparatus 100 according to the control of the process controller. The memory module stores programs, i.e., processing recipes, for executing various processes of the substrate processing apparatus 100 based on various data and processing conditions.

[0087] To prevent a decrease in the printing quality of substrate G due to nozzle defects, it is necessary to predict the lifespan of the inkjet head unit 140. If the replacement time of the inkjet head unit 140 is simply defined as the situation where there are many defects in the printing results, or as the situation where the nozzle out continuously increases during NJI (Nozzle Jetting Inspection), it may be difficult to prevent defective nozzles from being used in the printing of substrate G in advance.

[0088] In this embodiment, to solve this problem, the control unit 160 can be used to predict the lifespan of the inkjet head unit 140, and the lifespan of the inkjet head unit 140 can be maximized based on the prediction result. The function of the control unit 160 will be described in detail below.

[0089] Figure 2 This is a first example diagram schematically illustrating the internal modules of a control unit constituting a substrate processing apparatus according to an embodiment of the present invention.

[0090] according to Figure 2 The control unit 160 may include a counting module 210, a comparison module 220, a memory module 230, and an evaluation module 240.

[0091] The counting module 210 counts the number of times each nozzle that makes up the inkjet head unit 140 ejects.

[0092] As described above, the inkjet head unit 140 may include a nozzle plate, multiple nozzles, piezo elements, etc. Here, the number of piezo elements is set to correspond to the number of nozzles, and each nozzle can eject substrate processing liquid onto the substrate G according to the operation of the corresponding piezo elements. That is, the number of ejections from each nozzle can be counted based on whether a voltage is applied to the corresponding piezo elements.

[0093] Thus, the counting module 210 can count the number of times each nozzle ejects based on the number of times voltage is applied to the corresponding piezoelectric element.

[0094] On the other hand, even though voltage has been applied to the piezoelectric element, the nozzle may fail to eject the substrate processing liquid due to reasons such as program errors. In this case, the number of times voltage is applied to the piezoelectric element and the number of times the nozzle ejects liquid are inconsistent, so the number of times the nozzle ejects liquid may be inaccurate.

[0095] Considering the above, the substrate processing apparatus 100 may further include a camera sensor, and as shown in the figure. Figure 3As shown, the control unit 160 may also include a camera module 310 and a processing module 320.

[0096] Figure 3 This is a second example diagram schematically illustrating the internal modules of a control unit constituting a substrate processing apparatus according to an embodiment of the present invention.

[0097] like Figure 4 As shown, the camera sensor 410 can capture images of the substrate processing liquid 430 ejected onto the substrate G through the nozzle 420. For this purpose, the camera sensor 410 can be arranged to capture images of the space between the nozzle 420 of the inkjet head unit 140 and the substrate G. Figure 4 This is an example diagram illustrating the function of the control unit constituting a substrate processing apparatus according to an embodiment of the present invention.

[0098] The camera module 310 can control the camera sensor 410. The camera module 310 can control the camera sensor 410 to capture images of the substrate processing liquid 430 sprayed onto the substrate G through the nozzle 420.

[0099] When the nozzle 420 sprays the substrate processing liquid 430 onto the substrate G, the camera module 310 can control the camera sensor 410. Specifically, when a voltage is applied to the piezoelectric element 440 which corresponds to the nozzle 420, the camera module 310 can anticipate that the nozzle 420 will spray the substrate processing liquid 430 onto the substrate G and control the camera sensor 410.

[0100] In this embodiment, when the camera sensor 410 captures the space between the nozzle 420 and the substrate G under the control of the camera module 310 to obtain image information, the image information can be used to determine whether the number of times the nozzle 420 sprays out is accurately counted.

[0101] The processing module 320 can determine whether the nozzle 420 is properly spraying the substrate processing liquid 430 onto the substrate G based on the image information acquired by the camera sensor 410, under the control of the camera module 310.

[0102] When voltage is applied to the piezoelectric element 440, the nozzle 420, which corresponds to the piezoelectric element 440, can spray the substrate processing liquid 430 onto the substrate G according to the operation of the piezoelectric element 440, and the camera sensor 410 can capture the substrate processing liquid 430 falling onto the substrate G. Therefore, the image information acquired by the camera sensor 410 should show the substrate processing liquid 430. The processing module 320 can refer to this to determine whether the nozzle 420 is properly spraying the substrate processing liquid 430 onto the substrate G.

[0103] After determining whether the nozzle 420 is properly spraying the substrate processing liquid 430 onto the substrate G, the processing module 320 can determine whether the number of times the nozzle 420 sprays is accurately counted.

[0104] When the nozzle 420 normally sprays the substrate processing liquid 430 onto the substrate G, the number of times voltage is applied to the piezoelectric element 440 will coincide with the number of times the nozzle 420 sprays. Therefore, in this case, the processing module 320 can determine that the number of times the nozzle 420 sprays is accurately counted.

[0105] Conversely, when the nozzle 420 fails to properly spray the substrate processing liquid 430 onto the substrate G, the number of times voltage is applied to the piezoelectric element 440 will not match the number of times the nozzle 420 sprays liquid. Therefore, in this case, the processing module 320 can determine that the number of times the nozzle 420 sprays liquid is not accurately counted.

[0106] On the other hand, in this embodiment, in order to improve the image acquisition rate of the substrate processing liquid 430 falling onto the substrate G, the camera sensor 410 can continuously take pictures at certain time intervals. In this case, the camera sensor 410 can continuously take pictures from the moment the substrate processing liquid 430 is ejected from the nozzle 420 until the moment the substrate processing liquid 430 reaches the substrate G.

[0107] On the other hand, the processing result of the processing module 320 can be provided to the evaluation module 240, and the evaluation module 240 can use the processing result of the processing module 320 when evaluating the lifespan of the inkjet head unit 140.

[0108] Refer again Figure 2 Please provide an explanation.

[0109] The comparison module 220 compares the number of times the nozzle 420 sprays with a reference value. The comparison module 220 can determine whether the number of times the nozzle 420 sprays is above the reference value through this comparison. The comparison module 220 can perform the comparison after receiving the number of times the nozzle 420 sprays from the counting module 210.

[0110] The memory module 230 stores a reference value. When comparing the number of times the nozzle 420 sprays with the reference value, the comparison module 220 can read the reference value from the memory module 230 and then perform the comparison. The steps of receiving the number of times the nozzle 420 sprays from the counting module 210 and reading the reference value from the memory module 230 can be performed simultaneously, or either step can be performed first.

[0111] The baseline value can be predetermined and stored in the memory module 230 based on the user's empirical replacement cycle. Here, the user's empirical replacement cycle refers to situations such as poor quality of the final printing result of the substrate G or a high number of nozzle outages.

[0112] After printing on the substrate G using the multiple nozzles of the inkjet head unit 140, the printing result of the substrate G can be inspected. At this time, if the printing result of the substrate G meets the benchmark, it can be determined that the printing result of the substrate G is good; if the printing result of the substrate G does not meet the benchmark, it can be determined that the printing result of the substrate G is bad.

[0113] Due to factors such as internal particle accumulation, as usage frequency increases, the nozzle may fail to spray the specified amount of substrate processing liquid onto the substrate G, or the sprayed substrate processing liquid may detach from the designated position on the substrate G. In this case, the printing result of the substrate G may not meet the benchmark, thus the printing result of the substrate G is judged as defective. In this embodiment, the printing result of the substrate G becomes defective after using the nozzle a few times can be confirmed by checking the process, and this value is determined as the benchmark value.

[0114] On the other hand, in this embodiment, it can also be confirmed that when the nozzle is used several times, the flatness of the layer formed on the substrate G by printing does not meet the reference, or it can be confirmed whether there are problems such as spots on the substrate G, and its value is determined as the reference value.

[0115] On the other hand, as mentioned above, with increased usage frequency, particles may accumulate inside the nozzle, potentially leading to problems such as satellite ejection, non-ejection, or poor ejection position accuracy. In this embodiment, such a nozzle can be defined as a defective nozzle, and the corresponding nozzle can be excluded from printing on the substrate G. In this embodiment, the situation where the nozzle does not participate in the printing of the substrate G is defined as nozzle out.

[0116] During process inspection, it can be confirmed that the nozzle exits the test after a certain number of uses. In this embodiment, this value can be determined as a baseline value.

[0117] Although Figure 1 Although not shown, the substrate processing apparatus 100 may include a separate inspection device. The determination of the reference value can be performed by such a separately configured inspection device.

[0118] As described above, the comparison module 220 can read a reference value from the memory module 230 and then compare the number of nozzle ejections with the reference value. However, this embodiment is not limited to this. (See also...) Figure 5The comparison module 220 can also compare the number of times the nozzle sprays with the reference value after receiving the reference value input through the input module 330, or it can compare the number of times the nozzle sprays with the reference value after receiving the reference value through the communication module 340. Figure 5 This is a third example diagram schematically illustrating the internal modules of a control unit constituting a substrate processing apparatus according to an embodiment of the present invention.

[0119] Refer again Figure 2 Please provide an explanation.

[0120] The evaluation module 240 is used to evaluate the lifespan of the inkjet head unit 140 based on the comparison results of the comparison module 220.

[0121] The comparison module 220 can compare the number of ejections from the nozzle with a reference value to determine whether the number of ejections from each nozzle constituting the inkjet head unit 140 is above the reference value. Based on the comparison result of the comparison module 220, the evaluation module 240 can extract the nozzles that eject the substrate processing liquid above the reference value from the nozzles constituting the inkjet head unit 140.

[0122] When a nozzle capable of ejecting a substrate processing liquid exceeding a reference value is extracted from the nozzles constituting the inkjet head unit 140, the evaluation module 240 can calculate the number of nozzles ejecting a substrate processing liquid exceeding the reference value (i.e., nozzles with an ejection frequency exceeding the reference value). When the number of nozzles with an ejection frequency exceeding the reference value is calculated, the evaluation module 240 can compare the calculated value with the reference value (i.e., the reference number) to evaluate whether the lifespan of the inkjet head unit 140 has reached its service life.

[0123] When the calculated value is determined to be above the baseline value, the evaluation module 240 can assess that the lifespan of the inkjet head unit 140 has reached its service life. In this case, the evaluation module 240 can instruct the administrator to replace the inkjet head unit 140. On the other hand, when the calculated value is determined to be below the baseline value, the evaluation module 240 can assess that the lifespan of the inkjet head unit 140 has not reached its service life.

[0124] In the above text, the reference value can be predetermined and can correspond to the number of nozzles.

[0125] On the other hand, the evaluation module 240 can simply compare the calculated value with the reference value to evaluate whether the lifespan of the inkjet head unit 140 has reached its service life. However, it is not limited to this. It can also calculate the ratio of the calculated value, that is, the proportion of nozzles that eject more than the reference value among all the nozzles constituting the inkjet head unit 140, and then compare the ratio of the calculated value with the reference ratio to evaluate whether the lifespan of the inkjet head unit 140 has reached its service life.

[0126] In the above-described scenario, when the calculated value ratio is above the baseline ratio, the evaluation module 240 can determine that the lifespan of the inkjet head unit 140 has reached its service life, and in this case, it can instruct the administrator to replace the inkjet head unit 140. Conversely, when the calculated value ratio is below the baseline ratio, the evaluation module 240 can determine that the lifespan of the inkjet head unit 140 has not reached its service life.

[0127] On the other hand, the control unit 160 can allocate nozzles with relatively low usage to printing on the substrate G based on the amount of each nozzle used (i.e., the number of times the nozzles eject, counted by the counting module 210), thereby equalizing the number of ejections and maximizing the lifespan of the inkjet head unit 140. This will be explained below.

[0128] Figure 6 This is a fourth example diagram schematically illustrating the internal modules of a control unit constituting a substrate processing apparatus according to an embodiment of the present invention.

[0129] The extraction module 510 serves to extract nozzles with relatively low usage from the nozzles constituting the inkjet head unit 140 based on the usage of each nozzle.

[0130] When extracting nozzles with relatively low usage, extraction module 510 can randomly extract nozzles with usage below a baseline amount. Alternatively, extraction module 510 can extract nozzles sequentially, starting with the nozzle with the lowest usage.

[0131] The control module 520 controls the use of nozzles extracted by the extraction module 510 during substrate G printing. The control module 520 can control the nozzles to be arranged in the order extracted by the extraction module 510, and to use the corresponding nozzles on substrate G in the order of arrangement.

[0132] The functions of the extraction module 510 and the control module 520 described above can be applied separately from the functions of the comparison module 220 and the evaluation module 240. However, this embodiment is not limited to this. The functions of the extraction module 510 and the control module 520 described above can also be performed after the evaluation function of the evaluation module 240.

[0133] For example, when the evaluation module 240 determines that the inkjet head unit 140 has not reached its service life, the extraction module 510 and the control module 520 can sequentially execute the above-mentioned functions. According to this embodiment, through this function of the extraction module 510 and the control module 520, it is possible to... Figure 7 As shown, the number of ejections from each nozzle is equalized, thus maximizing the lifespan of the inkjet head unit 140. Figure 7 This is a reference diagram used to illustrate the effects of the present invention.

[0134] Above, refer to Figures 2 to 7 The various functions of the control unit 160 are described. These functions of the control unit 160 can be configured as a computer program, and the computer program can be installed in the microprocessor within the control unit 160 and applied by the microprocessor.

[0135] This invention relates to software implementation of a method for predicting and maximizing the lifespan of an inkjet head unit 140. In this invention, the number of ejections from each nozzle constituting the inkjet head unit 140 can be counted and used for the maintenance of the inkjet head unit 140.

[0136] In this invention, the number of times each nozzle of the inkjet head unit 140 ejects can be recorded in software and the lifespan of the inkjet head unit 140 can be predicted. The substrate G is printed by reflecting the usage of each nozzle, thereby maximizing the lifespan of the inkjet head unit 140.

[0137] According to the present invention, by recording and identifying the number of times each nozzle of the inkjet head unit 140 ejects, the service life of the inkjet head unit 140 can be determined, and by having more of the less frequently used nozzles participate in image generation, i.e., substrate G printing, the service life of the inkjet head unit 140 can be maximized.

[0138] In this invention, the ejection of substrate processing liquid from the inkjet head unit 140 of the inkjet device (i.e., the substrate processing apparatus 100) can be performed via printing commands, spitting commands, etc., from the pattern software (Pattern SW). Since the printing / spitting commands contain information about the printed image and whether or not the nozzles are used, the number of ejections from each nozzle can be counted. As stated above, the spitting command instructs the ejection of liquid at a predetermined frequency within a predetermined time after setting the nozzles to be used, and the printing command instructs the sending of an image containing printing / non-printing information for each nozzle to the head driver for ejection.

[0139] In this invention, by counting the number of ejections from each nozzle, it is possible to determine whether the physical lifespan provided by the head maker is approaching, or whether it is approaching the user's empirical replacement cycle based on increased defects (poor print quality), increased nozzle ejection, etc. This allows for the prediction of the inkjet head unit 140's lifespan and advance preparation for its replacement. Furthermore, by determining the usage of each nozzle and generating printed images using nozzles with relatively low usage, the lifespan of the inkjet head unit 140 can be maximized through equalizing the number of ejections.

[0140] In summary, the features of this invention can be summarized as follows.

[0141] First, by recording the number of times each nozzle of the inkjet head is used in the software, the lifespan of the head can be predicted and preparations can be made.

[0142] Second, by taking into account the usage of each nozzle and reflecting it in image generation, the lifespan of the head can be maximized.

[0143] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, those skilled in the art should understand that the present invention can be implemented in other specific forms without changing its technical concept or essential features. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

Claims

1. A control unit for maintaining an inkjet head unit that ejects substrate processing liquid onto a substrate, and comprising: A counting module is used to count the number of times each nozzle of the inkjet head unit ejects an ink. A comparison module is used to compare the number of ejections with a reference value to determine whether the number of ejections is above the reference value; as well as An evaluation module is used to evaluate whether the lifespan of the inkjet head unit has reached its service life based on whether the number of ejections from each nozzle is above the benchmark value. The counting module counts the number of ejections based on whether voltage is applied to the piezoelectric element involved in the operation of the nozzle. The control unit determines whether the number of ejections matches the number of times voltage is applied to the piezoelectric element involved in the operation of the nozzle.

2. The control unit according to claim 1, wherein, The piezoelectric elements are configured in the same number as the nozzles, and The counting module counts the number of ejections based on whether a voltage is applied to the piezoelectric element corresponding to the nozzle.

3. The control unit according to claim 1, wherein, The reference value is related to at least one of the printing quality of the substrate and the nozzles that do not participate in the substrate printing.

4. The control unit according to claim 3, wherein, When the reference value is related to the printing quality, the reference value is the amount of nozzles used in relation to the formation of patterns on the substrate, or the amount of nozzles used in relation to the failure of the flatness of the layers formed on the substrate by printing to meet the reference.

5. The control unit according to claim 3, wherein, When the reference value is related to the nozzles that do not participate in substrate printing, the reference value is the amount of defective nozzles that are judged to be defective.

6. The control unit according to claim 5, wherein, The defective nozzle is associated with at least one of satellite ejection, failure to eject, and inaccurate ejection position.

7. The control unit according to claim 1, further comprising any one of a memory module for storing the reference value, an input module for inputting the reference value, and a communication module for receiving the reference value from an external source. in, The reference value is provided to the comparison module through any one of the memory module, the input module, and the communication module.

8. The control unit according to claim 1, wherein, The evaluation module compares the number of nozzles that eject more than the baseline value with the baseline number to evaluate whether the lifespan of the inkjet head unit has reached its service life.

9. The control unit according to claim 8, wherein, When the number of nozzles is greater than the baseline number, the evaluation module assesses that the lifespan of the inkjet head unit has reached its service life and requests the replacement of the inkjet head unit that has reached its service life.

10. The control unit according to claim 1, wherein, The control unit selects nozzles with relatively low usage for printing on the substrate based on the amount of each nozzle used.

11. The control unit according to claim 1, further comprising: The extraction module is used to extract nozzles with relatively low usage based on the usage of each nozzle. as well as The control module is used to control the extracted nozzles to participate in the printing on the substrate. Specifically, when the lifespan of the inkjet head unit is assessed to be less than its service life, the extraction module and the control module are activated.

12. The control unit according to claim 11, wherein, The extraction module extracts nozzles with usage below the baseline amount or nozzles with the least usage.

13. The control unit according to claim 1, wherein, The control unit determines whether the components are compatible based on whether the nozzle normally sprays the substrate processing liquid onto the substrate when voltage is applied to the piezoelectric element.

14. The control unit according to claim 13, further comprising: A camera module is used to capture images of the space between the nozzle and the substrate using a camera sensor; as well as The processing module is used to determine whether the nozzle sprays the substrate processing liquid onto the substrate based on the image information acquired by the camera.

15. The control unit according to claim 14, wherein, When voltage is applied to the piezoelectric element, the camera module captures an image of the space.

16. A control unit for maintaining an inkjet head unit that ejects substrate processing liquid onto a substrate, and comprising: A counting module is used to count the number of ejections from each nozzle of the inkjet head unit, and to count the number of ejections based on whether voltage is applied to the piezoelectric element involved in the operation of the nozzle; A comparison module is used to compare the number of ejections with a reference value to determine whether the number of ejections is above the reference value; as well as An evaluation module is used to evaluate whether the lifespan of the inkjet head unit has reached its service life based on whether the number of ejections from each nozzle is above the benchmark value. Among them, the nozzles with relatively low usage are selected for printing on the substrate based on the usage amount of each nozzle, and The reference value is related to at least one of the printing quality of the substrate and the nozzles that do not participate in the substrate printing. The counting module counts the number of ejections based on whether voltage is applied to the piezoelectric element involved in the operation of the nozzle. The control unit determines whether the number of ejections matches the number of times voltage is applied to the piezoelectric element involved in the operation of the nozzle.

17. A substrate processing apparatus, comprising: A process unit for supporting the substrate during substrate processing; An inkjet head unit includes multiple nozzles and is used to eject substrate processing liquid onto the substrate through the multiple nozzles; A gantry unit is used to move the position of the inkjet head unit. A substrate processing liquid supply unit is used to supply the substrate processing liquid to the inkjet head unit; as well as The control unit is used to maintain the inkjet head unit. The control unit includes: A counting module is used to count the number of times each nozzle of the inkjet head unit ejects an ink. A comparison module is used to compare the number of ejections with a reference value to determine whether the number of ejections is greater than or equal to the reference value; and An evaluation module is used to evaluate whether the lifespan of the inkjet head unit has reached its service life based on whether the number of ejections from each nozzle is above the benchmark value. The counting module counts the number of ejections based on whether voltage is applied to the piezoelectric element involved in the operation of the nozzle. The control unit determines whether the number of ejections matches the number of times voltage is applied to the piezoelectric element involved in the operation of the nozzle.

18. The substrate processing apparatus according to claim 17, further comprising: A camera sensor is used to capture images of the space between the at least one nozzle and the substrate when at least one of the plurality of nozzles sprays the substrate processing liquid onto the substrate.

Images