Vertical PVD double-side deposition silicon wafer loading device

Abstract

The application provides a vertical PVD double-sided deposition silicon wafer loading device, which comprises a substrate holder and a carrier plate assembly; the carrier plate assembly comprises a tray and a mask plate; the tray is provided with a plurality of first film coating areas; a fitting groove is formed in the reverse side wall of the tray in the first film coating area; the tray in the first film coating area is also provided with a first film coating through hole, which extends to the fitting groove; the mask plate is provided with a plurality of second film coating areas; the mask plate is also provided with a second film coating through hole; the tray and the mask plate are detachably connected; the substrate holder is provided with a work station; the substrate holder in the work station is provided with a through groove; the substrate holder is also provided with a cover plate assembly; two cover plates of the cover plate assembly are respectively arranged on the front and back sides of the substrate holder; the lower end of the cover plate is hingedly connected with the substrate holder; the upper end of the cover plate is detachably connected with the substrate holder; and the cover plate is provided with a cover hole. The loading device can realize that the target material simultaneously performs film coating operation on multiple wafers, and two wafers can perform film coating in the same area.

Description

TECHNICAL FIELD

[0001] The present application relates to a vertical PVD double-sided deposition wafer loading device. BACKGROUND

[0002] PVD physical vapor deposition technology refers to a technology that under vacuum conditions, a material source (solid or liquid) surface is vaporized into gaseous atoms or molecules or partially ionized into ions by physical methods, and through a low-pressure gas (or plasma) process, a thin film with certain special functions is deposited on the substrate surface. Physical vapor deposition is one of the main surface treatment technologies.

[0003] Large-area magnetron sputtering coating equipment has two main modes: horizontal and vertical. Currently, the magnetron sputtering used for TOPCon is mainly horizontal equipment. The advantage of this equipment is that the silicon wafer is easy to load, and the lower coating can use the carrier plate for masking. The horizontal silicon wafer loading device mainly has the following disadvantages: (1) the silicon wafer is easy to fall off, causing the target to be short-circuited; (2) the floor space is large; (3) it is not easy to realize double-sided deposition. At present, there is a lack of a silicon wafer loading device that cooperates with a vertical magnetron sputtering equipment.

[0004] The utility model patent with the application number CN202122819467.7 discloses a knife particle vacuum coating loading rack, which comprises a knife particle mounting rack. The knife particle mounting rack has a tile-shaped structure, including a tile-shaped bottom plate, a tile-shaped top plate, a support rod, and a knife particle rod. The tile-shaped top plate and the tile-shaped bottom plate are arranged in a top-down correspondence. The support rod is located between the tile-shaped top plate and the tile-shaped bottom plate and is located on the inner side. The support rod and the tile-shaped bottom plate are fixedly installed. The support rod and the tile-shaped top plate are detachably installed. The knife particle rod is located between the tile-shaped top plate and the tile-shaped bottom plate and is located on the outer side. The knife particle rod and the tile-shaped bottom plate are rotationally connected. The knife particle rod and the tile-shaped top plate are rotationally connected. The lower section of the knife particle rod is also fixedly installed with a driving gear. The above-mentioned patent technology cannot be applied to vertical PVD magnetron sputtering coating equipment and cannot overcome the technical problems existing in the prior art.

[0005] The invention with the application number CN201810599996.0 belongs to the technical field of vacuum coating and specifically relates to a physical vapor deposition (PVD) device. The device comprises a vacuum chamber, a workpiece holder arranged in the vacuum chamber, an ion source system, a sputtering power supply, and a plurality of double-twin magnetron targets. The workpiece holder has a vertical rotary structure, and the ion source system adopts a vertical strip-shaped large-area ion source. Similarly, the above-mentioned patent technology cannot be applied to vertical PVD magnetron sputtering coating equipment and cannot overcome the technical problems existing in the prior art. SUMMARY

[0006] The technical problem solved by the present application is to provide a vertical PVD double-sided deposition wafer loading device with reasonable structure and suitable for vertical magnetron sputtering equipment.

[0007] To solve the above technical problems, the present application provides a vertical PVD double-sided deposition wafer loading device;

[0008] The substrate holder comprises a substrate holder and at least one set of carrier plate assembly;

[0009] The carrier plate assembly comprises a tray and a mask plate, the tray is provided with a plurality of first film coating areas, the reverse side wall of the tray in the first film coating area is provided with a fitting groove matching the profile of the substrate, and the tray in the first film coating area is also provided with a first film coating through hole matching the film coating area of the substrate, one side of the first film coating through hole extends to the front side wall of the tray, and the other side of the first film coating through hole extends to the fitting groove; the mask plate is provided with a plurality of second film coating areas, the plurality of second film coating areas correspond to the plurality of first film coating areas of the tray one by one, the mask plate in the second film coating area is also provided with a second film coating through hole matching the film coating area of the substrate, the second film coating through hole penetrates the front and reverse side walls of the mask plate, the tray and the mask plate are detachably connected, and the fitting groove of the tray and the mask plate form a space for placing two substrates;

[0010] The substrate holder is provided with at least one station, the substrate holder in the station is provided with a through groove for placing the corresponding carrier plate assembly, and the substrate holder is also provided with at least one set of cover plate assembly; the at least one set of cover plate assembly, the at least one station and the at least one set of carrier plate assembly are in one-to-one correspondence; the cover plate assembly comprises two cover plates, the two cover plates are respectively located on the front and reverse sides of the substrate holder at the corresponding station position; the lower end of the cover plate is hinged to the substrate holder, and the upper end of the cover plate is detachably connected to the substrate holder; the cover plate is provided with a shielding hole penetrating the front and reverse sides thereof; and the shielding hole completely covers all the first film coating through holes or all the second film coating through holes of the carrier plate assembly.

[0011] As a preferred embodiment of the vertical PVD double-sided deposition wafer loading device, the cover plate assembly further comprises two fixing bolts corresponding to the two cover plates; the fixing bolts penetrate the upper end of the corresponding cover plate and cooperate with the body of the substrate holder, so as to realize the detachable connection between the upper end of the cover plate and the substrate holder.

[0012] As a preferred embodiment of the vertical PVD double-sided deposition wafer loading device, the front surface of the mask plate extends along the edge of the second film coating through hole and has an annular protrusion; after the tray and the mask plate are matched, the front end surface of the annular protrusion has only a space for accommodating two substrates between the corresponding fitting groove of the tray.

[0013] As a preferred embodiment of the vertical PVD double-sided deposition wafer loading device, the second film coating through hole of the mask plate has a chamfer between the hole wall and the reverse end surface of the mask plate.

[0014] As a preferred embodiment of the vertical PVD double-sided deposition wafer loading device, the top of the substrate holder is provided with a plurality of guide rollers matched with the guide rails in the tube furnace. The guide rollers are arranged in sequence along the length direction of the substrate holder.

[0015] As a preferred embodiment of the vertical PVD double-sided deposition wafer loading device, the bottom of the substrate holder is provided with a pull round steel matched with the driving mechanism in the tube furnace.

[0016] After adopting such structure, two wafers are placed between the assembly groove of each tray and the mask plate, the tray and the mask plate are fixed by bolts, and then the cover plate assembly is placed in the corresponding station of the substrate holder as a whole, and the two cover plates of the cover plate assembly abut against the tray and the mask plate of the cover plate assembly respectively.

[0017] The vertical PVD double-sided deposition wafer loading device can realize the film deposition operation of the target material to multiple wafers at the same time, and the film deposition can be realized by two wafers in the same area. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is the back view of the tray in the embodiment of the vertical PVD double-sided deposition wafer loading device.

[0019] Figure 2 is the cross-sectional view of the left view of Figure 1

[0020] Figure 3 is the enlarged view of A part of Figure 2

[0021] Figure 4 is the back view of the mask plate in the embodiment of the vertical PVD double-sided deposition wafer loading device.

[0022] Figure 5 is the cross-sectional view of the left view of Figure 4

[0023] Figure 6 is the enlarged view of B part of Figure 5

[0024] Figure 7 is the front view of the substrate holder in the embodiment of the vertical PVD double-sided deposition wafer loading device.

[0025] Figure 8 is the cross-sectional view of the left view of Figure 7 DETAILED DESCRIPTION

[0026] ​​​​​To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0027] The terms “vertical,” “horizontal,” “left,” “right,” and similar expressions used in this document are for illustrative purposes only and do not represent the only possible implementation.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0029] Please see Figures 1 to 8 .

[0030] This vertical PVD double-sided deposition silicon wafer loading device includes a substrate holder 2 and two sets of carrier assemblies.

[0031] The carrier assembly includes a tray 11 and a mask 12. The tray 11 has six first coating areas. The reverse sidewall of the tray 11 within each first coating area has a mounting groove 11a that conforms to the contour of the substrate. The tray 11 within each first coating area also has first coating through-holes 11b that correspond to the coating areas of the substrate. One side of the first coating through-hole 11b extends to the front sidewall of the tray 11, and the other side extends to communicate with the mounting groove 11a. The mask 12 has six second coating areas, each corresponding to one of the six first coating areas of the tray 11. The mask 12 located in the second coating area also has a second coating through hole 12b that matches the coating area of ​​the substrate. The first coating through hole 11b and the second coating through hole 12b have the same cross-sectional shape and area. The second coating through hole 12b penetrates the front and back sidewalls of the mask 12. The wall of the second coating through hole 12b and the back end face of the mask 12 have a chamfer 12c. The tray 11 and the mask 12 are detachably connected by bolts. The mounting groove 11a of the tray 11 and the mask 12 form a space for placing two substrates. The area of ​​the tray 11 is larger than the area of ​​the mask 12.

[0032] The annular protrusion 12a extends along the edge of the second plating through hole 12b on the front surface of the mask plate 12. After the tray 11 is matched with the mask plate 12, the front end surface of the annular protrusion 12a has only space for accommodating two substrates between the corresponding assembly groove 11a of the tray 11.

[0033] The substrate holder 2 is provided with two work stations. The substrate holder 2 in the work station is provided with a through groove for placing a corresponding carrier plate assembly. The substrate holder 2 is also provided with two sets of cover plate 21 assemblies. The two sets of cover plate 21 assemblies, the two work stations and the two sets of carrier plate assemblies are in one-to-one correspondence. The cover plate 21 assembly comprises two cover plates 21. The two cover plates 21 are respectively on the front and back surfaces of the substrate holder 2 at the corresponding work station positions. The lower end of the cover plate 21 is hinged to the substrate holder 2. The upper end of the cover plate 21 is detachably connected to the substrate holder 2. The cover plate 21 is provided with a cover hole 21a penetrating the front and back surfaces thereof. The cover hole 21a completely covers all the first plating through holes 11b or all the second plating through holes 12b of the carrier plate assembly. The area of the cover hole 21a is smaller than the area of the tray 11.

[0034] The cover plate 21 assembly further comprises two fixing bolts 21b. The two fixing bolts 21b correspond to the two cover plates 21. The fixing bolt 21b penetrates the upper end of the corresponding cover plate 21 and cooperates with the body of the substrate holder 2 to realize the detachable connection between the upper end of the cover plate 21 and the substrate holder 2.

[0035] The top of the substrate holder 2 is provided with five guide rollers 22 cooperating with the guide rails in the tube furnace. The five guide rollers 22 are arranged in sequence and at intervals along the length direction of the substrate holder 2. The bottom of the substrate holder 2 is provided with a pull round steel 23 cooperating with the driving mechanism in the tube furnace.

[0036] In use, two substrates are placed between the assembly groove 11a of each tray 11 and the mask plate 12. The tray 11 and the mask plate 12 are fixed by bolts. Then the carrier plate assembly is placed in the two work stations of the substrate holder 2. The two cover plates 21 of the cover plate 21 assembly abut against the tray 11 and the mask plate 12 of the carrier plate assembly respectively.

[0037] The above is only one embodiment of the present application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the principles of the present application. These should also be considered within the scope of protection of the present application.

Claims

1. A vertical PVD double-sided deposition silicon wafer loading device, characterized in that: it comprises a substrate holder and at least one set of carrier plate assemblies; the carrier plate assembly comprises a tray and a mask plate, the tray is provided with a plurality of first coating areas, the reverse side wall of the tray in the first coating area is provided with an assembly groove matching the profile of the substrate, the tray in the first coating area is also provided with a first coating through hole matching the coating area of the substrate, one side of the first coating through hole extends to the front side wall of the tray, the other side of the first coating through hole extends to the assembly groove, the mask plate is provided with a plurality of second coating areas, the plurality of second coating areas correspond to the plurality of first coating areas of the tray one by one, the mask plate in the second coating area is also provided with a second coating through hole matching the coating area of the substrate, the second coating through hole penetrates the front and reverse side walls of the mask plate, the tray and the mask plate are detachably connected, and the assembly groove of the tray and the mask plate form a space for placing two substrates; the substrate holder is provided with at least one station, the substrate holder in the station is provided with a through slot for placing the corresponding carrier plate assembly, and the substrate holder is also provided with at least one set of cover plate assemblies, the at least one set of cover plate assemblies, the at least one station and the at least one set of carrier plate assemblies are in one-to-one correspondence, the cover plate assembly comprises two cover plates, the two cover plates are respectively located on the front and reverse sides of the substrate holder at the corresponding station position, the lower end of the cover plate is hinged to the substrate holder, and the upper end of the cover plate is detachably connected to the substrate holder, the cover plate is provided with a shielding hole penetrating the front and reverse sides thereof, and the shielding hole completely covers all the first coating through holes or all the second coating through holes of the carrier plate assembly.

2. The vertical PVD double-sided deposition silicon wafer loading device according to claim 1, characterized in that: the cover plate assembly further comprises two fixing bolts, the two fixing bolts correspond to the two cover plates one by one, the fixing bolt penetrates the upper end of the corresponding cover plate and cooperates with the body of the substrate holder to realize the detachable connection between the upper end of the cover plate and the substrate holder.

3. The vertical PVD double-sided deposition silicon wafer loading device according to claim 1, characterized in that: the front surface of the mask plate is provided with an annular protrusion extending along the edge of the second coating through hole, and after the tray is matched with the mask plate, the front end surface of the annular protrusion has only a space for accommodating two substrates between the corresponding assembly groove of the tray.

4. The vertical PVD double-sided deposition silicon wafer loading device according to claim 1, characterized in that: the second coating through hole of the mask plate has a chamfer between the hole wall and the reverse end surface of the mask plate.

5. The vertical PVD double-sided deposition silicon wafer loading device according to claim 1, characterized in that: the top of the substrate holder is provided with a plurality of guide rollers matched with the guide rails in the tube furnace, and the plurality of guide rollers are arranged in sequence and at intervals along the length direction of the substrate holder.

6. The vertical PVD double-sided deposition silicon wafer loading device according to claim 1, characterized in that: the bottom of the substrate holder is provided with a pull light round steel matched with a driving mechanism in the tube furnace. ​ ​ ​ ​ ​ ​ ​ ​

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