Flexible light emitting mechanism and flexible light emitting mechanism manufacturing process

Abstract

The application provides a flexible light-emitting mechanism and a manufacturing process thereof, which comprises a flexible substrate, a conductive circuit arranged on the flexible substrate, the conductive circuit comprising two wire segments, a wire port arranged between the two wire segments, and a light-emitting component located at the wire port, the light-emitting component comprising a light-emitting lamp bead and two lamp bead pads supporting the bottom of the light-emitting lamp bead, the two lamp bead pads being arranged at intervals, and the positive and negative poles of the light-emitting lamp bead being connected to the two wire segments respectively through the two lamp bead pads to form a loop. In the application, the conductive circuit is used to replace the copper metal circuit in the prior art, so that the environmental protection performance is improved and the manufacturing cost is reduced, and the positive and negative poles of the light-emitting lamp bead are connected to the two wire segments respectively through the two lamp bead pads arranged at intervals, so that the stable connection between the light-emitting lamp bead and the flexible substrate is realized, and the use stability of the flexible light-emitting mechanism is improved.

Description

Technical Field

[0001] This invention belongs to the field of electronic product accessories technology, and particularly relates to a flexible light-emitting mechanism and a manufacturing process for the flexible light-emitting mechanism. Background Technology

[0002] Intelligent surface luminescent structural components are functional parts that integrate structural materials with luminescent functions. With the advent of the intelligent era, surface interior decoration is no longer just simple interior decoration, but an integrated plastic-electrical product that combines sound, light, and electricity. Intelligent surface technology is also gradually being applied to automotive interiors.

[0003] Innovative products such as smart surfaces and smart ambient lighting will revolutionize interior products. Currently, most smart surface luminescent products can only make luminescent components on hard substrates such as glass, plastic, and metal. Although Cu metal circuits can be made on flexible substrates such as PI and PET through exposure, development, and etching processes, and luminescent devices can be arranged on the circuits, the production cost is high and it is not environmentally friendly. Moreover, circuits cannot be made on fabrics through exposure, development, and etching processes.

[0004] While Ag circuits can be manufactured through direct printing, addressing both environmental and cost-effectiveness issues, soldering problems prevent the placement of light-emitting devices on the Ag circuits. Furthermore, embedding LEDs within flexible PET, PI, or fabric / leather materials can lead to damage to the LED circuitry and the contact between the circuitry and the LEDs during use due to compression or deformation, resulting in a short lifespan. Summary of the Invention

[0005] The main objective of this invention is to propose a flexible light-emitting mechanism and a manufacturing process for the flexible light-emitting mechanism, aiming to solve the technical problems of high cost and environmental unfriendliness of the existing flexible light-emitting structure.

[0006] To achieve the above objectives, the present invention provides a flexible light-emitting mechanism, comprising: a flexible substrate; a conductive circuit disposed on the flexible substrate, the conductive circuit including two wiring segments, with a connection port between the two wiring segments; and a light-emitting component located at the connection port, the light-emitting component including a light-emitting LED and two LED pads supported on the bottom of the light-emitting LED, the two LED pads being spaced apart, and the positive and negative electrodes of the light-emitting LED being respectively connected to the two wiring segments through the two LED pads to form a circuit.

[0007] In this embodiment of the invention, an insulating protective layer is wrapped around the conductive line and the lamp bead pad, and the insulating protective layer is provided with a clearance opening to avoid the light-emitting lamp bead.

[0008] In this embodiment of the invention, the bottom surface of the light-emitting lamp bead is connected to the lamp bead pad surface, and the outer side of the light-emitting lamp bead is provided with a connector that is connected to the lamp bead pad. The edge of the clearance opening and the connector form a clearance gap.

[0009] In this embodiment of the invention, the connector is a reinforcing adhesive layer, which surrounds the outer surface of the light-emitting LED bead.

[0010] In this embodiment of the invention, the thickness of the lamp bead pad is 15μm to 35μm, the thickness of the wiring segment is 4μm to 30μm, and the thickness of the insulating protective layer is 8μm to 30μm.

[0011] In this embodiment of the invention, the thickness of the lamp bead pad is greater than the thickness of the wiring segment, and the lamp bead pad is provided with an overlap segment, which overlaps the top of the wiring segment.

[0012] In this embodiment of the invention, the flexible light-emitting mechanism further includes an elastic protective layer wrapped around the insulating protective layer and the lamp bead pads, and the elastic protective layer has an opening to avoid the light-emitting lamp beads.

[0013] In this embodiment of the invention, the distance between the top surface of the elastic protective layer and the top surface of the light-emitting lamp bead is greater than 0.2 mm.

[0014] In this embodiment of the invention, the elastic protective layer is a PDMS component or an AB adhesive component.

[0015] In this embodiment of the invention, the flexible substrate is a TPU component, a fabric component, a leather component, a PET component, a PI component, or a COP component;

[0016] And / or,

[0017] The LED chip pads are made of Cu paste, Ni paste, or Mo paste.

[0018] This invention also proposes a manufacturing process for a flexible light-emitting mechanism, the manufacturing process of which includes:

[0019] S1. Conductive lines are fabricated on a flexible substrate by inkjet printing, printing or printing methods. The conductive lines include two wiring segments and a wiring port is provided between the two wiring segments. The conductive lines are then cured.

[0020] S2. Create LED chip pads on the conductive lines by inkjet printing, printing or printing method, with two LED chip pads spaced apart at the terminal, and cure the LED chip pads.

[0021] S3. The LED beads are supported on the top of the two LED bead pads by SMT method, so that the positive and negative terminals of the LED beads are respectively connected to the two wiring segments through the two LED bead pads to form a circuit.

[0022] In this embodiment of the invention, the method further includes the following step before step S3:

[0023] S4. An insulating protective layer is formed on the outside of the conductive lines and the lamp bead pads by inkjet printing, printing or printing method. The insulating protective layer is provided with a clearance opening to avoid the light-emitting lamp bead. The insulating protective layer is then cured.

[0024] In this embodiment of the invention, step S3 is followed by:

[0025] S5. Use a dispensing machine to apply a reinforcing adhesive layer around the light-emitting LED beads to reinforce them. The edge of the clearance opening and the reinforcing adhesive layer form a clearance gap.

[0026] S6. AB glue is poured onto the light-emitting lamp beads, the insulating protective layer and the lamp bead pads, and then encapsulated by spin coating, scraping coating, roller coating and potting in sequence. After the AB glue is leveled, the AB glue is pre-fixed and cured to form an elastic protective layer. The elastic protective layer has an opening to avoid the light-emitting lamp beads.

[0027] Through the above technical solution, the flexible light-emitting mechanism provided in the embodiments of the present invention has the following beneficial effects:

[0028] Conductive circuitry can be applied to the surface of a flexible substrate using inkjet printing, printing, or other printing methods, forming a connection port between two wiring segments to provide installation space for the light-emitting components. Then, at the connection port, two spaced-apart LED pads are created using a solderable paste via inkjet printing, printing, or other printing methods. The LEDs and their pads are then soldered together, so that the positive and negative terminals of the LEDs are connected to the two wiring segments via the two pads, forming a circuit. This invention uses conductive circuitry instead of the copper metal circuitry used in existing technologies, improving environmental performance while reducing manufacturing costs. Furthermore, the two spaced-apart LED pads connect the positive and negative terminals of the LEDs to the two wiring segments, achieving a stable connection between the LEDs and the flexible substrate and improving the stability of the flexible light-emitting mechanism.

[0029] Other features and advantages of the present invention will be described in detail in the following detailed description section. Attached Figure Description

[0030] The accompanying drawings are provided to illustrate the invention and form part of the specification. They are used together with the following detailed description to explain the invention, but do not constitute a limitation thereof. In the drawings:

[0031] Figure 1 This is a schematic diagram of the structure of a flexible light-emitting mechanism according to an embodiment of the present invention;

[0032] Figure 2 yes Figure 1 A partial structural diagram;

[0033] Figure 3 This is a schematic diagram of the flexible light-emitting mechanism according to another embodiment of the present invention;

[0034] Figure 4 yes Figure 3 A partial structural diagram;

[0035] Figure 5 This is a schematic flowchart of the manufacturing process of a flexible light-emitting mechanism according to an embodiment of the present invention;

[0036] Figure 6 This is a schematic flowchart of the manufacturing process of the flexible light-emitting mechanism according to another embodiment of the present invention.

[0037] Explanation of reference numerals in the attached figures

[0038] Label Name Label Name

[0039] 100 Flexible light-emitting mechanism 321 Overlapping section

[0040] 1 Flexible substrate 4 Insulating protective layer

[0041] 2. Conductive circuit 41. Clearance opening

[0042] 21. Terminal section 5. Connector

[0043] 22 Wiring port 6 clearance

[0044] 3 Light-emitting components 7 Elastic protective layer

[0045] 31 LED beads, 71 openings

[0046] 32 LED chip pads Detailed Implementation

[0047] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0048] The flexible light-emitting mechanism according to the present invention is described below with reference to the accompanying drawings.

[0049] like Figures 1 to 3As shown, in an embodiment of the present invention, the flexible light-emitting mechanism 100 includes a flexible substrate 1, a conductive line 2, and a light-emitting component 3; the conductive line 2 is disposed on the flexible substrate 1, and the conductive line 2 includes two connecting segments 21, with a connecting port 22 between the two connecting segments 21; the light-emitting component 3 is located at the connecting port 22, and the light-emitting component 3 includes a light-emitting LED 31 and two LED pads 32 supported on the bottom of the light-emitting LED 31, the two LED pads 32 are spaced apart, and the positive and negative electrodes of the light-emitting LED 31 are respectively connected to the two connecting segments 21 through the two LED pads 32 to form a circuit.

[0050] Understandably, the conductive line 2 in this embodiment can be a silver paste line, a copper paste line, or a full paste line, and the light-emitting lamp bead 31 can be an LED lamp bead from the prior art. It should be noted that in other embodiments, there are multiple conductive lines 2, and each conductive line 2 is provided with multiple light-emitting components 3.

[0051] In this embodiment, the conductive line 2 can be applied to the surface of the flexible substrate 1 by inkjet printing, printing, or spot welding, forming a connection port 22 between the two wiring segments 21, providing installation space for the light-emitting component 3. Then, at the connection port 22, two spaced-apart lamp bead pads 32 are fabricated using a solderable paste via inkjet printing, printing, spot welding, or spot welding. The light-emitting lamp bead 31 and the lamp bead pads 32 are then welded together, so that the positive and negative terminals of the light-emitting lamp bead 31 are respectively connected to the two wiring segments 21 through the two lamp bead pads 32, forming a circuit. In this embodiment, the conductive line 2 replaces the copper metal wiring of the existing FPC, improving environmental performance while reducing manufacturing costs. Furthermore, by connecting the positive and negative terminals of the light-emitting lamp bead 31 to the two wiring segments 21 through the two spaced-apart lamp bead pads 32, a stable connection between the light-emitting lamp bead 31 and the flexible substrate 1 is achieved, improving the stability of the flexible light-emitting mechanism 100.

[0052] like Figure 1 and Figure 2 As shown, in one embodiment, an insulating protective layer 4 is wrapped around the conductive line 2 and the lamp bead pad 32. The insulating protective layer 4 is provided with a clearance opening 41 to avoid the light-emitting lamp bead 31. Understandably, the insulating protective layer 4 can be formed of insulating oil. After two spaced-apart lamp bead pads 32 are fabricated by inkjet printing, printing, or printing, the insulating protective layer 4 can be fabricated on the outer surface of the conductive line 2 and the outer surface of the lamp bead pad 32 by inkjet printing, printing, or printing, and a clearance opening 41 is provided on the insulating protective layer 4 to reserve soldering positions for the lamp bead pad 32 and the light-emitting lamp bead 31. In this embodiment, the insulating protective layer 4 can protect the conductive line 2, avoid short circuits in the conductive line 2, and improve the operational stability of the flexible light-emitting mechanism 100.

[0053] In one embodiment, the bottom surface of the light-emitting LED bead 31 is connected to the surface of the LED bead pad 32. A connector 5, which connects to the LED bead pad 32, is provided on the outer side of the light-emitting LED bead 31. The edge of the clearance opening 41 and the connector 5 form a clearance gap 6. In this embodiment, by connecting both the bottom surface and the outer side of the light-emitting LED bead 31 to the LED bead pad 32, the connection stability between the light-emitting LED bead 31 and the LED bead pad 32 can be improved, preventing the LED bead pad 32 from detaching and thus increasing the service life of the flexible light-emitting mechanism 100.

[0054] Specifically, connector 5 is a reinforcing adhesive layer, which surrounds the outer surface of the light-emitting lamp bead 31. Understandably, the reinforcing adhesive layer in this embodiment can be made of UV adhesive. The bottom surface of the light-emitting lamp bead 31 is welded to the top surface of the lamp bead solder pad 32 with Sn material. After initial fixation, the reinforcing adhesive layer can be used to reinforce the area around the light-emitting lamp bead 31.

[0055] In one embodiment, the thickness of the LED chip pad 32 is 15μm to 35μm. This avoids the situation where the LED chip pad 32 is too thin, resulting in low welding efficiency and poor welding quality. It also avoids the situation where the adhesion is weakened due to the LED chip pad 32 being too thick, thus ensuring the production efficiency and operational stability of the flexible light-emitting mechanism 100. The thickness of the wiring segment 21 is 4μm to 30μm, which facilitates the connection between the wiring segment 21 and the LED chip pad 32 and ensures the structural compactness of the flexible light-emitting mechanism 100. The thickness of the insulating protective layer 4 is 8μm to 30μm, which ensures that the conductive line 2 and the LED chip pad 32 are effectively insulated and protected.

[0056] In this embodiment of the invention, the thickness of the LED chip pad 32 is greater than the thickness of the wiring segment 21, and an overlap segment 321 is provided on the LED chip pad 32, which overlaps the top of the wiring segment 21. Figure 2 As shown, two LED pads 32 are spaced apart relative to each other in the left-right direction. The overlap section 321 of the LED pad 32 located at the left end accounts for half the length of the LED pad 32 and overlaps the top of the wiring segment 21. The other end of the LED pad 32 can be welded to the LED 31 using Sn material. In this embodiment, the LED pads 32 connect the wiring segment 21 and the LED 31 respectively through bridging welding, which improves the assembly stability of the flexible light-emitting mechanism 100.

[0057] like Figure 3 and Figure 4As shown, the flexible light-emitting mechanism 100 also includes an elastic protective layer 7 wrapped around the insulating protective layer 4 and the lamp bead pad 32. The elastic protective layer 7 has an opening 71 to avoid the light-emitting lamp bead 31. After the light-emitting lamp bead 31 is reinforced with a reinforcing adhesive layer, the insulating protective layer 4 and the lamp bead pad 32 can be encapsulated using elastomers such as PDMS or AB glue through methods such as roller coating, scraping, and potting. This makes the flexible light-emitting mechanism 100 resistant to compression and pulling, and prevents the light-emitting lamp bead 31 from falling off after repeated bending.

[0058] In this embodiment of the invention, the top surface of the elastic protective layer 7 is more than 0.2 mm away from the top surface of the light-emitting lamp bead 31. In one embodiment, the elastic protective layer 7 completely covers the light-emitting lamp bead 31, the conductive line 2, and the insulating protective layer 4, and the thickness of the elastic protective layer 7 is 0.2 mm higher than the surface of the light-emitting lamp bead 31, which ensures the tensile strength of the flexible light-emitting mechanism 100 while improving the structural compactness of the flexible light-emitting mechanism 100.

[0059] The flexible substrate 1 is made of TPU, fabric, leather, PET, PI, or COP. The flexible substrate 1 is wear-resistant, which can improve the service life of the flexible light-emitting mechanism 100. The LED bead pads 32 are made of Cu, Ni, or Mo paste, which facilitates printing on the LED bead pads 32. In one embodiment, the flexible substrate 1 is a transparent PET board, and the conductive lines 2 are printed onto the flexible substrate 1 by inkjet printing, printing, or inkjet printing.

[0060] like Figure 5 As shown, the present invention also proposes a manufacturing process for a flexible light-emitting mechanism. In a first embodiment, the manufacturing process for the flexible light-emitting mechanism includes:

[0061] S1. Conductive circuit 2 is fabricated on flexible substrate 1 by inkjet printing, printing or printing method. The conductive circuit 2 includes two wiring segments 21 and a wiring port 22 is provided between the two wiring segments 21. The conductive circuit 2 is then cured.

[0062] S2. The lamp bead pads 32 are fabricated on the conductive line 2 by inkjet printing, printing or printing method. Two lamp bead pads 32 are spaced apart at the terminal 22. The lamp bead pads 32 are then cured.

[0063] S3. The LED beads 31 are supported on the top of the two LED bead pads 32 by SMT method, so that the positive and negative terminals of the LED beads 31 are respectively connected to the two wiring segments 21 through the two LED bead pads 32 to form a circuit.

[0064] First, the conductive line 2 is applied to the surface of the flexible substrate 1 using inkjet printing, printing, or printing methods, forming a connection port 22 between the two wiring segments 21, providing installation space for the light-emitting component 3. After the conductive line 2 is cured, two spaced-apart lamp bead pads 32 are fabricated at the connection port 22 using a solderable paste, inkjet printing, or printing methods. After the lamp bead pads 32 are cured, the light-emitting lamp bead 31 and the lamp bead pads 32 are welded together, so that the positive and negative electrodes of the light-emitting lamp bead 31 are connected to the two wiring segments 21 through the two lamp bead pads 32 respectively, forming a circuit. In this embodiment, the conductive line 2 replaces the copper metal line in the prior art, improving environmental performance while reducing manufacturing costs. Furthermore, by connecting the positive and negative electrodes of the light-emitting lamp bead 31 and the two wiring segments 21 through the two spaced-apart lamp bead pads 32 respectively, a stable connection between the light-emitting lamp bead 31 and the flexible substrate 1 is achieved, improving the stability of the flexible light-emitting mechanism 100 in use.

[0065] In the first embodiment, a 6μm thick conductive line 2 is screen-printed on a transparent PET board using a screen printing method with a mesh size of 250. The conductive line 2 is then baked and cured at 130℃ for 30 minutes. At the connection port 22 on the conductive line 2, a 30μm thick LED chip pad 32 is screen-printed using a screen printing method with a mesh size of 200. The LED chip pad 32 is then baked and cured at 130℃ for 60 minutes. The LED chip 31 is then connected to the LED chip pad 32 and the connection segment 21 using an SMT method, so that the LED chip 31 and the connection segment 21 form a circuit.

[0066] Based on the first embodiment, the present invention proposes a second embodiment, in which the following is included before step S3:

[0067] S4. An insulating protective layer 4 is formed on the outside of the conductive line 2 and the lamp bead pad 32 by inkjet printing, printing or printing method. The insulating protective layer 4 is provided with a relief opening 41 to avoid the light-emitting lamp bead 31. The insulating protective layer 4 is then cured.

[0068] Specifically, after the LED chip pads 32 are baked and cured, an insulating oil layer 4 with a thickness of 12μm can be printed on the conductive circuit 2 using screen printing. The screen mesh count is 250. The insulating protective layer 4 is baked and cured at 800Mj / cm. 2 The insulating protective layer 4 is provided with a clearance opening 41 to avoid the light-emitting lamp bead 31. After fabrication, the light-emitting lamp bead 31 can be connected to the lamp bead pad 32 and the wiring segment 21 by SMT. In this embodiment, the insulating protective layer 4 can provide insulation protection for the conductive line 2 and part of the lamp bead pad 32, thereby avoiding short circuits in the flexible light-emitting mechanism 100.

[0069] like Figure 6As shown, based on the second embodiment, the present invention proposes a third embodiment. In this embodiment, step S3 is followed by:

[0070] S5. Use a dispensing machine to apply a reinforcing adhesive layer around the light-emitting lamp bead 31 to reinforce the light-emitting lamp bead 31. The edge of the clearance opening 41 and the reinforcing adhesive layer form a clearance gap 6.

[0071] S6. AB glue is poured onto the light-emitting lamp bead 31, the insulating protective layer 4 and the lamp bead pad 32, and then encapsulated by spin coating, scraping coating, roller coating and potting in sequence. After the AB glue is leveled, the AB glue is pre-fixed and cured to form an elastic protective layer 7. The elastic protective layer 7 has an opening 71 to avoid the light-emitting lamp bead 31.

[0072] Specifically, in this embodiment, after the LED bead 31 is connected to the LED bead pad 32 and the wiring segment 21 using SMT, a layer of UV reinforcing adhesive can be applied around the LED bead 31 using a dispensing machine. This adhesive is then cured to form a reinforcing layer, reinforcing the LED bead 31. After the reinforcing layer is completed, PDMS or AB glue, or other elastic fluids, can be poured onto the LED bead 31, the conductive line 2, and the insulating protective layer 4. After the AB glue has leveled, it is pre-fixed at 80℃ for 12 minutes, and finally baked at 120℃ for 30 minutes for curing. The elastic protective layer 7 has an opening 71 to avoid the LED bead 31. The elastic protective layer 7 provides resistance to compression and pulling; the insulating protective layer 4, located between the elastic protective layer 7 and the conductive line 2, prevents the elastic protective layer 7 and the conductive line 2 from reacting, further improving the stability of the flexible light-emitting mechanism 100. Figure 3 and Figure 4 As shown, the elastic protective layer 7 in this embodiment completely wraps the remaining components, providing all-round encapsulation and protection for the flexible light-emitting mechanism 100.

[0073] Understandably, the baking and curing process in this embodiment can be carried out using an oven, tunnel oven, or flat oven, depending on the actual usage requirements.

[0074] In the description of this invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0075] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0076] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0077] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A flexible light-emitting mechanism, characterized in that, The flexible light-emitting mechanism (100) includes: Flexible substrate (1); A conductive line (2) is disposed on the flexible substrate (1). The conductive line (2) includes two connection segments (21) and a connection port (22) is provided between the two connection segments (21). The light-emitting component (3) is located at the terminal (22). The light-emitting component (3) includes a light-emitting lamp (31) and two lamp pads (32) supported on the bottom of the light-emitting lamp (31). The two lamp pads (32) are spaced apart. The positive and negative terminals of the light-emitting lamp (31) are respectively connected to the two terminals (21) through the two lamp pads (32) to form a circuit. The conductive line (2) is formed on the flexible substrate (1) by inkjet printing, printing or printing method, and the lamp bead pad (32) is formed on the conductive line (2) by inkjet printing, printing or printing method, and the thickness of the lamp bead pad (32) is 15μm~35μm; The thickness of the lamp bead pad (32) is greater than the thickness of the wiring segment (21). The lamp bead pad (32) is provided with an overlap segment (321), which overlaps the top of the wiring segment (21).

2. The flexible light-emitting mechanism according to claim 1, characterized in that, The conductive line (2) and the lamp bead pad (32) are wrapped with an insulating protective layer (4), and the insulating protective layer (4) is provided with a clearance opening (41) to avoid the light-emitting lamp bead (31).

3. The flexible light-emitting mechanism according to claim 2, characterized in that, The bottom surface of the light-emitting lamp bead (31) is connected to the surface of the lamp bead pad (32). The outer side of the light-emitting lamp bead (31) is provided with a connector (5) that is connected to the lamp bead pad (32). The edge of the clearance opening (41) and the connector (5) form a clearance gap (6).

4. The flexible light-emitting mechanism according to claim 3, characterized in that, The connector (5) is a reinforcing adhesive layer, which surrounds the outer surface of the light-emitting lamp bead (31).

5. The flexible light-emitting mechanism according to claim 2, characterized in that, The thickness of the wiring segment (21) is 4μm~30μm, and the thickness of the insulating protective layer (4) is 8μm~30μm.

6. The flexible light-emitting mechanism according to any one of claims 2 to 5, characterized in that, The flexible light-emitting mechanism (100) also includes an elastic protective layer (7) wrapped around the insulating protective layer (4) and the lamp bead pad (32), and the elastic protective layer (7) has an opening (71) to avoid the light-emitting lamp bead (31).

7. The flexible light-emitting mechanism according to claim 6, characterized in that, The distance between the top surface of the elastic protective layer (7) and the top surface of the light-emitting lamp bead (31) is greater than 0.2 mm.

8. The flexible light-emitting mechanism according to claim 6, characterized in that, The elastic protective layer (7) is a PDMS component or an AB adhesive component.

9. The flexible light-emitting mechanism according to any one of claims 1 to 5, characterized in that, The flexible substrate (1) is a TPU component, a fabric component, a leather component, a PET component, a PI component, or a COP component; And / or, The lamp bead pad (32) is made of Cu paste, Ni paste or Mo paste.

10. A manufacturing process for a flexible light-emitting mechanism, used to manufacture the flexible light-emitting mechanism according to any one of claims 1 to 9, characterized in that, The manufacturing process of the flexible light-emitting mechanism includes: S1. Conductive circuit (2) is fabricated on flexible substrate (1) by inkjet printing, printing or printing method. The conductive circuit (2) includes two wiring segments (21) and a wiring port (22) is provided between the two wiring segments (21). The conductive circuit (2) is cured. S2. Make lamp bead pads (32) on the conductive line (2) by inkjet printing, printing or printing method. Two lamp bead pads (32) are arranged at intervals at the terminal (22). The lamp bead pads (32) are cured. The thickness of the lamp bead pads (32) is 15μm~35μm. S3. The light-emitting lamp (31) is supported on the top of the two lamp pads (32) by SMT, so that the positive and negative terminals of the light-emitting lamp (31) are respectively connected to the two terminals (21) through the two lamp pads (32) to form a circuit.

11. The manufacturing process of the flexible light-emitting mechanism according to claim 10, characterized in that, Before step S3, the following also includes: S4. An insulating protective layer (4) is made on the outside of the conductive line (2) and the lamp bead pad (32) by inkjet printing, printing or printing method. The insulating protective layer (4) is provided with a clearance opening (41) to avoid the light-emitting lamp bead (31). The insulating protective layer (4) is cured.

12. The manufacturing process of the flexible light-emitting mechanism according to claim 11, characterized in that, After step S3, the following is included: S5. Use a dispensing machine to apply a reinforcing adhesive layer around the light-emitting lamp bead (31) to reinforce the light-emitting lamp bead (31). The edge of the clearance opening (41) and the reinforcing adhesive layer form a clearance gap (6). S6. AB glue is poured onto the light-emitting lamp bead (31), the insulating protective layer (4) and the lamp bead pad (32), and the encapsulation is carried out by spin coating, scraping coating, rolling coating and potting in sequence. After the AB glue is leveled, the AB glue is pre-fixed and cured to form an elastic protective layer (7). The elastic protective layer (7) has an opening (71) to avoid the light-emitting lamp bead (31).

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