Electronic device and cooling module

Abstract

This invention relates to electronic devices and cooling modules. The invention provides an electronic device and a cooling module that achieves high cooling efficiency even when there is a step between two heat-generating elements. The electronic device includes a frame, a first heat-generating element and a second heat-generating element disposed within the frame, and a cooling module for absorbing heat from the heat-generating elements. The cooling module has a first heat spreader connected to the first heat-generating element and a second heat spreader connected to the second heat-generating element, the first and second heat spreaders being arranged adjacent to each other with a step between them. The first heat spreader has a bridge portion that extends toward the second heat spreader via at least one of two first metal plates, crossing the step, and is formed by connecting to the surface of the second heat spreader. The bridge portion does not have a sealed space.

Description

Technical Field

[0001] This invention relates to electronic devices equipped with a cooling module and the cooling module itself. Background Technology

[0002] Electronic devices such as laptop PCs contain heat-generating components like CPUs. These devices typically have a cooling module within their casing to absorb heat generated by the heat-generating components and dissipate it externally. Patent Document 1 discloses a structure in an electronic device containing a CPU and GPU as heat-generating components, where heat pipes are connected to the CPU and GPU respectively. Patent Document 2 discloses a structure where a plate-shaped heat sink is connected to the CPU.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2020-42588

[0004] Patent Document 2: Japanese Patent Application Publication No. 2019-32134

[0005] In such electronic devices, especially those configured as laptop-type mobile workstations, it is necessary to be able to select from multiple CPUs and GPUs according to user requirements. Therefore, in such electronic devices, by having a motherboard with a CPU installed and a daughterboard with a GPU installed within the chassis, the number of motherboard specifications for CPU and GPU combinations is minimized, thereby achieving component commonality.

[0006] On the other hand, miniaturization of the chassis is also essential in such electronic devices. Therefore, these devices employ a structure that uses a daughter board stacked on top of a mother board to mount two boards while minimizing chassis enlargement. However, stacking two boards creates a step between the CPU and GPU. Therefore, the cooling module needs to correspond to this step and be able to compensate for the load on both the CPU and GPU. Furthermore, this step problem can also occur in structures that do not use two boards, because the GPU is typically thicker than the CPU. Summary of the Invention

[0007] The present invention was made in view of the problems of the prior art, and its object is to provide an electronic device with a cooling module and a cooling module that can achieve high cooling efficiency even when there is a step between two heat-generating elements.

[0008] The electronic device according to the first aspect of the present invention includes: a frame; a first heating element and a second heating element disposed within the frame; and a cooling module disposed within the frame for absorbing heat generated by the first heating element and the second heating element. The cooling module includes: a first heat spreader connected to the first heating element and containing a working fluid in a sealed space formed between two first metal plates; and a second heat spreader connected to the second heating element and containing a working fluid in a sealed space formed between two second metal plates. The first heat spreader and the second heat spreader are arranged adjacent to each other with steps between them. The first heat spreader has a bridge portion that extends toward the second heat spreader through at least one of the two first metal plates, crossing the steps, and is formed by connecting with the surface of the second heat spreader. The bridge portion does not have the sealed space.

[0009] The second aspect of the present invention relates to a cooling module for absorbing heat from multiple heat-generating elements mounted in the housing of an electronic device. The cooling module comprises: a first heat spreader plate containing a working fluid in a sealed space formed between two first metal plates; and a second heat spreader plate containing a working fluid in a sealed space formed between two second metal plates. The first and second heat spreaders plate are arranged adjacent to each other with steps between them. The first heat spreader plate has a bridge portion that extends toward the second heat spreader plate through at least one of the two first metal plates, crossing the steps, and is connected to the surface of the second heat spreader plate. The bridge portion does not have the sealed space.

[0010] According to one aspect of the present invention, high cooling efficiency can be achieved even when there is a step between the two heating elements. Attached Figure Description

[0011] Figure 1 This is a schematic top view of an electronic device according to one embodiment, viewed from above.

[0012] Figure 2 It is a top view that schematically shows the internal structure of the frame.

[0013] Figure 3 This is a schematic bottom view of the cooling module.

[0014] Figure 4 It is a magnified 3D view of the bridge section and its surrounding parts of the cooling module.

[0015] Figure 5 This is an enlarged side sectional view showing the main part of the internal structure of the frame.

[0016] Figure 6It's enlarged. Figure 5 The side sectional view of the bridge section and its surrounding parts is shown.

[0017] Figure 7 It is an enlarged side sectional view of the bridge section and its surrounding parts involved in the first modified example.

[0018] Figure 8 It is an enlarged side sectional view of the bridge section and its surrounding parts involved in the second modified example.

[0019] Figure 9 It is a magnified top view of the bridge section and its surrounding parts involved in the third variation.

[0020] Explanation of reference numerals in the attached figures

[0021] 10…Electronic device; 14…Frame; 22…Cooling module; 24…Mother board; 25…Daughter board; 30…CPU; 31…GPU; 36…First heat spreader; 36a, 36b, 37a, 37b…Metal plates; 37…Second heat spreader; 38…First heat pipe; 39…Second heat pipe; 40, 41…Cooling fins; 42, 43…Air blower; 50-52…Bridge section; S1, S2…Enclosed space. Detailed Implementation

[0022] The preferred embodiments are described below, and the electronic device and cooling module involved in the present invention will be described in detail with reference to the accompanying drawings.

[0023] Figure 1 This is a schematic top view of an electronic device 10 according to one embodiment, viewed from above. (Example) Figure 1 As shown, the electronic device 10 is a clamshell-type laptop PC formed by connecting the display frame 12 and the frame 14 rotatably with a hinge 16, and is referred to as a mobile workstation. In addition to laptop PCs, the electronic device involved in this invention can also be, for example, a desktop PC, a tablet PC, a mobile phone, a smartphone, or a game console.

[0024] The display frame 12 is a thin, flat box. A display 18 is mounted on the display frame 12. The display 18 is made of, for example, organic EL (OLED: Organic Light Emitting Diode) or liquid crystal.

[0025] The following describes the frame 14 and the various elements mounted on the frame 14, such that the frames 12 and 14 are positioned as follows: Figure 1 The diagram shows the open state. Based on the posture of the visual recognition display 18, the near front side is referred to as the front, the depth side as the rear, the width direction as left and right, and the height direction (the thickness direction of the frame 14) as up and down.

[0026] The frame 14 is a thin, flat box. The frame 14 is composed of a cover member 14A forming the upper surface and surrounding sides, and a cover member 14B forming the lower surface. The upper cover member 14A has a generally bathtub shape with an opening on the lower surface. The lower cover member 14B has a generally flat shape, serving as a cover that closes the opening on the lower surface of the cover member 14A. The cover members 14A and 14B overlap in the thickness direction and are detachably connected to each other. A keyboard 20 and a touchpad 21 are provided on the upper surface of the frame 14. The rear end of the frame 14 is connected to the display frame 12 using a hinge 16.

[0027] Figure 2 It is a schematic top view showing the internal structure of the frame 14, and a schematic top sectional view cutting off the frame 14 slightly below the keyboard 20.

[0028] like Figure 2 As shown, a cooling module 22, a motherboard 24, a daughterboard 25, and a battery device 26 are arranged inside the frame 14. Various electronic components and mechanical components are also arranged inside the frame 14.

[0029] The motherboard 24 is the mainboard of the electronic device 10. The motherboard 24 is located near the rear of the frame 14 and extends in the left-right direction. The motherboard 24 is a printed circuit board on which various electronic components, such as communication modules, memory, and connection terminals, are mounted, in addition to the CPU (Central Processing Unit) 30. The motherboard 24 is located below the keyboard 20 and is threaded to the back of the keyboard 20 and the inner surface of the cover member 14A. The upper surface of the motherboard 24 serves as a mounting surface relative to the cover member 14A, and the lower surface serves as a mounting surface 24a for the CPU 30, etc. (see reference). Figure 5 The CPU 30 is positioned approximately at the center of the mounting surface 24a of the motherboard 24. The CPU 30 performs calculations related to the main control and processing of the electronic device 10. Figure 5 Reference numeral 30a in the figure refers to the packaging substrate on which the CPU (die) 30 is mounted.

[0030] Daughter board 25 is an expansion card with a smaller form factor than mother board 24. Daughter board 25 is a printed circuit board housing various electronic components such as a GPU (Graphics Processing Unit) 31 and power components 32. Daughter board 25 is stacked near the right end of the mounting surface 24a of mother board 24 (see reference). Figure 2 and Figure 5 The GPU 31 is mounted approximately in the center of the motherboard 24. The daughterboard 25 is connected to connector 33 mounted on the motherboard 24 (see reference). Figure 5This allows it to be electrically connected to the motherboard 24. The upper surface of the daughterboard 25 becomes the mounting surface 24a relative to the motherboard 24, and the lower surface becomes the mounting surface 25a of the GPU 31, etc. The GPU 31 performs the calculations required for image rendering such as 3D graphics. Figure 5 Reference numeral 31a in the figure refers to the packaging substrate on which the GPU (die) 31 is mounted.

[0031] The battery device 26 is a rechargeable battery that powers the electronic device 10. The battery device 26 is located at the front of the motherboard 24 and extends to the left and right along the front end of the frame 14.

[0032] Next, the structure of the cooling module 22 will be described.

[0033] CPU 30 and GPU 31 are the largest heat-generating components among the electronic components housed within the frame 14. Therefore, the cooling module 22 absorbs and dissipates the heat generated by CPU 30 and GPU 31, and then exhausts it outside the frame 14. The cooling module 22 is stacked on the lower surfaces of the motherboard 24 and daughterboard 25 (below mounting surfaces 24a and 25a).

[0034] Figure 3 This is a schematic bottom view of the cooling module 22. Figure 4 It is a magnified perspective view of the bridge section 50 and its surrounding parts of the cooling module 22. Figure 5 This is an enlarged side sectional view showing the main part of the internal structure of frame 14. Figure 6 It's enlarged. Figure 5 The diagram shows the bridge section 50 and its surrounding parts.

[0035] like Figures 2-5 As shown, the cooling module 22 includes first and second heat spreaders 36 and 37 arranged in a left-right manner, a first heat pipe 38 consisting of two heat pipes in a group, a second heat pipe 39 consisting of two heat pipes in a group, a pair of left and right cooling fins 40 and 41, a pair of left and right air supply fans 42 and 43, and a heat conduction plate 44.

[0036] The heat exchange plates 36 and 37 are plate-type heat transfer devices. The first heat exchange plate 36 forms a closed space S1 between two thin metal plates 36a and 36b (see reference). Figure 5 The sealed space S1 contains a working fluid. Metal plates 36a and 36b are formed of a metal with high thermal conductivity, such as aluminum, copper, or stainless steel. The sealed space S1 serves as a flow path for the sealed working fluid to flow while undergoing a phase change. Examples of working fluids include water, Freon substitutes, acetone, or butane. A core 36c (see reference) is provided within the sealed space S1 to transport the condensed working fluid using capillary action. Figure 5The core 36c is formed, for example, from a porous body such as a mesh made of fine metal wires woven into a flocculent shape or micro-flow channels.

[0037] The second heat spreader 37 is basically the same as the first heat spreader 36, except that it is larger in shape and slightly thinner. That is, the second heat spreader 37 forms a sealed space S2 between the two thin metal plates 37a and 37b (see reference). Figure 5 A core 37c is installed in the sealed space S2 to seal in the working fluid. In the second heat exchanger 37, the materials of the metal plates 37a and 37b, the type of working fluid, and the structure of the core 37c can be the same as those of the first heat exchanger 36.

[0038] The heat spreaders 36 and 37 are thin and easily deformed. Therefore, the heat spreaders 36 and 37 are reinforced at the outer periphery and central portion of their upper surfaces (first surfaces 36d and 37d), respectively, by the joint frames 46 and 47 (see reference). Figure 2 and Figure 4 The frames 46 and 47 are made of metals such as stainless steel and are formed by constructing a frame shape with rods that are thicker than the heat spreaders 36 and 37.

[0039] like Figures 4-6 As shown, the heat spreaders 36 and 37 are provided with vertical steps 48 between them (see reference). Figure 6 They are arranged adjacent to each other in a state where they are mounted on the motherboard 24, on which the CPU 30 is mounted. This step 48 arises because the daughterboard 25, on which the GPU 31 is mounted, is stacked on the lower surface of the motherboard 24, on which the CPU 30 is mounted, and because the GPU 31 is thicker than the CPU 30. That is, because the top surface of the GPU 31 is located lower than the top surface of the CPU 30 (see reference...). Figure 5 Therefore, the cooling module 22 positions the second heat sink 37 for cooling the GPU 31 at a lower position than the first heat sink 36 for cooling the CPU 30. Furthermore, the step between the top surface of the CPU 30 and the top surface of the GPU 31 is, for example, 4 to 5 mm.

[0040] Therefore, the second heat spreader 37 has a bridge portion 50 that extends obliquely upward across the step 48 and engages (e.g., welds) with the second surface 36e of the first heat spreader 36. The end portion of the bridge portion 50 engages at a position overlapping with the enclosed space S1 of the first heat spreader 36. The bridge portion 50 is a heat transfer component used to thermally connect the heat spreaders 36 and 37 and to complement each other's cooling capabilities.

[0041] The bridge portion 50 is a fin-shaped plate formed by extending the portion of the outer edge of the metal plates 37a and 37b of the second heat spreader 37 adjacent to the first heat spreader 36 toward the first heat spreader 36. The bridge portion 50 is constituted by the joint of the metal plates 37a and 37b that edge the outer edge of the second heat spreader 37. Therefore, a sealed space S2 containing the working fluid is not formed in the bridge portion 50. That is, in the bridge portion 50, heat transfer caused by the phase change of the working fluid inside the second heat spreader 37 does not occur, but heat transfer caused by the thermal conductivity based on the metal plates 37a and 37b occurs.

[0042] like Figures 3-5 As shown, the first heat pipe 38 is a tubular heat transfer device. In this embodiment, two heat pipes 38a and 38b are used side-by-side as a pair, but one or more heat pipes can also be used. The heat pipes 38a and 38b are formed into an elliptical cross-section by flattening a thin, flat metal tube, and a working fluid is sealed in a closed space formed inside the metal tube. The metal tube is made of a metal with high thermal conductivity, such as aluminum, copper, or stainless steel. The closed space becomes a flow path for the sealed working fluid to flow while undergoing a phase change. Examples of working fluids include water, Freon substitutes, acetone, or butane. A core is provided in the closed space to transport the condensed working fluid using capillary action. The core is formed, for example, a porous body such as a mesh made of fine metal wires woven into a flocculent structure or a micro-flow path.

[0043] Except for the difference in length and path, the basic structure of the second heat pipe 39 is the same as that of the first heat pipe 38. That is, the second heat pipe 39 has a core inside a flattened metal tube, which is then filled with the working fluid. Furthermore, the second heat pipe 39 can use two heat pipes 39a and 39b arranged in pairs, either front-to-back or side-to-side, but one or more heat pipes can also be used. In the second heat pipe 39, the material of the metal tube, the type of working fluid, and the structure of the core can be the same as those of the first heat pipe 38.

[0044] like Figure 2 and Figure 3 As shown, the cooling fin 40 on the left is constructed by arranging multiple plate-shaped fins at equal intervals along the left-right direction on the surface of the plate. Each fin stands upright in the vertical direction and extends in the front-back direction. Gaps are formed between adjacent fins to allow air supplied from the fan 42 to pass through. The cooling fin 40 is made of a metal with a high thermal conductivity, such as aluminum or copper.

[0045] The size of the cooling fin 41 on the right side is slightly different, but its basic structure is about symmetrical to that of the cooling fin 40 on the left side, so detailed descriptions are omitted.

[0046] like Figure 2 and Figure 3As shown, the left-side air supply fan 42 is positioned directly in front of the cooling fin 40. That is, the cooling fin 40 is configured with a rearward-opening exhaust port 42a facing the air supply fan 42. The air supply fan 42 is a centrifugal fan that uses a motor to rotate an impeller housed inside a fan housing 42b. The air supply fan 42 draws air from the housing 14, which has intake ports 42c opening at the top and bottom of the fan housing 42b, and exhausts it through the exhaust port 42a. The air supplied from the exhaust port 42a passes through the cooling fin 40, promoting heat dissipation.

[0047] The right-side fan 43 is slightly different in size, but its basic structure is symmetrical to the left-side fan 42, so detailed descriptions are omitted. Specifically, the fan 43 also has a rearward-facing exhaust port 43a and an intake port 43c with openings on the top and bottom of the fan housing 43b. Furthermore, the cooling fin 41 is configured to face the exhaust port 43a of the fan 43.

[0048] like Figure 2 and Figure 3 As shown, the heat-conducting plate 44 is connected to the leading edge of the second heat-spreading plate 37 and protrudes forward. The heat-conducting plate 44 is a thin plate made of a metal such as aluminum or copper, or a material with high thermal conductivity such as graphite. The heat-conducting plate 44 is configured to cover the power assembly 32, and a heat pipe 39 is attached to its lower surface. Thus, the heat-conducting plate 44 absorbs heat from the power assembly 32 and transfers it to the heat pipe 39. The heat-conducting plate 44 can be configured to be thinner than the second heat-spreading plate 37, so it can also be easily installed on the tall power assembly 32.

[0049] In the cooling module 22 configured as described above, the first surface 36d of the first heat spreader 36 abuts against the CPU 30 via the heat receiving plate 30b. Furthermore, the first surface 37d of the second heat spreader 37 abuts against the GPU 31 via the heat receiving plate 31b. The heat receiving plates 30b and 31b are plates made of metals with high thermal conductivity, such as copper or aluminum.

[0050] The central portion of the first heat pipe 38 bends forward and extends generally in the left-right direction. The first heat pipe 38, at approximately its central portion which becomes the heat receiving section, overlaps with the CPU 30 and engages with the second surface 36e of the first heat spreader 36. The left end (heat dissipation section) of one heat pipe 38a engages with the lower surface of the cooling fin 40, and the right end (heat receiving section) crosses the bridge portion 50 and engages with the second surface 37e of the second heat spreader 37. The left end (heat dissipation section) of another heat pipe 38b engages with the lower surface of the cooling fin 40, and the right end (heat dissipation section) crosses the bridge portion 50 and passes through the second surface 37e of the second heat spreader 37 to engage with the lower surface of the cooling fin 41. A large portion of the first heat pipe 38 engages with the second surfaces 36e and 37e of each heat spreader 36 and 37.

[0051] The second heat pipe 39 is generally arranged in an L-shape. The second heat pipe 39, at approximately the center where it overlaps with the GPU 31 (forming a heat receiving section), engages with the second surface 37e of the second vapor chamber 37. The right end (heat dissipation section) of the second heat pipe 39 engages with the lower surface of the cooling fin 41, and the front end (heat receiving section) engages with the lower surface of the heat-conducting plate 44 via the second vapor chamber 37. The two heat pipes 39a and 39b travel parallel along the same path. Most of the second heat pipe 39 is engaged with the second surface 37e of the second vapor chamber 37.

[0052] As a result, the heat generated by the CPU30 and GPU31 is absorbed and diffused by the heat spreaders 36 and 37, and then efficiently transported to the cooling plates 40 and 41 via the heat pipes 38 and 39, and finally discharged to the outside of the frame 14 by the air blowers 42 and 43.

[0053] However, the CPU 30 and GPU 31 do not operate at maximum output simultaneously; typically, one operates under a high load while the other operates under a low load. Therefore, the cooling module 22 in this embodiment uses a bridge 50 to connect the first heat sink 36 for the CPU 30 and the second heat sink 37 for the GPU 31.

[0054] Therefore, when the CPU 30 is under low load, the cooling module 22 can utilize the first heat spreader 36 to assist the second heat spreader 37 in absorbing heat from the GPU 31 under high load, and vice versa. As a result, the overall cooling efficiency of the cooling module 22 is greatly improved, and the overall temperature of the module is uniformized, thereby suppressing the generation of local high-temperature areas (hot spots) on the outer surface of the frame 14.

[0055] like Figure 7 As shown, the cooling module 22 can also use a bridge portion 51 instead of a bridge portion 50. The bridge portion 51 is a structure in which only a single metal plate 37b extends. The bridge portion 51 can also be made of a metal plate 37a.

[0056] like Figure 8 As shown, the cooling module 22 can also use a bridge portion 52 instead of bridge portions 50 and 51. The bridge portion 52 is formed on the first heat spreader 36 and engages with the second surface 37e of the second heat spreader 37 across the step 48. The end portion of the bridge portion 52 engages at a position overlapping the sealed space S2 of the second heat spreader 37. Like bridge portions 50 and 51, the bridge portion 52 can be a structure that causes one or both of the metal plates 36a and 36b of the first heat spreader 36 to protrude. Figure 9 As shown, bridge sections 50 (51) and 52 can also be used together.

[0057] As described above, the electronic device 10 according to this embodiment includes a cooling module 22, which absorbs heat generated by the first and second heat-generating elements (CPU 30, GPU 31) disposed within the housing 14. The cooling module 22 has a first heat spreader 36 connected to the CPU 30 and a second heat spreader 37 connected to the GPU 31. These heat spreaders 36 and 37 are arranged adjacent to each other with steps 48 provided between them. Moreover, at least one heat spreader has a bridge portion 50 (51, 52) that engages with the surface of another heat spreader. The bridge portion 50 (51, 52) is composed of one or two metal plates 36a, etc., and does not have enclosed spaces S1, S2.

[0058] Thus, the electronic device 10 has a step between the CPU 30 and the GPU 31, resulting in a step 48 between the heat spreaders 36 and 37. However, since the heat spreaders 36 and 37 are thermally connected to each other by a bridge 50, one can supplement the other according to the difference in load between the CPU 30 and the GPU 31. Therefore, the cooling module 22 can achieve high cooling efficiency, and the temperature distribution of the housing 14 is also uniform. In addition, the bridge 50 is formed by bending the outer edges of the metal plates 37a and 37b, so it can smoothly cross the step 48 between the heat spreaders 36 and 37 with minimal thermal resistance. That is, the cooling module 22 can seamlessly connect the first heat spreader 36 for the CPU 30 and the second heat spreader 37 for the GPU 31 using the bridge 50, and can supplement each other depending on whether the heat spreaders 36 and 37 have sufficient capacity.

[0059] However, assuming a structure using a single vapor chamber to centrally cool the CPU 30 and GPU 31, the vapor chamber bends in the enclosed space beyond step 48. Consequently, the movement of the working fluid within this bend becomes unstable, resulting in a significant increase in thermal resistance and a reduction in the overall heat transfer efficiency of the vapor chamber. Furthermore, the high-precision bending of the vapor chamber also presents manufacturability challenges.

[0060] In this respect, the cooling module 22 uses two heat spreaders 36 and 37, and connects them using a bridge 50 or the like, which is made of a metal plate without a sealed space. Therefore, the cooling module 22 can ensure that the heat transfer efficiency of each heat spreader 36 and 37 is maximized, and that there is smooth heat movement between them, thereby achieving the aforementioned complementary effects.

[0061] Furthermore, in this cooling module 22, the bridge portion 50, etc., is joined at the position where it overlaps with the sealed spaces S1 and S2 of another heat spreader (see reference). Figures 6-8 Therefore, the bridge section 50 and the like can directly transfer heat to the working fluid, further improving the heat transfer efficiency between the heat spreaders 36 and 37.

[0062] Furthermore, the present invention is not limited to the above-described embodiments, and can of course be freely modified within the scope of the spirit of the present invention.

[0063] The air supply fans 42 and 43, and the cooling fins 40 and 41, may not be a pair on the left and right, but may consist of only one side. Alternatively, the heat receiving plates 30a and 31a or the heat conducting plate 44 may be omitted.

Claims

1. An electronic device, comprising: Possessing: a frame; a first heat generating body and a second heat generating body provided in the frame; and a cooling module provided in the frame, which absorbs heat generated by the first heat generating body and the second heat generating body, the cooling module has: a first vapor chamber connected to the first heat generating body and having a sealed space formed between two first metal plates in which a working fluid is enclosed; and a second vapor chamber connected to the second heat generating body and having a sealed space formed between two second metal plates in which a working fluid is enclosed, the first vapor chamber and the second vapor chamber are arranged in abutment with a step provided therebetween, the first vapor chamber has a bridge portion which extends toward the second vapor chamber across the step through at least one of the two first metal plates and is connected to a surface of the second vapor chamber to form a bridge portion, the bridge portion is not provided with the sealed space.

2. The electronic device according to claim 1, wherein the bridge portion overlaps the sealed space of the second vapor chamber.

3. The electronic device according to claim 1, wherein the first heat generating body is connected to a first surface of the first vapor chamber, the second heat generating body is connected to a first surface of the second vapor chamber, the bridge portion is connected to a second surface of the second vapor chamber, the cooling module further has: a first heat pipe configured to be connected to a second surface of the first vapor chamber and having a sealed space formed inside a metal pipe in which a working fluid is enclosed at a position overlapping the first heat generating body in a thickness direction of the first vapor chamber; a second heat pipe configured to be connected to a second surface of the second vapor chamber and having a sealed space formed inside a metal pipe in which a working fluid is enclosed at a position overlapping the second heat generating body in a thickness direction of the second vapor chamber; a first air supply fan; a second air supply fan; a first cooling fin connected to an end portion of the first heat pipe and configured to face an exhaust port of the first air supply fan; and a second cooling fin connected to an end portion of the second heat pipe and configured to face an exhaust port of the second air supply fan.

4. The electronic device according to any one of claims 1 to 3, wherein the first heat generating body is a CPU, the second heat generating body is a GPU. further comprising: a motherboard provided in the frame and on which the CPU is mounted; and 5. The electronic device of claim 4, wherein, a daughterboard provided in the frame and on which the GPU is mounted, the daughterboard is stacked on a mounting surface of the motherboard on which the CPU is mounted. having: a first vapor chamber having a sealed space formed between two first metal plates in which a working fluid is enclosed; and 6. A cooling module for heat absorption of a plurality of heat generating bodies mounted in a frame of an electronic device, characterized by comprising: a second vapor chamber having a sealed space formed between two second metal plates in which a working fluid is enclosed, the first vapor chamber and the second vapor chamber are arranged in abutment with a step provided therebetween, the first vapor chamber has a bridge portion which extends toward the second vapor chamber across the step through at least one of the two first metal plates and is connected to a surface of the second vapor chamber to form a bridge portion, ​ ​ ​ The bridge portion does not provide the closed space.

7. The cooling module according to claim 6, wherein The bridge portion overlaps the closed space of the second vapor chamber.

8. The cooling module according to claim 6 or 7, wherein The first face of the first vapor chamber becomes a heat absorbing face with respect to the heat generating body, The first face of the second vapor chamber becomes a heat absorbing face with respect to the heat generating body, The bridge portion is joined to the second face of the second vapor chamber, The cooling module further comprises: a first heat pipe joined to the second face of the first vapor chamber and having a working fluid enclosed in a closed space formed inside a metal pipe; a second heat pipe joined to the second face of the second vapor chamber and having a working fluid enclosed in a closed space formed inside a metal pipe; a first air blowing fan; a second air blowing fan; a first cooling fin joined to an end portion of the first heat pipe and arranged to face an air outlet of the first air blowing fan; and a second cooling fin joined to an end portion of the second heat pipe and arranged to face an air outlet of the second air blowing fan. ​

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