Metallic wire electrical test structure

Abstract

The application provides a metal wire electrical test structure, comprising: a test main body, comprising: at least one first metal wire arranged in sequence along a first direction, both ends of the first metal wire being provided with a first through hole; at least one second metal wire arranged in sequence along a second direction, both ends of the second metal wire being provided with a second through hole, the at least one second metal wire being arranged correspondingly to the at least one first metal wire; a first soldering pad located on one side of the test main body and electrically connected to the first through hole or the second through hole through a first metal connecting structure; and a second soldering pad located on the other side of the test main body and electrically connected to the first through hole or the second through hole through a second metal connecting structure. Through the ingenious distribution of the metal wires, the most time-efficient electrical test can be used to test the leakage between the metal wires of the same structure and different structures.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and in particular to a metal wire electrical testing structure. BACKGROUND

[0002] In the FINFET technology, the metal wire connecting the source and the drain and the metal wire connecting the gate are key processes connecting the front and rear stages. The process features small opening size and deep depth. Specifically, the line width and gap of the process are the smallest in the front stage size, and the aspect ratio is greater than 50, which is extremely prone to short circuit defects between the same structures. At the same time, the gap between the two metal wires is also the minimum value, and short circuit defects are very prone to occur between them.

[0003] Due to the too high aspect ratio, the slot sidewall morphology is complex, resulting in poor process monitoring capability, which cannot effectively monitor the process stability. Currently, there are higher requirements for the metal wire connecting the source and the drain process, and the process of expanding the opening is introduced, which increases the process complexity and makes the slot sidewall morphology more complex, making the process monitoring more difficult. The current measurement means cannot accurately measure, nor can they monitor the sidewall morphology of the metal wire.

[0004] Therefore, it is necessary to provide a more effective and reliable technical solution. SUMMARY

[0005] The present application provides a metal wire electrical testing structure, which can test the leakage between the metal wires of the same structure and different structures.

[0006] The present application provides a metal wire electrical testing structure, comprising: a test main body, comprising: at least one first metal wire arranged in a first direction, both ends of the first metal wire are formed with a first through hole; at least one second metal wire arranged in a second direction, both ends of the second metal wire are formed with a second through hole, and the at least one second metal wire is arranged corresponding to the at least one first metal wire; a first solder pad located on one side of the test main body and electrically connected to the first through hole or the second through hole through a first metal connecting structure; and a second solder pad located on the other side of the test main body and electrically connected to the first through hole or the second through hole through a second metal connecting structure.

[0007] In some embodiments of the present application, when testing the leakage of adjacent first metal wires, the first solder pad is electrically connected to the first metal wire through the first through hole, and the second solder pad is electrically connected to the first metal wire through the first through hole, and the first metal wires electrically connected to the first solder pad and the first metal wires electrically connected to the second solder pad are alternately and spacedly distributed.

[0008] In some embodiments of the present application, when testing the leakage between the adjacent second metal wires, the first pad is electrically connected to the second metal wire through the first via, and the second pad is electrically connected to the second metal wire through the second via.

[0009] In some embodiments of the present application, when testing the leakage between the first metal wire and the second metal wire, the first pad is electrically connected to the first metal wire through the first via, and the second pad is electrically connected to the second metal wire through the second via.

[0010] In some embodiments of the present application, the at least one first metal wire is further provided with a first dummy metal wire on both sides, and the at least one second metal wire is further provided with a second dummy metal wire on both sides.

[0011] In some embodiments of the present application, the number of the at least one first metal wire is the same as the number of the at least one second metal wire.

[0012] In some embodiments of the present application, the at least one first metal wire and the at least one second metal wire are arranged in an L shape.

[0013] In some embodiments of the present application, the first direction is perpendicular to the second direction.

[0014] In some embodiments of the present application, the structure further comprises a third pad and a fourth pad, and the test body is arranged between the second pad and the third pad and between the third pad and the fourth pad, wherein the first pad and the second pad are electrically connected to the first metal wire of the test body between the first pad and the second pad, and the first metal wire electrically connected to the first pad and the first metal wire electrically connected to the second pad are alternately and evenly distributed; the second pad and the third pad are electrically connected to the second metal wire of the test body between the second pad and the third pad, and the second metal wire electrically connected to the second pad and the second metal wire electrically connected to the third pad are alternately and evenly distributed; the third pad is electrically connected to the first metal wire of the test body between the third pad and the fourth pad, and the fourth pad is electrically connected to the second via metal wire of the test body between the third pad and the fourth pad.

[0015] In some embodiments of the present application, the first pad, the second pad, the third pad, and the fourth pad are arranged along the same straight line.

[0016] The application provides a metal wire electrical test structure, through ingenious metal wire distribution, using the most time-effective electrical test, the leakage between the metal wires of the same structure and different structures can be tested. BRIEF DESCRIPTION OF DRAWINGS

[0017] The following drawings in detail describe the exemplary embodiments disclosed in the application. The same reference signs in the several views of the drawings represent similar structures. A person of ordinary skill in the art will understand that these embodiments are non-limiting, exemplary embodiments, the drawings are only for the purpose of illustration and description, and are not intended to limit the scope of the application, and other ways of embodiments can also achieve the same purpose of the application. It should be understood that the drawings are not drawn to scale.

[0018] wherein:

[0019] Figure 1 A structure diagram of a test body in the metal wire electrical test structure described in the embodiment of the application;

[0020] Figure 2 A first cross-sectional schematic diagram of a test body in the metal wire electrical test structure described in the embodiment of the application;

[0021] Figure 3 A second cross-sectional schematic diagram of a test body in the metal wire electrical test structure described in the embodiment of the application;

[0022] Figure 4 A structure schematic diagram of the metal wire electrical test structure described in the embodiment one of the application;

[0023] Figure 5 A structure schematic diagram of the metal wire electrical test structure described in the embodiment two of the application;

[0024] Figure 6 A structure schematic diagram of the metal wire electrical test structure described in the embodiment three of the application;

[0025] Figure 7 A structure schematic diagram of the metal wire electrical test structure described in the embodiment four of the application. DETAILED DESCRIPTION

[0026] The following description provides specific application scenarios and requirements of the application, so that a person skilled in the art can manufacture and use the content in the application. Various local modifications of the disclosed embodiments are obvious to those skilled in the art, and the general principles defined herein can be applied to other embodiments and applications without departing from the spirit and scope of the application. Therefore, the application is not limited to the shown embodiments, but is consistent with the widest scope of the claims.

[0027] The technical solutions of the present application will be described in detail below with reference to the embodiments and drawings.

[0028] Embodiments of the present application provide a metal wire electrical test structure for testing leakage and short circuit of metal wires. The metal wire electrical test structure mainly comprises a test body and first and second pads electrically connected to the test body. The test body is a metal wire structure made by the same process as the actual process. The layout of the metal wire structure in the test body can be set according to the actual structure to be tested. Embodiments of the present application take the first metal wire connecting the source and drain and the second metal wire connecting the gate in the FINFET structure as an example for illustration.

[0029] Figure 1 The structure of the test body in the metal wire electrical test structure described in embodiments of the present application is shown in the schematic diagram.

[0030] Reference Figure 1 As shown in the figure, the metal wire electrical test structure described in the present application comprises a test body 100. The test body 100 comprises at least one first metal wire 110 arranged in a first direction, and first through holes 111 are formed on the surfaces of both ends of the first metal wire 110. First dummy metal wires 112 are arranged on both sides of the at least one first metal wire 110.

[0031] The test body 100 further comprises at least one second metal wire 120 arranged in a second direction, and second through holes 121 are formed on the surfaces of both ends of the second metal wire 120. The at least one second metal wire 120 is arranged correspondingly to the at least one first metal wire 110. Second dummy metal wires 122 are arranged on both sides of the at least one second metal wire 120.

[0032] It should be noted that, Figure 1 It is only a schematic diagram for briefly illustrating the main structure of the test body 100. The test body 100 further comprises a medium layer and a substrate, which are not shown.

[0033] The test body 100 is used for testing. The test body 100 simulates the metal wire structure to be tested. Therefore, the structure and manufacturing method of the first metal wire 110 and the second metal wire 120 in the test body 100 are the same as those of the object to be tested. For example, in the present application, the first metal wire 110 simulates the metal wire structure connecting the source and drain in the FINFET structure. The second metal wire 120 simulates the metal wire structure connecting the gate in the FINFET structure.

[0034] In some embodiments of the present application, the number of the at least one first metal line 110 is the same as the number of the at least one second metal line 120. For example, in the present application, the number of the at least one first metal line 110 is four, and the number of the at least one second metal line 120 is also four. In other embodiments of the present application, the number of the at least one first metal line 110 can also be other numbers, and the number of the at least one second metal line 120 can also be other numbers.

[0035] In some embodiments of the present application, the at least one first metal line 110 and the at least one second metal line 120 are arranged in an L shape. This arrangement can minimize the area occupied by the test subject 100 while ensuring the test function. The at least one first metal line 110 is arranged in sequence, which can be used to test the leakage between adjacent first metal lines 110. The at least one second metal line 120 is arranged in sequence, which can be used to test the leakage between adjacent second metal lines 120. The at least one first metal line 110 and the at least one second metal line 120 are arranged one by one (one end of a first metal line 110 and one end of a corresponding second metal line 120 are close to each other), which can be used to test the leakage between the two corresponding first metal line 110 and second metal line 120.

[0036] In some embodiments of the present application, the first direction is perpendicular to the second direction. In the layout of the semiconductor structure, the metal line structure is generally distributed horizontally or vertically along a straight line. That is, the first metal line 110 and the second metal line 120 perpendicular to each other can cover most of the cases of the metal line structure that needs to be tested. Of course, in a small number of cases, for semiconductor structures in which the metal line structure is not arranged horizontally and vertically, the layout of the first metal line 110 and the second metal line 120 can also be modified accordingly.

[0037] In some embodiments of the present application, the distance between the at least one first metal line 110, the distance between the at least one second metal line 120, the distance between the first metal line 110 and the second metal line 120, the distance between the first metal line 110 and the first dummy metal line 112, and the distance between the second metal line 120 and the second dummy metal line 122 are all the minimum size of the corresponding node. For example, the minimum size of the 28-nanometer process. Because the test subject 100 is used for testing, directly setting the minimum size facilitates effective acquisition of test results. For example, under the minimum size of the corresponding node, the test subject can meet the demand (that is, there is no leakage), which indicates that under other large sizes of the node, the test subject can also meet the demand.

[0038] The first pseudo-metallic interconnect 112 and the second pseudo-metallic interconnect 122 are used to ensure the stability of the outermost structures of the at least one first metal interconnect 110 and at least one second metal interconnect 120. In actual manufacturing processes, the outermost metal interconnects are prone to structural defects due to process limitations, i.e., structural instability, and such metal interconnects cannot be used for testing. Therefore, the first pseudo-metallic interconnect 112 and the second pseudo-metallic interconnect 122 are used as sacrificial structures. Even if the structures of the first pseudo-metallic interconnect 112 and the second pseudo-metallic interconnect 122 are defective, it does not affect the testing.

[0039] The first through hole 111 is electrically connected to the first metal connection 110, and the second through hole 121 is electrically connected to the second metal connection 120.

[0040] Figure 2 This is a schematic diagram of the first cross-section of the test body in the metal interconnect electrical test structure described in the embodiments of this application. Figure 2 For along Figure 1 The cross-sectional view created by the dashed line AA.

[0041] refer to Figure 2 As shown, the test body 100 includes: a substrate 130; a first dielectric layer 140 located on the surface of the substrate 130; a first metal interconnect 110 and first pseudo-metal interconnects 112 located on both sides of the first metal interconnect 110, located in the first dielectric layer 140; a second dielectric layer 150 located on the surface of the first dielectric layer 140; and a first via 111 located in the second dielectric layer 150, electrically connected to the first metal interconnect 110.

[0042] The substrate 130 is a semiconductor substrate, such as a silicon substrate. The material of the first dielectric layer 140 is, for example, an insulating material such as silicon oxide. The materials of the first metal interconnect 110 and the first pseudo-metal interconnect 112 are, for example, copper. The material of the second dielectric layer 150 is, for example, an insulating material such as silicon oxide. The material of the first via 111 is, for example, tungsten.

[0043] In some embodiments of this application, in order to improve testing accuracy, the materials of each part of the test body 100 are the same as the materials of the actual structure to be tested.

[0044] Figure 3 This is a schematic diagram of the second cross-section of the test body in the metal interconnect electrical test structure described in the embodiments of this application. Figure 3 For along Figure 1 The cross-sectional view created by the dashed line BB.

[0045] refer to Figure 3As shown, the test body 100 comprises: a substrate 130; a first dielectric layer 140 on the surface of the substrate 130; a second metal wire 120 and a second dummy metal wire 122 on both sides of the second metal wire 120, in the first dielectric layer 140; a second dielectric layer 150 on the surface of the first dielectric layer 140; and a second via 121 in the second dielectric layer 150, electrically connecting the second metal wire 120.

[0046] The material of the second metal wire 120 and the second dummy metal wire 122 is, for example, copper. The material of the second via 121 is, for example, tungsten.

[0047] Figures 1 to 3 The structure of the test body in the metal wire electrical test structure according to the embodiments of the present application is shown. In the technical solution of the present application, the layout of the test body is ingeniously designed. The at least one first metal wire 110 is arranged in parallel in steps, the first metal wire 110 is electrically connected by the first via 111, and the leakage of the adjacent first metal wire 110 can be tested; the at least one second metal wire 120 is arranged in parallel in steps, the second metal wire 120 is electrically connected by the second via 121, and the leakage of the adjacent second metal wire 120 can be tested; the at least one first metal wire 110 and the at least one second metal wire 120 are distributed in a "L" shape one by one, and are electrically connected to the first metal wire 110 and the second metal wire 120 respectively, so that the leakage between the first metal wire 110 and the second metal wire 120 can be tested. The test body structure in the technical solution of the present application can improve the test efficiency and accuracy.

[0048] As described above, when testing, the first metal wire and the second metal wire need to be electrically connected. Therefore, the test structure further comprises a first solder pad and a second solder pad for electrically connecting a power supply and the test body. Since the electrical connection is different in different test requirements (that is, the electrical connection of the first solder pad and the second solder pad to the first metal wire and the second metal wire is different), different embodiments of the present application are listed to illustrate the technical solution of the present application.

[0049] Embodiment one

[0050] Figure 4 The structural schematic diagram of the metal wire electrical test structure according to the embodiment one of the present application is shown. It should be noted that, for the purpose of simplicity, Figure 4 the detailed structure of the test body 100 is not labeled in the figure, and the detailed structure of the test body 100 has been described above.

[0051] Reference Figure 4The test structure further comprises a first solder pad 160 and a second solder pad 180 for electrically connecting the test body 100. The test body 100 is located between the first solder pad 160 and the second solder pad 180.

[0052] With reference to the foregoing Figure 4 The first solder pad 160 is located on one side of the test body 100. The first solder pad 160 is electrically connected to the first metal wire 110 in the test body 100 through a first metal connecting structure 170.

[0053] The second solder pad 180 is located on the other side of the test body 100. The second solder pad 180 is electrically connected to the first metal wire 110 in the test body 100 through a second metal connecting structure 190.

[0054] The first metal wire 110 electrically connected to the first solder pad 160 and the first metal wire 110 electrically connected to the second solder pad 180 are alternately and evenly distributed. The alternately and evenly distribution means that when the first solder pad 160 is electrically connected to one first metal wire 110, the second solder pad 180 is electrically connected to a first metal wire 110 adjacent to the first metal wire 110. In this way of electrical connection, the first solder pad 160 and the second solder pad 180 are electrically connected to two adjacent first metal wires 110, so as to test the leakage between the two adjacent first metal wires 110.

[0055] The first solder pad 160 and the second solder pad 180 are not electrically connected to the second metal wire 120.

[0056] With reference to the foregoing Figure 4 The connection shown in Embodiment One is used to test the leakage between the adjacent first metal wires 110.

[0057] Embodiment Two

[0058] Figure 5 A structural schematic diagram of a metal wire electrical test structure according to Embodiment Two of the present application. It should be noted that, for the purpose of brevity, Figure 5 The detailed structure of the test body 100 is not labeled in Embodiment Two, and the detailed structure of the test body 100 has been described above.

[0059] With reference to the foregoing Figure 5 The test structure further comprises a first solder pad 160 and a second solder pad 180 for electrically connecting the test body 100. The test body 100 is located between the first solder pad 160 and the second solder pad 180.

[0060] With reference to Figure 5 As shown, the first soldering pad 160 is located on one side of the test body 100. The first soldering pad 160 is electrically connected with the second through hole 121 in the test body 100 through the first metal connecting structure 170, and then is electrically connected with the second metal wire 120.

[0061] The second soldering pad 180 is located on the other side of the test body 100. The second soldering pad 180 is electrically connected with the second through hole 121 in the test body 100 through the second metal connecting structure 190, and then is electrically connected with the second metal wire 120.

[0062] Among them, the second metal wire 120 electrically connected with the first soldering pad 160 and the second metal wire 120 electrically connected with the second soldering pad 180 are alternately and spacedly distributed. The alternately and spacedly distribution means that when the first soldering pad 160 is electrically connected with one second metal wire 120, the second soldering pad 180 is electrically connected with one second metal wire 120 adjacent to the second metal wire 120. In such an electrical connection mode, the first soldering pad 160 and the second soldering pad 180 are electrically connected with two adjacent second metal wires 120, so as to test the leakage between the two adjacent second metal wires 120.

[0063] The first soldering pad 160 and the second soldering pad 180 are not electrically connected with the first metal wire 110.

[0064] With reference to Figure 5 As shown, the connection mode shown in embodiment two is used to test the leakage between the adjacent second metal wires 120.

[0065] Embodiment three

[0066] Figure 6 A structural schematic diagram of a metal wire electrical test structure according to embodiment three of the present application. It should be noted that, for the purpose of simplicity, Figure 6 The detailed structure of the test body 100 is not labeled in the figure, and the detailed structure of the test body 100 has been described before.

[0067] With reference to Figure 6 As shown, the test structure further includes a first soldering pad 160 and a second soldering pad 180 for electrically connecting the test body 100. The test body 100 is located between the first soldering pad 160 and the second soldering pad 180.

[0068] With reference to Figure 6The first soldering pad 160 is located on one side of the test body 100. The first soldering pad 160 is electrically connected with the first through hole 111 in the test body 100 through the first metal connecting structure 170, and then is electrically connected with the first metal wire 110.

[0069] The second soldering pad 180 is located on the other side of the test body 100. The second soldering pad 180 is electrically connected with the second through hole 121 in the test body 100 through the second metal connecting structure 190, and then is electrically connected with the second metal wire 120.

[0070] The first metal wire 110 electrically connected with the first soldering pad 160 and the second metal wire 120 electrically connected with the second soldering pad 180 correspond to each other. The corresponding to each other means that one end of the first metal wire 110 electrically connected with the first soldering pad 160 and one end of the second metal wire 120 electrically connected with the second soldering pad 180 are close to each other, and are in the shape of "L". In such an electrical connection mode, the first soldering pad 160 and the second soldering pad 180 are electrically connected with the first metal wire 110 and the second metal wire 120 closest to each other, so as to test the leakage between the first metal wire 110 and the second metal wire 120.

[0071] Continuing to refer to Figure 6 As shown, the connection condition shown in embodiment three is used to test the leakage between the adjacent first metal wire 110 and second metal wire 120.

[0072] Embodiment four

[0073] Figure 7 A structural schematic diagram of the metal wire electrical property test structure according to embodiment four of the present application. It should be noted that, Figure 7 The detailed structure of the test body 100 and the connecting structure of the corresponding test soldering pad are not shown in embodiment four, and the detailed structure of the test body 100 and the connecting structure of the corresponding test soldering pad are described in detail in the foregoing.

[0074] Embodiments one to three respectively show the corresponding test structure designed according to different test requirements. However, in addition to designing a test structure for a test requirement, a test structure combining embodiments one to three can also be designed by combining multiple test requirements.

[0075] Referring to Figure 7 As shown, the metal wire electrical property test structure 200 described in embodiment four includes a first soldering pad 210, a second soldering pad 220, a third soldering pad 230 and a fourth soldering pad 240. There is a test body 250 between two adjacent test soldering pads.

[0076] Embodiment four combines Embodiments one to three. Specifically, the first pad 210, the second pad 220, and the test body 250 between the first pad 210 and the second pad 220 correspond to Embodiment one. The second pad 220, the third pad 230, and the test body 250 between the second pad 220 and the third pad 230 correspond to Embodiment two. The third pad 230, the fourth pad 240, and the test body 250 between the third pad 230 and the fourth pad 240 correspond to Embodiment three.

[0077] That is, as the connection cases illustrated in Embodiments one to three. The first pad 210 and the second pad 220 are electrically connected with the first metal wires of the test body 250 between the first pad 210 and the second pad 220, and the first metal wires electrically connected with the first pad 210 and the first metal wires electrically connected with the second pad 220 are alternately and evenly distributed.

[0078] The second pad 220 and the third pad 230 are electrically connected with the second metal wires of the test body 250 between the second pad 220 and the third pad 230, and the second metal wires electrically connected with the second pad 220 and the second metal wires electrically connected with the third pad 230 are alternately and evenly distributed.

[0079] The third pad 230 is electrically connected with the first metal wires of the test body 250 between the third pad 230 and the fourth pad 240, and the fourth pad 240 is electrically connected with the second through-hole metal wires of the test body 250 between the third pad 230 and the fourth pad 240.

[0080] The detailed structure of the test body 250 and the connection structure of the test body 250 and the corresponding first pad 210, second pad 220, third pad 230, and fourth pad 240 are referred to Embodiments one to three, and will not be repeated here. Figure 7 The main purpose is to show the structural schematic diagram of Embodiments one to three combined together.

[0081] In some embodiments of the present application, the first pad 210, the second pad 220, the third pad 230, and the fourth pad 240 are arranged along the same straight line.

[0082] Continuing to refer to Figure 7 As shown, in the test structure of Embodiment four, the leakage between adjacent first metal wires, the leakage between adjacent second metal wires, and the leakage between adjacent first metal wires and second metal wires can be tested at the same time. The test structure improves the test efficiency.

[0083] The present application provides a metal wire electrical test structure, through the ingenious metal wire distribution, using the most time-effective electrical test, the leakage between the metal wires of the same structure and different structures can be tested.

[0084] In view of the foregoing, it will be understood that the foregoing description is presented by way of example only and is not intended to limit the application. Although the present application has been described in considerable detail with reference to certain exemplary embodiments, it is to be understood that modifications and changes can be made therein without departing from the spirit and scope of the application as recited in the following claims.

[0085] It should be understood that the term "and / or" as used herein includes any and all combinations of one or more of the associated listed items. It should be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements can be present.

[0086] Similarly, it should be understood that, when an element such as a layer, region or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements can be present. In contrast, the term "directly on" means that there are no intervening elements present. It will also be understood that the terms "comprises", "comprising", "includes", "including" and the like, when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0087] It will also be understood that, although the terms first, second, third etc. can be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Thus, a first element in some embodiments could be termed a second element in other embodiments without departing from the teachings of the present application. The same reference numerals or same reference designators denote the same elements throughout the specification.

[0088] In addition, the specification of the present application describes the exemplary embodiments by referring to idealized exemplary cross-sectional and / or plan and / or perspective views. Therefore, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, the exemplary embodiments should not be construed as limited to the precise shapes and / or relative dimensions illustrated herein, but should be construed broadly to include equivalents of the shapes and / or relative dimensions illustrated herein. Accordingly, the regions illustrated in the figures are schematic and are not intended to be drawn to scale.

Claims

1. A metal wire electrical test structure, comprising: The utility model relates to an electric property test structure of semiconductor wafer, including: Test body, including: A plurality of first metal connection line, along first direction arrange in turn, both ends surface of first metal connection line form with first through -hole; A plurality of second metal connection line, along second direction arrange in turn, both ends surface of second metal connection line form with second through -hole, a plurality of second metal connection line with a plurality of first metal connection line corresponding arrangement, a plurality of first metal connection line with a plurality of second metal connection line are located same layer; First solder pad, located test body one side, through first metal connection structure with first through -hole or second through -hole electricity is connected; Second solder pad, located test body other side, through second metal connection structure with first through -hole or second through -hole electricity is connected; Electric property test structure is used for testing adjacent first metal connection line between the leakage condition or adjacent second metal connection line between the leakage condition or first metal connection line and second metal connection line between the leakage condition.

2. The electrical test structure of claim 1, wherein, When test adjacent first metal connection line's leakage condition, first solder pad passes through first through -hole and first metal connection line electricity is connected, second solder pad passes through first through -hole and first metal connection line electricity is connected, and first metal connection line is connected with first solder pad and first metal connection line is connected with second solder pad and is alternately spaced distribution.

3. The electrical test structure of claim 1, wherein, When test adjacent second metal connection line's leakage condition, first solder pad passes through second through -hole and second metal connection line electricity is connected, second solder pad passes through second through -hole and second metal connection line electricity is connected, and second metal connection line is connected with first solder pad and second metal connection line is connected with second solder pad and is alternately spaced distribution.

4. The electrical test structure of claim 1, wherein, When test first metal connection line and second metal connection line between the leakage condition, first solder pad passes through first through -hole and first metal connection line electricity is connected, second solder pad passes through second through -hole and second metal connection line electricity is connected.

5. The electrical test structure of claim 1, wherein, The both sides of the plurality of first metal connection lines are further provided with first pseudo metal connection lines, and the both sides of the plurality of second metal connection lines are further provided with second pseudo metal connection lines.

6. The electrical test structure of claim 1, wherein, The number of the plurality of first metal connection lines is the same as the number of the plurality of second metal connection lines.

7. The electrical test structure of claim 1, wherein, The plurality of first metal connection lines and the plurality of second metal connection lines are arranged in an L shape.

8. The electrical test structure of claim 1, wherein, The first direction is perpendicular to the second direction.

9. The electrical test structure of claim 1, wherein, Further including: Third solder pad and fourth solder pad, the second solder pad and third solder pad between and the third solder pad and fourth solder pad between are all provided with test body, wherein, The first solder pad and the second solder pad are electrically connected to the first metal connection lines between the first solder pad and the second solder pad, and the first metal connection lines electrically connected to the first solder pad and the first metal connection lines electrically connected to the second solder pad are alternately and spacedly distributed. The second solder pad and the third solder pad are electrically connected to the second metal connection lines between the second solder pad and the third solder pad, and the second metal connection lines electrically connected to the second solder pad and the second metal connection lines electrically connected to the third solder pad are alternately and spacedly distributed. The third pad is electrically connected with a first metal wire of a test main body between the third pad and the fourth pad, and the fourth pad is electrically connected with a second metal wire of the test main body between the third pad and the fourth pad.

10. The electrical test structure of claim 9, wherein, The first pad, the second pad, the third pad and the fourth pad are arranged along the same straight line.

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