Workpiece processing system, distance measuring device and workpiece placement path setting method

Abstract

A method for setting a workpiece placement path using a workpiece processing system, the workpiece processing system including a carrier and a robotic arm, and the method comprising: obtaining a first position corresponding to the carrier, and obtaining a second position corresponding to the workpiece when the workpiece is placed on the carrier; and generating a corrected placement path based on the difference between the first position and the second position. The corrected placement path is used to control the robotic arm to place the workpiece onto the carrier such that the distance between the center of the workpiece and the center of the carrier is less than the distance between the first position and the second position. The corrected placement path enables the robotic arm to place the workpiece more precisely aligned with the carrier, thus avoiding negative impacts on the processing of the workpiece due to placement deviations.

Description

Technical Field

[0001] This invention relates to a processing system, and more particularly to a workpiece processing system suitable for workpieces. The invention also relates to a distance measuring device included in the workpiece processing system, and a method for setting a workpiece placement path by the workpiece processing system. Background Technology

[0002] Many manufacturing industries utilize robotic arms to place workpieces (such as wafers) into various processing equipment (such as etching equipment) for machining or other treatments. The accuracy of the workpiece's placement within the processing equipment is crucial to the processing outcome; therefore, ensuring that the workpiece is accurately placed in the correct position within the processing equipment becomes a topic worthy of discussion. Summary of the Invention

[0003] Therefore, one of the objectives of this invention is to provide a workpiece handling system capable of accurately placing workpieces.

[0004] The workpiece processing system of the present invention is suitable for processing workpieces. The workpiece processing system includes: a workpiece processing device, including a support for carrying the workpiece, a robotic arm for holding and moving the workpiece, and a processing unit; a distance measuring device, corresponding to the position of the support and electrically connected to the processing unit; wherein the processing unit is configured to obtain a first position corresponding to the support based on a first sensing result generated by the distance measuring device, and to obtain a second position corresponding to the workpiece based on a second sensing result generated by the distance measuring device when the workpiece is placed on the support, wherein the distance between the first position and the second position is used as an offset distance, and the processing unit is further configured to generate a corrected placement path corresponding to the robotic arm based at least on the difference between the first position and the second position, wherein the corrected placement path is used to control the robotic arm to place the workpiece to be processed onto the support, and such that the distance between the center position of the workpiece to be processed when placed on the support by the robotic arm and the center position of the support is less than the offset distance.

[0005] In some embodiments of the workpiece processing system of the present invention, the processing unit is also electrically connected to the robotic arm. After obtaining the first position based on the first sensing result, the processing unit first controls the robotic arm to place the workpiece onto the carrier according to the initial placement path. Then, it obtains the second position based on the second sensing result generated by the distance measuring device when the workpiece is placed on the carrier according to the initial placement path. The processing unit adjusts the initial placement path based on the difference between the first position and the second position to generate the corrected placement path.

[0006] In some embodiments of the workpiece processing system of the present invention, the distance measuring device includes a plurality of distance sensors, and the first sensing result and the second sensing result each include a plurality of sensing distance values ​​corresponding to the distance sensors respectively. Furthermore, the processing unit calculates the first position corresponding to the carrier based at least on the sensing distance value of the first sensing result, and calculates the second position corresponding to the workpiece based at least on the sensing distance value of the second sensing result.

[0007] In some embodiments of the workpiece processing system of the present invention, the carrier and the workpiece are each disk-shaped, and the distance sensor is disposed around the carrier; each sensing distance value included in the first sensing result represents the distance between the distance sensor corresponding to the sensing distance value and the side circumferential surface of the carrier; the processing unit first calculates a plurality of first circumferential coordinates corresponding to the sensing distance values ​​based on at least the sensing distance values ​​of the first sensing result, and then calculates the first position based on the first circumferential coordinates, and the first position represents the center position of the circular surface of the carrier; each sensing distance value included in the second sensing result represents the distance between the distance sensor corresponding to the sensing distance value and the side circumferential surface of the workpiece; the processing unit first calculates a plurality of second circumferential coordinates corresponding to the sensing distance values ​​based on at least the sensing distance values ​​of the second sensing result, and then calculates the second position based on the second circumferential coordinates, and the second position represents the center position of the circular surface of the workpiece.

[0008] In some embodiments of the workpiece processing system of the present invention, the processing unit is also adapted to be electrically connected to an input unit for user operation, and the initial placement path is generated by the processing unit after receiving the initial placement coordinates from the input unit, at least based on the initial placement coordinates.

[0009] In some embodiments of the workpiece processing system of the present invention, the processing unit generates the corrected placement path by generating a test placement path corresponding to the robotic arm based at least on the difference between the first position and the second position, and executing a test program based on the test placement path. The test program includes: controlling the robotic arm to place the workpiece onto the carrier according to the test placement path, and determining whether the distance between the current center position of the workpiece when it is placed on the carrier and the center position of the carrier is less than an offset threshold less than the offset distance. If the determination result is yes, the test placement path is used as the corrected placement path. If the determination result is no, the second position is updated with the current center position, and another test placement path corresponding to the robotic arm is generated based at least on the updated second position, and the test program is executed again based on the other test placement path.

[0010] Another object of the present invention is to provide a distance measuring device included in the workpiece handling system.

[0011] The distance measuring device of the present invention is suitable for being installed in a workpiece processing equipment, wherein the workpiece processing equipment includes a support for carrying a workpiece; the distance measuring device includes: a body adapted to be installed in the workpiece processing equipment; and a plurality of distance sensors disposed on the body and each facing the support, such that each distance sensor can measure the distance between itself and the support when no workpiece is placed on the support, and measure the distance between itself and the workpiece when the workpiece is placed on the support.

[0012] In some embodiments of the distance measuring device of the present invention, the support is disc-shaped, and the distance sensors are arranged in a fan shape relative to the support.

[0013] In some embodiments of the distance measuring device of the present invention, the number of distance sensors is at least three.

[0014] In some embodiments of the distance measuring device of the present invention, the workpiece handling equipment further includes a wall surrounding the carrier and a robotic arm located on one side of the carrier for placing the workpiece onto the carrier, and the body of the distance measuring device is adapted to be disposed on the wall and located on the other side of the carrier opposite to the robotic arm.

[0015] Another object of the present invention is to provide a method for setting a workpiece placement path implemented by the workpiece processing system.

[0016] The workpiece placement path setting method of the present invention is implemented by a workpiece processing system, wherein the workpiece processing system includes a support for carrying the workpiece, a distance measuring device corresponding to the position of the support, a robotic arm for holding and moving the workpiece, and a processing unit electrically connected to the distance measuring device; the workpiece placement path setting method includes: the processing unit obtaining a first position corresponding to the support based on a first sensing result generated by the distance measuring device, and obtaining a second position corresponding to the workpiece based on a second sensing result generated by the distance measuring device when the workpiece is placed on the support, wherein the distance between the first position and the second position is used as an offset distance; the processing unit generates a corrected placement path corresponding to the robotic arm based at least on the difference between the first position and the second position, wherein the corrected placement path is used to control the robotic arm to place the workpiece to be processed onto the support, and such that the distance between the center position of the workpiece to be processed when placed on the support by the robotic arm and the center position of the support is less than the offset distance.

[0017] In some embodiments of the workpiece placement path setting method of the present invention, the processing unit is also electrically connected to the robotic arm, and after obtaining the first position based on the first sensing result, the processing unit first controls the robotic arm to place the workpiece onto the carrier according to the initial placement path, and then obtains the second position based on the second sensing result generated by the distance measuring device when the workpiece is placed on the carrier according to the initial placement path. Furthermore, the processing unit adjusts the initial placement path according to the difference between the first position and the second position, thereby generating the corrected placement path.

[0018] In some embodiments of the workpiece placement path setting method of the present invention, the distance measuring device includes a plurality of distance sensors, and the first sensing result and the second sensing result each include a plurality of sensing distance values ​​corresponding to the distance sensors respectively. Furthermore, the processing unit calculates the first position corresponding to the carrier based at least on the sensing distance value of the first sensing result, and calculates the second position corresponding to the workpiece based at least on the sensing distance value of the second sensing result.

[0019] In some embodiments of the workpiece placement path setting method of the present invention, the carrier and the workpiece are each disc-shaped, and the distance sensor is disposed around the carrier; each sensing distance value included in the first sensing result represents the distance between the distance sensor corresponding to the sensing distance value and the side circumferential surface of the carrier; the processing unit first calculates a plurality of first circumferential coordinates corresponding to the sensing distance values ​​based on at least the sensing distance values ​​of the first sensing result, and then calculates the first position based on the first circumferential coordinates, and the first position represents the center position of the circular surface of the carrier; each sensing distance value included in the second sensing result represents the distance between the distance sensor corresponding to the sensing distance value and the side circumferential surface of the workpiece; the processing unit first calculates a plurality of second circumferential coordinates corresponding to the sensing distance values ​​based on at least the sensing distance values ​​of the second sensing result, and then calculates the second position based on the second circumferential coordinates, and the second position represents the center position of the circular surface of the workpiece.

[0020] In some embodiments of the workpiece placement path setting method of the present invention, the processing unit is also adapted to be electrically connected to an input unit for user operation, and the initial placement path is generated by the processing unit after receiving the initial placement coordinates from the input unit, at least based on the initial placement coordinates.

[0021] In some embodiments of the workpiece placement path setting method of the present invention, the processing unit generates the corrected placement path by generating a test placement path corresponding to the robotic arm based at least on the difference between the first position and the second position, and executing a test program based on the test placement path. The test program includes: controlling the robotic arm to place the workpiece onto the carrier according to the test placement path, and determining whether the distance between the current center position of the workpiece when it is placed on the carrier and the center position of the carrier is less than an offset threshold that is less than the offset distance. If the determination result is yes, the test placement path is used as the corrected placement path. If the determination result is no, the second position is updated with the current center position, and another test placement path corresponding to the robotic arm is generated based at least on the updated second position. The test program is then executed again based on the other test placement path.

[0022] The beneficial effects of the present invention are as follows: by obtaining the first position corresponding to the support and the second position corresponding to the workpiece when it is on the support, the workpiece processing system can generate the corrected placement path according to the relative positional relationship between the workpiece and the support when it is on the support. The corrected placement path enables the robotic arm to place the workpiece to be processed more aligned with the support, thus avoiding the negative impact on the processing of the workpiece due to the placement position deviation of the workpiece. Attached Figure Description

[0023] Other features and effects of the present invention will be clearly presented in the embodiments with reference to the accompanying drawings, wherein:

[0024] Figure 1 This is a block diagram illustrating an embodiment of the workpiece processing system of the present invention, a workpiece suitable for application to the embodiment, and an input unit suitable for cooperation with the embodiment;

[0025] Figure 2 This is a top view schematic diagram, exemplarily illustrating a workpiece processing device and a distance measuring device included in this embodiment;

[0026] Figure 3 This is a top view schematic diagram, exemplarily illustrating a workpiece placed on a support of the workpiece processing equipment; and

[0027] Figure 4 This is a flowchart illustrating, by way of example, how this embodiment implements a workpiece placement path setting method for the workpiece. Detailed Implementation

[0028] Before this invention is described in detail, it should be noted that, unless otherwise defined, "electrical connection" as used in this specification refers to a "wired electrical connection" where multiple electronic devices / devices / components are interconnected via conductive materials, and a "radio connection" where one-way / two-way wireless signal transmission is performed via wireless communication technology. Furthermore, unless otherwise defined, "electrical connection" as used in this specification also refers to a "direct electrical connection" where multiple electronic devices / devices / components are directly interconnected, and an "indirect electrical connection" where multiple electronic devices / devices / components are also indirectly interconnected via other electronic devices / devices / components.

[0029] See Figure 1 and Figure 2 One embodiment of the workpiece processing system 1 of the present invention includes, for example, a workpiece processing device 11 and a distance measuring device 12 detachably disposed on the workpiece processing device 11. Furthermore, the workpiece processing device 11 is adapted, for example, to connect with an input unit 2 for user operation (shown in…). Figure 1Electrical connection.

[0030] The workpiece processing device 11 is suitable for processing a workpiece 5 (exemplarily shown in...). Figure 3 ) to perform automated processing. More specifically, in the application of this embodiment, the workpiece 5 may be, for example, a disk-shaped wafer, having a circular surface 51 and a side peripheral surface 52 extending from the edge of the circular surface 51 (shown in Figure 3 ).

[0031] On the other hand, in this embodiment, the workpiece processing apparatus 11 may be implemented as a wafer etching apparatus for etching the workpiece 5 placed in the workpiece processing apparatus 11. However, in other embodiments, the workpiece processing apparatus 11 may also be implemented as a wafer cleaning apparatus for cleaning wafers, or a wafer processing apparatus for performing other processing on wafers. Therefore, the actual implementation of the workpiece processing apparatus 11 is not limited to this embodiment.

[0032] In this embodiment, the workpiece processing device 11 includes, for example, a base 111, a support 112 disposed on the base 111 and used to support the workpiece 5, a surrounding wall 113 disposed on the base 111 and surrounding the support 112, a robotic arm 114 for holding and moving the workpiece 5, and a processing unit 115 (shown in Figure 113) electrically connected to the robotic arm 114 and the distance measuring device 12. Figure 1 ).

[0033] The support 112 is, for example, disc-shaped and has a horizontal circular surface 116 and a side peripheral surface 117 extending downward from the edge of the circular surface 116. When the support 112 carries the workpiece 5, the circular surface 116 of the support 112 will contact the bottom surface of the workpiece 5.

[0034] The enclosure 113 is, for example, annular and spaced apart from the support 112. More specifically, since the workpiece processing equipment 11 is exemplary implemented as a wafer etching equipment in this embodiment, the enclosure 113 is used, for example, to block the etching liquid flowing around the support 112 during the etching process, but is not limited thereto.

[0035] The robotic arm 114 is, for example, disposed on a first side of the support 112, and the robotic arm 114 can be controlled by the processing unit 115 to hold the workpiece 5 and move the workpiece 5, and place the workpiece 5 on the support 112 or move it away from the support 112.

[0036] In this embodiment, the processing unit 115 may be implemented as a central processing unit (CPU), and it may be electrically connected to the input unit 2. More specifically, the input unit 2 may be a keyboard, but it can also be replaced by other types of input devices or the input interface of the workpiece processing device 11 itself. Furthermore, in similar embodiments, the processing unit 115 may be implemented as multiple CPUs electrically connected to each other, or as a control circuit board including CPUs. In general, the processing unit 115 can be implemented as any computer hardware with data processing and computation functions, so its actual implementation is not limited to this embodiment.

[0037] In this embodiment, the distance measuring device 12 is installed on the enclosure 113 in a removable manner, and the distance measuring device 12 is located on a second side of the support 112 opposite to the first side and spaced apart from the support 112, so that the robotic arm 114 will not collide with the distance measuring device 12 when it is in motion.

[0038] More specifically, in this embodiment, the distance measuring device 12 includes, for example, a body 121 that is detachably mounted on the enclosure 113, and three distance sensors 122 mounted on the body 121 and electrically connected to the processing unit 115.

[0039] In this embodiment, the body 121 of the distance measuring device 12 has, for example, a central section in the shape of a straight strip and two extension sections, wherein the two extension sections are respectively connected to opposite ends of the central section, and the central section and the two extension sections are, for example, as shown in the figure. Figure 2 The surfaces shown are each at an obtuse angle, making the overall shape of the body 121 convenient for mounting on the enclosure 113. However, in other embodiments, the body 121 may also be implemented as a straight horizontal bar without bends, or as an arc shape that matches the enclosure 113; even, the body 121 is not limited to being mounted on the enclosure 113. In general, the body 121 of the distance measuring device 12 can be implemented as long as it can be mounted around the support 112, so its actual implementation is not limited to this embodiment.

[0040] In this embodiment, each distance sensor 122 of the distance measuring device 12 may be, for example, a laser ranging sensor implemented using optical technology. However, in other embodiments, the distance sensor 122 may also implement the ranging function using other technologies such as infrared or radar, and the number of the distance sensors 122 may be, for example, three or more. Therefore, the actual implementation of the distance sensor 122 is not limited to this embodiment.

[0041] Furthermore, in this embodiment, the distance sensor 122 is, for example, relative to the support 112 as follows: Figure 2 The components are arranged in a fan shape around the support 112, each facing the side peripheral surface 117 of the support 112. This allows for operation even when the workpiece 5 is not placed on the support 112 (i.e.,...). Figure 2 As shown, each distance sensor 122 can measure the distance between itself and the side circumferential surface 117 of the support 112. Furthermore, the distance between each distance sensor 122 and the side circumferential surface 117 of the support 112 is equivalent to the horizontal distance between the distance sensor 122 and the edge of the circular surface 116. On the other hand, when the workpiece 5 is placed on the support 112 (i.e.,...) Figure 3 As shown, since the workpiece 5 protrudes beyond the support 112, each distance sensor 122 can measure the distance between itself and the side circumferential surface 52 of the workpiece 5. Furthermore, the distance between each distance sensor 122 and the side circumferential surface 52 of the workpiece 5 is equivalent to the horizontal distance between the distance sensor 122 and the edge of the circular surface 116. More specifically, in a preferred embodiment, when the body 121 of the distance measuring device 12 is mounted on the enclosure 113 and is in a horizontal position, the horizontal heights of the distance sensors 122 are the same, and the horizontal height of the distance sensors 122 is also approximately the same as the side circumferential surface 117 of the support 112.

[0042] It should be further explained that, since the area of ​​the circular surface 51 of the workpiece 5 is larger than the area of ​​the circular surface 116 of the support 112, when the workpiece 5 is placed on the support 112, the distance sensor 122 will naturally sense the side peripheral surface 52 of the workpiece 5, rather than the side peripheral surface 117 of the support 112. On the other hand, in other embodiments, the distance sensor 122 only needs to be at approximately the same horizontal height as the support 112 to measure distances to multiple points on the side peripheral surface 117 of the support 112 and the side peripheral surface 52 of the workpiece 5. Therefore, the distance sensor 122 can also be arranged in a straight line in other embodiments, and is not limited to the arrangement of this embodiment. Furthermore, in other embodiments, either the support 112 or the workpiece 5 can be other shapes, and is not limited to the disc shape described in this embodiment.

[0043] See also Figure 4 The following describes in detail, by way of example, how the workpiece processing system 1 of this embodiment implements a workpiece placement path setting method for the workpiece 5.

[0044] First, in step S1, if the workpiece 5 is not placed on the support 112 (i.e.) Figure 2 (As shown), the processing unit 115 controls the operation of the distance sensor 122 of the distance measuring device 12 to obtain a first sensing result related to the carrier 112 from the distance measuring device 12. In this embodiment, the first sensing result includes, for example, three sensing distance values ​​generated by the three distance sensors 122 respectively, and each sensing distance value included in the first sensing result represents the distance between the corresponding distance sensor 122 and the side peripheral surface 117 of the carrier 112.

[0045] After the processing unit 115 obtains the first sensing result, the process proceeds to step S2.

[0046] In step S2, the processing unit 115 obtains a first position corresponding to the bearing 112 based on the sensing distance value contained in the first sensing result.

[0047] In this embodiment, the processing unit 115 first calculates a plurality of first circumferential coordinates corresponding to the sensing distance values ​​based on the angle of each distance sensor 122, the relative positional relationship between each distance sensor 122 and a reference point coordinate, and the sensing distance value of the first sensing result. Then, the processing unit 115 calculates the first position corresponding to the carrier 112 based on the first circumferential coordinates.

[0048] More specifically, in this embodiment, each first circumferential coordinate represents, for example, the position of a point on the edge of the circular surface 116 of the support 112, that is, the coordinates of a point on the circumference of the circular surface 116. On the other hand, the first position represents, for example, the center position of the circular surface 116 of the support 112. Moreover, the processing unit 115 calculates the first position, for example, using the first circumferential coordinates and the equation of a circle, but is not limited to this.

[0049] After the processing unit 115 calculates the first position, the process proceeds to step S3.

[0050] In step S3, the processing unit 115 controls the robotic arm 114 to hold the workpiece 5 and, according to an initial placement path, controls the robotic arm 114 to place the workpiece 5 onto the carrier 112. More specifically, in this embodiment, the initial placement path is generated by the processing unit 115, for example, after receiving an initial placement coordinate from the input unit 2, based on the initial placement coordinate and the relative positional relationship between the robotic arm 114 and the carrier 112. Moreover, the initial placement coordinate is generated by the input unit 2 according to the user's input operation and provided to the processing unit 115. In other words, in this embodiment, the initial placement coordinate is, for example, manually input by the user into the workpiece processing system 1 through the input unit 2, but is not limited to this.

[0051] After the processing unit 115 controls the robotic arm 114 to place the workpiece 5 onto the carrier 112 according to the initial placement path, the process proceeds to step S4.

[0052] In step S4, when the workpiece 5 has been placed on the support 112 by the robotic arm 114 (e.g.) Figure 3 (As shown in the example), the processing unit 115 again controls the distance sensor 122 of the distance measuring device 12 to operate, so as to obtain a second sensing result related to the workpiece 5 from the distance measuring device 12. In this embodiment, the second sensing result includes, for example, three other sensing distance values ​​generated by the three distance sensors 122 respectively, and each sensing distance value included in the second sensing result represents the distance between the corresponding distance sensor 122 and the side peripheral surface 52 of the workpiece 5.

[0053] After the processing unit 115 obtains the second sensing result, the process proceeds to step S5.

[0054] In step S5, the processing unit 115 obtains a second position corresponding to the workpiece 5 based on the sensing distance value contained in the second sensing result.

[0055] Similar to the first position, in this embodiment, the processing unit 115 first calculates a plurality of second circumferential coordinates corresponding to the sensing distance values ​​of the second sensing results, based on the angle of each distance sensor 122, the relative positional relationship between each distance sensor 122 and the coordinates of the reference point, and the sensing distance value of the second sensing result. Then, the processing unit 115 calculates the second position corresponding to the workpiece 5 based on the second circumferential coordinates.

[0056] More specifically, in this embodiment, each second circumferential coordinate represents, for example, the position of a point on the edge of the circular surface 51 of the workpiece 5, that is, the coordinate of a point on the circumference of the circular surface 51 of the workpiece 5. On the other hand, the second position represents, for example, the center position of the circular surface 51 of the workpiece 5. Moreover, the processing unit 115 calculates the second position, for example, using the second circumferential coordinates and the circle-square program, but is not limited thereto.

[0057] After the processing unit 115 calculates the second position, the process proceeds to step S6.

[0058] In step S6, the processing unit 115 generates a corrected placement path corresponding to the robotic arm 114 based on the positional difference between the first position and the second position and the initial placement path, and outputs the corrected placement path to a storage unit (not shown) for storage. The storage unit may be, for example, a data storage device (e.g., a hard disk or memory) for storing digital data, and may be, for example, located inside the workpiece processing device 11, or, for example, located in an external server independent of the workpiece processing device 11.

[0059] It should be noted that when the workpiece 5 is placed on the support 112, the center point of the workpiece 5 should ideally be aligned with the support 112. Furthermore, since the first position and the second position in this embodiment represent the centers of the support 112 and the workpiece 5, respectively, the distance between the first position and the second position is, for example, used as an offset distance in this embodiment. In other words, this offset distance is not only equivalent to the distance between the center of the support 112 and the center of the workpiece 5, but also equivalent to the error caused by the robotic arm 114 placing the workpiece 5 along the initial placement path.

[0060] On the other hand, the corrected placement path stored in the storage unit is used by the processing unit 115 to control the robotic arm 114 to place one or more workpieces (not shown) of the same size as the workpiece 5 onto the carrier 112, such that when the workpiece is placed on the carrier 112 by the robotic arm 114 according to the corrected placement path, the distance between the center position of the workpiece (corresponding to the center of the workpiece) and the center position of the carrier 112 (corresponding to the center of the carrier 112) is less than the offset distance, that is, the center of the workpiece is more aligned with the center of the carrier 112. It should be further noted that the workpiece 5 itself may be, for example, one of the workpieces to be processed.

[0061] More specifically, in this embodiment, the processing unit 115 adjusts the initial placement path based on the positional difference between the first position and the second position to generate the corrected placement path. For example, assuming the second position (corresponding to the center of the workpiece 5) is offset 1 mm to the right from the first position (corresponding to the center of the support 112), the processing unit 115 will, for example, use a position "moved 1 mm to the left from the initial placement coordinates" as the corrected placement coordinates corresponding to the initial placement coordinates, and adjust the initial placement path accordingly based on the relative positional relationship between the corrected placement coordinates and the initial placement coordinates to generate the corrected initial placement path, but this is not a limitation.

[0062] After the processing unit 115 generates and outputs the corrected placement path, the process of the workpiece placement path setting method ends.

[0063] The above is an example of how the workpiece processing system 1 of this embodiment implements the workpiece placement path setting method. It should be noted that in similar embodiments, the workpiece processing system 1 may also implement the workpiece placement path setting method on a wafer model that matches the actual wafer size, rather than necessarily on the actual wafer (i.e., workpiece 5 in this embodiment).

[0064] It should be noted that steps S1 to S6 and in this embodiment are... Figure 4 The flowchart provided is merely an example illustrating one possible implementation of the workpiece placement path setting method of the present invention. It should be understood that even if steps S1 to S6 are combined, split, or rearranged in order, if the resulting process achieves substantially the same effect in substantially the same manner as this embodiment, it still falls under the category of an implementable form of the workpiece placement path setting method of the present invention. Therefore, steps S1 to S6 of this embodiment and... Figure 4 The flowchart is not intended to limit the scope of the invention.

[0065] Furthermore, in a further embodiment of this example, the processing unit 115 generates the corrected placement path in step S6 by, for example, first generating a test placement path corresponding to the robotic arm 114 based on the positional difference between the first position and the second position and the initial placement path, and then executing a test program based on the test placement path. The processing unit 115 executes the test program by, for example, first controlling the robotic arm 114 to move along the test placement path and placing the workpiece 5 onto the support 112, and then determining whether the distance between the current center position (equivalent to the center of the workpiece 5) when the workpiece 5 is placed on the support 112 and the center position (equivalent to the center of the support 112) is less than an offset threshold value that is even smaller than the offset distance. If the processing unit 115 determines the correct placement path, it uses the test placement path as the calibration placement path. Conversely, if the processing unit 115 determines the incorrect placement path, it updates the second position using the current center position of the workpiece 5 (i.e., uses the current center position of the workpiece 5 as the new second position), generates another test placement path corresponding to the robotic arm based on the first position and the updated second position, and executes the test program again based on the other test placement path until a test placement path suitable as the calibration placement path is generated. By executing the test program with the processing unit 115, the workpiece processing system 1 can further ensure the accuracy of the calibration placement path.

[0066] In summary, by implementing this workpiece placement path setting method, the workpiece processing system 1 can calculate the first position corresponding to the support 112 and the second position corresponding to the workpiece 5 when it is on the support 112. Based on the relative positional relationship between the workpiece 5 and the support 112, the initial placement path is corrected to generate a corrected placement path. This corrected placement path ensures that the robotic arm 114 places the workpiece to be processed more closely aligned with the center of the support 112, thus avoiding negative impacts on the processing of the workpiece due to placement deviations. It is worth noting that manually adjusting the path of the robotic arm 114 for placing the workpiece typically takes more than half an hour, and different users may have inconsistent calibration standards. However, by implementing this workpiece placement path setting method, the workpiece processing system 1 can obtain the corrected placement path in only about ten minutes, saving at least 60% of the adjustment time and eliminating the problem of inconsistent calibration standards. Therefore, the purpose of this invention is indeed achieved.

[0067] The above description is merely an embodiment of the present invention and should not be construed as limiting the scope of the present invention. Any simple equivalent changes and modifications made in accordance with the claims and description of the present invention shall still fall within the scope of the present invention.

Claims

1. A workpiece processing system, suitable for processing workpieces, characterized in that: The workpiece processing system includes: A workpiece handling device includes a support for carrying the workpiece, a robotic arm for holding and moving the workpiece, and a processing unit electrically connected to the robotic arm. and A distance measuring device, corresponding to the position of the support and electrically connected to the processing unit, includes a plurality of distance sensors, wherein each distance sensor is used to measure the distance between itself and the side circumferential surface of the support when no workpiece is placed on the support, and to measure the distance between itself and the side circumferential surface of the workpiece when the workpiece is placed on the support. The processing unit is configured to control the distance sensor to operate when no workpiece is placed on the carrier, thereby obtaining a first sensing result generated by the distance measuring device and related to the carrier, and obtaining a first position corresponding to the carrier based on the first sensing result. It then controls the robotic arm to place the workpiece onto the carrier according to an initial placement path. When the workpiece has been placed on the carrier by the robotic arm according to the initial placement path, the unit controls the distance sensor to operate again, thereby obtaining a second sensing result generated by the distance measuring device and related to the workpiece, and obtaining a second position corresponding to the workpiece based on the second sensing result. Each of the first and second sensing results includes multiple sensing distance values ​​corresponding to the distance sensor, and each sensing distance value in the first sensing result represents that sensing distance. The processing unit calculates the first position corresponding to the carrier based at least on the sensing distance value of the first sensing result, and calculates the second position corresponding to the workpiece based at least on the sensing distance value of the second sensing result. The distance between the first position and the second position is used as the offset distance. The processing unit is also used to adjust the initial placement path based at least on the difference between the first position and the second position to generate a corrected placement path corresponding to the robotic arm. The corrected placement path is used to replace the initial placement path and control the robotic arm to place the workpiece to be processed onto the carrier, such that the distance between the center position of the workpiece to be processed when it is placed on the carrier by the robotic arm and the center position of the carrier is less than the offset distance.

2. The workpiece processing system according to claim 1, characterized in that: The support base and the workpiece are each disc-shaped, and the distance sensor is disposed around the support base; The processing unit first calculates at least a plurality of first circumferential coordinates corresponding to the sensing distance value based on the sensing distance value of the first sensing result, and then calculates the first position based on the first circumferential coordinates, wherein the first position represents the center position of the circular surface of the support. Each sensing distance value included in the second sensing result represents the distance between the distance sensor corresponding to that sensing distance value and the side circumferential surface of the workpiece; and The processing unit first calculates at least a plurality of second circumferential coordinates corresponding to the sensing distance value based on the sensing distance value of the second sensing result, and then calculates the second position based on the second circumferential coordinates, wherein the second position represents the center position of the circular surface of the workpiece.

3. The workpiece processing system according to claim 1, characterized in that: The processing unit is also adapted to be electrically connected to an input unit for user operation, and the initial placement path is generated by the processing unit after receiving the initial placement coordinates from the input unit, at least based on the initial placement coordinates.

4. The workpiece processing system according to claim 1, characterized in that: The processing unit generates the corrected placement path by generating a test placement path corresponding to the robotic arm based at least on the difference between the first position and the second position, and executing a test program based on the test placement path. The test program includes: controlling the robotic arm to place the workpiece onto the carrier using the test placement path, and determining whether the distance between the current center position of the workpiece when it is placed on the carrier and the center position of the carrier is less than an offset threshold that is less than the offset distance. If the determination result is yes, the test placement path is used as the corrected placement path. If the determination result is no, the second position is updated with the current center position, and another test placement path corresponding to the robotic arm is generated based at least on the updated second position. The test program is then executed again based on the other test placement path.

5. A method for setting a workpiece placement path, characterized in that: The workpiece placement path setting method is implemented by a workpiece processing system. The workpiece processing system includes a support for carrying the workpiece, a distance measuring device corresponding to the position of the support, a robotic arm for holding and moving the workpiece, and a processing unit electrically connected to the distance measuring device and the robotic arm. The distance measuring device includes multiple distance sensors, each of which measures the distance between itself and the side circumferential surface of the support when no workpiece is placed on the support, and measures the distance between itself and the side circumferential surface of the workpiece when the workpiece is placed on the support. The workpiece placement path setting method includes: When no workpiece is placed on the carrier, the processing unit controls the distance sensor to operate, so as to obtain a first sensing result generated by the distance measuring device and related to the carrier, and obtains a first position corresponding to the carrier based on the first sensing result. The first sensing result includes a plurality of sensing distance values ​​corresponding to the distance sensor, and each sensing distance value in the first sensing result represents the distance between the distance sensor and the side circumferential surface of the carrier. The processing unit calculates the first position corresponding to the carrier based at least on the sensing distance values ​​of the first sensing result. The processing unit controls the robotic arm to place the workpiece onto the support according to the initial placement path; After the workpiece has been placed on the carrier by the robotic arm along the initial placement path, the distance sensor is controlled to operate again to obtain a second sensing result generated by the distance measuring device and related to the workpiece, and a second position corresponding to the workpiece is obtained based on the second sensing result, wherein the second sensing result includes a plurality of additional sensing distance values ​​respectively corresponding to the distance sensor, and the distance between the first position and the second position is used as an offset distance; and The processing unit adjusts the initial placement path based at least on the difference between the first position and the second position to generate a corrected placement path corresponding to the robotic arm. The corrected placement path is used to replace the initial placement path and control the robotic arm to place the workpiece to be processed onto the carrier, such that the distance between the center position of the workpiece to be processed when it is placed on the carrier by the robotic arm and the center position of the carrier is less than the offset distance.

6. The workpiece placement path setting method according to claim 5, characterized in that: The support base and the workpiece are each disc-shaped, and the distance sensor is disposed around the support base; The processing unit first calculates at least a plurality of first circumferential coordinates corresponding to the sensing distance value based on the sensing distance value of the first sensing result, and then calculates the first position based on the first circumferential coordinates, wherein the first position represents the center position of the circular surface of the support. Each sensing distance value included in the second sensing result represents the distance between the distance sensor corresponding to that sensing distance value and the side circumferential surface of the workpiece; and The processing unit first calculates at least a plurality of second circumferential coordinates corresponding to the sensing distance value based on the sensing distance value of the second sensing result, and then calculates the second position based on the second circumferential coordinates, wherein the second position represents the center position of the circular surface of the workpiece.

7. The workpiece placement path setting method according to claim 5, characterized in that: The processing unit is also adapted to be electrically connected to an input unit for user operation, and the initial placement path is generated by the processing unit after receiving the initial placement coordinates from the input unit, at least based on the initial placement coordinates.

8. The workpiece placement path setting method according to claim 5, characterized in that: The processing unit generates the corrected placement path by generating a test placement path corresponding to the robotic arm based at least on the difference between the first position and the second position, and executing a test program based on the test placement path. The test program includes: controlling the robotic arm to place the workpiece onto the carrier using the test placement path, and determining whether the distance between the current center position of the workpiece when it is placed on the carrier and the center position of the carrier is less than an offset threshold that is less than the offset distance. If the determination result is yes, the test placement path is used as the corrected placement path. If the determination result is no, the second position is updated with the current center position, and another test placement path corresponding to the robotic arm is generated based at least on the updated second position. The test program is then executed again based on the other test placement path.

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