A PCB board hole wetting device

Abstract

The present invention discloses a PCB board hole wetting device, comprising a conveying mechanism, an immersion mechanism and a hole wetting mechanism; the conveying mechanism is used to convey the PCB board, comprising a frame, a water tank and a plurality of conveying rollers, the plurality of conveying rollers are horizontally arranged on the frame in sequence, and the water tank is arranged at the bottom of the frame; the immersion mechanism is used to immerse the PCB board, comprising an immersion tank, an infusion tube and a first water pump; the hole wetting mechanism is used to perform hole wetting operations on the holes of the PCB board, comprising a hole wetting tube, a hole wetting nozzle and a second water pump, one end of the hole wetting tube is connected to the water tank, and the other end of the hole wetting tube is horizontally installed above the frame, the hole wetting nozzle is installed at the bottom of the hole wetting tube away from the water tank, the second water pump is connected to the hole wetting tube, and the second water pump is used to pump a wetting liquid into the hole wetting tube, so that the hole wall of the PCB board can be wetted before electroplating, so that the electroplating liquid can more easily penetrate into the hole.

Description

Technical Field

[0001] The present invention relates to the field of PCB electroplating, and in particular to a PCB hole wetting device. Background Art

[0002] PCB hole and line design is the basis for ensuring the realization of circuit functions. With the realization of informatization and the Internet of Things, small-aperture, high-aspect-ratio ultra-fine circuit boards have emerged. Small-aperture, high-aspect-ratio ultra-fine circuit boards are characterized by small aperture and high depth. Therefore, during the electroplating process of the PCB board, due to the dry hole wall, the plating liquid is difficult to evenly penetrate into the hole, resulting in uneven copper plating on the hole wall. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a PCB hole wetting device that can wet the hole walls of the PCB board before electroplating, allowing the electroplating solution to more easily penetrate into the hole.

[0004] The technical solution adopted by the present invention to solve its technical problem is:

[0005] A PCB board hole wetting device, comprising a conveying mechanism, a soaking mechanism and a hole wetting mechanism;

[0006] The conveying mechanism is used to convey PCB boards, including a frame, a water tank and several conveying rollers. The conveying rollers are horizontally arranged on the frame in sequence. The water tank is set at the bottom of the frame and is used to contain lubricating liquid.

[0007] The immersion mechanism is used to immerse the PCB board, and includes an immersion tank, an infusion tube, and a first water pump. The immersion tank is used to accommodate the lubricating liquid and the PCB board. The immersion tank is provided with two openings along the conveying direction of the PCB board, and the openings can accommodate the conveying roller and the PCB board. One end of the infusion tube is connected to the water tank, and the other end of the infusion tube is fixed above the immersion tank. The infusion tube is used to add the lubricating liquid to the interior of the immersion tank. The first water pump is connected to the infusion tube and is used to pump the lubricating liquid into the infusion tube.

[0008] The wetting mechanism is used to wetting the holes of the PCB board, and includes a wetting tube, a wetting nozzle and a second water pump. One end of the wetting tube is connected to the water tank, and the other end of the wetting tube is horizontally installed above the frame. The wetting nozzle is installed at the bottom of the wetting tube away from the water tank. The second water pump is connected to the wetting tube and is used to pump the lubricating liquid into the wetting tube.

[0009] A PCB board hole wetting device according to an embodiment of the present invention has at least the following beneficial effects: by arranging conveying rollers, each conveying roller is connected by gears, and a motor drives the conveying rollers to rotate so that the PCB board can be conveyed along the direction in which the conveying rollers are arranged; by arranging a soaking box, after the PCB board is conveyed to the inside of the soaking box by the conveying rollers, a wetting liquid in the water tank is added to the inside of the soaking box by arranging a first water pump and an infusion pipe until the liquid level is higher than the PCB board, and then the PCB board is soaked so that the wetting liquid can initially penetrate into the holes of the PCB board; the soaked PCB board is conveyed to the hole wetting mechanism by the conveying rollers, and by arranging a wetting pipe, a wetting nozzle and a second water pump, the wetting liquid in the water tank is sprayed onto the PCB board by high-pressure water flow, part of the high-pressure water flow can be sprayed into the inside of the hole of the PCB board, and then the hole wall of the PCB board can be wetted before electroplating, so that the electroplating liquid can more easily penetrate into the inside of the hole.

[0010] According to some embodiments of the present invention, the lubricating orifice pipe includes a lubricating orifice main pipe and several lubricating orifice branch pipes. One end of the lubricating orifice main pipe is connected to the water tank, and the other end of the lubricating orifice main pipe is connected to several lubricating orifice branch pipes respectively. The several lubricating orifice branch pipes are horizontally arranged above the frame, and the lubricating orifice branch pipes are installed with several lubricating orifice nozzles.

[0011] The benefit is that: by arranging several wetting branch pipes horizontally, the wetting mechanism can wet the PCB board in a larger range, and can spray for a longer time during the transportation of the PCB board.

[0012] According to some embodiments of the present invention, the wetting nozzle is a high-pressure nozzle, which is used to spray wetting liquid into the holes of the PCB board and wet the hole walls.

[0013] Advantageously, the hole-wetting nozzle is configured as a high-pressure nozzle, which can eject a high-pressure water flow, thereby breaking through the residual bubbles in the hole and wetting the hole wall.

[0014] According to some embodiments of the present invention, two water rollers are provided above and below the opening. When the water rollers are closed, they are used to block the opening to reduce the outflow of lubricating liquid. When the water rollers are opened, they are used to transport the PCB board into the immersion box.

[0015] What is beneficial is that: by arranging two water pressure rollers above and below the two openings, when the conveying roller conveys the PCB board to the water pressure roller, the water pressure roller opens and the PCB board can enter the immersion box. When the PCB board is completely inside the immersion box, the water pressure roller closes, and then the infusion pipe starts to fill the immersion box with water until the liquid level of the lubricating liquid is higher than the PCB board. After the immersion is completed, the conveying roller transports the PCB board to the second water pressure roller. When the water pressure roller opens, the PCB board is transported out of the immersion box by the conveying roller.

[0016] According to some embodiments of the present invention, a first water retaining cover is provided above the soaking mechanism, the first water retaining cover is a cover body with an opening at the bottom, the first water retaining cover is fixed to the frame, two first notches are provided at the lower portion of the first water retaining cover, the first notches are used to avoid empty conveying rollers and PCB boards, a first water collecting trough is provided on the bottom surface of the first water retaining cover, a first filter plate is provided inside the first water collecting trough, and the bottom of the water collecting trough is connected to the water tank. A second water retaining cover is provided above the wetting hole mechanism, the second water retaining cover is a cover body with an opening at the bottom, the second water retaining cover is fixed to the frame, two second notches are provided at the lower portion of the second water retaining cover, the second notches are used to avoid empty conveying rollers and PCB boards, a second water collecting trough is provided on the bottom surface of the second water retaining cover, a second filter plate is provided inside the second water collecting trough, and the bottom of the water collecting trough is connected to the water tank.

[0017] The benefit is that: by setting the first water retaining cover and the second water retaining cover, the splashing of water droplets during the soaking operation and the wetting operation can be reduced. At the same time, a water collecting tank is set to collect the wetting liquid used in the soaking operation and the wetting operation, and the wetting liquid is filtered through the first filter plate and the second filter plate, thereby reducing impurities inside the wetting liquid and preventing impurities from entering the PCB hole and forming a blockage.

[0018] According to some embodiments of the present invention, the first notch and the second notch are provided with water-blocking rollers, and the water-blocking rollers are arranged above the conveying rollers.

[0019] Advantageously, by providing the water retaining roller, the outflow of liquid from the first water retaining cover and the second water retaining cover can be reduced by blocking the first gap and the second gap.

[0020] According to some embodiments of the present invention, a temperature detector, a leakage detector and a liquid level detector are further provided inside the water tank.

[0021] Advantageously, by providing a temperature detector, a leakage detector and a liquid level detector, the user can understand the temperature and liquid level inside the water tank and whether there is leakage.

[0022] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which:

[0024] Figure 1 A front view of an embodiment of the present invention;

[0025] Figure 2 A top view of an embodiment of the present invention;

[0026] Figure 3 for Figure 1A side view of the soaking tank is shown.

[0027] Figure numerals: conveying mechanism 100, frame 110, water tank 120, conveying roller 130, lubricating liquid 140, immersion mechanism 150, immersion tank 160, infusion tube 170, first water pump 180, opening 190, lubricating mechanism 200, lubricating tube 210, lubricating nozzle 220, second water pump 230, lubricating main pipe 240, lubricating branch pipe 250, water pressure roller 260, first water retaining cover 270, first notch 280, first water collecting trough 290, second water retaining cover 300, second notch 310, second water collecting trough 320, water retaining roller 330, temperature detector 340, leakage detector 350, liquid level detector 360, first filter plate 370, second filter plate 380. DETAILED DESCRIPTION

[0028] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0029] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0030] In the description of the present invention, "several" means one or more, "many" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0031] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0032] Reference below Figure 1-Figure 3 A PCB hole wetting device is described in detail using a specific embodiment. It is worth noting that the following description is merely an illustrative example and does not specifically limit the invention.

[0033] like Figure 1 、 Figure 2 、 Figure 3 As shown, a PCB board hole wetting device includes a conveying mechanism 100, an immersion mechanism 150 and a hole wetting mechanism 200;

[0034] The conveying mechanism 100 is used to convey PCB boards and includes a frame 110, a water tank 120, and a plurality of conveying rollers 130. The plurality of conveying rollers 130 are horizontally arranged on the frame 110 in sequence. The water tank 120 is arranged at the bottom of the frame 110 and is used to accommodate the lubricating liquid 140.

[0035] The immersion mechanism 150 is used to immerse the PCB board and includes an immersion tank 160, a liquid infusion tube 170, and a first water pump 180. The immersion tank 160 is used to accommodate the lubricating liquid 140 and the PCB board. The immersion tank 160 is provided with two openings 190 along the conveying direction of the PCB board. The openings 190 can accommodate the conveying roller 130 and the PCB board. One end of the liquid infusion tube 170 is connected to the water tank 120, and the other end of the liquid infusion tube 170 is fixed above the immersion tank 160. The liquid infusion tube 170 is used to add the lubricating liquid 140 to the interior of the immersion tank 160. The first water pump 180 is connected to the liquid infusion tube 170 and is used to pump the lubricating liquid 140 into the liquid infusion tube 170.

[0036] The lubricating mechanism 200 is used to lubricate the holes of the PCB board, and includes a lubricating tube 210, a lubricating nozzle 220 and a second water pump 230. One end of the lubricating tube 210 is connected to the water tank 120, and the other end of the lubricating tube 210 is horizontally installed above the frame 110. The lubricating nozzle 220 is installed at the bottom of the lubricating tube 210 away from the water tank 120. The second water pump 230 is connected to the lubricating tube 210, and the second water pump 230 is used to pump the lubricating liquid 140 into the lubricating tube 210.

[0037] In some specific embodiments of the present invention, by setting gear connections between the various conveying rollers 130, the motor drives the conveying rollers 130 to rotate, thereby conveying the PCB board along the direction in which the conveying rollers 130 are arranged. By setting the immersion box 160, after the PCB board is conveyed to the inside of the immersion box 160 by the conveying rollers 130, the lubricating liquid 140 in the water tank 120 is added to the inside of the immersion box 160 by setting the first water pump 180 and the infusion tube 170 until the liquid level is higher than the PCB board, thereby soaking the PCB board so that the lubricating liquid 140 can initially penetrate into the holes of the PCB board. The soaked PCB board is conveyed to the lubricating mechanism 200 through the conveying rollers 130, and by setting the lubricating tube 210, the lubricating nozzle 220 and the second water pump 230, the lubricating liquid 140 in the water tank 120 is sprayed onto the PCB board by high-pressure water flow. Part of the high-pressure water flow can be sprayed into the inside of the hole of the PCB board, thereby moistening the hole wall of the PCB board before electroplating, so that the electroplating liquid can more easily penetrate into the inside of the hole.

[0038] Specifically, the lubricating pipe 210 includes a main lubricating pipe 240 and several branch lubricating pipes 250. One end of the main lubricating pipe 240 is connected to the water tank 120, and the other end of the main lubricating pipe 240 is connected to the branch lubricating pipes 250. The branch lubricating pipes 250 are horizontally arranged above the frame 110. The branch lubricating pipes 250 are equipped with several lubricating nozzles 220. The lubricating nozzles 220 are high-pressure nozzles that are used to spray the lubricating liquid 140 into the holes of the PCB board and wet the hole walls.

[0039] In some specific embodiments of the present invention, by arranging a number of wetting branches 250 horizontally, the wetting mechanism 200 can have a larger wetting range for the PCB board, and can spray for a longer time during the transportation of the PCB board. By setting the wetting nozzle 220 as a high-pressure nozzle, the wetting nozzle 220 can spray high-pressure water flow, which can break through the residual bubbles in the hole and moisten the hole wall at the same time.

[0040] In addition, two water rollers 260 are provided above and below the opening 190 . The water rollers 260 are closed to block the opening 190 and reduce the outflow of the lubricating liquid 140 . The water rollers 260 are opened to transport the PCB board into the immersion box 160 .

[0041] In some specific embodiments of the present invention, two water rollers 260 are arranged above and below the two openings 190. When the conveying roller 130 conveys the PCB board to the water roller 260, the water roller 260 opens and the PCB board can enter the immersion box 160. When the PCB board completely enters the immersion box 160, the water roller 260 closes, and then the infusion tube 170 starts to inject water into the immersion box 160 until the liquid level of the lubricating liquid 140 is higher than the PCB board. After the immersion is completed, the conveying roller 130 transports the PCB board to the second water roller 260. When the water roller 260 opens, the PCB board is transported to the outside of the immersion box 160 by the conveying roller 130.

[0042] Preferably, a first water retaining cover 270 is provided above the immersion mechanism 150. The first water retaining cover 270 is a cover body with a bottom opening 190. The first water retaining cover 270 is fixed on the frame 110. Two first notches 280 are provided at the lower part of the first water retaining cover 270. The first notches 280 are used to avoid the empty conveying roller 130 and the PCB board. A first water collecting trough 290 is provided on the bottom surface of the first water retaining cover 270. A first filter plate 370 is provided inside the first water collecting trough 290. The bottom of the water collecting trough is connected to the water tank 120. A second water retaining cover 300 is provided above the moistening hole mechanism 200. The second water retaining cover 300 is a cover body with a bottom opening 190. The second water retaining cover 300 is fixed on the frame 110. Two second notches 310 are provided at the lower part of the second water retaining cover 300. The second notches 310 are used to avoid the air conveying roller 130 and the PCB board. A second water collecting trough 320 is provided on the bottom surface of the second water retaining cover 300. A second filter plate 380 is provided inside the second water collecting trough 320. The bottom of the water collecting trough is connected to the water tank 120.

[0043] In some preferred embodiments of the present invention, by providing a first water retaining cover 270 and a second water retaining cover 300, the splashing of water droplets during the soaking operation and the wetting operation can be reduced. At the same time, a water collecting tank is provided to collect the wetting liquid 140 used in the soaking operation and the wetting operation, and the wetting liquid 140 is filtered through the first filter plate 370 and the second filter plate 380 to separate the impurities in the wetting liquid 140 to prevent the impurities from entering the PCB hole and forming a blockage.

[0044] According to some embodiments of the present invention, the first notch 280 and the second notch 310 are provided with water-blocking rollers 330 , and the water-blocking rollers 330 are provided above the conveying roller 130 .

[0045] Advantageously, by providing the water-blocking roller 330 , the outflow of liquid from the first water-blocking cover 270 and the second water-blocking cover 300 can be reduced by blocking the first notch 280 and the second notch 310 .

[0046] According to some embodiments of the present invention, a temperature detector 340 , a leakage detector 350 , and a liquid level detector 360 are further provided inside the water tank 120 .

[0047] Advantageously, by providing the temperature detector 340 , the leakage detector 350 and the liquid level detector 360 , the user can understand the temperature and liquid level inside the water tank 120 and whether there is leakage.

[0048] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the technical field without departing from the scope of the present invention.

Claims

1. A PCB board hole wetting device, characterized in that: include: A conveying mechanism (100) for conveying PCB boards, comprising a frame (110), a water tank (120), and a plurality of conveying rollers (130), wherein the plurality of conveying rollers (130) are sequentially and horizontally arranged on the frame (110), the water tank (120) is arranged at the bottom of the frame (110), the water tank (120) is used to accommodate a lubricating liquid (140), and a temperature detector (340), a leakage detector (350), and a liquid level detector (360) are further arranged inside the water tank (120); A soaking mechanism (150) for soaking a PCB board, comprising a soaking box (160), a liquid infusion tube (170) and a first water pump (180), wherein the soaking box (160) is used to accommodate the wetting liquid (140) and the PCB board, and the soaking box (160) is provided with two openings (190) along the conveying direction of the PCB board, wherein the openings (190) can accommodate the passage of the PCB board, one end of the liquid infusion tube (170) is connected to the water box (120), and the other end of the liquid infusion tube (170) is fixed above the soaking box (160), and the liquid infusion tube (170) is used to add the wetting liquid (140) to the inside of the soaking box (160), and the first water pump (180) is connected to the liquid infusion tube (170), and the first water pump (180) is used to pump the wetting liquid (140) into the liquid infusion tube (170); The hole wetting mechanism (200) is used to perform hole wetting operations on the holes of the PCB board, and comprises a hole wetting tube (210), a hole wetting nozzle (220) and a second water pump (230). One end of the hole wetting tube (210) is connected to the water tank (120), and the other end of the hole wetting tube (210) is horizontally installed above the frame (110). The hole wetting nozzle (220) is installed at the bottom of the hole wetting tube (210) away from the water tank (120). The second water pump (230) is connected to the hole wetting tube (210). The second water pump (230) is connected to the hole wetting tube (210). The pump (230) is used to pump the lubricating liquid (140) into the lubricating tube (210). The lubricating tube (210) includes a lubricating main tube (240) and a plurality of lubricating branch tubes (250). One end of the lubricating main tube (240) is connected to the water tank (120), and the other end of the lubricating main tube (240) is respectively connected to the plurality of lubricating branch tubes (250). The plurality of lubricating branch tubes (250) are horizontally arranged above the frame (110). The lubricating branch tubes (250) are equipped with a plurality of lubricating nozzles (220).

2. A PCB board hole wetting device according to claim 1, characterized in that: The wetting nozzle (220) is a high-pressure nozzle, and is used to spray the wetting liquid (140) into the hole of the PCB board and wet the hole wall.

3. A PCB board hole wetting device according to claim 1, characterized in that: Two water rollers (260) are provided above and below the opening (190); the water rollers (260) are closed to block the opening (190) and reduce the outflow of the lubricating liquid (140); and the water rollers (260) are opened to transport the PCB board into the immersion box (160).

4. A PCB board hole wetting device according to claim 1, characterized in that: A first water retaining cover (270) is provided above the soaking mechanism (150). The first water retaining cover (270) is a cover body with a bottom opening (190). The first water retaining cover (270) is fixed to the frame (110). Two first notches (280) are provided at the lower portion of the first water retaining cover (270). The first notches (280) are used to keep the conveying roller and the PCB board out of the air.

5. A PCB board hole wetting device according to claim 4, characterized in that: A first water collecting trough (290) is provided on the bottom surface of the first water retaining cover (270), a first filter plate (370) is provided inside the first water collecting trough (290), and the bottom of the water collecting trough is in communication with the water tank (120).

6. A PCB board hole wetting device according to claim 4, characterized in that: A second water retaining cover (300) is provided above the wetting mechanism (200); the second water retaining cover (300) is a cover body with a bottom opening (190); the second water retaining cover (300) is fixed to the frame (110); two second notches (310) are provided at the lower portion of the second water retaining cover (300); the second notches (310) are used to avoid the conveying roller (130) and the PCB board.

7. A PCB board hole wetting device according to claim 6, characterized in that: A second water collecting trough (320) is provided on the bottom surface of the second water retaining cover (300), a second filter plate (380) is provided inside the second water collecting trough (320), and the bottom of the water collecting trough is in communication with the water tank (120).

8. The PCB hole wetting device according to claim 6, characterized in that: The first notch (280) and the second notch (310) are provided with water-blocking rollers (330), and the water-blocking rollers (330) are arranged above the conveying roller (130).

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