Industrial Internet of Things Terminal

Abstract

The present invention relates to the technical field of Internet of Things devices, and discloses an industrial Internet of Things terminal. A casing (2) is circumferentially arranged with three support plates (3) with vertical surfaces. The outer surfaces of the support plates (3) are provided with receiving grooves (4). A mainboard (5) is fitted in the receiving grooves (4). An exhaust device (13) is provided between the casing (2) and the base (1) to blow air into the ventilation grooves (10). In the industrial Internet of Things terminal of the present invention, the three support plates (3) can enclose a triangular prism-shaped ventilation groove (10). The mainboard (5) is divided into three parts and respectively installed in the receiving grooves (4) of the three support plates (3), which can effectively reduce the space occupied by the mainboard (5). By means of the exhaust device (13) between the casing (2) and the base (1), air is blown into the ventilation grooves (10), which can simultaneously take away the heat conducted from the three mainboards (5) to the corresponding support plates (3), thereby reducing the temperature of the mainboard (5) during operation and effectively reducing the volume of the casing (2) and the space occupied by the mainboard (5).

Description

Technical Field

[0001] The present invention relates to the technical field of Internet of Things devices, and in particular to an industrial Internet of Things terminal. Background Art

[0002] The Industrial Internet of Things (IIoT) integrates various data acquisition and control sensors or controllers with sensing and monitoring capabilities, as well as mobile communications and intelligent analysis technologies, into every aspect of the industrial production process. This aims to significantly improve manufacturing efficiency, improve product quality, reduce product costs and resource consumption, and ultimately elevate traditional industries to a new stage of intelligence. For example, the utility model patent with publication number CN205958982U discloses a similar IIoT device. When operating under high load, the motherboard of such an IIoT device generates significant heat. To prevent motherboard failure, a cooling fan is typically installed within the chassis. A similar chassis is disclosed in utility model patent with publication number CN209400969U.

[0003] During use, the aforementioned chassis has multiple cooling fans arrayed on one side of the motherboard to cover the motherboard's heat-generating surface, ensuring efficient and uniform heat dissipation. However, this approach increases the chassis's size and space requirements. Furthermore, dust from the cooling fans easily adheres to the motherboard's surface, impairing heat dissipation and reducing its insulation, thus affecting its normal operation. Therefore, this approach requires further improvement. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the present invention provides an industrial Internet of Things terminal, which can reduce the volume of the chassis and the space it occupies, and reduce the impact of dust on the mainboard while ensuring the heat dissipation performance of the mainboard.

[0005] In order to solve the above technical problems, the present invention is solved by the following technical solutions:

[0006] The cam is secured to the upper and lower portions of the housing and has a cam face that is adapted to receive the camshafts and the support rails, and the cam face is secured to the upper and lower portions of the housing and is adapted to receive the camshafts and the support rails.

[0007] Using this solution, the three support plates can be arranged to form a triangular prism-shaped ventilation slot, dividing the mainboard into three pieces and installing them separately within the slots of the three support plates, effectively reducing the space occupied by the mainboard. By using the exhaust device between the housing and the base to blow air into the ventilation slots, the heat transferred from the three mainboards to the corresponding support plates can be simultaneously removed, thereby reducing the operating temperature of the mainboard and effectively reducing the size of the housing and its occupied space. By positioning the mainboard with the components facing inward and filling the slots with potting compound, the mainboard can be fixed and the side with higher heat generation can be directed towards the ventilation slots, further improving heat dissipation performance. The upper and lower sealing plates can effectively prevent dust from directly adsorbing onto the mainboard surface, preventing degradation of mainboard performance. A dustproof plate above the upper vent can effectively reduce the amount of dust entering the ventilation slot, and the ventilation gap between the dustproof plate and the upper vent allows air circulation within the ventilation slot.

[0008] Preferably, heat dissipation slots are provided at positions of the casing corresponding to the support plates, and each group of heat dissipation slots is provided with a plurality of heat dissipation slots. The plurality of heat dissipation slots are arranged along the axial direction of the casing and each heat dissipation slot is arranged to be tilted downward.

[0009] With this solution, the heat sink on the lower side of the motherboard can dissipate heat, further improving the device's heat dissipation performance. By tilting the sink downward, dust can be effectively prevented from entering the enclosed space between the support plate and the chassis, further enhancing the device's dust resistance.

[0010] Preferably, three ventilation intervals are provided and correspond to three groups of heat dissipation slots one by one. A bottom plate is extended from the bottom edge of the ventilation interval toward the heat dissipation slot, and the bottom plate exceeds the outer circumference of the casing. Both side edges of the ventilation interval are extended outward with enclosures toward the corresponding heat dissipation slots. The lower edge of the enclosure is connected to the two side edges of the bottom plate, and a baffle is connected between the ends of the two enclosures away from the ventilation interval. The part of the bottom plate that exceeds the outer circumference of the casing is provided with dust removal holes toward the heat dissipation slots; a cover plate is provided above the bottom plate, and the cover plate covers the space formed by the baffle plate and the two enclosures; the upper plate surface of the dustproof plate is provided with a driving mechanism connected to the cover plate to drive the cover plate to perform reciprocating linear motion in the vertical direction.

[0011] With this solution, when the drive mechanism drives the cover plate upward, the ventilation gap is open. This allows the motherboard inside the case to passively dissipate heat without the exhaust system in operation, reducing energy consumption. When the exhaust system is in operation, the drive mechanism pushes the cover plate downward to seal the space formed by the baffle and the two enclosures. Airflow from the ventilation gap is then expelled exclusively through the dust removal holes, sweeping the surface of the heat sink, thereby removing any dust adhering to the surface and ensuring a cleaner and more hygienic case surface.

[0012] Preferably, a guide sleeve is provided on the side of the cover plate, and a guide rod which slides through the guide sleeve is vertically provided on the upper plate surface of the dustproof plate.

[0013] By adopting the above solution, the sliding cooperation between the guide sleeve and the guide rod can effectively improve the stability and smoothness of the cover when it is raised and lowered.

[0014] Preferably, the driving mechanism includes a bracket connected to the cover plate and a micro cylinder mounted on the dustproof plate, and a push rod of the cylinder is fixed to the bracket.

[0015] By adopting the above solution, the micro cylinder has a simple structure, is easy to install, has low maintenance cost, and can effectively and stably drive the cover plate to perform reciprocating linear motion.

[0016] Preferably, a temperature sensor is provided on the lower surface of the dustproof plate, a control module is coupled to the temperature sensor, a solenoid valve is coupled to the control module, the exhaust device is coupled to and controlled by the control module, the cylinder is connected to and controlled by the solenoid valve, and a temperature threshold is preset in the control module; the temperature sensor is used to monitor the actual temperature value in the ventilation slot and send the measured actual temperature value to the control module, and the control module is used to compare the actual temperature value with the temperature threshold;

[0017] If the actual temperature value is lower than the temperature threshold, the control module controls the exhaust device to stop running, and at the same time controls the cylinder through the solenoid valve to push the push rod upward to make the cover rise;

[0018] On the contrary, if the actual temperature value is higher than or equal to the temperature threshold, the control module controls the exhaust device to operate, and at the same time controls the cylinder through the solenoid valve to pull the push rod downward, so that the cover plate drops and closes the space formed by the enclosure and baffle.

[0019] With this solution, the control module can shut down the exhaust system when the temperature inside the housing is low, and control the cylinder via the solenoid valve to push the cover upward, enabling passive heat dissipation, thereby reducing heat dissipation energy consumption. Conversely, when the temperature inside the housing is high, the control module can activate the exhaust system and control the cylinder via the solenoid valve to pull the cover back, enabling active heat dissipation. Meanwhile, the dust removal holes can sweep dust from the surface of the heat sink, improving heat dissipation performance while keeping the device's exterior clean and tidy, making it more user-friendly.

[0020] Preferably, a plurality of cooling fins coupled to the control module are arranged longitudinally on the inner surface of the support plate;

[0021] If the actual temperature value is lower than the temperature threshold, the control module controls the refrigeration plate to stop running;

[0022] On the contrary, if the actual temperature value is higher than or equal to the temperature threshold, the control module controls the refrigeration unit to operate.

[0023] By adopting the above solution, when the equipment is actively cooling, the airflow passing through the ventilation slots can be cooled by the cooling fins, so that the temperature of the airflow blowing on the surface of the heat sink is lower, thereby avoiding affecting the heat dissipation capacity of the heat sink.

[0024] Preferably, sliding bars are provided on both side edges of the support plate, and sliding grooves for sliding engagement of the sliding bars are provided along the axial direction of the inner peripheral surface of the housing.

[0025] With the above solution, the sliding engagement between the sliding bar and the sliding groove can effectively realize the detachable connection between the support plate and the casing, making it easy to remove and replace the mainboard, while ensuring the stability of the support plate after installation.

[0026] Preferably, the exhaust device includes a ventilation sleeve arranged between the lower cover plate and the base and a fan arranged in the ventilation sleeve. The ventilation sleeve is connected to the ventilation slot through the lower vent. The fan is fixed to the lower cover plate and maintained at a distance from the base. The side wall of the ventilation sleeve is provided with a number of air inlet slots around the bottom of the fan.

[0027] By adopting the above solution, the exhaust device can efficiently supply air to the ventilation slots, thereby improving the heat dissipation performance of the equipment.

[0028] Preferably, a plurality of support columns are provided on the upper end surface of the base, and the plurality of support columns are circumferentially arranged along the inner circumferential surface of the ventilation sleeve, and the upper ends of the support columns abut against the lower plane of the fan.

[0029] By adopting the above solution, multiple support columns can form multiple support points under the fan to improve the stability of the fan during operation.

[0030] By adopting the above technical solutions, the present invention has significant technical effects: the three support plates can enclose a triangular prism-shaped ventilation slot, dividing the mainboard into three parts and installing them separately in the receiving slots of the three support plates, effectively reducing the space occupied by the mainboard. The exhaust device between the housing and the base blows air into the ventilation slot, simultaneously removing heat transferred from the three mainboards to the corresponding support plates, thereby reducing the operating temperature of the mainboard and effectively reducing the size and space occupied by the housing. By arranging the mainboard with the components facing inward and filling the receiving slots with potting compound, the mainboard is secured and the heat-generating side of the mainboard faces the ventilation slot, further improving heat dissipation performance. The upper and lower sealing plates effectively prevent dust from directly adsorbing on the mainboard surface, preventing degradation of mainboard performance. The dustproof plate above the upper vent effectively reduces the amount of dust entering the ventilation slot, and the ventilation gap between the dustproof plate and the upper vent allows air circulation within the ventilation slot. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a schematic diagram of the structure of this embodiment Figure 1 ;

[0032] Figure 2 This is a schematic diagram of the structure of this embodiment Figure 2 ;

[0033] Figure 3 The explosion of this embodiment Figure 1 ;

[0034] Figure 4 for Figure 3 An enlarged schematic diagram of section A is shown;

[0035] Figure 5 The explosion of this embodiment Figure 2 ;

[0036] Figure 6 This is a schematic diagram of the structure of this embodiment Figure 3 ;

[0037] Figure 7 The explosion of this embodiment Figure 3 ;

[0038] Figure 8 This is a schematic diagram of the structure of this embodiment Figure 4 ;

[0039] Figure 9 This is a schematic diagram of the structure of this embodiment Figure 5 ;

[0040] Figure 10 for Figure 7 An enlarged schematic diagram of portion B is shown;

[0041] Figure 11 This is a system architecture diagram of this embodiment.

[0042] The names of the parts indicated by the numerical labels in the above drawings are as follows: 1. Base; 2. Casing; 3. Support plate; 4. Receiving groove; 5. Main board; 6. Components; 8. Upper cover plate; 9. Lower cover plate; 10. Ventilation slot; 11. Upper vent; 12. Lower vent; 13. Exhaust device; 14. Dustproof plate; 15. Ventilation partition; 16. Heat dissipation slot; 17. Bottom plate; 18. Enclosure; 19. Partition plate; 20. Dust removal hole; 21. Cover plate; 22. Guide sleeve; 23. Guide rod; 24. Bracket; 25. Cylinder; 26. Push rod; 27. Temperature sensor; 28. Control module; 29. ​​Solenoid valve; 30. Refrigeration plate; 31. Sliding bar; 32. Sliding groove; 33. Ventilation sleeve; 34. Fan; 35. Air inlet slot; 36. Support column; 37. Screw; 38. Support ear; 39. Bolt. DETAILED DESCRIPTION

[0043] The present invention is further described in detail below with reference to the accompanying drawings and embodiments.

[0044] like Figures 1 to 7 As shown, an industrial Internet of Things terminal disclosed in this embodiment includes a base 1, and a cylindrical housing 2 is vertically arranged above the base 1. The housing 2 is preferably made of aluminum alloy, so it has better structural strength and heat dissipation performance. Three support plates 3 with vertical surfaces are arranged in the inner circumference of the housing 2. The surface of each support plate 3 is perpendicular to the radial direction of the housing 2, and the two side edges of the support plate 3 are detachably connected to the inner circumference of the housing 2. In this embodiment, the two side edges of the support plate 3 are provided with sliding bars 31, and the inner circumference of the housing 2 is provided with sliding grooves 32 along its axial direction for the sliding bars 31 to slide and engage. The outer plate surface of the support plate 3 is provided with a receiving groove 4, and the receiving groove 4 is fitted with a main board 5. The main board 5 has a plate surface with components 6 facing inward and the receiving groove 4 is filled with potting glue. The potting glue is preferably a high thermal conductivity epoxy resin. The upper and lower ports of the casing 2 are respectively covered with an upper sealing plate 8 and a lower sealing plate 9, wherein the upper sealing plate 8 is fixed to the upper port of the casing 2 by screws 37, so as to facilitate the disassembly and assembly of the support plate 3. The lower sealing plate 9 is welded to the lower port of the casing 2. The space formed by the three support plates 3 is defined as a ventilation slot 10. The upper sealing plate 8 and the lower sealing plate 9 are respectively provided with an upper vent 11 and a lower vent 12 connected to the ventilation slot 10. An exhaust device 13 is provided between the casing 2 and the base 1 to blow air into the ventilation slot 10. In this embodiment, the exhaust device 13 includes a ventilation sleeve 33 provided between the lower sealing plate 9 and the base 1 and a fan 34 provided in the ventilation sleeve 33. The ventilation sleeve 33 is connected to the ventilation slot 10 through the lower vent 12. The four corners of the fan 34 are fixed to the lower sealing plate 9 by screws (not shown) and are spaced apart from the base 1. The side wall of the ventilation sleeve 33 is provided with a plurality of air inlet slots 35 around and below the fan 34. In order to improve the stability of the fan 34 during operation, a plurality of support columns 36 are provided on the upper end surface of the base 1. The plurality of support columns 36 are arranged circumferentially along the inner circumference of the ventilation sleeve 33, and the upper ends of the support columns 36 abut against the lower plane of the fan 34.

[0045] like Figure 7 As shown, the lower end surface of the ventilation sleeve 33 abuts against the upper end surface of the base 1, and the outer peripheral surface of the ventilation sleeve 33 is provided with a plurality of support ears 38 at its lower end. The support ears 38 are fixed to the base 1 by bolts 39, thereby realizing a detachable connection between the base 1 and the ventilation sleeve 33, which is convenient for users to replace or maintain the fan 34.

[0046] like Figure 8 As shown, in order to reduce the amount of dust entering the ventilation slot 10, a dustproof plate 14 is installed above the upper ventilation port 11, and a ventilation gap 15 is maintained between the lower plate surface of the dustproof plate 14 and the opening of the upper ventilation port 11 to achieve air circulation in the ventilation slot 10.

[0047] like Figure 6As shown, in order to further improve the heat dissipation performance of the motherboard 5, the casing 2 is provided with heat dissipation slots 16 at positions corresponding to the support plate 3. Each group of heat dissipation slots 16 is provided with multiple heat dissipation slots 16. The multiple heat dissipation slots 16 are arranged along the axial direction of the casing 2 and each heat dissipation slot 16 is arranged to be tilted downward.

[0048] like Figure 8 、 Figure 9 and Figure 10 As shown, in order to reduce heat dissipation energy consumption and realize the purging function on the surface of the heat dissipation groove 16, the ventilation interval 15 is provided with three and one-to-one corresponding to the three groups of heat dissipation grooves 16, the bottom edge of the ventilation interval 15 extends toward the direction close to the heat dissipation groove 16 with a bottom plate 17, the bottom plate 17 exceeds the outer peripheral surface of the casing 2, and the two side edges of the ventilation interval 15 extend outward with a surrounding plate 18 facing the corresponding heat dissipation groove 16, the lower edge of the surrounding plate 18 is connected to the two side edges of the bottom plate 17, and a baffle 19 is connected between the ends of the two surrounding plates 18 away from the ventilation interval 15. The part of the bottom plate 17 that exceeds the outer peripheral surface of the casing 2 is provided with a dust removal hole 20 facing the heat dissipation groove 16; a cover plate 21 is provided above the bottom plate 17, and the cover plate 21 covers the space formed by the baffle 19 and the two surrounding plates 18; the upper plate surface of the dustproof plate 14 is provided with a driving mechanism connected to the cover plate 21 to drive the cover plate 21 to perform reciprocating linear motion in the vertical direction. In this embodiment, the driving mechanism includes a bracket 24 connected to the cover plate 21 and a micro cylinder 25 installed on the dustproof plate 14 . The push rod 26 of the cylinder 25 is fixed to the bracket 24 .

[0049] like Figure 8 As shown, in order to improve the stability and smoothness of the cover plate 21 during the lifting process, a guide sleeve 22 is provided on the side of the cover plate 21, and a guide rod 23 that slides through the guide sleeve 22 is vertically provided on the upper plate surface of the dustproof plate 14.

[0050] like Figure 9 and Figure 11 As shown, in order to further reduce heat dissipation energy consumption and realize the purge function of the surface of the heat dissipation slot 16, a temperature sensor 27 is provided on the lower plate surface of the dustproof plate 14. A control module 28 is coupled to the temperature sensor 27. The control module 28 is preferably a single-chip microcomputer. A solenoid valve 29 is coupled to the control module 28. The fan 34 is coupled to and controlled by the control module 28. The cylinder 25 is connected to and controlled by the solenoid valve 29. A temperature threshold is preset in the control module 28. The temperature sensor 27 is used to monitor the actual temperature value in the ventilation slot 10 and send the measured actual temperature value to the control module 28. The control module 28 is used to compare the actual temperature value with the temperature threshold.

[0051] If the actual temperature value is lower than the temperature threshold, indicating that the operating temperature within housing 2 is low, control module 28 controls fan 34 to stop operating to reduce energy consumption. Simultaneously, control module 28 controls cylinder 25 via solenoid valve 29 to push push rod 26 upward, raising cover 21 and exposing ventilation gap 15. This allows motherboard 5 within housing 2 to passively dissipate heat via ventilation slots 10, ventilation gap 15, and heat sink 16.

[0052] Conversely, if the actual temperature value is higher than or equal to the temperature threshold, it indicates that the equipment is operating at a high load, resulting in a high operating temperature of the mainboard 5 in the housing 2. At this point, the control module 28 activates the fan 34 and simultaneously controls the cylinder 25 through the solenoid valve 29 to pull the push rod 26 downward, causing the cover 21 to descend and seal the space formed by the enclosure 18 and the baffle 19. In this state, the airflow from the ventilation compartment 15 can only be discharged downward through the dust removal hole 20 to remove dust from the surface of the heat sink 16.

[0053] like Figure 5 and Figure 11 As shown, to avoid affecting the heat dissipation capacity of the heat sink 16 during active cooling, the inner surface of the support plate 3 is longitudinally arranged with a plurality of cooling fins 30 coupled to a control module 28. If the actual temperature value is lower than a temperature threshold, the control module 28 controls the cooling fins 30 to stop operating; conversely, if the actual temperature value is higher than or equal to the temperature threshold, the control module 28 controls the cooling fins 30 to operate.

[0054] The specific working process is as follows:

[0055] When the device is operating at low load, the heat generated by mainboard 5 is low, resulting in a lower temperature inside housing 2. At this point, the actual temperature measured by temperature sensor 27 is below the temperature threshold. Control module 28 activates fan 34 and, through solenoid valve 29, controls push rod 26 of cylinder 25 to move upward, driving cover 21 to raise and open ventilation gap 15. Simultaneously, cooling fins 30 are deactivated. In this state, housing 2 can passively dissipate heat via ventilation slots 10, ventilation gap 15, and heat sink 16.

[0056] When the device is operating at high load, the mainboard 5 generates a high amount of heat, causing the temperature inside the housing 2 to rise. At this point, the actual temperature measured by the temperature sensor 27 is higher than or equal to the temperature threshold. The control module 28 can control the operation of the fan 34 and, through the solenoid valve 29, control the push rod 26 of the cylinder 25 to pull down, thereby driving the cover 21 downward and closing the space formed by the baffle 19 and the two enclosures 18. Simultaneously, the control module 28 controls the operation of the cooling fins 30. In this state, the housing 2 can actively dissipate heat. The fan 34 draws air through the air inlet slots 35 below the ventilation sleeve 33 and blows it into the ventilation slots 10. The airflow passing through the ventilation slots 10 can simultaneously remove the heat transferred from the three mainboards 5 to the three support plates 3, thereby reducing the temperature of the mainboards 5. At the same time, under the cooling effect of the cooling fins 30, the temperature inside the ventilation slots 10 decreases. The cooled air flow is blown to the dustproof plate 14 and discharged through the three ventilation gaps 15. Since the cover plate 21 is in the covered state, the low-temperature air flow blown out from the ventilation gap 15 can only be discharged downward through the dust removal holes 20 to blow away the dust adsorbed on the surface of the heat dissipation groove 16, thereby making the surface of the casing 2 cleaner and tidier.

Claims

1. An industrial Internet of Things terminal, characterized by: The invention comprises a base (1), a cylindrical housing (2) is vertically arranged above the base (1), three support plates (3) with vertical surfaces are arranged in the inner circumference of the housing (2), the surface of each support plate (3) is perpendicular to the radial direction of the housing (2), and the two side edges of the support plate (3) are detachably connected to the inner circumference of the housing (2); a receiving groove (4) is provided on the outer surface of the support plate (3), a main board (5) is fitted in the receiving groove (4), and the main board (5) has a plate of components (6) The housing (4) is arranged facing inward and filled with potting glue; the upper and lower ports of the housing (2) are respectively covered with an upper sealing plate (8) and a lower sealing plate (9); the space formed by the three support plates (3) is defined as a ventilation slot (10); the upper sealing plate (8) and the lower sealing plate (9) are respectively provided with an upper ventilation port (11) and a lower ventilation port (12) connected to the ventilation slot (10); an exhaust device (13) is provided between the housing (2) and the base (1) to blow air to the ventilation slot (10); A dustproof plate (14) is mounted above the upper vent (11), and a ventilation gap (15) is maintained between the lower plate surface of the dustproof plate (14) and the opening of the upper vent (11); The housing (2) is provided with heat dissipation slots (16) at positions corresponding to the support plate (3), and each group of heat dissipation slots (16) is provided with a plurality of heat dissipation slots (16). The plurality of heat dissipation slots (16) are arranged along the axial direction of the housing (2), and each heat dissipation slot (16) is arranged to be inclined downward. The ventilation space (15) is provided with three heat dissipation slots (16) corresponding to each other. A bottom plate (17) is extended from the bottom edge of the ventilation space (15) toward the heat dissipation slots (16). The bottom plate (17) exceeds the outer peripheral surface of the housing (2). Both side edges of the ventilation space (15) are extended outwardly with a surrounding plate (18) facing the corresponding heat dissipation slots (16). The lower edge of the surrounding plate (18) is connected to the two side edges of the bottom plate (17). The two surrounding plates (18) are away from the ventilation space (15). A baffle plate (19) is connected between the ends of the housing (2); a dust removal hole (20) facing the heat dissipation groove (16) is opened on the portion of the bottom plate (17) that exceeds the outer peripheral surface of the housing (2); a cover plate (21) is provided above the bottom plate (17), and the cover plate (21) covers the space formed by the baffle plate (19) and the two enclosure plates (18); and a driving mechanism connected to the cover plate (21) is provided on the upper plate surface of the dustproof plate (14) to drive the cover plate (21) to perform reciprocating linear motion in the vertical direction.

2. The industrial Internet of Things terminal according to claim 1, characterized in that: A guide sleeve (22) is provided on the side of the cover plate (21), and a guide rod (23) which is slidably penetrated through the guide sleeve (22) is vertically provided on the upper plate surface of the dustproof plate (14).

3. The industrial Internet of Things terminal according to claim 1, characterized in that: The driving mechanism comprises a bracket (24) connected to the cover plate (21) and a micro cylinder (25) mounted on the dustproof plate (14); a push rod (26) of the cylinder (25) is fixed to the bracket (24).

4. The industrial Internet of Things terminal according to claim 3, characterized in that: A temperature sensor (27) is provided on the lower surface of the dustproof plate (14), a control module (28) is coupled to the temperature sensor (27), a solenoid valve (29) is coupled to the control module (28), the exhaust device (13) is coupled to and controlled by the control module (28), the cylinder (25) is connected to and controlled by the solenoid valve (29), and a temperature threshold is preset in the control module (28); the temperature sensor (27) is used to monitor the actual temperature value in the ventilation slot (10) and send the measured actual temperature value to the control module (28), and the control module (28) is used to compare the actual temperature value with the temperature threshold; If the actual temperature value is lower than the temperature threshold, the control module (28) controls the exhaust device (13) to stop running, and at the same time controls the cylinder (25) through the solenoid valve (29) to push the push rod (26) upward to make the cover plate (21) rise; On the contrary, if the actual temperature value is higher than or equal to the temperature threshold, the control module (28) controls the exhaust device (13) to operate, and at the same time controls the cylinder (25) through the solenoid valve (29) to pull the push rod (26) downward, so that the cover plate (21) descends and closes the space formed by the enclosure (18) and the baffle (19).

5. The industrial Internet of Things terminal according to claim 4, characterized in that: A plurality of cooling fins (30) coupled to the control module (28) are arranged longitudinally on the inner surface of the support plate (3); If the actual temperature value is lower than the temperature threshold, the control module (28) controls the refrigeration plate (30) to stop operating; On the contrary, if the actual temperature value is higher than or equal to the temperature threshold, the control module (28) controls the refrigeration plate (30) to operate.

6. The industrial Internet of Things terminal according to any one of claims 1 to 5, characterized in that: Sliding strips (31) are provided on both side edges of the support plate (3), and a sliding groove (32) for sliding engagement of the sliding strips (31) is provided along the inner peripheral surface of the housing (2) along its axial direction.

7. The industrial Internet of Things terminal according to any one of claims 1 to 5, characterized in that: The exhaust device (13) comprises a ventilation sleeve (33) arranged between the lower sealing plate (9) and the base (1) and a fan (34) arranged in the ventilation sleeve (33). The ventilation sleeve (33) is connected to the ventilation slot (10) through the lower ventilation port (12). The fan (34) is fixed to the lower sealing plate (9) and is spaced apart from the base (1). A plurality of air inlet slots (35) are formed on the side wall of the ventilation sleeve (33) and around the bottom of the fan (34).

8. The industrial Internet of Things terminal according to claim 7, characterized in that: The upper end surface of the base (1) is provided with a plurality of support columns (36), which are arranged circumferentially along the inner circumference of the ventilation sleeve (33), and the upper ends of the support columns (36) abut against the lower plane of the fan (34).

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