Method, device, equipment and storage medium for determining panel information

Abstract

The present application discloses a method, device, equipment and storage medium for determining board surface information, the method comprising: obtaining the first height information between the laser cutting head and the board surface to be processed, which is collected by the height adjustment box based on its response characteristics; processing the height information of the encoder according to a preset compensation function to obtain the second height information, wherein the compensation function is determined according to the response characteristics of the height adjustment box; determining the board surface information of the board surface to be processed according to the first height information and the second height information, so that the laser cutting head can cut based on the board surface information. The compensation function of the encoder is obtained by an offline identification method, so that the encoder is consistent with the response characteristics of the height adjustment box through the compensation function, so as to achieve more accurate board surface position and board surface speed in the dynamic process of laser processing, and solve the problem of inaccurate board surface processing information caused by large height deviation obtained by the existing height adjustment box.

Description

Technical Field

[0001] The present application relates to the field of metal laser processing, and in particular to a method, device, equipment and storage medium for determining plate surface information. Background Art

[0002] During metal laser processing with a cutting head height sensor, the control system needs to obtain the height sensor signal to control the height of the cutting head. The height sensor information is obtained from the height adjustment box (also called the height adjustment box), where the height adjustment box is used to collect and process the height signal. Generally, the control goal in this scenario is to make the height value returned by the height sensor consistent with the command height set by the user as much as possible. This control method is called follow-up control or height adjustment control, and the axis involved in the follow-up control is called the follow-up axis.

[0003] However, during the process of height signal acquisition by the height adjustment box, its capacitive sensor has the characteristic of easily generating a large number of noise points. Therefore, existing height adjustment box manufacturers will add specific filtering and other processing methods to reduce the noise of the height signal. However, this filtering processing method will cause the sensor signal to be distorted to a certain extent, and the distortion mainly occurs during the movement of the cutting head. That is, when the cutting head accelerates or decelerates, the height value obtained by the system deviates from the actual height value due to the filtering effect. As a result, the accuracy of the position or speed information of the plate surface (metal surface to be laser processed) determined by the height adjustment box is low, and the follower axis is prone to jitter during processing, which affects the follow-up control effect. Summary of the invention

[0004] In view of this, the embodiments of the present application provide a method, device, equipment and storage medium for determining panel surface information, aiming to solve the technical problem that the existing panel surface processing information is inaccurate, resulting in jitter and other problems during follow-up axis processing, thus affecting the follow-up control effect.

[0005] The present application provides a method for determining panel information, the method comprising:

[0006] Acquire first height information between the laser cutting head and the plate surface to be processed, which is collected by the height adjustment box based on its response characteristics;

[0007] Processing the height information of the encoder according to a preset compensation function to obtain second height information, wherein the compensation function is determined according to the response characteristics of the height adjustment box;

[0008] The board surface information of the board surface to be processed is determined according to the first height information and the second height information, so that the laser cutting head can perform cutting based on the board surface information.

[0009] In a possible implementation manner of the present application, before processing the height information of the encoder according to a preset compensation function, the method includes:

[0010] Get the initial function;

[0011] According to the response characteristics of the height adjustment box, the initial function is identified by using an off-line identification technology to obtain a compensation function.

[0012] In a possible implementation manner of the present application, the initial function is identified by using an offline identification technology according to the response characteristics of the height adjustment box to obtain a compensation function, including:

[0013] Acquire motion information of the follower shaft when performing excitation motion based on the motion signal, wherein the motion information includes a third height information set collected by the encoder and a fourth height information set collected by the height adjustment box, wherein the follower shaft is used to control the motion of the laser cutting head;

[0014] Based on the motion information, an initial value set of response coefficients of the initial function is calculated by using a phase delay method;

[0015] Using the least square method, based on the initial value set of the response coefficient and the preset board surface velocity function, the target coefficient of the initial function is solved;

[0016] The target coefficient is input into the initial function to obtain the compensation function.

[0017] In a possible implementation manner of the present application, the follower shaft performs an excitation motion based on a motion frequency in a motion signal, and the acquiring motion information of the follower shaft when performing the excitation motion based on the motion signal includes:

[0018] Acquire the motion frequency of the follower axis when it performs excitation motion based on the motion signal;

[0019] The motion information is acquired in real time based on the motion frequency and a collection period for collecting the motion information.

[0020] In a possible implementation manner of the present application, the follower axis performs an excitation motion based on a motion frequency in a motion signal, and the initial value set of the response coefficient of the initial function is calculated based on the motion information by a phase delay method, including:

[0021] Calculating a phase difference between the height information in the third height information set and the height information in the fourth height information set;

[0022] Determining a delay time of the height adjustment box based on the movement frequency and the phase difference;

[0023] Determine the number of delay cycles of the height adjustment box according to the delay time and the collection period of the motion information;

[0024] Based on the number of cycles, the initial value set of the response coefficients is determined.

[0025] In a possible implementation manner of the present application, the least square method is used to solve the target coefficient set of the initial function based on the initial value set of the response coefficient and the preset board speed function, including:

[0026] Constructing a board speed function based on the initial function;

[0027] Based on the initial value set of response coefficients and the least square method, a target coefficient set that minimizes the surface velocity function is determined.

[0028] In a possible implementation manner of the present application, the board surface information includes target height information and speed information, and determining the board surface information of the board surface to be processed according to the first height information and the second height information includes:

[0029] Determining target height information of the panel surface to be processed based on the first height information and the second height information;

[0030] The target height information is differentiated based on a differential function to obtain speed information of the to-be-processed panel surface.

[0031] The present application also provides a device for determining board surface information, the device comprising:

[0032] An information acquisition module, used to acquire first height information between the laser cutting head and the plate surface to be processed, which is collected by the height adjustment box based on its response characteristics;

[0033] an accuracy compensation module, used for processing the height information of the encoder according to a preset compensation function to obtain second height information, wherein the compensation function is determined according to the response characteristics of the height adjustment box;

[0034] The information determination module is used to determine the board surface information of the board surface to be processed according to the first height information and the second height information, so that the laser cutting head can perform cutting based on the board surface information.

[0035] The present application also provides a panel information determination device, which is a physical node device. The panel information determination device includes: a memory, a processor, and a program of the panel information determination method stored in the memory and executable on the processor. When the program of the panel information determination method is executed by the processor, the steps of the panel information determination method as described above can be implemented.

[0036] To achieve the above-mentioned purpose, a computer-readable storage medium is also provided, on which a board information determination program is stored. When the board information determination program is executed by a processor, the steps of any of the above-mentioned board information determination methods are implemented.

[0037] The present application provides a method, device, equipment and storage medium for determining board surface information, which obtains first height information between a laser cutting head and a board surface to be processed, which is collected by a height adjustment box based on its response characteristics; processes the height information of the encoder according to a preset compensation function to obtain second height information, wherein the compensation function is determined according to the response characteristics of the height adjustment box; and determines the board surface information of the board surface to be processed according to the first height information and the second height information, so that the laser cutting head can perform cutting based on the board surface information. Through the offline identification method, the compensation function of the encoder is obtained, so that the response characteristics of the encoder and the height adjustment box are consistent after the compensation function, so that the board position (target height information) and the board speed in the dynamic process of laser processing are more accurate, and the problem of inaccurate board processing information caused by the large height deviation obtained by the existing height adjustment box is solved (in the process of height signal acquisition, the capacitive sensor of the height adjustment box has the characteristic of easily generating a large number of noise points, so the existing height adjustment box manufacturers will add specific filtering and other means to reduce the noise of the height signal. However, this filtering processing method will distort the sensor signal to a certain extent, resulting in a deviation between the height value obtained by the system and the actual height value, resulting in inaccurate board processing information). That is, the first height information between the laser cutting head and the board to be processed collected by the height box based on its response characteristics is obtained, and the response characteristics of the encoder and the height adjustment box height output are used on the encoder, and the height information of the encoder is processed according to the preset compensation function to obtain the second height information, so that the response characteristics of the encoder after this compensation function are consistent with the response characteristics of the height adjustment box, and the accuracy of the height adjustment box is compensated. Therefore, according to the first height information and the second height information, the target height information and the speed information of the plate surface to be processed are determined more accurately, so that the follow-up control effect is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 This is a flow chart of the first embodiment of the method for determining panel information of the present application;

[0039] Figure 2 This is a control block diagram of the precision compensation in the second embodiment of the method for determining the panel information of the present application;

[0040] Figure 3 The effect diagram of the accuracy compensation and the uncompensated one in the third embodiment of the method for determining the board surface information of the present application;

[0041] Figure 4 A schematic diagram of the device structure of the hardware operating environment involved in the embodiment of the present application;

[0042] Figure 5 This is a schematic diagram of the functional modules of a preferred embodiment of the board information determination device of the present application. DETAILED DESCRIPTION

[0043] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0044] The present application embodiment provides a method for determining board surface information. In one embodiment of the method for determining board surface information of the present application, the method is applied to a board surface information determining device. Figure 1 , the method comprising:

[0045] Step S10, obtaining first height information between the laser cutting head and the board to be processed, which is collected by the height adjustment box based on its response characteristics;

[0046] Step S20, processing the height information of the encoder according to a preset compensation function to obtain second height information, wherein the compensation function is determined according to the response characteristics of the height adjustment box;

[0047] Step S30, determining the board surface information of the board surface to be processed according to the first height information and the second height information, so that the laser cutting head can perform cutting based on the board surface information.

[0048] The purpose of this embodiment is to: identify the response characteristics of the encoder and the height output of the height adjustment box, utilize the response characteristics on the encoder, thereby compensating for the accuracy of the board surface information obtained by the height adjustment box and the encoder, obtain accurate board surface processing information, and improve the follow-up control effect of the follow-up axis during laser processing.

[0049] Specifically, in the present application, the compensation function of the encoder is obtained by an offline identification method, so that the response characteristics of the encoder after the compensation function are consistent with the response characteristics of the height adjustment box, so that the board position (target height information) and the board speed in the dynamic process of laser processing are more accurate, and the problem of inaccurate board processing information caused by the large height deviation obtained by the existing height adjustment box is solved (in the process of height signal acquisition, the capacitive sensor of the height adjustment box has the characteristic of easily generating a large number of noise points, so the existing height adjustment box manufacturers will add specific filtering and other means to reduce the noise of the height signal. However, this filtering processing method will distort the sensor signal to a certain extent, resulting in a deviation between the height value obtained by the system and the actual height value, resulting in inaccurate board processing information). In the present application, the first height information between the laser cutting head and the board to be processed collected by the height adjustment box based on its response characteristics is obtained, and the height information of the encoder is processed according to the preset compensation function to obtain the second height information, so that the response characteristics of the encoder after this compensation function are consistent with the response characteristics of the height adjustment box, and the accuracy of the height adjustment box is compensated. Therefore, according to the first height information and the second height information, the target height information and the speed information of the plate surface to be processed are determined more accurately, so that the follow-up control effect is better.

[0050] In this embodiment, the specific application scenarios are:

[0051] During metal laser processing with a cutting head height sensor, the control system needs to obtain the signal of the height sensor to control the height of the cutting head. The height sensor information is obtained from the height adjustment box (also called the height adjustment box). Generally, the control goal in this scenario is to make the height value returned by the height sensor consistent with the command height set by the user as much as possible. This control method is called follow-up control or height adjustment control, and the axis involved in follow-up control is called a follow-up axis.

[0052] However, when the height adjustment box is collecting height signals, its capacitive sensor has the characteristic of easily generating a large number of noise points. Therefore, existing height adjustment box manufacturers will add specific filtering and other processing methods to reduce the noise of the height signal. However, this filtering processing method will cause the sensor signal to be distorted to a certain extent, and this distortion mainly occurs during the movement of the cutting head. That is, when the cutting head accelerates or decelerates, the height value obtained by the system deviates from the actual height value due to the filtering effect. As a result, the accuracy of the position or speed information of the plate surface (metal surface to be laser processed) determined by the height adjustment box is low, and the follower axis is prone to jitter during processing, which affects the follow-up control effect.

[0053] As an example, the board surface information determination method may be applied to a laser processing control system, which is applied to a laser processing control device.

[0054] As an example, a laser processing control system includes a laser cutting head, a height adjustment box, and an encoder.

[0055] As an example, the encoder is installed on the motor, the motor is linked to the follower shaft, and the laser cutting head is installed on the follower shaft. Therefore, when the motor drives the follower shaft to move, it drives the laser cutting head to move and perform laser processing on the processed board surface.

[0056] As an example, the height adjustment box is used to collect and process the height signal during laser processing. The processed signal is transmitted to the height sensor so that the laser processing control system can obtain the signal of the height sensor for control and control the laser cutting head to perform laser processing on the board to be processed.

[0057] As an example, the height signal collected by the height adjustment box refers to the height information or distance information between the laser cutting head and the board surface to be processed.

[0058] As an example, the plate surface to be processed refers to the metal surface to be processed.

[0059] As an example, the laser processing control system also reads the encoder position (motor end) of the follower axis to determine the height of the command position of the follower axis from the board surface, as well as the trend speed of the board surface, to enhance the control effect of the follower. Among them, the command position of the follower axis refers to the height signal of the height adjustment box, that is, the height information between the laser cutting head and the board surface to be processed. When the command position of the follower axis is consistent with the command height set by the user, it means that the accuracy of the height adjustment box is high, and the height value obtained by the height adjustment box is very small from the actual height, which can maintain the accuracy of the board surface position or speed information.

[0060] The specific steps are as follows:

[0061] Step S10, obtaining first height information between the laser cutting head and the board to be processed, which is collected by the height adjustment box based on its response characteristics;

[0062] As an example, the component that collects the height signal in the height adjustment box is a sensor, usually a capacitive sensor. Since the capacitive sensor is prone to generate a lot of noise, a specific filtering process is added to the height adjustment box during manufacturing. This filtering process will cause the height value obtained by the system to deviate from the actual height. In other words, the height information (actual height) collected by the height adjustment box will enter the response of a transfer function H(s). In essence, H(s) is generated because of the filtering and other processes inside the height adjustment box.

[0063] As an example, the first height information outputted from the height adjustment box after the H(s) response is obtained, where the first height information refers to the height information between the laser cutting head and the board to be processed.

[0064] Step S20, processing the height information of the encoder according to a preset compensation function to obtain second height information, wherein the compensation function is determined according to the response characteristics of the height adjustment box;

[0065] As an example, the ideal position of the plate to be processed = the encoder position of the follower axis - the actual height. The encoder position refers to the coordinate position of the encoder in the mechanical coordinate system of the laser processing. The actual height refers to the height information between the laser cutting head and the plate to be processed.

[0066] But in fact, the actual height is obtained through the response of the transfer function H(s) of the height adjustment box, which will distort the signal of the height adjustment box sensor to a certain extent. That is, the height information collected by the height adjustment box deviates from the actual height. However, the encoder position of the follower shaft collected by the encoder is not distorted, that is, it is an accurate value. Therefore, when determining the board surface information of the board to be processed, a deviation is formed between the position of the board surface and the speed of the board surface.

[0067] In order to compensate for this deviation, a compensation function is set for the encoder's data output processing so that after the information in the encoder responds to the compensation function, the response characteristics of the encoder after passing through this compensation function are consistent with the response characteristics of the height adjustment box, thereby reducing the deviation of information between the encoder and the height adjustment box.

[0068] As an example, the compensation function refers to a function established according to the response characteristics of the height adjustment box and acting on the encoder to respond to the information output. The characteristics of the compensation function in response to the information obtained by the encoder are consistent with the characteristics of the transfer function H(s) in response to the information obtained by the height adjustment box.

[0069] As an example, the height information of the encoder is processed according to a preset compensation function to obtain the encoder position information output by the encoder. Since the position of the board to be processed is determined based on the longitudinal direction in the mechanical coordinate system, the encoder position information is also the second height information.

[0070] Step S30, determining the board surface information of the board surface to be processed according to the first height information and the second height information, so that the laser cutting head can perform cutting based on the board surface information.

[0071] As an example, the surface information of the board to be processed includes target height information and speed information, wherein the target height refers to the position information of the board to be processed, that is, the position of the board in the mechanical coordinate system where the laser processing is located. The speed information refers to the speed trend of the board calculated based on the position information of the board to be processed, which is used to control the synchronization between the laser cutting head and the board to be processed, and avoid the problem of poor processing effect caused by the jitter of the laser cutting head.

[0072] As an example, the panel information is determined by the first height information after the transfer function H(s) response of the height adjustment box and the second height information after the compensation function response of the encoder, compensating for the accuracy of the height adjustment box and improving the accuracy of the information processed by the encoder and the height adjustment box.

[0073] As an example, the board surface information of the board surface to be processed is determined according to the first height information and the second height information.

[0074] As an example, the board surface information includes target height information and speed information, and determining the board surface information of the to-be-processed board surface according to the first height information and the second height information includes:

[0075] Step S31, determining target height information of the to-be-processed panel surface based on the first height information and the second height information;

[0076] Step S32, performing differentiation processing on the target height information based on a differential function to obtain speed information of the board surface to be processed.

[0077] As an example, the target height information of the board to be processed is the height difference between the second height information output by the encoder and the first height information output by the height adjustment box, that is, the value corresponding to the second height information is subtracted from the value corresponding to the first height information to obtain the height difference. The height difference is the position information of the board to be processed in the mechanical coordinate system, that is, the target height information.

[0078] As an example, the differential is the linear main part of the change of a variable in a certain change process. After the position information of the plate to be processed is differentiated based on the differential function, the speed information of the plate to be processed is obtained. The target height information and speed information obtained based on the first height information and the second height information processed by the height adjustment box and the encoder are more accurate. Through the target height information and speed information, the subsequent follow-up control tracking, overshoot and other indicators have a certain promoting effect.

[0079] The present application provides a method, device, equipment and storage medium for determining board surface information. Compared with the current inaccurate board surface processing information, which leads to problems such as jitter during follow-up axis processing and affects the follow-up control effect, in the present application, the first height information between the laser cutting head and the board surface to be processed, which is collected by the height adjustment box based on its response characteristics, is obtained; the height information of the encoder is processed according to a preset compensation function to obtain the second height information, wherein the compensation function is determined according to the response characteristics of the height adjustment box; the board surface information of the board surface to be processed is determined according to the first height information and the second height information, so that the laser cutting head can cut based on the board surface information. In the present application, the compensation function of the encoder is obtained by an offline identification method, so that the encoder is consistent with the response characteristics of the height adjustment box after the compensation function, so that the board position (target height information) and the board speed are more accurate during the dynamic process of laser processing, and the problem of inaccurate board processing information caused by the large height deviation obtained by the existing height adjustment box is solved (in the process of height signal acquisition, the capacitive sensor of the height adjustment box has the characteristic of easily generating a large number of noise points, so the existing height adjustment box manufacturers will add specific filtering and other means to reduce the noise of the height signal. However, this filtering processing means will distort the sensor signal to a certain extent, resulting in a deviation between the height value obtained by the system and the actual height value, resulting in inaccurate board processing information). That is, the first height information between the laser cutting head and the board to be processed collected by the height box based on its response characteristics is obtained, and the response characteristics of the encoder and the height adjustment box height output are used on the encoder, and the height information of the encoder is processed according to the preset compensation function to obtain the second height information, so that the response characteristics of the encoder after this compensation function are consistent with the response characteristics of the height adjustment box, and the accuracy of the height adjustment box is compensated. Therefore, according to the first height information and the second height information, the target height information and the speed information of the plate surface to be processed are determined more accurately, so that the follow-up control effect is better.

[0080] Based on the first embodiment of the method for determining board surface information described above, a second embodiment of the method for determining board surface information is proposed.

[0081] Reference Figure 2 , Figure 2 The control block diagram of the open precision compensation is shown. In order to compensate for the deviation of the position and speed of the plate surface to be processed caused by the response of the height adjustment box transfer function H(s), a response of a compensation function G(s) is added to the position of the follower shaft encoder. When G(s) = H(s), the encoder can be made consistent with the transfer function H(s) of the height adjustment box through this compensation function G(s), so that the position and speed of the plate surface to be processed can be compensated.

[0082] As an example, before processing the height information of the encoder according to a preset compensation function, the method includes:

[0083] Step S40, obtaining an initial function;

[0084] Step S50: According to the response characteristics of the height adjustment box, the initial function is identified by using an off-line identification technology to obtain a compensation function.

[0085] As an example, during the process of identifying the compensation function through the offline identification technology, the user needs to ensure that the board surface to be processed does not move during the entire process.

[0086] As an example, the initial function refers to a function designed according to the filter properties in the height adjustment box for reducing height signal noise, so that the compensation function obtained by the initial function is consistent with the filter response characteristics of the height adjustment box, and is used to compensate for the accuracy of the height adjustment box and improve the accuracy of the board surface information of the board to be processed.

[0087] As an example, the initial function is set to G(s)', and G(s)' is discretized to obtain G(Z -1 ), if the structure is assumed to be a FIR filter, then G(Z -1 ) is as follows:

[0088]

[0089] Where n refers to the order of the filter, and n is a custom variable that can be specified by the user according to actual needs. z is the encoder position information after extending the i-th cycle (i.e., the position of the laser cutting head in the mechanical coordinate system). Therefore, as long as a is determined i The range of G(Z -1 ) expression.

[0090] As an example, the initial function G(s)' is identified using an off-line identification technique to obtain a compensation function.

[0091] As an example, according to the response characteristics of the height adjustment box, the initial function is identified by using an offline identification technology to obtain a compensation function, including:

[0092] Step S51, obtaining motion information of the follower shaft when performing excitation motion based on the motion signal, wherein the motion information includes a third height information set collected by the encoder and a fourth height information set collected by the height adjustment box, wherein the follower shaft is used to control the motion of the laser cutting head;

[0093] Step S52, based on the motion information, using a phase delay method to calculate an initial value set of response coefficients of the initial function;

[0094] Step S53, using the least square method, based on the initial value set of the response coefficient and the preset board speed function, solving to obtain the target coefficient of the initial function;

[0095] Step S54: input the target coefficient into the initial function to obtain the compensation function.

[0096] As an example, the motion signal refers to a signal or designation for controlling the follower axis to perform an excitation motion.

[0097] As an example, excitation refers to a specific motion signal, and the excitation motion refers to the sine and cosine motion of the follower axis. The motion properties of the follower axis can be determined by the motion frequency specified by the user, that is, the sine motion or cosine motion of the follower axis.

[0098] As an example, the reciprocating motion has a range. The lowest point of the range is a preset value, and the highest point is half of the maximum range of the follow-up. The preset value is set according to the requirements of the laser processing, and can be 1mm.

[0099] As an example, motion information of the follower axis when performing an excitation motion based on a motion signal is obtained, and the motion information is used to instantiate the initial function to obtain the compensation function.

[0100] As an example, the acquired motion information refers to the encoder position of the follower shaft (third height information) stored according to the controller cycle (generally 1ms) and the height (fourth height information) fed back by the height adjustment box. The stored multiple third height information form a third height information set, and the stored multiple fourth height information form a fourth height information set. That is, the motion information includes the third height information set collected by the encoder and the fourth height information set collected by the height adjustment box. Among them, the controller cycle refers to the signal acquisition cycle of the control of the follower shaft movement in the laser processing control system.

[0101] As an example, the follower shaft performs an excitation motion based on a motion frequency in a motion signal, and the acquiring motion information of the follower shaft when performing the excitation motion based on the motion signal includes:

[0102] Step S511, obtaining the motion frequency of the follower axis when performing excitation motion based on the motion signal;

[0103] Step S512: acquiring the motion information in real time based on the motion frequency and the collection period of the motion information.

[0104] As an example, the user specifies the movement frequency of the follower axis so that the follower axis performs reciprocating motion according to the movement frequency. Therefore, the movement frequency of the follower axis when performing excitation motion based on the motion signal is obtained to determine the sine and cosine motion of the follower axis.

[0105] As an example, the controller cycle refers to a signal collection cycle for controlling the movement of a follower axis in a laser processing control system.

[0106] As an example, the cycle of the excitation movement can be set according to actual needs. If an excitation action is set to move according to a preset number of movement frequency cycles, then a complete excitation movement can be completed, and n*f1 / f2 groups of movement information can be obtained, where n is a preset number, which can be default or customized. For example, n=5 means that the entire excitation action moves according to 5 user-specified movement frequency cycles f1, and f2 is the controller cycle.

[0107] As an example, based on the motion information, the response coefficient value set a of the initial function is calculated by using the phase delay method. i .

[0108] As an example, the step of calculating the initial value set of the response coefficient of the initial function based on the motion information by adopting a phase delay method includes:

[0109] Step S521, calculating the phase difference between the height information in the third height information set and the height information in the fourth height information set;

[0110] Step S522, determining a delay time of the height adjustment box based on the movement frequency and the phase difference;

[0111] Step S523, determining the number of delay cycles of the height adjustment box according to the delay time and the collection cycle of the motion information;

[0112] Step S524: determining the initial value set of the response coefficient based on the number of cycles.

[0113] As an example, if the user specifies the motion frequency as f, the third height information of the encoder obtained by the controller is actPos(t) and the fourth height information obtained by the height adjustment box is sysSensor(t). The phase difference between actPos(t) and sysSensor(t) is calculated as

[0114] Assumptions

[0115]

[0116]

[0117]

[0118] Where N1(t) is the encoder noise, N2(t) is the step-up box noise, To increase the box amplitude attenuation, is the delay of the third height information actPos(t) in the third height information set of the encoder, It is the delay of the fourth height information sysSensor(t) in the fourth height information set obtained by the height adjustment box.

[0119] The phase of actPos(t) at frequency f can be obtained using the DFT algorithm:

[0120]

[0121] The calculation method of the phase of sysSensor(t) at frequency f is basically the same as the calculation method of the phase of actPos(t) at frequency f, which will not be repeated here. Thus, the phase phase(sysSensor(t)) of sysSensor(t) at frequency f is obtained.

[0122] The phase difference between the height information in the third height information set and the corresponding height information in the fourth height information set at time t is:

[0123]

[0124] Therefore, through With the acquisition cycle of the controller, the delay time of the height adjustment box can be obtained as

[0125] Divide the height adjustment box delay by the controller acquisition cycle and round it to get the height adjustment box delay cycle number k, then a k =1, and all other values ​​are 0. Such values ​​are taken as a i That is, the initial value of the response coefficient a i {a0, a1, a2...a i}’s initial value set is {0, 0, 0…1, 0, 0…0}, and the kth a i The initial value of is 1.

[0126] As an example, the least square method is used to solve the target coefficients of the initial function based on the initial value set of the response coefficients and the preset plate velocity function, thereby obtaining the initial function with determined coefficients, which is the compensation function.

[0127] As an example, the least square method is used to solve the target coefficient set of the initial function based on the initial value set of the response coefficient and the preset board speed function, including:

[0128] Step S531, constructing a board speed function based on the initial function;

[0129] Step S532: Based on the initial value set of response coefficients and the least square method, determine the target coefficient set that minimizes the board surface velocity function.

[0130] Step S54: input the target coefficient into the initial function to obtain the compensation function.

[0131] As an example, a board speed function is constructed based on the initial function, and the board speed function refers to the sum of the squares of the board speeds of the motion information of each controller during the acquisition period after the third height information set of the encoder passes through the set initial function G(s)' and the fourth height information set of the height adjustment box passes through H(s).

[0132] As an example, the board speed function F(a i )as follows:

[0133]

[0134]

[0135] in, The encoder position (ie, the third height information) is obtained by expressing the encoder through the initial function G(s)'. sysSensor(nT) is the original height signal of the height adjustment box, i.e., the fourth height information.

[0136] Since the plate surface to be processed remains stationary, the plate surface speed is 0. Therefore, if a i The value of makes F(ai) the smallest, then the obtained a i is the optimal solution. Among them, the plate surface velocity function F(a i ) where T is the acquisition cycle time of the controller for acquiring motion information, and N is the number of motion information groups collected to complete a complete excitation motion during the excitation motion of the follower axis based on the motion frequency in the motion signal.

[0137] Using the least squares principle, we get the system of equations:

[0138]

[0139] Solving the above equations gives the target coefficient set a i When the target coefficient set a i After the value of is determined, the compensation function G(s) can be completely determined based on the initial function G(s)'. During normal laser processing, the compensation function G(s) is used to respond to the height information obtained by the encoder to obtain the second height information consistent with the response characteristics of the height adjustment box, thereby realizing the dynamic accuracy compensation of the height adjustment box. Through the first height information and the second height information, more accurate board surface information is obtained for the laser cutting head to cut based on the board surface information.

[0140] In this embodiment, by using the encoder and height sensor information, the encoder compensation function is obtained through an offline identification method, so that the response characteristics of the encoder after the compensation function are consistent with the response characteristics of the height adjustment box, so that the board position and board speed are more accurate in the dynamic process. It has a certain promoting effect on the subsequent follow-up control followability, overshoot and other indicators.

[0141] As an example, see Figure 3 , Figure 3 This is the effect diagram of accuracy compensation and non-compensation. The vertical axis value represents the board speed of the board to be processed.

[0142] The measured results are as follows, the movement frequency f = 15H Z The target coefficient a is obtained through offline identification. i The value of is [0, 0, 0, 0.199, -0.019, 1.346, -0.526]. Figure 3 It can be seen that the actual physical board speed is 0 during identification, so the smaller the board speed, the closer the compensation is to the theoretical value. Obviously, the speed fluctuation after compensation is smaller and the effect is better.

[0143] Reference Figure 4 , Figure 4 It is a schematic diagram of the device structure of the hardware operating environment involved in the embodiment of the present application.

[0144] like Figure 4 As shown, the board information determination device may include: a processor 1001 , a memory 1005 , and a communication bus 1002 . The communication bus 1002 is used to realize the connection and communication between the processor 1001 and the memory 1005 .

[0145] Optionally, the panel information determination device may further include a user interface, a network interface, a camera, an RF (Radio Frequency) circuit, a sensor, a WiFi module, etc. The user interface may include a display screen (Display), an input submodule such as a keyboard (Keyboard), and the optional user interface may also include a standard wired interface and a wireless interface. The network interface may include a standard wired interface and a wireless interface (such as a WI-FI interface).

[0146] Those skilled in the art will understand that Figure 4 The structure of the board information determination device shown in the figure does not constitute a limitation on the board information determination device, and may include more or less components than shown in the figure, or combine certain components, or arrange the components differently.

[0147] like Figure 4As shown, the memory 1005 as a storage medium may include an operating system, a network communication module and a board information determination program. The operating system is a program that manages and controls the hardware and software resources of the board information determination device, and supports the operation of the board information determination program and other software and / or programs. The network communication module is used to realize the communication between the components inside the memory 1005, and to communicate with other hardware and software in the board information determination system.

[0148] exist Figure 4 In the board surface information determination device shown, the processor 1001 is used to execute the board surface information determination program stored in the memory 1005 to implement the steps of any of the above-mentioned board surface information determination methods.

[0149] The specific implementation of the board surface information determination device of the present application is basically the same as the various embodiments of the above-mentioned board surface information determination method, and will not be repeated here.

[0150] The present application also provides a device for determining board information, referring to Figure 5 , the device comprises:

[0151] An information acquisition module 10 is used to acquire first height information between the laser cutting head and the plate surface to be processed, which is collected by the height adjustment box based on its response characteristics;

[0152] The accuracy compensation module 20 is used to process the height information of the encoder according to a preset compensation function to obtain second height information, wherein the compensation function is determined according to the response characteristics of the height adjustment box;

[0153] The information determination module 30 is used to determine the board surface information of the board surface to be processed according to the first height information and the second height information, so that the laser cutting head can perform cutting based on the board surface information.

[0154] In a possible implementation manner of the present application, the device further includes:

[0155] Function acquisition module, used to obtain the initial function;

[0156] The function identification module is used to identify the initial function according to the response characteristics of the height adjustment box by using an off-line identification technology to obtain a compensation function.

[0157] And / or, the function identification module further includes:

[0158] An information acquisition submodule, used for acquiring motion information of the follower shaft when performing excitation motion based on the motion signal, wherein the motion information includes a third height information set collected by the encoder and a fourth height information set collected by the height adjustment box, wherein the follower shaft is used for controlling the motion of the laser cutting head;

[0159] An information calculation submodule, used to calculate the initial value set of the response coefficient of the initial function by using a phase delay method based on the motion information;

[0160] A coefficient solving submodule, for solving the target coefficient of the initial function by using the least square method based on the initial value set of the response coefficient and the preset board surface velocity function;

[0161] The function determination submodule is used to input the target coefficient into the initial function to obtain the compensation function.

[0162] And / or, the information acquisition submodule further includes:

[0163] A first acquisition unit is used to acquire a motion frequency when the follower shaft performs an excitation motion based on a motion signal; the follower shaft performs an excitation motion based on the motion frequency in the motion signal;

[0164] The second acquisition unit is used to acquire the motion information in real time based on the motion frequency and a collection period for collecting the motion information.

[0165] And / or, the information calculation submodule further includes:

[0166] A calculation unit, used to calculate a phase difference between the height information in the third height information set and the height information in the fourth height information set;

[0167] A first determining unit is used to determine the delay time of the height adjustment box based on the motion frequency and the phase difference; a second determining unit is used to determine the number of delay cycles of the height adjustment box according to the delay time and the collection period of the motion information;

[0168] The third determining unit is used to determine the initial value set of the response coefficient based on the number of cycles.

[0169] And / or, the coefficient solving submodule further includes:

[0170] A function construction unit, used for constructing a board speed function based on the initial function;

[0171] The coefficient determination unit is used to determine the target coefficient set that minimizes the board surface velocity function based on the initial value set of the response coefficients and the least squares method.

[0172] And / or, the information determination module further includes:

[0173] A height information determination submodule, used to determine target height information of the to-be-processed board surface based on the first height information and the second height information;

[0174] The speed information determination submodule is used to perform differential processing on the target height information based on a differential function to obtain the speed information of the board surface to be processed.

[0175] The specific implementation of the board surface information determination device of the present application is basically the same as the various embodiments of the board surface information determination method described above, and will not be repeated here.

[0176] An embodiment of the present application provides a computer-readable storage medium, and the computer-readable storage medium stores one or more programs, and the one or more programs can also be executed by one or more processors to implement the steps of any of the above-mentioned board information determination methods.

[0177] The specific implementation of the storage medium of the present application is basically the same as the various embodiments of the above-mentioned board information determination method, and will not be repeated here.

[0178] The present application also provides a computer program product, including a computer program, which implements the steps of the above-mentioned board surface information determination method when executed by a processor.

[0179] The specific implementation of the computer program product of the present application is basically the same as the various embodiments of the above-mentioned board information determination method, and will not be repeated here.

[0180] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0181] The serial numbers of the above embodiments of the present invention are only for description and do not represent the advantages or disadvantages of the embodiments.

[0182] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus hardware platform, or by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present invention, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes a number of instructions for enabling a terminal device (which can be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods described in each embodiment of the present invention.

[0183] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for determining board surface information, characterized in that: Applied to a laser processing control system, the system includes a laser cutting head, a height adjustment box and an encoder, and the method includes: Acquire first height information between the laser cutting head and the plate surface to be processed, which is collected by the height adjustment box based on its response characteristics; Processing the height information of the encoder according to a preset compensation function to obtain second height information, wherein the compensation function is determined according to the response characteristics of the height adjustment box; Determining the board surface information of the board surface to be processed according to the first height information and the second height information, so that the laser cutting head can perform cutting based on the board surface information; Before processing the height information of the encoder according to the preset compensation function, the method includes: Get the initial function; Acquire motion information of the follower shaft when performing excitation motion based on the motion signal, wherein the motion information includes a third height information set collected by the encoder and a fourth height information set collected by the height adjustment box, wherein the follower shaft is used to control the motion of the laser cutting head; Based on the motion information, an initial value set of response coefficients of the initial function is calculated by using a phase delay method; Using the least square method, based on the initial value set of the response coefficient and the preset board surface velocity function, the target coefficient of the initial function is solved; The target coefficient is input into the initial function to obtain the compensation function.

2. The method for determining board surface information according to claim 1, wherein: The follower shaft performs an excitation motion based on a motion frequency in a motion signal, and the acquiring motion information of the follower shaft when performing the excitation motion based on the motion signal includes: Acquire the motion frequency of the follower axis when it performs excitation motion based on the motion signal; The motion information is acquired in real time based on the motion frequency and a collection period for collecting the motion information.

3. The method for determining board surface information according to claim 2, wherein: The step of calculating the initial value set of the response coefficient of the initial function based on the motion information by adopting a phase delay method includes: Calculating a phase difference between the height information in the third height information set and the height information in the fourth height information set; Determining a delay time of the height adjustment box based on the movement frequency and the phase difference; Determine the number of delay cycles of the height adjustment box according to the delay time and the collection period of the motion information; Based on the number of cycles, the initial value set of the response coefficients is determined.

4. The method for determining board surface information according to claim 3, characterized in that: The method of using the least square method to solve the target coefficient set of the initial function based on the initial value set of the response coefficient and the preset board speed function includes: Constructing a board speed function based on the initial function; Based on the initial value set of response coefficients and the least square method, a target coefficient set that minimizes the surface velocity function is determined.

5. The method for determining board surface information according to claim 1, characterized in that: The board surface information includes target height information and speed information, and determining the board surface information of the board surface to be processed according to the first height information and the second height information includes: Determining target height information of the panel surface to be processed based on the first height information and the second height information; The target height information is differentiated based on a differential function to obtain speed information of the to-be-processed panel surface.

6. A device for determining board information, characterized in that: The device comprises: An information acquisition module is used to acquire first height information between the laser cutting head and the plate surface to be processed, which is collected by the height adjustment box based on its response characteristics; An accuracy compensation module, used for processing the height information of the encoder according to a preset compensation function to obtain second height information, wherein the compensation function is determined according to the response characteristics of the height adjustment box; An information determination module, used to determine the board surface information of the board surface to be processed according to the first height information and the second height information, so that the laser cutting head can perform cutting based on the board surface information; The board surface information determination device is used to achieve: Get the initial function; Acquire motion information of the follower shaft when performing excitation motion based on the motion signal, wherein the motion information includes a third height information set collected by the encoder and a fourth height information set collected by the height adjustment box, wherein the follower shaft is used to control the motion of the laser cutting head; Based on the motion information, an initial value set of response coefficients of the initial function is calculated by using a phase delay method; Using the least square method, based on the initial value set of the response coefficient and the preset board surface velocity function, the target coefficient of the initial function is solved; The target coefficient is input into the initial function to obtain the compensation function.

7. A device for determining board information, characterized in that: The board information determination device includes a memory, a processor, and a board information determination program stored in the memory and executable on the processor. When the processor executes the board information determination program, the steps of the board information determination method described in any one of claims 1 to 5 are implemented.

8. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a board surface information determination program, and when the board surface information determination program is executed by the processor, the steps of the board surface information determination method according to any one of claims 1 to 5 are implemented.

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