Temperature control method and electronic device

Abstract

The application provides a temperature control method and an electronic device, including: determining whether an operating state of the electronic device meets a preset condition; based on the operating state meeting the preset condition, adopting a first control strategy to control a temperature of a first target unit, the first control strategy adopting a first cooling element and a second cooling element; and based on the operating state not meeting the preset condition, adopting a second control strategy to control the temperature of the first target unit, the second control strategy adopting the first cooling element.

Description

TECHNICAL FIELD

[0001] The present application relates to the control field, more particularly, to a temperature control method and an electronic device. BACKGROUND

[0002] At present, portable devices are everywhere, and mobile terminals such as smart phones and tablet computers have become necessities of modern life and work due to their excellent performance.

[0003] However, with the enhancement of various device functions, the battery is getting larger and larger, and the heat generated by the system is also getting more and more. When designing the whole machine, the balance between temperature and performance is becoming a difficult point in system design. Not only the performance of the system needs to be improved, but also the temperature rise of the shell that easily affects the user experience must be paid attention to. How to optimize the performance of the system in various scenarios and improve the temperature of the area held by the user in different scenarios has become a key point in design.

[0004] The existing solutions basically all adopt various passive heat dissipation schemes, such as copper foil, graphite, heat pipe, and VC (Vapor Chamber, vacuum chamber heat plate heat dissipation technology) heat plate and various heat dissipation measures. These existing schemes are non-active, and in the process of temperature rise of the system, the heat dissipation material is used for rapid heat conduction to flatten the high and low temperature difference of the whole shell. Once the heat is not evenly distributed in a short time, hot spots are easily formed, affecting the user experience. SUMMARY

[0005] Therefore, the present application provides a temperature control method and an electronic device as follows:

[0006] A temperature control method, comprising:

[0007] determining whether a running state of an electronic device meets a preset condition;

[0008] based on the running state meeting the preset condition, adopting a first control strategy to control the temperature of a first target unit, and in the first control strategy, a first cooling element and a second cooling element are adopted;

[0009] based on the running state not meeting the preset condition, adopting a second control strategy to control the temperature of the first target unit, and in the second control strategy, the first cooling element is adopted.

[0010] Optionally, the method above, determining whether the running state of the electronic device meets the preset condition, comprises at least one of the following:

[0011] detecting whether an application started in the electronic device belongs to a preset application set, and the power consumption of any application in the preset application set during running is greater than a preset power consumption threshold;

[0012] or

[0013] Detecting whether a load of a preset processor in an electronic device is greater than a preset load threshold.

[0014] Optionally, in the method described above, based on the running state satisfying a preset condition, a first control strategy is used to control the temperature of the first target unit, and the method comprises the following steps of:

[0015] Based on the running state satisfying a preset condition, a second cooling element is started, and the second cooling element is arranged correspondingly to the first target unit.

[0016] The second cooling element is controlled to operate in a first mode, so that the second cooling element and the first cooling element cool the first target unit.

[0017] Optionally, in the method described above, after the first control strategy is used to control the temperature of the first target unit, the method further comprises the following steps of:

[0018] The temperature of the first target unit is obtained.

[0019] If the temperature of the first target unit is greater than a first preset temperature threshold, the second cooling element is controlled to stop.

[0020] The load of the first target unit is controlled to be reduced, so as to reduce the temperature of the first target unit.

[0021] Optionally, in the method described above, after the second control strategy is used to control the temperature of the first target unit based on the running state not satisfying the preset condition, the method further comprises the following steps of:

[0022] The temperature of the second target unit is obtained.

[0023] If the temperature of the second target unit is less than a second preset temperature threshold, the second cooling element is controlled to start.

[0024] The second cooling element is controlled to operate in a second mode, so as to heat the second target unit.

[0025] Optionally, in the method described above, the method further comprises the following steps of:

[0026] The temperatures of at least two target regions in the electronic device are obtained, and the target regions are regions in a shell of the electronic device that are in contact with an operating body.

[0027] Based on the temperatures of the at least two target regions satisfying a preset temperature difference condition, the temperatures of the at least two target regions are adjusted, so that the temperatures of the at least two target regions do not satisfy the preset temperature difference condition.

[0028] Optionally, the method as above, the adjusting the temperature of the at least two target areas comprises:

[0029] determining a third cooling element, the third cooling element is arranged in a first target area, the temperature of the first target area and the temperature of a second target area satisfy a preset temperature difference condition, the first target area and the second target area are arranged with a heat conduction material;

[0030] starting the third cooling element;

[0031] controlling the third cooling element to operate in a first mode, so that the third cooling element controls to transfer part of heat of the first target area to the second target area through the heat conduction material, so that the temperature of the first target area and the temperature of the second target area do not satisfy the preset temperature difference condition.

[0032] An electronic device comprises:

[0033] a first target unit, the first target unit is arranged on a first side of a circuit board;

[0034] a first cooling element arranged on the first side of the circuit board, for dissipating heat generated by the first target unit during operation;

[0035] a second cooling element arranged on a second side of the circuit board, for operating in a first mode when an operating state of the electronic device satisfies a preset condition, to dissipate heat for the first target unit.

[0036] Optionally, the electronic device as above, further comprises:

[0037] a second target unit arranged on the first side of the circuit board;

[0038] based on the operating temperature of the second target unit being less than a second preset temperature threshold, the second cooling element operates in a second mode to warm up the second target unit.

[0039] Optionally, the electronic device as above, further comprises:

[0040] a third cooling element arranged corresponding to a first target area in the electronic device, the first target area is an area in a housing of the electronic device which contacts a first operating body;

[0041] the third cooling element is used to adjust the temperature of the first target area and a second target area when the temperature of the first target area and the temperature of the second target area satisfy a preset temperature difference condition, so that the temperature of the at least two target areas do not satisfy the preset temperature difference condition, the second target area is an area in the housing of the electronic device which contacts a second operating body. BRIEF DESCRIPTION OF DRAWINGS

[0042] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only embodiments of the present application, and other drawings can be obtained by the drawings provided by the person skilled in the art without creative labor.

[0043] Figure 1 is a flow chart of a temperature control method embodiment 1 provided by the present application;

[0044] Figure 2 is a flow chart of a temperature control method embodiment 2 provided by the present application;

[0045] Figure 3 is a structural schematic diagram of a semiconductor refrigeration sheet in the temperature control method embodiment 2 provided by the present application;

[0046] Figure 4 is a flow chart of a temperature control method embodiment 3 provided by the present application;

[0047] Figure 5 is a flow chart of a temperature control method embodiment 4 provided by the present application;

[0048] Figure 6 is a control schematic diagram of a semiconductor refrigeration sheet in the temperature control method embodiment 5 provided by the present application;

[0049] Figure 7 is a flow chart of a temperature control method embodiment 5 provided by the present application;

[0050] Figure 8 is a target area schematic diagram in the temperature control method embodiment 5 provided by the present application;

[0051] Figure 9 is a target area setting schematic diagram in the temperature control method embodiment 5 provided by the present application;

[0052] Figure 10 is a flow chart of a temperature control method embodiment 6 provided by the present application;

[0053] Figure 11 is a temperature adjustment schematic diagram of two target areas in the temperature control method embodiment 6 provided by the present application;

[0054] Figure 12 is another temperature adjustment schematic diagram of two target areas in the temperature control method embodiment 6 provided by the present application;

[0055] Figure 13is a square wave schematic diagram in embodiment 6 of the temperature control method provided by the present application;

[0056] Figure 14 is a structural schematic diagram of embodiment 1 of the electronic device provided by the present application;

[0057] Figure 15 is another structural schematic diagram of embodiment 1 of the electronic device provided by the present application;

[0058] Figure 16 is a structural schematic diagram of embodiment 2 of the electronic device provided by the present application;

[0059] Figure 17 is a structural schematic diagram of embodiment 3 of the electronic device provided by the present application;

[0060] Figure 18 is a setting schematic diagram of the third cooling element in embodiment 3 of the electronic device provided by the present application. DETAILED DESCRIPTION

[0061] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0062] As shown in Figure 1 is a flowchart of embodiment 1 of the temperature control method provided by the present application, which is applied to an electronic device provided with a first cooling element and a second cooling element. The method comprises the following steps:

[0063] Step S101: determining whether the running state of the electronic device meets a preset condition.

[0064] In the running process of the electronic device, the running elements therein generate heat, which leads to the temperature rise among the internal elements of the electronic device.

[0065] The temperature of the important structure in the electronic device cannot be too high. Too high temperature will lead to the abnormal running of the structure or even the danger of burning, thus, the temperature of the important structure needs to be controlled.

[0066] The important structure at least comprises a first target unit.

[0067] In the embodiment, two control strategies are preset in the electronic device, which are used to control the temperature of the important structure.

[0068] The running state of the electronic device is detected to determine whether the preset condition is met, so as to determine which control strategy is used to control the temperature of the important structure in the electronic device.

[0069] Specifically, the preset condition is that the first target unit switches from light load to heavy load. If the running state of the electronic device does not meet the preset condition, it indicates that the first target unit is in light load operation. If the running state of the electronic device meets the preset condition, it indicates that the first target unit switches from light load to heavy load.

[0070] Specifically, determining whether the running state of the electronic device meets the preset condition includes at least one of the following two conditions:

[0071] I. Detecting whether the started application in the electronic device belongs to a preset application set, and the power consumption of any application in the preset application set during operation is greater than a preset power consumption threshold.

[0072] The electronic device has a preset application set, and the power consumption of the preset application in the preset application set during operation is large after the preset application is started.

[0073] Wherein, the start of an application in the preset application set will cause the temperature rise of the first target unit to be serious.

[0074] In a specific implementation, after an application in the electronic device is started, it is determined whether the started application belongs to the preset application set. If it does, it is determined that the running state of the electronic device meets the preset condition; otherwise, the running state of the electronic device does not meet the preset condition.

[0075] II. Detecting whether the load of a preset processor in the electronic device is greater than a preset load threshold.

[0076] The load condition of the preset processor in the electronic device can represent whether there is an application with large running power consumption in the electronic device.

[0077] Specifically, the preset processor can be a CPU (central processing unit) or the like.

[0078] During operation of the electronic device, various parameters of the operation of the preset processor are generated in the system, including the load condition. The parameter representing the load of the preset processor is obtained from the system, and based on the parameter, it can be determined whether the load is greater than the preset load threshold.

[0079] Specifically, the preset load threshold can be 50%, 75%, etc. Of course, the value of the preset load threshold can be set according to the actual situation, and the application does not limit the value of the preset load threshold.

[0080] The second cooling element needs to be powered by the electronic device to operate, and thus, heat is generated during operation of the second cooling element.

[0081] If the temperature of the first target unit is too high, it indicates that even if the first cooling element and the second cooling element are used to externally cool the first target unit, the temperature of the first target unit cannot be reduced, and the second cooling element cannot achieve the purpose of cooling the first target unit even if it operates for a long time. Since the second cooling element generates heat during operation, when the temperature of the first target unit is too high, the operation of the second cooling element needs to be prohibited to save power consumption.

[0082] Therefore, when determining whether the operating state of the electronic device meets the preset condition, in addition to using whether the load of the first target unit is switched from light load to heavy load as a judgment condition, whether the temperature of the first target unit is at a high temperature can also be used for judgment. If the temperature of the first target unit is greater than a preset high temperature threshold, it is determined that the operating state of the electronic device does not meet the preset condition, and the second cooling element is prohibited from being started. If the temperature of the first target unit is less than a preset non-high temperature threshold, and the load of the first target unit is switched from light load to heavy load, it is determined that the operating state of the electronic device meets the preset condition.

[0083] Specifically, the preset high temperature threshold can be slightly less than the first temperature threshold, for example, 80°C, 75°C, etc. The preset non-high temperature threshold is less than the preset high temperature threshold, and is generally the average temperature of the first target unit when operating at light load, for example, 50°C, 60°C, etc. Of course, the values of the preset high temperature threshold and the preset non-high temperature threshold can be selected according to actual conditions, and the application does not limit the values of the preset high temperature threshold and the preset non-high temperature threshold.

[0084] Step S102: based on the operating state meeting the preset condition, using a first control strategy to control the temperature of the first target unit.

[0085] In the first control strategy, the first cooling element and the second cooling element are used.

[0086] In a specific implementation, the first target unit is the temperature of a SOC (System on Chip) in the electronic device, and the temperature of the first target unit can be the junction temperature of the SOC.

[0087] If the operating state of the electronic device meets the preset condition and the temperature of the first target element in the electronic device reaches a high temperature, the first control strategy is used to control the temperature of the first target unit.

[0088] The first control strategy employs two cooling units, both of which cool the first target unit to achieve strong cooling and instantaneous cooling.

[0089] It should be noted that when the temperature of the first target unit is controlled by this first control strategy, the system can provide temperature control support in terms of transient capability when running, for example, games or related calculations. It can provide a certain amount of low temperature supplement to the first target unit when it needs to maintain a high-performance state for a certain period of time, thereby improving performance.

[0090] Step S103: Based on the fact that the operating state does not meet the preset conditions, the temperature of the first target unit is controlled by the second control strategy.

[0091] The second control strategy employs the first cooling element.

[0092] If the operating state of the electronic device does not meet the preset conditions, and the temperature of the first target element in the electronic device does not reach a high temperature, then the second control strategy is used to control the temperature of the first target unit.

[0093] In this second control strategy, only the first cooling element is used to cool the first target unit, thereby achieving cooling and ensuring the cooling of the first target unit while reducing the overall power consumption of the electronic device.

[0094] In summary, the temperature control method provided in this embodiment selects different control strategies to control the temperature of the first target unit based on whether the operating state of the electronic device meets or does not meet preset conditions. If the operating state meets the preset conditions and the temperature of the first target unit in the electronic device reaches a high temperature, the first control strategy is adopted to use the first cooling element and the second cooling element in combination to instantly cool the first target unit. If the operating state does not meet the preset conditions and the temperature of the first target unit in the electronic device does not reach a high temperature, the second control strategy is adopted to cool the unit using only the first cooling element. Different temperature control strategies can be adopted based on different operating states of the electronic device to ensure the safe operation of the first target unit of the electronic device.

[0095] like Figure 2 The diagram shown is a flowchart of Embodiment 2 of a temperature control method provided in this application. The method includes the following steps:

[0096] Step S201: Determine whether the operating status of the electronic device meets the preset conditions;

[0097] Step S201 is the same as step S101 in Embodiment 1, and will not be described again in this embodiment.

[0098] Step S202: based on the running state satisfying the preset condition, starting the second cooling element;

[0099] The second cooling element is arranged corresponding to the first target unit.

[0100] The second cooling element is an element that can be controlled to start and stop.

[0101] The second cooling element is arranged near or in contact with the first target unit to cool the temperature of the first target element.

[0102] Specifically, when the running state of the electronic device satisfies the preset condition, the second cooling element is started.

[0103] Specifically, the second cooling element can be a semiconductor cooling sheet, which can transfer heat from one end to the other end to cool and reduce the temperature of the first target unit.

[0104] The semiconductor cooling sheet is a heat transfer tool. When an electric current passes through a thermocouple pair composed of an N-type semiconductor material and a P-type semiconductor material, heat transfer occurs between the two ends, and heat is transferred from one end to the other end, thereby generating a temperature difference to form hot and cold ends. It uses the Peltier effect, that is, when an electric current passes through a loop composed of different conductors, in addition to irreversible Joule heat, heat absorption and heat release will occur at the junctions of different conductors depending on the direction of the electric current.

[0105] For example, Figure 3The structure diagram of the semiconductor refrigeration sheet is shown, which includes thermocouple (one piece of N-type semiconductor material and one piece of P-type semiconductor material) and electrodes 301 connected with the thermocouple, electrodes 302 connected with the N-type semiconductor in the thermocouple only, and electrodes 303 connected with the P-type semiconductor in the thermocouple only. The structure diagram also shows the working process of the semiconductor refrigeration sheet. The positive electrode of the power supply is connected with the electrode 302, and the negative electrode of the power supply is connected with the electrode 303. The electrode 301 of the semiconductor refrigeration sheet is connected with the cold end, and one end of the electrodes 302-303 is connected with the hot end. The electrons start from the negative electrode of the power supply to the junction of the electrode 303 and the P-type semiconductor. When the electrons enter the P-type semiconductor from the electrode 303, it is equivalent to that the energy of the electrons enters the valence band of the semiconductor from the Fermi level (because it is P-type, the carriers in it are in the valence band), and the energy of the electrons in the valence band is lower than the Fermi level, so heat is released at the hot end. The electrons continue to move, and when the electrons enter the electrode 301 of the cold end from the P-type semiconductor, it is equivalent to that the electrons enter the Fermi level from the valence band, so heat is absorbed at the cold end. When the electrons enter the N-type semiconductor from the electrode 301, it is equivalent to that the electrons enter the conduction band from the Fermi level (because it is N-type, the carriers in it are in the conduction band), and the energy of the electrons in the conduction band is higher, so heat is absorbed in this process. Conversely, when the electrons enter the electrode 302 of the hot end from the N-type semiconductor, the energy is reduced, so heat is released at the hot end and finally returns to the positive electrode of the power supply. The cold end and the hot end of the refrigeration sheet are also connected with the insulating ceramic to ensure that the semiconductor refrigeration sheet dissipates heat without conducting electricity.

[0106] Specifically, the electrodes 301-303 in the semiconductor refrigeration sheet adopt copper (Cu) electrodes.

[0107] In specific implementation, the working power of the semiconductor refrigeration sheet is generally in the range of 4W (watt).

[0108] Step S203: controlling the second cooling element to operate in a first mode, so that the second cooling element and the first cooling element cool the first target unit;

[0109] The second cooling element has two operating modes.

[0110] In the first direction, the second cooling element can make the cold end close to one side of the first target unit, so as to ensure that the heat generated by the operation of the first target unit is transferred to the hot end through the second cooling element for heat dissipation.

[0111] In specific implementation, the first cooling element and the second cooling element can be arranged at adjacent positions in the electronic device, and are adjacent to the first target unit respectively to dissipate heat emitted by the first target unit; or the first cooling element and the second cooling element can be arranged at non-adjacent positions and are adjacent to the first target unit respectively to dissipate heat emitted by the first target unit.

[0112] It should be noted that the second cooling element can be a group of cooling elements, and the same structure of cooling elements is adopted, such as two or more semiconductor refrigeration pieces for cooling the first target unit.

[0113] The first cooling element can be a fixed heat dissipation element arranged in the electronic device, and the first cooling element adopts a passive cooling mode.

[0114] Specifically, when the temperature of the structure adjacent to or in contact with the first cooling element is higher than the temperature of the first cooling element, the first cooling element cools the structure by heat conduction without the need to control the start or stop of operation.

[0115] Specifically, the first cooling element includes a CPU heat pipe, a vc (Vapor Chamber, vacuum chamber heat plate heat dissipation technology) heat plate, a fan, and the like.

[0116] Step S204: based on the operating state not satisfying the preset condition, a second control strategy is adopted to control the temperature of the first target unit.

[0117] In this embodiment, step S204 is consistent with step S103 in Embodiment 1, and will not be described herein.

[0118] In summary, in the temperature control method provided in this embodiment, when the operating state of the electronic device satisfies the preset condition, the second cooling element is started to control the second cooling element to operate in the first mode, so that the second cooling element and the first cooling element jointly cool the first target unit, and the purpose of executing the first control strategy to cool the first target unit of the electronic device is achieved.

[0119] As shown in FIG. 3, a flowchart of Embodiment 3 of the temperature control method provided in this application is shown, and the method includes the following steps: Figure 4

[0120] Step S401: determining whether the operating state of the electronic device satisfies a preset condition;

[0121] Step S402: based on the operating state satisfying the preset condition, a first control strategy is adopted to control the temperature of the first target unit;

[0122] ​The steps S401-S402 are consistent with the steps S101-S102 in the embodiment 1, and will not be described herein.

[0123] Step S403: obtaining the temperature of the first target unit;

[0124] The temperature of the first target unit increases during operation. To ensure that the temperature of the first target unit can be effectively controlled by the first control strategy, the temperature of the first target unit needs to be detected after the first control strategy is used to control the temperature of the first target unit.

[0125] The parameters of the preset processor are generated in the system, including the temperature of the first target unit. The parameters representing the temperature of the first target unit are obtained from the system, and the temperature of the first target unit can be determined based on the parameters.

[0126] For example, after the temperature of the first target unit is controlled by the first control strategy, if it is detected that the temperature of the first target unit is greater than the first preset temperature threshold, it is determined that the temperature of the first target unit is too high, and the cooling needs to be continued.

[0127] The first preset temperature threshold can be set to a high temperature, such as 85°C, 90°C, 95°C, etc. The value of the first preset temperature threshold can be set according to actual conditions, and the application does not limit the value thereof.

[0128] Step S404: if the temperature of the first target unit is greater than the first preset temperature threshold, the second cooling element is controlled to stop;

[0129] The operation of the second cooling element needs to be provided with electric energy by the electronic device, and therefore, a certain amount of heat will be generated during the operation of the second cooling element.

[0130] If the temperature of the first target unit is greater than the first preset temperature threshold, it is indicated that even if the first cooling element and the second cooling element are used to externally cool the first target unit, the temperature of the first target unit cannot be reduced, and the second cooling element cannot achieve the purpose of cooling the first target unit even if it is operated for a long time. Since the second cooling element generates a certain amount of heat during operation, the second cooling element is stopped to save power consumption.

[0131] Step S405: the load of the first target unit is controlled to be reduced to reduce the temperature of the first target unit;

[0132] The more the load in the first target unit, the more heat it generates, and the higher the temperature. Conversely, the less the load in the first target unit, the less heat it generates, and the lower the temperature.

[0133] Wherein, since the temperature of the first target unit cannot be reduced by using external cooling method, it is needed to control to reduce the load in the first target unit, so as to reduce the heat generated by the first target unit, and achieve the purpose of reducing the temperature.

[0134] It should be noted that in the specific implementation, the steps S404 and S405 can be executed simultaneously or sequentially, but when executed sequentially, the two steps need to be executed within a short time.

[0135] Step S406: based on the running state not satisfying the preset condition, using a second control strategy to control the temperature of the first target unit.

[0136] Wherein, the step S406 is consistent with the step S103 in the embodiment 1, and the embodiment will not be repeated here.

[0137] In summary, in the temperature control method provided by the embodiment, after using the first control strategy to control the temperature of the first target unit, the temperature of the first target unit is obtained, and when the temperature of the first target unit is greater than the first preset temperature threshold, the second cooling element is controlled to stop, the load of the first target unit is reduced, so that the heat generated by the first target unit is reduced, and the purpose of reducing the temperature from the inside of the first target unit is achieved.

[0138] As shown in Figure 5 the flow chart of the temperature control method embodiment 4 provided by the present application, the method comprises the following steps:

[0139] Step S501: determining whether the running state of the electronic device satisfies the preset condition;

[0140] Step S502: based on the running state satisfying the preset condition, using a first control strategy to control the temperature of the first target unit;

[0141] Step S503: based on the running state not satisfying the preset condition, using a second control strategy to control the temperature of the first target unit;

[0142] Wherein, the steps S501-503 are consistent with the steps S101-103 in the embodiment 1, and the embodiment will not be repeated here.

[0143] Step S504: obtaining the temperature of the second target unit;

[0144] Wherein, the second target unit is also an important structure in the electronic device.

[0145] Wherein, in the low temperature scene, the performance of the second target unit is easily affected by the low temperature, therefore, it is needed to ensure that the temperature of the second target unit is maintained within a range.

[0146] Specifically, a temperature sensor is arranged at the second target unit, and a temperature detection value of the temperature sensor is obtained based on the temperature sensor detecting the temperature of the second target unit.

[0147] In specific implementation, the second target unit can be an RFIC (Radio Frequency Integrated Circuit), and the RF performance of the RFIC can be affected in a low-temperature scenario.

[0148] Step S505: If the temperature of the second target unit is less than a second preset temperature threshold, the second cooling element is controlled to be started.

[0149] If the temperature of the second target unit is too low, it indicates that the electronic device is in a low-temperature environment, and the performance of the second target unit is affected.

[0150] The second preset temperature threshold can be set to a lower temperature, such as -20°C or -15°C, and the value of the second preset temperature threshold can be set according to actual conditions, and the application does not limit the value thereof.

[0151] Step S506: The second cooling element is controlled to operate in a second mode to warm up the second target unit.

[0152] The second cooling element is controlled to operate in the second mode to warm up the second target unit.

[0153] The second mode is specifically a current input mode opposite to the first mode.

[0154] For details, refer to Figure 3 The second mode is a mode obtained by exchanging the positive and negative poles of the power supply corresponding to the first mode.

[0155] The first side of the second cooling element operating in the first mode is a cold end, and the second side is a hot end. The cold end absorbs heat from the space where the first side is located, and the absorbed heat is released through the hot end. The first side of the second cooling element operating in the second mode is a hot end, and the second side is a cold end. The cold end absorbs heat from the space where the first side is located, and the absorbed heat is released through the hot end. The second target unit is arranged at the first side of the second cooling element, and the temperature of the environment where the second target unit is located is increased by releasing heat from the first side, so that the temperature of the second target unit is increased.

[0156] As Figure 6As shown in the control schematic diagram of the semiconductor refrigeration piece, including: power supply 601, positive and negative power supply control circuit 602, current limiting module 603, semiconductor refrigeration piece 604. Among them, the power provided by the power supply is processed by the positive and negative power supply control circuit, and then passes through the current limiting module 603, and controls the semiconductor refrigeration piece 604 to run in the first mode; the power provided by the power supply is processed by the positive and negative power supply control circuit, and then passes through the current limiting module 603, and controls the semiconductor refrigeration piece 604 to run in the second mode.

[0157] It should be noted that the operation of the first target unit in a low temperature environment is also susceptible to low temperature, and the second target unit and the first target unit are arranged close to each other, and the first target unit is also arranged on the first side of the semiconductor refrigeration piece. When the second cooling element is used to heat the second target unit, it can also be used to heat the first target unit, ensuring the normal operation of the two target units.

[0158] In summary, in the temperature control method provided by the embodiment, the temperature of the second target unit is obtained, and if the temperature of the second target unit is less than the second preset temperature threshold, it indicates that the temperature of the second target unit is too low and will affect the performance of the second target unit. The second cooling element is controlled to start, and specifically, the second cooling element is controlled to run in the second mode to heat the second target unit, so as to ensure that the second target unit is not affected by low temperature and improve the performance of the second target unit in a low temperature environment.

[0159] As Figure 7 As shown in the flow chart of the temperature control method embodiment 5 provided by the application, the method comprises the following steps:

[0160] Step S701: obtaining the temperature of at least two target regions in the electronic device;

[0161] Among them, the target region is the region in the shell of the electronic device that is in contact with the operating body.

[0162] Among them, the temperature of the at least two target regions is the temperature that can be felt by the operating body when it is in contact with the electronic device.

[0163] Among them, in the region in the shell of the electronic device that is in contact with the operating body, the region containing the contact region is determined as the target region.

[0164] Specifically, the sensor can be a capacitive sensor.

[0165] Among them, the temperature of the target region is specifically the temperature of the packaging shell of the electronic device (Case Temperature), which is referred to as shell temperature.

[0166] One such device is a temperature detection structure that can be installed within the electronic device to detect the temperature of the target area.

[0167] Specifically, an NTC (Negative Temperature Coefficient) resistor is used as the temperature detection structure to detect the temperature of the target area.

[0168] It should be noted that, due to the usage habits of most users, the area they touch when using electronic devices is relatively fixed. Therefore, several areas can be designated as commonly used contact areas (handheld areas). Temperature capacitive sensing sensors can be installed in these areas, and the area that is determined to be in contact with the device can be used as the target area.

[0169] Specifically, after determining the target area, the temperature detection structure for that target area is activated to detect the temperature of that target area, or the detection temperature of each temperature sensor is obtained, and after determining the target area, only the detection temperature of that target area is used for subsequent steps.

[0170] Specifically, the target area is the area held by the user's hands. Generally, users hold the device with both hands, so the electronic device has two or more target areas.

[0171] like Figure 8 The diagram shows the target area. Using a tablet computer as an example, the left image shows the user holding the device with both hands on either side of the lower end; these two areas represent the target area. The right image shows the target areas within the electronic device, comprising four areas (801-804). Areas 801-802 form one group, and areas 803-804 form another. This diagram uses the back of the electronic device to illustrate the corresponding target areas.

[0172] Step S702: Based on the fact that the temperatures of the at least two target areas meet the preset temperature difference condition, adjust the temperatures of the at least two target areas so that the temperatures of the at least two target areas do not meet the preset temperature difference condition;

[0173] The preset temperature difference condition refers to the temperature difference between two target areas being greater than a preset threshold.

[0174] The preset threshold can be 5℃, but it is not limited to this and can be set according to the actual situation.

[0175] The temperature of the target area is increased due to heat dissipation caused by the operation of the components in the electronic device. One of the target areas is close to the heat generating component, and the other is generally far away from the heat generating component. Correspondingly, the temperatures of the two target areas are different. The two operating bodies simultaneously contact the two target areas. Due to the large temperature difference between the two target areas, the user's experience is poor. Therefore, the temperature of the two target areas needs to be adjusted.

[0176] In a specific implementation, when the temperature of the target area with a higher temperature is greater than a set threshold, the temperature of the target area is adjusted in combination with the condition that the temperature of the target area meets a preset temperature difference condition.

[0177] The set threshold can be 37 degrees Celsius, but is not limited thereto, and can also be a temperature close to the body temperature of the user.

[0178] It should be noted that, from the perspective of the user, if the temperature of the target area is not greater than the set threshold, the user does not feel a significant temperature difference between the two target areas. If the temperature of the target area is greater than the set threshold, the user feels one side is hot and the other side is cool. By adjusting the temperature of the two target areas, the user's overall experience is consistent and the user does not feel hot, thereby improving the user experience.

[0179] In a specific implementation, the area contacted by the operating body can be detected by the capacitive sensor to determine whether the electronic device is in a horizontal screen mode or a vertical screen mode. The display mode of the electronic device is controlled according to different modes. Moreover, the NTC resistance set in the area contacted by the operating body is used as a temperature control detection structure to detect whether the temperature of the target area exceeds a set threshold. If the threshold is exceeded, the user's experience will be more obvious. The temperature of the target area is adjusted.

[0180] Specifically, the target area with a higher temperature can be cooled to reduce its temperature. The temperature difference between the reduced temperature and the temperature of the other target area is small, thereby achieving the purpose of adjusting the temperature of the at least two target areas.

[0181] Specifically, heat from the target area with a higher temperature can be transferred to the target area with a lower temperature to achieve the purpose of adjusting the temperature of the at least two target areas.

[0182] The temperature difference between the at least two target areas is reduced by heat transfer between the at least two target areas, and the temperature difference is reduced to not meet the preset temperature difference condition.

[0183] In a specific implementation, the scheme in this embodiment is executed after the shell temperature of the electronic device is stable.

[0184] Among them, the temperature of the electronic device's casing is stable, and the temperature of the target area is also stable. Temperature adjustment is performed based on the stable casing temperature.

[0185] In practice, the target area can be located on the front of the electronic device, i.e., the side where the screen is located, or it can be located on the back of the electronic device.

[0186] like Figure 9 The diagrams show target area settings. The left diagram shows the target areas on the back of the electronic device, including a first target area 901 and a second target area 902. The temperature of the first target area 901 is higher than the temperature of the second target area 902. The temperature difference between the two is greater than a preset threshold. The temperature of the first target area is controlled to decrease so that the temperature difference between the two target areas is less than the preset threshold. The right diagram shows the target areas on the front of the electronic device, including a first target area 903 and a second target area 904. The temperature of the first target area 903 is higher than the temperature of the second target area 904. The temperature difference between the two target areas is greater than a preset threshold. The temperature of the first target area is controlled to decrease so that the temperature difference between the two target areas is less than the preset threshold. The first and second target areas are respectively equipped with capacitive sensors for detecting contact with the operating body and NTC resistors for detecting temperature.

[0187] Step S703: Determine whether the operating status of the electronic device meets the preset conditions;

[0188] Step S704: Based on the fact that the operating state meets the preset conditions, the temperature of the first target unit is controlled by the first control strategy;

[0189] Step S705: Based on the fact that the operating state does not meet the preset conditions, the temperature of the first target unit is controlled by the second control strategy;

[0190] Steps S703-705 are the same as steps S501-503 in Example 4, and will not be described again in this example.

[0191] In summary, the temperature control method provided in this embodiment obtains the temperature of at least two target areas in the casing of an electronic device that are in contact with the operating body. If the temperatures of the at least two target areas meet a preset temperature difference condition, it indicates that the temperature difference between the at least two target areas is large. From the user's perspective, one area in contact with the operating body is cooler and the other is hotter. The temperature of the at least two target areas is adjusted so that the device does not meet the preset temperature difference condition, so that the user's overall feeling is consistent and does not feel hot, thereby improving the user experience.

[0192] like Figure 10As shown, a flowchart of a temperature control method embodiment 6 provided in the present application, the method comprises the following steps:

[0193] Step S901: obtaining temperatures of at least two target regions in the electronic device;

[0194] Wherein, the step S901 is consistent with the step S701 in embodiment 5, and the present embodiment will not be repeated.

[0195] Step S902: determining a third cooling element based on the temperatures of the at least two target regions satisfying a preset temperature difference condition;

[0196] Wherein, the third cooling element is arranged in the first target region, the temperature of the first target region and the temperature of the second target region satisfy the preset temperature difference condition, and the first target region and the second target region are arranged with a heat conduction material.

[0197] Wherein, the temperature of the first target region is higher than the temperature of the second target region, and the temperatures of the two regions satisfy the preset temperature difference condition.

[0198] Wherein, the third cooling element corresponding to the first target region is capable of being controlled to start and stop.

[0199] Specifically, the third cooling element can adopt a semiconductor cooling sheet, the cold end of the semiconductor cooling sheet is close to the first target region, and the hot end is away from the first target region.

[0200] In specific implementation, the third cooling element is arranged between the shell of the electronic device and the internal structural element / first cooling element of the internal structural element of the electronic device, so as to realize the temperature of the internal structural element at the corresponding position of the shell.

[0201] Step S903: starting the third cooling element;

[0202] Wherein, the third cooling element is started, specifically, the third cooling element is powered on to make it run.

[0203] Step S904: controlling the third cooling element to run in a first mode, so that the third cooling element controls part of the heat of the first target region to be transferred to the second target region through the heat conduction material;

[0204] Wherein, by transferring part of the heat of the first target region to the second target region, the temperature of the first target region and the temperature of the second target region do not satisfy the preset temperature difference condition.

[0205] Wherein, the heat conduction material is arranged between the first target region and the second target region, and the heat conduction material can quickly conduct the heat around it.

[0206] In this design, the cold end of the third cooling element is close to the first target area, and its hot end is close to the heat-conducting material. Accordingly, the cold end absorbs heat and lowers the temperature of the first target area. The hot end transfers the heat absorbed by the cold end from the first target area to the heat-conducting material, which then transfers the heat to the relatively cooler second target area around it. This achieves the purpose of transferring some of the heat from the first target area to the second target area, making the temperature of the first target area and the temperature of the second target area more balanced.

[0207] like Figure 11 The diagram illustrates a temperature adjustment for two target regions. It includes a first target region 1101, a second target region 1102, and a heat-conducting material 1103 positioned between them. The temperature of the first target region 1101 is higher than the temperature of the second target region 1102, and the temperature difference between them exceeds a preset threshold. A thermoelectric cooler 11011 is installed in the first target region. This cooler operates in a first mode, absorbing heat from the first target region and releasing it to the heat-conducting material. The heat-conducting material then transfers this heat to the second target region, thereby controlling and lowering the temperature of the first target region so that the temperature difference between the two target regions is less than the preset threshold. The direction of heat transfer is indicated by arrows in the diagram.

[0208] In practice, to improve the speed of temperature adjustment, a fourth cooling element can be set in the second target area where the temperature is lower. The cold end of the fourth cooling element is controlled to be close to the heat-conducting material and the hot end is close to the second target area, so as to absorb the heat transferred by the heat-conducting material and release it to the second target area, thereby increasing the temperature of the second target area and accelerating the heat transfer process between the two target areas.

[0209] like Figure 12The diagram illustrates another temperature adjustment for two target regions. This diagram includes a first target region 1201, a second target region 1202, and a heat-conducting material 1203 disposed between them. The temperature of the first target region 1201 is higher than the temperature of the second target region 1202, and the temperature difference between them exceeds a preset threshold. A thermoelectric cooler 12011 is disposed in the first target region, operating in a first mode. The side of the thermoelectric cooler 12011 closest to the first target region is the cold end, which absorbs heat from the first target region and releases it to the heat-conducting material. The heat-conducting material then conducts this heat to the second target region. A thermoelectric cooler 12021 is disposed in the second target region, operating in a second mode. The side of the thermoelectric cooler 12021 closest to the second target region is the hot end, which absorbs heat from the heat-conducting material and releases it to the second target region. The direction of heat transfer is indicated by arrows in the diagram.

[0210] In a specific implementation, several areas in the electronic device are designed as commonly used contact areas (handheld areas) by the user. Semiconductor cooling chips are installed in these areas so that the temperature of the target area can be adjusted in any of these areas as described in this embodiment.

[0211] Since the thermoelectric cooler generates heat during startup due to efficiency issues, the control strategy employs intermittent square wave control using PWM (Pulse Width Modulation) to prevent excessive heat generation from affecting the system temperature.

[0212] like Figure 13 The diagram shows a square wave. When the temperature T in the first target area is greater than the set threshold T0, the third cooling element is turned on (represented by "on" in the diagram). When the temperature T in the first target area is less than the set threshold T0, the third cooling element is turned off (represented by "off" in the diagram).

[0213] Specifically, when a user holds the electronic device, if the NTC temperature of the handheld casing rises above the set threshold of 37°C due to system load in the right-hand holding area, and the user's hand begins to feel hot, the system immediately uses intermittent PWM pulse width control of the thermoelectric cooler to quickly reduce the casing temperature of the user's side to below 37°C, forming a dynamic closed-loop temperature control strategy. Correspondingly, the temperature of the left-hand holding area is detected. If it is below 37°C, and combined with the temperature of the right-hand holding area, it is determined whether the temperature difference is too large. If the temperature difference is large, the PWM control of the thermoelectric cooler is reversed in the left-hand area, creating a hot and cold temperature difference inside the machine, lowering the temperature of the hot end, and forming a PWM hot and cold flow, which can perform heat conduction and transfer in the area, transferring heat from one side to the other.

[0214] The third cooling element is a semiconductor refrigeration chip.

[0215] Step S905: Determine whether the operating status of the electronic device meets the preset conditions;

[0216] Step S906: Based on the fact that the operating state meets the preset conditions, the temperature of the first target unit is controlled by the first control strategy;

[0217] Step S907: Based on the fact that the operating state does not meet the preset conditions, the temperature of the first target unit is controlled by the second control strategy;

[0218] Steps S905-907 are the same as steps S703-705 in Example 5, and will not be described again in this example.

[0219] In summary, the temperature control method provided in this embodiment, based on the fact that the temperatures of the first target area and the second target area meet the temperature difference condition of stagnation, and the temperature of the first target area is higher, activates the third cooling element corresponding to the first target area, controls the third cooling element to operate in a first mode, so that the third cooling element conducts part of the heat from the first target area to the second target area through the heat conduction material, so that the temperatures of the first target area and the second target area are close and do not meet the preset temperature difference condition, ensuring that the temperature felt by the operator of the electronic device in the two areas is similar, thus improving the user experience.

[0220] Corresponding to the temperature control method embodiment provided in this application above, this application also provides an electronic device embodiment that applies the temperature control method.

[0221] like Figure 14 The diagram shown is a side view of an electronic device according to embodiment 1 of this application. The electronic device includes the following structure: a first target unit 1401, a first cooling element 1402, and a second cooling element 1403.

[0222] The first target unit 1401 is disposed on the first side of the circuit board 1404;

[0223] The first cooling element is disposed on the first side of the circuit board and is used to dissipate the heat generated during the operation of the first target unit.

[0224] The first side and the first surface are the same side of the circuit board, specifically the front side of the circuit board, and the components of the electronic device that are disposed on the circuit board are disposed on the first surface.

[0225] The second cooling element 1403 is arranged on the second side of the circuit board and is used to dissipate heat from the first target unit in the first mode when the operating state of the electronic device meets the preset condition.

[0226] Correspondingly, the second side is the side corresponding to the back of the circuit board.

[0227] In a specific implementation, the second cooling element is a semiconductor cooling sheet.

[0228] Specifically, the second cooling unit is installed in an SMT (Surface Mount Technology) welding manner.

[0229] In a specific implementation, the second side of the circuit board is the direction of the back cover of the electronic device, and a heat dissipation material (such as a VC / graphite sheet / heat pipe) is further arranged on the back cover side of the electronic device. The second cooling element is fixed on the second side of the circuit board through the heat-conducting gel. The heat dissipation material can be fixed together with the second cooling element through the heat-conducting gel, or the heat dissipation material can be fixed on the back cover. When the back cover is covered, the heat dissipation material is in close contact with the heat-conducting gel to uniformly conduct the heat conducted from the second cooling element through the heat dissipation material close to the back cover.

[0230] In a specific implementation, the second cooling element is a semiconductor cooling sheet. Figure 14 In a specific implementation, in order to improve the cooling effect, two or even more second cooling elements can be arranged to cool the first target unit.

[0231] In a specific implementation, in order to improve the cooling effect, two or even more second cooling elements can be arranged to cool the first target unit.

[0232] In a specific implementation, the second cooling element is a semiconductor cooling sheet. Figure 15Another structural schematic diagram of the electronic device is shown, which includes the following structures: a first target unit 1501, a first cooling element 1502, and a second cooling element 1503-1504, wherein the first target unit 1501 is arranged on a first side of a circuit board 1505, the first cooling element 1502 is arranged on a first side of the circuit board 1505, and the second cooling element 1503-1504 is arranged on a second side of the circuit board. The second side of the circuit board is also provided with a functional unit 1506, and the second cooling elements 1503 and 1504 are arranged on both sides of the functional unit 1506. The cold end of the second cooling element is the side close to the circuit board, and the hot end is the side away from the circuit board. The second cooling elements 1503-1504 are fixed on the second side of the circuit board through a heat-conducting gel 1507, and the heat-conducting gel also wraps the functional unit 1506.

[0233] The structural schematic diagram of the semiconductor refrigeration sheet is shown in Figure 3 The specific structure and function of the semiconductor refrigeration sheet are not described in detail in this embodiment.

[0234] In summary, the electronic device provided in this embodiment has a first target unit arranged on a circuit board, and is also provided with two cooling elements. The first cooling element is arranged on the first side of the circuit board and is used to dissipate heat generated by the first target unit during operation. The second cooling element is arranged on the second side of the circuit board and is used to operate in a first mode when the operating state of the electronic device meets a preset condition, thereby dissipating heat for the target unit. The second cooling element and the first cooling element jointly cool the first target unit, different temperature control strategies can be adopted based on different operating states of the electronic device, and the safe operation of the first target unit of the electronic device is ensured.

[0235] As Figure 16 shown is a structural schematic diagram of an electronic device embodiment 2 provided in the present application, which includes the following structures: a first target unit 1601, a first cooling element 1602, a second cooling element 1603, and a second target unit 1604.

[0236] The structures and functions of the first target unit 1601, the first cooling element 1602, and the second cooling element 1603 are consistent with the corresponding structures and functions in embodiment 1, and are not described in detail in this embodiment.

[0237] The second target unit 1604 is arranged on the first side of the circuit board.

[0238] Based on the temperature of the second target unit being less than a second preset temperature threshold, the second cooling element operates in a second mode to warm up the second target unit.

[0239] In particular, a second target unit is also provided on the first side of the circuit board in the electronic device. The performance of the second target unit is severely affected by low temperature.

[0240] In practice, the second target unit can be an RFIC, whose radio frequency performance will be affected in low-temperature scenarios.

[0241] If the temperature of the second target unit is too low, it indicates that the electronic device is in a low-temperature environment and the performance of the second target unit is affected. Then, the second cooling unit is controlled to operate in the second mode to increase the temperature of the second target unit.

[0242] The second preset temperature threshold can be set to a lower temperature, such as -20℃ or -15℃. The value of the second preset temperature threshold can be set according to the actual situation, and this application does not restrict its value.

[0243] The process of heating the second target unit is explained in the method embodiment, and will not be repeated in this embodiment.

[0244] In summary, the electronic device provided in this embodiment also includes a second target unit. If the temperature of the second target unit is lower than a second preset temperature threshold, it indicates that the temperature of the second target unit is too low and will affect the performance of the second target unit. The second cooling element is activated by controlling it to operate in a second mode to raise the temperature of the second target unit, ensuring that the second target unit is not affected by the low temperature and improving the performance of the second target unit in a low temperature environment.

[0245] like Figure 17 The diagram shown is a structural schematic of an electronic device embodiment 3 provided in this application. The electronic device includes the following structure: a first target unit 1701, a first cooling element 1702, a second cooling element 1703, and a third cooling element 1704.

[0246] The structural functions of the first target unit 1701, the first cooling element 1702, and the second cooling element 1703 are consistent with the corresponding structural functions in Embodiment 1, and will not be described again in this embodiment.

[0247] The third cooling element 1704 is configured to correspond to the first target area in the electronic device, which is the area in the outer casing 1705 of the electronic device that contacts the first operating body.

[0248] The third cooling element is configured to adjust the temperatures of the first target region and the second target region when the temperature difference between the first target region and the second target region meets the preset temperature difference condition, so that the temperature difference between the at least two target regions does not meet the preset temperature difference condition, and the second target region is a region of the shell of the electronic device that is in contact with the second operation body.

[0249] The third cooling unit is arranged at a position far away from the first target unit, and specifically, the third cooling unit is arranged at a region close to the frame of the electronic device.

[0250] The third cooling unit adjusts the temperatures of the first target region and the second target region in the manner described in the foregoing method embodiment, and will not be described in detail in this embodiment.

[0251] As shown in FIG. 18, the third cooling element is arranged in the electronic device. Figure 18 As shown in FIG. 18, the third cooling element is arranged in the electronic device. The third cooling element is arranged between the heat dissipation material contact 1803 and the rear shell 1804 of the electronic device, and is connected to the heat dissipation material through the heat conduction material 1085. An NTC resistor 1086 is arranged beside the third cooling element, and the NTC resistor is also powered by the circuit board. The heat dissipation material dissipates heat generated in the operation of each functional unit of the electronic device, the third cooling element absorbs the heat dissipated by the heat dissipation material, and transmits the heat to the second target region through the heat conduction material, so as to balance the temperatures of the first target region and the second target region.

[0252] In summary, the electronic device provided in this embodiment is based on the temperature difference between the first target region and the second target region meeting the preset temperature difference condition, and the temperature of the first target region being higher. When the above conditions are met, the third cooling element corresponding to the first target region is started, and the third cooling element is controlled to operate in the first mode. The third cooling element transmits part of the heat of the first target region to the second target region through the heat conduction material, so that the temperatures of the first target region and the second target region are close, and the preset temperature difference condition is not met. The temperature feeling of the operation body using the electronic device in the two regions is similar, and the user experience is improved.

[0253] Corresponding to the temperature control method provided in the foregoing embodiment of the present application, the present application also provides a readable storage medium corresponding to the temperature control method.

[0254] The readable storage medium has a computer program stored thereon, and the computer program is called and executed by a processor to implement the steps of the temperature control method according to any one of the foregoing embodiments.

[0255] Specifically, the computer program stored in the readable storage medium performs the temperature control method, which can be known from the foregoing embodiments of the temperature control method.

[0256] The various embodiments are described in a progressive manner in the specification, and each embodiment focuses on the difference from other embodiments. The same or similar parts between the various embodiments can be mutually referred to. For the apparatus provided by the embodiments, since it corresponds to the method provided by the embodiments, the description is relatively simple, and the relevant parts can be referred to the description of the method.

[0257] The above description of the provided embodiments enables a person skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features provided herein.

Claims

1. A temperature control method, comprising: determining whether an operating state of an electronic device meets a preset condition; based on the operating state meeting the preset condition, controlling a temperature of a first target unit by using a first control strategy, the first control strategy using a first cooling element and a second cooling element, the second cooling element having two operating modes, the two operating modes having opposite current input modes, wherein the second cooling element operates in a first mode, a first side of the second cooling element being a cold end and a second side of the second cooling element being a hot end, the cold end being a side close to the first target unit, and heat generated by the first target unit being transferred to the hot end through the second cooling element for heat dissipation, the first target unit being disposed on a first surface of a circuit board, and the second cooling element being disposed on a second surface of the circuit board; based on the operating state not meeting the preset condition, controlling the temperature of the first target unit by using a second control strategy, the second control strategy using the first cooling element; obtaining a temperature of a second target unit, and if the temperature of the second target unit is less than a second preset temperature threshold, controlling to start the second cooling element, the second target unit being disposed on the first surface of the circuit board; and controlling the second cooling element to operate in a second mode, a first side of the second cooling element being the hot end and a second side of the second cooling element being the cold end, the hot end being a side close to the second target unit, the second cooling element being used to heat the first target unit and the second target unit; wherein the method further comprises: obtaining temperatures of at least two target regions in the electronic device, the target regions being regions of a housing of the electronic device that are in contact with an operating body; and based on the temperatures of the at least two target regions meeting a preset temperature difference condition, adjusting the temperatures of the at least two target regions so that the temperatures of the at least two target regions do not meet the preset temperature difference condition. 2.The method of claim 1, wherein determining whether the operating state of the electronic device meets the preset condition comprises at least one of: detecting whether an application started in the electronic device belongs to a preset application set, any application in the preset application set having a power consumption greater than a preset power consumption threshold during operation; or detecting whether a load of a preset processor in the electronic device is greater than a preset load threshold. 3.The method of claim 1, wherein based on the operating state meeting the preset condition, controlling the temperature of the first target unit by using the first control strategy comprises: based on the operating state meeting the preset condition, starting the second cooling element, the second cooling element being disposed corresponding to the first target unit; and controlling the second cooling element to operate in the first mode so that the second cooling element and the first cooling element heat the first target unit. 4.The method of claim 1, wherein after controlling the temperature of the first target unit by using the first control strategy, the method further comprises: obtaining the temperature of the first target unit; if the temperature of the first target unit is greater than a first preset temperature threshold, controlling to stop the second cooling element; and controlling to reduce a load of the first target unit to reduce the temperature of the first target unit. 5.The method of claim 1, wherein adjusting the temperatures of the at least two target regions comprises: ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ determining a third cooling element, the third cooling element being arranged at a first target region, the first target region and a second target region satisfying a preset temperature difference condition, and a heat conduction material being arranged between the first target region and the second target region; starting the third cooling element; controlling the third cooling element to operate in a first mode, so that the third cooling element controls the heat generated by the first target region to be transferred to the second target region through the heat conduction material, so that the temperature of the first target region and the temperature of the second target region do not satisfy the preset temperature difference condition.

6. An electronic device, comprising: a first target unit arranged on a first side of a circuit board; a first cooling element arranged on the first side of the circuit board, for dissipating heat generated by the first target unit during operation; a second cooling element arranged on a second side of the circuit board, for dissipating heat from the first target unit when the operating state of the electronic device satisfies a preset condition; the second cooling element has two operating modes, and the current input modes of the two operating modes are opposite, wherein, when the second cooling element operates in the first mode, the first side is the cold end and the second side is the hot end, the cold end is the side close to the first target unit, and the heat generated by the first target unit is transferred to the hot end through the second cooling element for heat dissipation; the second cooling element is arranged on the second side of the circuit board; a second target unit arranged on the first side of the circuit board; when the operating temperature of the second target unit is less than a second preset temperature threshold, the second cooling element operates in a second mode, the first side is the hot end and the second side is the cold end, the hot end is the side close to the second target unit, and the second cooling element warms up the first target unit and the second target unit; wherein the electronic device further comprises: a third cooling element arranged corresponding to a first target region in the electronic device, the first target region being a region of the shell of the electronic device in contact with the first operating body; the third cooling element is used to adjust the temperature of the first target region and a second target region when the temperature of the first target region and the temperature of the second target region satisfy a preset temperature difference condition, so that the temperature of the two target regions does not satisfy the preset temperature difference condition, and the second target region is a region of the shell of the electronic device in contact with the second operating body.

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