A heat dissipation system, method and electronic device

Abstract

The application discloses a heat dissipation system, a heat dissipation method and electronic equipment, and relates to the technical field of heat dissipation. The heat dissipation system comprises a heat generating module, a quartz crystal, a frequency-voltage conversion module and a fan module, the output end of the heat generating module is connected to the first input end of the quartz crystal, the output end of the quartz crystal is connected to the input end of the frequency-voltage conversion module, the first output end of the frequency-voltage conversion module is connected to the second input end of the quartz crystal, and the second output end of the frequency-voltage conversion module is connected to the input end of the fan module. The frequency-voltage conversion module is used for converting the crystal output frequency into a fan rotating speed voltage signal, and then the rotating speed of the fan is directly adjusted, so that the scheme does not depend on BMC, the heat dissipation process is simplified, the reliability and stability of the system are improved, and the research and development cost is reduced.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of electronics, and particularly relates to a heat dissipation system and method and electronic equipment. BACKGROUND

[0002] With the rapid development of the Internet and the continuous rise of cloud computing technology, the deployment of servers is increasing. Compared with ordinary home computers, servers have more high-power and high-heat chips and electronic components, so more heat is generated during operation. How to quickly dissipate this heat is the key to stable operation of the system. If the heat dissipation effect is poor, the components will age and be damaged faster, and the CPU and other chips may also be reduced in frequency due to high temperature, reducing the efficiency of the system, and more seriously, may directly cause the server to crash, thereby affecting the progress of business operation on the server.

[0003] At present, air cooling is still the most mainstream heat dissipation method. Through the heat dissipation fan inside the server case, the air flow speed on the surface of the heat dissipation fin is accelerated to improve the heat exchange speed of the heat dissipation fin and the air, so as to achieve the purpose of cooling the main electronic components.

[0004] Generally, servers are operated continuously for 24 hours a week, but the load is constantly changing during operation, which leads to a change in heat generation. If the fan is always maintained at high speed, a large amount of power resources will be wasted, so a high-efficiency and stable heat dissipation system is needed to adjust the fan speed according to the change of temperature, so as to reduce the power consumption of the server while ensuring the heat dissipation effect.

[0005] The existing solution is that the temperature sensors on the mainboard obtain temperature data at different positions of the mainboard, and transmit the data to the baseboard management controller (BMC) through the I2C bus. The BMC adjusts the fan speed through the I2C bus.

[0006] The temperature sensors 1, 2 and 3 obtain the temperature of the mainboard, and then transmit the mainboard temperature information to the BMC chip. The BMC chip adjusts the fan speed through the I2C bus according to the temperature information returned by the temperature sensor, so that the temperature of the server is maintained in the normal range.

[0007] However, the commonly used temperature sensor has the disadvantages of low accuracy and linearity, slow response, poor long-term stability, high power consumption, etc.

[0008] At the same time, the commonly used server heat dissipation system needs the BMC chip to manage and transmit the temperature signal and the fan speed signal through the I2C bus, and the circuit is relatively complex and depends on the BMC chip. Once the BMC chip fails, the heat dissipation system may run abnormally.

[0009] That is, the speed of the fan of the heat dissipation system in the conventional design needs to rely on the BMC to manage and transmit information, and when the BMC fails, the fan will stop or rotate at full speed, which will cause the temperature of the server components to rise and the server to shut down, affecting the business; if it rotates at full speed, it will increase power consumption, waste power resources, and produce a lot of noise pollution. SUMMARY

[0010] In order to solve the problems of the prior art, the present application provides a heat dissipation system, method and electronic equipment, the heat dissipation system comprising a heat generating module, a quartz crystal, a frequency-voltage conversion module and a fan module, the output end of the heat generating module being connected to the first input end of the quartz crystal, the output end of the quartz crystal being connected to the input end of the frequency-voltage conversion module, the first output end of the frequency-voltage conversion module being connected to the second input end of the quartz crystal, and the second output end of the frequency-voltage conversion module being connected to the input end of the fan module. The present application converts the crystal output frequency into a fan speed control voltage signal through the frequency-voltage conversion module, and then directly adjusts the speed of the fan. This scheme does not rely on the BMC, simplifies the heat dissipation process, improves the reliability and stability of the system, and reduces the research and development cost.

[0011] The technical solution is as follows:

[0012] In a first aspect, the present application provides a heat dissipation system, the heat dissipation system comprising a heat generating module, a quartz crystal, a frequency-voltage conversion module and a fan module,

[0013] the output end of the heat generating module being connected to the first input end of the quartz crystal, the output end of the quartz crystal being connected to the input end of the frequency-voltage conversion module, the first output end of the frequency-voltage conversion module being connected to the second input end of the quartz crystal, and the second output end of the frequency-voltage conversion module being connected to the input end of the fan module;

[0014] the quartz crystal being used to convert the temperature information of the heat generating module components into a vibration frequency signal;

[0015] the frequency-voltage conversion module being used to convert the vibration frequency signal into a target direct current voltage signal.

[0016] In some embodiments, the frequency-voltage conversion module comprises a comparator, an F / V converter, an inverter, and an inverting adder,

[0017] the output end of the comparator being connected to the input end of the F / V converter, the output end of the F / V converter being connected to the input end of the inverter, the output end of the inverter being connected to the input end of the inverting adder;

[0018] The input end of the comparator is the input end of the frequency-voltage conversion module, and the output end of the inverting adder is the second output end of the frequency-voltage conversion module.

[0019] The inverting adder is used for performing an addition operation on the inverted voltage signal output by the inverter and a reference voltage signal, adjusting the size of the reference voltage through an addition operation circuit, and outputting a target direct current voltage signal for controlling the rotation speed of the fan.

[0020] In a second aspect, the application further provides a heat dissipation method, the method comprising:

[0021] obtaining temperature information of the heat module component;

[0022] translating the temperature information of the heat module component into a vibration frequency signal through the quartz crystal according to the temperature information of the heat module component;

[0023] translating the vibration frequency signal into a target direct current voltage signal;

[0024] adjusting the rotation speed of the fan according to the target direct current voltage signal to dissipate heat from the heat module component.

[0025] In some embodiments, the method further comprises, before the step of obtaining the temperature information of the heat module component:

[0026] arranging the quartz crystal at the position of the heat module component to be detected, and applying a voltage excitation to the quartz crystal through the frequency-voltage conversion module.

[0027] In some embodiments, the step of translating the temperature information of the heat module component into a vibration frequency signal through the quartz crystal according to the temperature information of the heat module component comprises:

[0028] translating the temperature information of the heat module component into a vibration frequency signal through the formula f = f0(1 + Tf (1) (t-t0) + Tf (2) (t-t0) 2 + Tf (3) (t-t0) 3 );

[0029] wherein f is the current frequency of the quartz crystal, f0 is the initial frequency of the quartz crystal, Tf (1) , Tf (2) , and Tf (3) are the first, second and third order temperature frequency coefficients of the quartz crystal, respectively, t is the current temperature of the heat module component, and t0 is the initial temperature of the heat module component.

[0030] In some embodiments, the method comprises:

[0031] The cut type of the quartz crystal is set as an LC cut type.

[0032] The detection temperature of the temperature detection component of the heat generating module is corrected by a segmented linear correction mode of the frequency voltage conversion module.

[0033] In some embodiments, the converting the vibration frequency signal into a target direct current voltage signal comprises:

[0034] The sine vibration frequency signal is converted into a square wave signal through a comparator, the square wave signal is converted into a direct current voltage signal through an F / V converter, the direct current voltage signal is converted into an inverted voltage signal through an inverter circuit, and the inverted voltage signal is converted into a target direct current voltage signal through an inverted adder.

[0035] In some embodiments, the converting the inverted voltage signal into a target direct current voltage signal through the inverted adder comprises:

[0036] The inverted voltage signal is subjected to an addition operation with a reference voltage signal through the inverted adder, the size of the reference voltage is adjusted through an addition operation circuit, and a target direct current voltage signal for controlling the rotation speed of the fan is output.

[0037] In some embodiments, the converting the vibration frequency signal into a target direct current voltage signal further comprises:

[0038] The vibration frequency signal is converted into a target direct current voltage signal through an integrated chip and a frequency voltage conversion circuit.

[0039] In a third aspect, the present application further provides an electronic device, which comprises the heat dissipation system according to any one of the first aspect.

[0040] The technical scheme disclosed in the embodiments of the present application has the following beneficial effects:

[0041] The application provides a heat dissipation system, method and electronic equipment, the heat dissipation system comprises a heat generating module, a quartz crystal, a frequency-voltage conversion module and a fan module, the output end of the heat generating module is connected to the first input end of the quartz crystal, the output end of the quartz crystal is connected to the input end of the frequency-voltage conversion module, the first output end of the frequency-voltage conversion module is connected to the second input end of the quartz crystal, and the second output end of the frequency-voltage conversion module is connected to the input end of the fan module.The application converts the crystal output frequency into a fan speed voltage signal through the frequency-voltage conversion module, and then directly adjusts the speed of the fan, which does not depend on BMC, simplifies the heat dissipation process, improves the reliability and stability of the system, and reduces the research and development cost.

[0042] The technical scheme disclosed in the embodiment of the application utilizes the temperature-frequency characteristic of the quartz crystal, collects the temperature information of the heat generating module components in real time, and converts the temperature information into a fan speed control signal, and compared with the traditional temperature sensor such as a thermistor, the quartz crystal has the advantages of high sensitivity and linearity and good stability.

[0043] The technical scheme disclosed in the embodiment of the application does not depend on BMC for signal processing and transmission, and when the BMC fails, the heat dissipation system can still operate independently and stably, avoids the abnormality and even the downtime of the server caused by the overheating of the server due to the fan stop, and also avoids the increase of power consumption and noise pollution caused by the full-speed operation of the fan.Compared with the traditional design scheme, the circuit is simplified, the cost is reduced, and the stability and reliability of the heat dissipation system are improved.

[0044] The technical scheme disclosed in the embodiment of the application utilizes the temperature-frequency characteristic of the quartz crystal, adopts a suitable cut type to make the temperature-frequency characteristic have very high linearity, converts the change of the component temperature into a voltage signal for controlling the fan speed in real time, and realizes the precise, stable and efficient operation of the server heat dissipation system. BRIEF DESCRIPTION OF DRAWINGS

[0045] The above features and advantages of the present application can be better understood by reading the following detailed description of the embodiments of the present application in conjunction with the accompanying drawings. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0046] Figure 1 The structure diagram of the heat dissipation system described in the application is shown;

[0047] Figure 2 The structure diagram of the frequency-voltage conversion module described in the application is shown;

[0048] Figure 3 The flowchart of the heat dissipation method described in the application is shown;

[0049] Figure 4 A circuit diagram of the frequency-voltage conversion circuit according to the present application is shown;

[0050] Figure 5 A structural diagram of the heat dissipation device according to the present application is shown;

[0051] Figure 6 An exemplary system that can be used to implement various embodiments described herein is provided. DETAILED DESCRIPTION

[0052] In order to make the objectives, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0053] It should be noted that the terms "first", "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. In the description of the present application, the meaning of "multiple" or "several" is two or more, unless otherwise explicitly specified.

[0054] Embodiment one

[0055] The embodiment of the present application provides a heat dissipation system, as shown in the figure, the heat dissipation system comprises a heat generating module, a quartz crystal, a frequency-voltage conversion module, a fan module, Figure 1

[0056] The output end of the heat generating module is connected to the first input end of the quartz crystal, the output end of the quartz crystal is connected to the input end of the frequency-voltage conversion module, the first output end of the frequency-voltage conversion module is connected to the second input end of the quartz crystal, and the second output end of the frequency-voltage conversion module is connected to the input end of the fan module.

[0057] The quartz crystal is used to convert the temperature information of the heat generating module component into a vibration frequency signal.

[0058] The frequency-voltage conversion module is used to convert the vibration frequency signal into a target direct current voltage signal.

[0059] ​Specifically, the heat generating module is a server mainboard, a quartz crystal is arranged at a position of a component of the heat generating module which needs to be detected, the quartz crystal is used to convert temperature change information of the component of the heat generating module into a vibration frequency signal, the frequency-voltage conversion module is used to complete conversion of the vibration frequency signal into a target direct current voltage signal, and the fan module is used to receive the target direct current voltage signal output from the frequency-voltage conversion module and adjust the rotating speed of the fan.

[0060] In the embodiment, as shown in the figure, Figure 2 The frequency-voltage conversion module comprises a comparator, an F / V converter, an inverter, and an inverting adder,

[0061] The output end of the comparator is connected to the input end of the F / V converter, the output end of the F / V converter is connected to the input end of the inverter, and the output end of the inverter is connected to the input end of the inverting adder.

[0062] The input end of the comparator serves as the input end of the frequency-voltage conversion module, and the output end of the inverting adder serves as the second output end of the frequency-voltage conversion module.

[0063] The inverting adder is used to perform an addition operation on the inverted voltage signal output by the inverter and a reference voltage signal, adjust the size of the reference voltage through an addition operation circuit, and output a target direct current voltage signal for controlling the rotating speed of the fan.

[0064] The technical scheme disclosed by the embodiment of the application has the following beneficial effects:

[0065] The application discloses a heat dissipation system, which comprises a heat generating module, a quartz crystal, a frequency-voltage conversion module, and a fan module, the output end of the heat generating module is connected to the first input end of the quartz crystal, the output end of the quartz crystal is connected to the input end of the frequency-voltage conversion module, the first output end of the frequency-voltage conversion module is connected to the second input end of the quartz crystal, and the second output end of the frequency-voltage conversion module is connected to the input end of the fan module.

[0066] The technical scheme disclosed by the embodiment of the application utilizes the temperature-frequency characteristic of the quartz crystal, collects temperature information of components of the heat generating module in real time, and converts the temperature information into a control signal of the rotating speed of the fan.

[0067] The technical scheme disclosed by the embodiment of the application can realize accurate speed regulation of a server fan and meanwhile realize an efficient and stable heat dissipation mode.

[0068] Embodiment two

[0069] The application provides a heat dissipation method, as shown in the method, comprising: Figure 3

[0070] Step S0, placing a quartz crystal at a position of a temperature detection part of the heat generating module, and applying a voltage excitation to the quartz crystal through the frequency-voltage conversion module.

[0071] Specifically, due to the piezoelectric effect of the quartz crystal, when a certain voltage is applied to the quartz crystal, the quartz crystal outputs a stable frequency oscillation, and the oscillation frequency of the quartz crystal changes with temperature. Meanwhile, a special crystal cutting method is adopted to strengthen the frequency change, and the frequency change is controlled to be linear or close to linear, so that a high-reliability and high-sensitivity temperature sensor can be made of the quartz crystal. According to different frequencies and cutting methods, the temperature sensitivity of the quartz crystal can be changed in the range of 20 Hz / ℃ to 2850 Hz / ℃, and the temperature resolution can reach 0.0001℃ by frequency measurement.

[0072] The main component of the quartz crystal is silicon dioxide, which has high hardness, good long-term stability, and high electromechanical coupling coefficient.

[0073] It can be understood that the quartz crystal is arranged at a position of the server mainboard where the temperature needs to be monitored, the frequency-voltage conversion module applies a certain voltage excitation to the quartz crystal, and the quartz crystal starts to vibrate.

[0074] Step S1, acquiring temperature information of the heat generating module part.

[0075] Specifically, when the quartz crystal senses the change of the temperature of the heat generating module part, the vibration frequency of the quartz crystal also changes in real time.

[0076] Step S2, converting the temperature information of the heat generating module part into a vibration frequency signal through the quartz crystal according to the temperature information of the heat generating module part.

[0077] Step S2 further comprises:

[0078] Step S21, converting the temperature information of the heat generating module part into a vibration frequency signal through the quartz crystal according to the temperature information of the heat generating module part by the formula f=f0(1+Tf (1) (t-t0)+Tf (2) (t-t0) 2 +Tf (3) (t-t0) 3 ​) converting the temperature information of the heat module component into a vibration frequency signal;

[0079] wherein f is the current frequency of the quartz crystal, f0 is the initial frequency of the quartz crystal, Tf (1) , Tf (2) , Tf (3) are the 1st, 2nd and 3rd order temperature frequency coefficients of the quartz crystal respectively, t is the current temperature of the heat module component, t0 is the initial temperature of the heat module component.

[0080] Specifically, the temperature-frequency characteristic curve f(t) of the quartz crystal is a quadratic or cubic parabola or a straight line, and within -200℃ to +200℃, the temperature frequency characteristic of the quartz crystal can be approximately expressed by a cubic polynomial: f = f0(1 + Tf (1) (t-t0) + Tf (2) (t-t0) 2 + Tf (3) (t-t0) 3 )

[0081] Here, in order to make the temperature-frequency characteristic of the quartz crystal have good linearity, the value of Tf (1) is preferably much larger than the values of Tf (2) , Tf (3) , and the best case is that Tf (2) , Tf (3) = 0.

[0082] Step S22, setting the cut type of the quartz crystal as LC cut type;

[0083] correcting the detected temperature of the heat module component to be detected by the segmented linear correction mode of the frequency-voltage conversion module.

[0084] Specifically, according to experimental experience data, the cut type of the quartz crystal has a great influence on the temperature coefficients of each order and the temperature-frequency linearity, and when the quartz crystal adopts LC cut type, the temperature-frequency linearity of the quartz crystal is the best.

[0085] Generally, a very high temperature-frequency linearity can be obtained by controlling the cut type of the quartz crystal, and at the same time, the frequency-voltage conversion module can output a direct current voltage signal in proportion to the input frequency. Here, the segmented linear correction mode can also be used inside the frequency-voltage conversion module to further reduce the temperature measurement error caused by nonlinearity and improve the control accuracy.

[0086] Step S3, converting the vibration frequency signal into a target direct current voltage signal.

[0087] Specifically, when the quartz crystal perceives the change of the temperature of the heating module component, the vibration frequency will also change in real time, and the vibration frequency is transmitted to the frequency-voltage conversion module in real time. The frequency-voltage conversion module converts the input vibration frequency signal into a direct current voltage signal in real time and outputs it to the fan module. The fan module adjusts the rotating speed of the fan according to the change of the input target direct current voltage.

[0088] Step S3 further comprises:

[0089] Step S31, the sine vibration frequency signal is converted into a square wave signal through a comparator, the square wave signal is converted into a direct current voltage signal through an F / V converter, the direct current voltage signal is converted into an inverted voltage signal through an inverter circuit, and the inverted voltage signal is converted into a target direct current voltage signal through an inverted adder.

[0090] Specifically, the frequency-voltage conversion module comprises a comparator, an F / V converter, an inverter, and an inverted adder. The quartz crystal frequency is a sine signal, which is converted into a square wave signal through a comparator, and then converted into a direct current voltage signal through an F / V converter circuit. The input direct current voltage signal is converted into an inverted voltage signal output through an inverter circuit. The inverted voltage signal output and a reference voltage Vref are subjected to an addition operation. A target direct current voltage signal meeting the condition is output through the function of the addition operation circuit and the adjustment of the size of the reference voltage Vref, so as to control the rotating speed of the fan through the target direct current voltage signal.

[0091] The comparator converts the input frequency sine signal into a square wave signal, which can be realized by using a zero-crossing comparator. The input voltage is vi, and the reference voltage is 0. When the input voltage crosses zero each time, the output voltage will jump, thereby converting the sine signal into a square wave signal.

[0092] Step S32, the inverted voltage signal and a reference voltage signal are subjected to an addition operation through the inverted adder, and the size of the reference voltage is adjusted through an addition operation circuit, so as to output a target direct current voltage signal for controlling the rotating speed of the fan.

[0093] Step S33, the vibration frequency signal is converted into a target direct current voltage signal through an integrated chip and a frequency-voltage conversion circuit.

[0094] Specifically, the LM331 is an integrated chip with high cost performance. The function of frequency-voltage conversion can be realized through simple peripheral circuit configuration, and the conversion precision is high. Figure 4For the circuit diagram of the frequency-voltage conversion circuit, when pin 7 inputs a positive voltage Vi, the input comparator outputs a high level, the R-S flip-flop is set, the Q terminal outputs a high level, the output drive tube T1 is turned on, and pin 3 outputs a low level. At the same time, the mirror current source is connected to pin 1 to charge the capacitor CL. At this time, since the reset transistor is cut off, the power supply VCC charges the capacitor Ct through the resistor Rt. When the voltage across the capacitor Ct is higher than 2 / 3VCC and the voltage of pin 6 is greater than that of pin 7, the timing comparator outputs a high level, the R-S flip-flop is reset, the Q terminal outputs a low level, the output drive tube is cut off, and pin 3 outputs a high level under the action of the pull-up power supply. At the same time, the reset transistor is turned on, and the capacitor Ct is discharged. At this time, the current switch is turned to the other side, and the capacitor CL is discharged through the resistor RL. When the voltage across the capacitor CL is less than or equal to the input voltage Vi, the input comparator outputs a high level again, the R-S flip-flop is set, and the cycle is repeated to form self-excitation. When the voltage of pin 5 is higher than 2 / 3VCC, if the voltage of pin 7 is greater than that of pin 6, the flip-flop will not be reset, and the voltage of pin 6 will continue to rise until the voltage of pin 7 is lower than that of pin 6. This condition is usually used for start-up conditions or input signal overload. When the input signal is overloaded, the frequency output is 0. When the input signal returns to normal, the output frequency will work normally.

[0095] Wherein, the input comparator in-phase input end is Vi. i is provided by the mirror current source, and the size is determined by the reference voltage 1.90V of the energy gap reference circuit and the external resistor RS.

[0096] The relationship between the output voltage Vi and the input signal frequency F0 can be approximately expressed as:

[0097] Vi=(2.1RLRtCtF0) / (Rs)

[0098] When the sizes of RL, Rt, Ct and RS are certain, the input signal frequency F0 is in a proportional relationship with the output voltage Vi, and the V / F conversion is realized.

[0099] Step S4, adjusting the rotating speed of the fan according to the target direct current voltage signal, and dissipating heat of the components of the heat generating module.

[0100] Specifically, when the mainboard temperature rises, the quartz crystal vibration frequency rises, the direct current voltage signal input to the fan module also rises, the fan rotating speed rises, and the heat dissipation is accelerated; when the mainboard temperature decreases, the fan rotating speed decreases, and the whole heat dissipation system dynamically adjusts in real time to stabilize the temperature in a reasonable range.

[0101] It can be understood that the application solves the problems of low measurement accuracy and low linearity and poor stability of ordinary temperature sensors in the server heat dissipation system. The quartz crystal has the following advantages compared with ordinary temperature sensors: 1. high resolution, temperature accuracy can reach 0.0001 DEG C; 2. high accuracy, within the range of-50 DEG C to 120 DEG C, the measurement error is ± 0.05 DEG C; 3. good stability, the annual change range is within 0.02 DEG C, and it can work reliably and stably for a long time; 4. small thermal hysteresis error, which can quickly respond to the change of temperature in real time and adjust the heat dissipation strategy in time; 5. through a special crystal cut type, very high temperature frequency linearity can be achieved; 6. because the crystal output is frequency, the subsequent measurement and processing circuit design is convenient, simple, and can not be affected by the drift and dialing of the amplifier, and the temperature measurement signal can be conveniently transmitted over a long distance.

[0102] The application converts the crystal output frequency into a fan speed voltage signal through the frequency-voltage conversion module, and then directly adjusts the speed of the fan, which does not depend on BMC, simplifies the heat dissipation process, improves the reliability and stability of the system, and reduces the research and development cost.

[0103] The heat dissipation method provided by the embodiments of the application can also be improved and optimized without departing from the technical scheme of the application, and these improvements and optimizations should also be considered as the protection scope of the application.

[0104] At the same time, due to the stable physical and chemical properties of the quartz crystal, the heat dissipation method can also be applied to other heat dissipation scenes such as immersion liquid cooling.

[0105] The technical scheme disclosed by the embodiments of the application has the following beneficial effects:

[0106] The technical scheme disclosed by the embodiments of the application does not depend on BMC for signal processing and transmission, and when BMC fails, the heat dissipation system can still operate independently and stably, avoids the abnormality and even downtime of the server caused by overheating due to the fan stop, and also avoids the increase of power consumption and noise pollution caused by the full-speed operation of the fan. Compared with the traditional design scheme, the circuit is simplified, the cost is reduced, and the stability and reliability of the heat dissipation system are improved.

[0107] The technical scheme disclosed by the embodiments of the application utilizes the temperature-frequency characteristics of the quartz crystal, adopts a suitable cut type to make the temperature-frequency characteristics have very high linearity, converts the change of the component temperature into a voltage signal for controlling the speed of the fan in real time, and realizes the precise, stable and efficient operation of the server heat dissipation system.

[0108] Embodiment three

[0109] The application provides a computer device, comprising a memory, a processor and a computer program stored in the memory and executable on the processor, and the processor can execute the following heat dissipation method when executing the computer program:

[0110] obtain temperature information of the component of the heat generating module;

[0111] convert the temperature information of the component of the heat generating module into a vibration frequency signal through the quartz crystal according to the temperature information of the component of the heat generating module;

[0112] convert the vibration frequency signal into a target direct current voltage signal;

[0113] adjust the rotating speed of the fan according to the target direct current voltage signal to dissipate heat of the component of the heat generating module.

[0114] The technical scheme provided by the embodiment of the application has the following beneficial effects:

[0115] The technical scheme disclosed by the embodiment of the application does not rely on BMC for signal processing and transmission, and the heat dissipation system can still independently and stably operate when BMC fails, thereby avoiding abnormality and even downtime of the server caused by overheating due to fan stop, and avoiding power consumption increase and noise pollution caused by full-speed operation of the fan. Compared with the traditional design scheme, the circuit is simplified, the cost is reduced, and the stability and reliability of the heat dissipation system are improved.

[0116] Embodiment four

[0117] The application provides a heat dissipation device, as shown in the figure, the device comprises a preprocessing module, an acquisition module, a conversion module and a heat dissipation module. Figure 5

[0118] In the embodiment, the preprocessing module is used for arranging the quartz crystal at the position of the temperature detecting component of the heat generating module, and applying voltage excitation to the quartz crystal through the frequency-voltage conversion module;

[0119] The acquisition module is used for obtaining the temperature information of the component of the heat generating module;

[0120] The conversion module is used for converting the temperature information of the component of the heat generating module into a vibration frequency signal through the quartz crystal according to the temperature information of the component of the heat generating module;

[0121] The vibration frequency signal is converted into a target direct current voltage signal;

[0122] The heat dissipation module is used for adjusting the rotating speed of the fan according to the target direct current voltage signal to dissipate heat of the component of the heat generating module.

[0123] ​In the embodiment, the conversion module is used for converting the temperature information of the heat module component into a vibration frequency signal through a formula f=f0(1+Tf (1) (t-t0)+Tf (2) (t-t0) 2 +Tf (3) (t-t0) 3 .

[0124] In the embodiment, the conversion module is further used for setting the cut type of the quartz crystal as an LC cut type.

[0125] The detection temperature of the heat module to be detected is corrected through a segmented linear correction mode of the frequency-voltage conversion module.

[0126] In the embodiment, the conversion module is further used for converting the sinusoidal vibration frequency signal into a square wave signal through a comparator, converting the square wave signal into a direct current voltage signal through an F / V converter, converting the direct current voltage signal into an inverted voltage signal through an inverter circuit, and converting the inverted voltage signal into a target direct current voltage signal through an inverted adder.

[0127] In the embodiment, the conversion module is used for performing an addition operation on the inverted voltage signal and a reference voltage signal through the inverted adder, adjusting the size of the reference voltage through an addition operation circuit, and outputting a target direct current voltage signal for controlling the rotation speed of the fan.

[0128] In the embodiment, the conversion module is further used for converting the vibration frequency signal into a target direct current voltage signal through an integrated chip and a frequency-voltage conversion circuit.

[0129] The technical scheme provided by the embodiment has the following beneficial effects:

[0130] The technical scheme disclosed by the embodiment utilizes the temperature-frequency characteristic of the quartz crystal, collects the temperature information of the heat module component in real time, and converts the temperature information into a control signal of the rotation speed of the fan.

[0131] The technical scheme disclosed by the embodiment does not rely on BMC for signal processing and transmission, and the heat dissipation system can still operate independently and stably when the BMC fails, avoiding abnormality and even downtime of the server caused by overheating due to the fan stopping, and avoiding the increase of power consumption and noise pollution caused by the full-speed operation of the fan.

[0132] Embodiment Five

[0133] The application provides a computer storage medium, comprising a memory, a processor and a computer program stored in the memory and executable on the processor, and the processor implements the following steps when executing the computer program:

[0134] obtain temperature information of the component of the heat generating module;

[0135] convert the temperature information of the component of the heat generating module into a vibration frequency signal through the quartz crystal according to the temperature information of the component of the heat generating module;

[0136] convert the vibration frequency signal into a target direct current voltage signal;

[0137] adjust the rotating speed of the fan according to the target direct current voltage signal to dissipate heat of the component of the heat generating module.

[0138] In some embodiments, the obtaining of the temperature information of the component of the heat generating module comprises:

[0139] arrange the quartz crystal at the position of the component of the heat generating module to be detected, and apply a voltage excitation to the quartz crystal through the frequency-voltage conversion module.

[0140] In some embodiments, the converting of the temperature information of the component of the heat generating module into a vibration frequency signal through the quartz crystal according to the temperature information of the component of the heat generating module comprises:

[0141] convert the temperature information of the component of the heat generating module into a vibration frequency signal through the formula f=f0(1+Tf (1) (t-t0)+Tf (2) (t-t0) 2 +Tf (3) (t-t0) 3 );

[0142] wherein f is the current frequency of the quartz crystal, f0 is the initial frequency of the quartz crystal, Tf (1) , Tf (2) , and Tf (3) are the first, second and third order temperature frequency coefficients of the quartz crystal respectively, t is the current temperature of the component of the heat generating module, and t0 is the initial temperature of the component of the heat generating module.

[0143] In some embodiments, the method comprises:

[0144] arrange the cut type of the quartz crystal as an LC cut type;

[0145] correct the detection temperature of the component of the heat generating module to be detected through a segmented linear correction mode of the frequency-voltage conversion module.

[0146] In some embodiments, the converting the vibration frequency signal into a target direct current voltage signal comprises:

[0147] The sine vibration frequency signal is converted into a square wave signal through a comparator, the square wave signal is converted into a direct current voltage signal through an F / V converter, the direct current voltage signal is converted into an inverted voltage signal through an inverter circuit, and the inverted voltage signal is converted into a target direct current voltage signal through an inverting adder.

[0148] In some embodiments, the converting the inverted voltage signal into a target direct current voltage signal through the inverting adder comprises:

[0149] The inverted voltage signal is added to a reference voltage signal through the inverting adder, the size of the reference voltage is adjusted through an adding operation circuit, and a target direct current voltage signal for controlling the rotation speed of the fan is output.

[0150] In some embodiments, the converting the vibration frequency signal into a target direct current voltage signal further comprises:

[0151] The vibration frequency signal is converted into a target direct current voltage signal through an integrated chip and a frequency-voltage conversion circuit.

[0152] Figure 6 An exemplary system that can be used to implement various embodiments described herein is provided for embodiment five of the present application;

[0153] As shown in Figure 6 some embodiments, a system can be used as the above-mentioned device for heat dissipation in any of the embodiments. In some embodiments, the system can include one or more computer-readable media (e.g., system memory or NVM / storage) having results and one or more processors (e.g., processor(s)) coupled to the one or more computer-readable media and configured to execute the results to implement modules to perform the actions described herein.

[0154] The technical solutions provided by the embodiments of the present application have the following beneficial effects:

[0155] The technical solutions disclosed by the embodiments of the present application do not rely on BMC for signal processing and transmission, and the heat dissipation system can still operate independently and stably when BMC fails, avoiding abnormality and even downtime of the server due to overheating caused by fan stop, and avoiding increased power consumption and noise pollution caused by full-speed operation of the fan. Compared with the traditional design scheme, the circuit is simplified, the cost is reduced, and the stability and reliability of the heat dissipation system are improved.

[0156] The technical scheme disclosed by the embodiment of the application utilizes the temperature-frequency characteristic of a quartz crystal, adopts a suitable cut type to make the temperature-frequency characteristic have extremely high linearity, converts the change of the temperature of a component into a voltage signal for controlling the rotating speed of a fan in real time, and realizes the precise, stable and efficient operation of a server heat dissipation system.

[0157] Embodiment six

[0158] The electronic device can be a server, and the electronic device comprises a heat dissipation system, the heat dissipation system comprising a heat generating module, a quartz crystal, a frequency-voltage conversion module, a fan module,

[0159] The output end of the heat generating module is connected to the first input end of the quartz crystal, the output end of the quartz crystal is connected to the input end of the frequency-voltage conversion module, the first output end of the frequency-voltage conversion module is connected to the second input end of the quartz crystal, and the second output end of the frequency-voltage conversion module is connected to the input end of the fan module.

[0160] The quartz crystal is used to convert the temperature information of the heat generating module component into a vibration frequency signal.

[0161] The frequency-voltage conversion module is used to convert the vibration frequency signal into a target direct current voltage signal.

[0162] In some embodiments, the frequency-voltage conversion module comprises a comparator, an F / V converter, an inverter, and an inverting adder,

[0163] The output end of the comparator is connected to the input end of the F / V converter, the output end of the F / V converter is connected to the input end of the inverter, and the output end of the inverter is connected to the input end of the inverting adder.

[0164] The input end of the comparator serves as the input end of the frequency-voltage conversion module, and the output end of the inverting adder serves as the second output end of the frequency-voltage conversion module.

[0165] The inverting adder is used to perform an addition operation on the inverted voltage signal output by the inverter and a reference voltage signal, adjust the size of the reference voltage through an addition operation circuit, and output a target direct current voltage signal for controlling the rotating speed of the fan.

[0166] The technical scheme disclosed by the embodiment of the application converts the crystal output frequency into a voltage signal for controlling the rotating speed of the fan through the frequency-voltage conversion module, and then directly adjusts the rotating speed of the fan, which does not depend on the BMC, simplifies the heat dissipation process, improves the reliability and stability of the system, and reduces the research and development cost.

[0167] All the optional technical solutions above can be combined to form optional embodiments of the present application, and will not be described one by one here.

[0168] Although the preferred embodiments in the present application have been described, those skilled in the art can make further changes and modifications to the embodiments once they know the basic inventive concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the embodiments of the present application.

[0169] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application is also intended to include these modifications and variations.

[0170] The above description is only the preferred embodiments of the present application, and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

[0171] The contents not described in detail in the present specification belong to the prior art known to those skilled in the art.

Claims

1. A heat dissipation system, characterized in that, The heat dissipation system includes a heat-generating module, a quartz crystal, a frequency-to-voltage conversion module, and a fan module. The output terminal of the heating module is connected to the first input terminal of the quartz crystal, the output terminal of the quartz crystal is connected to the input terminal of the frequency-voltage conversion module, the first output terminal of the frequency-voltage conversion module is connected to the second input terminal of the quartz crystal, and the second output terminal of the frequency-voltage conversion module is connected to the input terminal of the fan module. The quartz crystal is used to convert the temperature information of the heating module component into a vibration frequency signal; The frequency-to-voltage conversion module is used to convert the vibration frequency signal into a target DC voltage signal; The frequency-to-voltage conversion module includes a comparator, an F / V converter, an inverter, and an inverting adder. The output of the comparator is connected to the input of the F / V converter, the output of the F / V converter is connected to the input of the inverter, and the output of the inverter is connected to the input of the inverting adder. The input terminal of the comparator serves as the input terminal of the frequency-to-voltage conversion module, and the output terminal of the inverting adder serves as the second output terminal of the frequency-to-voltage conversion module. The inverter adder is used to add the inverted voltage signal output by the inverter to the reference voltage signal. The magnitude of the reference voltage is adjusted by the addition circuit, and a target DC voltage signal for controlling the fan speed is output. The step of converting the temperature information of the heating module component into a vibration frequency signal includes: Using the formula f=f0(1+Tf) (1) (t-t0)+Tf (2) (t-t0) 2 +Tf (3) (t-t0) 3 The temperature information of the heating module component is converted into a vibration frequency signal; Where f is the current frequency of the quartz crystal, f0 is the initial frequency of the quartz crystal, and Tf (1) ,Tf (2) ,Tf (3) These represent the 1st, 2nd, and 3rd order temperature frequency coefficients of the quartz crystal, respectively; t is the current temperature of the heating module component; t0 is the initial temperature of the heating module component; Tf (1) The value is greater than Tf (2) ,Tf (3) The value of Tf (2) ,Tf (3) =0.

2. A heat dissipation method, applied to the heat dissipation system as described in claim 1, characterized in that, The method includes: Obtain the temperature information of the heating module component; The temperature information of the heating module component is converted into a vibration frequency signal through the quartz crystal. The vibration frequency signal is converted into a target DC voltage signal; The fan speed is adjusted according to the target DC voltage signal to dissipate heat from the components of the heat-generating module.

3. The heat dissipation method according to claim 2, characterized in that, Before obtaining the temperature information of the heating module component, the following steps are included: A quartz crystal is placed at the position of the temperature-to-be-detected component in the heating module, and a voltage excitation is applied to the quartz crystal through the frequency-voltage conversion module.

4. The heat dissipation method according to claim 2, characterized in that, The method includes: The quartz crystal is cut into an LC cut. The detection temperature of the component to be detected in the heating module is corrected by the piecewise linear correction method of the frequency-voltage conversion module.

5. The heat dissipation method according to claim 2, characterized in that, The step of converting the vibration frequency signal into a target DC voltage signal includes: The sinusoidal vibration frequency signal is converted into a square wave signal by a comparator, the square wave signal is converted into a DC voltage signal by an F / V converter, the DC voltage signal is converted into an inverted voltage signal by an inverter circuit, and the inverted voltage signal is converted into the target DC voltage signal by an inverting adder.

6. The heat dissipation method according to claim 5, characterized in that, The step of converting the inverted voltage signal into a target DC voltage signal using an inverting adder includes: The inverting adder adds the inverted voltage signal to the reference voltage signal, and the addition circuit adjusts the magnitude of the reference voltage to output a target DC voltage signal that controls the fan speed.

7. The heat dissipation method according to claim 2, characterized in that, The step of converting the vibration frequency signal into a target DC voltage signal further includes: The vibration frequency signal is converted into a target DC voltage signal using an integrated chip and a frequency-to-voltage conversion circuit.

8. An electronic device, characterized in that, The electronic device includes the heat dissipation system as described in claim 1.

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