A method for detecting polishing carriers and fly-through blades

Abstract

This application relates to the field of semiconductor polishing technology, and in particular to a polishing carrier, comprising: a carrier body, the carrier body including: a first seat having a first air channel; a second seat stacked on top of the first seat and located directly below the first seat, forming a first cavity between the second seat and the first seat, the first cavity communicating with the first air channel; the second seat and the first seat being movably connected, such that the volume of the first cavity is variable; and a detection component, the detection component including: a pressure sensor housed within the first cavity, the pressure sensor being used to monitor changes in air pressure within the first cavity. This solves the technical problem of inaccurate identification and timely response to flyaway wafers during the polishing process, achieving the technical effect of accurate identification and timely response to flyaway wafers.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor polishing, in particular to a polishing carrier and a flying piece detection method. BACKGROUND

[0002] Polishing plays an important role in semiconductor processing technology. Polishing can realize mirrorization of the polishing piece and improve the flatness of the polishing piece. It can also remove the damage caused by the previous process step to the surface of the polishing piece to a certain extent.

[0003] In the prior art, the polishing piece is prone to cracking or fragmentation during the polishing process due to uneven pressure or its own properties. Once cracking or fragmentation occurs, the adsorption effect between the polishing head and the polishing piece is destroyed, and the polishing piece fragments are easily thrown out during the rotation of the polishing head due to centrifugal force, i.e., the flying piece phenomenon occurs. The thrown-out fragments are retained on the polishing disc, which may cause damage to other polishing heads. Therefore, the polishing process needs to be stopped in time to remove the polishing piece fragments. At present, for such flying piece situations, manual observation or real-time monitoring by a vision module is required, which results in high dependence on manpower or errors in judgment by the vision module, which is not conducive to accurate identification and timely response to the flying piece situation.

[0004] Therefore, the technical problem of the prior art is that the flying piece situation cannot be accurately identified and timely responded to during the polishing process. SUMMARY

[0005] The present application provides a polishing carrier and a flying piece detection method, which solves the technical problem that the flying piece situation cannot be accurately identified and timely responded to during the polishing process, and achieves the technical effect of accurate identification and timely response to the flying piece situation.

[0006] In one aspect, the present application provides a polishing carrier, which adopts the following technical solution:

[0007] A polishing carrier, comprising: a carrier body, the carrier body comprising: a first seat, the first seat having a first air channel; a second seat, the second seat being stacked with the first seat and being located directly below the first seat, a first cavity being formed between the second seat and the first seat, the first cavity being in communication with the first air channel; the second seat and the first seat being movably connected, so that the volume of the first cavity is variable; a detection assembly, the detection assembly comprising: a pressure sensor, the pressure sensor being accommodated in the first cavity, the pressure sensor being used to monitor the change of air pressure in the first cavity.

[0008] Preferably, the outer ring of the first seat has a first connecting portion, the outer ring of the second seat has a second connecting portion, and a sealing assembly is arranged between the first connecting portion and the second connecting portion, the sealing assembly comprising: a sealing ring embedded in the first connecting portion and abutting against the second connecting portion, so that the first cavity is sealed; or the sealing assembly comprises: a sealing ring embedded in the second connecting portion and abutting against the first connecting portion, so that the first cavity is sealed.

[0009] Preferably, the second seat is connected to the first seat in a sliding manner, and the sliding direction is perpendicular to the plane on which the wafer to be thrown is located.

[0010] Preferably, a limiting groove is arranged on the bottom surface of the first seat, and a limiting assembly is arranged between the first seat and the second seat, the limiting assembly comprising: a limiting portion fixedly connected to the second seat, the limiting portion being accommodated in the limiting groove, the limiting portion being used to abut and cooperate with the limiting groove, so that the movement of the second seat is limited, and the limiting groove has a movement space for the limiting portion to move in a direction perpendicular to the plane on which the wafer to be thrown is located; or a limiting groove is arranged on the top surface of the second seat, and a limiting assembly is arranged between the first seat and the second seat, the limiting assembly comprising: a limiting portion fixedly connected to the first seat, the limiting portion being accommodated in the limiting groove, the limiting portion being used to abut and cooperate with the limiting groove, so that the movement of the second seat is limited, and the limiting groove has a movement space for the limiting portion to move in a direction perpendicular to the plane on which the wafer to be thrown is located.

[0011] Preferably, a linear bearing is connected between the first seat and the second seat, and the arrangement direction of the linear bearing is perpendicular to the plane on which the wafer to be thrown is located.

[0012] Preferably, the linear bearing has a plurality of linear bearings, and the linear bearings are centrally symmetrically distributed about the rotation center of the carrier.

[0013] Preferably, the second seat has a detection portion, and the detection portion is located outside the first seat; the detection assembly further comprises: a laser sensor located outside the carrier, the laser sensor being located above the detection portion, and the laser sensor being used to monitor the position change of the detection portion.

[0014] Preferably, the detection portion and the detection assembly each have a plurality of detection portions and detection assemblies, the detection portions and the detection assemblies are one-to-one corresponding, and the detection portions and the detection assemblies are centrally symmetrically distributed about the rotation center of the carrier.

[0015] As preferred, the second seat comprises: a second seat body, a bottom surface of the second seat body having a concave surface, an outer ring of the second seat body having a fixing ring; a soft base pad, the soft base pad being wrapped on the concave surface of the second seat body, so that a second cavity is formed between the concave surface and the soft base pad; and a pressing plate, the pressing plate being located at an inner ring of the fixing ring, and the pressing plate being located below the soft base pad; wherein a second air passage is formed on the second seat body, the second air passage being in communication with the second cavity, and when the second cavity is filled with pressure, the soft base pad is in contact with the pressing plate.

[0016] In another aspect, the application provides a flying piece detection method of a polishing carrier, which adopts the following technical scheme:

[0017] A flying piece detection method of a polishing carrier is used to detect whether a flying piece occurs in the polishing process of the polishing carrier, comprising: setting a maximum value P of air pressure fluctuation in a first cavity max ; monitoring a pressure value P in the first cavity in real time; judging the monitored pressure value P and the maximum value P max of air pressure fluctuation: if P>P max , it is judged that a flying piece occurs in the polishing process.

[0018] As preferred, it further comprises: setting a maximum value H of displacement fluctuation of a detection part in a direction perpendicular to a plane where the to-be-polished piece is located max ; monitoring a displacement value H of the detection part in the direction perpendicular to the plane where the to-be-polished piece is located in real time; judging the monitored displacement value H and the maximum value H max of displacement fluctuation: if H>H max , and P>P max , it is judged that a flying piece occurs in the polishing process.

[0019] In summary, the application has at least one of the following beneficial technical effects:

[0020] 1. In the application, the first seat and the second seat of the polishing carrier are movably connected and a first cavity is formed between the two, by filling the first cavity with pressure and acting on the second seat, the movable connection structure between the first seat and the second seat absorbs the fluctuation generated in the polishing process, and the polished piece is subjected to stable pressure to reduce the occurrence of flying pieces; the detection assembly monitors the air pressure fluctuation in the first cavity, and timely feedback is made when it is judged that a flying piece occurs, corresponding shutdown measures are taken, the technical problems of inaccurate identification and timely response of flying pieces in the polishing process are solved, and the technical effects of accurate identification and timely response of flying pieces are achieved.

[0021] 2、The first seat and the second seat are slidable in the direction perpendicular to the plane of the wafer to be polished by the linear bearing, which not only can absorb the fluctuation generated in the polishing process to improve the polishing quality of the wafer, but also can guide the displacement direction of the second seat, so that the second seat can only be displaced in the vertical direction and cannot be tilted in the horizontal direction. In this way, the second seat has greater rigidity to resist the overturning moment exerted by the polishing pad on the second seat, reduces the angle between the second seat and the polishing pad, and reduces the possibility of the wafer flying out from between the second seat and the polishing pad.

[0022] 3、The detection assembly can improve the accuracy of detection of the flying-out condition of the wafer by monitoring the air pressure in the first cavity and the displacement of the detection part, and comprehensively judging whether the wafer flies out according to the two groups of monitoring indexes.

[0023] 4、The pressure plate in the second seat is in contact with the soft base pad, and the soft base pad can uniformly press the upper surface of the pressure plate after being inflated by the pressure in the second cavity. The pressure is transmitted to the wafer by the pressure plate, and the pressure distribution is uniform without bias, which improves the flatness of the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 is a schematic view of the polishing carrier described in the present application;

[0025] Figure 2 、 3 is a sectional view of Figure 1 ;

[0026] Figure 4 is an enlarged view of A in Figure 3 ;

[0027] Figure 5 is an enlarged view of B in Figure 3 ;

[0028] Figure 6 is a first flowchart of the wafer flying-out detection method of the polishing carrier described in the present application;

[0029] Figure 7 is a second flowchart of the wafer flying-out detection method of the polishing carrier described in the present application.

[0030] Explanation of reference signs: 100, first seat; 110, first air channel; 120, first cavity; 130, first connecting part; 140, limiting groove; 200, second seat; 210, second seat body; 211, second air channel; 212, fixing ring; 220, soft base pad; 230, pressing plate; 240, second cavity; 250, second connecting part; 300, connecting assembly; 310, linear bearing; 400, sealing assembly; 410, sealing ring; 500, limiting assembly; 510, limiting part; 600, detection assembly; 610, laser sensor; 620, detection part; W, polishing piece; M, polishing pad. DETAILED DESCRIPTION

[0031] The serial numbers of components used herein, such as "first", "second", etc., are only used to distinguish the described objects and do not have any sequential or technical meaning. The "connection" and "coupling" mentioned in the present application include direct and indirect connection (coupling) unless otherwise specified. In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0032] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be direct contact between the first and second features, or indirect contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0033] The embodiments of the present application provide a polishing carrier and a flying piece detection method, which solve the technical problem that the flying piece situation cannot be accurately identified and timely responded to in the polishing process, and achieve the technical effect of accurate identification and timely response to the flying piece situation.

[0034] In order to better understand the above technical solutions, the above technical solutions will be described in detail below in combination with the drawings of the specification and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application.

[0035] The present application provides a polishing carrier, as shown inFigure 1 As shown, the polishing carrier has the effect of reducing the flying off of the polishing blade W or providing timely feedback after it flies off. The polishing carrier includes a carrier body and a detection component 600. The carrier body is used to adsorb the polishing blade W and serve as the polishing head during the polishing process. The detection component 600 is used to detect whether the polishing blade W has flown off.

[0036] The main body of the carrier, such as Figure 1 , 2 As shown, the carrier body is used to adsorb the polishing disc W, which serves as the polishing head during the polishing process. The carrier body includes a first seat 100, a second seat 200, a connecting component 300, a sealing component 400, and a limiting component 500; the first seat 100 and the second seat 200 are stacked together to form the carrier body; the second seat 200 is used to connect the polishing disc W; the connecting component 300 is used to connect the first seat 100 and the second seat 200, allowing them to move between each other; the sealing component 400 is used to seal the interior of the first seat 100 and the second seat 200; and the limiting component 500 is used to limit the displacement between the second seat 200 and the first seat 100.

[0037] The first one is 100, such as Figure 2 , 3 As shown, the first seat 100 and the second seat 200 are stacked together to form the carrier body. The first seat 100 is located directly above the second seat 200. The interior of the first seat 100 is recessed, so that the first seat 100 and the second seat 200 are stacked and connected to form a first cavity 120 between the first seat 100 and the second seat 200. A first air passage 110 is provided on the first seat 100, which communicates with the first cavity 120. The first air passage 110 can pressurize or depressurize the first cavity 120, so that the air pressure in the first cavity 120 is adjustable. It can be understood that the top of the rotation center of the first seat 100 is connected to a rotating shaft. By rotating, the first seat 100 and the second seat 200 are driven to rotate, thereby driving the throwing plate W to rotate. In one embodiment, the first air passage 110 is opened in the rotating shaft.

[0038] The second one is 200, such as Figures 2-4As shown, the second seat 200 and the first seat 100 are stacked together to form the carrier body, and the second seat 200 is used to connect the spade W. The second seat 200 is located directly below the first seat 100. The outer ring of the first seat 100 has a first connecting portion 130, and the outer ring of the second seat 200 has a second connecting portion 250. The first connecting portion 130 covers the outer ring of the second connecting portion 250. The second seat 200 is connected to the bottom surface of the first seat 100 through a connecting component 300, thereby forming a first cavity 120 between the first seat 100 and the second seat 200. The sealing of the first cavity 120 is ensured by providing a sealing component 400 between the first seat 100 and the second seat 200. The second seat 200 includes a main body, a soft base pad 220, and a pressure plate 230. The main body of the second seat 200 is connected to the bottom of the first seat 100 via a connecting assembly 300. The bottom surface of the main body of the second seat 200 has a concave surface, which is evenly distributed on the bottom surface of the main body of the second seat 200 and is centrally symmetrical about the rotation center of the second seat 200 to improve the uniformity of pressure applied to the throwing plate W. The soft base pad 220 covers the bottom of the main body of the second seat 200, that is, the soft base pad 220 covers the concave surface, so that a second cavity 240 is formed between the soft base pad 220 and the concave surface. The main body of the second seat 200 has a second air passage 211, through which air is supplied to the first seat 100. The two chambers 240 are pressurized or depressurized to adjust the pressure on the polishing plate W. In one embodiment, the second air passage 211 is opened at the rotation center of the main body of the second seat 200 and passes through the rotating shaft through a connector. The pressure plate 230 is located below the soft base pad 220 and is used to connect the polishing plate W. It is worth noting that the bottom edge of the main body of the second seat 200 has a fixing ring 212 and the pressure plate 230 is located in the inner ring of the fixing ring 212. In this way, the soft base pad 220 expands under pressure and acts evenly on the pressure plate 230. The pressure plate 230 acts on the polishing plate W, making the pressure on the polishing plate W more uniform. In one embodiment, the pressure plate 230 can be a ceramic disc.

[0039] It is worth noting that in the chemical mechanical polishing process of polishing plate W, there are generally two mainstream processing methods: one is to use one or more air pressure chambers to apply pressure to polishing plate W through air bags, and the other is to use a ceramic disc as a medium to apply pressure to polishing plate W. From a practical application perspective, both methods have some drawbacks. The surface of the polished wafer W, produced by airbag pressure polishing, often exhibits a wavy morphology, making it difficult to achieve high flatness requirements. Due to its high rigidity and flatness, the ceramic disc undergoes minimal deformation during the polishing process, and the morphology of the polished wafer W can, to some extent, "imprint" its quality. However, it can also lead to significant differences in the amount of material removed in the circumferential direction of the polished wafer W due to a certain degree of eccentricity in the force applied to the ceramic disc, or over-polishing or under-polishing of the edges of the polished wafer due to the inability to adjust the pressure distribution at the edges of the polished wafer W. In this application, the soft base pad 220 expands under pressure and acts uniformly on the pressure plate 230. The pressure transmitted to the silicon wafer through the pressure plate 230 is uniformly distributed with almost no eccentricity, thereby ensuring the high flatness quality of the polished wafer.

[0040] Connection component 300, such as Figure 2 , 3 As shown, the connecting component 300 is used to connect the first seat 100 and the second seat 200. The connecting component 300 is positioned between the first seat 100 and the second seat 200, allowing the first seat 100 and the second seat 200 to move together. By pressurizing or depressurizing the first cavity 120, the force exerted by the fixing ring 212 of the second seat 200 on the polishing pad M can be adjusted. Conversely, when the air pressure in the first cavity 120 remains constant, during the polishing process, the upward displacement of the second seat 200 can compress the air pressure in the first cavity 120, thereby increasing the air pressure in the first cavity 120. Specifically, the connecting component 300 is positioned between the bottom surface of the first seat 100 and the top surface of the second seat 200, allowing the second seat 200 to move relative to the first seat 100, thereby causing changes in the volume of the first cavity 120 or changes in the air pressure within the first cavity 120.

[0041] In one embodiment, the second seat 200 is slidably connected to the bottom surface of the first seat 100 via a connecting component 300, and the sliding direction is perpendicular to the plane where the piece to be fired W is located, i.e., in the vertical direction. Thus, the second seat 200 can be displaced vertically relative to the first seat 100. In one embodiment, the connecting component 300 is a linear bearing 310, which is connected between the bottom surface of the first seat 100 and the top surface of the second seat 200. There are multiple linear bearings 310, which are centrally symmetrically distributed about the rotation center of the carrier body. Thus, under the action of the linear bearings 310... This design enables the second seat 200 to move vertically relative to the first seat 100, absorbing the fluctuations caused by polishing during the polishing process. It also restricts the second seat 200 from moving horizontally or tilting relative to the first seat 100, guiding the direction of the second seat 200's displacement so that it can only move vertically and cannot move horizontally to avoid tilting. The second seat 200 has greater rigidity to resist the overturning moment exerted by the polishing pad M on the second seat 200, reducing the angle formed between the second seat 200 and the polishing pad M, and reducing the possibility of the polishing disc W flying out between the second seat 200 and the polishing pad M.

[0042] Based on the above, the second seat 200 and the first seat 100 are movably connected by a linear bearing 310. On the one hand, the telescopic structure can absorb the fluctuations caused during the polishing process. On the other hand, it also limits the tilt angle between the second seat 200 and the polishing pad M, reducing the possibility of the polishing disc W flying out. Even if the polishing disc W flies out from between the second seat 200 and the polishing pad M, the second seat 200 is raised at the moment the polishing disc W flies out, causing the gas in the first cavity 120 to be compressed and form fluctuations. Such air pressure fluctuations are used to characterize whether the polishing disc W has flown out and to provide feedback.

[0043] Sealing component 400, such as Figure 3 , 5As shown, the sealing assembly 400 is used to seal the first cavity 120. The outer ring of the first seat 100 has a first connecting portion 130, and the outer ring of the second seat 200 has a second connecting portion 250. The first connecting portion 130 covers the outer ring of the second connecting portion 250. A sealing assembly 400 is disposed between the first connecting portion 130 and the second connecting portion 250. The sealing assembly 400 includes a sealing ring 410. The sealing ring 410 is arranged such that its center is located at the rotation center of the carrier body. The sealing ring 410 is embedded in the first connecting portion 130, and the sealing ring 410 abuts and fits against the second connecting portion 250 at all points, so that the first cavity 120 is sealed. In one embodiment, the sealing ring 410 is embedded in the second connecting portion 250, and the sealing ring 410 abuts and fits against the first connecting portion 130 at all points, so that the first sealing ring 410 is sealed. During the displacement of the second seat 200, the sealing ring 410 can also maintain contact with the second connecting portion 250 at all points, thereby maintaining the sealing of the first cavity 120.

[0044] Limiting component 500, such as Figure 2 , 3As shown, the limiting component 500 is used to limit the displacement between the second seat 200 and the first seat 100. The limiting component 500 is connected between the first seat 100 and the second seat 200, and the maximum distance between the first seat 100 and the second seat 200 is limited by the limiting component 500, that is, the maximum space of the first cavity 120 is limited. In this embodiment, a limiting groove 140 is formed on the bottom surface of the first seat 100. The limiting component 500 includes a limiting part 510, which is located within the first cavity 120 and is fixedly connected to the top surface of the second seat body 210. The limiting part 510 is accommodated in the limiting groove 140 and is used to abut against the limiting groove 140, thereby restricting the movement of the second seat 200 relative to the first seat 100. The limiting groove 140 has a space for the limiting part 510 to move in a direction perpendicular to the plane where the piece to be fired W is located. That is, when the limiting part 510 is located in the limiting groove 140, the limiting part 510 can move one distance in the vertical direction, so that the first cavity 120 has a maximum or minimum space. In one embodiment, the limiting groove 140 is formed on the top surface of the second seat body 210. 0. The limiting component 500 includes a limiting part 510, which is located in the first cavity 120 and fixedly connected to the top surface of the first seat 100. The limiting part 510 is accommodated in the limiting groove 140 and is used to abut against the limiting groove 140, thereby restricting the movement of the second seat 200 relative to the first seat 100. The limiting groove 140 has a space for the limiting part 510 to move in a direction perpendicular to the plane of the piece to be thrown W. That is, when the limiting part 510 is located in the limiting groove 140, the limiting part 510 can move one distance in the vertical direction, so that the first cavity 120 has the maximum or minimum space. In other embodiments, there are multiple limiting components 500 and corresponding limiting grooves 140, all of which are centrally symmetrically arranged about the rotation center of the carrier body.

[0045] Detection component 600, such as Figure 2 , 3 As shown, the detection component 600 is used to detect whether the throwing piece W has experienced a flying piece situation. The detection component 600 includes a pressure sensor and a laser sensor 610; the pressure sensor is used to monitor the air pressure change in the first cavity 120; the laser sensor 610 is used to monitor the position change of the second seat 200.

[0046] A pressure sensor is used to monitor changes in air pressure within the first cavity 120. The pressure sensor is located inside the first cavity 120 and monitors air pressure fluctuations in real time. When the second seat 200 moves relative to the first seat 100, the air pressure in the first cavity 120 increases due to the upward movement of the second seat 200; conversely, the air pressure decreases due to the downward movement of the second seat 200. In one embodiment, multiple pressure sensors are evenly distributed within the first cavity 120, all used to monitor and provide feedback on air pressure fluctuations within the first cavity 120. Thus, during polishing, if the polishing disc W flies out from between the second seat 200 and the polishing pad M, due to the thickness of the polishing disc W, the edge of the second seat 200 will inevitably be lifted by the polishing disc W, causing the gas in the first cavity 120 to be compressed, resulting in an increase in air pressure within the first cavity 120.

[0047] A laser sensor 610 is used to monitor the positional changes of the second seat 200. The laser sensor 610 is disposed outside the carrier body and is used to monitor the displacement fluctuations of the second seat 200. The second seat 200 has a detection unit 620, which is located outside the area covered by the first seat 100, i.e., the detection unit 620 is located on the outer surface of the second seat 200 and is planar. Furthermore, the laser sensor 610 is positioned directly above the detection unit 620, which is the object of detection by the laser sensor 610. The laser sensor 610 monitors the positional fluctuations of the detection unit 620 in real time. When the second seat 200 moves relative to the first seat 100, the position of the detection unit 620 rises with the second seat 200, and the laser sensor 610 detects this upward displacement. In one embodiment, there are multiple detection units 620 and detection components 600, with one-to-one correspondence between the detection units 620 and the detection components 600, and they are centrally symmetrically distributed about the rotation center of the carrier. Each detection component 600 is used to detect the position fluctuation of the corresponding detection unit 620 and provide feedback. Thus, during the polishing process, if the polishing disc W flies out from between the second seat 200 and the polishing pad M, due to the thickness of the polishing disc W itself, the edge of the second seat 200 will inevitably be lifted up by the polishing disc W and float upward. The position of the detection unit 620 floats up with the second seat 200, and the laser sensor 610 detects the upward displacement of the position of the detection unit 620.

[0048] The detection component 600 monitors the air pressure fluctuation in the first cavity 120 and the position fluctuation of the detection part 620 in the second seat 200 in real time. The two sets of monitoring indicators are mutually verified, so as to obtain a more accurate judgment on whether a flying piece has appeared or not.

[0049] This application also provides a method for detecting fly-off in a polishing carrier, used to detect whether fly-off occurs during the polishing process. The fly-off detection method includes: setting a maximum air pressure fluctuation P within the first cavity 120. max Real-time monitoring of the air pressure value P in the first chamber 120; comparison of the monitored air pressure value P with the maximum air pressure fluctuation value P. max If P > P max This indicates that the piece is flying off the plate (W). Figure 6 As shown, specifically:

[0050] S1: The maximum air pressure fluctuation value in the first chamber 120 is preset to P. max The maximum pressure fluctuation is P max It is set relative to the original filling pressure value P0 of the first chamber 120, and P max If, during the polishing process, the original pressure value P0 of the first chamber 120 needs to be adjusted to P1, then the corresponding maximum air pressure fluctuation value also needs to be adjusted accordingly. max1 It is understandable that P max A certain error range can also be set;

[0051] S2: During the polishing process, the pressure sensor monitors the air pressure value P in the first chamber 120 in real time;

[0052] S3: Determine the difference between the monitored air pressure value P and the maximum air pressure fluctuation value P. max :

[0053] S31: If P≤P max The air pressure in the first chamber 120 is below the maximum air pressure fluctuation value, that is, the air pressure in the first chamber 120 is kept within the normal range. The upward displacement of the second seat 200 is insufficient to throw out the throwing piece W, so it is judged that no flying piece situation has occurred.

[0054] S32: If P > P max If the air pressure in the first chamber 120 is above the maximum air pressure fluctuation value, that is, the air pressure in the first chamber 120 is outside the normal range, and the second seat 200 is displaced upward or tilted enough to throw out the polishing disc W, it is judged that a flying disc has occurred, and the polishing equipment needs to be stopped to remove the flying disc W.

[0055] Furthermore, such as Figure 7 As shown, the fly-off detection method further includes: setting the maximum displacement fluctuation H of the detection unit 620 in the direction perpendicular to the plane where the fly-off piece W is located. max ; Real-time monitoring of the displacement value of the detection unit 620 in the direction perpendicular to the plane where the piece to be polished W is located; Determining the difference between the monitored displacement value H and the maximum displacement fluctuation value H. max If H > H max And P > P maxThe judgment is that the ejector plate W has a flying plate situation; specifically:

[0056] S1': The maximum displacement fluctuation of the detection unit 620 is preset to H. max The displacement direction is perpendicular to the plane containing the piece W to be ejected, i.e., in the vertical direction; it can be understood that H max A certain error range can also be set;

[0057] S2': During the polishing process, the laser sensor 610 monitors the displacement value H of the detection unit 620 in real time;

[0058] S3': Determine whether the monitored displacement value H is equal to the maximum displacement fluctuation value H. max ;

[0059] S31': If H≤H max The displacement value of the detection unit 620 is below the maximum displacement fluctuation value, that is, the position of the detection unit 620 is kept within the normal range. The upward displacement of the second unit 200 is insufficient to throw out the throwing piece W, so it is judged that no flying piece situation has occurred.

[0060] S32': If H > H max If the displacement value of the detection unit 620 is above the maximum displacement fluctuation value, that is, the position of the detection unit 620 is outside the normal range, and the second seat 200 is displaced upward or tilted enough to throw out the polishing piece W, it is judged that a flying piece has occurred, and the polishing equipment needs to be stopped to remove the flying polishing piece W.

[0061] In one embodiment, the pressure fluctuation detection process of the first cavity 120 and the displacement fluctuation detection process of the detection unit 620 are performed simultaneously. The two detection indicators are used to comprehensively determine whether a flying disc situation has occurred, that is, when H > H max And P > P max Only then was it determined that the piece was flying off the plate (W).

[0062] In other embodiments, when the displacement of the detection unit 620 is the same, and H≤H max In the case where the second chamber 200 is vertically displaced upwards as a whole, compared to when it tilts, the compression of the first chamber 120 is greater, meaning the pressure increase within the first chamber 120 is larger. This triggers feedback from the pressure sensor, i.e., H ≤ H. max And P > P max At this point, it is determined that there is no flying piece, but rather a false trigger caused by the vibration of the polishing disc or the overall vibration of the polishing head, thus improving the accuracy of flying piece detection.

[0063] Working principle / steps:

[0064] The pressure inside the first cavity 120 acts on the edge of the second seat 200, and the edge of the second seat 200 acts downward on the polishing pad M to prevent the polishing disc W from flying out. The second seat 200 and the first seat 100 are movably connected by a linear bearing 310, which is used to absorb a certain amount of vibration during the polishing process and guide the movement of the first seat 100. The second seat 200 has greater rigidity to resist the overturning moment exerted by the polishing pad M on the second seat 200, reduce the angle formed between the second seat 200 and the polishing pad M, and reduce the possibility of the polishing disc W flying out from between the second seat 200 and the polishing pad M.

[0065] The detection component 600 monitors the air pressure fluctuation in the first cavity 120 and the position fluctuation of the detection unit 620 of the second seat 200 in real time. The air pressure value P in the first cavity 120 is monitored in real time, and the monitored air pressure value P is compared with the maximum air pressure fluctuation value P. max ; Real-time monitoring of the displacement value of the detection unit 620 in the direction perpendicular to the plane where the piece to be polished W is located; Determining the difference between the monitored displacement value H and the maximum displacement fluctuation value H. max The two sets of monitoring indicators are cross-validated to obtain a more accurate judgment on whether or not fly-through particles have appeared.

[0066] Technical effects:

[0067] 1. In this application, the first seat 100 and the second seat 200 of the polishing carrier are movably connected, forming a first cavity 120 between them. By pressurizing the first cavity 120 and applying it to the second seat 200, the movable connection structure between the first seat 100 and the second seat 200 absorbs the fluctuations generated during the polishing process, and makes the polishing blade W subject to stable pressure, thus reducing the occurrence of flying blades. The detection component 600 monitors the air pressure fluctuations in the first cavity 120, and promptly provides feedback when it is determined that flying blades have occurred, and takes corresponding shutdown measures. This solves the technical problem of not being able to accurately identify and respond to flying blades in a timely manner during the polishing process, and achieves the technical effect of accurately identifying and responding to flying blades in a timely manner.

[0068] 2. The first seat 100 and the second seat 200 slide perpendicular to the plane of the polishing piece W through a linear bearing 310. This not only absorbs the fluctuations generated during the polishing process and improves the polishing quality of the polishing piece W, but also guides the displacement direction of the second seat 200, so that the second seat 200 can only move in the vertical direction and cannot move in the horizontal direction to avoid tilting. In this way, the second seat 200 has greater rigidity to resist the overturning moment exerted by the polishing pad M on the second seat 200, reduce the angle formed between the second seat 200 and the polishing pad M, and reduce the possibility of the polishing piece W flying out from between the second seat 200 and the polishing pad M.

[0069] 3. The detection component 600 monitors the air pressure in the first chamber 120 and the displacement of the detection unit 620. By comprehensively judging whether the ejector plate W has flown out through the above two sets of monitoring indicators, the accuracy of detecting whether the ejector plate W has flown out is improved.

[0070] 4. The pressure plate 230 in the second seat 200 abuts against the soft base pad 220. By filling the second cavity 240 with pressure, the soft base pad 220 can be evenly pressed on the upper surface of the pressure plate 230 after being inflated. The pressure is transmitted from the pressure plate 230 to the polishing sheet W, and the pressure distribution is uniform with no eccentric load, thus improving the flatness of the polishing sheet W.

[0071] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0072] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A polishing carrier, characterized by, The utility model relates to a kind of detection device for wafer, including: Carrier body, the carrier body includes: First seat (100), first air passage (110) is on the first seat (100); Second seat (200), the second seat (200) is superposed with the first seat (100) and is located directly below the first seat (100), and the first cavity (120) is formed between the second seat (200) and the first seat (100), and the first cavity (120) is communicated with the first air passage (110);The first cavity (120) is variable in volume, and the second seat (200) is movably connected with the first seat (100); Detection assembly (600), the detection assembly (600) includes: Pressure sensor, the pressure sensor is housed in the first cavity (120), and the pressure sensor is used to monitor the air pressure change in the first cavity (120).

2. A polishing support according to claim 1, wherein The outer ring of the first seat (100) has first connecting part (130), the outer ring of the second seat (200) has second connecting part (250), and sealing assembly (400) is arranged between the first connecting part (130) and the second connecting part (250), and the sealing assembly (400) includes: Sealing ring (410), the sealing ring (410) is embedded in the first connecting part (130), and the sealing ring (410) is in contact with the second connecting part (250), so that the first cavity (120) is closed; Or, the sealing assembly (400) includes: Sealing ring (410), the sealing ring (410) is embedded in the second connecting part (250), and the sealing ring (410) is in contact with the first connecting part (130), so that the first cavity (120) is closed.

3. A polishing support according to claim 2, wherein The second seat (200) is movably connected to the first seat (100), and the sliding direction is perpendicular to the plane where the wafer to be thrown is located.

4. A polishing support according to any one of claim 3, wherein Limiting groove (140) is arranged on the bottom surface of the first seat (100), and limiting assembly (500) is arranged between the first seat (100) and the second seat (200), and the limiting assembly (500) includes: Limiting part (510), the limiting part (510) is fixedly connected to the second seat (200), the limiting part (510) is housed in the limiting groove (140), and the limiting part (510) is used to be in contact with the limiting groove (140) to limit the movement of the second seat (200), and the limiting groove (140) has a movable space for the limiting part (510) to move in the direction perpendicular to the plane where the wafer to be thrown is located; Or, the top surface of the second seat (200) is provided with a limiting groove (140), and the first seat (100) and the second seat (200) are provided with a limiting assembly (500), and the limiting assembly (500) includes: A limiting part (510) is fixedly connected to the first seat (100), is accommodated in the limiting groove (140), and is used for abutting and matching with the limiting groove (140), so that movement of the second seat (200) is limited, and the limiting groove (140) has a moving space for the limiting part (510) to move in a direction perpendicular to the plane where the wafer to be thrown is located.

5. A polishing support according to claim 3, wherein A linear bearing (310) is connected between the first seat (100) and the second seat (200), and the arrangement direction of the linear bearing (310) is perpendicular to the plane where the wafer to be thrown is located.

6. A polishing support according to claim 5, wherein The linear bearing (310) has a plurality of linear bearings (310) that are centrally symmetrically distributed about the rotation center of the carrier.

7. A polishing support according to any one of claims 1 to 6, wherein The second seat (200) has a detection part (620) located outside the first seat (100), and the detection assembly (600) further comprises: A laser sensor (610) is located outside the carrier, above the detection part (620), and is used for monitoring position change of the detection part (620).

8. The polishing support of claim 1 wherein, The second seat (200) comprises: A second seat (200) body, the bottom surface of the second seat (200) body has a concave surface, and the outer ring of the second seat (200) body has a fixing ring (212); A soft base pad (220) is wrapped around the concave surface of the second seat (200) body, so that a second cavity (240) is formed between the concave surface and the soft base pad (220); and A pressing plate (230) is located inside the fixing ring (212) and below the soft base pad (220). The second seat (200) body is provided with a second air channel (211) that is in communication with the second cavity (240), and when the second cavity (240) is filled with pressure, the soft base pad (220) abuts against the pressing plate (230).

9. A method for detecting a flying piece of a polishing carrier for detecting whether the flying piece of the polishing carrier as claimed in any one of claims 1 to 8 occurs during polishing, characterized by It comprises: Setting the maximum value P of the air pressure fluctuation in the first chamber (120) max ; Real-time monitoring of the air pressure value P in the first cavity (120); determining whether the monitored air pressure value P is greater than the air pressure fluctuation maximum value Pmax max : If P > P max , it is determined that the flying piece situation occurs.

10. The method of claim 9, wherein the polishing carrier is a wafer. It further comprises: The setting detection section (620) displaces the maximum value H of the fluctuation in the direction perpendicular to the plane on which the workpiece to be polished is placed max ; Real-time monitoring of the displacement value H of the detection part (620) in a direction perpendicular to the plane where the wafer to be thrown is located; determining whether the monitored displacement value H is greater than the maximum displacement fluctuation value H max : If H > H max , and P > P max , it is determined that the flying piece situation occurs.

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