Busbar joint infrared temperature measurement phase busbar temperature automatic identification method

Abstract

The application relates to a method which first places an array type infrared temperature measuring sensor above a bus joint, wherein an X-axis infrared temperature measuring point is vertically placed with the copper bar, and a Y-axis infrared temperature measuring point is placed in parallel with the copper bar; secondly, the array type infrared temperature measuring sensor sends all temperature measuring point data to an upper computer, and the upper computer automatically identifies the temperature of each phase copper bar in the bus joint. Compared with the prior art, the application has the advantages of greatly improved identification efficiency and precision, convenient installation and the like.

Description

TECHNICAL FIELD

[0001] The application relates to an infrared temperature measurement technology for bus joint, in particular to a phase busbar temperature automatic identification method for infrared temperature measurement of a bus joint. BACKGROUND

[0002] In recent years, bus duct power distribution is widely used in various industries. In the actual application of bus power distribution, the bus joint temperature is often too high due to excessive load or improper installation, which seriously damages the bus joint and causes safety hazards. Therefore, effective measures must be taken to monitor the temperature of each phase busbar in the bus joint in real time, upload the temperature data of each phase to the background, and monitor and alarm in real time to prompt the management personnel to prevent and handle in a timely manner, and ensure the safe and reliable use of bus power.

[0003] A bus joint temperature measuring device applied to a data center (authorized publication number CN 212721834U) provides a bus joint temperature measuring device applied to a data center, which can realize the purposes of reasonable structure, small size and multiple functions. The device comprises a lower shell, an upper shell, a circuit board and a power taking and temperature measuring probe to solve the problem of real-time temperature monitoring of the bus joint.

[0004] An infrared bus duct online temperature measuring device (authorized publication number CN 217111168U) provides an infrared bus duct online temperature measuring device, which comprises a lower shell, a monitoring unit arranged in the lower shell, an expandable built-in battery connected with the monitoring unit and a dual-band built-in antenna, and an auxiliary positioning structure arranged at the bottom of the lower shell. The device solves the problem of the traditional bus temperature measurement based on the contact type temperature probe.

[0005] The above two methods can monitor the temperature of each phase of the bus joint, achieve real-time monitoring of the operating temperature of the bus joint, and can measure the temperature of each phase busbar. However, during installation, each phase sensor needs to be aligned with the busbar to achieve temperature monitoring of each phase. Since there are many types of bus joint, the distances between busbars are different, and the heights from busbars to cover plates are different, the above two methods cannot meet the temperature measurement of all types of bus joints, and it is difficult to achieve the self-identification function of the temperature of each phase busbar. SUMMARY

[0006] The application aims to overcome the defects of the prior art and provides a phase busbar temperature automatic identification method for infrared temperature measurement of a bus joint.

[0007] The purpose of the application can be achieved by the following technical solutions:

[0008] According to one aspect of the present application, there is provided a method for automatically identifying the temperature of each phase busbar of a bus joint infrared temperature measurement, which first places an array infrared temperature measurement sensor directly above the bus joint, with the X-axis infrared temperature measurement points being placed vertically with respect to the copper bar and the Y-axis infrared temperature measurement points being placed parallel to the copper bar;

[0009] Secondly, the array infrared temperature measurement sensor sends all temperature measurement point data to the upper computer, which automatically identifies the temperature of each phase copper bar in the bus joint.

[0010] As a preferred technical solution, the array infrared temperature measurement sensor temperature measurement points need to meet: Y-axis needs ≥4 temperature measurement points, X-axis needs ≥16 temperature measurement points, and the entire array infrared sensor temperature measurement points are Y×X.

[0011] As a preferred technical solution, the array infrared temperature measurement sensor X-axis has an angle of view radiation arc θ for determining the infrared temperature measurement range.

[0012] As a preferred technical solution, the angle of view radiation arc θ is a known parameter, and the height h of the array infrared temperature measurement sensor to the bus joint is also known. The length L of the area covered by the X-axis of the infrared temperature measurement sensor is calculated by the right triangle function tan θ, and thus the length X of the area covered by each column of infrared temperature measurement on the X-axis is calculated. L Finally, the temperature of each phase busbar is calculated by the busbar spacing a.

[0013] As a preferred technical solution, the length L is specifically calculated as follows:

[0014] L = 2 × tan(θ / 2) × h.

[0015] As a preferred technical solution, the length X of the area covered by each column of infrared temperature measurement on the X-axis is specifically calculated as follows: L

[0016] X L = L ÷ X.

[0017] As a preferred technical solution, the temperature of each phase busbar is specifically calculated as follows:

[0018] N = a ÷ X L

[0019] According to the calculated average value of each column on the X-axis, the maximum average value is found as the temperature rise measurement value of the copper bar of a certain phase. This column is taken as the reference 0 column. Then, according to the span N value of the two-phase copper bar, the highest temperature value in the +N column and the upper and lower columns is found as the temperature rise measurement value of the copper bar. This method is used to find the temperature rise measurement value of each phase copper bar.

[0020] ​As a preferred technical scheme, the method calculates the average value of each column of the X axis as the temperature measurement data of the column according to the collected data.

[0021] As a preferred technical scheme, if a certain temperature measurement point exceeds the error range, the temperature measurement point data is removed, and the average value of the remaining part is calculated, and the average value of the temperature measurement data of each column of the X axis is calculated in the same way.

[0022] As a preferred technical scheme, the upper computer is a background software platform or a configuration control touch screen.

[0023] Compared with the prior art, the present application has the following advantages:

[0024] I. Each phase is measured by software, which greatly improves the recognition efficiency and accuracy.

[0025] II. The installation condition is not affected by the distance and height of the bus joint.

[0026] III. Easy to install, no need to adjust the one-to-one correspondence of the sensor and the busbar. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 It is an installation schematic diagram of the array type infrared temperature measurement sensor of the present application.

[0028] Figure 2 It is a temperature measurement point arrangement schematic diagram of the array type infrared temperature measurement sensor of the present application. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor should belong to the scope of protection of the present application.

[0030] The present application is a phase copper bar temperature automatic recognition method for bus joint infrared temperature measurement, which includes a temperature collection module and a measured temperature object bus joint.

[0031] The temperature collection module is directly placed above the bus joint, the X axis infrared temperature measurement point is vertically placed with the copper bar to ensure that the X axis infrared temperature measurement point covers the area of all copper bars in the bus joint, and the Y axis infrared temperature measurement point is placed parallel to the copper bar to ensure that a Y axis temperature measurement point is on the same copper bar. The temperature collection module collects all temperature measurement point data and uploads the data to a background software platform or a configuration control touch screen through a communication circuit. The temperature measurement of the copper bars in the bus joint is realized by the background software or the configuration software algorithm.

[0032] As Figure 1 shown, the array infrared temperature sensor X axis has a viewing angle radiation arc θ, the viewing angle arc size determines the infrared temperature measurement range, in practical application, the infrared temperature sensor viewing angle arc θ is known, the temperature collection module to bus joint height h is known, the area length L covered by the infrared temperature sensor X axis can be calculated by the tangent function tan θ, so that the area length of each column of infrared temperature measurement on the X axis can be calculated. Finally, the temperature of each phase bus can be calculated through the bus bar spacing a.

[0033] As Figure 2 shown, the array infrared temperature sensor temperature measurement points need to meet: the Y axis needs ≥4 temperature measurement points, the X axis needs ≥16 temperature measurement points, the entire array infrared sensor temperature measurement points are Y*X, for example, when Y=4 and X=16, there are a total of 64 temperature measurement points. Specific embodiments

[0035] As Figure 1 shown: the viewing angle arc θ=120°, the temperature collection module to bus joint height h=20mm, the bus bar spacing is about a=12mm, the array infrared temperature sensor temperature measurement points need to meet: the Y axis=4 temperature measurement points, the X axis=16 temperature measurement points.

[0036] The temperature collection module first collects 64 temperature collection data, according to the collected data, the correct average value of each column of X axis is calculated through the algorithm, to prevent the temperature measurement accuracy from being affected by the damage of a certain point temperature measurement.

[0037] Because each column of temperature measurement points corresponds to the same phase copper bar, the temperature error range is very small, and the average temperature algorithm is used, for example, the Y0, Y1, Y2, Y3 four temperatures in a column are compared with each other, if they are within the set error range, the average value (Y0+Y1+Y2+Y3)÷4=Yav is calculated, if one of them is out of the error range, the data of the temperature measurement point is removed, and the average value of the remaining part is calculated, and the average value of the 16 columns of X axis temperature measurement data is calculated in the same way.

[0038] According to the viewing angle arc θ=120°, the temperature collection module to bus joint height h=20mm, the area length L covered by the infrared temperature sensor X axis is calculated,

[0039] Tan(θ / 2)=L / 2÷h→L=2×tan(60°)×20=69.28mm

[0040] According to the area length L covered by the infrared temperature sensor X axis, the infrared temperature measurement area of each column of X axis can be calculated

[0041] X L =L÷16→X L =69.28÷16=4.33mm

[0042] Busbar spacing is about a = 12mm, the span of two-phase copper bar between the infrared temperature measurement area can be calculated

[0043] N = a ÷ X L → N = 12 ÷ 4.33 ≈ 3

[0044] According to the actual application of bus joint, the temperature rise of the maximum current copper bar is the highest, according to the average value of each column of X axis calculated above, the maximum column average value is found as the temperature rise measurement value of the copper bar, and the column is taken as the reference 0 column, then according to the span N value of the two-phase copper bar, the highest temperature value in the +N column and the upper and lower columns is found as the temperature rise measurement value of the copper bar, and the method is used to find the temperature rise measurement value of each phase copper bar, so as to achieve the purpose of temperature measurement of each phase copper bar.

[0045] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited to this, any skilled person in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the present application, and these modifications or replacements should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A method for automatic identification of the temperature of each phase busbar in infrared temperature measurement of busbar joints, characterized in that, The method first places an array of infrared temperature sensors directly above the busbar connector, with the X-axis infrared temperature measurement point perpendicular to the copper busbar and the Y-axis infrared temperature measurement point parallel to the copper busbar. Secondly, the array-type infrared temperature sensor sends all temperature measurement point data to the host computer, which automatically identifies the temperature of each phase copper busbar inside the bus joint. The array-type infrared temperature sensor has a viewing angle radian θ on its X-axis to determine the infrared temperature measurement range. This viewing angle radian θ is a known parameter. Given the height h from the array-type infrared temperature sensor to the busbar connector, the length L of the area covered by the infrared temperature sensor's X-axis is calculated using the right-angle trigonometric function tanθ. Therefore, the length X of the infrared temperature measurement area for each column on the X-axis is calculated. L Finally, the temperature of each phase busbar is calculated using the busbar spacing 'a'. The length L of the region is calculated as follows: L = 2 × tan(θ / 2) × h; The length of each infrared thermometry region on the X-axis is X. L The specific calculations are as follows: X L = L÷X; The specific calculations for the temperatures of each phase busbar are as follows: N=a÷X L Based on the average value of each column of the X-axis calculated above, find the average value of the largest column as the temperature rise measurement value of a certain phase copper busbar. Use this column as the baseline column 0. Then, based on the span N value of the two phase copper busbars, find the highest temperature value in the +N column and the column above and below as the temperature rise measurement value of the copper busbar. Use this method to find the temperature rise measurement value of each phase copper busbar.

2. The method for automatic identification of phase busbar temperature for infrared temperature measurement of busbar joints according to claim 1, characterized in that, The array-type infrared temperature sensor needs to meet the following requirements: there need to be ≥4 temperature measurement points on the Y-axis and ≥16 temperature measurement points on the X-axis. The total number of temperature measurement points for the array-type infrared sensor is Y×X.

3. The method for automatic identification of the temperature of each phase busbar for infrared temperature measurement of busbar joints according to claim 1, characterized in that, This method uses the collected data and calculates the average value of each column on the X-axis as the temperature measurement data for that column.

4. The method for automatic identification of the temperature of each phase busbar for infrared temperature measurement of busbar joints according to claim 1, characterized in that, If any temperature measurement point exceeds the error range, remove the data from that temperature measurement point and calculate the average value of the remaining data. Repeat this process to calculate the average value of the temperature measurement data for each column of the X-axis.

5. The method for automatic identification of the temperature of each phase busbar for infrared temperature measurement of busbar joints according to claim 1, characterized in that, The host computer is a background software platform or a configuration control touch screen.

Images