Imaging optical systems, camera modules and electronic devices

Abstract

An imaging optical system, camera module, and electronic device are disclosed. The imaging optical system sequentially includes an infrared light-absorbing element, an infrared light-reducing film, and a flat panel element along a central optical path. The infrared light-absorbing element is an infrared light-absorbing plastic element used to refract light. The infrared light-reducing film is positioned closer to an imaging surface of the imaging optical system than an incident surface of the infrared light-absorbing element. The flat panel element is integrally formed and disposed between the infrared light-reducing film and the imaging surface. The flat panel element includes a light-transmitting portion and a support portion, wherein the light-transmitting portion is correspondingly disposed to the imaging surface, and the support portion surrounds the light-transmitting portion, keeping the light-transmitting portion at a specific position on the central optical path. This improves optical quality.

Description

Technical Field

[0001] This disclosure relates to an imaging optical system and camera module, and more particularly to an imaging optical system and camera module for use in portable electronic devices. Background Technology

[0002] In recent years, portable electronic devices have developed rapidly, such as smart electronic devices and tablet computers, which have become ubiquitous in modern life. Consequently, camera modules and imaging optical systems mounted on these devices have also flourished. However, as technology advances, users' demands for the quality of imaging optical systems and camera modules are also increasing.

[0003] Specifically, in existing camera modules, a light filter is positioned between the imaging lens and the image sensor. Filters can be used to filter infrared and ultraviolet light, but are not limited to these. Filters also typically protect the image sensor from dust adhering to its photosensitive surface. However, filters are prone to ghosting under strong light, and their size is limited by assembly requirements and the need to filter out excess light, thus affecting the back focus of the imaging optical system and making it difficult to design a high-quality, compact imaging optical system. Therefore, developing an imaging optical system that increases design freedom has become an important and urgent problem for the industry. Summary of the Invention

[0004] This disclosure provides an imaging optical system, camera module, and electronic device. By configuring low-reflection coatings, dense-sparse structural layers, or anti-reflection multi-layer coatings with infrared light absorbing elements and infrared light reducing coatings, the design freedom of the imaging optical system is improved, thereby achieving effects such as improved optical quality or reduced size.

[0005] According to one embodiment of this disclosure, an imaging optical system is provided, comprising, sequentially along a central optical path, an infrared light absorbing element, an infrared light reducing film, and a flat panel element. The infrared light absorbing element is an infrared light absorbing plastic element used to refract light. The infrared light reducing film is positioned closer to an imaging surface of the imaging optical system than an incident surface of the infrared light absorbing element. The flat panel element is integrally formed and disposed between the infrared light reducing film and the imaging surface. The flat panel element includes a light-transmitting portion and a support portion, wherein the light-transmitting portion corresponds to the imaging surface, and the support portion surrounds the light-transmitting portion, maintaining the light-transmitting portion at a specific position along the central optical path. The flat panel element further includes a density-sparse structure layer, which is disposed on at least one of an incident surface and an exit surface of the light-transmitting portion. The density-sparse structure layer gradually thins towards the air direction and forms a plurality of holes on at least one of the incident surface and the exit surface of the light-transmitting portion. The main material of the density-sparse structure layer is ceramic, and the average reflectivity of the density-sparse structure layer for light in the wavelength range of 420nm to 680nm is less than 0.98%. The average crystal height of the density-sparse structure layer is GH, the focal length of the imaging optical system is f, the distance between the infrared light absorbing element and the infrared light reducing film along the central optical path is L1, and the distance between the infrared light reducing film and the density-sparse structure layer along the central optical path is L2, which satisfy the following conditions: 60nm≤GH≤400nm; 0.0≤L1 / f≤0.21; and 0.21≤L2 / f.

[0006] According to the imaging optical system of the embodiment described above, the average reflectivity of the density-sparse structure layer for light in the wavelength range of 400 nm to 900 nm can be less than 0.98%.

[0007] According to the imaging optical system of the embodiment described above, the average reflectivity of the density-sparse structure layer for a wavelength range of 400 nm to 900 nm can be less than 0.5%.

[0008] According to the imaging optical system of the embodiment described above, the average height of the crystal in the dense-sparse structure layer is GH, which can satisfy the following conditions: 120nm≤GH≤300nm.

[0009] The imaging optical system according to the embodiments described above may further include an intermediate layer, wherein the intermediate layer connects the density layer and the flat element, and the intermediate layer is in contact with air through at least one of the holes.

[0010] In the imaging optical system according to the embodiments described above, an infrared light reduction film layer may be disposed on a light-emitting surface of an infrared light absorbing element.

[0011] The imaging optical system according to the embodiments described above may further include a film layer setting element, wherein the film layer setting element is disposed on an image side of the infrared light absorbing element. An infrared light reducing film layer is disposed on one of an incident light surface and an exit light surface of the film layer setting element.

[0012] In the imaging optical system according to the embodiments described above, the film layer setting element may be located close to the infrared light absorbing element.

[0013] The imaging optical system according to the embodiments described above may further include a colloid, wherein the colloid bonds the infrared light absorbing element and the film layer setting element.

[0014] In the imaging optical system according to the embodiments described above, the support portion of the flat panel element may be an opaque plastic support portion.

[0015] According to the imaging optical system described above, the flat panel element can be integrally formed by embedding or secondary ejection.

[0016] According to the imaging optical system of the embodiment described above, the flat panel element may further include a light-shielding part, and the light-shielding part is disposed adjacent to the light-transmitting part.

[0017] In the imaging optical system according to the embodiments described above, the dense-sparse structure layer can be simultaneously disposed on the light-incident surface and the light-exit surface of the light-transmitting part.

[0018] According to the imaging optical system of the embodiment described above, the density-sparse structure layer can be simultaneously disposed on at least a portion of one surface of the support portion.

[0019] According to the imaging optical system of the embodiment described above, the focal length of the imaging optical system is f, and the thickness of the light-transmitting part is THI, which can satisfy the following condition: 0.005≤THI / f≤0.35.

[0020] According to one embodiment of the present disclosure, a camera module is provided, including an imaging optical system and a photosensitive element as described in the foregoing embodiments, wherein the photosensitive element is disposed on the imaging surface of the imaging optical system.

[0021] According to one embodiment of the present disclosure, an electronic device is provided, which includes at least one camera module of the aforementioned embodiment.

[0022] According to one embodiment of this disclosure, an imaging optical system is provided, comprising, sequentially along a central optical path, an infrared light-absorbing element, an infrared light-reducing film, a flat panel element, and an anti-reflection multilayer film. The infrared light-absorbing element is an infrared light-absorbing plastic element used to refract light. The infrared light-reducing film is positioned closer to an imaging surface of the imaging optical system than an incident surface of the infrared light-absorbing element. The flat panel element is integrally formed and disposed between the infrared light-reducing film and the imaging surface. The flat panel element includes a light-transmitting portion and a support portion, wherein the light-transmitting portion corresponds to the imaging surface, and the support portion surrounds the light-transmitting portion, maintaining the light-transmitting portion at a specific position along the central optical path. The anti-reflection multilayer film is disposed at least one of an incident surface and an exit surface of the light-transmitting portion, wherein the anti-reflection multilayer film includes multiple high-refractive-index layers and multiple low-refractive-index layers, with the high-refractive-index layers and low-refractive-index layers alternately stacked. The anti-reflection multilayer film has an average reflectivity of less than 0.98% for light in the wavelength range of 420 nm to 680 nm. The focal length of the imaging optical system is f, the distance between the infrared light absorbing element and the infrared light reducing film along the central optical path is L1, and the distance between the infrared light reducing film and the anti-reflection multilayer film along the central optical path is L2'. These conditions satisfy the following: 0.0≤L1 / f≤0.21; and 0.21≤L2' / f.

[0023] According to the imaging optical system of the embodiment described above, the average reflectivity of the antireflective multilayer for light in the wavelength range of 400nm to 900nm is less than 0.98%.

[0024] In the imaging optical system according to the embodiments described above, an infrared light reduction film layer may be disposed on a light-emitting surface of an infrared light absorbing element.

[0025] The imaging optical system according to the embodiments described above may further include a film layer setting element, wherein the film layer setting element is disposed on an image side of the infrared light absorbing element, and the infrared light reducing film is disposed on one of an incident light surface and an exit light surface of the film layer setting element.

[0026] In the imaging optical system according to the embodiments described above, the film layer setting element may be located close to the infrared light absorbing element.

[0027] The imaging optical system according to the embodiments described above may further include a colloid, wherein the colloid bonds the infrared light absorbing element and the film layer setting element.

[0028] In the imaging optical system according to the embodiments described above, the support portion of the flat panel element may be an opaque plastic support portion.

[0029] According to the imaging optical system described above, the flat panel element can be integrally formed by embedding or secondary ejection.

[0030] According to the imaging optical system of the embodiment described above, the flat panel element may further include a light-shielding part, and the light-shielding part is disposed adjacent to the light-transmitting part.

[0031] According to the imaging optical system described above, the anti-reflection multilayer can be simultaneously disposed on the light-incident surface and the light-exit surface of the light-transmitting part.

[0032] According to the imaging optical system of the embodiment described above, the anti-reflective multilayer film can be simultaneously disposed on at least a portion of a surface of the support portion.

[0033] According to the imaging optical system of the embodiment described above, the focal length of the imaging optical system is f, and the thickness of the light-transmitting part is THI, which can satisfy the following condition: 0.005≤THI / f≤0.35.

[0034] According to one embodiment of the present disclosure, a camera module is provided, including an imaging optical system and a photosensitive element as described in the foregoing embodiments, wherein the photosensitive element is disposed on the imaging surface of the imaging optical system.

[0035] According to one embodiment of the present disclosure, an electronic device is provided, which includes at least one camera module of the aforementioned embodiment.

[0036] According to one embodiment of this disclosure, an imaging optical system is provided, comprising, sequentially along a central optical path, an infrared light-absorbing element, an infrared light-reducing film, a flat panel element, and a low-reflection film. The infrared light-absorbing element is an infrared light-absorbing plastic element used to refract light. The infrared light-reducing film is positioned closer to an imaging surface of the imaging optical system than an incident surface of the infrared light-absorbing element. The flat panel element includes a light-transmitting portion and a support portion. The light-transmitting portion is disposed between the infrared light-reducing film and the imaging surface, corresponding to the imaging surface. The support portion surrounds the central optical path and is integrated with the light-transmitting portion, maintaining the light-transmitting portion at a specific position along the central optical path. The low-reflection film is disposed on at least one of an incident surface and an exit surface of the light-transmitting portion, and simultaneously covers at least a portion of the support portion. The low-reflection film has an average reflectivity of less than 0.98% for light in the wavelength range of 420 nm to 680 nm. The focal length of the imaging optical system is f, the distance between the infrared light absorbing element and the infrared light reducing film along the central optical path is L1, and the distance between the infrared light reducing film and the low reflectance film along the central optical path is L2″, which satisfy the following conditions: 0.0≤L1 / f≤0.21; and 0.21≤L2″ / f.

[0037] According to the imaging optical system of the embodiments described above, the low-reflection film layer may include an anti-reflection multilayer, the anti-reflection multilayer may include multiple high-refractive-index layers and multiple low-refractive-index layers, and the high-refractive-index layers and low-refractive-index layers are stacked alternately.

[0038] According to the imaging optical system described in the preceding paragraph, the low-reflection film layer may include a density-sparse structure layer. This density-sparse structure layer is disposed on at least one of the light-incident surface and the light-exit surface of the light-transmitting portion. The density-sparse structure layer gradually thins towards the air direction, forming multiple pores on at least one of the light-incident surface and the light-exit surface of the light-transmitting portion. The main material of the density-sparse structure layer is ceramic. The average crystal height of the density-sparse structure layer is GH, which satisfies the following condition: 60nm ≤ GH ≤ 400nm. Additionally, it satisfies the following condition: 120nm ≤ GH ≤ 300nm.

[0039] According to the imaging optical system of the embodiment described above, the low-reflection film may further include an intermediate layer, which is in contact with the solid plate element, and at least a portion of the intermediate layer is in contact with air through at least one of the holes.

[0040] According to the imaging optical system of the embodiment described above, the low-reflectivity film layer has an average reflectivity of less than 0.98% for a light ray in the wavelength range of 400 nm to 900 nm.

[0041] According to the imaging optical system of the embodiment described above, the low-reflectivity film layer has an average reflectivity of less than 0.5% for light in the wavelength range of 400 nm to 900 nm.

[0042] In the imaging optical system according to the embodiments described above, an infrared light reduction film layer may be disposed on a light-emitting surface of an infrared light absorbing element.

[0043] The imaging optical system according to the embodiments described above may further include a film layer setting element, wherein the film layer setting element is disposed on an image side of the infrared light absorbing element, and the infrared light reducing film is disposed on one of an incident light surface and an exit light surface of the film layer setting element.

[0044] In the imaging optical system according to the embodiments described above, the film layer setting element may be located close to the infrared light absorbing element.

[0045] The imaging optical system according to the embodiments described above may further include a colloid, wherein the colloid bonds the infrared light absorbing element and the film layer setting element.

[0046] In the imaging optical system according to the embodiments described above, the support portion of the flat panel element may be an opaque plastic support portion.

[0047] According to the imaging optical system of the embodiment described above, a low-reflection film layer can be simultaneously disposed on the light-incident surface and the light-exit surface of the light-transmitting part. The low-reflection film layer disposed on the light-incident surface of the light-transmitting part includes one of an anti-reflection multilayer film layer and a sparse-dense structure layer, and the low-reflection film layer disposed on the light-exit surface of the light-transmitting part includes one of an anti-reflection multilayer film layer and a sparse-dense structure layer.

[0048] According to the imaging optical system of the embodiment described above, a low-reflection film layer may be simultaneously disposed on at least a portion of a surface of the support portion.

[0049] According to the imaging optical system of the embodiment described above, the focal length of the imaging optical system is f, and the thickness of the light-transmitting part is THI, which can satisfy the following condition: 0.005≤THI / f≤0.35.

[0050] According to one embodiment of the present disclosure, a camera module is provided, including an imaging optical system and a photosensitive element as described in the foregoing embodiments, wherein the photosensitive element is disposed on the imaging surface of the imaging optical system.

[0051] According to one embodiment of the present disclosure, an electronic device is provided, which includes at least one camera module of the aforementioned embodiment.

[0052] According to one embodiment of this disclosure, an imaging optical system is provided, comprising, sequentially along a central optical path, an infrared light absorbing element, an infrared light reducing film, a prism element, and a low-reflection film. The infrared light absorbing element is an infrared light absorbing plastic element used to refract light. The infrared light reducing film is positioned closer to an imaging surface of the imaging optical system than an incident surface of the infrared light absorbing element. The prism element includes a prism portion and a support portion. The prism portion sequentially includes an incident surface, at least one reflecting surface, and an exiting surface along the central optical path, with the exiting surface of the prism portion corresponding to the imaging surface. The support portion supports the prism portion, holding it at a specific position along the central optical path. The low-reflection film is disposed on at least one of the incident surface and the exiting surface of the prism portion. The low-reflection film has an average reflectivity of less than 0.98% for light in the wavelength range of 420 nm to 680 nm. The focal length of the imaging optical system is f, the distance between the infrared light absorbing element and the infrared light reducing film along the central optical path is L1, and the distance between the infrared light reducing film and the low reflectance film along the central optical path is L2″, which satisfy the following conditions: 0.0≤L1 / f≤0.21; and 0.21≤L2″ / f.

[0053] According to the imaging optical system of the embodiments described above, the low-reflection film layer may include an anti-reflection multilayer, which includes multiple high-refractive-index layers and multiple low-refractive-index layers, and the high-refractive-index layers and low-refractive-index layers are stacked alternately.

[0054] According to the imaging optical system described above, the low-reflection film layer may include a density-sparse structure layer. This density-sparse structure layer is disposed on at least one of the light-incident surface and the light-exit surface of the prism. The density-sparse structure layer gradually thins towards the air direction, forming multiple holes on at least one of the light-incident surface and the light-exit surface of the prism. The main material of the density-sparse structure layer may be ceramic. The average crystal height of the density-sparse structure layer is GH, which satisfies the following condition: 60nm ≤ GH ≤ 400nm. Additionally, it satisfies the following condition: 120nm ≤ GH ≤ 300nm.

[0055] According to the imaging optical system of the embodiment described above, the low-reflection film may further include an intermediate layer, which is in contact with the prism element and is in contact with air through at least one of the holes.

[0056] According to the imaging optical system of the embodiment described above, the low-reflectivity film layer has an average reflectivity of less than 0.98% for a light ray in the wavelength range of 400 nm to 900 nm.

[0057] According to the imaging optical system of the embodiment described above, the low-reflectivity film layer has an average reflectivity of less than 0.5% for a light ray in the wavelength range of 400 nm to 900 nm.

[0058] In the imaging optical system according to the embodiments described above, an infrared light reduction film layer may be disposed on a light-emitting surface of an infrared light absorbing element.

[0059] The imaging optical system according to the embodiments described above may further include a film layer setting element, wherein the film layer setting element is disposed on an image side of the infrared light absorbing element, and the infrared light reducing film is disposed on one of an incident light surface and an exit light surface of the film layer setting element.

[0060] In the imaging optical system according to the embodiments described above, the film layer setting element may be located close to the infrared light absorbing element.

[0061] The imaging optical system according to the embodiments described above may further include a colloid, wherein the colloid bonds the infrared light absorbing element and the film layer setting element.

[0062] In the imaging optical system according to the embodiments described above, the support portion of the prism element may be an opaque plastic support portion.

[0063] According to the imaging optical system of the embodiment described above, a low-reflection film layer can be simultaneously disposed on the light-incident surface and the light-exit surface of the prism. The low-reflection film layer disposed on the light-incident surface of the prism includes one of an anti-reflection multilayer film layer and a density-sparse structure layer, and the low-reflection film layer disposed on the light-exit surface of the prism includes one of an anti-reflection multilayer film layer and a density-sparse structure layer.

[0064] According to the imaging optical system of the embodiment described above, a low-reflection film layer may be simultaneously disposed on at least a portion of a surface of the support portion.

[0065] According to one embodiment of the present disclosure, a camera module is provided, including an imaging optical system and a photosensitive element as described in the foregoing embodiments, wherein the photosensitive element is disposed on the imaging surface of the imaging optical system.

[0066] According to one embodiment of the present disclosure, an electronic device is provided, which includes at least one camera module of the aforementioned embodiment.

[0067] According to one embodiment of this disclosure, a camera module is provided, comprising an imaging optical system and a photosensitive element. The imaging optical system includes an imaging lens, a flat panel element, and a low-reflection coating. The imaging lens includes a plurality of lenses, an infrared light-reducing coating, and a lens carrier. The lenses are arranged sequentially along a central optical path, wherein each lens includes an infrared light-absorbing lens, and the infrared light-absorbing lens is an infrared light-absorbing plastic lens. The infrared light-reducing coating is disposed on a light-emitting surface of the infrared light-absorbing lens. The lens carrier houses the lenses and the infrared light-reducing coating. The flat panel element includes a light-transmitting portion and a support portion, wherein the support portion surrounds the central optical path. The low-reflection coating is disposed on at least one of a light-incident surface and a light-emitting surface of the light-transmitting portion. The photosensitive element is disposed on an image side of the lens carrier, and the flat panel element is disposed between the imaging lens and the photosensitive element. The light-transmitting portion and the photosensitive element are correspondingly disposed, and the central optical path passes through the imaging lens and is transmitted to the photosensitive element. The support portion maintains a specific distance between the light-transmitting portion of the flat panel element and the photosensitive element. The low-reflectance coating has an average reflectance of less than 0.98% in the wavelength range of 420 nm to 680 nm. The focal length of the imaging optical system is f, the distance between the infrared light reduction coating and the low-reflectance coating along the central optical path is L2″, and the thickness of the light-transmitting part of the flat panel element is THI, which satisfies the following conditions: 0.21 ≤ L2″ / f; and 0.005 ≤ THI / f ≤ 0.35. Attached Figure Description

[0068] Figure 1A A cross-sectional view of the camera module according to the first embodiment of this disclosure is shown;

[0069] Figure 1B Drawing according to Figure 1A A partial perspective view of the camera module in the first embodiment;

[0070] Figure 1C Drawing according to Figure 1A Partial exploded view of the camera module in the first embodiment;

[0071] Figure 1D Drawing according to Figure 1A A schematic diagram of the low-reflection film layer in the first embodiment of the first implementation;

[0072] Figure 1E Drawing according to Figure 1D Scanning electron microscope image of the dense-sparse structure layer in the first embodiment of the first implementation;

[0073] Figure 1F Drawing according to Figure 1D Wavelength-reflectivity experimental data table in the first embodiment of the first implementation;

[0074] Figure 1G Drawing according to Figure 1A A schematic diagram of the low-reflection film layer in the second embodiment of the first embodiment;

[0075] Figure 1H Drawing according to Figure 1G Wavelength-reflectivity experimental data table in the second embodiment of the first implementation;

[0076] Figure 2A A perspective view of the camera module according to the second embodiment of this disclosure is shown;

[0077] Figure 2B Drawing according to Figure 2A Cross-sectional view of the camera module in the second embodiment;

[0078] Figure 2C Drawing according to Figure 2A Exploded view of the camera module in the second embodiment;

[0079] Figure 2D Drawing according to Figure 2A A cross-sectional view of the flat panel element in the second embodiment;

[0080] Figure 3A A perspective view of the camera module according to the third embodiment of this disclosure is shown;

[0081] Figure 3B Drawing according to Figure 3A A cross-sectional view of the camera module in the third embodiment;

[0082] Figure 3C Drawing according to Figure 3A Exploded view of the camera module in the third embodiment;

[0083] Figure 3D Drawing according to Figure 3A Another exploded view of the camera module in the third embodiment;

[0084] Figure 3E Drawing according to Figure 3A A cross-sectional view of the lens carrier and the flat plate element in the third embodiment;

[0085] Figure 4AA perspective view of the camera module according to the fourth embodiment of this disclosure is shown;

[0086] Figure 4B Drawing according to Figure 4A A cross-sectional view of the camera module in the fourth embodiment;

[0087] Figure 4C Drawing according to Figure 4A Exploded view of the camera module in the fourth embodiment;

[0088] Figure 4D Drawing according to Figure 4A Another exploded view of the camera module in the fourth embodiment;

[0089] Figure 4E Drawing according to Figure 4A A partial perspective view of the camera module in the fourth embodiment;

[0090] Figure 5A A perspective view of the camera module according to the fifth embodiment of this disclosure is shown;

[0091] Figure 5B Drawing according to Figure 5A A schematic diagram of the camera module in the fifth embodiment;

[0092] Figure 5C Drawing according to Figure 5A Partial exploded view of the camera module in the fifth embodiment;

[0093] Figure 5D Drawing according to Figure 5A Exploded view of the camera module in the fifth embodiment;

[0094] Figure 5E Drawing according to Figure 5A Another exploded view of the camera module in the fifth embodiment;

[0095] Figure 6A A perspective view of the camera module according to the sixth embodiment of this disclosure is shown;

[0096] Figure 6B Drawing according to Figure 6A A schematic diagram of the camera module in the sixth embodiment;

[0097] Figure 6C Drawing according to Figure 6A A schematic diagram of the parameters of the camera module in the sixth embodiment;

[0098] Figure 6D Drawing according to Figure 6A Exploded view of the camera module in the sixth embodiment;

[0099] Figure 6E Drawing according to Figure 6A Another exploded view of the camera module in the sixth embodiment;

[0100] Figure 6F Drawing according to Figure 6A A schematic diagram of the prism section in the sixth embodiment;

[0101] Figure 7A A schematic diagram of the camera module according to the seventh embodiment of this disclosure is shown;

[0102] Figure 7B Drawing according to Figure 7A A schematic diagram of the parameters of the camera module in the seventh embodiment;

[0103] Figure 7C Drawing according to Figure 7A A schematic diagram of the prism section in the seventh embodiment;

[0104] Figure 8A A schematic diagram illustrating the electronic device according to the eighth embodiment of this disclosure;

[0105] Figure 8B Drawing according to Figure 8A Another schematic diagram of the electronic device in the eighth embodiment;

[0106] Figure 8C Drawing according to Figure 8A Another schematic diagram of the electronic device in the eighth embodiment;

[0107] Figure 8D Drawing according to Figure 8A A schematic diagram of an image captured by an electronic device in the eighth embodiment;

[0108] Figure 8E Drawing according to Figure 8A Another image diagram captured by the electronic device in the eighth embodiment;

[0109] Figure 8F Drawing according to Figure 8A Another image illustration captured by the electronic device in the eighth embodiment; and

[0110] Figure 8G Drawing according to Figure 8A Another image diagram captured by the electronic device in the eighth embodiment.

[0111] [Symbol Explanation]

[0112] 10, 20, 30, 40, 50, 60, 70: Camera modules

[0113] 11,21,31,41,51,61,71: Photosensitive element

[0114] 110, 210, 310, 410, 510: Flat panel components

[0115] 111,211,311,411,511: Light-transmitting part

[0116] 112, 212, 312, 412, 512, 612, 712: Support section

[0117] 113,513: Transparent plastic injection port

[0118] 114,514: Opaque plastic injection port

[0119] 115:Light shielding part

[0120] 121,221,321,421,521,621,721: First lens

[0121] 122,222,322,422,522,622,722: Second lens

[0122] 123,223,323,423,523,623,723: Third lens

[0123] 124,224,324,424,524,624,724: Fourth lens

[0124] 125, 225, 325, 425, 525: Fifth lens

[0125] 126,326,526: Sixth lens

[0126] 127,327: Seventh Lens

[0127] 128,328: Eighth Lens

[0128] 131,132,231,232,233,331,332,333,334,431,432,433,531,532: Spacer elements

[0129] 133,434,533: Fixed components

[0130] 140, 240, 340, 440, 540, 640, 740: Infrared light reduction film layer

[0131] 151,351,551,651,751: Lens carrier

[0132] 152,652: Drive unit

[0133] 153,653: Carrier plate

[0134] 171,271,371,471,671: Density-sparse structural layers

[0135] 172: Intermediate Layer

[0136] 173: High Refractive Index Layer

[0137] 174: Low Refractive Index Layer

[0138] 475: Anti-reflective multilayer coating

[0139] 570, 770: Low-reflection coating

[0140] 610, 710: Prism elements

[0141] 611, 711: Prism section

[0142] 611a, 711a: Incident surface

[0143] 611b, 711b: Reflecting surface

[0144] 611c, 711c: Emitting surface

[0145] 613: Reflection Enhancement Layer

[0146] 651a: Guide hole

[0147] 652a: Driving magnet

[0148] 652b: Drive coil

[0149] 654: Cover

[0150] 655: Guide shaft

[0151] 80: Electronic devices

[0152] 811: Video playback button

[0153] 812: Image capture module switching button

[0154] 813: Focus and take photo button

[0155] 814: Integrated menu button

[0156] 815: Zoom control button

[0157] 821, 822: Ultra-wide-angle camera module

[0158] 823: Super Telescope Camera Module

[0159] 824, 825: Wide-angle camera module

[0160] 826: Telescope Camera Module

[0161] 827: TOF Module

[0162] 828: Macro Camera Module

[0163] 829: Camera module for biometric sensing

[0164] 83: Indicator Light

[0165] 84: Circuit Board

[0166] 841: Connector

[0167] 85: Single-chip system

[0168] 86: Focusing Auxiliary Components

[0169] 861: Light-emitting element

[0170] L: Central optical path

[0171] P: Hole

[0172] S: Substrate

[0173] G: Colloid

[0174] L1: The distance between the infrared light absorbing element and the infrared light reduction film along the central optical path.

[0175] L2: Infrared light reduces the distance between the film layer and the dense / sparse structure layer along the central optical path.

[0176] L2-1: Infrared light reduces the distance between the film layer and the density-sparse structure layer disposed on the light-incident surface of the light-transmitting part along the central optical path.

[0177] L2-2: Infrared light reduces the distance between the film layer and the density-sparse structure layer disposed on the light-emitting surface of the light-transmitting part along the central optical path.

[0178] L2-3: Infrared light reduction film layer and the density structure layer of the incident surface of the prism part along the central optical path.

[0179] L2-4: The distance between the infrared light reduction film and the density-sparse structure layer on the light-emitting surface of the prism along the central optical path.

[0180] L2': Infrared light reduces the distance between the film layer and the anti-reflection multilayer along the central optical path.

[0181] L2″-1: Distance along the central optical path between the infrared light reduction film and the low-reflection film disposed on the light-incident surface of the light-transmitting part.

[0182] L2″-2: Distance along the central optical path between the infrared light reduction film and the low-reflection film disposed on the light-emitting surface of the light-transmitting part.

[0183] L2″-3: Distance along the central optical path between the infrared light reduction film and the low-reflection film disposed on the incident surface of the prism.

[0184] L2″-4: Distance along the central optical path between the infrared light reduction film and the low-reflection film disposed on the light-emitting surface of the prism.

[0185] THI: Thickness of the light-transmitting part

[0186] GH1, GH2, GH3, GH4: Crystal height Detailed Implementation

[0187] This disclosure provides an imaging optical system comprising, sequentially along a central optical path, an infrared light absorbing element and an infrared light reducing film. The infrared light absorbing element is an infrared light absorbing plastic element used to refract light. The infrared light reducing film is positioned closer to an imaging plane of the imaging optical system than an incident surface of the infrared light absorbing element. The focal length of the imaging optical system is f, and the distance between the infrared light absorbing element and the infrared light reducing film along the central optical path is L1, satisfying the condition: 0.0 ≤ L1 / f ≤ 0.21.

[0188] When L1 / f meets the above conditions, the compatibility between the infrared light absorbing element and the infrared light reducing film can be improved, thereby ensuring the effect of the imaging optical system in filtering out infrared light.

[0189] It must be noted that infrared light absorbing plastics can be doped with infrared light absorbing materials to enable infrared light absorbing elements to absorb infrared light, and infrared light absorbing plastics can be further doped with ultraviolet light absorbing materials to enable infrared light absorbing elements to further absorb ultraviolet light.

[0190] The infrared light reduction film can be a multilayer film, which includes alternating layers of high and low refractive indices, and can form destructive interference to infrared light.

[0191] The imaging optical system may further include a planar element, wherein the imaging optical system sequentially includes an infrared light-absorbing element, an infrared light-reducing film, and the planar element along the central optical path. The planar element is integrally formed and disposed between the infrared light-reducing film and the imaging surface, and includes a light-transmitting portion and a support portion. Further, the light-transmitting portion is disposed corresponding to the imaging surface, and the support portion surrounds the light-transmitting portion, keeping the light-transmitting portion at a specific position on the central optical path. Alternatively, the light-transmitting portion is disposed between the infrared light-reducing film and the imaging surface, corresponding to the imaging surface, and the support portion surrounds the central optical path, with the support portion and the light-transmitting portion integrated, keeping the light-transmitting portion at a specific position on the central optical path. Specifically, an imaging ray travels along the central optical path from the object side through multiple optical elements such as the infrared light-absorbing element and the planar element before reaching the imaging surface. In other words, the imaging ray first passes through the infrared light-absorbing element and then through the infrared light-reducing film, thereby avoiding color distortion of large-angle incident light in the infrared light-reducing film.

[0192] The support portion of the flat panel element can be an opaque plastic support portion. This prevents non-imaging light from passing through the support portion and incident on the photosensitive element. Furthermore, the flat panel element can be integrally molded by injection molding, where the light-transmitting portion can be glass or polymer, and the support portion can be an opaque polymer or ceramic, not limited to the aforementioned materials. Alternatively, the flat panel element can be integrally molded by secondary injection molding, where the light-transmitting portion can be a transparent polymer, and the support portion can be an opaque polymer. The opaque polymer can be made of the same material as the transparent polymer, and a dye can be added to make the opaque polymer opaque, thereby improving adhesion. Alternatively, the flat panel element can be integrated with the light-transmitting portion through bonding, thermal riveting, or interlocking, but this is not a limitation.

[0193] The flat panel element may further include a light-shielding portion, which is disposed adjacent to the light-transmitting portion to prevent non-imaging light from incident on the photosensitive element.

[0194] The imaging optical system has a focal length of f and a light-transmitting portion thickness of THI, which satisfies the condition: 0.005 ≤ THI / f ≤ 0.35. This increases the design freedom of the imaging optical system, thereby improving image quality or reducing the size of the camera module.

[0195] The imaging optical system may further include a prism element, wherein the imaging optical system sequentially includes an infrared light absorbing element, an infrared light reducing film, and a prism element along the central optical path. The prism element includes a prism portion and a support portion, wherein the prism portion sequentially includes an incident light surface, at least one reflecting surface, and an exiting light surface along the central optical path, the exiting light surface of the prism portion is correspondingly disposed to the imaging surface, and the support portion supports the prism portion, so that the prism portion is held at a specific position on the central optical path.

[0196] The support portion of the prism element can be an opaque plastic support portion.

[0197] The imaging optical system may further include a low-reflection coating layer, wherein the imaging optical system sequentially includes an infrared light absorbing element, an infrared light reducing coating layer, a flat panel element, and a low-reflection coating layer along the central optical path; or, the imaging optical system sequentially includes an infrared light absorbing element, an infrared light reducing coating layer, a prism element, and a low-reflection coating layer along the central optical path. The low-reflection coating layer is disposed on at least one of the light-incident surface and the light-exit surface of the light-transmitting portion, and simultaneously covers at least a portion of the support portion, wherein the low-reflection coating layer may be simultaneously disposed on at least a portion of a surface of the support portion; or, the low-reflection coating layer is disposed on at least one of the light-incident surface and the light-exit surface of the prism portion. The low-reflection coating layer has an average reflectivity of less than 0.98% for light in the wavelength range of 420 nm to 680 nm.

[0198] The focal length of the imaging optical system is f, and the distance between the infrared light reduction coating and the low-reflection coating along the central optical path is L2″, which satisfies the following condition: 0.21 ≤ L2″ / f. When L2″ / f satisfies the above condition, ghosting caused by large-angle incident light between the infrared light reduction coating and the low-reflection coating can be further avoided, thereby ensuring image quality. Furthermore, the infrared light reduction coating can be placed outside the light-transmitting part, thereby avoiding ghosting caused by reflection between the infrared light reduction coating and the surface of the photosensitive element.

[0199] The low-reflectance coating can achieve an average reflectance of less than 0.98% for light in the wavelength range of 400 nm to 900 nm. Furthermore, the low-reflectance coating can achieve an average reflectance of less than 0.5% for light in the same wavelength range.

[0200] The flat panel element may further include a density-sparse structure layer. Specifically, the low-reflection film layer may include a density-sparse structure layer, wherein the density-sparse structure layer is disposed on at least one of a light-incident surface and a light-exit surface of the light-transmitting portion. The density-sparse structure layer gradually thins towards the air direction, and multiple pores are formed on at least one of the light-incident surface and the light-exit surface of the light-transmitting portion. Furthermore, the density-sparse structure layer may be simultaneously disposed on both the light-incident surface and the light-exit surface of the light-transmitting portion, and may also be simultaneously disposed on at least a portion of a surface of the support portion, thereby further reducing the risk of glare from the support portion. The main material of the density-sparse structure layer may be ceramic. The average reflectance of the density-sparse structure layer for light in the wavelength range of 420nm to 680nm is less than 0.98%, wherein the average crystal height of the density-sparse structure layer is GH, which satisfies the following condition: 60nm ≤ GH ≤ 400nm. Additionally, it satisfies the following condition: 120nm ≤ GH ≤ 300nm. Specifically, the density-sparse structure layer can further provide a minimum reflectance of less than 0.5%.

[0201] Furthermore, the dense-sparse structure layer can be a multilayer film, and the ceramic can be an oxide, nitride, or carbide of elements such as aluminum, silicon, titanium, zirconium, tantalum, niobium, and chromium, but is not limited thereto. To further explain, the ceramic can be alumina, silicon oxide, titanium oxide, etc. The dense-sparse structure layer can be formed by chemical etching, generation, electrochemical etching, laser, plasma, semiconductor processes (processes may include exposure, development, etching, etc.), but is not limited thereto.

[0202] The focal length of the imaging optical system is f, and the distance between the infrared light reduction film and the density-sparse structure layer along the central optical path is L2, which satisfies the following condition: 0.21 ≤ L2 / f. When L2 / f satisfies the above condition, ghosting caused by large-angle incident light between the infrared light reduction film and the density-sparse structure layer can be further avoided, thereby ensuring image quality. Furthermore, the infrared light reduction film can be placed outside the light-transmitting part, thereby avoiding ghosting caused by reflection between the infrared light reduction film and the surface of the photosensitive element.

[0203] The average reflectivity of the density-sparse structure layer for light in the wavelength range of 400 nm to 900 nm can be less than 0.98%. Furthermore, the average reflectivity of the density-sparse structure layer for light in the wavelength range of 400 nm to 900 nm can be less than 0.5%.

[0204] The imaging optical system may further include an interposer layer. Specifically, the low-reflection film layer may include an interposer layer connecting the density-sparse structure layer and the planar element. The interposer layer is in solid contact with the planar element, and the interposer layer is in contact with air through at least one of the apertures. The interposer layer can improve the adhesion of the density-sparse structure layer, thereby increasing the lifetime of the density-sparse structure layer. The interposer layer may be a multilayer film to further increase the adhesion of the density-sparse structure layer. Furthermore, a substrate may be disposed on the surface of the planar element.

[0205] The imaging optical system may further include an anti-reflective multilayer coating. Specifically, the low-reflection coating may include an anti-reflective multilayer coating. The imaging optical system sequentially includes an infrared light-absorbing element, an infrared light-reducing coating, a planar element, and the anti-reflective multilayer coating along the central optical path. The anti-reflective multilayer coating is disposed on at least one of an incident surface and an exit surface of the light-transmitting portion. The anti-reflective multilayer coating includes multiple high-refractive-index layers and multiple low-refractive-index layers, which are alternately stacked to eliminate reflected light through interference principles. Furthermore, the anti-reflective multilayer coating may simultaneously cover at least a portion of the support portion, and the average reflectivity of the anti-reflective multilayer coating for light in the wavelength range of 420 nm to 680 nm is less than 0.98%.

[0206] The anti-reflective multi-layer coating can be simultaneously disposed on the light-incident surface and the light-exit surface of the light-transmitting part, and the anti-reflective multi-layer coating can be simultaneously disposed on at least a portion of one surface of the support part.

[0207] The focal length of the imaging optical system is f, and the distance between the infrared light-reducing coating and the anti-reflective multilayer coating along the central optical path is L2', which satisfies the following condition: 0.21 ≤ L2' / f. When L2' / f satisfies the above condition, ghosting caused by large-angle incident light between the infrared light-reducing coating and the anti-reflective multilayer coating can be further avoided, thereby ensuring image quality. Furthermore, the infrared light-reducing coating can be placed outside the light-transmitting portion, thereby avoiding ghosting caused by reflection between the infrared light-reducing coating and the surface of the photosensitive element.

[0208] The average reflectivity of the anti-reflective multilayer film for light in the wavelength range of 400nm to 900nm can be less than 0.98%.

[0209] The low-reflection film can be simultaneously disposed on the light-incident surface and the light-exit surface of the light-transmitting part. The low-reflection film disposed on the light-incident surface of the light-transmitting part can include one of an anti-reflection multilayer film and a sparse-dense structure layer, and the low-reflection film disposed on the light-exit surface of the light-transmitting part can include one of an anti-reflection multilayer film and a sparse-dense structure layer.

[0210] A low-reflection coating can be simultaneously disposed on both the light-incident surface and the light-exit surface of the prism. The low-reflection coating on the light-incident surface of the prism comprises one of an anti-reflection multilayer coating and a density-sparse structure layer, and the low-reflection coating on the light-exit surface of the prism comprises one of an anti-reflection multilayer coating and a density-sparse structure layer. Furthermore, the density-sparse structure layer can be disposed on at least one of the light-incident surface and the light-exit surface of the prism, and at least one of the light-incident surface and the light-exit surface of the prism forms a hole.

[0211] An infrared light reduction film can be applied to one of the light-emitting surfaces of an infrared light-absorbing element. Specifically, when L1 / f = 0, the number of optical elements can be further reduced, thereby minimizing the size.

[0212] The imaging optical system may further include a film layer setting element, wherein the film layer setting element is disposed on an image side of the infrared light absorbing element, and an infrared light reducing film is disposed on one of an incident light surface and an exit light surface of the film layer setting element, and the film layer setting element is adjacent to the infrared light absorbing element. Thus, the absorption efficiency of the film layer setting element for infrared light can be improved by using the infrared light absorbing element.

[0213] The imaging optical system may further include a colloid, wherein the colloid bonds an infrared light absorbing element and a film layer setting element. This allows the infrared light absorbing element to improve the absorption efficiency of infrared light by the film layer setting element, further enhancing the optical quality of the imaging optical system.

[0214] The various technical features in the imaging optical system disclosed above can be combined and configured to achieve the corresponding effects.

[0215] This disclosure provides a camera module including an imaging optical system and a photosensitive element. The imaging optical system includes an imaging lens, a flat panel element, and a low-reflection coating. The imaging lens includes multiple lenses, an infrared light-reducing coating, and a lens carrier. The lenses are arranged sequentially along a central optical path, wherein each lens includes an infrared light-absorbing lens, and the infrared light-absorbing lens is an infrared light-absorbing plastic lens. The infrared light-reducing coating is disposed on a light-emitting surface of the infrared light-absorbing lens. The lens carrier houses the lenses and the infrared light-reducing coating. The flat panel element is disposed between the imaging lens and the photosensitive element, and includes a light-transmitting portion and a support portion, wherein the light-transmitting portion is correspondingly disposed to the photosensitive element, and the support portion surrounds the central optical path and maintains a specific distance between the light-transmitting portion of the flat panel element and the photosensitive element. The low-reflection coating is disposed on at least one of a light-incident surface and a light-emitting surface of the light-transmitting portion. The photosensitive element is disposed on an image side of the lens carrier, and the central optical path passes through the imaging lens and is transmitted to the photosensitive element. The low-reflectance coating has an average reflectance of less than 0.98% in the wavelength range of 420 nm to 680 nm. The focal length of the imaging optical system is f, the distance between the infrared light reduction coating and the low-reflectance coating along the central optical path is L2″, and the thickness of the light-transmitting part of the flat panel element is THI, which satisfies the following conditions: 0.21 ≤ L2″ / f; and 0.005 ≤ THI / f ≤ 0.35.

[0216] When L2″ / f meets the above conditions, ghosting caused by large-angle incident light between the infrared light reduction film and the low-reflection film can be further avoided, thereby ensuring image quality. Furthermore, the infrared light reduction film can be removed from the light-transmitting portion, thereby preventing ghosting caused by reflection between the infrared light reduction film and the surface of the photosensitive element.

[0217] When THI / f meets the above conditions, the design freedom of the imaging lens can be increased, thereby improving image quality or reducing the size of the camera module.

[0218] This disclosure provides an electronic device that includes the aforementioned camera module.

[0219] Based on the above implementation methods, specific implementation methods and examples are presented below in conjunction with the accompanying drawings for detailed description.

[0220] <First Implementation>

[0221] Please refer to Figures 1A to 1C ,in Figure 1A A cross-sectional view of the camera module 10 according to the first embodiment of this disclosure is shown. Figure 1B Drawing according to Figure 1A A partial perspective view of the camera module 10 in the first embodiment. Figure 1C Drawing according to Figure 1A A partially exploded view of the camera module 10 in the first embodiment. Figures 1A to 1CAs can be seen, the camera module 10 includes an imaging optical system (not shown) and a photosensitive element 11, wherein the imaging optical system includes an imaging lens (not shown) and a flat panel element 110.

[0222] Furthermore, the imaging optical system sequentially includes an infrared light absorbing element, an infrared light reducing film 140, and a flat panel element 110 along the central optical path L, wherein the infrared light reducing film 140 is disposed on a light-emitting surface of the infrared light absorbing element. The infrared light absorbing element is an infrared light absorbing plastic element used to refract light, and in the first embodiment, the infrared light absorbing element is an infrared light absorbing lens. The infrared light reducing film 140 is closer to an imaging surface of the imaging optical system (not shown) than a light-incident surface of the infrared light absorbing element. It must be noted that the infrared light absorbing plastic can be doped with infrared light absorbing materials to enable the infrared light absorbing element to absorb infrared light, and the infrared light absorbing plastic can be further doped with ultraviolet light absorbing materials to enable the infrared light absorbing element to further absorb ultraviolet light.

[0223] Furthermore, an imaging ray (not shown) travels along the central optical path L from the object side through multiple optical elements, including the infrared light absorbing element and the flat panel element 110, before reaching the imaging surface. In other words, the imaging ray first passes through the infrared light absorbing element and then through the infrared light reducing film 140, thereby preventing color distortion of large-angle incident light in the infrared light reducing film 140. Furthermore, the central optical path L passes through the imaging lens and then reaches the photosensitive element 11.

[0224] The infrared light reduction film 140 can be a multilayer film, wherein the infrared light reduction film 140 includes alternating layers of high and low refractive indices, which can form destructive interference to infrared light.

[0225] The imaging lens comprises multiple lenses, an infrared light-reducing coating 140, and a lens carrier 151. Specifically, along a central optical path L, the imaging lens sequentially comprises a first lens 121, a second lens 122, an infrared light-reducing coating 140, a third lens 123, a fourth lens 124, a fifth lens 125, a spacer element 131, a sixth lens 126, a seventh lens 127, a spacer element 132, an eighth lens 128, and a fixing element 133. The lens carrier 151 houses the first lens 121, the second lens 122, the third lens 123, the fourth lens 124, the fifth lens 125, the sixth lens 126, the seventh lens 127, the eighth lens 128, the spacer elements 131 and 132, the fixing element 133, and the infrared light-reducing coating 140. The photosensitive element 11 is disposed on one image side of the lens carrier 151. It must be noted that the number, structure, surface shape, and other optical characteristics of the lenses and optical elements can be configured according to different imaging requirements and are not limited thereto.

[0226] In the first embodiment, the first lens 121 is an infrared light absorbing element. It must be noted that, for the purpose of clearly illustrating the coverage area of ​​the infrared light reducing film 140, the thickness of the infrared light reducing film 140 is not the actual thickness.

[0227] The imaging optical system further includes a film layer setting element, wherein the film layer setting element is disposed on the image side of the infrared light absorbing element, and the infrared light reducing film 140 is disposed on one of the light-incident surface and the light-exit surface of the film layer setting element. In the first embodiment, the infrared light reducing film 140 is disposed on the light-incident surface of the third lens 123, and the third lens 123 is the film layer setting element.

[0228] A flat panel element 110 is integrally formed and disposed between the infrared light reduction film layer 140 and the imaging surface. The flat panel element 110 is also disposed between the eighth lens 128 and the photosensitive element 11. The flat panel element 110 includes a light-transmitting portion 111, a support portion 112, a transparent plastic injection port 113, an opaque plastic injection port 114, and a light-shielding portion 115. The light-transmitting portion 111 is disposed corresponding to the imaging surface. The support portion 112 surrounds the light-transmitting portion 111, maintaining the light-transmitting portion 111 at a specific position on the central optical path L. The support portion 112 surrounds the central optical path L, maintaining a specific distance between the light-transmitting portion 111 and the photosensitive element 11. The light-shielding portion 115 is disposed adjacent to the light-transmitting portion 111 to prevent non-imaging light from incident on the photosensitive element 11. The support portion 112 and the light-transmitting portion 111 can be made of transparent plastic, while the light-shielding portion 115 can be made of black plastic. The flat panel element 110 can be integrally molded by secondary injection molding, but is not limited to this. Specifically, the transparent plastic injection port 113 is provided correspondingly to the support portion 112, and the opaque plastic injection port 114 is provided correspondingly to the light-shielding portion 115.

[0229] Depend on Figure 1A and Figure 1C It is understood that the flat panel element 110 also includes a density-sparse structure layer 171, wherein the density-sparse structure layer 171 is simultaneously disposed on a light-incident surface and a light-exit surface of the light-transmitting portion 111, and the density-sparse structure layer 171 disposed on the light-incident surface of the light-transmitting portion 111 is also disposed on a portion of the surface of the light-shielding portion 115. In this way, glare reflected through the surface of the light-shielding portion 115 can be avoided, thereby blocking non-imaging light.

[0230] The imaging lens also includes a drive unit 152 and a carrier plate 153. The drive unit 152 can drive the lens carrier 151 to move relative to the photosensitive element 11 in at least one direction of the horizontal and vertical central optical path L, so that the camera module 10 has functions such as focusing and image stabilization. The carrier plate 153 may be a printed circuit board, but is not limited thereto, and the support portion 112 is disposed on the carrier plate 153, so that the light-transmitting portion 111 is further held at a specific position on the central optical path L.

[0231] Please refer to Figure 1D and Figure 1E ,in Figure 1D Drawing according to Figure 1A A schematic diagram of the low-reflection film layer in the first embodiment of the first implementation. Figure 1E Drawing according to Figure 1D Scanning electron microscope image of the dense-sparse structure layer 171 in the first embodiment of the first implementation. Figure 1D and Figure 1E As can be seen, the imaging optical system also includes a low-reflection film layer (not shown in the figure), which comprises a density-sparse structure layer 171 and an interposer layer 172. The density-sparse structure layer 171 enables the low-reflection film layer to have anti-reflection functionality, while the interposer layer 172 connects the density-sparse structure layer 171 to a substrate S on the surface of the flat panel element 110, and the interposer layer 172 is in solid contact with the substrate S. Furthermore, the interposer layer 172 is a multilayer film, thereby improving the adhesion of the density-sparse structure layer 171.

[0232] The density-sparse structure layer 171 gradually thins out from the substrate S towards the air, and forms multiple holes P on the light-incident and light-exit surfaces of the light-transmitting portion 111. The intermediate layer 172 contacts the air through at least one of the holes P. This ensures the low-reflection functionality of the density-sparse structure layer 171.

[0233] It should be noted that the substrate S may refer to one of the light-transmitting portion 111, the support portion 112, and the light-shielding portion 115 of the flat panel element 110. Figure 1D The thickness and number of layers of the intermediate layer 172 in the partial cross-sectional view are only for illustration. The thickness and number of layers can be adjusted according to actual needs. The thickness of the dense and sparse structural layer 171 is not the actual thickness. It is only used to clearly illustrate the coverage range of the dense and sparse structural layer 171 and is not limited thereto.

[0234] Depend on Figure 1D It can be seen that the crystal heights of the dense-sparse structure layer 171 are GH1, GH2, GH3 and GH4, respectively, and the average crystal height of the dense-sparse structure layer 171 is GH, where GH1 is 189.56nm, GH2 is 303.28nm, GH3 is 271.88nm, GH4 is 112.67nm, and GH is 219.35nm.

[0235] Please refer to Figure 1F Its drawing is based on Figure 1D A wavelength-reflectivity experimental data table from the first embodiment of the first implementation. Figure 1FIt can be seen that the average reflectance of the density-sparse structure layer 171 for a single ray in the wavelength range of 420nm to 680nm is 0.022%, the average reflectance of the density-sparse structure layer 171 for a single ray in the wavelength range of 400nm to 900nm is 0.023%, and the lowest reflectance of the density-sparse structure layer 171 for a single ray in the wavelength range of 420nm to 680nm is 0.012%.

[0236] Please refer to Figure 1G Its drawing is based on Figure 1A A schematic diagram of the low-reflection film layer in the second embodiment of the first embodiment. Figure 1G It is known that the low-reflection film layer also includes an anti-reflection multilayer (not shown in the figure), wherein the anti-reflection multilayer includes multiple high-refractive-index layers 173 and multiple low-refractive-index layers 174, and the high-refractive-index layers 173 and low-refractive-index layers 174 are stacked alternately, so that the low-reflection film layer has the function of anti-reflection, and the reflected light is eliminated through the interference principle.

[0237] It must be stated that, Figure 1G The thickness and number of layers of the intermediate layer 172, high refractive index layer 173 and low refractive index layer 174 in the partial cross-sectional view are for illustrative purposes only. Their thickness, number of layers and order can be adjusted according to actual needs and are not limited thereto.

[0238] Please refer to Figure 1H Its drawing is based on Figure 1G Wavelength-reflectivity experimental data table from the second embodiment of the first implementation. Figure 1H It can be seen that the anti-reflective multilayer has an average reflectivity of 0.43% for light in the wavelength range of 420nm to 680nm, an average reflectivity of 0.93% for light in the wavelength range of 400nm to 900nm, and a minimum reflectivity of 0.23% for light in the wavelength range of 420nm to 680nm.

[0239] Depend on Figure 1A It can be seen that the focal length of the imaging optical system is f, the distance between the infrared light absorbing element (first lens 121 in the first embodiment) and the infrared light reducing film 140 along the central optical path L is L1, the distance between the infrared light reducing film 140 and the dense-sparse structure layer 171 disposed on the light-incident surface of the light-transmitting part 111 along the central optical path L is L2-1, the distance between the infrared light reducing film 140 and the dense-sparse structure layer 171 disposed on the light-outceasing surface of the light-transmitting part 111 along the central optical path L is L2-2, and the thickness of the light-transmitting part 111 is THI. The parameters satisfy the conditions in Table 1A below.

[0240]

[0241]

[0242] <Second Implementation>

[0243] Please refer to Figures 2A to 2C ,in Figure 2A A perspective view of the camera module 20 according to the second embodiment of this disclosure is shown. Figure 2B Drawing according to Figure 2A A cross-sectional view of the camera module 20 in the second embodiment. Figure 2C Drawing according to Figure 2A An exploded view of the camera module 20 in the second embodiment. Figures 2A to 2C As can be seen, the camera module 20 includes an imaging optical system (not shown) and a photosensitive element 21, wherein the imaging optical system includes an imaging lens (not shown) and a flat panel element 210.

[0244] Furthermore, the imaging optical system sequentially includes an infrared light absorbing element, an infrared light reducing film 240, and a flat panel element 210 along the central optical path L, wherein the infrared light reducing film 240 is disposed on a light-emitting surface of the infrared light absorbing element. The infrared light absorbing element is an infrared light absorbing plastic element used to refract light, and in the second embodiment, the infrared light absorbing element is an infrared light absorbing lens. The infrared light reducing film 240 is closer to an imaging surface of the imaging optical system (not shown) than a light-incident surface of the infrared light absorbing element.

[0245] The imaging lens comprises multiple lenses and an infrared light-reducing coating 240. Specifically, along a central optical path L, the imaging lens sequentially comprises a first lens 221, a second lens 222, a spacer element 231, a third lens 223, a spacer element 232, a fourth lens 224, an infrared light-reducing coating 240, a fifth lens 225, and a spacer element 233. It must be noted that the number, structure, surface shape, and other optical characteristics of the lenses and other optical elements can be configured according to different imaging requirements and are not limited thereto.

[0246] The imaging optical system also includes a film layer setting element, wherein the film layer setting element is disposed on the image side of the infrared light absorbing element, and the infrared light reducing film 240 is disposed on one of the light-incident surface and the light-exit surface of the film layer setting element. In the second embodiment, the infrared light reducing film 240 is disposed on the light-incident surface of the fifth lens 225, the fourth lens 224 is the infrared light absorbing element, and the fifth lens 225 is the film layer setting element. Furthermore, the infrared light reducing film 240 may also be disposed on the light-exit surface of the fifth lens 225.

[0247] Furthermore, the film layer element is positioned adjacent to the infrared light absorbing element, and the imaging optical system also includes a colloid G, which bonds the infrared light absorbing element and the film layer element. This improves the absorption efficiency of the film layer element for infrared light by utilizing the infrared light absorbing element, thereby enhancing the optical quality of the camera module 20. Moreover, by using the colloid G between the bonded infrared light absorbing element and the film layer element to replace an air gap, ghosting caused by surface reflection is reduced.

[0248] Please refer to Figure 2D Its drawing is based on Figure 2A A cross-sectional view of the flat panel element 210 in the second embodiment. Figure 2D As can be seen, the flat panel element 210 includes a light-transmitting portion 211 and a support portion 212, wherein the light-transmitting portion 211 and the support portion 212 are integrally formed into the flat panel element 210 by embedded injection molding. Specifically, the light-transmitting portion 211 is disposed corresponding to the imaging surface, and the support portion 212 surrounds the light-transmitting portion 211, keeping the light-transmitting portion 211 at a specific position on the central optical path L. The support portion 212 surrounds the central optical path L and maintains a specific distance between the light-transmitting portion 211 of the flat panel element 210 and the photosensitive element 21. The support portion 212 of the flat panel element 210 is further used to accommodate a first lens 221, a second lens 222, a third lens 223, a fourth lens 224, a fifth lens 225, and spacer elements 231, 232, and 233.

[0249] The material of the light-transmitting part 211 can be glass or plastic, while the support part 212 is an injection-molded part and its material can be opaque plastic. However, the materials of the light-transmitting part 211 and the support part 212 are not limited to those mentioned above. The opaque plastic material of the support part 212 can prevent non-imaging light from passing through the support part 212 and entering the photosensitive element 21.

[0250] Depend on Figure 2B and Figure 2C It is understood that the flat panel element 210 further includes a density-sparse structure layer 271, wherein the density-sparse structure layer 271 is simultaneously disposed on a light-incident surface and a light-exit surface of the light-transmitting portion 211, and the density-sparse structure layer 271 disposed on the light-exit surface of the light-transmitting portion 211 simultaneously covers at least a portion of the surface of the support portion 212. This further reduces the risk of glare generated by the support portion 212.

[0251] Depend on Figure 2BIt can be seen that the focal length of the imaging optical system is f, the distance between the infrared light absorbing element (the fourth lens 224 in the second embodiment) and the infrared light reducing film 240 along the central optical path L is L1, the distance between the infrared light reducing film 240 and the dense-sparse structure layer 271 disposed on the light-incident surface of the light-transmitting part 211 along the central optical path L is L2-1, the distance between the infrared light reducing film 240 and the dense-sparse structure layer 271 disposed on the light-exiting surface of the light-transmitting part 211 along the central optical path L is L2-2, and the thickness of the light-transmitting part 211 is THI. The parameters satisfy the conditions in Table 2A below.

[0252]

[0253] <Third Implementation Method>

[0254] Please refer to Figures 3A to 3D ,in Figure 3A A perspective view of the camera module 30 according to the third embodiment of this disclosure is shown. Figure 3B Drawing according to Figure 3A A cross-sectional view of the camera module 30 in the third embodiment. Figure 3C Drawing according to Figure 3A An exploded view of the camera module 30 in the third embodiment. Figure 3D Drawing according to Figure 3A Another exploded view of the camera module 30 in the third embodiment. Figures 3A to 3D As can be seen, the camera module 30 includes an imaging optical system (not shown) and a photosensitive element 31, wherein the imaging optical system includes an imaging lens (not shown) and a flat panel element 310.

[0255] Furthermore, the imaging optical system sequentially includes an infrared light absorbing element, an infrared light reducing film 340, and a flat panel element 310 along the central optical path L, wherein the infrared light reducing film 340 is disposed on a light-emitting surface of the infrared light absorbing element. The infrared light absorbing element is an infrared light absorbing plastic element used to refract light, and in the third embodiment, the infrared light absorbing element can be regarded as an infrared light absorbing lens. The infrared light reducing film 340 is closer to an imaging surface of the imaging optical system (not shown) than a light-incident surface of the infrared light absorbing element.

[0256] The imaging lens comprises multiple lenses, an infrared light-reducing coating 340, and a lens carrier 351. Specifically, along a central optical path L, the imaging lens sequentially comprises a first lens 321, a second lens 322, a spacer element 331, a spacer element 332, a third lens 323, a fourth lens 324, a fifth lens 325, an infrared light-reducing coating 340, a spacer element 333, a sixth lens 326, a seventh lens 327, a spacer element 334, and an eighth lens 328. It must be noted that the number, structure, surface shape, and other optical characteristics of the lenses and optical elements can be configured according to different imaging requirements and are not limited thereto.

[0257] In the third embodiment, the fifth lens 325 is an infrared light absorbing element, and the infrared light reducing film layer 340 is disposed on the light emitting surface of the fifth lens 325.

[0258] Please refer to the following: Figure 3E Its drawing is based on Figure 3A A cross-sectional view of the lens carrier 351 and the flat plate element 310 in the third embodiment. Figures 3B to 3E As can be seen, the flat panel element 310 includes a light-transmitting portion 311 and a support portion 312. Specifically, the light-transmitting portion 311 is disposed corresponding to the imaging surface, and the support portion 312 surrounds the light-transmitting portion 311, keeping the light-transmitting portion 311 at a specific position on the central optical path L. The support portion 312 surrounds the central optical path L and maintains a specific distance between the light-transmitting portion 311 of the flat panel element 310 and the photosensitive element 31.

[0259] In detail, the lens carrier 351 is used to accommodate the first lens 321, the second lens 322, the third lens 323, the fourth lens 324 and the spacers 331 and 332, and the support portion 312 of the flat plate element 310 is further used to accommodate the lens carrier 351, the fifth lens 325, the sixth lens 326, the seventh lens 327, the eighth lens 328 and the spacers 333 and 334.

[0260] Depend on Figure 3B It is known that the material of the light-transmitting part 311 can be transparent glass or transparent plastic, and the support part 312 can be molded from black plastic. The light-transmitting part 311 and the support part 312 are bonded together by a glue G.

[0261] Depend on Figure 3B It is understood that the flat panel element 310 also includes a density-sparse structure layer 371, wherein the density-sparse structure layer 371 is simultaneously disposed on a light-incident surface and a light-exit surface of the light-transmitting portion 311. Furthermore, the density-sparse structure layer 371 simultaneously covers at least a portion of the surface of the support portion 312. In this way, the risk of glare generated by the support portion 312 can be further reduced.

[0262] Depend on Figure 3BIt can be seen that the focal length of the imaging optical system is f, the distance between the infrared light reduction film 340 and the density structure layer 371 disposed on the light-incident surface of the light-transmitting part 311 along the central optical path L is L2-1, the distance between the infrared light reduction film 340 and the density structure layer 371 disposed on the light-exiting surface of the light-transmitting part 311 along the central optical path L is L2-2, and the thickness of the light-transmitting part 311 is THI. The parameters satisfy the conditions in Table 3A below.

[0263]

[0264] <Fourth Implementation>

[0265] Please refer to Figures 4A to 4D ,in Figure 4A A perspective view of the camera module 40 according to the fourth embodiment of this disclosure is shown. Figure 4B Drawing according to Figure 4A A cross-sectional view of the camera module 40 in the fourth embodiment. Figure 4C Drawing according to Figure 4A An exploded view of the camera module 40 in the fourth embodiment. Figure 4D Drawing according to Figure 4A Another exploded view of the camera module 40 in the fourth embodiment. Figures 4A to 4D As can be seen, the camera module 40 includes an imaging optical system (not shown) and a photosensitive element 41, wherein the imaging optical system includes an imaging lens (not shown) and a flat panel element 410.

[0266] Furthermore, the imaging optical system sequentially includes an infrared light absorbing element, an infrared light reducing film 440, and a flat panel element 410 along the central optical path L, wherein the infrared light reducing film 440 is disposed on a light-emitting surface of the infrared light absorbing element. The infrared light absorbing element is an infrared light absorbing plastic element used to refract light, and in the fourth embodiment, the infrared light absorbing element can be regarded as an infrared light absorbing lens. The infrared light reducing film 440 is closer to an imaging surface of the imaging optical system (not shown) than a light-incident surface of the infrared light absorbing element.

[0267] The imaging lens comprises multiple lenses and an infrared light-reducing coating 440. Specifically, along a central optical path L, the imaging lens sequentially includes a first lens 421, an infrared light-reducing coating 440, a second lens 422, a spacer element 431, a third lens 423, a spacer element 432, a fourth lens 424, a spacer element 433, a fifth lens 425, and a fixing element 434. It must be noted that the number, structure, surface shape, and other optical characteristics of the lenses and other optical elements can be configured according to different imaging requirements and are not limited thereto.

[0268] In the fourth embodiment, the first lens 421 is an infrared light absorbing element, and the infrared light reducing film layer 440 is disposed on the light emitting surface of the first lens 421.

[0269] Please refer to Figure 4E Its drawing is based on Figure 4A A partial perspective view of the camera module 40 in the fourth embodiment. Figures 4B to 4E It is known that the imaging optical system also includes a colloid G, wherein the colloid G is disposed between the light-transmitting part 411 and the photosensitive element 41.

[0270] The flat panel element 410 includes a light-transmitting portion 411 and a support portion 412, wherein the light-transmitting portion 411 and the support portion 412 are integrally formed into the flat panel element 410 by a thermal riveting process. Specifically, the light-transmitting portion 411 is disposed corresponding to the imaging surface, and the support portion 412 surrounds the light-transmitting portion 411, holding the light-transmitting portion 411 at a specific position on the central optical path L. The support portion 412 surrounds the central optical path L and maintains a specific distance between the light-transmitting portion 411 of the flat panel element 410 and the photosensitive element 41. The support portion 412 of the flat panel element 410 further accommodates a first lens 421, a second lens 422, a third lens 423, a fourth lens 424, a fifth lens 425, spacer elements 431, 432, and 433, and a fixing element 434.

[0271] The material of the light-transmitting part 411 can be transparent glass or transparent plastic, while the support part 412 can be molded from black plastic, but the materials of the light-transmitting part 411 and the support part 412 are not limited to the above-mentioned materials. The support part 412, made of opaque plastic material, can prevent non-imaging light from passing through the support part 412 and entering the photosensitive element 41.

[0272] The imaging optical system also includes a low-reflection coating (not shown in the figure), which is simultaneously disposed on both an incident surface and an exit surface of the light-transmitting portion 411. The low-reflection coating disposed on the incident surface of the light-transmitting portion 411 includes a density-sparse structure layer 471, and the low-reflection coating disposed on the exit surface of the light-transmitting portion 411 includes an anti-reflection multilayer 475. Furthermore, the anti-reflection multilayer 475 includes multiple high-refractive-index layers and multiple low-refractive-index layers, with the high-refractive-index layers and low-refractive-index layers alternately stacked to give the low-reflection coating anti-reflection functionality. Moreover, the anti-reflection multilayer 475 is further disposed on a portion of the surface of the support portion 412 to prevent glare reflected through the surface of the support portion 412 and to block non-imaging light rays.

[0273] Depend on Figure 4BIt can be seen that the focal length of the imaging optical system is f, the distance between the infrared light reduction film 440 and the sparse-dense structure layer 471 along the central optical path L is L2, the distance between the infrared light reduction film 440 and the anti-reflection multi-film layer 475 along the central optical path L is L2', and the thickness of the light-transmitting part 411 is THI. The parameters satisfy the conditions in Table 4A below.

[0274]

[0275]

[0276] <Fifth Implementation>

[0277] Please refer to Figures 5A to 5E ,in Figure 5A A perspective view of the camera module 50 according to the fifth embodiment of this disclosure is shown. Figure 5B Drawing according to Figure 5A A schematic diagram of the camera module 50 in the fifth embodiment. Figure 5C Drawing according to Figure 5A A partially exploded view of the camera module 50 in the fifth embodiment. Figure 5D Drawing according to Figure 5A An exploded view of the camera module 50 in the fifth embodiment. Figure 5E Drawing according to Figure 5A Another exploded view of the camera module 50 in the fifth embodiment. Figures 5A to 5E As can be seen, the camera module 50 includes an imaging optical system (not shown) and a photosensitive element 51. The imaging optical system includes an imaging lens (not shown) and a flat panel element 510, and the imaging lens is disposed on the flat panel element 510 so that the imaging lens and the photosensitive element 51 are relatively fixed.

[0278] The imaging optical system sequentially includes an infrared light absorbing element, an infrared light reducing film 540, and a flat panel element 510 along the central optical path L. The infrared light reducing film 540 is disposed on a light-emitting surface of the infrared light absorbing element. The infrared light absorbing element is an infrared light absorbing plastic element used to refract light, and in the fifth embodiment, it can be considered as an infrared light absorbing lens. The infrared light reducing film 540 is closer to an imaging surface of the imaging optical system (not shown) than a light-incident surface of the infrared light absorbing element.

[0279] The imaging lens comprises multiple lenses, an infrared light-reducing coating 540, and a lens carrier 551. Specifically, along a central optical path L, the imaging lens sequentially comprises a first lens 521, an infrared light-reducing coating 540, a second lens 522, a third lens 523, a fourth lens 524, a spacer element 531, a fifth lens 525, a spacer element 532, a sixth lens 526, and a fixing element 533. The lens carrier 551 houses the first lens 521, the second lens 522, the third lens 523, the fourth lens 524, the fifth lens 525, the sixth lens 526, the spacers 531 and 532, and the fixing element 533. It must be noted that the number, structure, surface shape, and other optical characteristics of the lenses and optical elements can be configured according to different imaging requirements and are not limited thereto.

[0280] In the fifth embodiment, the first lens 521 is an infrared light absorbing element, and the infrared light reducing film layer 540 is disposed on the light emitting surface of the first lens 521.

[0281] The flat panel element 510 includes a light-transmitting portion 511, a support portion 512, a transparent plastic injection port 513, and an opaque plastic injection port 514. The light-transmitting portion 511 and the support portion 512 are integrally formed into the flat panel element 510 through secondary injection molding. Specifically, the light-transmitting portion 511 is disposed corresponding to the imaging surface, and the support portion 512 surrounds the light-transmitting portion 511, keeping the light-transmitting portion 511 at a specific position on the central optical path L. The support portion 512 surrounds the central optical path L and maintains a specific distance between the light-transmitting portion 511 of the flat panel element 510 and the photosensitive element 51.

[0282] The material of the light-transmitting part 511 can be plastic, while the support part 512 can be opaque plastic, but the materials of the light-transmitting part 511 and the support part 512 are not limited to those mentioned above. Furthermore, the opaque plastic of the support part 512 can be made of the same material as the transparent plastic of the light-transmitting part 511, wherein the opaque plastic of the support part 512 can be made opaque by adding a dye. The use of opaque plastic material for the support part 512 prevents non-imaging light from passing through the support part 512 and incident on the photosensitive element 51. Specifically, the transparent plastic injection port 513 is provided corresponding to the light-transmitting part 511, and the opaque plastic injection port 514 is provided corresponding to the support part 512.

[0283] The imaging optical system also includes a low-reflection film layer 570, which is simultaneously disposed on both an incident light surface and an exit light surface of the light-transmitting portion 511, and the low-reflection film layer 570 is a multilayer film. More specifically, the low-reflection film layer 570 includes a dense-sparse structure layer (not shown) and an anti-reflection multilayer (not shown). The anti-reflection multilayer includes multiple high-refractive-index layers and multiple low-refractive-index layers, with the high-refractive-index layers and low-refractive-index layers stacked alternately to give the low-reflection film layer 570 anti-reflection functionality. Furthermore, the low-reflection film layer 570 located on the exit light surface is further disposed on a portion of the surface of the support portion 512 to prevent glare reflected through the surface of the support portion 512.

[0284] Depend on Figure 5B It can be seen that the focal length of the imaging optical system is f, the distance between the infrared light reduction film 540 and the low reflection film 570 disposed on the light-incident surface of the light-transmitting part 511 along the central optical path L is L2″-1, the distance between the infrared light reduction film 540 and the low reflection film 570 disposed on the light-exiting surface of the light-transmitting part 511 along the central optical path L is L2″-2, and the thickness of the light-transmitting part 511 is THI. The parameters satisfy the conditions in Table 5A below.

[0285]

[0286] <Sixth Implementation Method>

[0287] Please refer to Figures 6A to 6E ,in Figure 6A A perspective view of the camera module 60 according to the sixth embodiment of this disclosure is shown. Figure 6B Drawing according to Figure 6A A schematic diagram of the camera module 60 in the sixth embodiment. Figure 6C Drawing according to Figure 6A A schematic diagram of the parameters of the camera module 60 in the sixth embodiment. Figure 6D Drawing according to Figure 6A An exploded view of the camera module 60 in the sixth embodiment. Figure 6E Drawing according to Figure 6A Another exploded view of the camera module 60 in the sixth embodiment. Figures 6A to 6E As can be seen, the camera module 60 includes an imaging optical system (not shown) and a photosensitive element 61, wherein the imaging optical system includes an imaging lens (not shown) and a prism element 610.

[0288] The imaging optical system sequentially includes an infrared light absorbing element, an infrared light reducing film 640, and a prism element 610 along the central optical path L. The infrared light reducing film 640 is disposed on a light-emitting surface of the infrared light absorbing element. The infrared light absorbing element is an infrared light absorbing plastic element used to refract light, and in the sixth embodiment, it can be considered as an infrared light absorbing lens. The infrared light reducing film 640 is closer to an imaging surface of the imaging optical system (not shown) than a light-incident surface of the infrared light absorbing element.

[0289] The imaging lens comprises multiple lenses, an infrared light-reducing coating 640, and a lens carrier 651. Specifically, along a central optical path L, the imaging lens sequentially comprises a first lens 621, an infrared light-reducing coating 640, a second lens 622, a third lens 623, and a fourth lens 624, wherein the lens carrier 651 houses the first lens 621, the second lens 622, the third lens 623, and the fourth lens 624. It must be noted that the number, structure, surface shape, and other optical characteristics of the lenses can be configured according to different imaging requirements and are not limited thereto.

[0290] In the sixth embodiment, the first lens 621 is an infrared light absorbing element, and the infrared light reducing film layer 640 is disposed on the light emitting surface of the first lens 621.

[0291] Please refer to Figure 6F Its drawing is based on Figure 6A A schematic diagram of the prism section 611 in the sixth embodiment. Figure 6B and Figure 6F It is understood that the prism element 610 includes a prism portion 611, a support portion 612, and a reflection enhancement layer 613. The support portion 612 supports the prism portion 611, keeping the prism portion 611 at a specific position on the central optical path L. The prism portion 611 sequentially includes an incident light surface 611a, at least one reflecting surface 611b, and an exiting light surface 611c along the central optical path L, and the exiting light surface 611c of the prism portion 611 is disposed corresponding to the imaging surface. Furthermore, the reflection enhancement layer 613 is disposed on the reflecting surface 611b, and the number of reflection enhancement layers 613 corresponds to the number of reflecting surfaces 611b, wherein the number of reflecting surfaces 611b is four.

[0292] The prism portion 611 can be made of glass or plastic, while the support portion 612 can be made of opaque plastic. However, the materials of the prism portion 611 and the support portion 612 are not limited to those mentioned above. Furthermore, the opaque plastic of the support portion 612 can be made of the same material as the transparent plastic of the prism portion 611. The opaque plastic of the support portion 612 can be made opaque by adding a dye. The use of an opaque plastic support portion 612 prevents non-imaging light from passing through the support portion 612 and incident on the photosensitive element 61.

[0293] The imaging optical system also includes a low-reflection film (not shown in the figure), wherein the low-reflection film is disposed on both an incident surface 611a and an exit surface 611c of the prism section 611, and both the low-reflection film disposed on the incident surface 611a and the exit surface 611c of the prism section 611 include a dense-sparse structure layer 671.

[0294] Depend on Figure 6D and Figure 6E It is understood that the imaging lens also includes a driving unit 652, a carrier plate 653, a cover 654 and two guide shafts 655, and the lens carrier 651 has a guide hole 651a. The driving unit 652 is disposed on the lens carrier 651 to drive the lens carrier 651 to move along the extension direction of the guide shaft 655. The guide shaft 655 is formed on the support portion 612. The support portion 612 and the photosensitive element 61 are disposed on the carrier plate 653. The cover 654 is disposed on the lens carrier 651, and the guide shaft 655 and the guide hole 651a are disposed opposite to each other.

[0295] Furthermore, the driving unit 652 includes a driving magnet 652a and a driving coil 652b, wherein the driving magnet 652a and the driving coil 652b are correspondingly arranged, and the driving magnet 652a and the driving coil 652b interact to generate a driving magnetic force.

[0296] Depend on Figure 6C It can be seen that the focal length of the imaging optical system is f, the distance between the infrared light reduction film 640 and the density structure layer 671 disposed on the light-incident surface of the prism part 611 along the central optical path L is L2-3, and the distance between the infrared light reduction film 640 and the density structure layer 671 disposed on the light-outcident surface of the prism part 611 along the central optical path L is L2-4. The parameters satisfy the conditions in Table 6A below.

[0297]

[0298] <Seventh Implementation>

[0299] Please refer to Figure 7A and Figure 7B ,in Figure 7A A schematic diagram of the camera module 70 according to the seventh embodiment of this disclosure is shown. Figure 7B Drawing according to Figure 7A A schematic diagram showing the parameters of the camera module 70 in the seventh embodiment. Figure 7A and Figure 7B As can be seen, the camera module 70 includes an imaging optical system (not shown) and a photosensitive element 71, wherein the imaging optical system includes an imaging lens (not shown) and a prism element 710.

[0300] The imaging optical system sequentially includes an infrared light absorbing element, an infrared light reducing film 740, and a prism element 710 along the central optical path L. The infrared light reducing film 740 is disposed on a light-emitting surface of the infrared light absorbing element. The infrared light absorbing element is an infrared light absorbing plastic element used to refract light, and in the seventh embodiment, it can be considered as an infrared light absorbing lens. The infrared light reducing film 740 is closer to an imaging surface of the imaging optical system (not shown) than a light-incident surface of the infrared light absorbing element.

[0301] The imaging lens comprises multiple lenses, an infrared light-reducing coating 740, and a lens carrier 751. Specifically, the imaging lens sequentially comprises a first lens 721, a second lens 722, a third lens 723, a fourth lens 724, and an infrared light-reducing coating 740 along a central optical path L, wherein the lens carrier 751 houses the first lens 721, the second lens 722, the third lens 723, and the fourth lens 724. It must be noted that the number, structure, surface shape, and other optical characteristics of the lenses can be configured according to different imaging requirements and are not limited thereto.

[0302] In the seventh embodiment, the second lens 722 is an infrared light absorbing element, and the infrared light reducing film layer 740 is disposed on the light-emitting surface of the fourth lens 724.

[0303] Please refer to Figure 7C Its drawing is based on Figure 7A A schematic diagram of the prism section 711 in the seventh embodiment. Figure 7A and Figure 7C As can be seen, the prism element 710 includes a prism portion 711, a support portion 712, and a reflection enhancement layer (not shown in the figure). The support portion 712 supports the prism portion 711, keeping the prism portion 711 at a specific position on the central optical path L. The prism portion 711 sequentially includes an incident light surface 711a, at least one reflecting surface 711b, and an exiting light surface 711c along the central optical path L, and the exiting light surface 711c of the prism portion 711 is disposed corresponding to the imaging surface. Furthermore, the reflection enhancement layer is disposed on the reflecting surface 711b, and the number of reflection enhancement layers corresponds to the number of reflecting surfaces 711b, wherein the number of reflecting surfaces 711b is four.

[0304] The imaging optical system also includes a low-reflection film 770, which is disposed on both an incident light surface and an exit light surface of the prism section 711. The low-reflection film 770 includes a dense-sparse structure layer (not shown) and an anti-reflection multilayer (not shown). The anti-reflection multilayer includes multiple high-refractive-index layers and multiple low-refractive-index layers, and the high-refractive-index layers and low-refractive-index layers are stacked alternately to enable the low-reflection film 770 to have anti-reflection functionality.

[0305] Depend on Figure 7BIt can be seen that the focal length of the imaging optical system is f, the distance between the infrared light absorbing element (the second lens 722 in the seventh embodiment) and the infrared light reducing film 740 along the central optical path L is L1, the distance between the infrared light reducing film 740 and the low reflection film 770 disposed on the light-incident surface of the prism part 711 along the central optical path L is L2″-3, and the distance between the infrared light reducing film 740 and the low reflection film 770 disposed on the light-outceasing surface of the prism part 711 along the central optical path L is L2″-4. The parameters satisfy the conditions in Table 7A below.

[0306]

[0307] It must be noted that the optical system and mechanism configuration of the seventh embodiment are the same as those of the sixth embodiment, so the structure and configuration of the remaining components will not be described again here.

[0308] <Eighth Implementation Method>

[0309] Please refer to Figures 8A to 8C ,in Figure 8A A schematic diagram of the electronic device 80 according to the eighth embodiment of this disclosure is shown. Figure 8B Drawing according to Figure 8A Another schematic diagram of the electronic device 80 in the eighth embodiment, Figure 8C Drawing according to Figure 8A Another schematic diagram of the electronic device 80 in the eighth embodiment. Figures 8A to 8C It is understood that the electronic device 80 is a smartphone, but it can also be a notebook computer, tablet computer, dashcam, etc., but is not limited thereto. The electronic device 80 includes at least one camera module, wherein the camera module includes an imaging optical system (not shown) and a photosensitive element (not shown), and the photosensitive element is disposed on an imaging surface of the imaging optical system.

[0310] In the eighth embodiment, the camera modules are ultra-wide-angle camera modules 821 and 822, super telephoto camera module 823, wide-angle camera module 824 and 825, telephoto camera module 826, TOF (Time-Of-Flight) module 827, macro camera module 828, and biometric sensing camera module 829. The TOF module 827 and biometric sensing camera module 829 can also be other types of camera modules, and are not limited to this configuration. Specifically, the camera modules can be the camera modules described in the first to seventh embodiments, but this disclosure is not limited thereto.

[0311] In detail, in the eighth embodiment, the ultra-wide-angle camera module 821, the wide-angle camera module 824, the TOF module 827, and the biometric sensing camera module 829 are disposed on the front of the electronic device 80, while the ultra-wide-angle camera module 822, the super telephoto camera module 823, the wide-angle camera module 825, the telephoto camera module 826, and the macro camera module 828 are disposed on the back of the electronic device 80.

[0312] The image capture control interface 810 can be a touch screen, which is used to display the image and has touch functionality, and can be used to manually adjust the shooting angle. In detail, the image capture control interface 810 includes an image playback button 811, an image capture module switching button 812, a focus and shooting button 813, an integrated menu button 814, and a zoom control button 815. Furthermore, the user enters the shooting mode through the image capture control interface 810 of the electronic device 80. The image capture module switching button 812 allows the user to freely switch between using one of the ultra-wide-angle camera modules 821, 822, super telephoto camera module 823, wide-angle camera module 824, 825, telephoto camera module 826, and macro camera module 828 for shooting. The zoom control button 815 is used to adjust the zoom. The focus and shooting button 813 is used to capture the image after framing the shot and selecting one of the ultra-wide-angle camera modules 821, 822, super telephoto camera module 823, wide-angle camera module 824, 825, telephoto camera module 826, and macro camera module 828. The image playback button 811 allows the user to view the photo after capturing the image. The integrated menu button 814 is used to adjust the details during image capture (such as timed shooting, shooting ratio, etc.).

[0313] The electronic device 80 may also include an indicator light 83, which is located on the front of the electronic device 80 and can be used to indicate unread messages, missed calls, and mobile phone status to the user.

[0314] Furthermore, after the user enters the shooting mode through the image capture control interface 810 of the electronic device 80, the imaging optical system gathers the imaging light onto the photosensitive element and outputs the relevant electronic signal of the image to the image signal processor (not shown) of the single-chip system 85. The single-chip system 85 may also include random access memory (RAM) (not shown), central processing unit (not shown), and storage unit (not shown), and may also include, but is not limited to, display unit, control unit, read-only memory (ROM), or a combination thereof.

[0315] Depending on the camera specifications of the electronic device 80, the electronic device 80 may also include an optical image stabilization component (not shown). Furthermore, the electronic device 80 may also include at least one focus assist element 86 and at least one sensing element (not shown). The focus assist element 86 may include a color temperature compensation light-emitting element 861, an infrared rangefinder (not shown), a laser focus module (not shown), etc. The sensing element may have the function of sensing physical momentum and kinetic energy, such as an accelerometer, gyroscope, Hall effect element, position locator, signal transmission module, etc., to sense the shaking and tremors caused by the user's hand or the external environment. This facilitates the performance of the autofocus function and optical image stabilization component configured in the camera module of the electronic device 80, resulting in good image quality. This helps the electronic device 80 according to this disclosure to have multiple shooting modes, such as optimized Selfie, low-light HDR (High Dynamic Range) imaging, and high-resolution 4K video recording. In addition, users can directly view the camera's shooting screen through the image capture control interface 810 and manually operate the framing range on the image capture control interface 810 to achieve the WYSIWYG autofocus function.

[0316] Furthermore, the camera module, optical image stabilization component, sensing element, and focus assist element 86 can be mounted on a circuit board 84 and electrically connected to related components such as an image signal processor via a connector 841 to execute the shooting process. The circuit board 84 can be a flexible printed circuit board (FPC). Current electronic devices, such as smartphones, tend to be thinner and lighter. Mounting the camera module and related components on a circuit board and then using connectors to integrate the circuitry onto the mainboard of the electronic device satisfies the structural design and circuit layout requirements of the limited internal space of the electronic device, providing greater flexibility. It also allows for more flexible control of the camera module's autofocus function through the device's touchscreen. In the eighth embodiment, the sensing element and focus assist element 86 are mounted on the circuit board 84 and at least one other flexible circuit board (not shown), and electrically connected to related components such as an imaging signal processing element via corresponding connectors to execute the shooting process. In other embodiments (not shown), the sensing element and auxiliary optical element can also be mounted on the mainboard of the electronic device or other types of carrier boards, depending on the structural design and circuit layout requirements.

[0317] Please refer to Figure 8D Its drawing is based on Figure 8A A schematic diagram of an image captured by the electronic device 80 in the eighth embodiment. Figure 8DIt is known that the imaging results of ultra-wide-angle camera modules 821 and 822 can have a larger angle of view and depth of field than those of wide-angle camera modules 824 and 825, but are often accompanied by greater distortion. Specifically, Figure 8D The angle of view is 105 to 125 degrees, and the equivalent focal length is 11 mm to 14 mm.

[0318] Please refer to Figure 8E Its drawing is based on Figure 8A A schematic diagram of another image captured by the electronic device 80 in the eighth embodiment. Figure 8E It can be seen that the wide-angle camera modules 824 and 825 can capture images within a certain range with high resolution and low distortion. Specifically, Figure 8E for Figure 8D Enlarged portion of the image. Figure 8E The field of view is 70 to 90 degrees, and the equivalent focal length is 22mm to 30mm.

[0319] Please refer to Figure 8F Its drawing is based on Figure 8A A further image illustration captured by the electronic device 80 in the eighth embodiment. Figure 8F It can be seen that the imaging result of the telephoto camera module 826 can have a smaller angle of view and depth of field than that of the wide-angle camera modules 824 and 825, and can be used to photograph moving targets. That is, the actuator (not shown in the figure) of the electronic device 80 can drive the telephoto camera module 826 to perform fast and continuous autofocus on the target, so that the target does not become blurry as it moves away from the focus position. Specifically, Figure 8F for Figure 8E Enlarged portion of the image. Figure 8F The angle of view is 10 to 40 degrees, and the equivalent focal length is 60mm to 300mm.

[0320] Please refer to Figure 8G Its drawing is based on Figure 8A A schematic diagram of another image captured by the electronic device 80 in the eighth embodiment. Figure 8G It is known that the super telephoto camera module 823 produces an image with a smaller angle of view and depth of field than the telephoto camera module 826, making it more prone to defocusing due to camera shake. Therefore, the actuator provides a driving force to focus the super telephoto camera module 823 on the target object while simultaneously providing a feedback force to correct for shake, thus achieving optical image stabilization. Specifically, Figure 8G for Figure 8E Enlarged portion of the image. Figure 8G The angle of view is 4 to 8 degrees, and the equivalent focal length is 400mm to 600mm.

[0321] Depend on Figures 8D to 8GIt is understood that by using camera modules with different focal lengths for framing and combining them with image processing technology, zoom functionality can be achieved in electronic devices. It must be noted that the equivalent focal length is a calculated estimate and may differ from the actual focal length due to variations in camera module design and sensor size.

[0322] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope defined in the appended claims.

Claims

1. An imaging optical system, characterized in that, The optical path along the center contains, in sequence: An infrared light absorbing element is an infrared light absorbing plastic element, and the infrared light absorbing element is used to refract light; An infrared light reduction film is positioned closer to an imaging surface of the imaging optical system than an incident surface of the infrared light absorbing element; and A flat panel element is disposed between the infrared light reduction film and the imaging surface and is integrally formed. The flat panel element includes a light-transmitting part and a support part, wherein the light-transmitting part is disposed corresponding to the imaging surface, and the support part surrounds the light-transmitting part, so that the light-transmitting part is held at a specific position in the central optical path. The flat panel element further includes a dense-sparse structure layer, which is disposed on at least one of a light-incident surface and a light-outceasing surface of the light-transmitting portion. The dense-sparse structure layer gradually becomes less dense towards the air, and at least one of the light-incident surface and the light-outceasing surface of the light-transmitting portion forms a plurality of holes. The main material of the dense-sparse structure layer is ceramic, and the average reflectivity of the dense-sparse structure layer for light in the wavelength range of 420nm to 680nm is less than 0.98%. Wherein, the average crystal height of the dense-sparse structure layer is GH, the focal length of the imaging optical system is f, the distance between the infrared light absorbing element and the infrared light reducing film layer along the central optical path is L1, and the distance between the infrared light reducing film layer and the dense-sparse structure layer along the central optical path is L2, and the following conditions are satisfied: 60nm≤GH≤400nm; 0.0 ≤ L1 / f ≤ 0.21; and 0.21≤L2 / f.

2. The imaging optical system as described in claim 1, characterized in that, The average reflectivity of this sparse-dense structure layer for light in the wavelength range of 400 nm to 900 nm is less than 0.98%.

3. The imaging optical system as described in claim 1, characterized in that, The average reflectivity of this dense-sparse structure layer for light in the wavelength range of 400 nm to 900 nm is less than 0.5%.

4. The imaging optical system as described in claim 1, characterized in that, The average crystal height of this dense-sparse structure layer is GH, which satisfies the following condition: 120nm≤GH≤300nm.

5. The imaging optical system as described in claim 1, characterized in that, Also includes: An intermediary layer connects the density-sparse structure layer to the flat panel element; The intermediate layer is in contact with air through at least one of the plurality of holes.

6. The imaging optical system as described in claim 1, characterized in that, The infrared light reduction film is disposed on one of the light-emitting surfaces of the infrared light absorbing element.

7. The imaging optical system as claimed in claim 1, characterized in that, Also includes: A film layer setting element is disposed on one image side of the infrared light absorbing element; The infrared light reduction film is disposed on one of the light-incident surface and the light-outcident surface of the film layer disposed on the film layer element.

8. The imaging optical system as described in claim 7, characterized in that, The film layer is positioned adjacent to the infrared light absorbing element.

9. The imaging optical system as described in claim 8, characterized in that, Also includes: A colloid is used to bond the infrared light absorbing element to the film layer setting element.

10. The imaging optical system as claimed in claim 1, characterized in that, The support portion of this flat panel component is an opaque plastic support portion.

11. The imaging optical system as claimed in claim 10, characterized in that, The flat panel component is integrally formed by embedding injection or secondary injection.

12. The imaging optical system as claimed in claim 1, characterized in that, The flat panel element also includes a light-shielding portion, which is disposed adjacent to the light-transmitting portion.

13. The imaging optical system as claimed in claim 1, characterized in that, The density-sparse structure layer is simultaneously disposed on both the light-incident surface and the light-exit surface of the light-transmitting part.

14. The imaging optical system as claimed in claim 1, characterized in that, The density-sparse structure layer is simultaneously disposed on at least a portion of one surface of the support portion.

15. The imaging optical system as claimed in claim 1, characterized in that, The focal length of the imaging optical system is f, and the thickness of the light-transmitting part is THI, which satisfies the following condition: 0.005≤THI / f≤0.

35.

16. A camera module, characterized in that, Include: The imaging optical system of claim 1; and A photosensitive element is disposed on the imaging surface of the imaging optical system.

17. An electronic device, characterized in that, Include: At least one camera module as described in claim 16.

18. An imaging optical system, characterized in that, The optical path along the center contains, in sequence: An infrared light absorbing element is an infrared light absorbing plastic element, and the infrared light absorbing element is used to refract light; An infrared light reduction film is positioned closer to an imaging surface of the imaging optical system than an incident surface of the infrared light absorbing element. A flat panel element, integrally formed and disposed between the infrared light reduction film layer and the imaging surface, includes a light-transmitting portion and a support portion, wherein the light-transmitting portion is disposed corresponding to the imaging surface, and the support portion surrounds the light-transmitting portion, thereby maintaining the light-transmitting portion at a specific position in the central optical path; and An anti-reflective multi-layer is disposed on at least one of a light-incident surface and a light-outceasing surface of the light-transmitting portion, wherein the anti-reflective multi-layer comprises a plurality of high refractive index layers and a plurality of low refractive index layers, and the plurality of high refractive index layers and the plurality of low refractive index layers are stacked alternately. The anti-reflective multilayer film has an average reflectivity of less than 0.98% for light rays in the wavelength range of 420nm to 680nm. Wherein, the focal length of the imaging optical system is f, the distance between the infrared light absorbing element and the infrared light reducing film along the central optical path is L1, and the distance between the infrared light reducing film and the anti-reflection multilayer film along the central optical path is L2', which satisfies the following conditions: 0.0 ≤ L1 / f ≤ 0.21; and 0.21≤L2' / f.

19. The imaging optical system as claimed in claim 18, characterized in that, The antireflective multilayer film has an average reflectivity of less than 0.98% for light in the wavelength range of 400nm to 900nm.

20. The imaging optical system as claimed in claim 18, characterized in that, The infrared light reduction film is disposed on one of the light-emitting surfaces of the infrared light absorbing element.

21. The imaging optical system as claimed in claim 18, characterized in that, Also includes: A film layer setting element is disposed on one image side of the infrared light absorbing element; The infrared light reduction film is disposed on one of the light-incident surface and the light-outcident surface of the film layer disposed on the film layer element.

22. The imaging optical system as claimed in claim 21, characterized in that, The film layer is positioned adjacent to the infrared light absorbing element.

23. The imaging optical system as claimed in claim 22, characterized in that, Also includes: A colloid is used to bond the infrared light absorbing element to the film layer setting element.

24. The imaging optical system as claimed in claim 18, characterized in that, The support portion of this flat panel component is an opaque plastic support portion.

25. The imaging optical system as claimed in claim 24, characterized in that, The flat panel component is integrally formed by embedding injection or secondary injection.

26. The imaging optical system as claimed in claim 18, characterized in that, The flat panel element also includes a light-shielding portion, which is disposed adjacent to the light-transmitting portion.

27. The imaging optical system as claimed in claim 18, characterized in that, The anti-reflective multilayer is simultaneously disposed on both the light-incident surface and the light-exit surface of the light-transmitting part.

28. The imaging optical system as claimed in claim 18, characterized in that, The anti-reflective multilayer is simultaneously disposed on at least a portion of one surface of the support portion.

29. The imaging optical system as claimed in claim 18, characterized in that, The focal length of the imaging optical system is f, and the thickness of the light-transmitting part is THI, which satisfies the following condition: 0.005≤THI / f≤0.

35.

30. A camera module, characterized in that, Include: The imaging optical system of claim 18; and A photosensitive element is disposed on the imaging surface of the imaging optical system.

31. An electronic device, characterized in that, Include: At least one camera module as described in claim 30.

32. An imaging optical system, characterized in that, The optical path along the center contains, in sequence: An infrared light absorbing element is an infrared light absorbing plastic element, and the infrared light absorbing element is used to refract light; An infrared light reduction film is positioned closer to an imaging surface of the imaging optical system than an incident surface of the infrared light absorbing element. A flat panel element includes a light-transmitting portion and a support portion, wherein the light-transmitting portion is disposed between an infrared light-reducing film layer and an imaging surface, and the light-transmitting portion is correspondingly disposed to the imaging surface; the support portion surrounds the central optical path, and the support portion and the light-transmitting portion are integrally integrated, so that the light-transmitting portion is maintained at a specific position on the central optical path; and A low-reflection film layer is disposed on at least one of a light-incident surface and a light-exit surface of the light-transmitting portion, and simultaneously covers at least a portion of the support portion; The low-reflectivity film has an average reflectivity of less than 0.98% for light in the wavelength range of 420nm to 680nm. Wherein, the focal length of the imaging optical system is f, the distance between the infrared light absorbing element and the infrared light reducing film along the central optical path is L1, and the distance between the infrared light reducing film and the low-reflection film along the central optical path is L2”, which satisfies the following conditions: 0.0 ≤ L1 / f ≤ 0.21; and 0.21≤L2” / f.

33. The imaging optical system as described in claim 32, characterized in that, The low-reflection film layer includes an anti-reflection multilayer layer, which includes multiple high-refractive-index layers and multiple low-refractive-index layers, and the multiple high-refractive-index layers and the multiple low-refractive-index layers are stacked alternately.

34. The imaging optical system as described in claim 32, characterized in that, The low-reflection film layer includes a dense-sparse structure layer, which is disposed on at least one of the light-incident surface and the light-outcident surface of the light-transmitting portion. The dense-sparse structure layer gradually disperses towards the air direction, and forms multiple holes on at least one of the light-incident surface and the light-outcident surface of the light-transmitting portion. The main material of the dense-sparse structure layer is ceramic. The average crystal height of this dense-sparse structure layer is GH, which satisfies the following condition: 60nm≤GH≤400nm.

35. The imaging optical system as described in claim 34, characterized in that, The average crystal height of this dense-sparse structure layer is GH, which satisfies the following condition: 120nm≤GH≤300nm.

36. The imaging optical system as claimed in claim 34, characterized in that, The low-reflection film layer also includes an intermediary layer that is in contact with the solid plate element, and at least a portion of the intermediary layer is in contact with air through at least one of the plurality of holes.

37. The imaging optical system as claimed in claim 32, characterized in that, The low-reflectivity coating has an average reflectivity of less than 0.98% for light in the wavelength range of 400 nm to 900 nm.

38. The imaging optical system as claimed in claim 37, characterized in that, The low-reflectivity film has an average reflectivity of less than 0.5% for light in the wavelength range of 400 nm to 900 nm.

39. The imaging optical system as described in claim 32, characterized in that, The infrared light reduction film is disposed on one of the light-emitting surfaces of the infrared light absorbing element.

40. The imaging optical system as claimed in claim 32, characterized in that, Also includes: A film layer setting element is disposed on one image side of the infrared light absorbing element; The infrared light reduction film is disposed on one of the light-incident surface and the light-outcident surface of the film layer disposed on the film layer element.

41. The imaging optical system as claimed in claim 40, characterized in that, The film layer is positioned adjacent to the infrared light absorbing element.

42. The imaging optical system as claimed in claim 41, characterized in that, Also includes: A colloid is used to bond the infrared light absorbing element to the film layer setting element.

43. The imaging optical system as described in claim 32, characterized in that, The support portion of this flat panel component is an opaque plastic support portion.

44. The imaging optical system as claimed in claim 32, characterized in that, The low-reflection film layer is simultaneously disposed on the light-incident surface and the light-exiting surface of the light-transmitting portion; The low-reflection film layer disposed on the light-incident surface of the light-transmitting part includes one of an anti-reflection multilayer film layer and a dense-sparse structure layer. The low-reflection film layer disposed on the light-emitting surface of the light-transmitting part includes one of the anti-reflection multilayer film layer and the dense-sparse structure layer.

45. The imaging optical system as claimed in claim 32, characterized in that, The low-reflection film is also disposed on at least a portion of one surface of the support portion.

46. ​​The imaging optical system as claimed in claim 32, characterized in that, The focal length of the imaging optical system is f, and the thickness of the light-transmitting part is THI, which satisfies the following condition: 0.005≤THI / f≤0.

35.

47. A camera module, characterized in that, Include: The imaging optical system of claim 32; and A photosensitive element is disposed on the imaging surface of the imaging optical system.

48. An electronic device, characterized in that, Include: At least one camera module as described in claim 47.

49. An imaging optical system, characterized in that, The optical path along the center contains, in sequence: An infrared light absorbing element is an infrared light absorbing plastic element, and the infrared light absorbing element is used to refract light; An infrared light reduction film is positioned closer to an imaging surface of the imaging optical system than an incident surface of the infrared light absorbing element. A prism element, comprising: A prism portion, along the central optical path, sequentially includes an incident surface, at least one reflecting surface, and an exiting surface, wherein the exiting surface of the prism portion is correspondingly disposed with respect to the imaging surface; and A support portion, which supports the prism portion and holds the prism portion at a specific position in the central optical path; and A low-reflection film is disposed on at least one of the light-incident surface and the light-outcrystal surface of the prism portion; The low-reflectivity film has an average reflectivity of less than 0.98% for light in the wavelength range of 420nm to 680nm. Wherein, the focal length of the imaging optical system is f, the distance between the infrared light absorbing element and the infrared light reducing film along the central optical path is L1, and the distance between the infrared light reducing film and the low-reflection film along the central optical path is L2”, which satisfies the following conditions: 0.0 ≤ L1 / f ≤ 0.21; and 0.21≤L2” / f.

50. The imaging optical system as claimed in claim 49, characterized in that, The low-reflection film layer includes an anti-reflection multilayer layer, which includes multiple high-refractive-index layers and multiple low-refractive-index layers, and the multiple high-refractive-index layers and the multiple low-refractive-index layers are stacked alternately.

51. The imaging optical system as claimed in claim 49, characterized in that, The low-reflection film layer includes a dense-sparse structure layer, which is disposed on at least one of the light-incident surface and the light-outcident surface of the prism portion. The dense-sparse structure layer gradually disperses towards an air direction, forming multiple holes on at least one of the light-incident surface and the light-outcident surface of the prism portion. The main material of the dense-sparse structure layer is ceramic. The average crystal height of this dense-sparse structure layer is GH, which satisfies the following condition: 60nm≤GH≤400nm.

52. The imaging optical system as claimed in claim 51, characterized in that, The average crystal height of this dense-sparse structure layer is GH, which satisfies the following condition: 120nm≤GH≤300nm.

53. The imaging optical system as described in claim 51, characterized in that, The low-reflection coating also includes an intermediary layer that is in contact with the prism element body and is in contact with air through at least one of the plurality of holes.

54. The imaging optical system as described in claim 49, characterized in that, The low-reflectivity coating has an average reflectivity of less than 0.98% for light in the wavelength range of 400 nm to 900 nm.

55. The imaging optical system as described in claim 49, characterized in that, The low-reflectivity film has an average reflectivity of less than 0.5% for light in the wavelength range of 400 nm to 900 nm.

56. The imaging optical system as described in claim 49, characterized in that, The infrared light reduction film is disposed on one of the light-emitting surfaces of the infrared light absorbing element.

57. The imaging optical system as claimed in claim 49, characterized in that, Also includes: A film layer setting element is disposed on one image side of the infrared light absorbing element; The infrared light reduction film is disposed on one of the light-incident surface and the light-outcident surface of the film layer disposed on the film layer element.

58. The imaging optical system as claimed in claim 57, characterized in that, The film layer is positioned adjacent to the infrared light absorbing element.

59. The imaging optical system as claimed in claim 58, characterized in that, Also includes: A colloid is used to bond the infrared light absorbing element to the film layer setting element.

60. The imaging optical system as claimed in claim 49, characterized in that, The support portion of the prism element is an opaque plastic support portion.

61. The imaging optical system as claimed in claim 49, characterized in that, The low-reflection coating is simultaneously disposed on both the light-incident surface and the light-outcrystal surface of the prism. The low-reflection film layer disposed on the light-incident surface of the prism portion includes one of an anti-reflection multilayer film layer and a dense-sparse structure layer. The low-reflection film layer disposed on the light-emitting surface of the prism portion includes one of the anti-reflection multilayer film layer and the dense-sparse structure layer.

62. The imaging optical system as claimed in claim 49, characterized in that, The low-reflection film is also disposed on at least a portion of one surface of the support portion.

63. A camera module, characterized in that, Include: The imaging optical system of claim 49; and A photosensitive element is disposed on the imaging surface of the imaging optical system.

64. An electronic device, characterized in that, Include: At least one camera module as described in claim 63.

65. A camera module, characterized in that, Include: An imaging optical system, comprising: A single-image lens, comprising: Multiple lenses are arranged sequentially along a central optical path, wherein the multiple lenses include an infrared light absorbing lens, and the infrared light absorbing lens is an infrared light absorbing plastic lens. An infrared light reduction film is disposed on a light-emitting surface of the infrared light-absorbing lens; and A lens carrier that houses the plurality of lenses and the infrared light reduction film; A flat panel component, comprising: One light-transmitting part; and A support section surrounds the central optical path; and A low-reflection film layer is disposed on at least one of a light-incident surface and a light-exit surface of the light-transmitting portion; and A photosensitive element is disposed on the image side of the lens carrier, a flat plate element is disposed between the imaging lens and the photosensitive element, a light-transmitting portion is disposed corresponding to the photosensitive element, and the central optical path is transmitted to the photosensitive element after passing through the imaging lens. The bracket portion maintains a specific distance between the light-transmitting portion of the flat panel element and the photosensitive element. The low-reflectivity film has an average reflectivity of less than 0.98% in the wavelength range of 420nm to 680nm. Wherein, the focal length of the imaging optical system is f, the distance between the infrared light reduction film and the low reflectance film along the central optical path is L2", and the thickness of the light-transmitting portion of the flat panel element is THI, which satisfies the following conditions: 0.21≤L2” / f; and 0.005≤THI / f≤0.35.

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