Substrate processing apparatus and substrate processing method using the same

Abstract

The present application provides a substrate processing device and a substrate processing method using the same, which can stably move a substrate and eject ink to an accurate position. The substrate processing device of the present application includes a rack extending in a first direction and along which a substrate moves, a moving unit respectively arranged on both sides of the rack extending in the first direction and moving the substrate in the first direction, and a control unit aligning the substrate. The moving unit includes a first gripper and a second gripper respectively sucking one side and the other side of the substrate. After the first gripper sucks one side of the substrate, the control unit aligns the substrate. After the substrate is aligned, the second gripper sucks the other side of the substrate, and the substrate moves in the first direction.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method using the same. Background Technology

[0002] Typically, in order to manufacture electronic circuit components or flat panel displays (FPDs) such as liquid crystal displays, photoresist or metal pastes such as copper (Cu), silver (Ag), and aluminum (Al) are used to form certain patterns, such as electrodes or dots, on glass surfaces or printed circuit boards (PCBs).

[0003] As a method for forming a certain pattern on a substrate, one can use two rollers to directly pattern the pattern using offset printing or by ejecting ink droplets. The inkjet printing system that ejects ink droplets onto the substrate is similar to a conventional inkjet printer, employing a method of directly patterning a certain pattern on the substrate using nozzles.

[0004] An inkjet printing system ejects ink droplets onto a substrate while moving it in a specific direction. To eject the droplets to the desired location, the substrate must be moved stably. If the substrate is not moved consistently in a straight line, the ink droplets may not be ejected accurately to the desired position. Summary of the Invention

[0005] The problem that the invention aims to solve

[0006] The problem to be solved by the present invention is to provide a substrate processing apparatus capable of stably moving a substrate and ejecting ink to an accurate position, and a substrate processing method using the same.

[0007] The subject matter of this invention is not limited to the subject matter mentioned above, and those skilled in the art can clearly understand other subject matters not mentioned through the following description.

[0008] Solution to the problem

[0009] One aspect of the substrate processing apparatus of the present invention for achieving the above-mentioned objectives includes: a worktable extending along a first direction, and a substrate moving along the first direction; a moving unit disposed on both sides of the worktable extending along the first direction, and moving the substrate along the first direction; and a control unit aligning the substrate, the moving unit including a first clamp and a second clamp respectively adsorbing one side and the other side of the substrate, wherein after the first clamp adsorbs one side of the substrate, the control unit aligns the substrate, and after the substrate is aligned, the second clamp adsorbs the other side of the substrate, and the substrate moves along the first direction.

[0010] In some embodiments, the first gripper is rotatable about a second direction perpendicular to the first direction.

[0011] In some embodiments, the first and second grippers are capable of yaw control of the substrate while moving the substrate along the first direction.

[0012] The substrate processing apparatus further includes a measuring unit, which is disposed on the worktable and captures alignment marks disposed at the vertices of the substrate.

[0013] In some embodiments, the control unit uses an image of the alignment mark captured by the measurement unit to set the position of the alignment mark to the preset reference point when the alignment mark deviates from the preset reference point.

[0014] The substrate processing apparatus may further include: a head unit disposed on a frame extending along a second direction different from the first direction on the worktable, and spraying droplets toward the substrate, the head unit being movable along the second direction.

[0015] In some embodiments, the worktable includes a first region and a second region, the first region being a region for loading the substrate and for the first clamp and the second clamp to respectively hold the first and second surfaces of the substrate, and the second region being a region for performing printing processes on the substrate.

[0016] In some embodiments, the first region is a region that sprays gas toward the substrate, and the second region is a region that sprays gas toward the substrate and draws in gas between the substrate and the second region.

[0017] Another aspect of the substrate processing apparatus of the present invention for achieving the above-mentioned objectives includes: a worktable extending along a first direction, and a substrate marked with an alignment mark moving along the first direction; a measuring unit including a camera on the worktable corresponding to the alignment mark on the substrate and capturing the alignment mark; a first gripper adsorbing a first surface of the substrate and rotatable about a second direction perpendicular to the first direction; a second gripper adsorbing a second surface facing the first surface of the substrate; and a control unit controlling the first gripper, wherein the camera of the measuring unit captures the alignment mark after the first gripper adsorbs the first surface, the control unit receives the image captured by the camera and rotates the first gripper to align the substrate, and after aligning the substrate, the second gripper adsorbs the second surface of the substrate.

[0018] After the substrate is attracted by the second clamp, the substrate processing apparatus moves the substrate along the first direction and performs a printing process on the substrate.

[0019] In some embodiments, the first and second grippers are capable of yaw control of the substrate while moving the substrate along the first direction.

[0020] In some embodiments, the worktable includes a first region and a second region, the first region being a region for loading the substrate and for adsorbing the substrate by the first clamp and the second clamp, and the second region being a region for performing printing processes on the substrate.

[0021] In some embodiments, the first region is a region in which gas is injected toward the substrate, and the second region is a region in which gas is injected toward the substrate and gas between the substrate and the second region is drawn in.

[0022] The substrate processing apparatus further includes: a head unit disposed on a frame extending along a third direction different from the first direction and the second direction on the worktable, and spraying droplets toward the substrate; the measuring unit is disposed on the first region of the worktable; and the head unit is disposed on the second region of the worktable.

[0023] In some embodiments, the alignment mark is disposed at the apex of the substrate.

[0024] One aspect of the substrate processing method of the present invention for solving the above-mentioned problems includes: loading a substrate including alignment marks in a first region of a worktable; using a first clamp to adsorb a first surface of the substrate extending in a first direction; photographing the alignment marks on the substrate; rotating the first clamp to align the substrate; using a second clamp, different from the first clamp, to adsorb a second surface facing the first surface of the substrate; moving the substrate in the first direction; and performing a printing process on the substrate in a second region of the worktable.

[0025] In some embodiments, the alignment mark is disposed at the apex of the substrate.

[0026] In some embodiments, a first region of the worktable is a region that sprays gas toward the substrate, and a second region of the worktable is a region that sprays gas toward the substrate and draws in gas between the substrate and the second region.

[0027] The substrate processing method further includes: moving the substrate along the first direction while controlling the yaw of the substrate.

[0028] In some embodiments, aligning the substrate is achieved by capturing an image of the alignment mark and setting the position of the alignment mark to the preset reference point when the alignment mark deviates from the preset reference point.

[0029] Specific details of other embodiments are included in the detailed description and accompanying drawings. Attached Figure Description

[0030] Figure 1 This is an exemplary top view used to illustrate a substrate processing apparatus according to some embodiments.

[0031] Figure 2 It is used for explanation Figure 1 A top view of the workbench.

[0032] Figure 3 It is along Figure 3 AA and BB cut sectional views.

[0033] Figure 4 It is used for explanation Figure 1 Conceptual diagrams of the substrate, the first clamp, and the second clamp.

[0034] Figure 5 This is a schematic cross-sectional view used to illustrate a substrate processing apparatus according to some embodiments.

[0035] Figure 6 This is a flowchart illustrating a substrate processing method according to some embodiments.

[0036] Figure 7 as well as Figure 8 It is used for explanation Figure 6 A diagram of step S100.

[0037] Figure 9 as well as Figure 10 It is used for explanation Figure 6 A diagram of step S200.

[0038] Figure 11 as well as Figure 12 It is used for explanation Figure 6 The diagrams for steps S300 and S400 are shown.

[0039] Figure 13 as well as Figure 14 It is used for explanation Figure 6 A diagram of the S500 steps.

[0040] Figure 15 It is used for explanation Figure 6 A diagram of the S600 steps.

[0041] Explanation of reference numerals in the attached figures

[0042] 110: Worktable; 150: Substrate

[0043] 200: Transfer unit; 310: Rack

[0044] 320: Head unit; 400: Measurement unit

[0045] 500: Control unit 220a: First gripper

[0046] 220b: Second gripper; 160: Alignment mark

[0047] 222a: First adsorption section; 223a: First rotation center

[0048] 222b: Second adsorption section; 223a: Second rotation center Detailed Implementation

[0049] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The advantages, features, and methods of implementing the present invention will become clear from the accompanying drawings and the detailed embodiments described below. However, the present invention is not limited to the embodiments disclosed below and can be implemented in various ways different from each other. These embodiments are provided merely to fully disclose the invention and to fully inform those skilled in the art of its scope, which is defined only by the scope of the claims. Throughout this specification, the same reference numerals refer to the same constituent elements.

[0050] Elements or layers described as "on" or "above" other elements or layers include not only those directly above them but also those with other layers or elements in between. Conversely, elements described as "directly on" or "directly above" indicate that no other elements or layers are in between.

[0051] Terms such as "below," "below," "lower," "above," and "upper," used as spatially relative terms, can be used to more easily describe the relationship between one element or component and other elements or components as shown in the figure. Spatially relative terms should be understood to include terms that describe the different orientations of elements during use or operation, in addition to the orientations shown in the figure. For example, if the elements shown in the figure are flipped, an element described as "below" or "below" of another element can be placed "above" of another element. Therefore, the exemplary term "below" can include both "below" and "above." Elements can also be oriented along other directions, thereby allowing the spatially relative terms to be interpreted according to the orientation direction.

[0052] It should be understood that although the terms first, second, etc., are used herein to describe various elements, constituent elements, and / or parts, these elements, constituent elements, and / or parts are of course not limited by these terms. These terms are only used to distinguish one element, constituent element, or part from another element, constituent element, or part. Therefore, it is natural that the first element, first constituent element, or first part mentioned below can also be a second element, second constituent element, or second part within the technical concept of the present invention.

[0053] The terminology used in this specification is for illustrative purposes and is not intended to limit the invention. Unless otherwise specifically mentioned herein, the singular includes the plural. The terms "comprises" and / or "comprising" as used in this specification do not exclude the presence or addition of one or more other constituent elements, steps, steps, and / or components in addition to those mentioned.

[0054] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) may be used in the sense commonly understood by one of ordinary skill in the art to which this invention pertains. Furthermore, commonly used, predefined terms should not be idealized or over-interpreted unless explicitly defined otherwise.

[0055] Embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the description with reference to the drawings, the same or corresponding constituent elements in the drawings are referred to by the same reference numerals, regardless of the drawing numbers, and repeated descriptions thereof are omitted.

[0056] Below, refer to Figures 1 to 5 This describes a substrate processing apparatus according to some embodiments. The substrate processing apparatus according to some embodiments may be an inkjet printing system.

[0057] Figure 1 This is an exemplary top view used to illustrate a substrate processing apparatus according to some embodiments. Figure 2 It is used for explanation Figure 1 A top view of the workbench. Figure 3 It is along Figure 2 AA and BB cut sectional views. Figure 4 It is used for explanation Figure 1 Conceptual diagrams of the substrate, the first clamp, and the second clamp. Figure 5 This is a schematic cross-sectional view used to illustrate a substrate processing apparatus according to some embodiments.

[0058] First refer to Figure 1 According to some embodiments, the substrate processing apparatus may include a worktable 110, a transfer unit 200, a gantry 310, a head unit 320, a measurement unit 400, and a control unit 500.

[0059] The worktable 110 is an area for supporting and moving the substrate 150. The method of moving the substrate 150 on the worktable 110 is not limited to a specific manner. Although a substrate processing apparatus for holding and moving the substrate 150 with a first clamp and a second clamp is illustrated in this specification, it is not limited thereto. For example, the substrate 150 can be moved by a plate that moves in a roller-to-roll manner.

[0060] The worktable 110 may extend along a first direction X. For example, the worktable 110 may include a short side extending along a second direction Y and a long side extending along the first direction X. In this specification, the first direction X and the second direction Y may be mutually intersecting directions. The third direction Z may be a direction intersecting the first direction X and the second direction Y. For example, the first direction X, the second direction Y, and the third direction Z may be substantially perpendicular to each other.

[0061] On the worktable 110, the substrate can be moved along the first direction X. The substrate 150 may also be a transparent substrate (e.g., a glass substrate) used in a display device. For example, the substrate 150 may be a mass-production glass substrate.

[0062] Reference Figure 2 as well as Figure 3The workbench 110 may include a first area I and a second area II.

[0063] For example, workbench 110 may be an air floating system comprising a first zone I and a second zone II. The first zone I and the second zone II of workbench 110 may be continuous. However, it is not limited to this.

[0064] Unlike the illustration, the first region I of the worktable 110 can be configured at both ends of the worktable 110, and the second region II of the worktable 110 can be configured in the central part of the worktable 110. That is, the second region II of the worktable 110 can also be configured between the first regions I.

[0065] The first region I of the worktable 110 can be a region where gas is sprayed in a third direction Z. The first region I of the worktable 110 can also be a region where gas is not drawn into the first region I. The first region I can be a region where the substrate 150 is loaded onto the worktable or removed. The first region I can be a region where no printing process is performed. For example, the first region I can be a region where the head unit 320 does not eject ink droplets toward the substrate 150.

[0066] The second region II of the worktable 110 can be a region that sprays gas along a third direction Z while simultaneously drawing in gas from the second region II. For example, the second region II of the worktable 110 can be a region that sprays gas toward the substrate 150 while simultaneously drawing in gas between the substrate 150 and the worktable 110. Alternatively, the second region II can be a region where a printing process is performed. The second region II can also be a region where the head unit 320 ejects ink droplets onto the substrate 150.

[0067] In some embodiments, the stage 110 may include a plurality of holes 110H. The holes 110H can be either for injecting gas or for drawing in gas. For example, only holes for injecting gas may be configured in a first region I of the stage 110. In a second region II of the stage 110, holes for injecting gas and holes for drawing in gas may be configured alternately.

[0068] exist Figure 3 In the worktable 110, the hole 110H may include a first hole 110H_1 and a second hole 110H_2. The first hole 110H_1 may be a hole for injecting gas. The second hole 110H_2 may be a hole for drawing in gas.

[0069] The second region II of the worktable 110 may include a first orifice 110H_1 for upward gas injection and a second orifice 110H_2 for gas intake. Although the illustration shows an alternating arrangement of the first orifice 110H_1 and the second orifice 110H_2, it is not limited thereto. The first region I of the worktable 110 may include only the first orifice 110H_1 for upward gas injection.

[0070] Refer again Figure 1 The transfer unit 200 can be disposed on both sides of the worktable 110. The transfer unit 200 can be disposed on the long side of the worktable 110 extending along the first direction X. The transfer unit 200 may include a first transfer unit 200a and a second moving unit 200b. The first transfer unit 200a can be disposed on one side of the worktable 110. The second transfer unit 200b can be disposed on the other side of the worktable 110. The transfer unit 200 is capable of moving the substrate 150 along the first direction X on the worktable 110.

[0071] The first transfer unit 200a includes a first transfer track 210a and a first gripper 220a. The first transfer track 210a extends elongatedly along a first direction X. The first transfer track 210a is a track capable of moving the first gripper 220a along the first direction X. The first gripper 220a can engage with the first transfer track 210a and move along the first direction X. Since the first gripper 220a grips the substrate 150, the first transfer track 210a can move the substrate 150 along the first direction X.

[0072] A first gripper 220a may be disposed on a first transfer track 210a. The first gripper 220a can adsorb and fix the substrate 150. The first gripper 220a adsorbs one side 150a of the substrate 150. For example, when the substrate 150 includes a long side extending along a first direction X and a short side extending along a second direction Y, the first gripper 220a adsorbs and fixes one of the long sides 150a of the substrate 150.

[0073] The second transfer unit 200b includes a second transfer track 210b and a second gripper 220b. The second transfer track 210b extends elongatedly along a first direction X. The second transfer track 210b is a track capable of moving the second gripper 220b along the first direction X. The second gripper 220b can be engaged with the second transfer track 210b to move along the first direction X. Since the second gripper 220b grips the substrate 150, the second transfer track 210b can move the substrate 150 along the first direction X.

[0074] The second gripper 220b can be disposed on the second transfer track 210b. The second gripper 220b can adsorb and fix the substrate 150. The second gripper 220b adsorbs one side of the substrate 150. It can be that the first gripper 220a adsorbs one side of the substrate 150, and the second gripper 220b adsorbs the other side 150b of the substrate 150. For example, the second gripper 220b adsorbs and fixes the long side 150b of the substrate 150 that is not adsorbed by the first gripper 220a.

[0075] When the substrate 150 moves along the first direction X, it may be in a state where the first gripper 220a and the second gripper 220b respectively adsorb one side 150a and the other side 150b of the substrate 150. That is, in the substrate processing apparatus according to some embodiments, the first gripper 220a adsorbs one side 150a of the substrate 150 and the second gripper 220b adsorbs the other side 150b of the substrate 150, thereby enabling the substrate 150 to move more stably.

[0076] Figure 4 The substrate 150, the first clamp 220a, and the second clamp 220b are illustrated in more detail. (Refer to...) Figure 4 The substrate 150 includes a first surface 150a, a second surface 150b, a third surface 150c, and a fourth surface 150d.

[0077] The first surface 150a can be the long side of the substrate 150. The second surface 150b can be the long side facing the first surface. The third surface 150c and the fourth surface 150d can be the short sides connecting the first surface 150a and the second surface 150b.

[0078] The substrate 150 includes an alignment mark 160. The alignment mark 160 can be a mark used to determine whether the substrate is aligned. Although a cross-shaped alignment mark 160 is illustrated, it is not limited to this.

[0079] Alignment marks 160 can be disposed at the vertices of substrate 150. For example, alignment marks 160 may include a first alignment mark 161, a second alignment mark 162, a third alignment mark 163, and a fourth alignment mark 164. The first alignment mark 161 can be disposed at the vertex where the first surface 150a intersects with the third surface 150c. The second alignment mark 162 can be disposed at the vertex where the second surface 150b intersects with the third surface 150c. The third alignment mark 163 can be disposed at the vertex where the first surface 150a intersects with the fourth surface 150d. The fourth alignment mark 164 can be disposed at the vertex where the second surface 150b intersects with the fourth surface 150d. Details on aligning substrate 150 using the various alignment marks 160 will be provided later. Figure 11 as well as Figure 12 Described later.

[0080] The first gripper 220a includes a first support portion 221a, a first adsorption portion 222a, and a first rotation center 223a. The first support portion 221a may be a portion connected to the first transfer track 210a. The first support portion 221a supports and fixes the first rotation center 223a and the first adsorption portion 222a. The first adsorption portion 222a may be a portion that adsorbs and fixes the substrate 150. The first adsorption portion 222a adsorbs the first surface 150a of the substrate 150. The first rotation center 223a may be a portion that allows the first adsorption portion 222a to rotate. For example, the first rotation center 223a may be able to rotate clockwise or counterclockwise about a third direction Z (refer to reference numeral 170).

[0081] The second gripper 220a includes a second support portion 221b, a second suction portion 222b, and a second rotation center 223b. The second support portion 221b may be connected to the second transfer track 210b. The second support portion 221b supports and fixes the second rotation center 223b and the second suction portion 222b. The second suction portion 222b may be the portion that suctions and fixes the substrate 150. The second suction portion 222b suctions the second surface 150b of the substrate 150. The second rotation center 223a may be the portion that allows the second suction portion 222b to rotate. For example, the second rotation center 223b may be able to rotate clockwise or counterclockwise about a third direction Z (refer to reference numeral 170).

[0082] In some embodiments, the first gripper and the second grippers 220a and 220b described above can move the substrate 150 along the first direction X while simultaneously performing yaw control on the substrate 150. Yaw refers to rotation about a vertical axis. Yaw control means controlling the substrate 150 to rotate about a third direction Z, enabling the substrate 150 to move linearly along the first direction X.

[0083] As described above, the first rotation center 223a of the first gripper 220a can rotate clockwise or counterclockwise about the third direction Z axis (see reference numeral 170). The second rotation center 223b of the second gripper 220b can also rotate clockwise or counterclockwise about the third direction Z axis (see reference numeral 170).

[0084] According to some embodiments, the substrate processing apparatus can also move the substrate 150 along a first direction X using the first gripper and the second grippers 220a and 220b, while simultaneously rotating the substrate 150 clockwise or counterclockwise about a third direction Z. In other words, the first gripper and the second grippers 220a and 220b can assist in enabling the substrate 150 to move linearly along the first direction X. As a result, the first gripper 220a and the second gripper 220b can perform yaw control on the substrate 150.

[0085] For example, such as Figure 4 As shown, substrate 150 can be positioned in a direction inclined relative to the first direction X. The first surface 150a of substrate 150 can extend in any direction between the first direction X and the second direction Y. The first gripper 220a and the second gripper 220b can provide yaw control to assist in advancing substrate 150 parallel to the first direction X. The first gripper 220a and the second gripper 220b can rotate substrate 150 to align the first surface 150a parallel to the first direction X. The first gripper 220a and the second gripper 220b can rotate substrate 150 clockwise.

[0086] Refer again Figure 1 The rack 310 can be configured to span the worktable 110. The rack 310 can extend elongated along the second direction Y, for example. The rack 310 can be configured on the second region II of the worktable 110.

[0087] The head unit 320 may be disposed on the frame 310 and movable along the frame 310. While the head unit 320 may move along a second direction Y, it is not limited thereto. The head unit 320 may include multiple heads for ejecting ink droplets. Each head may include a nozzle. The ink droplets ejected through the head unit 320 may be, for example, QD (Quantum Dot) ink, but are not limited thereto. The multiple nozzles of the head unit 320 may eject multiple ink droplets onto the substrate 150.

[0088] The measurement unit 400 can be disposed on the first region I of the worktable 110. The measurement unit 400 is capable of capturing images of the alignment marks 160 of the substrate 150 and generating images. The measurement unit 400 may include a camera support 410 and a plurality of cameras 420. The camera support 410 may be the part where the cameras 420 are disposed. The cameras 420 may be the part that captures images of the alignment marks 160 of the substrate 150. The cameras 420 may correspond to each alignment mark 160. For example, the cameras 420 may include a first camera (not shown) corresponding to the first alignment mark 161, a second camera (not shown) corresponding to the second alignment mark 162, a third camera (not shown) corresponding to the third alignment mark 163, and a fourth camera (not shown) corresponding to the fourth alignment mark 164.

[0089] The control unit 500 is capable of aligning the substrate 150. The control unit 500 is capable of controlling the first gripper 220a and the second gripper 220b. For example, the control unit 500 can control the first rotation center 223a of the first gripper 220a and the second rotation center 223b of the second gripper 220b, thereby aligning the substrate 150. If the substrate 150 is tilted by a given angle relative to the first direction X, the control unit 500 can rotate the substrate 150 in the direction opposite to the tilt direction.

[0090] When the control unit 500 aligns the substrate 150, the first clamp 220a may be attached to one side 150a of the substrate 150, while the second clamp 220b may not be attached to the other side 150b of the substrate 150. That is, the substrate 150 may be loaded, and the first clamp 220a may be attached to one side 150a of the substrate 150, while the control unit 500 aligns the substrate 150. After the control unit 500 aligns the substrate 150, the second clamp 220b may be attached to the other side 150b of the substrate 150, allowing the substrate to move along the first direction X.

[0091] Reference Figure 5 The substrate 150 is loaded into the first region I of the worktable 110. In the first region I of the worktable 110, the measuring unit 400 captures the alignment marks 160 on the substrate 150, and the control unit 500 uses the captured image to align the substrate 150. The substrate 150 moves to the second region II of the worktable 110. The head unit 320 can eject ink droplets onto the substrate 150 in the second region II of the worktable 110. A printing process can be performed on the substrate 150 in the second region II.

[0092] Below, refer to Figures 6 to 15 This describes a substrate processing method according to some embodiments.

[0093] Figure 6This is a flowchart illustrating a substrate processing method according to some embodiments.

[0094] Reference Figure 1 and Figure 6 According to some embodiments, the substrate processing method may include: loading substrate 150 (S100), first clamp 220a adsorbing a first surface of substrate 150 (S200), measuring unit 400 photographing alignment mark 160 of substrate 150 (S300), rotating first clamp 220a to align substrate 150 (S400), second clamp 220b adsorbing a second surface of substrate 150 (S500), thereby moving substrate 150.

[0095] Although not shown, the process may also include spraying ink droplets onto the substrate 150 in the second region II of the stage 110 after the substrate 150 is moved along the first direction X to perform the printing process.

[0096] Figure 7 as well as Figure 8 It is used for explanation Figure 6 A diagram of step S100. (Refer to...) Figure 7 as well as Figure 8 The S100 steps will be explained in more detail.

[0097] Reference Figure 7 The substrate 150 can be loaded. The substrate 150 can be loaded into the first area I of the worktable 110. The substrate 150 can be moved to a first position.

[0098] Specifically, refer to Figure 8 The first position can be the position of the first to fourth alignment marks 161, 162, 163, 164 on the substrate 150 corresponding to the positions of the first to fourth reference points R1, R2, R3, R4. The positions of the first to fourth reference points R1, R2, R3, R4 can be the positions of the camera 420 of the measurement unit 400.

[0099] Figure 9 as well as Figure 10 It is used for explanation Figure 6 A diagram of step S200. (Refer to...) Figure 9 as well as Figure 10 The S200 procedure will be explained in more detail.

[0100] Reference Figure 9 as well as Figure 10 The substrate 150 is loaded into the first position. Although Figure 9 Although not shown in the figure, the alignment mark 160 of the substrate 150 can overlap with the camera of the measurement unit 400 in the third direction Z.

[0101] After the substrate 150 is loaded, the first gripper 220a can hold the first surface 150a of the substrate 150. At this time, the second gripper 220b does not hold the second surface 150b of the substrate 150.

[0102] Figure 11 as well as Figure 12 It is used for explanation Figure 6 The diagrams for steps S300 and S400 are provided for reference. Figure 12 It is Figure 11 The magnified image of region P. (Refer to...) Figure 11 as well as Figure 12 The steps for S300 and S400 will be explained in more detail.

[0103] Reference Figure 11 as well as Figure 12 The substrate 150 may be tilted relative to the first direction X. The substrate 150 may be loaded in an tilted state. The substrate 150 may be loaded in an unaligned state.

[0104] The first alignment mark 161 can correspond to the first reference point R1, the second alignment mark 162 can correspond to the second reference point R2, the third alignment mark 163 can correspond to the third reference point R3, and the fourth alignment mark 164 can correspond to the fourth reference point R4. The substrate 150 can be aligned using the first to fourth reference points R1, R2, R3, R4 and the first to fourth alignment marks 161, 162, 163, 164. Since the cases using the second alignment mark 162 and the second reference point R2, the cases using the third alignment mark 163 and the third reference point R3, and the cases using the fourth alignment mark 164 and the fourth reference point R4 are the same as the cases using the first alignment mark 161 and the first reference point R1, only the case using the first alignment mark 161 and the first reference point R1 will be described below.

[0105] If the center R1S of the first reference point R1 is called the (0, 0) coordinate, then when the center 161S of the first alignment mark 161 is located at the (0, 0) coordinate, it can be determined that the first alignment mark 161 is aligned. If the first to fourth alignment marks 161, 162, 163, and 164 are aligned, it can be determined that the substrate 150 is aligned.

[0106] First, the camera 420 of the measurement unit 400 captures an image of the first alignment mark 161. Using the captured image, it is confirmed whether the center 161S of the first alignment mark 161 is located at the center R1S of the first reference point R1. If the first alignment mark 161 deviates from the first reference point R1, the position of the first alignment mark 161 can be set as the first reference point R1.

[0107] exist Figure 12In the process, the first alignment mark 161 can be tilted at a first angle θ. The angle at which the first line L1, which passes through the center R1S of the first reference point R1 and is perpendicular to the first direction X, intersects the second line L2, which passes through the center 161S of the first alignment mark 161, can be the first angle θ.

[0108] The first clamp 220a can rotate the substrate 150 by a first angle θ. For example, the first rotation center 223a of the first clamp 220a can rotate clockwise by a first angle θ. If the substrate 150 rotates clockwise by a first angle θ, the center 161S of the first alignment mark 161 can be aligned with the center R1S of the first reference point R1. Similarly, the centers of the second to fourth alignment marks 162, 163, and 164 can be aligned with the centers of the second to fourth reference points R2, R3, and R4.

[0109] At this point, it is determined that substrate 150 is aligned.

[0110] Figure 13 as well as Figure 14 It is used for explanation Figure 6 A diagram illustrating the S500 steps. (Refer to...) Figure 13 as well as Figure 14 The S500 procedure will be explained in more detail.

[0111] Reference Figure 13 as well as Figure 14 The second gripper 220b can hold the second surface of the substrate 150. With the substrate 150 aligned, the second gripper 220b holds the second surface 150b of the substrate 150. The substrate 150 can be configured to be parallel to the first direction X.

[0112] Figure 15 It is used for explanation Figure 6 A diagram of the S600 steps.

[0113] Reference Figure 15 The substrate 150 can be moved along the first direction X. The first clamp 220a and the second clamp 220b can respectively adsorb and fix one side 150a and the other side 150b of each substrate 150. The first clamp 220a and the second clamp 220b move along the first transfer track 210a and the second transfer track 220b respectively in the first direction X.

[0114] During the movement of the substrate 150 along the first direction X, the first gripper 220a and the second gripper 220b can control the lateral movement of the substrate 150. The substrate 150 can be moved to the second region II of the worktable 110, where a printing process is performed on the substrate 150. The head unit 320 provided on the second region II can eject ink droplets onto the substrate 150.

[0115] According to some embodiments, the substrate processing apparatus has a first clamp 220 a The first and second grippers 220b can adhere to both sides of the substrate 150, thereby moving the substrate 150. Furthermore, the first and second grippers 220a and 220b control the lateral movement of the substrate 150, thus enabling stable movement of the substrate 150. Additionally, since the substrate 150 can move stably along the first direction X, ink droplets can be accurately ejected to the desired position.

[0116] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, it is understood that those skilled in the art can implement the invention in other specific forms without altering its technical spirit or essential features. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

Claims

1. A substrate processing apparatus, comprising: A worktable that extends along a first direction, and a substrate that moves along the first direction; A moving unit is respectively disposed on both sides of the worktable extending along the first direction, and moves the substrate along the first direction; as well as Control unit, which aligns with the substrate. The moving unit includes a first gripper and a second gripper that respectively adsorb one side and the other side of the substrate and are spaced apart from each other in a second direction intersecting the first direction. After the first gripper attaches to one side of the substrate, and before the second gripper attaches to the other side of the substrate, the control unit aligns the substrate. After the substrates are aligned, the second clamp attaches to the other side of the substrates, and the substrates move along the first direction. The substrate includes a long side extending along the first direction. The first clamp adheres to and secures one of the long sides of the substrate. The second clamp adheres to and secures the long side of the substrate that the first clamp did not adhere to.

2. The substrate processing apparatus according to claim 1, wherein, The first gripper is capable of rotating about the second direction as an axis.

3. The substrate processing apparatus according to claim 1, wherein, The first and second grippers are capable of lateral control of the substrate while moving it along the first direction.

4. The substrate processing apparatus according to claim 1, wherein, The substrate processing apparatus further includes a measuring unit, which is disposed on the worktable and captures alignment marks disposed at the vertices of the substrate.

5. The substrate processing apparatus according to claim 4, wherein, The control unit uses the measurement unit to capture an image of the alignment mark to set the position of the alignment mark to the preset reference point when the alignment mark deviates from the preset reference point.

6. The substrate processing apparatus according to claim 1, wherein, The substrate processing apparatus further includes a head unit disposed on a frame extending along the second direction on the worktable, and ejecting droplets toward the substrate. The head unit is capable of moving along the second direction.

7. The substrate processing apparatus according to claim 1, wherein, The workbench includes a first area and a second area. The first region is the area where the substrate is loaded and where the first clamp and the second clamp respectively adhere to the first and second surfaces of the substrate. The second region is the region where the printing process is performed on the substrate.

8. The substrate processing apparatus according to claim 7, wherein, The first region is the region in which gas is injected toward the substrate. The second region is the area where gas is sprayed toward the substrate and drawn in the gas between the substrate and the second region.

9. A substrate processing apparatus, comprising: A worktable that extends along a first direction, and a substrate marked with alignment marks that moves along the first direction; The measuring unit, on the worktable, includes a camera that corresponds to the alignment mark on the substrate and captures the alignment mark; A first clamping device is used to attach and fix the first surface of the substrate corresponding to the long side, and is capable of rotating about a second direction perpendicular to the first direction. The second clamping device adsorbs and fixes the substrate to the second surface corresponding to the long side and facing the first surface; as well as The control unit controls the first gripper. The camera of the measuring unit captures the alignment mark after the first gripper attaches to the first surface. The control unit receives the image captured by the camera and rotates the first clamp to align the substrate. After aligning the substrate, the second clamp attaches to the second side of the substrate.

10. The substrate processing apparatus according to claim 9, wherein, After the second clamping device adsorbs the substrate, it moves the substrate along the first direction and performs a printing process on the substrate.

11. The substrate processing apparatus according to claim 9, wherein, The first and second grippers are capable of lateral control of the substrate while moving it along the first direction.

12. The substrate processing apparatus according to claim 9, wherein, The workbench includes a first area and a second area. The first region is the area where the substrate is loaded and where the first and second grippers hold the substrate. The second region is the region where the printing process is performed on the substrate.

13. The substrate processing apparatus according to claim 12, wherein, The first region is the region in which gas is injected toward the substrate. The second region is the area where gas is sprayed toward the substrate and drawn in the gas between the substrate and the second region.

14. The substrate processing apparatus according to claim 12, wherein, The substrate processing apparatus further includes a head unit, which is disposed on a frame extending along a third direction different from the first direction and the second direction on the worktable, and sprays droplets toward the substrate. The measuring unit is disposed on the first area of ​​the workbench. The head unit is disposed on the second area of ​​the worktable.

15. The substrate processing apparatus according to claim 10, wherein, The alignment mark is positioned at the apex of the substrate.

16. A substrate processing method, utilizing the substrate processing apparatus according to any one of claims 1 to 15, the method comprising: A substrate including alignment marks is loaded in the first area of ​​the worktable. The first surface of the substrate, corresponding to its long side and extending along a first direction, is held in place by a first clamp. The alignment marks on the substrate were photographed. The first clamp is rotated to align the substrate. A second gripper, different from the first gripper, is used to adsorb and fix the second surface of the substrate, corresponding to its long side and facing the first surface. Move the substrate along the first direction. A printing process is performed on the substrate in the second area of ​​the worktable.

17. The substrate processing method according to claim 16, wherein, The alignment mark is positioned at the apex of the substrate.

18. The substrate processing method according to claim 16, wherein, The first area of ​​the worktable is the area where gas is sprayed toward the substrate. The second area of ​​the workbench is the area that sprays gas toward the substrate and draws in the gas between the substrate and the second area.

19. The substrate processing method according to claim 16, wherein, The substrate processing method further includes: moving the substrate along the first direction while controlling the yaw of the substrate.

20. The substrate processing method according to claim 16, wherein, Aligning the substrate involves capturing an image of the alignment mark and setting the position of the alignment mark to the preset reference point when the alignment mark deviates from the preset reference point.

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