Wafer processing equipment and wafer processing method

Abstract

The present invention discloses a wafer processing apparatus and method, comprising a frame, a material storage mechanism, an alignment mechanism, a cold expansion mechanism for cold-expanding DAF film for products, a heat shrink mechanism for heat-shrinking UV film for products, a cleaning mechanism, and a UV disintegration mechanism. The apparatus also comprises a push-and-clamp assembly and a turntable, a first transfer mechanism for transferring products from the material storage mechanism to the alignment mechanism, a second transfer mechanism for transferring products from the alignment mechanism to the turntable, a push-and-clamp assembly for transferring products between the cold expansion mechanism and the turntable, and a third transfer mechanism for transferring products from the turntable to the heat shrink mechanism. The third transfer mechanism is also used to transfer products from the heat shrink mechanism to the cleaning mechanism, and the first transfer mechanism is also used to transfer products between the cleaning mechanism and the UV disintegration mechanism. Advantages: Improved DAF film cutting and separation quality, increased packaging yield, improved production efficiency, and reduced production costs.

Description

Technical Field

[0001] The present invention relates to the field of wafer equipment, and in particular to wafer processing equipment and a wafer processing method. Background Art

[0002] A wafer is a silicon wafer used in the manufacture of semiconductor integrated circuits. Due to its round shape, it is called a wafer. Various circuit components can be fabricated on the wafer, resulting in IC products with specific electrical functions. The raw material for wafers is silicon, while silicon dioxide is an inexhaustible source on the Earth's surface. Silicon dioxide ore is refined in an electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polysilicon with a purity of up to 99.9999999999%.

[0003] Currently, wafers are cut using a full-cut method, which involves cutting the wafer and its DAF film together. After full-cutting, the DAF film on the lower surface of the wafer may have burrs due to cutting, which may cause poor die placement during die placement. However, DAF film has good low-temperature brittleness, so separating the DAF film at low temperatures may reduce burrs.

[0004] In view of this, it is necessary to provide a wafer processing equipment and a wafer processing method. Summary of the Invention

[0005] The wafer processing equipment and wafer processing method provided by the present invention effectively solve the problems of burrs on the cutting edge of the DAF film after the wafer is cut, the DAF film cannot be completely separated, and the steel ring and the covering film need to be replaced after the DAF film is separated to support the product, resulting in low work efficiency and high cost.

[0006] The technical solution adopted in the present invention is:

[0007] A wafer processing equipment includes a frame, on which is provided a storage mechanism for storing products, an alignment mechanism for calibrating products, a cold expansion mechanism for cold expansion of the DAF film of the products, a heat shrinkage mechanism for heat shrinking the UV film of the products, a cleaning mechanism for cleaning the surface of the products and a UV degumming mechanism for degumming the cleaned products. The frame also includes a pushing and clamping assembly and a turntable arranged between the cold expansion mechanism and the heat shrinkage mechanism, a No. 1 transfer mechanism arranged on the frame for transferring products in the storage mechanism to the alignment mechanism, a No. 2 transfer mechanism for transferring products in the alignment mechanism to the turntable, a pushing and clamping assembly for transferring products between the cold expansion mechanism and the turntable, a No. 3 transfer mechanism for transferring products in the turntable to the heat shrinkage mechanism, the No. 3 transfer mechanism is also used to transfer products in the heat shrinkage mechanism to the cleaning mechanism, and the No. 1 transfer mechanism is also used to transfer products between the cleaning mechanism and the UV degumming mechanism.

[0008] Furthermore, the material storage mechanism, UV degumming mechanism, cold expansion mechanism and heat shrinkage mechanism are respectively arranged at the four corners of the frame, the material storage mechanism and the UV degumming mechanism are arranged correspondingly, the discharge port of the material storage mechanism corresponds to the feed port of the UV degumming mechanism, the alignment mechanism is arranged between the material storage mechanism and the UV degumming mechanism, the cleaning mechanism is arranged below the alignment mechanism, the cold expansion mechanism is arranged in parallel on one side of the UV degumming mechanism, the heat shrinkage mechanism is arranged on one side of the material storage mechanism and corresponds to the cold expansion mechanism, the No. 3 transfer mechanism is a rotating manipulator arranged between the heat shrinkage mechanism and the cold expansion mechanism, the transfer table is arranged in parallel with the alignment mechanism, and the No. 2 transfer mechanism includes a beam arranged on the frame, a biaxial moving mechanism arranged on the beam and a suction cup arranged at the output end of the biaxial moving mechanism.

[0009] Furthermore, the storage mechanism includes a feeding rack, on which a magazine for placing products and a No. 1 servo module for driving the magazine to rise and fall are provided. The alignment mechanism includes a No. 1 screw module arranged along the X direction and two lifting arms symmetrically arranged. The two lifting arms can move in the same direction or in opposite directions under the drive of the No. 1 screw module, and steps for carrying products are provided on the opposite side of the two lifting arms.

[0010] Furthermore, the transfer mechanism No. 1 includes a linear module No. 1 arranged on the frame along the Y direction, a cylinder No. 1 arranged at the output end of the linear module No. 1, a connecting arm No. 1 arranged at the output end of the cylinder No. 1, and a clamp No. 1 and a clamp No. 2 symmetrically arranged at the end of the connecting arm No. 1. The structures of the clamp No. 1 and the clamp No. 2 are the same, the clamping port of the clamp No. 1 is directed toward the discharge port of the storage mechanism, and the clamping port of the clamp No. 2 is directed toward the feed port of the UV degumming mechanism, and the linear module No. 1 is arranged on the side of the alignment mechanism.

[0011] Furthermore, the cold expansion mechanism includes a bottom plate, four side plates fixedly arranged on the bottom plate and a cover plate fixedly connected to the upper ends of the four side plates. A feed hole is provided on the side plate facing the heat shrinkage mechanism, a baffle is slidably provided, and a No. 3 air cylinder is fixedly provided for driving the baffle to rise and fall. The side plates, cover plates, baffles and bottom plates form a cavity. At least one side plate is provided with an air inlet for cold air. A lifting plate for supporting products and a top plate for top film are provided in the cavity. A No. 1 linear bearing and a No. 2 linear bearing are vertically provided on the end face of the bottom plate. A No. 1 linear bearing is provided inside the No. 1 linear bearing, and a No. 1 linear bearing whose upper end is fixedly connected to the lifting plate is provided. The guide column, the lower end face of the No. 1 guide column is fixedly connected to the No. 1 plate, and a No. 1 lifting power source for driving the No. 1 plate to rise and fall is provided under the bottom plate, and a No. 1 through hole is provided on the lifting plate, and a No. 2 guide column fixedly connected to the top plate is provided in the No. 2 linear bearing, and the lower end face of the No. 2 guide column is fixedly connected to the No. 2 plate, and a No. 2 power source for driving the No. 2 plate to rise and fall is provided under the bottom plate, and the top plate can be lifted and lowered through the No. 1 through hole under the drive of the No. 2 power source, and a card plate is further provided in the cavity, and the card plate is fixedly provided above the lifting plate, and a No. 2 through hole corresponding to the No. 1 through hole is provided on the card plate.

[0012] Furthermore, the heat shrink mechanism includes a mounting frame that can be lifted and lowered relative to the frame, a fixing frame fixedly arranged on the frame and located below the mounting frame, a cover assembly arranged on the frame for pressing the upper end surface of the steel ring, and a hot blowing assembly fixedly arranged on the frame, the mounting frame includes a No. 1 frame and a No. 2 frame, the No. 1 frame includes a number of No. 1 guide shafts that can be lifted and lowered relative to the end surface of the frame, a supporting plate fixedly arranged on the upper end of the No. 1 guide shaft, and a No. 3 plate fixedly connected to the lower end of the No. 1 guide shaft, the No. 2 frame includes a number of No. 2 guide shafts that can be lifted and lowered relative to the end surface of the frame, a supporting plate fixedly arranged on the No. 2 guide shaft, and a No. 3 plate fixedly connected to the lower end of the No. 1 guide shaft, The lifting mechanism is a pair of fixed frames, each of which is connected with the support frame by a plurality of cylinders, each of which is connected with the support frame by a plurality of cylinders. The lifting mechanism is connected with the plurality of cylinders, and the plurality of cylinders are connected with the support frame by a plurality of cylinders. The limit plate can be moved to the bottom of the turntable, and the limit plate is provided with ventilation holes, the aperture of the ventilation holes is not less than the aperture of the No. 3 through hole, and the hot blowing assembly includes a column arranged on the frame, a No. 2 linear module arranged on the column along the Z direction, a bracket arranged on the No. 2 linear module, a rotary drive assembly arranged on the bracket, a hot air gun arranged at the output end of the rotary drive assembly and an air guide cover for accommodating the hot air gun, the lower end surface of the air guide cover is provided with an air outlet, a plurality of suction holes are vertically provided on the suction plate, and a plurality of rollers are circumferentially provided on the outer edge of the suction plate. The rollers are arranged horizontally, and the rolling directions of several of the rollers are radial directions of the No. 3 through-holes. Four No. 1 waist-shaped grooves are also centrally symmetrically arranged on the support plate, and the No. 1 waist-shaped grooves are connected to the No. 3 through-holes. The limiting plate is provided with No. 2 waist-shaped grooves that can correspond one-to-one with the four No. 1 waist-shaped grooves. The limiting plate is provided with four No. 7 cylinders whose output end telescopic directions correspond one-to-one with the No. 1 waist-shaped grooves. The output end of the No. 7 cylinder is fixedly provided with a limiting column that is slidably connected to the No. 1 waist-shaped groove. When the limiting plate limits the product, the upper end of the limiting column extends into the No. 2 waist-shaped groove.

[0013] Furthermore, the cleaning mechanism includes a mounting seat arranged on the frame, an annular groove and a connecting seat arranged on the mounting seat, a rotating lifting assembly arranged on the connecting seat, a nozzle arranged on the inner wall of the annular groove, and a servo motor arranged outside the annular groove for driving the nozzle to rotate, the connecting seat is arranged below the annular hole of the annular groove, the rotating lifting assembly includes a No. 1 motor, a No. 4 cylinder fixedly arranged on the connecting seat with the output end facing upward, a lifting plate fixedly arranged at the output end of the No. 4 cylinder, a ball bearing vertically arranged on the lifting plate, a rotating shaft sleeved on the ball bearing, and a turntable arranged at the upper end of the rotating shaft, the No. 1 motor includes a motor body and a motor output end, the motor output end is fixedly connected to the lower end of the rotating shaft, the motor body is fixedly connected to the lifting plate, a vacuum adsorption area is provided on the turntable, and a fastener for fastening the steel ring is also provided on the turntable located outside the vacuum adsorption area.

[0014] Furthermore, the cleaning mechanism also includes a curtain assembly, which includes a curtain and a frame arranged on a frame. The frame includes two vertical plates arranged on both sides of the annular groove, rollers with two ends respectively arranged on the two vertical plates for rolling up the curtain, a driving wheel and a driven wheel arranged on the vertical plates, and a belt wound around the driving wheel and the impulse wheel. One end of the curtain is fixed on the belt so that the curtain can follow the belt to move above the annular groove.

[0015] Furthermore, a plurality of mounting grooves with outward notches are symmetrically arranged on the center of the turntable, and the fastener is hinged in the mounting groove. The fastener includes an integrally formed lower half and an upper half arranged on the lower half. The weight of the lower half is greater than the weight of the upper half, so that when the turntable rotates, the fastener is subjected to centrifugal force and the upper half flips toward the center of the turntable.

[0016] A wafer processing method for wafer processing equipment comprises the following steps:

[0017] S1. The No. 1 transfer mechanism transfers the product from the storage mechanism to the alignment mechanism, and the alignment mechanism performs centering correction on the product.

[0018] S3. The No. 2 transfer mechanism transfers the product that has been corrected by the alignment mechanism to the transfer table, and pushes the clamping component to transfer the product from the transfer table to the cold expansion mechanism. The temperature in the cavity of the cold expansion mechanism is controlled between -20℃ and -15℃. After fixing the steel ring, a lifting force is applied to the UV film from under the UV film corresponding to the wafer, so that the annular UV film between the wafer and the steel ring is stretched, the UV film covering the wafer is stretched, and the DAF film between the wafer and the UV film follows the movement of the UV film, so that the DAF film is completely separated.

[0019] S3. Push the clamping assembly to transfer the cold-expanded product from the cold-expanding mechanism to the transfer table. The No. 3 transfer mechanism transfers the product to the heat shrinking mechanism. After the steel ring is placed on the pallet, the upper and lower end faces of the steel ring are respectively fixed by the limit plate and the pallet. Then the suction plate rises to lift the UV film covering the wafer to the height before cold expansion, and adsorbs and fixes the UV film covering the wafer. Then the No. 2 linear module drives the bracket to move downward, so that the air outlet of the air guide cover moves to a suitable distance from the ventilation hole. Then the rotary drive assembly drives the hot air gun to rotate, and the hot air gun blows hot air. The hot air passes through the air guide cover and blows to the ventilation hole, so that the temperature of the UV film is between 180°C and 220°C. When the UV film deforms and shrinks due to the hot air, the part of the UV film adsorbed by the suction plate, that is, the UV film corresponding to the grain, does not deform, and the UV film between the grain and the steel ring is shortened.

[0020] S4, the No. 3 transfer mechanism transfers the product from the heat shrink mechanism to the cleaning mechanism, so that the steel ring is pressed by the fastener and the UV film corresponding to the wafer is adsorbed by the turntable. During the rotation of the turntable, the nozzle swings horizontally to spray cleaning liquid on the wafer.

[0021] S5. After the cleaning mechanism completes cleaning of the product, the alignment mechanism receives the product, and the No. 1 transfer mechanism transfers the product from the alignment mechanism to the UV degumming mechanism. Then the UV degumming mechanism works to reduce the viscosity between the UV film and the DAF film.

[0022] S6. After the UV degumming mechanism completes degumming, the No. 1 transfer mechanism transfers the product from the UV degumming mechanism to the alignment mechanism, and then transfers the product from the alignment mechanism to the storage mechanism.

[0023] Beneficial effects of the invention:

[0024] 1. A cold expansion mechanism is set up to split the DAF film of the wafer at a low temperature, eliminating the DAF burrs caused by full cutting. A heat shrink mechanism is used to shrink the UV film that has been stretched and deformed in the cold expansion mechanism. This eliminates the need to replace the UV film after cold expansion, making it easier for wafers to enter the SMT process directly after processing. This improves the quality of wafer cutting and separation, increases packaging yield, improves production efficiency, and reduces production costs.

[0025] 2. The setting relationship of each mechanism can make the structure of the wafer processing equipment more compact, save unnecessary transfer mechanisms, effectively save production costs, and facilitate use. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a right isometric diagram of a wafer processing apparatus according to an embodiment of the present application.

[0027] Figure 2A schematic left isometric view of wafer processing equipment provided in accordance with an embodiment of the present application.

[0028] Figure 3 A top view of the wafer processing equipment provided in an embodiment of the present application.

[0029] Figure 4 Schematic diagram of the material storage mechanism, No. 1 transfer mechanism, alignment mechanism, dual-axis movement mechanism and suction cup of the wafer processing equipment provided in an embodiment of the present application.

[0030] Figure 5 Schematic diagram of the cold expansion mechanism and heat shrinkage mechanism of the wafer processing equipment provided in the embodiment of the present application without the hot blowing component, the turntable and the push-and-clamp component.

[0031] Figure 6 This is an isometric diagram of a cold expansion mechanism of a wafer processing device provided in an embodiment of the present application.

[0032] Figure 7 for Figure 6 Front view of .

[0033] Figure 8 for Figure 6 Top view of .

[0034] Figure 9 For the Figure 8 Cross-sectional view of AA in the figure.

[0035] Figure 10 For the Figure 8 Cross-sectional view of the BB.

[0036] Figure 11 for Figure 6 side view.

[0037] Figure 12 A schematic diagram of a heat shrink mechanism of a wafer processing equipment provided in an embodiment of the present application.

[0038] Figure 13 for Figure 12 side view.

[0039] Figure 14 for Figure 12 Schematic diagram of the magnified area in middle F.

[0040] Figure 15 An isometric view of a cleaning mechanism of a wafer processing apparatus according to an embodiment of the present application.

[0041] Figure 16 A top view of a cleaning mechanism of a wafer processing device provided in an embodiment of the present application.

[0042] Figure 17For the Figure 16 Cross-sectional view of CC.

[0043] Figure 18 for Figure 16 Schematic diagram of the enlarged area C in the middle.

[0044] Figure 19 A schematic diagram of a turntable and fasteners of a cleaning mechanism of a wafer processing device provided in an embodiment of the present application.

[0045] Figure 20 A schematic diagram of the working of fasteners of a cleaning mechanism of a wafer processing equipment provided in an embodiment of the present application.

[0046] Figure 21 Schematic diagram of the steel ring, UV film and wafer used in the wafer processing equipment provided in the embodiment of the present application.

[0047] The following are marked in the figure: 1. Frame; 2. Storage mechanism; 3. Alignment mechanism; 4. Cold expansion mechanism; 5. Heat shrinkage mechanism; 6. UV degumming mechanism; 7. Transfer mechanism No. 1; 8. Transfer mechanism No. 2; 9. Transfer mechanism No. 3; 10. Cleaning mechanism; 93. Rotary manipulator; 81. Beam; 82. Turntable; 83. Push-and-pull assembly; 84. Double-axis moving mechanism; 85. Suction cup; 21. Feed rack; 22. Clip; 23. Servo module No. 1; 31. Screw module No. 1; 32. Lifting arm; 321. Step; 71. Linear module No. 1; 72. Cylinder No. 1; 73. Connecting arm No. 1; 74, clamping jaw No. 1; 75, clamping jaw No. 2; 401, side plate; 402, top plate; 421, feed hole; 403, baffle; 404, cylinder No. 3; 405, lifting plate; 406, top plate; 407, guide post No. 1; 408, plate No. 1; 409, lifting power source No. 1; 410, guide post No. 2; 411, plate No. 2; 412, power source No. 2; 413, clamping plate; 4131, through hole No. 2; 414, supporting plate; 51, hot air blower assembly; 52, cover plate assembly; 501, guide shaft No. 1; 502, support plate; 503, plate No. 3; 504 , No. 2 guide shaft; 505, suction plate; 506, No. 4 plate; 507, No. 6 cylinder; 508, No. 2 screw rod module; 509, linear guide rail; 510, moving plate; 511, limit plate; 512, No. 5 cylinder; 5111, ventilation hole; 513, column; 514, No. 2 linear module; 515, bracket; 516, air guide cover; 517, roller; 5020, No. 1 waist groove; 5110, No. 2 waist groove; 518, No. 7 cylinder; 519, rotary drive assembly; 520, limit column; 101, mounting seat; 102, annular groove; 103, connecting seat; 1 04. Rotary lifting assembly; 105. Nozzle; 106. Servo motor; 1041. Motor No. 1; 1042. Cylinder No. 4; 1043. Lifting plate; 1044. Rotating shaft; 1045. Turntable; 1046. Fastener; 1071. Curtain; 1072. Frame; 1073. Driven pulley; 1074. Roller; 1075. Belt; 1076. Drive motor; 1040. Mounting slot; 0461. Upper half; 0462. Lower half; 001. Steel ring; 002. Wafer; 003. UV film; 0451. Vacuum adsorption area; 452. Lateral protrusion. DETAILED DESCRIPTION

[0048] To make the above-mentioned objects, features, and advantages of the present invention more readily apparent, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following description sets forth numerous specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0049] It should be noted that when an element is referred to as being “fixed to” another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or there may be an intermediate element.

[0050] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used in this specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0051] like Figure 1 、 Figure 2 、 Figure 3 As shown, a wafer processing equipment provided by an embodiment of the present application comprises a frame 1, on which is provided a storage mechanism 2 for storing products, a positioning mechanism 3 for correcting products, a cold expansion mechanism 4 for cold expansion of the DAF film of the product, a heat shrinking mechanism 5 for heat shrinking the UV film of the product, a cleaning mechanism 10 for cleaning the surface of the product, and a UV debonding mechanism 6 for debonding the cleaned product, and further comprising a push-and-pull assembly 83 and a transfer table 82 arranged between the cold expansion mechanism 4 and the heat shrinking mechanism 5, and a rotating table 83 arranged between the cold expansion mechanism 4 and the heat shrinking mechanism 5. The frame 1 is provided with a transfer mechanism No. 1 7 for transferring the products in the storage mechanism 2 to the alignment mechanism 3, a transfer mechanism No. 2 8 for transferring the products in the alignment mechanism 3 to the transfer table 82, a pushing and clamping assembly 83 for transferring the products between the cold expansion mechanism 4 and the transfer table 82, and a transfer mechanism No. 3 93 for transferring the products in the transfer table 82 to the heat shrink mechanism 5. The transfer mechanism No. 3 93 is also used to transfer the products in the heat shrink mechanism 5 to the cleaning mechanism 10, and the transfer mechanism No. 1 7 is also used to transfer the products between the cleaning mechanism 10 and the UV degumming mechanism 6.

[0052] It should be noted that the product includes a wafer 002, a steel ring 001 for supporting the wafer 002, and a UV film 003 disposed on the steel ring 001. Wafer 002 is placed on the UV film 003, with a DAF film disposed beneath wafer 002. A UV debonding mechanism 6 reduces the adhesion between the UV film and the DAF film. Before the product is fed into the wafer processing equipment of this application, wafer 002 is cut into dies and attached to the DAF film, but the DAF film remains intact.

[0053] During actual use, the No. 1 transfer mechanism 7 transfers the product in the storage mechanism 2 to the alignment mechanism 3 for position correction, and then the No. 2 transfer mechanism 8 transfers the corrected product on the alignment mechanism 3 to the transfer table 82, and then pushes the clamping component 83 to transfer the product in the transfer table 82 to the cold expansion mechanism 4. The cold expansion mechanism 4 stretches the UV film 003 in an environment of -20°C to -15°C, so that the DAF film is separated along the cutting path between the grains, and then pushes the clamping component 83 to transfer the cold-expanded product from the cold expansion mechanism 4 to the transfer table 82, and then the No. 3 transfer mechanism 93 transfers the product from the transfer table 82 to the heat shrinkage mechanism 5. The heat shrinkage mechanism 5 shrinks the UV film 003 stretched after cold expansion by heating the environment. Then the No. 3 transfer mechanism 93 transfers the heat-shrunk product to the cleaning mechanism 10 for cleaning, and then the No. 1 transfer mechanism 7 sends the cleaned product to the UV degumming mechanism 6. The UV degumming mechanism 6 degummes the UV film 003 to reduce the adhesion between the UV film 003 and the grains.

[0054] In the above design, a cold expansion mechanism 4 is provided to separate the DAF film of wafer 002 at a low temperature, thus overcoming the DAF film burrs caused by full cutting. A heat shrink mechanism 5 heat-shrinks the UV film 003 that has been stretched and deformed in the cold expansion mechanism 4. This eliminates the need to replace the UV film 003 after cold expansion, allowing wafer 002 to proceed directly to the die bonding process after processing. This improves the quality of wafer 002 cutting and separation, increases packaging yield, increases production efficiency, and reduces production costs.

[0055] Specifically: Figure 1 、 Figure 2 、 Figure 3 and Figure 5 As shown, the storage mechanism 2, UV degumming mechanism 6, cold expansion mechanism 4 and heat shrinkage mechanism 5 are respectively arranged at the four corners of the frame 1, the storage mechanism 2 and the UV degumming mechanism 6 are arranged correspondingly, the discharge port of the storage mechanism 2 corresponds to the feed port of the UV degumming mechanism 6, the alignment mechanism 3 is arranged between the storage mechanism 2 and the UV degumming mechanism 6, the cleaning mechanism 10 is arranged below the alignment mechanism 3, the cold expansion mechanism 4 is arranged in parallel on one side of the UV degumming mechanism 6, the heat shrinkage mechanism 5 is arranged on one side of the storage mechanism 2 and corresponds to the cold expansion mechanism 4, the No. 3 transfer mechanism 93 is a rotating manipulator arranged between the heat shrinkage mechanism 5 and the cold expansion mechanism 4, the transfer table 82 is arranged in parallel with the alignment mechanism 3, and the No. 2 transfer mechanism 8 includes a beam 81 arranged on the frame 1, a biaxial moving mechanism 84 arranged on the beam 81 and a suction cup 85 arranged at the output end of the biaxial moving mechanism 84.

[0056] In actual use, the No. 1 transfer mechanism 7 transfers the product in the storage mechanism 2 to the alignment mechanism 3. After the alignment mechanism 3 corrects the product, the biaxial moving mechanism 84 drives the suction cup 85 to move downward, so that the suction cup 85 adsorbs the steel ring 001 located in the alignment mechanism 3. Then the biaxial moving mechanism 84 drives the suction cup 85 to move upward, and drives the suction cup 85 to move above the transfer table 82. Then the suction cup 85 places the product on the transfer table 82, and then pushes the clamping component 83 from the steel ring 001 away from the side of the feed port of the cold expansion mechanism 4. Clamp the steel ring 001 and push it into the cold expansion mechanism 4. When the cold expansion mechanism 4 completes the expansion of the UV film 003 under low temperature, push the clamping component 83 to transfer the product from the cold expansion mechanism 4 to the transfer table 82. Then the rotating manipulator transfers the product to the heat shrinking mechanism 5. After heat shrinkage by the heat shrinking mechanism 5, the rotating manipulator transfers the product to the cleaning mechanism 10. After cleaning by the cleaning mechanism 10, the No. 1 transfer mechanism 7 transfers the product from the cleaning mechanism 10 to the UV degumming mechanism 6.

[0057] The above design can make the structure of the wafer 002 processing equipment more compact, save unnecessary transfer mechanisms, effectively save production costs, and facilitate use.

[0058] Specifically: Figure 4 As shown, the storage mechanism 2 includes a feeding rack 21, on which a magazine 22 for placing products and a servo module 23 for driving the magazine 22 to rise and fall are provided. The positioning mechanism 3 includes a screw module 31 arranged along the X direction and two lifting arms 32 symmetrically arranged. The two lifting arms 32 can move in the same direction or in opposite directions under the drive of the screw module 31. A step 321 for carrying products is provided on the opposite side of the two lifting arms 32.

[0059] Servo module No. 1 23 drives the clip 22 to rise and fall, so that the wafer 002 to be processed located in the clip 22 is raised and lowered to a height at which the wafer can be clamped by transfer mechanism No. 1 7. Then transfer mechanism No. 1 transfers the product from the clip 22 to the alignment mechanism 3, so that the steps 321 of the two lifting arms 32 lift the steel ring 001. Then screw module No. 1 31 drives the two lifting arms 32 to move toward each other, so that the lifting arms 32 drive the steel ring 001 to move to the correct position, thereby completing the correction of the product.

[0060] In the above design, the structural design and specific implementation method of the storage mechanism 2 and the positioning mechanism 3 can enable the product to be corrected before entering the cold expansion mechanism 4, so that the position of the product in the cold expansion mechanism 4, the heat shrinkage mechanism 5, the cleaning mechanism 10 and the UV degumming mechanism 6 is accurate, ensuring the normal progress of subsequent processing and ensuring processing accuracy.

[0061] Specifically: Figure 4As shown, the No. 1 transfer mechanism 7 includes a No. 1 linear module 71 arranged on the frame 1 along the Y direction, a No. 1 cylinder 72 arranged at the output end of the No. 1 linear module 71, a No. 1 connecting arm 73 arranged at the output end of the No. 1 cylinder 72, and a No. 1 clamp 74 and a No. 2 clamp 75 symmetrically arranged at the end of the No. 1 connecting arm 73. The No. 1 clamp 74 and the No. 2 clamp 75 have the same structure. The clamping port of the No. 1 clamp 74 is directed toward the discharge port of the storage mechanism 2, and the clamping port of the No. 2 clamp 75 is directed toward the feed port of the UV degumming mechanism 6. The No. 1 linear module 71 is arranged on the side of the positioning mechanism 3.

[0062] In actual use, when it is necessary to clamp the product from the storage mechanism 2 to the correction mechanism, the No. 1 cylinder 72 drives the No. 1 clamp 74 to rise and fall until its clamping port corresponds to the product to be taken from the storage mechanism 2, and then the No. 1 linear module 71 drives the No. 1 cylinder 72 to move toward the side of the storage mechanism 2, so that the No. 1 clamp 74 then clamps the product. After the product is clamped by the No. 1 clamp 74, the No. 1 module drives the No. 1 cylinder 72 to move toward the alignment mechanism 3. When the product moves to the top of the alignment mechanism 3, the No. 1 cylinder 72 drives the No. 1 clamp 74 to move downward to place the product on the alignment mechanism 3. When the product is cleaned and placed again on the alignment mechanism 3, the No. 1 cylinder 72 drives the No. 2 clamp 75 to rise, so that the clamping mouth of the No. 2 clamp 75 is higher than the product in the alignment mechanism 3, and then the No. 1 linear module 71 drives the No. 1 cylinder 72 to move toward the side of the storage mechanism 2. When the No. 1 cylinder 72 moves to between the alignment mechanism 3 and the storage mechanism 2, the drive is stopped, and the No. 1 cylinder 72 drives the No. 2 clamp 75 to move downward, so that the clamping mouth of the No. 2 clamp 75 corresponds to the product in the alignment mechanism 3. Then the No. 2 clamp 75 clamps the product away from the side of the UV degumming mechanism 6, and the No. 1 module drives the No. 1 cylinder 72 to move toward the side of the UV degumming mechanism 6 to send the product into the UV degumming mechanism 6. After the product has completed degumming in the UV degumming mechanism 6, the No. 2 clamp 75 takes the product out of the UV degumming mechanism 6 and places it in the alignment mechanism 3, and then the No. 1 cylinder 72 drives the connecting arm to rise, so that the No. 1 clamp 74 and the No. 2 clamp 75 move up, and the No. 1 linear module 71 drives the No. 1 cylinder 72 to move between the UV degumming mechanism 6 and the alignment mechanism 3, and then the No. 1 cylinder 72 drives the connecting arm to move downward, so that the clamping port of the No. 1 clamp 74 corresponds to the product, and then the No. 1 clamp 74 clamps the product, and the No. 1 linear module 71 drives the No. 1 cylinder 72 to move to the side of the storage mechanism 2 to send the product into the storage mechanism 2.

[0063] In the above design, the storage mechanism 2 and the UV degumming mechanism 6 are arranged opposite to each other, and the positioning mechanism 3 and the No. 1 transfer mechanism 7 are arranged between the storage mechanism 2 and the UV degumming mechanism 6, so that the No. 1 transfer mechanism 7 can clamp the product from one side of the product according to actual conditions, and select the product to be sent to different mechanisms according to the clamping position, so that the equipment integration is higher and the product transfer efficiency is higher.

[0064] Specifically: Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 and Figure 11 As shown, the cold expansion mechanism 4 includes a bottom plate, four side plates 401 fixedly arranged on the bottom plate and a cover plate 402 fixedly connected to the upper ends of the four side plates 401. The side plate 401 facing the heat shrink mechanism 5 is provided with a feed hole 421 and a baffle 403 is slidably provided and a No. 3 cylinder 404 is fixedly provided for driving the baffle 403 to rise and fall. The side plates 401, the cover plate 402, the baffle 403 and the bottom plate form a cavity. At least one side plate 401 is provided with an air inlet for cold air. A lifting plate 405 for supporting the product and a top plate 406 for the top film are provided in the cavity. A No. 1 linear bearing and a No. 2 linear bearing are vertically provided on the end face of the bottom plate. A No. 1 guide column 407 with an upper end fixedly connected to the lifting plate 405 is provided in the No. 1 linear bearing. The lower end face of the No. 1 guide column 407 is fixedly connected to the No. 1 plate 408, and a No. 1 lifting power source 409 for driving the No. 1 plate 408 to rise and fall is arranged below the bottom plate. A No. 1 through hole is provided on the lifting plate 405, and a No. 2 guide column 410 fixedly connected to the top plate 406 is sleeved in the No. 2 linear bearing, and the No. 2 guide column 410 is fixedly connected to the No. 2 plate 411 on the lower end face, and a No. 2 power source 412 for driving the No. 2 plate 411 to rise and fall is arranged below the bottom plate. The top plate 406 can be lifted and lowered through the No. 1 through hole under the drive of the No. 2 power source 412, and a clamping plate 413 is further provided in the cavity, and the clamping plate 413 is fixedly arranged above the lifting plate 405, and a No. 2 through hole 4131 corresponding to the No. 1 through hole is provided on the clamping plate 413.

[0065] It should be noted that the external refrigerator is connected to the air inlet and is responsible for reducing the temperature in the cavity. Two support plates 414 for supporting the card plate 413 are provided on the rack 1.

[0066] In actual use, the No. 1 lifting power source 409 drives the No. 1 plate 408 to rise, so that the No. 1 guide column 407 and the lifting plate 405 rise synchronously to the height of receiving the product, and then receive the product. After the product is received, the No. 3 cylinder 404 drives the baffle 403 to block the feed hole 421, and the external refrigerator controls the temperature in the cavity at -20℃ to -15℃ through the air inlet. The No. 3 cylinder drives the steel ring 001 to be placed on the lifting plate 405 forming the No. 1 through hole. At this time, the No. 1 through hole and the steel ring 001 are in a state of contact. 1, then the first lifting power source 409 continues to drive the first plate 408 upward, so that the upper and lower end surfaces of the steel ring 001 respectively contact the lower end surface of the clamping plate 413 and the upper end surface of the lifting plate 405. Then the second lifting power source drives the second plate 411 upward, causing the second guide pillar 410 and the top plate 406 to rise synchronously. After contacting the lower end of the UV film 003, the second plate 411 continues to rise, causing the UV film 003 to deform. At this time, the DAF films separate along the cutting line of the wafer 002. Then the second lifting power source drives the second plate 411 downward, causing the top plate 406 to separate from the UV film 003. Then the first lifting power source 409 drives the first plate 408 downward, causing the lifting plate 405 to move downward, so that the steel ring 001 no longer contacts the clamping plate 413.

[0067] In the above design, an external refrigerator is used to lower the temperature inside the cavity, so that the DAF film placed in the cavity becomes brittle due to the low temperature, thereby expanding the UV film 003 and the DAF film, so that the DAF film can be divided along the grains with high quality, reducing the occurrence efficiency of problems such as defects in the subsequent patch process.

[0068] Specifically: Figure 12 、 Figure 13 and Figure 14As shown, the heat shrink mechanism 5 includes a mounting frame that can be lifted and lowered relative to the frame 1, a fixing frame fixedly arranged on the frame 1 and located below the mounting frame, a cover assembly 52 arranged on the frame 1 for pressing the upper end surface of the steel ring 001, and a hot blowing assembly 51 fixedly arranged on the frame 1, the mounting frame includes a No. 1 frame and a No. 2 frame, the No. 1 frame includes a number of No. 1 guide shafts 501 that can be lifted and lowered relative to the end surface of the frame 1, a supporting plate 502 fixedly arranged on the upper end of the No. 1 guide shaft 501, and a No. 3 plate 503 fixedly connected to the lower end of the No. 1 guide shaft 501, the No. 2 frame includes a number of No. 2 guide shafts 504 that can be lifted and lowered relative to the end surface of the frame 1, a suction plate 505 fixedly arranged on the upper end of the No. 2 guide shaft 504, and a No. 3 plate 503 fixedly connected to the lower end of the No. 1 guide shaft 501. 04, the fourth plate 506 is fixedly connected at the lower end, the fixed frame is provided with a sixth cylinder 507 for driving the third plate 503 to rise and fall, and a screw module for driving the fourth plate 506 to rise and fall, the supporting plate 502 is provided with a third through hole for avoiding the UV film 003, the suction plate 505 is located below the third through hole, the cover plate assembly 52 includes two linear guide rails 509 arranged in parallel on the frame 1, a movable plate 510 slidingly arranged on the two linear guide rails 509, a limit plate 511 connecting the upper ends of the two movable plates 510, and a fifth cylinder 512 arranged on the frame 1 for driving the movable plate 510 to move relative to the linear guide rail 509, the limit plate 511 can be moved to the turntable 8 2, a ventilation hole 5111 is provided on the limiting plate 511, and the aperture of the ventilation hole 5111 is not less than the aperture of the No. 3 through hole. The hot air blowing assembly 51 includes a column 513 provided on the frame 1, a No. 2 linear module 514 provided on the column 513 along the Z direction, a bracket 515 provided on the No. 2 linear module 514, a rotary drive assembly 519 provided on the bracket 515, a hot air gun provided at the output end of the rotary drive assembly 519, and an air guide hood 516 for accommodating the hot air gun. The lower end surface of the air guide hood 516 is provided with an air outlet, a plurality of suction holes are vertically provided on the suction plate 505, and a plurality of rollers 517 are provided circumferentially along the outer edge of the suction plate 505. The rollers 517 are horizontally It is arranged that the rolling direction of several of the rollers 517 is the radial direction of the No. 3 through hole, and four No. 1 waist-shaped grooves 5020 are also centrally symmetrically arranged on the support plate 502, and the No. 1 waist-shaped grooves 5020 are connected to the No. 3 through hole, and the limiting plate 511 is provided with a No. 2 waist-shaped groove 5110 which can correspond one-to-one with the four No. 1 waist-shaped grooves 5020, and the limiting plate 511 is provided with four No. 7 cylinders 518 whose output end telescopic directions correspond one-to-one with the No. 1 waist-shaped grooves 5020, and the output end of the No. 7 cylinder 518 is fixedly provided with a limiting column 520 which is slidably connected to the No. 1 waist-shaped groove 5020, and when the limiting plate 511 limits the product, the upper end of the limiting column 520 extends into the No. 2 waist-shaped groove 5110.

[0069] It should be noted that the air suction port of the suction plate 505 is connected to an external exhaust device.

[0070] During actual use, the rotating manipulator 93 transfers the product from the turntable 82 to the pallet 502, so that the steel ring 001 is placed on the part of the pallet 502 with the ring shape of the No. 3 through hole, and the UV film 003 corresponds to the No. 3 through hole. Then the No. 5 cylinder 512 drives the movable plate 510 to move along the linear guide rail 509 to the corresponding position of the pallet 502, so that the limit plate 511 is located directly above the pallet 502, and the center of the ventilation hole 5111 corresponds to the center of the No. 3 hole. Then the No. 6 cylinder 507 drives the No. 1 frame to rise and fall, so that the upper end face of the steel ring 001 is against the lower end face of the limit plate 511. Then the screw module drives the No. 2 frame to rise and fall, so that the suction plate 505 contacts the UV film 003 corresponding to the grain. Then the exhaust equipment works, so that the UV film 003 is tightly attached to the suction plate 505 due to the negative pressure. Linear module 514 then drives bracket 515 downward, moving the air outlet of air guide 516 to an appropriate distance from vent 5111. Rotary drive assembly 519 then rotates the heat gun, which blows hot air through air guide 516 toward vent 5111, keeping the temperature of UV film 003 between 180°C and 220°C. While UV film 003 deforms and shrinks due to the hot air, the portion of UV film 003 held by suction plate 505, corresponding to the die, remains unchanged. The portion of UV film 003 between the die and steel ring 001 shortens.

[0071] In the above design, the structural design and specific implementation of the heat shrink mechanism 5 enable the UV film 003 to shrink after cold expansion, and the shrinkage is limited to the UV film 003 between the die and the steel ring 001. This means that the product after cold expansion does not need to be re-applied with UV film 003, and the film frame can be directly sent to the patch process.

[0072] Specifically: Figure 15 、 Figure 16 、 Figure 17 、 Figure 18As shown, the cleaning mechanism 10 includes a mounting base 101 arranged on the frame 1, an annular groove 102 and a connecting base 103 arranged on the mounting base 101, a rotating lifting assembly 104 arranged on the connecting base 103, a nozzle 105 arranged on the inner wall of the annular groove 102, and a servo motor 106 arranged outside the annular groove 102 for driving the nozzle 105 to rotate. The connecting base 103 is arranged below the annular hole of the annular groove 102, and the rotating lifting assembly 104 includes a No. 1 motor 1041, a No. 4 cylinder 1042 fixedly arranged on the connecting base 103 with the output end facing upward, and a lifting plate 104 fixedly arranged at the output end of the No. 4 cylinder 1042. 43. A ball bearing vertically arranged on the lifting plate 1043, a rotating shaft 1044 sleeved on the ball bearing and a turntable 1045 arranged at the upper end of the rotating shaft 1044, the No. 1 motor 1041 includes a motor body and a motor output end, the motor output end is fixedly connected to the lower end of the rotating shaft 1044, the motor body is fixedly connected to the lifting plate 1043, and a vacuum adsorption area 0451 for adsorbing the UV film 003 is provided on the turntable 1045. Four lateral protrusions 452 for placing the steel ring 001 are circumferentially provided on the turntable 1045, and each lateral protrusion 452 is provided with a fastener 1046 for fastening the steel ring 001.

[0073] It should be noted that the lifting arm 32 of the alignment mechanism 3 is provided with a vertical hole for the lateral protrusion 452 to pass through for lifting.

[0074] During actual use, the No. 4 cylinder 1042 drives the lifting plate 1043 to rise to a height convenient for receiving the product. Then, when the product is placed on the turntable 1045, the UV film 003 is adsorbed by the vacuum adsorption area 0451, and the steel ring 001 is fastened by the fastener 1046. The No. 4 cylinder 1042 drives the lifting plate 1043 to descend, so that the turntable 1045 is at a height convenient for the nozzle 105 to spray. Then, the servo motor 106 drives the nozzle 105 to rotate back and forth, and the No. 1 motor 1041 drives the rotating shaft 1044 to rotate, so that the turntable 1045 rotates. Then, the nozzle 105 sprays the cleaning fluid, so that the spray fluid cleans the surface of the wafer 002.

[0075] In the above design, the wafer 002 can be cleaned effectively, and during the cleaning process, the centrifugal force generated by the rotation of the turntable 1045 can automatically dry the cleaning liquid on the surface of the wafer 002.

[0076] Specifically: Figure 15 、 Figure 16 、 Figure 17 and Figure 18As shown, the cleaning mechanism 10 also includes a curtain 1071 assembly, which includes a curtain 1071 and a frame 1072 arranged on the frame 1. The frame 1072 includes two vertical plates arranged on both sides of the annular groove 102, rollers 1074 with two ends respectively arranged on the two vertical plates for rolling up the curtain 1071, a driving wheel and a driven wheel 1073 arranged on the vertical plates, and a belt 1075 wound around the driving wheel and the impulse wheel. One end of the curtain 1071 is fixed on the belt 1075, so that the curtain 1071 can follow the belt 1075 to move to above the annular groove 102.

[0077] It should be noted that the driving wheel is driven to rotate by the driving motor 1076, thereby driving the belt 1075 and the driven wheel 1073 to rotate.

[0078] In actual use, before the product is placed on the tray, the curtain 1071 follows the movement of the belt 1075 so that the curtain 1071 does not cover the upper end of the annular groove 102. At this time, the curtain 1071 is rolled up on the roller 1074, and then the motor drives the driving wheel to rotate in the opposite direction, so that the belt 1075 drives the curtain 1071 to move above the opening of the annular groove 102.

[0079] In the above design, the structural design and specific implementation of the curtain 1071 assembly can prevent the spraying liquid from being sprayed outside the cleaning mechanism 10 during the process of the spray head 105 spraying the cleaning liquid.

[0080] Specifically: Figure 18 、 Figure 19 and Figure 20 As shown, a plurality of mounting grooves 1040 with outward notches are symmetrically arranged on the center of the turntable 1045, and the fastener 1046 is hinged in the mounting groove 1040. The fastener 1046 includes an integrally formed lower half 0462 and an upper half 0461 arranged on the lower half 0462. The weight of the lower half 0462 is greater than the weight of the upper half 0461, so that when the turntable 1045 rotates, the fastener 1046 is subjected to centrifugal force and the upper half 0461 flips toward the center of the turntable 1045.

[0081] In actual use, when the turntable 1045 rotates, the fastener 1046 is subjected to centrifugal force. Since the centrifugal force is directed radially, the weight of the lower half 0462 of the fastener 1046 is greater than the weight of the upper half 0461. Therefore, the upper half 0461 of the fastener 1046 will flip toward the center of the turntable 1045. When the turntable 1045 stops, the centrifugal force disappears because the weight of the lower half 0462 of the fastener 1046 is greater than the weight of the upper half 0461. The fastener 1046 automatically returns to its original position, causing the upper half 0461 of the fastener 1046 to break contact with the product.

[0082] In the above design, the structural design of the fastener 1046 can enable the fastener 1046 to automatically press the upper end surface of the steel ring 001 when the turntable 1045 rotates. When the turntable 1045 stops rotating, the fastener 1046 automatically resets because the weight of the upper half 0461 is less than the weight of the lower half 0462, thereby stopping pressing the steel ring 001.

[0083] A wafer processing method for wafer 002 processing equipment comprises the following steps:

[0084] S1. The No. 1 transfer mechanism transfers the product from the storage mechanism 2 to the alignment mechanism 3, and the alignment mechanism 3 performs centering correction on the product.

[0085] S2, the No. 2 transfer mechanism 8 transfers the product that has been corrected by the alignment mechanism 3 to the transfer table 82, pushes the clamping component 38 to transfer the product from the transfer table 82 to the cold expansion mechanism 4, controls the temperature in the cavity of the cold expansion mechanism 4 between -20℃ and -15℃, and after fixing the steel ring 001, applies a lifting force to the UV film 003 from under the UV film 003 corresponding to the wafer 002, so that the annular UV film 003 between the wafer 002 and the steel ring 001 stretches, and the UV film 003 covering the wafer 002 stretches, and the DAF film between the wafer 002 and the UV film 003 moves with the UV film 003, so that the DAF film is completely separated.

[0086] S3, push the clamping assembly 83 to transfer the cold-expanded product from the cold-expanding mechanism 4 to the transfer table 82, and the No. 3 transfer mechanism 93 transfers the product to the heat shrink mechanism 5. After the steel ring 001 is placed on the support plate 502, the upper and lower end faces of the steel ring 001 are respectively fixed by the limit plate 511 and the support plate 502. Then the suction plate 505 rises to lift the UV film 003 covering the wafer 002 to the height before cold expansion, and adsorbs and fixes the UV film 003 covering the wafer 002. Then the No. 2 linear module 514 drives The bracket 515 moves downward, so that the air outlet of the air guide cover 516 moves to a suitable distance from the ventilation hole 5111, and then the rotary drive component 519 drives the hot air gun to rotate, and the hot air gun blows hot air. The hot air passes through the air guide cover 516 and blows toward the ventilation hole 5111, so that the temperature of the UV film 003 is between 180°C and 220°C. When the UV film 003 deforms and shrinks due to the hot air, the part of the UV film 003 adsorbed by the suction plate 505, that is, the UV film 003 corresponding to the grain does not deform, and the UV film 003 between the grain and the steel ring 001 is shortened.

[0087] S4, the No. 3 transfer mechanism 93 transfers the product from the heat shrink mechanism 5 to the cleaning mechanism 10, so that the steel ring 001 is pressed by the fastener 1046, and the UV film 003 corresponding to the wafer 002 is adsorbed by the turntable 1045. During the rotation of the turntable 1045, the nozzle 105 swings horizontally to spray cleaning liquid on the wafer 002.

[0088] S5. After the cleaning mechanism 10 completes cleaning of the product, the alignment mechanism receives the product, and the No. 1 transfer mechanism 7 transfers the product from the alignment mechanism 3 to the UV degumming mechanism 6. Then the UV degumming mechanism 6 works to reduce the viscosity between the UV film 003 and the DAF film.

[0089] S6. After the UV degumming mechanism 6 completes degumming, the No. 1 transfer mechanism 7 transfers the product from the UV degumming mechanism 6 to the alignment mechanism 3, and then transfers the product from the alignment mechanism 3 to the storage mechanism 2.

[0090] To explain in further detail, it should be understood that the above is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer processing device, comprising a frame (1), characterized in that: The frame (1) is provided with a storage mechanism (2) for storing products, a positioning mechanism (3) for correcting products, a cold expansion mechanism (4) for cold expansion of the DAF film of the products, a heat shrinking mechanism (5) for heat shrinking the UV film of the products, a cleaning mechanism (10) for cleaning the surface of the products, and a UV debonding mechanism (6) for debonding the cleaned products. The frame (1) also includes a push-and-pull assembly (83) and a transfer table (82) arranged between the cold expansion mechanism (4) and the heat shrinking mechanism (5), and a device arranged on the frame (1) for placing the products between the storage mechanism (2) and the positioning mechanism (5). 3), a No. 1 transfer mechanism (7) for transferring products between the alignment mechanism (3), a No. 2 transfer mechanism (8) for transferring products in the alignment mechanism (3) to the transfer table (82), a push-and-pull assembly (83) for transferring products between the cold expansion mechanism (4) and the transfer table (82), a No. 3 transfer mechanism (93) for transferring products in the transfer table (82) to the heat shrink mechanism (5), the No. 3 transfer mechanism (93) is also used to transfer products in the heat shrink mechanism (5) to the cleaning mechanism (10), and the No. 1 transfer mechanism (7) is also used to transfer products between the cleaning mechanism (10) and the UV degumming mechanism (6); The material storage mechanism (2), UV degumming mechanism (6), cold expansion mechanism (4) and heat shrink mechanism (5) are respectively arranged at the four corners of the frame (1); the material storage mechanism (2) and the UV degumming mechanism (6) are arranged correspondingly; the discharge port of the material storage mechanism (2) corresponds to the feed port of the UV degumming mechanism (6); the alignment mechanism (3) is arranged between the material storage mechanism (2) and the UV degumming mechanism (6); the cleaning mechanism (10) is arranged below the alignment mechanism (3); the cold expansion mechanism (4) is arranged in parallel with the UV degumming mechanism (6); The heat shrink mechanism (5) is arranged on one side of the material storage mechanism (2) and corresponds to the cold expansion mechanism (4); the third transfer mechanism (93) is a rotary manipulator arranged between the heat shrink mechanism (5) and the cold expansion mechanism (4); the transfer table (82) is arranged in parallel with the alignment mechanism (3); the second transfer mechanism (8) includes a crossbeam (81) arranged on the frame (1), a biaxial moving mechanism (84) arranged on the crossbeam (81), and a suction cup (85) arranged at the output end of the biaxial moving mechanism (84); The storage mechanism (2) includes a feeding rack (21), on which a magazine (22) for placing products and a No. 1 servo module (23) for driving the magazine (22) to move up and down are provided. The alignment mechanism (3) includes a No. 1 screw module (31) arranged along the X direction and two lifting arms (32) symmetrically arranged. The two lifting arms (32) can move in the same direction or in opposite directions under the drive of the No. 1 screw module (31). Steps (321) for carrying products are provided on opposite sides of the two lifting arms (32).

2. The wafer processing equipment according to claim 1, wherein: The No. 1 transfer mechanism (7) comprises a No. 1 linear module (71) arranged on the frame (1) along the Y direction, a No. 1 cylinder (72) arranged at the output end of the No. 1 linear module (71), a No. 1 connecting arm (73) arranged at the output end of the No. 1 cylinder (72), and a No. 1 clamping jaw (74) and a No. 2 clamping jaw (75) symmetrically arranged at the end of the No. 1 connecting arm (73). The No. 1 clamping jaw (74) and the No. 2 clamping jaw (75) have the same structure. The clamping opening of the No. 1 clamping jaw (74) is oriented toward the discharge port of the storage mechanism (2), and the clamping opening of the No. 2 clamping jaw (75) is oriented toward the feed port of the UV degumming mechanism (6). The No. 1 linear module (71) is arranged on the side of the alignment mechanism (3).

3. The wafer processing equipment according to claim 2, wherein: The cold expansion mechanism (4) comprises a bottom plate, four side plates (401) fixedly arranged on the bottom plate, and a cover plate (402) fixedly connected to the upper ends of the four side plates (401); a feed hole (421) is provided on the side plate (401) facing the heat shrink mechanism (5), a baffle (403) is slidably arranged, and a No. 3 air cylinder (404) is fixedly arranged for driving the baffle (403) to rise and fall; the side plates (401), the cover plate (402), the baffle (403) and the bottom plate form a cavity; at least one side plate (401) is provided with an air inlet for cold air; a lifting plate (405) for supporting products and a top plate (406) for top film are provided in the cavity; a No. 1 linear bearing and a No. 2 linear bearing are vertically provided on the end face of the bottom plate; a No. 1 guide column (407) with an upper end fixedly connected to the lifting plate (405) is provided inside the No. 1 linear bearing; The lower end surface of the No. 1 guide column (407) is fixedly connected to the No. 1 plate (408), and a No. 1 lifting power source (409) for driving the No. 1 plate (408) to move up and down is provided below the bottom plate. A No. 1 through hole is provided on the lifting plate (405), and a No. 2 guide column (410) fixedly connected to the top plate (406) is provided inside the No. 2 linear bearing. The lower end surface of the No. 2 guide column (410) is fixedly connected to the No. 2 plate (411), and a No. 2 power source (412) for driving the No. 2 plate (411) to move up and down is provided below the bottom plate. The top plate (406) can be lifted and lowered through the No. 1 through hole under the drive of the No. 2 power source (412). A card plate (413) is also provided in the cavity, and the card plate (413) is fixedly provided above the lifting plate (405). The card plate (413) is provided with a No. 2 through hole (4131) corresponding to the No. 1 through hole.

4. The wafer processing equipment according to claim 3, wherein: The heat shrink mechanism (5) comprises a mounting frame that can be lifted and lowered relative to the frame (1), a fixing frame fixedly arranged on the frame (1) and located below the mounting frame, a cover plate assembly (52) arranged on the frame (1) for pressing the upper end surface of the steel ring (001), and a hot air blowing assembly (51) fixedly arranged on the frame (1), wherein the mounting frame comprises a No. 1 frame and a No. 2 frame, wherein the No. 1 frame comprises a plurality of No. 1 guide shafts (501) that can be lifted and lowered relative to the end surface of the frame (1), a supporting plate (502) fixedly arranged on the upper end of the No. 1 guide shaft (501), and a No. 3 plate (503) fixedly connected to the lower end of the No. 1 guide shaft (501), and the No. 2 frame comprises a plurality of No. 2 guide shafts (504) that can be lifted and lowered relative to the end surface of the frame (1). A suction plate (505) is fixedly arranged on the upper end of the No. 2 guide shaft (504) and a No. 4 plate (506) is fixedly connected to the lower end of the No. 2 guide shaft (504). The fixed frame is provided with a No. 6 cylinder (507) for driving the No. 3 plate (503) to rise and fall and a No. 2 screw rod module (508) for driving the No. 4 plate (506) to rise and fall. The support plate (502) is provided with a No. 3 through hole for avoiding the coating. The suction plate (505) is located below the No. 3 through hole. The cover plate assembly (52) includes two linear guide rails (509) arranged in parallel on the frame (1), movable plates (510) respectively slidably arranged on the two linear guide rails (509), and a limit plate connecting the upper ends of the two movable plates (510). A positioning plate (511) and a No. 5 air cylinder (512) arranged on the frame (1) for driving the movable plate (510) to move relative to the linear guide rail (509); the positioning plate (511) can be moved to the bottom of the turntable (82); a ventilation hole (5111) is arranged on the positioning plate (511); the aperture of the ventilation hole (5111) is not less than the aperture of the No. 3 through hole; the hot air blowing assembly (51) comprises a column (513) arranged on the frame (1), a No. 2 linear module (514) arranged on the column (513) along the Z direction, a bracket (515) arranged on the No. 2 linear module (514), a rotation drive assembly (519) arranged on the bracket (515), and a rotation drive assembly (519) arranged on the rotation drive assembly (519). The hot air gun at the output end of the driving component (519) and the wind guide cover (516) for accommodating the hot air gun, the lower end surface of the wind guide cover (516) is provided with an air outlet, the suction plate (505) is vertically provided with a plurality of suction holes, the outer edge of the suction plate (505) is provided with a plurality of rollers (517) in the circumferential direction, the rollers (517) are horizontally provided, and the rolling direction of the plurality of rollers (517) is the radial direction of the No. 3 through hole, the supporting plate (502) is also centrally symmetrically provided with four No. 1 waist-shaped grooves (5020), the No. 1 waist-shaped grooves (5020) are connected to the No. 3 through hole, and the limiting plate (511) is provided with a No. 2 waist-shaped groove (5110) that can correspond one-to-one with the four No. 1 waist-shaped grooves (5020).The limiting plate (511) is provided with four No. 7 cylinders (518) whose output ends are telescopically corresponding to the No. 1 waist-shaped groove (5020) in one-to-one correspondence. A limiting column (520) is fixedly provided on the output end of the No. 7 cylinder (518) and is slidably connected to the No. 1 waist-shaped groove (5020). When the limiting plate (511) limits the product, the upper end of the limiting column (520) extends into the No. 2 waist-shaped groove (5110).

5. The wafer processing equipment according to claim 4, wherein: The cleaning mechanism (10) comprises a mounting seat (101) arranged on a frame (1), an annular groove (102) and a connecting seat (103) arranged on the mounting seat (101), a rotating lifting assembly (104) arranged on the connecting seat (103), a spray head (105) arranged on the inner wall of the annular groove (102), and a servo motor (106) arranged outside the annular groove (102) for driving the spray head (105) to rotate, wherein the connecting seat (103) is arranged below the annular hole of the annular groove (102), and the rotating lifting assembly (104) comprises a No. 1 motor (1041), a No. 4 cylinder (1042) fixedly arranged on the connecting seat (103) with its output end facing upward, and a lifting plate fixedly arranged at the output end of the No. 4 cylinder (1042). (1043), a ball bearing vertically arranged on the lifting plate (1043), a rotating shaft (1044) sleeved on the ball bearing and a turntable (1045) arranged at the upper end of the rotating shaft (1044), the No. 1 motor (1041) includes a motor body and a motor output end, the motor output end is fixedly connected to the lower end of the rotating shaft (1044), the motor body is fixedly connected to the lifting plate (1043), a vacuum adsorption area (0451) for adsorbing the UV film (003) is provided on the turntable (1045), four lateral protrusions (452) for placing the steel ring (001) are circumferentially arranged on the turntable (1045), and each lateral protrusion (452) is provided with a fastener (1046) for fastening the steel ring (001).

6. The wafer processing equipment according to claim 5, characterized in that: The cleaning mechanism (10) further comprises a curtain (1071) assembly, the curtain (1071) assembly comprising a curtain (1071), a frame (1072) arranged on the frame (1), the frame (1072) comprising two vertical plates arranged on both sides of the annular groove (102), a roller (1074) with two ends respectively arranged on the two vertical plates for rolling up the curtain (1071), a driving wheel and a driven wheel (1073) arranged on the vertical plates, and a belt (1075) wound around the driving wheel and the impulse wheel, one end of the curtain (1071) being fixed on the belt (1075) so that the curtain (1071) can follow the belt (1075) to move to above the annular groove (102).

7. The wafer processing equipment according to claim 6, wherein: The turntable (1045) is centrally and symmetrically provided with a plurality of mounting grooves (1040) with notches facing outwards. The fastener (1046) is hinged in the mounting groove (1040). The fastener (1046) comprises an integrally formed lower half (0462) and an upper half (0461) provided on the lower half (0462). The weight of the lower half (0462) is greater than the weight of the upper half (0461), so that when the turntable (1045) rotates, the fastener (1046) is subjected to centrifugal force and the upper half (0461) flips toward the center of the turntable (1045).

8. A wafer processing method for a wafer processing device, using the wafer processing device according to claim 6, characterized in that: The steps include: S1, the No. 1 transfer mechanism transfers the product from the storage mechanism (2) to the alignment mechanism (3), and the alignment mechanism (3) performs centering correction on the product; S2, the second transfer mechanism (8) transfers the product after being calibrated by the alignment mechanism (3) to the transfer table (82), pushes the clamping assembly (38) to transfer the product from the transfer table (82) to the cold expansion mechanism (4), controls the temperature in the cavity of the cold expansion mechanism (4) to be between -20°C and -15°C, fixes the steel ring (001), and applies a lifting force to the UV film (003) from below the UV film (003) corresponding to the wafer (002), so that the annular UV film (003) between the wafer (002) and the steel ring (001) stretches, the UV film (003) covered by the wafer (002) stretches, and the DAF film between the wafer (002) and the UV film (003) moves with the UV film (003), so that the DAF film is completely separated; S3, the push clamping assembly (83) transfers the product after cold expansion from the cold expansion mechanism (4) to the transfer table (82), and the No. 3 transfer mechanism (93) transfers the product to the heat shrink mechanism (5). After the steel ring (001) is placed on the support plate (502), the upper and lower end faces of the steel ring (001) are respectively pressed against the limit plate (511) and the support plate (502) to be fixed. Then the suction plate (505) rises to lift the UV film (003) covered by the wafer (002) to the height before cold expansion, and adsorbs and fixes the UV film (003) covered by the wafer (002). Then the No. 2 linear module (514) ) driving the bracket (515) to move downward, so that the air outlet of the air guide cover (516) moves to a suitable distance from the ventilation hole (5111), and then the rotating driving component (519) drives the hot air gun to rotate, and the hot air gun blows hot air, and the hot air passes through the air guide cover (516) and blows toward the ventilation hole (5111), so that the temperature of the UV film (003) is between 180°C and 220°C. When the UV film (003) is deformed and shrunk due to the hot air, the part of the UV film (003) adsorbed by the suction plate (505), that is, the UV film (003) corresponding to the grain, does not deform, and the UV film (003) between the grain and the steel ring (001) is shortened; S4, the third transfer mechanism (93) transfers the product from the heat shrink mechanism (5) to the cleaning mechanism (10), so that the steel ring (001) is pressed by the fastener (1046), and the UV film (003) corresponding to the wafer (002) is adsorbed by the turntable (1045). During the rotation of the turntable (1045), the nozzle (105) swings horizontally to spray the cleaning liquid on the wafer (002); S5. After the cleaning mechanism (10) completes cleaning of the product, the alignment mechanism receives the product, and the first transfer mechanism (7) transfers the product from the alignment mechanism (3) to the UV degumming mechanism (6). Subsequently, the UV degumming mechanism (6) works to reduce the viscosity between the UV film (003) and the DAF film. S6. After the UV degumming mechanism (6) completes degumming, the first transfer mechanism (7) transfers the product from the UV degumming mechanism (6) to the alignment mechanism (3), and then transfers the product from the alignment mechanism (3) to the storage mechanism (2).

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