Display module and manufacturing method thereof

Abstract

The application discloses a display module and a manufacturing method thereof. The display module comprises a display panel, a touch panel and a cover plate which are sequentially stacked, and further comprises a first flexible circuit board and a second flexible circuit board. In a flat state, the first flexible circuit board has a spacing or a contact surface with a side of the second cover plate part facing the first flexible circuit board. When the contact surface is formed, the area of the orthogonal projection of the contact surface on the second cover plate part accounts for 1 / 8-1 / 5 of the area of the second cover plate part. The display module improves the reliability of the flexible circuit board, reduces the peeling of the cover plate and the probability of bubble generation in the display area. The manufacturing method is simple in steps, avoids bubble generation in the display area during the preparation process and does not need a bubble removal step.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and a method for manufacturing the display module. Background Technology

[0002] As flexible OLED display technology continues to mature, borderless displays have become the mainstream in the market. Borderless displays utilize flexible circuit boards to bend some of the ribbon cables or control chips to the bottom of the screen to reduce the size of the non-display area.

[0003] For touchscreen display devices, the display module includes flexible printed circuit boards (FPCs) bonded to the touch layer and the array layer, respectively. Because the bonding positions of these two FPCs differ in the stacking direction, their bending radii must also differ. Therefore, the length of the outer FPC is greater than that of the inner FPC. Due to this length difference, in the flattened state before bending, the outer FPC will bulge upwards. When the bulge exceeds the inner surface of the cover plate, the FPC exerts pressure on the cover plate above, causing the cover plate to detach and lift, resulting in air intake into the display area and the formation of bubbles that are difficult to eliminate. Summary of the Invention

[0004] The main technical problem addressed by this application is to provide a display module and its manufacturing method, which improves the reliability of flexible circuit boards, reduces cover plate peeling, and decreases the probability of air bubbles forming in the display area.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: providing a display module comprising a display panel, a touch panel, and a cover plate stacked sequentially, wherein, along the length direction of the cover plate, the cover plate includes a first cover plate portion and a second cover plate portion connected to each other, the orthographic projection of the first cover plate portion on the plane where the touch panel is located is located within the touch panel, and the orthographic projection of the second cover plate portion on the plane where the touch panel is located is located outside the touch panel; a first flexible circuit board, along the length direction of the first flexible circuit board, includes a first panel bonding end, a first transmission segment, and a first driving bonding end connected sequentially, the first panel... The first flexible circuit board is bonded to the touch panel; the second flexible circuit board includes, along its length, a second panel bonding end, a second transmission segment, and a second driving bonding end connected in sequence. The second panel bonding end is bonded to the array layer of the display panel, and the second driving bonding end is bonded to the first driving bonding end. In the flattened state, the first flexible circuit board and the side of the second cover plate facing the first flexible circuit board have a gap or form a contact surface, wherein the orthogonal projection area of ​​the contact surface on the second cover plate accounts for 1 / 8 to 1 / 5 of the area of ​​the second cover plate.

[0006] To solve the above-mentioned technical problems, another technical solution adopted in this application is: providing a method for manufacturing a display module, comprising: bonding a first panel bonding end of a first flexible circuit board to a touch panel, and bonding a second panel bonding end of a second flexible circuit board to an array layer; providing a cover plate on the side of the touch panel where the first flexible circuit board is disposed; wherein, in the length direction of the cover plate, the cover plate includes a first cover plate portion and a second cover plate portion connected to each other, the orthographic projection of the first cover plate portion on the plane where the touch panel is located is located inside the touch panel, and the orthographic projection of the second cover plate portion on the plane where the touch panel is located is located outside the touch panel; the first flexible circuit board further includes a second portion, the orthographic projection of the second portion on the cover plate is located inside the second cover plate portion, and a contouring member is disposed and fixed on the side of the second portion away from the cover plate; wherein, the side of the contouring member facing the second portion is a second arc surface protruding towards the second portion; bonding a first driving bonding end of the first flexible circuit board to a second driving bonding end of the second flexible circuit board; and bending the first flexible circuit board and the second flexible circuit board.

[0007] The beneficial effects of this application are as follows: Unlike existing technologies, this application, on the one hand, limits the distance between the first flexible circuit board and the cover plate in the flattened state of the display module, preventing the first flexible circuit board from contacting the cover plate and thus reducing the pressure exerted by the first flexible circuit board on the cover plate; on the other hand, it limits the contact area between the first flexible circuit board and the cover plate in the flattened state to a certain range, preventing the contact area from being too small, thereby reducing the probability of excessive stress on the first flexible circuit board and damage to it; simultaneously, it prevents the contact area from being too large, thereby reducing the pressure exerted by the first flexible circuit board on the inner surface of the cover plate, thus reducing the probability of the cover plate delaminating and peeling off, and reducing the probability of air bubbles forming in the display area of ​​the display module. The manufacturing method of the display module of this application is simple, reduces the pressure of the first flexible circuit board on the cover plate, avoids air bubbles forming in the display area during the manufacturing process, and eliminates the need for a defoaming step. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of the display module embodiment of this application when unfolded;

[0009] Figure 2 This is a partial top view of the second embodiment of the display module of this application when unfolded;

[0010] Figure 3 This is a schematic diagram of the display module in embodiment three of this application when unfolded;

[0011] Figure 4 This is a partial structural schematic diagram of the cover plate of Embodiment 3 of the display module of this application;

[0012] Figure 5 This is a schematic diagram of the structure of the display module according to Embodiment 3 of this application after bending;

[0013] Figure 6 This is a schematic diagram of the display module embodiment four of this application when unfolded;

[0014] Figure 7 This is a partial structural schematic diagram of the contoured part of the display module embodiment four of this application;

[0015] Figure 8 This is a schematic diagram of the structure of the display module according to Embodiment 4 of this application after bending;

[0016] Figure 9 This is a schematic diagram of the structure of the display module according to Embodiment 5 of this application after bending;

[0017] Figure 10 This is a flowchart illustrating an embodiment of the manufacturing method of the display module of this application. Detailed Implementation

[0018] To make the objectives, technical solutions, and effects of this application clearer and more explicit, the following detailed description is provided with reference to the accompanying drawings and embodiments. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0019] See Figure 1 , Figure 1 This is a schematic diagram of the structure of the display module embodiment of this application when unfolded.

[0020] In this embodiment, the display module includes:

[0021] The display panel 7, the touch panel 5, and the cover plate 1 are stacked in sequence. In the length direction of the cover plate 1, the cover plate 1 includes a first cover plate part 11 and a second cover plate part 12 that are connected to each other. The orthographic projection of the first cover plate part 11 on the plane where the touch panel 5 is located is inside the touch panel 5, and the orthographic projection of the second cover plate part 12 on the plane where the touch panel 5 is located is outside the touch panel 5.

[0022] The first flexible circuit board 4 includes a first panel bonding terminal 41, a first transmission segment and a first driving bonding terminal 43 connected in sequence. The first panel bonding terminal 41 is bonded to the touch panel 5.

[0023] The second flexible circuit board 6 includes, along its length, a second panel bonding end 61, a second transmission segment 63, and a second driving bonding end 62 connected in sequence. The second panel bonding end 61 is bonded to the array layer of the display panel 7, and the second driving bonding end 62 is bonded to the first driving bonding end 43.

[0024] When the second flexible circuit board 6 is in a flattened state, and the length direction of the first flexible circuit board 4 is relatively parallel to the cover plate 1, there is a gap between the first flexible circuit board 4 and the side of the second cover plate portion 12 facing the first flexible circuit board 4.

[0025] Specifically, such as Figure 1 As shown, the display module includes components from top to bottom ( Figure 1 The display module comprises a cover plate 1, an adhesive layer 2, a polarizing layer 3, a touch panel 5, a display panel 7, and a buffer layer 8, which are stacked sequentially in the Z-direction. The display panel 7 includes a light-emitting layer, an array layer, and a substrate stacked sequentially from top to bottom. The cover plate 1 includes a first cover plate portion 11 located in the display area and a second cover plate portion 12 located in the non-display area. The display module also includes a first flexible circuit board 4, a second flexible circuit board 6, and a third flexible circuit board 9. Specifically, the first flexible circuit board 4 can be a touch flexible circuit board (TPFPC), the second flexible circuit board 6 can be a chip-on-film (COF), and the third flexible circuit board 9 can be a driver flexible circuit board (driverFPC). In the first flexible circuit board 4, along its length, it includes a first panel bonding end 41 and a first driving bonding end 43 at both ends, and a first transmission segment connected in the middle of the two ends. The first panel bonding end 41 is bonded to the touch panel 5 and adhered to the adhesive layer 2. The first driving bonding end 43 can be connected to the third flexible circuit board 9. In the second flexible circuit board 6, along its length, it includes a second panel bonding end 61 and a second driving bonding end 62 at both ends, and a second transmission segment 63 connected in the middle of the two ends. The second panel bonding end 61 is bonded to the array layer in the display panel 7. The second driving bonding end 62 is bonded to the first driving bonding end 43. The second driving bonding end 62 can also be connected to the third flexible circuit board 9. An IC chip 64 and a padding block 65 can also be fixed on the second flexible circuit board 6.

[0026] See Figure 2 , Figure 2 This is a partial top view of the second embodiment of the display module of this application when unfolded. The difference between this embodiment and the first embodiment is that a contact surface 121 is formed between the first flexible circuit board (not shown) and the side of the second cover plate portion 12 facing the first flexible circuit board, wherein the orthogonal projection area of ​​the contact surface 121 on the second cover plate portion 12 accounts for 1 / 8 to 1 / 5 of the area of ​​the second cover plate portion 12.

[0027] When the second flexible circuit board 6 is in a flattened state (along...) Figure 1 When extending in the X direction, the second panel bonding end 61, the second transmission segment 63, and the second drive bonding end 62 are located on a straight line. At this time, the first flexible circuit board 4 and the second cover plate portion 12 of this application have two states: one is that the two are in the stacking direction ( Figure 1 The Z-direction has a spacing, such as Figure 1 As shown, the first flexible circuit board 4 does not contact the inner surface of the second cover plate 12, thereby reducing the pressure of the first flexible circuit board 4 on the cover plate 1. This reduces the probability that the cover plate 1 will be lifted by the first flexible circuit board 4 and peel off from the adhesive layer 2 when the display module is flattened, thus reducing the probability of air bubbles forming in the display area of ​​the display module. Secondly, the two are in contact, such as... Figure 2 As shown, a contact surface 121 is formed between the two. On the plane where the cover plate 1 is located, the ratio of the positive projection area of ​​the contact surface 121 on the second cover plate portion 12 to the area of ​​the second cover plate portion 12 is 1 / 8-1 / 5. On the one hand, this reduces the local stress on the first flexible circuit board 4 and reduces the probability of damage to the first flexible circuit board 4; on the other hand, it reduces the pressure of the first flexible circuit board 4 on the inner surface of the cover plate, thereby reducing the probability of the cover plate 1 peeling off from the adhesive layer 2 and reducing the probability of bubbles being generated in the display area of ​​the display module.

[0028] Optionally, see Figure 3 , Figure 3 This is a schematic diagram of the display module according to Embodiment 3 of this application when unfolded. In this embodiment, the second cover plate portion 12 has a groove 13 on the side facing the first flexible circuit board 4 for accommodating at least a portion of the first flexible circuit board 4. In this embodiment, the groove 13 is provided on the inner side of the cover plate 1, which can accommodate and buffer the bulging first flexible circuit board 4, effectively reducing the distance between the first flexible circuit board 4 and the inner surface of the cover plate 1, thereby reducing the pressure of the first flexible circuit board on the cover plate.

[0029] Further reading Figure 3 In this embodiment, the surface of the groove 13 is a first arc surface that is concave away from the first flexible circuit board 4. The arc surface is adapted to the shape of the first flexible circuit board 4 with its arc-shaped bulge, so as to avoid the cover plate 1 being too thin and affecting its strength.

[0030] Specifically, see Figure 4 , Figure 4 This is a partial structural diagram of the cover plate of Embodiment 3 of the display module of this application. Along the length direction of cover plate 1 ( Figure 4 In the X direction, the width b1 of the first arc surface is 0.1mm-0.3mm; the depth h1 of the first arc surface is 0.1mm-0.2mm, and the depth of the first arc surface does not exceed 1 / 3 of the thickness of the cover plate 1 to ensure the strength of the cover plate 1. The structure after bending in this embodiment is as follows. Figure 5 As shown, Figure 5 This is a schematic diagram of the structure of the display module embodiment three after bending. After bending, the third flexible circuit board 9 and the padding block 65 are both attached to the side of the buffer layer 8 away from the display panel 7.

[0031] Alternatively, see [link to relevant documentation] Figure 6 , Figure 6 This is a schematic diagram of the display module according to Embodiment 4 of this application when unfolded. In this embodiment, the first transmission section of the first flexible circuit board 4 further includes a second part 42. The orthographic projection of the second part 42 on the cover plate 1 is located within the second cover plate part 12. A contouring member 44 is fixed to the side of the second part 42 away from the cover plate 1. The side of the contouring member 44 facing the second part 42 is a second arc surface protruding towards the second part 42. The contouring member 44 is provided corresponding to the bulging part of the first flexible circuit board 4, and the bulging part of the first flexible circuit board 4 is forced to fit with the second arc surface of the contouring member 44, thereby reducing the degree of bulging of the first flexible circuit board 4, separating the first flexible circuit board 4 from the cover plate 1, thereby reducing the pressure on the cover plate 1, reducing the probability of the cover plate 1 peeling off, and reducing the probability of air bubbles being generated in the display area of ​​the display module. The shape of the arc-shaped contouring member 44 is adapted to the bulging shape of the first flexible circuit board 4, and it is not easy to generate excessive stress on the first flexible circuit board 4, reducing the probability of damage to the first flexible circuit board 4.

[0032] Specifically, see Figure 7 , Figure 7 This is a partial structural schematic diagram of the contouring component in Embodiment 4 of the display module of this application. Along the length of the contouring component 44, the width b2 of the second arc surface is 2mm-4mm; the maximum height h2 of the contouring component 44 (i.e., the distance from the apex of the second arc surface to the bottom surface of the contouring component 44) is 0.2mm-0.4mm; and the minimum height h3 of the contouring component 44 (i.e., the distance from the endpoint of the second arc surface to the bottom surface of the contouring component 44) is 0.1mm-0.3mm. The width and height of the second arc surface are both smaller than the width and height of the bulge of the first flexible circuit board before bonding, ensuring the spacing between the first flexible circuit board and the cover plate. Simultaneously, the first flexible circuit board and the contouring component 44 have a high degree of bonding, and the stress is relatively low, making them less prone to detachment.

[0033] Optionally, see Figure 8 , Figure 8 This is a schematic diagram of the bent structure of the display module embodiment four of this application. The contoured part 44 is fixedly connected to the second flexible circuit board 6 on at least part of its side facing the second flexible circuit board 6. Since both sides of the contoured part 44 are fixed, the distance between the first flexible circuit board 4 and the cover plate 1 is further increased, reducing the probability of the first flexible circuit board 4 contacting the cover plate 1.

[0034] Further reading Figure 8The orthographic projection of the contouring member 44 on the second flexible circuit board 6 is located outside the second panel bonding end 61. The contouring member 44 is located outside the display panel 7. When the first flexible circuit board 4 and the second flexible circuit board 6 are bent, the contouring member 44 can bend along with them. Since the contouring member 44 is always in contact with the first flexible circuit board 4 and the second flexible circuit board 6 on both sides during the bending process, it provides support for the two and avoids the problem of stress concentration causing damage to the flexible circuit board.

[0035] Further, see Figure 9 , Figure 9 This is a schematic diagram of the structure of the display module according to Embodiment 5 of this application after bending. The side of the contour piece 44 facing the second flexible circuit board 6 is a concave arc surface away from the second flexible circuit board 6. This improves the fit with the bent second flexible circuit board 6.

[0036] In other embodiments, the groove 13 and the contour piece 44 can be simultaneously disposed in the display module.

[0037] See Figure 10 , Figure 10 This is a flowchart illustrating a first embodiment of the manufacturing method for the display module of this application. The manufacturing method of this embodiment includes:

[0038] Step S101: Bond the first panel bonding terminal 41 of the first flexible circuit board 4 to the touch panel 5, and bond the second panel bonding terminal 61 of the second flexible circuit board 6 to the display panel 7.

[0039] Step S102: A cover plate 1 is disposed on the side of the touch panel 5 where the first flexible circuit board 4 is located; wherein, along the length direction of the cover plate 1, the cover plate 1 includes a first cover plate portion 11 and a second cover plate portion 12 connected to each other, the orthographic projection of the first cover plate portion 11 on the plane of the touch panel 5 is located inside the touch panel 5, and the orthographic projection of the second cover plate portion 12 on the plane of the touch panel 5 is located outside the touch panel 5, such as... Figure 1 As shown.

[0040] Step S103: As Figure 4 As shown, the first flexible circuit board 4 also includes a second part 42. The orthographic projection of the second part 42 on the cover plate 1 is located within the second cover plate part 12. A contouring member 44 is provided and fixed on the side of the second part 42 facing away from the cover plate 1. The side of the contouring member 44 facing the second part 42 is a second arc surface protruding towards the second part 42. Optionally, after the contouring member 44 is fixed to the first flexible circuit board 4, it can also be fixed to the side of the second flexible circuit board 6 facing the first flexible circuit board 4. When fixing the contouring member 44, in order to ensure full fit with the contouring member 44, the first driving bonding end 43 of the first flexible circuit board 4 and the second driving bonding end 62 of the second flexible circuit board 6 are both in a natural state.

[0041] Step S104: As Figure 4 As shown, the first driving bonding terminal 43 of the first flexible circuit board 4 is bonded to the second driving bonding terminal 62 of the second flexible circuit board 6. Optionally, in this step, both the first driving bonding terminal 43 and the second driving bonding terminal 62 can be connected to the third flexible circuit board 9.

[0042] Step S105: Bend the first flexible circuit board 4 and the second flexible circuit board 6, as follows. Figure 8 or Figure 9 As shown.

[0043] This manufacturing method increases the distance between the first flexible circuit board 4 and the cover plate 1, reduces the contact area between them, thereby reducing the pressure on the cover plate 1, reducing the probability of the cover plate 1 peeling off, reducing the probability of bubbles being generated in the display area of ​​the display module, and eliminating the need for subsequent bubble removal steps; and it is less likely to damage the first flexible circuit board 4 and the second flexible circuit board 6 during the manufacturing process, ensuring reliability.

[0044] Optionally, after bending the first flexible circuit board 4 and the second flexible circuit board 6, the process further includes removing the contour piece 44. Removing the contour piece 44 after bending reduces the weight of the display module and allows for reuse of the contour piece 44.

[0045] Furthermore, the removal of the contouring part 44 can be achieved in the following specific ways:

[0046] Firstly, in step S103, the contouring part 44 is bonded to the first flexible circuit board 4 and the second flexible circuit board 6. An adhesive is placed between the contouring part 44 and the second part 42. The adhesive includes an ultraviolet curable material. Then, after bending the first flexible circuit board 4 and the second flexible circuit board 6, the adhesive is irradiated with ultraviolet light. The adhesiveness of the adhesive weakens, and the first flexible circuit board 4 and the second flexible circuit board 6 separate from the contouring part 44. At this time, the contouring part 44 can be removed.

[0047] Secondly, in step S103, the contouring part 44 is bonded to the first flexible circuit board 4 and the second flexible circuit board 6. An adhesive is provided between the contouring part 44 and the second part 42. The adhesive includes a temperature-sensitive material. Then, after bending the first flexible circuit board 4 and the second flexible circuit board 6, the temperature of the adhesive is increased or decreased to weaken the adhesive's stickiness. The first flexible circuit board 4 and the second flexible circuit board 6 are separated from the contouring part 44, at which point the contouring part 44 can be removed.

[0048] Third, in step S103, a magnetic field is set between the contouring component 44, the first flexible circuit board 4, and the second flexible circuit board 6. The first flexible circuit board 4 and the second flexible circuit board 6 are magnetized in the magnetic field. The contouring component 44 includes ferromagnetic material that is adsorbed onto the first flexible circuit board 4 and the second flexible circuit board 6. Then, after bending the first flexible circuit board 4 and the second flexible circuit board 6, the magnetic field is removed or magnetic field interference is performed to demagnetize the first flexible circuit board 4 and the second flexible circuit board 6, or to make them repel each other from the contouring component 44. At this time, the contouring component 44 can be removed.

[0049] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A display module, characterized in that, include: A display panel, a touch panel, and a cover plate are stacked in sequence. In the length direction of the cover plate, the cover plate includes a first cover plate portion and a second cover plate portion that are connected to each other. The orthographic projection of the first cover plate portion on the plane where the touch panel is located is located inside the touch panel, and the orthographic projection of the second cover plate portion on the plane where the touch panel is located is located outside the touch panel. The first flexible circuit board includes, along its length, a first panel bonding end, a first transmission segment, and a first driving bonding end connected in sequence, wherein the first panel bonding end is bonded to the touch panel. The second flexible circuit board includes, along its length, a second panel bonding terminal, a second transmission segment, and a second driving bonding terminal connected in sequence. The second panel bonding terminal is bonded to the array layer of the display panel, and the second driving bonding terminal is bonded to the first driving bonding terminal. The second cover plate portion has a groove on the side facing the first flexible circuit board for accommodating at least a portion of the first flexible circuit board; or, the first transmission segment includes a second part, the orthographic projection of the second part on the cover plate is located inside the second cover plate portion, and a contouring member is fixed on the side of the second part away from the cover plate, the side of the contouring member facing the second part is a second arc surface protruding towards the second part. So that when the second flexible circuit board is in a flattened state, the first flexible circuit board and the side of the second cover plate facing the first flexible circuit board have a gap or form a contact surface, wherein when the contact surface is formed, the orthogonal projection area of ​​the contact surface on the second cover plate accounts for 1 / 8 to 1 / 5 of the area of ​​the second cover plate.

2. The display module according to claim 1, characterized in that, When the second cover plate has a groove for accommodating at least part of the first flexible circuit board on the side facing the first flexible circuit board, the surface of the groove is a first arc surface that is concave away from the first flexible circuit board.

3. The display module according to claim 2, characterized in that, Along the length of the cover plate, the width of the first arc surface is 0.1mm-0.3mm.

4. The display module according to claim 2, characterized in that, The depth of the first arc surface is 0.1mm-0.2mm.

5. The display module according to claim 1, characterized in that, When the first transmission segment includes a second part, the orthographic projection of the second part on the cover plate is located inside the second cover plate part, and a contouring component is fixed on the side of the second part away from the cover plate, the side of the contouring component facing the second part is a second arc surface protruding towards the second part; In the longitudinal direction of the contoured part, the width of the second arc surface is 2mm-4mm.

6. The display module according to claim 5, characterized in that, The maximum height of the contoured part is 0.2mm-0.4mm.

7. The display module according to claim 5, characterized in that, The contoured component is fixedly connected to the second flexible circuit board at least partially on the side facing the second flexible circuit board.

8. The display module according to claim 7, characterized in that, The orthographic projection of the contoured component on the second flexible circuit board is located outside the bonding end of the second panel.

9. The display module according to claim 7, characterized in that, The side of the contoured component facing the second flexible circuit board is an arc surface that is concave away from the second flexible circuit board.

10. A method for manufacturing a display module, characterized in that, The first panel bonding end of the first flexible circuit board is bonded to the touch panel, and the second panel bonding end of the second flexible circuit board is bonded to the array layer. A cover plate is provided on the side of the touch panel where the first flexible circuit board is located; wherein, in the length direction of the cover plate, the cover plate includes a first cover plate portion and a second cover plate portion connected to each other, the orthographic projection of the first cover plate portion on the plane where the touch panel is located is located inside the touch panel, and the orthographic projection of the second cover plate portion on the plane where the touch panel is located is located outside the touch panel. The first flexible circuit board further includes a second part, the orthographic projection of the second part on the cover plate is located inside the second cover plate part, and a contouring member is provided and fixed on the side of the second part away from the cover plate; wherein, the side of the contouring member facing the second part is a second arc surface protruding towards the second part; The first driving bonding terminal of the first flexible circuit board is bonded to the second driving bonding terminal of the second flexible circuit board. Bending the first flexible circuit board and the second flexible circuit board.

11. The manufacturing method according to claim 10, characterized in that, After bending the first flexible circuit board, the following is also included: Remove the contouring part.

12. The manufacturing method according to claim 11, characterized in that, The step of setting and fixing a contouring component on the side of the second part away from the cover plate includes: An adhesive is provided between the contoured part and the second part, the adhesive comprising an ultraviolet-curable material; The removal of the contouring component includes: The colloid is irradiated with ultraviolet light to separate the second part from the conforming part.

13. The manufacturing method according to claim 11, characterized in that, The step of setting and fixing a contouring component on the side of the second part away from the cover plate includes: An adhesive is provided between the contouring part and the second part, the adhesive comprising a temperature-sensitive material; The removal of the contouring component includes: Increase or decrease the temperature of the colloid to separate the second part from the contour piece.

14. The manufacturing method according to claim 11, characterized in that, The step of setting and fixing a contouring component on the side of the second part away from the cover plate includes: A magnetic field is provided between the contouring component and the second part, wherein the contouring component comprises a ferromagnetic material, causing the contouring component to be attracted to the second part; The removal of the contouring component includes: Remove the magnetic field or interfere with the magnetic field to separate the second part from the contouring part.

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