Automatic assembly device and method

Abstract

The application relates to an automatic assembling device and method, which comprises a work platform, a first glue dispensing mechanism and a heat sink taking and placing mechanism; the work platform is used for arranging a circuit board assembly to be assembled; the first glue dispensing mechanism is arranged on the work platform and comprises a glue pipe support and a first driving assembly; the glue pipe support is used for fixing a glue dispensing needle tube; the first driving assembly is used for driving the glue dispensing needle tube to move to a glue dispensing position and dispensing glue; the heat sink taking and placing mechanism is arranged on the work platform and comprises a heat sink picking assembly and a second driving assembly; the heat sink picking assembly is used for picking or releasing a heat sink to be assembled; and the second driving assembly is used for driving the heat sink picking assembly to move to a placing position relative to the circuit board assembly to be assembled. The application is used for completing the whole assembling process of dispensing glue on the circuit board assembly to be assembled, picking the heat sink to be assembled, moving to the placing position, and placing on the circuit board assembly with the dispensed glue, so that the assembling efficiency is improved and the cost is reduced.

Description

Technical Field

[0001] This invention relates to the field of optoelectronic communication module assembly technology, and in particular to an automatic assembly device and method. Background Technology

[0002] As the application fields of optoelectronic communication modules continue to expand, the structure of optoelectronic communication modules is also constantly being improved to adapt to different application scenarios. At the same time, the assembly technology of optoelectronic communication modules with different structures is also constantly developing. One type of optoelectronic communication module includes a housing, a circuit board assembly (PCBA) housed in the housing, optical components, and a heat sink (usually made of metal). The assembly process of this type of optoelectronic communication module includes the step of assembling and fixing the circuit board assembly and the heat sink.

[0003] In existing technologies, the assembly of circuit board assemblies and heat sinks generally requires manual gluing using precision fixtures, and there is no dedicated equipment for this assembly. The current assembly process involves applying black adhesive to the heat sink, fixing it in place using a precision fixture, assembling the heat sink and circuit board assembly, locking the fixture, and then baking it in an oven. In other words, the current method is manual gluing and lacks specialized equipment for assembling circuit board assemblies and heat sinks, requiring assembly personnel to use precision fixtures to complete the entire assembly process.

[0004] However, the dispensing technique and amount of adhesive in the above assembly process are uncontrollable, relying on human eyes to locate the dispensing position on the circuit board components and the placement of the heat sink. The cumulative tolerances caused by the tolerances of each component result in high labor costs, poor product assembly accuracy, and low assembly efficiency. On the other hand, the assembly process requires high precision of the fixtures and has a short scrap cycle, further increasing costs. Summary of the Invention

[0005] Therefore, it is necessary to provide an automated assembly device and method to address the problems of poor assembly accuracy, high cost, and low efficiency.

[0006] An automated assembly device for assembling circuit board assemblies and heat sinks includes a work platform, a first dispensing mechanism, and a heat sink pick-and-place mechanism. The work platform is used to configure the circuit board assembly to be assembled. The first dispensing mechanism is disposed on the work platform and includes a dispensing tube support and a first driving component. The dispensing tube support is used to fix a dispensing needle, and the first driving component is used to drive the dispensing needle to move relative to the circuit board assembly to the dispensing position and dispense adhesive. The heat sink pick-and-place mechanism is disposed on the work platform and includes a heat sink picking component and a second driving component. The heat sink picking component is used to pick up or release the heat sink to be assembled, and the second driving component is used to drive the heat sink picking component to move relative to the circuit board assembly to the placement position.

[0007] The aforementioned automatic assembly device is equipped with a first dispensing mechanism and a heat sink picking and placing mechanism to complete the dispensing of adhesive on the circuit board assembly to be assembled and to pick up the heat sink to be assembled, move it to the placement position and place it on the circuit board assembly with the adhesive applied, so that the heat sink overlaps with the circuit board assembly. This improves the assembly efficiency and reduces the cost.

[0008] In one embodiment, the automatic assembly device further includes a first visual positioning component, a second visual positioning component, and a control device. The first visual positioning component is used to acquire the position information of the circuit board assembly to be assembled and identify the first center line of the circuit board assembly to be assembled. The second visual positioning component is used to identify the second center line of the heat sink to be assembled. The control device is electrically connected to the first dispensing mechanism, the heat sink picking and placing mechanism, the first visual positioning component, and the second visual positioning component. The control device is used to obtain the coordinates of the dispensing position based on the position information, control the first driving component to drive the dispensing needle to move to the dispensing position and dispense adhesive, and fit the first center line and the second center line to obtain the coordinates of the placement position, control the second driving component to drive the heat sink picking component to place the heat sink to be assembled on the circuit board assembly to be assembled at the placement position.

[0009] In one embodiment, the first visual positioning component includes a first bracket and a first camera, the first bracket being disposed on the first driving component; the first camera is used to photograph the circuit board assembly to be assembled configured on the work platform, and the first camera is disposed on the first bracket to be able to move in the X and Y directions with the first dispensing mechanism; the second visual positioning component includes a second bracket and a second camera, the second bracket being disposed on the second driving component; the second camera is used to photograph the heat sink to be assembled; the second camera is disposed on the second bracket to be able to move in the X, Y, and Z directions with the heat sink pickup component.

[0010] In one embodiment, the automatic assembly device further includes a pressing mechanism disposed on the work platform; the pressing mechanism includes a pressure plate and a third driving component, the third driving component being used to drive the pressure plate to move and apply a pressing force to the heat sink to be assembled placed on the circuit board assembly to be assembled.

[0011] In one embodiment, the automatic assembly apparatus further includes a second dispensing mechanism for dispensing adhesive at a pre-curing position on the heat sink to be assembled; the second dispensing mechanism includes a pre-curing adhesive tube support and a fourth driving assembly, the pre-curing adhesive tube support being used to fix the pre-curing adhesive tube, and the fourth driving assembly being used to drive the pre-curing adhesive tube to move relative to the heat sink to be assembled and dispense adhesive.

[0012] In one embodiment, the automatic assembly device further includes a pre-curing mechanism disposed on the work platform; the pre-curing mechanism includes a curing lamp and a fifth driving component, the fifth driving component being used to drive the curing lamp to move relative to the heat sink to be assembled.

[0013] In one embodiment, the first drive component of the first dispensing mechanism, the second drive component of the heat sink pick-up and drop mechanism, and the fourth drive component of the second dispensing mechanism share the same X-axis and Y-axis drive components; the third drive component of the pressing mechanism and the fifth drive component of the pre-curing mechanism share the same X-axis drive component.

[0014] In one embodiment, the pressing mechanism and the pre-curing mechanism are arranged in the same direction.

[0015] In one embodiment, the first dispensing mechanism is disposed opposite to the heat sink pick-up and drop mechanism, and the heat sink pick-up and drop mechanism is disposed in the same direction as the second dispensing mechanism; the heat sink pick-up and drop mechanism and the second dispensing mechanism are disposed opposite to the pressing mechanism and the pre-curing mechanism.

[0016] An automated assembly apparatus includes a work platform, an overlapping section, and a pre-fixing section. The work platform is used to configure a circuit board assembly to be assembled. The overlapping section includes a first dispensing mechanism and a heat sink picking and placing mechanism. The first dispensing mechanism is used to dispense adhesive onto the circuit board assembly to be assembled, and the heat sink picking and placing mechanism is used to pick up the heat sink to be assembled and place it at the dispensing point on the circuit board assembly to be assembled, so that the heat sink to be assembled overlaps with the circuit board assembly to be assembled. The pre-fixing section includes a second dispensing mechanism and a pre-curing mechanism. The second dispensing mechanism is used to dispense adhesive at the edge of the overlapping point between the heat sink to be assembled and the circuit board assembly to be assembled, and the pre-curing mechanism is used to cure the adhesive dispensed by the second dispensing mechanism to pre-fix the heat sink to be assembled and the circuit board assembly to be assembled.

[0017] The aforementioned automatic assembly device is provided with an overlapping part for overlapping the heat sink to be assembled onto the circuit board assembly to be assembled, and a pre-fixing part for pre-fixing the heat sink to be assembled and the circuit board assembly to be assembled, which can reduce the risk of displacement during the turnover process.

[0018] In one embodiment, the overlap further includes a pressing mechanism for applying a pressing force to the heat sink to be assembled, which is placed on the circuit board assembly to be assembled.

[0019] In one embodiment, the first dispensing mechanism is disposed on the working platform. The first dispensing mechanism includes a first driving component and a tube support disposed on the first driving component. The tube support is used to fix the dispensing needle tube, and the first driving component is used to drive the dispensing needle tube to move.

[0020] The heat sink picking and placing mechanism is disposed on the working platform. The heat sink picking and placing mechanism includes a second driving component and a heat sink picking component disposed on the second driving component. The heat sink picking component is used to pick up or release the heat sink to be assembled, and the second driving component is used to drive the heat sink picking component to move.

[0021] The second dispensing mechanism includes a fourth driving component and a pre-cured adhesive tube support disposed on the fourth driving component. The pre-cured adhesive tube support is used to fix the pre-cured adhesive tube, and the fourth driving component is used to drive the pre-cured adhesive tube to move.

[0022] The pre-curing mechanism includes a fifth driving component and a curing lamp disposed on the fifth driving component, wherein the fifth driving component is used to drive the curing lamp to move;

[0023] The pressing mechanism includes a third driving component and a pressure plate disposed on the third driving component. The third driving component is used to drive the pressure plate to move and apply a pressing force to the heat sink to be assembled placed on the circuit board assembly to be assembled.

[0024] In one embodiment, the first drive component of the first dispensing mechanism, the second drive component of the heat sink pick-up and drop mechanism, and the fourth drive component of the second dispensing mechanism share the same X-axis and Y-axis drive components; the third drive component of the pressing mechanism and the fifth drive component of the pre-curing mechanism share the same X-axis drive component.

[0025] In one embodiment, the first dispensing mechanism is disposed opposite to the heat sink pick-up and drop mechanism, and the heat sink pick-up and drop mechanism is disposed in the same direction as the second dispensing mechanism; the pressing mechanism is disposed in the same direction as the pre-curing mechanism; the heat sink pick-up and drop mechanism and the second dispensing mechanism are disposed opposite to the pressing mechanism and the pre-curing mechanism.

[0026] An assembly method includes the following steps: providing a circuit board assembly to be assembled and a heat sink to be assembled; obtaining position information of the circuit board assembly to be assembled and identifying a first center line of the circuit board assembly to be assembled; obtaining a dispensing position based on the position information; dispensing adhesive at the dispensing position; identifying a second center line of the heat sink to be assembled; fitting the first center line and the second center line to obtain a placement position; and placing the heat sink to be assembled at the placement position.

[0027] The above assembly method, by fitting the center line of the circuit board assembly with the center line of the heat sink, can accurately lock the dispensing position and the placement position of the heat sink, thus improving assembly accuracy and efficiency.

[0028] An assembly method includes the following steps: providing a circuit board assembly to be assembled and a heat sink to be assembled; applying a first adhesive to the circuit board assembly; placing the heat sink to be assembled at the application point of the first adhesive, so that the heat sink overlaps with the circuit board assembly; applying a second adhesive to the edge of the overlap between the heat sink and the circuit board assembly; curing the second adhesive to pre-fix the circuit board assembly and the heat sink; and curing the first adhesive to fix the circuit board assembly and the heat sink.

[0029] The above assembly method pre-fixes the heat sink to be assembled, which can reduce the risk of displacement during turnover. Furthermore, this pre-fixing method does not require the use of fixing clamps, thus saving costs. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of an automatic assembly device according to an embodiment of the present invention;

[0031] Figure 2 for Figure 1 A top view of the automated assembly device shown;

[0032] Figure 3 This is a schematic diagram of the structure of an automatic assembly device (with the pre-curing mechanism and the pressing mechanism hidden) according to an embodiment of the present invention;

[0033] Figure 4 for Figure 3 The front view of the automated assembly device shown;

[0034] Figure 5 for Figure 4 A magnified view of part A in the middle;

[0035] Figure 6 for Figure 3 Rear view of the automated assembly device shown;

[0036] Figure 7 for Figure 6 A magnified view of part B in the middle section;

[0037] Figure 8 This is a schematic diagram of the structure of an automatic assembly device (with a first dispensing mechanism, a heat sink picking and placing mechanism, and a hidden second dispensing mechanism) according to an embodiment of the present invention;

[0038] Figure 9 This is a schematic diagram of the structure of the first dispensing mechanism and the first vision positioning component according to an embodiment of the present invention;

[0039] Figure 10 This is a schematic diagram of the structure of the heat sink picking and placing mechanism, the second vision positioning component, and the second dispensing mechanism according to an embodiment of the present invention;

[0040] Figure 11 This is a schematic diagram of the pressing mechanism and pre-curing mechanism according to an embodiment of the present invention;

[0041] Figure 12 This is a schematic diagram of the second dispensing mechanism according to an embodiment of the present invention from another perspective;

[0042] Figure 13 This is a partially enlarged schematic diagram of the heat sink placement mechanism placing the heat sink to be assembled in one embodiment of the present invention;

[0043] Reference numerals: 1. Automatic assembly device; 10. Working platform; 100. Material tray; 20. First dispensing mechanism; 200. Adhesive tube support; 210. Dispensing needle; 220. First drive assembly; 221. Support column; 222. First Y-axis; 223. First X-axis; 224. First Z-axis; 225. First Z-axis slide; 226. First Z-axis fixing plate; 30. Heat sink pick-up and drop mechanism; 300. Heat sink pickup assembly; 301. Finger cylinder; 302. Gripper; 303. Suction head fixing bracket; 310. Second drive assembly; 311. Angle fine-tuning turntable; 312. Placement cylinder; 40. First vision positioning assembly; 400. First camera; 410. First bracket; 420. Distance sensor; 430. First lens; 440. Focus fine-tuning assembly; 50 1. Second visual positioning component; 500. Second camera; 510. Second bracket; 520. Second lens; 60. Pressing mechanism; 600. Pressure plate; 601. Silicone pad; 610. Third drive component; 611. Third X-axis; 612. Third Z-axis; 613. Third Z-axis slide; 614. Downward cylinder; 615. Third Z-axis fixing plate; 620. Pressure sensor; 70. Second dispensing mechanism; 700. Pre-cured adhesive tube bracket; 710. Pre-cured adhesive tube; 720. Fourth drive component; 721. Fourth Z-axis; 722. Fourth Z-axis slide; 723. Pneumatic rotation device; 80. Pre-curing mechanism; 800. Curing lamp; 810. Fifth drive component; 811. Z-axis rodless cylinder; 812. Slide cylinder; 2. First centerline; 3. Second centerline. Detailed Implementation

[0044] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0045] In this invention, the X-axis, Y-axis, and Z-axis refer to directions in a three-dimensional coordinate system composed of the X, Y, and Z axes. The X-axis, Y-axis, and Z-axis are all perpendicular to each other.

[0046] To address the low efficiency and uncontrollable glue application techniques and amounts associated with manual gluing, this invention provides an automated assembly device 1 for the automatic assembly of optical communication modules, specifically for the automatic assembly of circuit board assemblies and heat sinks. The circuit board assembly (PCBA) includes a circuit board and various electronic components. Electrical signals are processed and transmitted through internal circuitry within the PCBA. The heat sink (typically a metal component) supports power-consuming and heat-generating chips, including optoelectronic chips, aiding in heat dissipation, maintaining the internal temperature of the optical communication module, reducing power consumption, and enhancing the overall strength of the circuit board assembly. The circuit board assembly, heat sink, and optoelectronic chips together form the core of the optical module, enabling the conversion and processing of photoelectric signals.

[0047] See Figure 1 , Figure 4 and Figure 6 An automatic assembly device 1 includes a work platform 10, a first dispensing mechanism 20, and a heat sink picking and placing mechanism 30. The first dispensing mechanism 20 is used to apply adhesive to a circuit board assembly to be assembled, which is disposed on the work platform 10. The heat sink picking and placing mechanism 30 is used to clamp or pick up the heat sink to be assembled so that the heat sink overlaps the adhesive on the circuit board assembly. (Continue to see...) Figure 1 , Figure 3 and Figure 9 In this example, the work platform 10 is used to configure the circuit board assembly to be assembled and the heat sink to be assembled. A first dispensing mechanism 20 is disposed on the work platform 10. The first dispensing mechanism 20 includes a dispensing tube support 200 for fixing the dispensing needle 210 and a first drive component 220 capable of driving the dispensing needle 210 relative to the circuit board assembly to the dispensing position and dispensing adhesive. (Continue to see...) Figure 6 , Figure 7 and Figure 10 The heat sink pick-up and place mechanism 30 is disposed on the work platform 10. The heat sink pick-up and place mechanism 30 includes a heat sink pick-up component 300 for picking up or releasing the heat sink to be assembled and a second drive component 310 capable of driving the heat sink pick-up component 300 to move relative to the circuit board assembly to be assembled to the placement position.

[0048] The aforementioned automatic assembly device 1 addresses the problems of low efficiency, uncontrollable dispensing techniques and glue volume, high precision requirements for fixtures, short fixture lifespan, and lack of dedicated equipment for assembling circuit board assemblies and heat sinks caused by manual gluing. It provides a device for assembling circuit board assemblies and heat sinks, including a first dispensing mechanism 20 and a heat sink handling mechanism 30 mounted on a work platform 10. The first dispensing mechanism 20 performs the dispensing step on the circuit board assembly to be assembled, which is completed by a first drive component 220. Compared to manual gluing, this method improves dispensing efficiency and makes the dispensing method and amount easier to control. The heat sink placement mechanism 30 is used to clamp or pick up the heat sink to be assembled, move it to the placement position, and overlap it with the adhesive on the circuit board assembly to be assembled, thus completing the placement step of the heat sink. This step is completed by the second drive component 310. Compared with the prior art method of using a jig to fix the heat sink and then assembling the heat sink with the circuit board assembly, the automatic assembly device of this embodiment no longer needs to use a jig to fix and position the heat sink, further improving the efficiency and accuracy of the assembly. In addition, the automatic assembly device 1 eliminates the need for manual gluing, reducing labor costs, and eliminates the need for jigs, further saving costs.

[0049] See also Figures 3-5 In one embodiment, the first drive assembly 220 includes a first X-axis drive assembly, a first Y-axis drive assembly, a first Z-axis drive assembly, and a dispensing drive assembly. Specifically, the first Y-axis drive assembly includes a support column 221 disposed on the work platform 10 and a first Y-axis 222 fixedly connected to the upper part of the support column 221; the first X-axis drive assembly includes a first X-axis 223 movable on the first Y-axis 222; the first Z-axis drive assembly includes a first Z-axis fixing plate 226 movable on the first X-axis 223, a first Z-axis 224 disposed on the first Z-axis fixing plate 226, and a first Z-axis slide 225 slidable on the first Z-axis 224, with the dispensing tube bracket 200 fixed to the first Z-axis slide 225. (See also...) Figure 10 In one embodiment, the second drive assembly 310 includes an angle fine-tuning turntable 311 mounted on the first Z-axis fixed plate 226 and a placement cylinder 312 connected to the angle fine-tuning turntable 311. It should be noted that in one embodiment, a swing cylinder (not shown in the figure) can also be fixed on the first Z-axis slide 225, and the hose support 200 can be fixed to the swing cylinder to adjust the dispensing angle. The first drive assembly 220 can also be configured in other ways besides the above-described configuration, as long as it can drive the hose support 200 to move relative to the work platform 10. Furthermore, the driving devices used for the relative movement between the first X-axis 223, the first Y-axis 222, and the first Z-axis fixed plate 226 include, but are not limited to, screw drives, hydraulic cylinder drives, and electric cylinder drives.

[0050] See Figure 1 , Figure 2 and Figure 9 In one embodiment, the circuit board assembly to be assembled is configured on the work platform 10 by fixing the circuit board assembly to be assembled in the tray 100. Further, in one embodiment, the tray 100 is movable relative to the work platform 10. In one embodiment, the dispensing needle 210 contains thermosetting adhesive, such as black glue. It should be noted that, in addition to the above configuration method, clamps, fixing fixtures, etc., can also be used to fix the tray 100 containing the circuit board assembly to be assembled, or the circuit board assembly to be assembled can be detachably fixed to the work platform 10. The method of configuring the circuit board assembly to be assembled on the work platform 10 is not limited, as long as the position of the circuit board assembly to be assembled remains fixed and does not shift during dispensing or placing the heat sink.

[0051] See also Figures 1 to 7 , Figure 9 , Figure 10 and Figure 13 In one embodiment, the automatic assembly device 1 further includes a first visual positioning component 40, a second visual positioning component 50, and a control device (not shown in the figure). The first visual positioning component 40 is used to acquire the position information of the circuit board assembly to be assembled and to identify the first center line 2 of the circuit board assembly to be assembled; the second visual positioning component 50 is used to identify the second center line 3 of the heat sink to be assembled. During operation, the second center line 3 of the heat sink to be assembled can be identified while the heat sink to be assembled is held in the heat sink pickup component 300.

[0052] The control device is electrically connected to the first dispensing mechanism 20, the heat sink placement and removal mechanism 30, the first vision positioning component 40, and the second vision positioning component 50, respectively, and controls the operation of these components according to preset instructions. The control device is used to obtain the coordinates of the dispensing position based on the position information of the circuit board assembly to be assembled. It should be noted that the position information can be the outer contour information of the circuit board assembly to be assembled or the coordinates of key points on it. The first vision positioning component 40 obtains the outer contour information or other key point coordinates of the circuit board assembly to be assembled placed on the work platform 10, and determines the coordinates of the dispensing position by combining the relative position of the circuit board assembly to be dispensed with the outer contour information or other key point coordinates. Besides the above method, other vision positioning methods can also be used to determine the dispensing position. The control device is used to control the first driving component 220 to drive the dispensing needle 210 to move relative to the circuit board assembly to the dispensing position and dispense adhesive; the control device is used to fit the first center line 2 and the second center line 3 to obtain the coordinates of the placement position. (See also...) Figure 13The control device controls the second drive component 310 to drive the heat sink pickup component 300, which holds the heat sink to be assembled, to move to the placement position, and controls the heat sink pickup component 300 to release the heat sink to be assembled, placing the heat sink to be assembled on the circuit board assembly to be assembled at the placement position. The specific type of control device is not limited, and it can be an embedded digital signal processor (DSP), microprocessor unit (MPU), application-specific integrated circuit (ASIC), or programmable logic device (PLD).

[0053] The aforementioned automatic assembly device 1 addresses two main issues. First, to overcome the lack of precision caused by relying on human eyes to locate the dispensing position on the heat sink to be assembled, the dispensing carrier is replaced with the circuit board assembly to be assembled. A first visual positioning component 40 is also included. During the dispensing process of the first dispensing mechanism 20 on the circuit board assembly to be assembled, which is positioned on the work platform 10, the first visual positioning component 40 acquires the position information of the circuit board assembly. Based on this position information, the dispensing position can be locked more accurately, improving assembly precision. Second, to address the lack of precision caused by relying on manual positioning of the relative positions of the heat sink and the circuit board assembly using a fixture, the automatic assembly device 1 includes a first visual positioning component 40 and a second visual positioning component 50. The first visual positioning component 40 identifies the first center line 2 of the circuit board assembly to be assembled, and the second visual positioning component 50 identifies the second center line 3 of the heat sink to be assembled. The control device fits the first center line 2 and the second center line 3 to obtain the placement coordinates, which can more accurately lock the placement position of the heat sink, further improving assembly precision.

[0054] See also Figures 4-7 , Figure 9 and Figure 10 In one embodiment, the first visual positioning component 40 includes a first camera 400 and a first bracket 410, the first bracket 410 being disposed on the first driving component 220; the first camera 400 is used to photograph the circuit board assembly to be assembled disposed on the work platform 10, and the first camera 400 is disposed on the first bracket 410 so that it can move in the Y and X directions with the first dispensing mechanism 20. The second visual positioning component 50 includes a second camera 500 and a second bracket 510; the second bracket 510 is disposed on the second driving component 310; the second camera 500 is used to photograph the heat sink to be assembled; the second camera 500 is disposed on the second bracket 510 so that it can move in the X, Y, and Z directions with the heat sink pickup component 300.

[0055] In the aforementioned automatic assembly device 1, to ensure a smoother assembly process, the first bracket 410 of the first visual positioning component 40 is mounted on the first drive component 220. When the first dispensing mechanism 20 moves in the Y and X directions, it drives the first camera 400 on the first bracket 410 to move. The first camera 400 takes pictures of the circuit board assembly to be assembled on the work platform 10. The first bracket 410 with the first camera 400 does not have independent Y and X direction drive devices, which is convenient for setup, simplifies the device structure, and is a more reasonable arrangement. This allows for dispensing adhesive onto the circuit board assembly after the first camera 400 takes pictures, further improving assembly efficiency. Similarly, the second bracket 510 of the second visual positioning component 50 is mounted on the second drive component 310. The second drive component 310 synchronously drives the heat sink pick-and-place mechanism 30 and the second visual positioning component 50, facilitating the placement of the heat sink after the second camera 50 takes pictures. (Continue to see...) Figure 5 and Figure 7 In one embodiment, the first camera 400 is specifically a CCD camera (charge coupled device). It should be noted that, in addition to using a CCD camera, other vision positioning cameras can also be used, as long as they can acquire image information of the object and transmit the data to the control device.

[0056] See also Figure 5 and Figure 7 Furthermore, in one embodiment, the first visual positioning component 40 further includes a first lens 430 disposed below the first camera 400, and the second visual positioning component 50 further includes a second lens 520 disposed below the second camera 500, to meet the information / image acquisition needs of the first camera 400 and the second camera 500; furthermore, a light source (not shown in the figure) may also be provided below the first lens 430 and the second lens 520 to adjust the ambient brightness, which helps the first camera 400 and the second camera 500 capture the object they are photographing.

[0057] See also Figure 4 and Figure 5In one embodiment, a distance sensor 420 is also provided on one side of the first support 410. The distance sensor 420 is used to measure the distance between itself and the circuit board assembly to be assembled, so as to obtain the Z-axis coordinate of the circuit board assembly to be assembled. The above-mentioned automatic assembly device 1 uses the first camera 400 of the first vision positioning component 40 to take pictures of the circuit board assembly to be assembled, so as to obtain the X-axis and Y-axis coordinates of the circuit board assembly to be assembled, and uses the distance sensor 420 to obtain the Z-axis coordinate of the circuit board assembly to be assembled. The X-axis, Y-axis and Z-axis coordinate data are transmitted to the control device. The control device is electrically connected to the first dispensing mechanism 20 and controls the first dispensing mechanism 20 to work according to the preset instructions. It should be noted that the distance sensor 420 can be set as a laser rangefinder, ultrasonic level meter or other device that can realize the distance measurement function.

[0058] Further, see also Figure 4 and Figure 5 In one embodiment, the first visual positioning component 40 further includes a focal length fine-tuning component 440 capable of adjusting the focal length of the first camera 400. Similarly, a device (not shown) for adjusting the focal length of the second camera 500 may also be provided in the second visual positioning component 50.

[0059] See Figure 7 and Figure 10 In one embodiment, the heat sink pickup component 300 is configured as a heat sink clamping component, which includes a finger cylinder 301 and a gripper 302 fixed to the finger cylinder 301. The finger cylinder 301 drives the gripper 302 to clamp or release the heat sink. The finger cylinder 301 is electrically connected to a control device, which controls its operation. In the above-mentioned automatic assembly device 1, after the control device obtains the placement position coordinates (X-axis, Y-axis) through the first visual positioning component 40 and the second visual positioning component 50, and controls the second drive component 310 to move the heat sink pickup component 300 to the placement position, the control device controls the finger cylinder 301 to actuate, so that the gripper 302 releases the heat sink to be assembled from the clamping state, and places the heat sink to be assembled in the accurate placement position.

[0060] It should be noted that, in addition to the aforementioned configuration of a finger cylinder 301 and gripper 302, the heat sink pickup assembly 300 can also be configured to use an electromagnetic suction head. Specifically, the heat sink pickup assembly 300 includes a suction head mounting bracket 303 and an electromagnetic suction head mounted on the suction head mounting bracket 303 for adsorbing the heat sink to be assembled. (See also...) Figure 7The suction head fixing bracket 303 can be integrally formed on the lower part of the second bracket 510 or detachably installed. When it is necessary to use the electromagnetic suction head to adsorb the heat sink to be assembled, the electromagnetic suction head can be placed on the suction head fixing bracket 303; otherwise, it can be removed (the figure shows this state). This setting method eliminates the need for a separate bracket to fix the electromagnetic suction head, making it easy for the heat sink pickup assembly 300 to switch between clamping and adsorption methods. In one embodiment, the suction head fixing bracket 303 is set as a U-shaped bracket, with both ends of the U-shaped bracket connected to the second bracket 510, and a square hole for fixing the electromagnetic suction head is opened through the middle of the U-shaped bracket.

[0061] See Figure 2 , Figure 8 and Figure 11 In one embodiment, the automatic assembly device 1 further includes a pressing mechanism 60 disposed on the work platform 10; the pressing mechanism 60 includes a pressure plate 600 and a third drive component 610 capable of driving the pressure plate 600 to move and applying a pressing force to the heat sink to be assembled placed on the circuit board assembly to be assembled. In order to make the bonding between the circuit board assembly to be assembled and the heat sink to be assembled more secure, the automatic assembly device 1 provides a pressing mechanism 60. The third drive component 610 drives the pressure plate 600 to move above the heat sink already placed on the upper part of the circuit board assembly, further driving the pressure plate 600 to press against the heat sink, so that the heat sink and the circuit board assembly are more evenly attached, avoiding problems such as the heat sink lifting.

[0062] See also Figure 8 and Figure 11 Specifically, in one embodiment, the third drive component 610 includes a third X-axis drive component disposed on the work platform 10 and a third Z-axis drive component connected to the third X-axis drive component. See also... Figure 7 and Figure 11 In one embodiment, the third X-axis drive assembly 610 includes a third X-axis 611 disposed on the work platform 10; the third Z-axis drive assembly includes a third Z-axis fixing plate 615 movable on the third X-axis 611, a third Z-axis 612 fixed on the third Z-axis fixing plate 615, and a third Z-axis slide 613 movable on the third Z-axis 612; a downward pressing cylinder 614 and a pressure plate 600 are disposed on the third Z-axis slide 613. (Continue to see...) Figure 11 In one embodiment, a silicone pad 601 or other soft material buffer pad is provided on the surface of the pressure plate 600 that contacts the heat sink, so that the pressure is applied more evenly and the heat sink is mounted more stably.

[0063] See also Figure 11In one embodiment, the pressing mechanism 60 further includes a pressure sensor 620 for detecting the parameters of the pressing force. By setting the pressure sensor 620, the pressing force can be controlled more accurately based on the information it collects, so that the pressing force is more stable, reducing the possibility of damage to the heat sink and circuit board assembly due to excessive pressing force, and reducing the possibility of unstable bonding of the heat sink and circuit board assembly due to insufficient pressing force.

[0064] See Figure 6 and Figure 7 In one embodiment, the automatic assembly device 1 further includes a second dispensing mechanism 70 for dispensing adhesive at a pre-curing position of the heat sink to be assembled. The second dispensing mechanism 70 includes a pre-curing adhesive tube support 700, a pre-curing adhesive tube 710 disposed on the pre-curing adhesive tube support 700, and a fourth driving component 720 capable of driving the pre-curing adhesive tube 710 to move relative to the heat sink to be assembled and dispensing adhesive. In the above-mentioned automatic assembly device 1, since the adhesive used by the first dispensing mechanism 20 is a thermosetting adhesive, it needs to be baked and cured after assembly. To prevent displacement during handling, the second dispensing mechanism 70 is provided, using adhesive pre-curing. After the pressing mechanism 60 presses against the heat sink, the fourth driving component 720 drives the pre-curing adhesive tube support 700 to move the pre-curing adhesive tube 710, dispensing adhesive at the pre-curing position for pre-curing treatment, thereby pre-fixing the circuit board assembly and the heat sink and reducing the risk of displacement during handling. The pre-curing position includes, but is not limited to, the edge positions on both sides or at the ends where the heat sink overlaps with the circuit board assembly. When the second dispensing mechanism 70 is working, the pre-fixing adhesive tube 710 contains UV adhesive. It should be noted that, in addition to UV adhesive, other types of adhesives can also be used for pre-fixing circuit board assemblies to heat sinks.

[0065] See Figure 10 In one embodiment, the fourth drive assembly 720 includes a fourth Z-axis 721 disposed on the first Z-axis fixing plate 226, a fourth Z-axis slide 722 movable on the fourth Z-axis 721, a pneumatic rotating device 723 disposed on the fourth Z-axis slide 722, and a pre-cured rubber tube bracket 700 disposed on the pneumatic rotating device 723.

[0066] See also Figure 1 , Figure 2 , Figure 8 and Figure 11In one embodiment, the automatic assembly device 1 further includes a pre-curing mechanism 80 disposed on the work platform 10; the pre-curing mechanism 80 includes a curing lamp 800 and a fifth drive component 810, the fifth drive component 810 being used to drive the curing lamp 800 to move relative to the heat sink to be assembled. The automatic assembly device 1 described above, with the pre-curing mechanism 80, uses the curing lamp 800 to irradiate the edge of the overlap between the heat sink, which is coated with pre-cured adhesive, and the circuit board assembly, thereby performing pre-curing. This replaces the fixing clamps used in manual assembly in the prior art, further reducing the risk of displacement during turnover, and eliminating the need for fixing clamps, reducing clamp consumption and saving costs. In one embodiment, when UV adhesive is used for pre-curing, the curing lamp 800 is a UV curing lamp. It should be noted that if the adhesive applied by the second dispensing mechanism 70 does not require curing by the curing lamp 800, the pre-curing mechanism 80 can also be set as other mechanisms to accelerate or promote adhesive curing.

[0067] See also Figure 1 , Figure 2 , Figure 8 and Figure 11 In one embodiment, the fifth drive assembly 810 includes a Z-axis rodless cylinder 811 disposed on the third Z-axis fixed plate 615, and a slide cylinder 812 connected to the moving end of the Z-axis rodless cylinder 811. A curing lamp 800 is disposed on the slide cylinder 812.

[0068] See Figures 1-12 In one embodiment, the first drive component 220 of the first dispensing mechanism 20, the second drive component 310 of the heat sink pick-up and drop mechanism 30, and the fourth drive component 720 of the second dispensing mechanism 70 share the same X-axis and Y-axis drive components.

[0069] See also Figure 5 and Figure 6 The first dispensing mechanism 20 is positioned opposite to the heat sink pick-up and drop-off mechanism 30, while the heat sink pick-up and drop-off mechanism 30 is positioned in the same direction as the second dispensing mechanism 70; see continue. Figure 8 The third drive assembly 610 of the pressing mechanism 60 and the fifth drive assembly 810 of the pre-curing mechanism 80 share an X-axis drive assembly; the pressing mechanism 60 and the pre-curing mechanism 80 are arranged in the same direction; the heat sink loading and unloading mechanism 30 and the second dispensing mechanism 70 are arranged opposite to the pressing mechanism 60 and the pre-curing mechanism 80. It should be noted that... (See also...) Figures 2-8The first dispensing mechanism 20 and the heat sink pick-up and place mechanism 30 are arranged opposite to each other, specifically meaning that the dispensing needle 210 of the first dispensing mechanism 20 and the heat sink pickup component 300 of the heat sink pick-up and place mechanism 300 are located on different sides of the first X-axis 223. The heat sink pick-up and place mechanism 30 and the second dispensing mechanism 70 are arranged in the same direction, specifically meaning that the heat sink pickup component 300 of the heat sink pick-up and place mechanism 30 and the pre-cured adhesive tube support 700 of the second dispensing mechanism 70 are located on the same side of the first X-axis 223. The pressing mechanism 60 and the pre-curing mechanism 80 are arranged in the same direction, specifically meaning that the pressure plate 600 of the pressing mechanism 60 and the curing lamp 800 of the pre-curing mechanism 80 are located on the same side of the third X-axis 611. The heat sink pick-up and drop mechanism 30 and the second dispensing mechanism 70 are arranged opposite to the pressing mechanism 60 and the pre-curing mechanism 80. Specifically, the heat sink pickup component 300 of the heat sink pick-up and drop mechanism 30 and the pre-curing tube support 700 of the second dispensing mechanism 70 are both located on the side of the first X-axis 223 that is relatively close to the third X-axis 611, and the pressure plate 600 of the pressing mechanism 60 and the curing lamp 800 of the pre-curing mechanism 80 are both located on the side of the third X-axis 611 that is relatively close to the first X-axis 223.

[0070] In order to make the assembly process smoother and avoid mutual interference between mechanisms, the above-mentioned automatic assembly device 1 integrates the first dispensing mechanism 20, the heat sink picking and placing mechanism 30 and the second dispensing mechanism 70 into an X-axis and Y-axis drive system, and integrates the pressing mechanism 60 and the pre-curing mechanism 80 into an X-axis drive system. The directions of each mechanism are reasonably set, and the two systems can work synchronously without affecting or interfering with each other, which further improves work efficiency.

[0071] See also Figures 1-13 Another embodiment of the present invention provides an automatic assembly device 1, including a working platform 10, an overlapping portion (not shown in the figure), and a pre-fixing portion (not shown in the figure); wherein, the working platform 10 is used to configure the circuit board assembly to be assembled; the overlapping portion includes a first dispensing mechanism 20 and a heat sink picking and placing mechanism 30, the first dispensing mechanism 20 is used to dispense adhesive on the circuit board assembly to be assembled, and the heat sink picking and placing mechanism 30 is used to pick up the heat sink to be assembled and place it on the dispensing portion of the circuit board assembly to be assembled, so that the heat sink to be assembled overlaps with the circuit board assembly to be assembled; the pre-fixing portion includes a second dispensing mechanism 70 and a pre-curing mechanism 80, the second dispensing mechanism 70 is used to dispense adhesive at the edge of the overlapping portion of the heat sink to be assembled and the circuit board assembly to be assembled, and the pre-curing mechanism 80 is used to cure the adhesive dispensed by the second dispensing mechanism to pre-fix the heat sink to be assembled and the circuit board assembly to be assembled.

[0072] The aforementioned automatic assembly device 1 addresses the issues of low efficiency and uncontrollable dispensing techniques and glue volume in manual gluing by providing an overlapping section to attach the heat sink to the circuit board assembly. Furthermore, to reduce the risk of displacement during handling, a pre-fixing section is provided to pre-secure the heat sink and the circuit board assembly.

[0073] In one embodiment, the overlap portion further includes a pressing mechanism 60, which is used to apply a pressing force to the heat sink to be assembled placed on the circuit board assembly to prevent the heat sink from lifting.

[0074] It should be noted that the working platform 10, the first dispensing mechanism 20, the heat sink picking and placing mechanism 30, the pressing mechanism 60, the second dispensing mechanism 70 and the pre-curing mechanism 80 in this embodiment are set up in the same way as in the previous embodiments, and the specific structure will not be described in detail here.

[0075] An embodiment of the present invention also proposes an assembly method for assembling a circuit board assembly and a heat sink, including a step of providing a circuit board assembly and a heat sink to be assembled, a dispensing position identification step, a dispensing step, and a step of placing the heat sink to be assembled. The specific steps include: providing the circuit board assembly and the heat sink to be assembled; performing a first visual positioning on the circuit board assembly to be assembled, obtaining the position information of the circuit board assembly and identifying a first center line of the circuit board assembly, and obtaining a dispensing position based on the position information of the circuit board assembly; dispensing adhesive at the dispensing position; performing a second visual positioning on the heat sink to be assembled, identifying a second center line of the heat sink, fitting the first center line and the second center line to obtain a placement position; and placing the heat sink to be assembled at the placement position.

[0076] To avoid the problems that may occur in the existing technology where black glue is applied to the heat sink and then fixed to the fixture during assembly with the circuit board assembly, resulting in inaccurate positioning and glue misalignment, which could affect the various electronic components integrated on the circuit board assembly, the above assembly method changes the glue dispensing carrier. The heat sink used in manual gluing methods is replaced with the circuit board assembly. The glue dispensing positioning and steps are all based on the circuit board assembly, allowing for accurate avoidance of electronic components. After the glue dispensing step is completed, the heat sink placement step is performed, reducing the possibility of the black glue affecting the electronic components. Furthermore, by fitting the centerline of the circuit board assembly with the centerline of the heat sink, the glue dispensing position and the placement position of the heat sink can be accurately locked, improving assembly accuracy and efficiency. It should be noted that the above assembly method can be completed using the aforementioned automatic assembly device 1. Specifically, the glue dispensing step is completed by the aforementioned first glue dispensing mechanism 20, the first visual positioning in the step of placing the heat sink to be assembled is completed by the aforementioned first visual positioning component 40, and the second visual positioning is completed by the aforementioned second visual positioning component 50. The specific working process will not be elaborated here.

[0077] Another embodiment of the present invention provides an assembly method, which includes a step of configuring a circuit board assembly to be assembled and a heat sink to be assembled, a dispensing step, a step of placing the heat sink to be assembled, a pressing step of pressing down the heat sink, a pre-curing dispensing step, and a pre-curing step; the specific steps include: providing a circuit board assembly to be assembled and a heat sink to be assembled; applying a first adhesive to the circuit board assembly to be assembled; placing the heat sink to be assembled at the dispensing point where the first adhesive has been applied, so that the heat sink overlaps with the circuit board assembly; applying a second adhesive at the edge of the overlap between the heat sink and the circuit board assembly; curing the second adhesive to pre-fix the circuit board assembly to be assembled and the heat sink to be assembled; and curing the first adhesive to fix the circuit board assembly to be assembled and the heat sink to be assembled.

[0078] The above assembly method pre-fixes the heat sink to be assembled by applying a second adhesive to the edge of the overlap between the heat sink and the circuit board assembly, replacing the high-precision fixing fixtures used in manual assembly. This reduces the risk of displacement during turnover, eliminates the need for fixing fixtures, and saves costs.

[0079] To further improve assembly efficiency, in one embodiment, the specific steps of providing the circuit board assembly to be assembled and the heat sink to be assembled include: placing the heat sink to be assembled in a preset bearing position and pushing the carrier loaded with the circuit board assembly to be assembled to a suitable position. After the operation is completed, the carrier is moved to the unloading position, and this step is repeated to load materials according to a controllable cycle. It should be noted that the movement of the carrier is driven by, but is not limited to, a loading cylinder. In addition, the loading method of the circuit board assembly to be assembled on the carrier includes, but is not limited to, embedding, clamping, and locking with locking components. The above assembly method automatically loads materials according to a controllable cycle, making the loading process and the position of the circuit board assembly to be assembled controllable, thereby ensuring accuracy and processing efficiency. Moreover, it has strong compatibility with carriers (trays) and is suitable for carriers (trays) of various models and sizes.

[0080] As an example, the specific steps of curing the first adhesive to fix the circuit board assembly and the heat sink to be assembled include: transferring the circuit board assembly and the heat sink to an oven for heat curing to cure the first adhesive at high temperature, thereby fixing the circuit board assembly and the heat sink together.

[0081] Specifically, in one embodiment, the step of applying a second adhesive to the edge of the overlap between the heat sink and the circuit board assembly includes: applying pre-curing UV adhesive to the edge of the overlap of the heat sink to be assembled; further, the step of curing the second adhesive to pre-fix the circuit board assembly and the heat sink to be assembled includes: curing the pre-curing UV adhesive using a UV curing lamp to pre-fix the heat sink and the circuit board assembly. It should be noted that if the applied second adhesive does not require curing by a curing lamp, the pre-curing mechanism can also be set to other suitable mechanisms to accelerate or promote adhesive curing.

[0082] It should be noted that the above assembly method can be completed by the above-mentioned automatic assembly device 1. Specifically, the dispensing step, the heat sink placement step, the heat sink pressing step, the pre-curing dispensing step, and the pre-curing step can be completed by the first dispensing mechanism 20, the heat sink picking and placing mechanism 30, the pressing mechanism 60, the second dispensing mechanism 70, and the pre-curing mechanism 80, respectively. The specific working process will not be described in detail here.

[0083] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0084] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0085] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0086] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0087] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0088] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0089] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. An automatic assembly apparatus for assembling circuit board assemblies and heat sinks, characterized in that, include: A work platform for configuring circuit board assemblies to be assembled; A first dispensing mechanism is disposed on the working platform. The first dispensing mechanism includes a glue tube support and a first driving component. The glue tube support is used to fix the dispensing needle tube, and the first driving component is used to drive the dispensing needle tube to move relative to the circuit board assembly to be assembled to the dispensing position and dispensing glue. A heat sink pick-up and place mechanism is provided on the working platform. The heat sink pick-up and place mechanism includes a heat sink picking component and a second driving component. The heat sink picking component is used to pick up or release the heat sink to be assembled, and the second driving component is used to drive the heat sink picking component to move relative to the circuit board assembly to the placement position. The automatic assembly device further includes a second dispensing mechanism for dispensing adhesive at the pre-curing position of the heat sink to be assembled; the second dispensing mechanism includes a pre-curing adhesive tube support and a fourth driving component, the pre-curing adhesive tube support is used to fix the pre-curing adhesive tube, and the fourth driving component is used to drive the pre-curing adhesive tube to move relative to the heat sink to be assembled and dispense adhesive. The automatic assembly device also includes a pre-curing mechanism disposed on the working platform; the pre-curing mechanism includes a curing lamp and a fifth driving component, the fifth driving component being used to drive the curing lamp to move relative to the heat sink to be assembled; The automatic assembly device further includes a pressing mechanism disposed on the working platform; the pressing mechanism includes a pressure plate and a third driving component, the third driving component being used to drive the pressure plate to move and apply a pressing force to the heat sink to be assembled placed on the circuit board assembly to be assembled; The first drive component of the first dispensing mechanism, the second drive component of the heat sink pick-up and drop mechanism, and the fourth drive component of the second dispensing mechanism share the same X-axis and Y-axis drive components. The third drive component of the pressing mechanism and the fifth drive component of the pre-curing mechanism share the same X-axis drive component; The pressing mechanism and the pre-curing mechanism are arranged in the same direction.

2. The automatic assembly device according to claim 1, characterized in that, The automated assembly device also includes: A first visual positioning component is used to acquire the position information of the circuit board assembly to be assembled and to identify the first center line of the circuit board assembly to be assembled. A second visual positioning component is used to identify the second centerline of the heat sink to be assembled; The control device is electrically connected to the first dispensing mechanism, the heat sink picking and placing mechanism, the first vision positioning component, and the second vision positioning component, respectively. The control device is used to obtain the coordinates of the dispensing position based on the position information, and control the first driving component to drive the dispensing needle to move to the dispensing position and dispense glue. The control device is used to fit the first center line and the second center line to obtain the coordinates of the placement position, and control the second driving component to drive the heat sink pickup component to place the heat sink to be assembled on the circuit board assembly at the placement position.

3. The automatic assembly device according to claim 2, characterized in that, The first visual positioning component includes: The first bracket is disposed on the first drive component; A first camera is used to take pictures of the circuit board assembly to be assembled, which is configured on the work platform. The first camera is set on the first bracket so that it can move in the X and Y directions with the first dispensing mechanism. The second visual positioning component includes: The second bracket is disposed on the second drive assembly; The second camera is used to photograph the heat sink to be assembled; the second camera is mounted on the second bracket so that it can move in the X, Y and Z directions along with the heat sink pickup assembly.

4. The automatic assembly device according to claim 1, characterized in that, The first dispensing mechanism is arranged opposite to the heat sink pick-up and drop-off mechanism, and the heat sink pick-up and drop-off mechanism is arranged in the same direction as the second dispensing mechanism; the heat sink pick-up and drop-off mechanism and the second dispensing mechanism are arranged opposite to the pressing mechanism and the pre-curing mechanism.

5. An automatic assembly device, characterized in that, include: A work platform for configuring circuit board assemblies to be assembled; The overlapping part includes a first dispensing mechanism and a heat sink picking and placing mechanism. The first dispensing mechanism is used to dispense thermosetting adhesive on the circuit board assembly to be assembled, and the heat sink picking and placing mechanism is used to pick up the heat sink to be assembled and place it on the dispensing point on the circuit board assembly to be assembled, so that the heat sink to be assembled overlaps with the circuit board assembly to be assembled. The pre-fixing part includes a second dispensing mechanism and a pre-curing mechanism. The second dispensing mechanism is used to dispense adhesive at the edge of the overlap between the heat sink to be assembled and the circuit board assembly to be assembled. The pre-curing mechanism is used to cure the adhesive dispensed by the second dispensing mechanism to pre-fix the heat sink to be assembled and the circuit board assembly to be assembled. The overlapping portion further includes a pressing mechanism, which is used to apply a pressing force to the heat sink to be assembled placed on the circuit board assembly to be assembled; The pressing mechanism includes a pressure plate and a third driving component. The third driving component is used to drive the pressure plate to move and apply a pressing force to the heat sink to be assembled, which is placed on the circuit board assembly to be assembled. The first drive component of the first dispensing mechanism, the second drive component of the heat sink pick-up and drop mechanism, and the fourth drive component of the second dispensing mechanism share the same X-axis and Y-axis drive components. The third drive component of the pressing mechanism and the fifth drive component of the pre-curing mechanism share the same X-axis drive component; The pressing mechanism and the pre-curing mechanism are arranged in the same direction.

6. The automatic assembly device according to claim 5, characterized in that, The first dispensing mechanism is disposed on the working platform. The first dispensing mechanism includes a first driving component and a glue tube bracket disposed on the first driving component. The glue tube bracket is used to fix the dispensing needle tube, and the first driving component is used to drive the dispensing needle tube to move. The heat sink picking and placing mechanism is disposed on the working platform. The heat sink picking and placing mechanism includes a second driving component and a heat sink picking component disposed on the second driving component. The heat sink picking component is used to pick up or release the heat sink to be assembled, and the second driving component is used to drive the heat sink picking component to move. The second dispensing mechanism includes a fourth driving component and a pre-cured adhesive tube support disposed on the fourth driving component. The pre-cured adhesive tube support is used to fix the pre-cured adhesive tube, and the fourth driving component is used to drive the pre-cured adhesive tube to move. The pre-curing mechanism includes a fifth driving component and a curing lamp disposed on the fifth driving component, wherein the fifth driving component is used to drive the curing lamp to move; The pressing mechanism includes a third driving component and a pressure plate disposed on the third driving component. The third driving component is used to drive the pressure plate to move and apply a pressing force to the heat sink to be assembled placed on the circuit board assembly to be assembled.

7. The automatic assembly device according to claim 6, characterized in that, The first drive component of the first dispensing mechanism, the second drive component of the heat sink pick-up and drop mechanism, and the fourth drive component of the second dispensing mechanism share the same X-axis and Y-axis drive components; the third drive component of the pressing mechanism and the fifth drive component of the pre-curing mechanism share the same X-axis drive component.

8. The automatic assembly device according to claim 7, characterized in that, The first dispensing mechanism is arranged opposite to the heat sink pick-up and drop-off mechanism, and the heat sink pick-up and drop-off mechanism is arranged in the same direction as the second dispensing mechanism; the pressing mechanism is arranged in the same direction as the pre-curing mechanism; the heat sink pick-up and drop-off mechanism and the second dispensing mechanism are arranged opposite to the pressing mechanism and the pre-curing mechanism.

9. An assembly method, characterized in that, The application to the automated assembly apparatus as described in claim 1 or 5 includes the following steps: Provide circuit board assemblies and heat sinks to be assembled; The first visual positioning component is used to obtain the position information of the circuit board assembly to be assembled and to identify the first center line of the circuit board assembly to be assembled. The dispensing position is obtained based on the location information; Apply adhesive at the designated dispensing location; The second centerline of the heat sink to be assembled is identified using a second visual positioning component. The placement position is obtained by fitting the first center line and the second center line using a control device; The heat sink to be assembled is placed in the designated placement position.

10. An assembly method, characterized in that, The application to the automated assembly apparatus as described in claim 1 or 5 includes the following steps: A circuit board assembly to be assembled and a heat sink to be assembled are provided, the circuit board assembly to be assembled being fixed to a worktable; Apply a first adhesive to the circuit board assembly to be assembled; The heat sink to be assembled is placed at the dispensing point where the first adhesive liquid is applied, so that the heat sink overlaps with the circuit board assembly. Apply a second layer of adhesive to the edge of the overlap between the heat sink and the circuit board assembly; The second adhesive is cured to pre-fix the circuit board assembly to be assembled and the heat sink to be assembled. The first adhesive is cured to fix the circuit board assembly to be assembled and the heat sink to be assembled.

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