An ultrasmooth device and a processing method thereof
By bonding the superlubricating plate array with the conductive connector, the problem of the inability to conduct electricity in large-scale superlubricating devices was solved, enabling large-scale fabrication and electrical connection, and improving the assembly efficiency and performance of superlubricating devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-12-21
- Publication Date
- 2026-03-17
AI Technical Summary
In the existing technology, large-scale superlubricated devices cannot achieve conductive connections with other devices, mainly because the adhesive is a non-conductive material.
By forming an array of superslippers on a transition substrate and bonding them with conductive connectors, the conductive connectors are softened at high temperatures to connect the superslippers, thus forming a conductive path.
Electrical connections between superlubricating devices and other devices were achieved, and the assembly difficulties caused by the uneven height of the superlubricating sheets were solved, enabling the large-scale fabrication of large-size superlubricating devices.
Smart Images
Figure CN115959618B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of structural superlubricity, and in particular to a superlubricity device and its fabrication method. Background Technology
[0002] Structural superlubricity refers to the phenomenon where friction and wear are almost zero when two atomically smooth and incommensurate van der Waals solid surfaces (such as graphene, molybdenum disulfide, and other two-dimensional material surfaces) slide relative to each other.
[0003] Superlubricants are typically around 10 μm in size. To combine superlubricants with structural superlubricants, larger-scale structural superlubricants are needed. Currently, in fabricating large-scale structural superlubricants, superlubricants of different heights are first transferred to the same flat substrate. Then, an adhesive is coated on the surface of the superlubricants. The adhesive will have gaps between adjacent superlubricants, but it will not penetrate between the superlubricant and the substrate. After the adhesive cures, all the superlubricants are connected together to form a large-scale structural superlubricant. However, since the adhesive is generally a non-conductive material, the superlubricant cannot achieve conductive connections with other devices.
[0004] Therefore, how to solve the above-mentioned technical problems should be a key focus for those skilled in the art. Summary of the Invention
[0005] The purpose of this application is to provide a superlubricating device and a method for processing the same, so that the superlubricating device can be electrically connected to other devices.
[0006] To solve the above-mentioned technical problems, this application provides a method for processing superlubricating devices, comprising:
[0007] Obtain a conductive connector;
[0008] At least two superslippers are transferred to the upper surface of a transition substrate to form a superslipper array on the transition substrate;
[0009] A transition substrate with the superslip array is bonded to the conductive connector, the conductive connector is softened, and the superslip is connected to the softened conductive connector.
[0010] Remove the transition substrate to obtain the super-slippery device.
[0011] Optionally, bonding the transition substrate with the superslipper array to the conductive interconnect includes:
[0012] The transition substrate with the superslipper array is flip-chipped so that the superslipper array is positioned above the conductive connector and bonded to the conductive connector.
[0013] Optionally, bonding the transition substrate with the superslipper array to the conductive interconnect includes:
[0014] The conductive connector is flipped so that it is positioned above the superslipper array and bonded to the superslipper array.
[0015] Optionally, before flip-chip bonding the transition substrate with the superslipper array, such that the superslipper array is positioned above the conductive interconnect and bonded to the conductive interconnect, the method further includes:
[0016] Alignment marks are provided on the edges of the superslipper array on the transition substrate and / or on the edges of the conductive connectors on the substrate;
[0017] Accordingly, flip-chip bonding the transition substrate with the superslipper array to the conductive interconnect includes:
[0018] Using the alignment marks, the transition substrate with the superslip array is flip-chipped, so that the superslip array is bonded to the conductive connector.
[0019] Optionally, obtaining a conductive connector includes:
[0020] A conductive block array is formed on a substrate, the conductive block array comprising at least two conductive blocks, the arrangement of the conductive block array being the same as that of the superslipper array.
[0021] Optionally, obtaining a conductive connector includes:
[0022] A single conductive layer is formed on the substrate.
[0023] Optionally, forming a one-piece conductive layer on the substrate includes:
[0024] A first patterned photoresist is fabricated on the substrate;
[0025] A conductive film layer is formed on the substrate;
[0026] The first patterned photoresist and the conductive film layer located on the first patterned photoresist are stripped off to form the one-piece conductive layer on the substrate, wherein the area of the one-piece conductive layer is smaller than the area of the substrate.
[0027] Optionally, forming a one-piece conductive layer on the substrate includes:
[0028] A film is deposited on the substrate to form a one-piece conductive layer, the area of which is equal to the area of the substrate.
[0029] Optionally, forming an array of conductive blocks on the substrate includes:
[0030] A second patterned photoresist is fabricated on the substrate;
[0031] A conductive film layer is formed on the substrate;
[0032] The second patterned photoresist and the conductive film layer located on the second patterned photoresist are stripped to form the conductive block array on the substrate.
[0033] Optionally, forming an array of conductive blocks on the substrate includes:
[0034] A third patterned photoresist is fabricated on the substrate;
[0035] A metal layer is formed on the substrate;
[0036] The third patterned photoresist and the metal layer located on the third patterned photoresist are stripped to form a one-piece metal layer on the substrate;
[0037] A second patterned photoresist is fabricated on a substrate with a one-piece metal layer;
[0038] A conductive film layer is formed on the substrate;
[0039] The second patterned photoresist and the conductive film layer located on the second patterned photoresist are stripped to form a conductive block array on the one-piece metal layer.
[0040] Optionally, the cross-sectional area of the conductive block is less than or equal to the cross-sectional area of the corresponding superslipper.
[0041] Optional, also includes:
[0042] A limiting protrusion is provided on the side of the conductive block. The height of the limiting protrusion is lower than the height of the conductive block, and all the limiting protrusions are of equal height.
[0043] Optionally, the height of the limiting protrusion is between 2μm and 3μm.
[0044] This application also provides a superlubricating device obtained by any of the superlubricating device processing methods described above, comprising:
[0045] Conductive connector;
[0046] An array of superslippers connected to the upper surface of the conductive connector, the array comprising at least two superslippers.
[0047] Optionally, when the conductive connector is a conductive block array, and the conductive block array includes at least two conductive blocks, the cross-section of the conductive block is circular.
[0048] The present application provides a method for processing a superslippery device, comprising: obtaining a conductive connector; transferring at least two superslippers to the upper surface of a transition substrate to form a superslipper array on the transition substrate; bonding the transition substrate with the superslipper array to the conductive connector, softening the conductive connector, and connecting the superslippers to the softened conductive connector; and removing the transition substrate to obtain a superslippery device.
[0049] As can be seen, the processing method in this application bonds a transition substrate with superslipper to a conductive interconnect. During bonding, the conductive interconnect melts and softens at high temperature, thus connecting the superslipper to the conductive interconnect. This effectively solves the assembly difficulties caused by the uneven height of the superslipper. Simultaneously, the conductive interconnect enables the superslipper to achieve electrical connections with other devices. Utilizing bonding in the processing allows for the large-scale fabrication of superslippery devices, and multiple superslipperies can be assembled together to obtain large-size superslippery devices.
[0050] In addition, this application also provides a superlubricating device with the above-mentioned advantages. Attached Figure Description
[0051] To more clearly illustrate the technical solutions of the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0052] Figure 1 This is a flowchart of a superlubricating device processing method provided in an embodiment of this application;
[0053] Figure 2 This is a schematic diagram of the transfer of the superslipper onto the transition substrate;
[0054] Figure 3 This is a flowchart of another superlubricating device processing method provided in an embodiment of this application;
[0055] Figures 4 to 9 This is a process flow diagram of a superlubricating device provided in an embodiment of this application;
[0056] Figure 10 This is a flowchart of another superlubricating device processing method provided in an embodiment of this application;
[0057] Figures 11 to 20 This is a process flow diagram of a superlubricating device provided in an embodiment of this application;
[0058] Figure 21 This is a flowchart of another superlubricating device processing method provided in an embodiment of this application;
[0059] Figures 22 to 27 This is a process flow diagram of a superlubricating device provided in an embodiment of this application;
[0060] Figure 28 This is a flowchart of another superlubricating device processing method provided in an embodiment of this application;
[0061] Figures 29 to 32 This is a process flow diagram of a superlubricating device provided in an embodiment of this application. Detailed Implementation
[0062] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some embodiments of the present application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0063] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.
[0064] As described in the background section, when processing large-scale structural superlubricating devices, multiple superlubricating sheets are bonded together using adhesives. However, since adhesives are generally non-conductive materials, superlubricating devices cannot achieve conductive connections with other devices.
[0065] In view of this, this application provides a method for processing superlubricating devices, please refer to... Figure 1 The method includes:
[0066] Step S101: Obtain a conductive connector.
[0067] Optionally, as one possible implementation, obtaining a conductive connector includes: forming a conductive block array on a substrate, the conductive block array comprising at least two conductive blocks, the arrangement of the conductive block array being the same as that of the superslipper array. However, this application does not limit this to the present invention. As another possible implementation, obtaining a conductive connector includes: forming a one-piece conductive layer on a substrate. Wherein, a one-piece conductive layer means that the conductive layer exists in the form of a single piece.
[0068] In other words, the conductive connector can be either a single conductive layer or an array of conductive blocks. Different conductive connectors are prepared in different ways, and the specific manufacturing methods will be described below.
[0069] Step S102: Transfer at least two superslippers to the upper surface of the transition substrate to form a superslipper array on the transition substrate.
[0070] Superslippers are fabricated from superslip islands, and the superslippers transferred from the superslip islands may exhibit significant height differences. For example, the superslippers 21 in the superslipper array 2 on the transition substrate 1 have height differences. Figure 2 As shown, the thickness of the superslipper 21 is between 0.5 and 1.8 μm, and the maximum height difference can reach 0.8 μm.
[0071] Because of the small size of the superslipper, positioning by using the center point of the superslipper during transfer can increase positioning accuracy.
[0072] The superslipper array can be a regular M×N array, where at least one of M and N is greater than 1, and M and N can be equal or unequal; the superslipper array can also be an irregular array, for example, the superslipper array can be arranged in circular, elliptical, or irregular polygonal shapes. This application does not limit the form of the superslipper array, but rather allows for selection based on the specific circumstances.
[0073] Step S103: Bond the transition substrate with the superslip array to the conductive connector, soften the conductive connector, and connect the superslip to the softened conductive connector.
[0074] The materials for conductive connectors include, but are not limited to, metals or alloys, with melting points generally below 300 degrees Celsius. Preferably, the conductive connector material can be metals such as tin, silver, lead, and indium, as well as alloys such as gold-tin alloys, silver-copper-tin alloys, and indium-tin alloys.
[0075] During bonding, the conductive connector softens as the temperature rises, but does not completely melt, thus bonding the superslipper array with the conductive connector and achieving bonding between the superslipper and the conductive connector.
[0076] Although the heights of the superslippers vary, the conductive connectors soften during bonding, allowing for a greater reduction in the thickness of the conductive connector area corresponding to taller superslippers and a smaller reduction in the thickness of the conductive connector area corresponding to shorter superslippers. This ensures that the surfaces of each superslipper not in contact with the conductive connector maintain a consistent height, effectively solving the assembly difficulties caused by uneven superslipper heights.
[0077] The superslipper and conductive connector can be aligned using an optical microscope, and then bonded using a pick-and-place machine. The conductive connector can be fabricated using micromachining techniques.
[0078] As one possible implementation, bonding a transition substrate with a superslipper array to a conductive connector includes: flipping the conductive connector so that the connector is positioned above the superslipper array and bonding it to the superslipper array.
[0079] The conductive interconnects are located above the superslipper array. Because the conductive interconnects melt and soften during bonding, they can easily enter the gap between the superslippers and the transition substrate. To avoid this problem, a sacrificial layer can be placed between the superslippers, and then removed after bonding is complete.
[0080] As another possible implementation, bonding the transition substrate with the superslip array to the conductive connector includes: flipping the transition substrate with the superslip array so that the superslip array is above the conductive connector and bonding it to the conductive connector.
[0081] The conductive connector is located beneath the superlubricant, so even if it melts and softens during bonding, it will not affect the superlubricant. Therefore, there is no need to place a sacrificial layer between the superlubricants, avoiding the impact on the edges of the superlubricant when removing the sacrificial layer, which could cause some layers of the superlubricant to peel off or delaminate again, leading to a decrease in superlubricating performance. Therefore, the flip-chip bonding method in this embodiment does not damage the superlubricating performance of the superlubricant and has minimal impact on the superlubricant.
[0082] When aligning the superslipper array with the conductive connector, there may be some misalignment. Preferably, the cross-sectional area of the conductive connector is less than or equal to the cross-sectional area of the superslipper to avoid the conductive connector melting and softening during bonding, which could affect the superslippery performance.
[0083] Step S104: Remove the transition substrate to obtain the super-slippery device.
[0084] The processing method in this application bonds a transition substrate with superslippers to a conductive interconnect. During bonding, the conductive interconnect melts and softens at high temperature, thus connecting the superslippers to the conductive interconnect. This effectively solves the assembly difficulties caused by the uneven height of the superslippers. Simultaneously, the conductive interconnect enables the superslippery device to achieve electrical connections with other devices. Utilizing bonding in the processing allows for the large-scale fabrication of superslippery devices, and multiple superslippers can be assembled together to obtain large-sized superslippery devices.
[0085] The processing method of this application can connect superlubricating sheets with a size of 10μm and below to obtain large-scale superlubricating devices with near-zero friction and zero wear on the scale of 50μm-1mm or even centimeters.
[0086] When the conductive connector is a conductive block array, please refer to... Figure 3 The processing methods for superlubricated components include:
[0087] Step S201: Fabricate a second patterned photoresist on the substrate.
[0088] like Figure 4 As shown, the second patterned photoresist 4 is located on the upper surface of the substrate 3, and the second patterned photoresist 4 is obtained through exposure and development.
[0089] Substrate 3 can be made of any nanometer-level smooth material that can be prepared at present, such as silicon wafers, silicon oxide wafers, silicon nitride wafers, glass wafers, sapphire wafers, metal wafers, etc.
[0090] Step S202: Fabricate a conductive film layer on the substrate.
[0091] like Figure 5 As shown, the conductive film layer 5' covers the second patterned photoresist 4 and the area of the substrate 3 not covered by the second patterned photoresist 4.
[0092] The conductive film layer can be made of metals such as tin, silver, lead, and indium, as well as alloys such as gold-tin alloys, silver-copper-tin alloys, and indium-tin alloys.
[0093] The melting temperature varies for different materials and needs to be controlled near the material's melting point. For example, the melting temperature of gold-tin alloy is about 180-300 degrees Celsius.
[0094] Step S203: Strip the second patterned photoresist and the conductive film layer on the second patterned photoresist to form a conductive block array on the substrate. The conductive block array includes at least two conductive blocks, and the arrangement of the conductive block array is the same as that of the superslipper array.
[0095] like Figure 6 As shown, after the lift-off process, a conductive block array 5 is fabricated on the substrate 3.
[0096] The arrangement of the conductive block array 5 is the same as that of the superslipper array, that is, the number of conductive blocks 51 and the distance between conductive blocks 51 in the conductive block array 5 are the same as those in the superslipper array.
[0097] Step S204: Transfer at least two superslippers to the upper surface of the transition substrate to form a superslipper array on the transition substrate.
[0098] Preferably, the height of the super-lubricating plate array is about 1 μm, and the use of micron-level conductive blocks for conductive connection can effectively avoid the problem of super-lubricating performance failure caused by the overflow of conductive blocks.
[0099] Step S205: Bond the transition substrate with the superslip array to the conductive connector, soften the conductive connector, and connect the superslip to the softened conductive connector.
[0100] like Figure 7 and Figure 8 As shown, the transition substrate 1 with the superslip array can be flipped so that the superslip 21 and the conductive block 51 are aligned one by one and bonded together.
[0101] Step S206: Remove the transition substrate to obtain the super-slippery device.
[0102] like Figure 9 As shown, the transition substrate 1 is removed. The substrate 3 may or may not be removed; this application does not impose any restrictions.
[0103] When the conductive connector is a conductive block array, please refer to... Figure 10 The processing methods for superlubricated components include:
[0104] Step S301: Fabricate a third patterned photoresist on the substrate.
[0105] like Figure 11 As shown, the third patterned photoresist 6 is located on the upper surface of the substrate 3, and the third patterned photoresist 6 is obtained through exposure and development.
[0106] Step S302: Fabricate a metal layer on the substrate.
[0107] like Figure 12 As shown, the metal layer 7' covers the third patterned photoresist 6 and the area of the substrate 3 not covered by the third patterned photoresist 6.
[0108] Step S303: Remove the third patterned photoresist and the metal layer located on the third patterned photoresist to form a one-piece metal layer on the substrate.
[0109] like Figure 13 As shown, after the lift-off process, a one-piece metal layer 7 is fabricated on the substrate 3.
[0110] A single-piece metal layer 7 means that the metal layer exists as a single piece.
[0111] Step S304: Fabricate a second patterned photoresist on a substrate having a one-piece metal layer.
[0112] like Figure 14 As shown, the second patterned photoresist 4 is located in the area of the one-piece metal layer 7 and the area of the substrate 3 not covered by the one-piece metal layer 7.
[0113] Step S305: Fabricate a conductive film layer on the substrate.
[0114] like Figure 15 As shown, the conductive film layer 5' covers the areas of the second patterned photoresist 4 and the one-piece metal layer 7 that are not covered by the second patterned photoresist 4.
[0115] Step S306: Strip the second patterned photoresist and the conductive film layer on the second patterned photoresist to form a conductive block array on a one-piece metal layer. The conductive block array includes at least two conductive blocks, and the arrangement of the conductive block array is the same as that of the superslipper array.
[0116] like Figure 16 As shown, after the lift-off stripping process, the conductive block array 5 is placed on a one-piece metal layer 7.
[0117] Step S307: Transfer at least two superslippers to the upper surface of the transition substrate to form a superslipper array on the transition substrate.
[0118] Step S308: Bond the transition substrate with the superslip array to the conductive connector, soften the conductive connector, and connect the superslip to the softened conductive connector.
[0119] like Figure 17 and Figure 18 As shown, the transition substrate 1 with the superslip array can be flipped so that the superslip 21 and the conductive block 51 are aligned one by one and bonded together.
[0120] Step S309: Remove the transition substrate to obtain the super-slippery device.
[0121] like Figure 19 As shown, the transition substrate 1 is removed. The substrate 3 may or may not be removed; this application does not impose any restrictions.
[0122] When substrate 3 is removed, the structural schematic diagram of the super-lubricating device is shown below. Figure 20 As shown.
[0123] When the conductive connector is a conductive block array, based on any of the above embodiments, in one embodiment of this application, the superlubricating device processing method further includes:
[0124] Limiting protrusions are provided on the side of the conductive block. The height of the limiting protrusions is lower than the height of the conductive block, and all limiting protrusions are of equal height.
[0125] The height of the limiting protrusion is generally between 2μm and 3μm. In this embodiment, by setting the limiting protrusion, on the one hand, the distance between the transition substrate and the substrate can be limited, controlling the pressing height and depth of the superslipper; on the other hand, the limiting protrusion can also protect the superslipper, preventing damage to the superslipper when the pressing force is large; at the same time, it can also better control the angle of the transition substrate during pressing, preventing the transition substrate from warping on one side during pressing, and increasing the bonding success rate. Additionally, the limiting protrusion can also serve as a marker, that is, to mark the position.
[0126] When there are no limit protrusions, the thickness of the conductive film or conductive block is generally 0.8-1.8μm; when there are limit protrusions, the height of the conductive film or conductive block does not need to be specially controlled, as long as it is not less than 0.8μm.
[0127] When the conductive connector is an array of conductive blocks, based on any of the above embodiments, in one embodiment of this application, the cross-sectional area of the conductive block is less than or equal to the cross-sectional area of the corresponding superlubricating sheet, so as to avoid the conductive block melting and softening during bonding and affecting the superlubricating performance.
[0128] When the conductive connector is a one-piece conductive layer, based on the above embodiments, in one embodiment of this application, obtaining the conductive connector includes: forming a one-piece conductive layer on a substrate. There are two methods for fabricating a one-piece conductive layer, which will be described below.
[0129] As one possible implementation method, please refer to Figure 21 The processing methods for superlubricated components include:
[0130] Step S401: Fabricate a first patterned photoresist on the substrate.
[0131] like Figure 22 As shown, the first patterned photoresist 8 is located on the upper surface of the substrate 3, and the first patterned photoresist 8 is obtained through exposure and development.
[0132] Step S402: Fabricate a conductive film layer on the substrate.
[0133] like Figure 23 As shown, the conductive film layer 5' covers the first patterned photoresist 8 and the area of the substrate 3 not covered by the first patterned photoresist 8.
[0134] Step S403: Strip the first patterned photoresist and the conductive film layer on the first patterned photoresist to form a one-piece conductive layer on the substrate, wherein the area of the one-piece conductive layer is smaller than the area of the substrate.
[0135] like Figure 24 As shown, after the lift-off process, a one-piece conductive layer 9 is fabricated on the substrate 3.
[0136] Step S404: Transfer at least two superslippers to the upper surface of the transition substrate to form a superslipper array on the transition substrate.
[0137] Step S405: Bond the transition substrate with the superslip array to the one-piece conductive layer, soften the one-piece conductive layer, and connect the superslip to the softened one-piece conductive layer.
[0138] like Figure 25 and Figure 26As shown, the transition substrate 1 with the superslip array can be flipped so that the superslip 21 is aligned with the one-piece conductive layer 9 and bonded together.
[0139] Step S406: Remove the transition substrate to obtain the super-slippery device.
[0140] like Figure 27 As shown, the transition substrate 1 is removed. The substrate 3 may or may not be removed; this application does not impose any restrictions.
[0141] As another possible implementation method, please refer to Figure 28 The processing methods for superlubricated components include:
[0142] Step S501: Deposit a film on the substrate to form a one-piece conductive layer, the area of which is equal to the area of the substrate.
[0143] like Figure 29 As shown, a one-piece conductive layer 9 is formed directly on the substrate 3.
[0144] Step S502: Transfer at least two superslippers to the upper surface of the transition substrate to form a superslipper array on the transition substrate.
[0145] Step S503: Bond the transition substrate with the superslip array to a one-piece conductive layer, soften the one-piece conductive layer, and connect the superslip to the softened one-piece conductive layer.
[0146] like Figure 30 and Figure 31 As shown, the transition substrate 1 with the superslip array can be flip-chipped, aligned with the one-piece conductive layer 9, and bonded.
[0147] Step S504: Remove the transition substrate to obtain the super-slippery device.
[0148] like Figure 32 As shown, the transition substrate 1 is removed. The substrate 3 may or may not be removed; this application does not impose any restrictions.
[0149] To improve the alignment accuracy between the superslipper array and the conductive connector, based on any of the above embodiments, in one embodiment of this application, the transition substrate with the superslipper array is flip-chip bonded, and before the superslipper array is bonded to the conductive connector, the following steps are further included:
[0150] Alignment marks are set at the edges of the superslip array on the transition substrate and / or the edges of the conductive connectors on the substrate.
[0151] Accordingly, flip-chip bonding of the transition substrate with the superslipper array to the conductive interconnect includes:
[0152] Using alignment marks, the transition substrate with the superslipper array is flipped to bond the superslipper array to the conductive interconnect.
[0153] Alignment marks include, but are not limited to, grooves, crosses, and protrusions. Alignment marks can be set at opposite ends of the superslipper array and / or at opposite ends of the conductive connector.
[0154] This application also provides a superlubricating device obtained by the superlubricating device processing method of any of the above embodiments, the superlubricating device comprising:
[0155] Conductive connector;
[0156] An array of superslippers connected to the upper surface of a conductive connector, the array comprising at least two superslippers.
[0157] The conductive connector can be a conductive block array or a single conductive layer. The conductive block array includes at least two conductive blocks, and the arrangement of the conductive block array is the same as that of the superslipper array.
[0158] When the conductive connector is an array of conductive blocks, the cross-sectional shape of the conductive blocks includes, but is not limited to, circles, squares, triangles, or other irregular shapes. Preferably, the cross-section of the conductive block is circular so that maximum area connection can be achieved regardless of the rotation direction of the superslipper. Furthermore, the cross-sectional area of the conductive block is smaller than the cross-sectional area of the corresponding superslipper to prevent the conductive block from "overflowing" upwards under external pressure when the superslipper is flipped and bonded to the conductive block, thereby affecting the structural superslip performance of the upper surface of the superslipper. For example, the cross-section of the superslipper can be a 10*10μm square cross-section, and the cross-section of the conductive block can be a 5 to 7μm circular cross-section.
[0159] Optionally, in one embodiment of this application, the super-slippery device may further include: a limiting protrusion disposed on the side of the conductive block, the height of the limiting protrusion being lower than the height of the conductive block, and all the limiting protrusions having the same height.
[0160] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.
[0161] The superlubricating device and its processing method provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.
Claims
1. A super slippery device processing method, characterized by, The method comprises: obtaining an electrically conductive connector; transferring at least two super slippery sheets to an upper surface of a transition substrate to form a super slippery sheet array on the transition substrate; bonding the transition substrate with the super slippery sheet array to the electrically conductive connector, softening the electrically conductive connector, and connecting the super slippery sheets to the softened electrically conductive connector; when bonding, the electrically conductive connector softens as the temperature rises, but does not completely melt; removing the transition substrate to obtain a super slippery device.
2. The ultra-slid device processing method of claim 1, wherein, The bonding of the transition substrate with the super slippery sheet array to the electrically conductive connector comprises: flip-chip the transition substrate with the super slippery sheet array to position the super slippery sheet array above the electrically conductive connector and bond the super slippery sheet array to the electrically conductive connector.
3. The ultra-smooth device processing method of claim 1, wherein, The bonding of the transition substrate with the super slippery sheet array to the electrically conductive connector comprises: flip-chip the electrically conductive connector to position the electrically conductive connector above the super slippery sheet array and bond the electrically conductive connector to the super slippery sheet array.
4. The ultra-slid device processing method of claim 2, wherein, Before flip-chipping the transition substrate with the super slippery sheet array to position the super slippery sheet array above the electrically conductive connector and bond the super slippery sheet array to the electrically conductive connector, the method further comprises: providing alignment marks on the edges of the super slippery sheet array on the transition substrate and / or on the edges of the electrically conductive connector on the substrate; Correspondingly, the flip-chipping of the transition substrate with the super slippery sheet array to bond the super slippery sheet array to the electrically conductive connector comprises: flip-chipping the transition substrate with the super slippery sheet array to position the super slippery sheet array above the electrically conductive connector and bond the super slippery sheet array to the electrically conductive connector by means of the alignment marks.
5. The ultra-slid device processing method of claim 1, wherein, The obtaining of the electrically conductive connector comprises: forming an array of electrically conductive blocks on a substrate, the array of electrically conductive blocks comprising at least two electrically conductive blocks, the array of electrically conductive blocks being arranged in the same manner as the super slippery sheet array.
6. The ultra-slid device processing method of claim 1, wherein, The obtaining of the electrically conductive connector comprises: forming a one-piece electrically conductive layer on a substrate.
7. The ultra-smooth device processing method of claim 6, wherein, The forming of the one-piece electrically conductive layer on a substrate comprises: making a first patterned photoresist on the substrate; making an electrically conductive film layer on the substrate; peeling off the first patterned photoresist and the electrically conductive film layer on the first patterned photoresist to form the one-piece electrically conductive layer on the substrate, the one-piece electrically conductive layer having an area smaller than that of the substrate.
8. The ultra-slid device processing method of claim 6, wherein, The forming of the one-piece electrically conductive layer on a substrate comprises: coating a film on the substrate to form a one-piece electrically conductive layer, the one-piece electrically conductive layer having an area equal to that of the substrate.
9. The ultra-slid device processing method of claim 5, wherein, The forming of the array of electrically conductive blocks on a substrate comprises: making a second patterned photoresist on the substrate; making an electrically conductive film layer on the substrate; peeling off the second patterned photoresist and the electrically conductive film layer on the second patterned photoresist to form the array of electrically conductive blocks on the substrate.
10. The ultra-slid device processing method of claim 5, wherein, The forming of the array of electrically conductive blocks on a substrate comprises: making a third patterned photoresist on the substrate; making a metal layer on the substrate; peeling off the third patterned photoresist and the metal layer on the third patterned photoresist to form a one-piece metal layer on the substrate; lithographically making a second patterned photoresist on the substrate with the one-piece metal layer; making an electrically conductive film layer on the substrate; Peeling off the second patterned photoresist and the conductive film layer on the second patterned photoresist, a conductive block array is formed on the one-piece metal layer.
11. The ultra-slid device processing method of claim 5, wherein, The cross-sectional area of the conductive block is less than or equal to the cross-sectional area of the corresponding super-smooth sheet.
12. The ultra-smooth device processing method of any one of claims 5, 9, 10, 11, wherein, Further comprising: A limiting protrusion is arranged on the side of the conductive block, the height of the limiting protrusion is lower than the height of the conductive block, and the height of all the limiting protrusions is equal.
13. The ultra-smooth device processing method of claim 12, wherein, The height of the limiting protrusion is between 2μm-3μm.
14. A super-slick device obtained by the method of claim 1 to 13, wherein, Including: A conductive connecting body; An array of super-smooth sheets connected to the upper surface of the conductive connecting body, the array of super-smooth sheets including at least two super-smooth sheets.
15. The ultrasmooth device of claim 14, wherein, When the conductive connecting body is a conductive block array, the conductive block array includes at least two conductive blocks, and the cross-section of the conductive block is circular.
Citation Information
Patent Citations
Conductive connection sheet, method for connecting terminals, method for forming connection terminal, semiconductor device, and electronic device
CN102725912A
Large-scale super-smooth element with conductive performance, processing technology of large-scale super-smooth element and large-scale super-smooth system
CN113173552A