Method and apparatus for processing control of semiconductor products, processing equipment

Abstract

The application discloses a kind of processing control method and device of semiconductor product, processing equipment, to realize product yield protection control when semiconductor product production processing equipment is abnormal.The processing control method of semiconductor product provided by the application comprises: by monitoring the in-process product currently in semiconductor product processing path and executing semiconductor product processing flow, it is judged whether to meet the preset condition that the in-process product is cut into the protection path set in advance to execute product protection flow;When there is in-process product that meets the preset condition, control in-process product that meets the preset condition enters the protection path set in advance, and the product protection flow set in advance is executed for the product entering the protection path.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, and in particular to a processing control method and device of semiconductor products and a processing equipment. BACKGROUND

[0002] In the current semiconductor industry, in the event of a large-scale equipment interruption accident on the production line, the main purpose is to complete equipment recovery as soon as possible. However, after the equipment is shut down, it is easily affected by the external environment, or the harmful substances in the site cannot be removed in time, which may cause the site to be damaged, thereby causing different degrees of product yield impact and losses. SUMMARY

[0003] Embodiments of the present application provide a processing control method and device of semiconductor products and a processing equipment, to realize product yield protection control when the production and processing equipment of semiconductor products is abnormal.

[0004] The processing control method of semiconductor products provided by the embodiments of the present application comprises:

[0005] The in-process products currently in the semiconductor product processing path and executing the semiconductor product processing flow are monitored to determine whether a preset condition for cutting the in-process products into a pre-set protection path to execute a product protection flow is met;

[0006] When there are in-process products meeting the preset condition, the in-process products meeting the preset condition are controlled to enter the pre-set protection path, and the pre-set product protection flow is executed for the products entering the protection path.

[0007] The embodiments of the present application monitor the in-process products currently in the semiconductor product processing path and executing the semiconductor product processing flow, to determine whether a preset condition for cutting the in-process products into a pre-set protection path to execute a product protection flow is met, when there are in-process products meeting the preset condition, the in-process products meeting the preset condition are controlled to enter the pre-set protection path, and the pre-set product protection flow is executed for the products entering the protection path, thereby realizing product yield protection control when the production and processing equipment of semiconductor products is abnormal, and avoiding secondary losses of the production line, and avoiding time efficiency problems and judgment error problems caused by manual participation, improving the timeliness and accuracy of product yield protection, thereby further improving product yield and avoiding or reducing losses.

[0008] In some embodiments, the preset condition comprises one or a combination of the following conditions:

[0009] Any process section in the semiconductor product processing flow is abnormal;

[0010] for any station in any process section in the semiconductor product processing flow, if the next station of the station is abnormal;

[0011] for any station in any process section in the semiconductor product processing flow, if the remaining processing time of the work-in-process in the process section does not meet preset requirements.

[0012] In some embodiments, the remaining processing time of the work-in-process in the process section does not meet preset requirements, comprising:

[0013] The proportion of the remaining processing time of the work-in-process in the process section to the preset allowable time of the process section is less than a preset threshold.

[0014] In some embodiments, the control of the work-in-process meeting the preset condition into the preset protection path comprises:

[0015] for the work-in-process of the last station in any process section in the semiconductor product processing flow, when the next station of the process section is abnormal, controlling the work-in-process of the last station into the preset protection path; and / or,

[0016] for the work-in-process of any station in any process section in the semiconductor product processing flow, when the next station of the station is abnormal, controlling the work-in-process into the preset protection path; and / or,

[0017] for the work-in-process of any station in any process section in the semiconductor product processing flow, when the remaining processing time of the work-in-process in the process section does not meet preset requirements, controlling the work-in-process into the preset protection path.

[0018] In some embodiments, the execution of the preset product protection process for the product entering the protection path comprises:

[0019] for the product entering the protection path, performing product protection operation according to the preset product protection priority.

[0020] In some embodiments, the execution of the preset product protection process for the product entering the protection path comprises:

[0021] for the product entering the protection path, periodically performing product protection operation according to the preset execution cycle of product protection.

[0022] In some embodiments, the execution of the preset product protection process for the product entering the protection path comprises:

[0023] For the product entering the protection path, the product protection operation is periodically performed according to the preset product protection priority and the execution period of the product protection; wherein different kinds of products correspond to different product protection priorities, and when the execution periods of the product protection corresponding to multiple kinds of products are the same, for different products with the same execution period, the product protection operation is periodically performed according to the product protection priority.

[0024] In some embodiments, the product protection comprises: oxidation protection of the product.

[0025] In some embodiments, the method further comprises:

[0026] When the product in the protection process meets the preset release condition, the product meeting the release condition is controlled to return to the semiconductor product processing path to continue the semiconductor product processing process.

[0027] In some embodiments, the release condition comprises one or a combination of the following conditions:

[0028] For the product in the protection process, the subsequent station of the cut-out station when the product is cut out from the semiconductor product processing path is recovered to normal;

[0029] For the product in the protection process, the subsequent station of the cut-out station when the product is cut out from the semiconductor product processing path is in an idle state in the process section belonging to the semiconductor product processing process.

[0030] In some embodiments, the control of the product meeting the release condition to return to the semiconductor product processing path to continue the semiconductor product processing process comprises:

[0031] The product meeting the release condition is controlled to return to the next station of the cut-out station when the product is cut out from the semiconductor product processing path, and the processing process of the next station and the subsequent station of the cut-out station is performed, wherein the remaining allowable time of the product is re-counted from the next station of the cut-out station.

[0032] In some embodiments, the method further comprises:

[0033] The protection process is monitored, and when an exception occurs, an alarm information is sent out.

[0034] In some embodiments, when there is an in-process product meeting the preset condition, a mark is set for the in-process product meeting the preset condition, and the product with the mark is controlled to enter a preset protection path.

[0035] The embodiment of the present application provides a processing control device of a semiconductor product, which comprises a memory and a processor, wherein the memory is used for storing program instructions, and the processor is used for calling the program instructions stored in the memory and executing the above-mentioned method according to obtained programs.

[0036] The embodiment of the present application provides a processing device of a semiconductor product, which comprises a semiconductor product processing path and a protection path, and the processing control device connected with the semiconductor product processing path and the protection path respectively; wherein the semiconductor product processing path comprises at least one machine table used for processing the semiconductor product, and the protection path comprises at least one device used for protecting the semiconductor product.

[0037] In addition, according to the embodiment, for example, a computer program product for a computer is provided, which comprises software code portions for performing the steps of the above-mentioned method when the product is run on the computer. The computer program product can comprise a computer readable medium having stored thereon the software code portions. In addition, the computer program product can be loaded directly into the internal memory of the computer and / or transmitted via a network by at least one of an upload process, a download process and a push process.

[0038] Another embodiment of the present application provides a computer readable storage medium, which stores computer executable instructions, and the computer executable instructions are used for enabling the computer to execute the above-mentioned method. BRIEF DESCRIPTION OF DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0040] Figure 1 The overall flowchart of the processing control method of the semiconductor product provided by the embodiment of the present application is shown in the figure.

[0041] Figures 2 to 4 The schematic diagrams of different process sections provided by the embodiments of the present application are shown in the figures.

[0042] Figures 5 to 7 The specific flowcharts of the processing control methods of different semiconductor products provided by the embodiments of the present application are shown in the figures.

[0043] Figures 8 to 10 The structural schematic diagrams of the processing control devices of different semiconductor products provided by the embodiments of the present application are shown in the figures.

[0044] Figure 11 Fig. 1 is a structural schematic diagram of a processing equipment for semiconductor products according to an embodiment of the present application. DETAILED DESCRIPTION

[0045] The technical solutions in the embodiments of the present application will be clearly and completely described with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, and not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0046] The embodiments of the present application provide a processing control method and device for semiconductor products and processing equipment, to realize product yield protection control when the production and processing equipment of the semiconductor products is abnormal.

[0047] The method and the device are based on the same application concept. Since the principles of the method and the device for solving problems are similar, the implementation of the device and the method can be mutually referred to, and the repeated parts will not be described again.

[0048] The terms "first", "second", and the like (if any) in the specification and claims of the embodiments of the present application and the above-described drawings are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device including a series of steps or units does not have to be limited to only those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to the process, method, product, or device.

[0049] The following examples and embodiments will only be understood as illustrative examples. Although the present specification may refer to "a", "one", or "some" example or embodiment, this does not mean that each such reference relates to the same example or embodiment, nor does it mean that the feature only applies to a single example or embodiment. Individual features of different embodiments can also be combined to provide other embodiments. In addition, terms such as "include" and "contain" should be understood as not limiting the described embodiments to only those features mentioned; such examples and embodiments can also include features, structures, units, modules, etc. that are not specifically mentioned.

[0050] The various embodiments of the present application will be described in detail below with reference to the accompanying drawings. It should be noted that the sequence of the embodiments of the present application is only the sequence of the embodiments, and does not represent the advantages and disadvantages of the technical solutions provided by the embodiments.

[0051] Referring to Figure 1 The processing control method for a semiconductor product provided by the embodiments of the present application comprises the following steps.

[0052] S101, by monitoring the in-process product currently in the semiconductor product processing path and performing the semiconductor product processing flow, it is judged whether the preset condition for cutting the in-process product into the preset protection path to perform the product protection flow is met;

[0053] The semiconductor product processing flow can include multiple process stages, such as Figure 2 As shown in the figure, for example, Qtime1, Qtime2 and Qtime3 represent different process stages.

[0054] Each process stage can include multiple stations, such as Figure 3 As shown in the figure, for example, the Qtime1 process stage includes stations 1-7.

[0055] One process stage can also include at least one process stage, such as Figure 4 As shown in the figure, for example, the Qtime1 process stage can also be subdivided into the Qtime2 process stage.

[0056] The product protection flow described in the embodiments of the present application can include any one or more product protection operation flows, which are not limited in the embodiments of the present application.

[0057] S102, when there is an in-process product meeting the preset condition, control the in-process product meeting the preset condition to enter the preset protection path, and perform the preset product protection flow for the product entering the protection path.

[0058] In the semiconductor industry, in the event of a large-scale equipment interruption on the production line (not limited to this abnormal situation), the priority is to complete the equipment recovery as soon as possible. Therefore, the embodiments of the present application provide a protection control method for product yield, thereby avoiding the adverse effects on product yield and avoiding losses. Moreover, the time limit problem of manual operation setting can be avoided, and the problems of insufficient product protection and human judgment errors can be avoided.

[0059] In the embodiments of the present application, the monitoring described in step S101 can be performed for all stations, or the monitoring described in step S101 can be performed for part of the stations.

[0060] In some implementations, the technical solutions provided in this application are applicable to semiconductor manufacturing equipment during large-scale shutdowns (not limited to this), specifically for product yield protection and control methods for products not located at safe stations. That is, after equipment shutdown, products are susceptible to external environmental influences or cannot be promptly removed from their stations, resulting in stations that could damage products. These stations can be termed unsafe stations, meaning that products in production at these stations require protection. During the monitoring described in step S101, monitoring can be performed only on products at unsafe stations to determine if the preset conditions for switching the in-production products to a pre-set protection path and executing the product protection process are met. In other words, products at safe stations do not need to undergo the protection process. Furthermore... Figure 2 For example, stations 7 and 12 are safe stations, meaning that products at these two stations do not require anti-oxidation protection operations such as nitrogen filling.

[0061] For products that are abruptly terminated, especially those not located at a safe production site, a controlled N2 inflation protection process with different time cycles can be implemented for different product grades. This prevents products from being affected by prolonged exposure to moisture and oxygen, thus avoiding secondary losses to the production line. After the equipment returns to the line, the protection process can be released, allowing the product to proceed to the next processing station for subsequent steps. Figure 2 The diagram shows the stations a product needs to navigate through, including safe and unsafe stations under shutdown conditions. Each station corresponds to a process step in the product's manufacturing process, and each process step requires one or more machines on a semiconductor manufacturing production line. Products that need to be manufactured at various stations in the product's process flow are also called work-in-process. After some stations complete product processing, subsequent corresponding processes need to be completed within a preset allowable time (Qtime, QT); otherwise, product quality issues will occur. The allowable time refers to the process interval corresponding to one Qtime. For example, Qtime 1 is the time required for the product to complete the processing flow from station 1 to station 7, and so on. The nitrogen protection system (i.e., the protection path described in the embodiments of this application) can automatically connect to the unsafe station according to set conditions.

[0062] In some implementations, the preset conditions include one or a combination of the following conditions:

[0063] First preset condition: For any process segment in the semiconductor product processing flow, the next station of that process segment is abnormal;

[0064] Second preset condition: For any station in any process segment of the semiconductor product processing flow, the next station of that station is abnormal;

[0065] The third preset condition: for the in-process product at any station in any process section in the semiconductor product processing flow, the remaining processing time of the in-process product in the process section does not meet the preset requirement.

[0066] In some embodiments, the remaining processing time of the in-process product in the process section does not meet the preset requirement, including:

[0067] The proportion of the remaining processing time of the in-process product in the process section in the preset allowable time of the process section is less than a preset threshold.

[0068] In some embodiments, when there is an in-process product meeting the preset condition, a mark is set for the in-process product meeting the preset condition, and the product provided with the mark is controlled to enter a pre-set protection path.

[0069] An example of the condition for cutting the product into the protection path is given below.

[0070] For example, the product is provided with a new type of control flag S_flag, which is used to judge the entry and exit of the product meeting the set condition into the protection path, and the integrated control method realizes the technical achievement. The specific judgment formula is, for example:

[0071] Method(Auto branch, S_flag) = Any{f1(next station equipment stops, S_flag), f2(process section Qtime control any equipment stops, S_flag), f3(Qtime interval remaining Qtime < N%, S_flag), …, fn(others, S_flag)}. Wherein, N is a preset value, and fn can set multiple conditions.

[0072] That is, taking nitrogen gas protection as an example, the method provided by the embodiments of the present application assigns the product to the protection process according to the set rules and logic, automatically performs the product protection N2 gas filling process, and can be recycled. The product accessing the dynamic nitrogen protection path needs to meet the preset condition, that is, the product at the unsafe station needs to be identified by the method Method(Auto branch, S_flag) when the equipment stops. The preset condition is, for example:

[0073] The first preset condition f1(next station equipment stops, S_flag): f1 indicates that the product is in the processing queue of a process section, but the next station equipment of the process section stops running, and the product stopped in the conveying route is easy to be affected by the environment, and needs to be protected by nitrogen, and the batch product (i.e. the product of the last station of the process section) is marked with “S”. For example, see Figure 2, the next site outside the process section Qtime1 is abnormal, i.e. site 8 is abnormal, then the in-process product of the last site in Qtime1, i.e. site 7, is protected, i.e. needs to be transported to the nitrogen filling path. Of course, if site 7 is a safety site, the in-process product of site 7 can also not be protected. This is only an optional execution mode.

[0074] The second preset condition f2 (any equipment in a process section Qtime stops, S_flag): f2 represents a process section, such as Figure 2 As shown in Qtime1, Qtime2, and Qtime3, all represent a process section, which includes multiple processing sites. If any product does not execute the site equipment in a stop state, the processing product in this process section needs to be protected by nitrogen, and the completed product that has not reached the site and the product being processed in the site are transported out of the machine table and marked "S". For example, each site in Qtime1 is monitored, and if any site is abnormal, the in-process product of the previous site of the abnormal site is protected, i.e. needs to be transported to the nitrogen filling path. For example, see Figure 3 If the third site in Qtime1, i.e. site 3, is abnormal, the in-process product of the second site in Qtime1, i.e. site 2, is protected, i.e. needs to be transported to the nitrogen filling path.

[0075] The third preset condition f3 (the remaining Qtime of a product to the next site is less than N% of the specified Qtime, S_flag): f3 represents the proportion of the remaining time of a product to the next site to the specified Qtime. When the proportion is less than the set proportion N%, it means that the product cannot reach the next site within the specified Qtime, and the time affected by the environment is longer, so nitrogen protection is also needed, and the product is also marked "S". The value of N is determined according to the processing time of the next site and the current position of the product. For example, the in-process product of each site in Qtime1 is monitored for the remaining Qtime. If the remaining Qtime of the in-process product of any site does not meet the requirement, the in-process product of the site needs to be protected, i.e. needs to be transported to the nitrogen filling path. For example, see Figure 3 The remaining Qtime of the in-process product of the second site in Qtime1, i.e. site 2, accounts for 50% of the entire Qtime, while the remaining Qtime of the in-process product of the second site actually needs to account for 60% of the entire Qtime to complete the processing flow of the subsequent sites (sites 3 to 7). Therefore, the in-process product of the second site in Qtime1 needs to be protected, i.e. needs to be transported to the nitrogen filling path.

[0076] In addition, more preset conditions fn (others, S_flag) can also be set according to actual application and needs.

[0077] That is, in some embodiments, the control of the in-process product satisfying the preset condition into the preset protection path includes:

[0078] For the in-process product of the last station in any process section in the semiconductor product processing flow, when the next station of the process section is abnormal, the control of the in-process product of the last station into the preset protection path; and / or,

[0079] For the in-process product of any station in any process section in the semiconductor product processing flow, when the next station of the station is abnormal, the control of the in-process product into the preset protection path; and / or,

[0080] For the in-process product of any station in any process section in the semiconductor product processing flow, when the remaining processing time of the in-process product in the process section does not meet the preset requirement, the control of the in-process product into the preset protection path.

[0081] In some embodiments, the execution of the preset product protection process for the product into the protection path includes:

[0082] For the product into the protection path, the execution of the product protection operation according to the preset product protection priority.

[0083] That is, in the embodiments of the present application, the N2 gas protection process can be automatically executed for different product grades.

[0084] In some embodiments, the execution of the preset product protection process for the product into the protection path includes:

[0085] For the product into the protection path, the periodic execution of the product protection operation according to the preset execution period of the product protection.

[0086] That is, in the embodiments of the present application, the N2 gas protection process can be automatically executed for different products in different time periods.

[0087] In some embodiments, the execution of the preset product protection process for the product into the protection path includes:

[0088] For the product into the protection path, the periodic execution of the product protection operation according to the preset product protection priority and the execution period of the product protection; wherein different kinds of products correspond to different product protection priorities, when the execution periods of the product protection corresponding to multiple kinds of products are the same, for different products with the same execution period, the periodic execution of the product protection operation is performed according to the product protection priority.

[0089] That is, in the embodiments of the present application, different time periods of automatic N2 filling protection processes can be performed for different product grades.

[0090] In some embodiments, the method further comprises:

[0091] When the product in the protection process meets the pre-set release condition, the product meeting the release condition is controlled to return to the semiconductor product processing path to continue the semiconductor product processing process.

[0092] In some embodiments, the release condition comprises one or a combination of the following conditions:

[0093] For the product in the protection process, the subsequent station of the cut-out station where the product is cut out from the semiconductor product processing path is resumed to normal;

[0094] For the product in the protection process, the subsequent station of the cut-out station where the product is cut out from the semiconductor product processing path is in an idle state in the process section to which the product belongs in the semiconductor product processing process.

[0095] In summary, the specific control process provided by the embodiments of the present application is as shown in Figure 5 , which comprises:

[0096] Identifying the product at the unsafe station;

[0097] Determining the unsafe product, for example, the next station of the unsafe station is stopped, then the product at the unsafe station is the unsafe product;

[0098] Transporting the unsafe product to the nitrogen filling path;

[0099] For the product on the nitrogen filling path, the reservation of the nitrogen filling operation according to the pre-set nitrogen filling period, that is, determining the time of the next nitrogen filling of the product;

[0100] Performing the nitrogen filling operation according to the reservation, and the pre-set nitrogen filling priority and nitrogen filling time (for example, 3 minutes), wherein the nitrogen filling time of different products each time can also be set to be different;

[0101] Transporting the product meeting the release condition back to the semiconductor product processing path.

[0102] In some embodiments, the control of the product meeting the release condition to return to the semiconductor product processing path to continue the semiconductor product processing process comprises:

[0103] controlling the next station of the product satisfying the release condition to return from the next station of the cut-out station of the semiconductor product processing path, and performing the processing flow of the next station and the subsequent station of the cut-out station, wherein the remaining tolerance time of the product is re-counted from the next station of the cut-out station.

[0104] In some embodiments, the method further comprises:

[0105] monitoring the protection flow, and issuing an alarm when an abnormality occurs.

[0106] Another specific control flow is shown in Figure 6 and comprises:

[0107] The first agent (Agent 1) identifies the product at the unsafe station, and sets a flag for the unsafe product;

[0108] The second agent (Agent 2) transports the product with the flag to the nitrogen filling path;

[0109] The third agent (Agent 3) automatically controls the N2 equipment to fill gas according to the pre-set nitrogen filling cycle of different products;

[0110] The product release condition is checked, i.e., after each nitrogen filling of the product is completed, it is determined whether the product satisfies the release condition;

[0111] Abnormal monitoring of the product that has not been moved in the N2 equipment for more than M hours, and the record of the product entering and exiting the N2 equipment for filling gas. That is, in the embodiment of the application, the protection flow is further provided with an alarm function, and the nitrogen filling records of all products are checked regularly to determine whether there is an abnormal situation that a product is always circulating or has not entered the nitrogen filling equipment.

[0112] The three agents, i.e., the three functional modules in the control device provided by the embodiment of the application, perform the corresponding steps described above, respectively.

[0113] Next, another specific control flow is exemplified, taking the three pre-set conditions described above as examples, and the products are pre-set with priority levels 0, 1, 2, 3, …, wherein the smaller the serial number of the priority level is, the higher the priority level is, and the higher the frequency of nitrogen filling of the product is. Referring to Figure 7 a control method comprises:

[0114] Step 1, identifying the product at the unsafe station;

[0115] Step 2, determining whether one or a combination of the following conditions is satisfied:

[0116] For any process section (Qtime interval) in the semiconductor product processing flow, the next station of the process section is abnormal;

[0117] For any station in any process section (Qtime interval) in the semiconductor product processing flow, the next station of the station is abnormal;

[0118] For any station in any process section (Qtime interval) in the semiconductor product processing flow, the remaining processing time (remaining Qtime) of the in-process product in the process section does not meet the preset requirement, for example, remaining Qtime < N%.

[0119] Step three, transport the product (i.e. unsafe product) satisfying one or combination of the above conditions to the nitrogen filling path;

[0120] Step three specifically includes:

[0121] For the in-process product of the last station in any process section in the semiconductor product processing flow, when the next station of the process section is abnormal, control the in-process product of the last station to enter the preset protection path; and / or,

[0122] For the in-process product of any station in any process section in the semiconductor product processing flow, when the next station of the station is abnormal, control the in-process product to enter the preset protection path; and / or,

[0123] For the in-process product of any station in any process section in the semiconductor product processing flow, when the remaining processing time of the in-process product in the process section does not meet the preset requirement, control the in-process product to enter the preset protection path.

[0124] Step four, automatically schedule the nitrogen filling time for the unsafe product entering the protection path according to the period.

[0125] Automatically schedule the N2 equipment according to the preset nitrogen filling period of the product: schedule the product in the nitrogen filling process, for example, according to the product importance level, schedule the N2 equipment to fill nitrogen according to the set period. That is, for example, for multiple batches of wafers to be protected, the nitrogen protection equipment will fill nitrogen according to the priority, and the subsequent nitrogen filling will be performed again according to whether the period time is met.

[0126] Step five, periodically perform the nitrogen filling operation according to the preset nitrogen filling priority and nitrogen filling execution period for the product entering the protection path; wherein different types of products correspond to different nitrogen filling priorities, and when the nitrogen filling execution periods of multiple types of products are the same, for different products with the same execution period, periodically perform the nitrogen filling operation according to the nitrogen filling priority.

[0127] In the embodiments of the present application, standardized data is pre-set, which includes setting of various configurations of nitrogen filling operation and identification and judgment logic of unsafe products, etc. For example: 1. defining product categories and grades that need to be filled with nitrogen; 2. S_Flag marking information of unsafe products and release conditions (in the embodiments of the present application, a mark can be set for the products determined to be unsafe, and for the same reason, a mark can also be set for the products meeting the release conditions, and the products with the release mark are released, i.e. return to the normal processing flow); 3. setting corresponding nitrogen filling protection period for product grades; 4. setting of Agent control start and stop. The above standardized data can be used as rules and logic basis for automatic process control, etc.

[0128] In the embodiments of the present application, standardized data is pre-set, which includes setting of various configurations of nitrogen filling operation and identification and judgment logic of unsafe products, etc. For example: 1. defining product categories and grades that need to be filled with nitrogen; 2. S_Flag marking information of unsafe products and release conditions (in the embodiments of the present application, a mark can be set for the products determined to be unsafe, and for the same reason, a mark can also be set for the products meeting the release conditions, and the products with the release mark are released, i.e. return to the normal processing flow); 3. setting corresponding nitrogen filling protection period for product grades; 4. setting of Agent control start and stop. The above standardized data can be used as rules and logic basis for automatic process control, etc.

[0129] The release conditions are, for example, normal function of the next station, recovery of all remaining processing machines within Qtime, and that the current remaining protection period of the product can cover the remaining Qtime (can enter the next station within the nitrogen protection period), etc. When the release conditions are met, the S_Flag mark of the product can be eliminated, and after the elimination, the product can be transferred to the previous processing route;

[0130] The setting of Agent control start and stop, for example, in the case of abnormal conditions on the processing route, such as power failure, or too long product queuing time, etc., the entire protection process is started, i.e. the setting of the prerequisite condition for starting the protection process.

[0131] In the embodiments of the present application, when there is an in-process product meeting the pre-set condition, the in-process product meeting the pre-set condition is controlled to enter the pre-set protection path, and the pre-set product protection process is performed for the product entering the protection path, i.e. an Agent of an automatic execution program is pre-established, and the prerequisite condition, i.e. the trigger condition for execution is, for example:

[0132] 1. stop of the next station equipment in the Qtime interval of any process;

[0133] 2. stop of any equipment in the Qtime interval of any process;

[0134] 3. Qtime < N% in the Qtime interval;

[0135] …

[0136] The product with quality yield risk mark (i.e. unsafe product, provided with corresponding unsafe mark) is automatically cut into the product protection flow path filled with nitrogen. That is, when the use condition of the nitrogen protection system is met, i.e. marked by the nitrogen protection system, and the corresponding protection flow is executed.

[0137] For example, Figure 7 Priority 0, 1 in the table respectively represent the priority order of nitrogen filling of two kinds of products, wherein the products provided with Priority 0 and Priority 1 have the same nitrogen filling period (for example, nitrogen filling operation is performed every 4 hours), but the nitrogen filling sequence of the product with Priority 0 is prior to that of the product with Priority 1. Similarly, Priority 2, 3 respectively represent the priority order of nitrogen filling of two kinds of products, wherein the products provided with Priority 2 and Priority 3 have the same nitrogen filling period (for example, nitrogen filling operation is performed every 6 hours), but the nitrogen filling sequence of the product with Priority 2 is prior to that of the product with Priority 3. The nitrogen filling sequence of the product with Priority 1 is prior to that of the product with Priority 2. Similarly, the smaller the Priority number is, the earlier the corresponding nitrogen filling sequence is. However, the products with different Priority numbers can have the same nitrogen filling period. For example, the products with Priority > 3 can have the same nitrogen filling period (for example, nitrogen filling operation is performed every 10 hours). Overall, the smaller the Priority number is, the shorter the corresponding nitrogen filling period is, i.e. the higher the nitrogen filling frequency is, that is, the more important protection is needed.

[0138] wherein, Figure 7 4hrs, 6hrs, 10hrs in the table represent the filling period. The box for storing the wafer is fixed in volume, and the time for filling the box with gas is very short, within 10 minutes, but nitrogen will diffuse outwardly, and needs to be supplemented regularly.

[0139] Step six, when the product in the protection flow meets the pre-set release condition, the product meeting the release condition is controlled to return to the semiconductor product processing path to continue the semiconductor product processing flow. The newly added or not meeting the release condition is continued to cycle the product nitrogen filling protection.

[0140] Specifically, for example, after each nitrogen filling of the product ends, it is determined whether the release condition is met. If the release condition is met, the in-process product is transported back to the next station of the original station to continue the subsequent processing process. At this time, the remaining Qtime is re-counted according to the entire Qtime of the process section to which the station belongs, that is, the processing time is counted from 0, instead of continuing to count according to the previous corresponding remaining Qtime. For example, the remaining Qtime of the in-process product of the second station in Qtime1 accounts for 50% of the entire Qtime, and the actual remaining Qtime of the in-process product of the second station accounts for 60% of the entire Qtime to complete the processing process of the subsequent station. Therefore, nitrogen filling protection is performed. During the protection period, if all the subsequent stations of the second station in Qtime1 are emptied of products, that is, there is no in-process product, it is determined that the release condition is met. The in-process product of the second station currently protected can be transported back to the next station, that is, the third station of the original station to continue the subsequent processing process. At this time, since there is no in-process product in the subsequent stations of the second station, the processing process is accelerated, and the product does not need to be queued to enter the station. The product transported back to the third station is re-counted for processing time and counts the remaining Qtime, and calculates the proportion of the remaining Qtime to the entire Qtime, without considering the statistical results in the first station and the second station.

[0141] In summary, the method provided in the embodiments of the present application can improve the operation accuracy and efficiency, and avoid the yield loss caused by time limit problems and human errors or omissions. Specifically, for example, the method provided in the embodiments of the present application can change the existing work efficiency of 2 people * 3 hours * N days to 1 person * 5 minutes, which shows that the work efficiency is improved by 99.8%.

[0142] The method provided in the embodiments of the present application can prevent yield loss, for example, 100K production capacity protects 500+ batches of important products for product yield quality protection, and 10000+ batches of general products for product yield quality protection.

[0143] The device or apparatus provided in the embodiments of the present application will be described below. The explanations or examples of the same or corresponding technical features described in the above method will not be repeated.

[0144] Referring to Figure 8 The processing control device for semiconductor products provided in the embodiments of the present application includes a memory 620 and a processor 600. The memory 620 is used to store program instructions, and the processor 600 is used to call the program instructions stored in the memory 620 and execute the program according to the obtained program:

[0145] By monitoring the in-process products currently in the semiconductor product processing path and executing the semiconductor product processing flow, it is determined whether the preset conditions for cutting the in-process products into the pre-set protection path to execute the product protection flow are met.

[0146] When there are in-process products that meet the preset conditions, the in-process products that meet the preset conditions are controlled to enter the preset protection path, and the preset product protection process is executed for the products that enter the protection path.

[0147] In some implementations, the preset conditions include one or a combination of the following conditions:

[0148] For any process segment in the semiconductor product manufacturing process, the next station of that process segment is abnormal;

[0149] For any station in any process segment of the semiconductor product manufacturing process, the next station is abnormal;

[0150] For any work-in-process product at any station in any process segment of the semiconductor product manufacturing process, the remaining processing time of the work-in-process product in that process segment does not meet the preset requirements.

[0151] In some embodiments, the remaining processing time of the work-in-process product in this process segment does not meet a preset requirement, including:

[0152] The remaining processing time of the product in the process segment is less than the preset allowable time of the process segment.

[0153] In some implementations, controlling in-process products that meet the preset conditions to enter a pre-set protection path includes:

[0154] For the in-process product at the last station in any process segment of the semiconductor product manufacturing process, if the next station in that process segment experiences an anomaly, the in-process product at that last station is controlled to enter a pre-set protection path; and / or,

[0155] For a work-in-process product at any station in any process segment of the semiconductor product manufacturing process, if the next station at that station malfunctions, the work-in-process product is controlled to enter a pre-set protection path; and / or,

[0156] For any work-in-process product at any station in any process segment of the semiconductor product manufacturing process, when the remaining processing time of the work-in-process product in that process segment does not meet the preset requirements, the work-in-process product is controlled to enter a preset protection path.

[0157] In some implementations, executing a pre-set product protection process for products entering the protection path includes:

[0158] The product protection operation is performed on the product entering the protection path according to a preset product protection priority.

[0159] In some embodiments, the preset product protection procedure performed on the product entering the protection path comprises:

[0160] The product protection operation is performed on the product entering the protection path periodically according to a preset product protection execution period.

[0161] In some embodiments, the preset product protection procedure performed on the product entering the protection path comprises:

[0162] The product protection operation is performed on the product entering the protection path periodically according to a preset product protection priority and a product protection execution period; wherein different kinds of products correspond to different product protection priorities, and when the product protection execution periods of multiple kinds of products are the same, the product protection operation is performed periodically on different products with the same product protection execution period according to the product protection priority.

[0163] In some embodiments, the product protection comprises: oxidation protection of the product.

[0164] In some embodiments, the processor 600 is further configured to invoke program instructions stored in the memory 620 to perform the following according to the obtained program:

[0165] When the product in the protection procedure satisfies a preset release condition, the product satisfying the release condition is controlled to return to the semiconductor product processing path to continue the semiconductor product processing procedure.

[0166] In some embodiments, the release condition comprises one or a combination of the following conditions:

[0167] For the product in the protection procedure, the product returns to normal at a subsequent station of a cut-out station when the product is cut out from the semiconductor product processing path;

[0168] For the product in the protection procedure, the product is in an idle state at a subsequent station of a cut-out station in a process section to which the product belongs in the semiconductor product processing procedure when the product is cut out from the semiconductor product processing path.

[0169] In some embodiments, the control of the product satisfying the release condition to return to the semiconductor product processing path to continue the semiconductor product processing procedure comprises:

[0170] The control satisfies the release condition of the product back to the next station of the cutting-out station when the product is cut out from the semiconductor product processing path, and performs the processing flow of the next station and the subsequent station of the cutting-out station, wherein the remaining tolerance time of the product is re-counted from the next station of the cutting-out station.

[0171] In some embodiments, the processor 600 is further configured to invoke the program instructions stored in the memory 620 to perform the following according to the obtained program execution:

[0172] The protection flow is monitored, and when an exception occurs, an alarm information is sent out.

[0173] In some embodiments, when there is a product in process satisfying the preset condition, a mark is set for the product satisfying the preset condition, and the product provided with the mark is controlled to enter a pre-set protection path.

[0174] In some embodiments, the processing control device further comprises a transceiver 610 configured to receive and send data under the control of the processor 600.

[0175] It should be noted that the processing control device in the embodiments of the present application and the devices in the processing path and the protection path described above can be connected through wired and / or wireless means to realize the corresponding control functions described above.

[0176] In the above embodiments, the processing control device can be connected to the devices in the processing path and the protection path through wired and / or wireless means to realize the corresponding control functions described above. Figure 8 The bus architecture can include any number of interconnecting buses and bridges, and the various circuitry representative of the processor(s) 600 and the memory 620 that are linked together by the bus architecture can be implemented as various combinations of processors, controllers, buffers, memories, etc., all of which are well known in the art, and thus, will not be described in further detail herein. The bus interface provides an interface to the transceiver 610. The transceiver 610 can be a plurality of elements including a transmitter and a receiver, and provides a means for communicating with various other apparatus over a transmission medium.

[0177] In some embodiments, the processing control device further comprises a user interface 630, which can be an interface capable of external and internal connection of required devices, and the connected devices include but are not limited to a keypad, a display, a speaker, a microphone, a joystick, etc.

[0178] The processor 600 is responsible for managing the bus architecture and general processing, and the memory 620 can store data used by the processor 600 in performing operations.

[0179] In some embodiments, the processor 600 can be a CPU (Central Processor Unit), an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), or a CPLD (Complex Programmable Logic Device).

[0180] Referring to Figure 9 The processing control device for semiconductor products provided in the embodiments of the present application can include a user terminal, a database, a monitoring agent, and the like.

[0181] The user terminal outputs a user interface, and the user sets the standardized data through the output user interface and stores the data in the database. The monitoring agent executes the control method according to the set data in the database, and the specific implementation is not described herein.

[0182] Referring to Figure 10 The processing control device for semiconductor products provided in the embodiments of the present application can include a user terminal, a database, a monitoring agent, and the like.

[0183] The first unit 11 is configured to monitor a work-in-process product currently in a semiconductor product processing path and executing a semiconductor product processing flow, and determine whether a preset condition for cutting the work-in-process product into a preset protection path to execute a product protection flow is met.

[0184] The second unit 12 is configured to, when there is a work-in-process product meeting the preset condition, control the work-in-process product meeting the preset condition to enter the preset protection path, and execute the preset product protection flow for the product entering the protection path.

[0185] In some embodiments, the second unit 12 is further configured to:

[0186] When the product in the protection flow meets a preset release condition, the second unit 12 is configured to control the product meeting the release condition to return to the semiconductor product processing path and continue to execute the semiconductor product processing flow.

[0187] In some embodiments, the second unit 12 is further configured to:

[0188] The second unit 12 is further configured to monitor the protection flow, and when an exception occurs, send an alarm information.

[0189] The optional specific implementation of the above units is described in the method embodiments, and is not described herein.

[0190] It should be noted that the division of the unit in the embodiments of the present application is illustrative, and is only a logical function division. In actual implementation, another division manner can be used. In addition, each functional unit in each embodiment of the present application can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.

[0191] When the integrated unit is realized in the form of a software functional unit and sold or used as an independent product, the integrated unit can be stored in a computer readable storage medium. Based on this understanding, the technical solutions of the present application essentially or the part that contributes to the prior art or the whole or part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium, and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor to perform all or part of the steps of the methods described in each embodiment of the present application. The foregoing storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and various media that can store program codes.

[0192] Referring to Figure 11 The semiconductor product processing equipment provided in the embodiments of the present application includes a semiconductor product processing path and a protection path, and a processing control device connected with the semiconductor product processing path and the protection path respectively (wired and / or wireless connection). The semiconductor product processing path includes at least one machine table for processing semiconductor products, and the protection path includes at least one device (for example, a nitrogen filling device) for protecting semiconductor products.

[0193] The embodiments of the present application provide a computing device, which can be a desktop computer, a portable computer, a smart phone, a tablet computer, a personal digital assistant (PDA), etc. The computing device can include a central processing unit (CPU), a memory, an input / output device, etc. The input device can include a keyboard, a mouse, a touch screen, etc. The output device can include a display device, such as a liquid crystal display (LCD), a cathode ray tube (CRT), etc.

[0194] The memory can include read-only memory (ROM) and random access memory (RAM), and provide the processor with program instructions and data stored in the memory. In the embodiments of the present application, the memory can be used to store the programs of any of the methods provided by the embodiments of the present application.

[0195] The processor calls the program instructions stored in the memory, and the processor is used to execute any of the methods provided by the embodiments of the present application according to the obtained program instructions.

[0196] The embodiments of the present application also provide a computer program product or computer program, which includes computer instructions stored in a computer readable storage medium. The processor of the computer device reads the computer instructions from the computer readable storage medium, and the processor executes the computer instructions, so that the computer device executes any of the methods in the above embodiments. The program product can adopt any combination of one or more readable media. The readable medium can be a readable signal medium or a readable storage medium. The readable storage medium may, for example, be but is not limited to an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or apparatus, or any combination of the above. More specific examples (non-exhaustive list) of the readable storage medium include an electrical connection having one or more wires, a portable disc, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above.

[0197] The embodiments of the present application provide a computer readable storage medium for storing computer program instructions for the device provided by the above embodiments of the present application, which contains programs for executing any of the methods provided by the above embodiments of the present application. The computer readable storage medium can be a non-transitory computer readable medium.

[0198] The computer readable storage medium can be any available medium or data storage device that can be accessed by a computer, including but not limited to a magnetic storage (such as a floppy disk, a hard disk, a magnetic tape, a magneto-optical disk (MO) and the like), an optical storage (such as a CD, a DVD, a BD, a HVD and the like), and a semiconductor storage (such as a ROM, an EPROM, an EEPROM, a non-volatile memory (NAND FLASH), a solid state disk (SSD)) and the like.

[0199] It should be understood that:

[0200] The access technology via which the entities in the communication network communicate traffic to and from each other can be any suitable current or future technology, such as WLAN (Wireless Local Access Network), WiMAX (Worldwide Interoperability for Microwave Access), LTE, LTE-A, 5G, Bluetooth, infrared, etc. can be used; furthermore, embodiments can also apply to wired technologies, e.g. IP-based access technologies like wireline networks or fixed lines.

[0201] Embodiments which are suitable to be implemented as software code or parts thereof and to be run using a processor or processing means are independent of the software code and can be specified using any known or future developed programming language, such as a high-level programming language, such as objective-C, C, C++, C#, Java, Python, Javascript, other scripting languages, etc., or a low-level programming language, such as a machine language or assembler.

[0202] Embodiments are independent of hardware and can be implemented using any known or future developed hardware technology or any hybrid of these, such as microprocessors or CPUs (Central Processing Units), MOS (Metal Oxide Semiconductor), CMOS (Complementary MOS), BiMOS (Bipolar MOS), BiCMOS (Bipolar CMOS), ECL (Emitter Coupled Logic) and / or TTL (Transistor-Transistor Logic).

[0203] Embodiments can be implemented as individual devices, units, means, components or functions, or in a distributed way, e.g. using or sharing one or more processors or processing means in processing, or using and sharing one or more processing segments or processing portions in processing, wherein one physical processor or more than one physical processor can be used for implementing one or more processing portions dedicated to specific processing as described.

[0204] The means can be implemented by a semiconductor chip, a chipset, or a (hardware) module including such chip or chipset.

[0205] Embodiments can also be implemented as any combination of hardware and software, such as an ASIC (Application Specific IC (Integrated Circuit)) component, a FPGA (Field-Programmable Gate Array) or CPLD (Complex Programmable Logic Device) component or a DSP (Digital Signal Processor) component.

[0206] Embodiments can also be implemented as a computer program product comprising a computer-readable storage medium having computer-readable program code embodied therein, said computer-readable program code adapted to carry out processes as described in embodiments, wherein the computer-readable storage medium can be a non-transitory medium.

[0207] Those skilled in the art will appreciate that embodiments of the present application can be readily used as software, hardware, or a combination of software and hardware. In one embodiment, the present application can be implemented in software and can be stored on a computer readable medium, which can include random access memory (RAM), read only memory (ROM), magnetic disk or optical disk, or the like. The software implementation of the present application files can further be transmitted or received over a modem or network connection.

[0208] The embodiments of methods, apparatuses (systems) and computer program products according to the present application can be described below with reference to flowcharts and / or block diagrams illustrating the principle of the present application. It is understood by those skilled in the art that each flow and / or block in the flowcharts and / or block diagrams, as well as a combination of flows and / or blocks in the flowcharts and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general purpose computer, a special purpose computer, an embedded processor, or other programmable data processing apparatus to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing apparatus generate a means for implementing the functions specified in the flowcharts and / or block diagrams. Figure 1 one or more flows and / or blocks Figure 1 an apparatus for performing the functions specified in the flowcharts and / or block diagrams.

[0209] These computer program instructions can also be stored in a computer readable memory that can direct a computer or other programmable data processing apparatus to work in a specific manner, so that the instructions stored in the computer readable memory produce a manufacture product including instruction apparatus, which implements the functions specified in the flowcharts and / or block diagrams. Figure 1 one or more flows and / or blocks Figure 1 an apparatus for performing the functions specified in the flowcharts and / or block diagrams.

[0210] These computer program instructions can also be loaded onto a computer or other programmable data processing apparatus, so that a series of operation steps are performed on the computer or other programmable data processing apparatus to produce a computer implemented process, so that the instructions executed on the computer or other programmable data processing apparatus provide a means for implementing the functions specified in the flowcharts and / or block diagrams. Figure 1 one or more flows and / or blocks Figure 1 an apparatus for performing the functions specified in the flowcharts and / or block diagrams.

[0211] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A method of processing control of a semiconductor product, characterized by, The method comprises: By monitoring the in-process products currently in the semiconductor product processing path and performing the semiconductor product processing flow, it is determined whether a preset condition for cutting the in-process products into a preset protection path to perform a product protection flow is met; the preset condition comprises one or a combination of the following conditions: for any process section in the semiconductor product processing flow, the next station of the process section is abnormal; for any station in any process section in the semiconductor product processing flow, the next station of the station is abnormal; for the in-process product of any station in any process section in the semiconductor product processing flow, the remaining processing time of the in-process product in the process section does not meet a preset requirement; When there is an in-process product that meets the preset condition, the in-process product that meets the preset condition is controlled to enter a preset protection path, and a preset product protection flow is performed for the product entering the protection path.

2. The method of claim 1, wherein, The remaining processing time of the in-process product in the process section does not meet the preset requirement, comprising: The proportion of the remaining processing time of the in-process product in the process section to the preset allowable time of the process section is less than a preset threshold.

3. The method of claim 1, wherein, Controlling the in-process product that meets the preset condition to enter a preset protection path, comprising: For the in-process product of the last station in any process section in the semiconductor product processing flow, when the next station of the process section is abnormal, the in-process product of the last station is controlled to enter a preset protection path; and / or, For the in-process product of any station in any process section in the semiconductor product processing flow, when the next station of the station is abnormal, the in-process product is controlled to enter a preset protection path; and / or, For the in-process product of any station in any process section in the semiconductor product processing flow, when the remaining processing time of the in-process product in the process section does not meet a preset requirement, the in-process product is controlled to enter a preset protection path.

4. The method of claim 1, wherein, The preset product protection flow is performed for the product entering the protection path, comprising: For the product entering the protection path, product protection operations are performed according to a preset product protection priority.

5. The method of claim 1, wherein, The preset product protection flow is performed for the product entering the protection path, comprising: For the product entering the protection path, product protection operations are periodically performed according to a preset product protection execution cycle.

6. The method of claim 1, wherein, The preset product protection flow is performed for the product entering the protection path, comprising: For the product entering the protection path, product protection operations are periodically performed according to a preset product protection priority and a product protection execution cycle; wherein different kinds of products correspond to different product protection priorities, and when the product protection execution cycles of multiple kinds of products are the same, for different products with the same execution cycle, product protection operations are periodically performed according to the product protection priority.

7. The method of claim 1, wherein, The product protection comprises oxidation protection of the product.

8. The method of claim 1, wherein, The method further comprises: When the product in the protection procedure meets the preset release condition, the product meeting the release condition is controlled to return to the semiconductor product processing path to continue the semiconductor product processing procedure.

9. The method of claim 8, wherein, The release condition includes one or a combination of the following conditions: For the product in the protection procedure, the subsequent station of the cut-out station when the product is cut out from the semiconductor product processing path resumes normal operation; For the product in the protection procedure, the subsequent station of the cut-out station when the product is cut out from the semiconductor product processing path is in an idle state in the process section to which the product belongs in the semiconductor product processing procedure.

10. The method of claim 8, wherein, The control of the product meeting the release condition to return to the semiconductor product processing path to continue the semiconductor product processing procedure includes: The control of the product meeting the release condition to return to the next station of the cut-out station when the product is cut out from the semiconductor product processing path, and to execute the processing procedure of the next station and the subsequent stations of the cut-out station, wherein the remaining allowable time of the product is re-counted from the next station of the cut-out station.

11. The method of claim 1, wherein, The method further includes: Monitoring the protection procedure, and issuing an alarm when an abnormality occurs.

12. The method of claim 1, wherein, When there is a product in process meeting the preset condition, the product meeting the preset condition is marked, and the product provided with the mark is controlled to enter a preset protection path.

13. A semiconductor product processing control device, characterized in that, It includes: A memory for storing program instructions; A processor for calling the program instructions stored in the memory, and executing the method according to any one of claims 1 to 12.

14. A semiconductor product processing apparatus characterized by comprising: It includes a semiconductor product processing path and a protection path, and a processing control device as claimed in claim 13 connected to the semiconductor product processing path and the protection path respectively; wherein the semiconductor product processing path includes at least one machine table for processing semiconductor products, and the protection path includes at least one device for protecting semiconductor products.

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