Wiring adjustment method and device

Abstract

The present invention provides a wiring adjustment method and device, wherein the method includes: obtaining a high-speed differential signal line that intersects with a via area in a printed circuit board design drawing, and determining an isolation disk that intersects with the high-speed differential signal line; determining the tangent between the high-speed differential signal line and the isolation disk and the tangent point coordinates between the via area and the isolation disk; based on the tangent and tangent point coordinates, adjusting the high-speed differential signal line in the via area so that the high-speed differential signal line does not intersect with the isolation disk when passing through the via area. The wiring adjustment method and device provided by the present invention, by determining the tangent between the high-speed differential signal line and the isolation disk and the tangent point coordinates between the via area and the isolation disk, allows the high-speed differential signal line to be routed close to the isolation disk in the via area when passing through the via area, and does not intersect with the isolation disk, thereby ensuring the communication quality of the high-speed differential signal line, realizing automatic adjustment of the wiring in the via area, and improving the wiring adjustment efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit boards, and in particular to a wiring adjustment method and device. Background Art

[0002] There are many signal vias on existing PCBs (Printed Circuit Boards). The space in this area is relatively narrow. When high-speed differential signal lines pass through this area, they are more likely to cross the reference layer of the isolation disk anti-pad. It is necessary to manually adjust the line spacing to ensure that the high-speed differential signal lines do not cross the anti-pad. Otherwise, the reference layer will be discontinuous and the impedance will change suddenly, which will seriously affect the impedance size and thus affect the signal quality.

[0003] Existingly, when high-speed differential signal lines pass through an isolation disk, it is necessary to manually reduce the line spacing of the high-speed differential signal lines to ensure that they do not cross the reference layer of the isolation disk. The manual adjustment method makes the design inefficient and increases the time cost of the design. Summary of the invention

[0004] The present invention provides a wiring adjustment method and device to solve the problem in the prior art that when a high-speed differential signal line passes through an isolation disk, the line spacing of the high-speed differential signal line needs to be manually reduced to ensure that it does not cross a reference layer. The manual adjustment method makes the design efficiency low and increases the time cost of the design.

[0005] The present invention provides a wiring adjustment method, comprising:

[0006] Obtaining a high-speed differential signal line intersecting with a via area in a printed circuit board design drawing, and determining an isolation plate intersecting with the high-speed differential signal line;

[0007] Determining a tangent line between the high-speed differential signal line and the isolation disk based on the line width of the high-speed differential signal line, the width of the via area, the radius of the isolation disk, and the differential via coordinates of the isolation disk;

[0008] Determining the coordinates of the tangent point between the via area and the isolation disk based on the radius of the isolation disk and the differential via coordinates of the isolation disk;

[0009] Based on the tangent line and the tangent point coordinates, the high-speed differential signal line in the via region is adjusted so that the high-speed differential signal line does not intersect the isolation plate when passing through the via region.

[0010] According to a wiring adjustment method provided by the present invention, based on the tangent line and the tangent point coordinates, the high-speed differential signal line in the via area is adjusted, comprising:

[0011] Based on the tangent line and the tangent point coordinates, determining a plurality of key coordinates where the high-speed differential signal line is tangent to the isolation disk in the via region when passing through the via region;

[0012] Based on the multiple key coordinates, a routing of the high-speed differential signal line passing through the via area is determined, and the high-speed differential signal line in the via area is adjusted based on the routing.

[0013] According to a wiring adjustment method provided by the present invention, a high-speed differential signal line intersecting with a via area in a printed circuit board design drawing is obtained, comprising:

[0014] Based on the width of the via area and the line width of the high-speed differential signal line, a high-speed differential signal line intersecting with the via area in the printed circuit board design drawing is determined.

[0015] According to a wiring adjustment method provided by the present invention, based on the width of the via area and the line width of the high-speed differential signal line, a high-speed differential signal line intersecting with the via area in a printed circuit board design drawing is determined, comprising:

[0016] In the case where the line width of the high-speed differential signal line is greater than the width of the via region, the high-speed differential signal line is determined to be a high-speed differential signal line intersecting with the via region in the printed circuit board design drawing.

[0017] According to a wiring adjustment method provided by the present invention, after determining the tangent line between the high-speed differential signal line and the isolation plate, the method further comprises:

[0018] The angle between the high-speed differential signal line and the tangent line of the isolation plate is determined to be 45 degrees.

[0019] According to a wiring adjustment method provided by the present invention, based on the tangent line and the tangent point coordinates, the high-speed differential signal line in the via area is adjusted, comprising:

[0020] Based on the tangent line and the tangent point coordinates, a skill tool command for adjusting the high-speed differential signal line in the via area is generated;

[0021] Based on the skill tool command, the high-speed differential signal line in the via area is adjusted.

[0022] The present invention also provides a wiring adjustment device, comprising:

[0023] A screening module, used to obtain high-speed differential signal lines intersecting with the via area in the printed circuit board design drawing, and determine the isolation disk intersecting with the high-speed differential signal lines;

[0024] A tangent determination module, configured to determine a tangent between the high-speed differential signal line and the isolation disk based on the line width of the high-speed differential signal line, the width of the via area, the radius of the isolation disk, and the differential via coordinates of the isolation disk;

[0025] A tangent point coordinate determination module, used to determine the tangent point coordinates between the via area and the isolation disk based on the radius of the isolation disk and the differential via coordinates of the isolation disk;

[0026] An adjustment module is used to adjust the high-speed differential signal line in the via area based on the tangent line and the tangent point coordinates so that the high-speed differential signal line does not intersect the isolation disk when passing through the via area.

[0027] The present invention also provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements any of the above wiring adjustment methods when executing the computer program.

[0028] The present invention also provides a non-transitory computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, any of the wiring adjustment methods described above is implemented.

[0029] The present invention also provides a computer program product, comprising a computer program, wherein when the computer program is executed by a processor, the wiring adjustment method described above is implemented.

[0030] The wiring adjustment method and device provided by the present invention obtain the high-speed differential signal line intersecting with the via area, and determine the tangent line between the high-speed differential signal line and the isolation disk, as well as the tangent point coordinates between the via area and the isolation disk based on the line width of the high-speed differential signal line, the width of the via area, the radius of the isolation disk and the differential via coordinates of the isolation disk. When the high-speed differential signal line passes through the via area, it is routed along the isolation disk in the via area and does not intersect with the isolation disk, thereby ensuring the communication quality of the high-speed differential signal line, realizing automatic adjustment of the wiring in the via area, and improving the wiring adjustment efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 It is a flow chart of the wiring adjustment method provided by the present invention;

[0033] Figure 2 It is a schematic diagram of determining key coordinates provided by the present invention;

[0034] Figure 3 It is a structural schematic diagram of the wiring adjustment device provided by the present invention;

[0035] Figure 4 It is a structural schematic diagram of the electronic device provided by the present invention. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] The present invention provides a wiring adjustment method. Figure 1 This is a flow chart of the wiring adjustment method provided by the present invention. Figure 1 , the wiring adjustment method provided by the present invention may include:

[0038] Step 110, obtaining a high-speed differential signal line intersecting with a reference layer in a via area in a printed circuit board design drawing, and determining a differential via intersecting with the high-speed differential signal line;

[0039] Step 120, determining a tangent line between the high-speed differential signal line and the differential via based on the width of the via area of ​​the differential via, the radius of the isolation plate of the differential via, the coordinates of the differential via, and the line width of the high-speed differential signal line;

[0040] Step 130, determining a tangent point between the via region and the differential via based on the width of the via region, the radius of the differential via, and the coordinates of the differential via;

[0041] Step 140: Adjust the high-speed differential signal line in the via region based on the tangent line and the tangent point, so that the high-speed differential signal line does not intersect with the reference layer of the via region when passing through the via region.

[0042] The execution subject of the wiring adjustment method provided by the present invention can be an electronic device, a component in an electronic device, an integrated circuit, or a chip. The electronic device can be a mobile electronic device or a non-mobile electronic device. Exemplarily, the mobile electronic device can be a mobile phone, a tablet computer, a laptop computer, a PDA, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc., and the non-mobile electronic device can be a server, a network attached storage (NAS), or a personal computer (PC), etc., which is not specifically limited by the present invention.

[0043] The following takes the wiring adjustment method provided by the present invention executed by a computer as an example to describe the technical solution of the present invention in detail.

[0044] In step 110, a high-speed differential signal line intersecting with a via area in a printed circuit board design drawing is obtained, and an isolation plate intersecting with the high-speed differential signal line is determined.

[0045] The printed circuit board PCB consists of an insulating base plate, connecting wires and pads for assembling and welding electronic components. It has the dual functions of a conductive circuit and an insulating base plate. It can replace complex wiring to achieve electrical connections between components in the circuit, which not only simplifies the assembly and welding of electronic products, reduces the wiring workload under traditional methods, and greatly reduces the labor intensity of workers; it also reduces the size of the whole machine, reduces product costs, and improves the quality and reliability of electronic equipment. The printed circuit board has good product consistency. It can adopt standardized design, which is conducive to mechanization and automation in the production process. At the same time, the entire assembled and debugged printed circuit board can be used as an independent spare part, which is convenient for the interchange and maintenance of the whole product.

[0046] When designing PCB, there are many signal vias on the PCB board. The space in this area is relatively narrow. When the high-speed differential signal line passes through this area, it is easy to cross the anti-pad isolation disk. It is necessary to manually adjust the line spacing to ensure that the high-speed differential signal line does not cross the isolation disk, otherwise it will cause the reference layer to be discontinuous and the impedance to suddenly change, which will seriously affect the impedance size and thus affect the signal quality. Therefore, when determining that the high-speed differential signal line passes through the via area, it is necessary to adjust the high-speed differential signal line so that the high-speed differential signal line does not overlap with the reference layer of the isolation disk to avoid affecting the signal in the high-speed differential signal line.

[0047] Get the high-speed differential line that intersects the reference layer of the via area in the drawn printed circuit board design. Intersecting the reference layer of the via area means that the line width of the high-speed differential line is greater than the width of the via area, so that when the high-speed differential line passes through the via area, it intersects with the isolation plate in the via area.

[0048] After obtaining a high-speed differential line intersecting with a reference layer of a via region in a design drawing of a printed circuit board, an isolation pad intersecting with the high-speed differential line is determined.

[0049] In step 120, a tangent line between the high-speed differential signal line and the isolation disk is determined based on the line width of the high-speed differential signal line, the width of the via region, the radius of the isolation disk, and the differential via coordinates of the isolation disk.

[0050] Impedance is an important characteristic in high-speed transmission lines. High-speed differential signal lines require a complete reference layer. Discontinuous or disconnected reference layers will seriously affect the continuity and size of impedance. Impedance discontinuity will cause reflections to high-speed signals and affect signal quality. It is crucial to design a complete reference plane to ensure impedance continuity.

[0051] When determining that the high-speed differential signal line passes through the via area and intersects with the isolation plate, it is determined that the high-speed differential signal line crosses the reference layer. It is necessary to adjust the high-speed differential signal line so that the high-speed differential signal line does not overlap with the isolation plate to avoid affecting the signal in the high-speed differential signal line.

[0052] The high-speed differential signal line can be made tangent to the isolation disk of the via area so that the high-speed differential signal line does not intersect with the isolation disk of the differential via and the high-speed differential signal line can pass through the via area while ensuring the width of the high-speed differential signal line.

[0053] Based on the line width of the high-speed differential signal line, the width of the via area, the radius of the isolation disk and the differential via coordinates of the isolation disk, a tangent line between the high-speed differential signal line and the isolation disk is determined.

[0054] Optionally, the differential via coordinates (x1, y1) and (x2, y2) of the isolation disk are obtained respectively, the radius size of the isolation disk in the via area is b, and the distance between the two vias is set itself, assumed to be a, a=x2-x1.

[0055] When a group of high-speed differential signal lines with a line width of d pass through the via area, in order to ensure impedance continuity, the line width needs to be fine-tuned and reduced to pass through the via area. Based on the determined line width of the high-speed differential signal line, the width of the via area, the radius of the isolation disk, and the differential via coordinates of the isolation disk, the tangent line between the high-speed differential signal line and the isolation pad can be calculated.

[0056] In step 130, the coordinates of the tangent point between the via region and the isolation disk are determined based on the width of the via region, the radius of the isolation disk and the differential via coordinates of the isolation disk.

[0057] The via area is the area between two pads. When determining that the high-speed differential signal line passes through the via area, the high-speed differential signal line intersects with the isolation disk. The coordinates of the tangent point between the via area and the isolation disk can be determined so that the high-speed differential signal line passes through the via area along the tangent line of the isolation disk.

[0058] The tangent point between the via region and the isolation disk may be determined based on the radius of the isolation disk, the differential via coordinates of the isolation disk, and the radius of the isolation disk to determine the tangent point coordinates between the via region and the isolation disk.

[0059] For example, after obtaining the differential via coordinates (x1, y1) and (x2, y2) of the isolation disk respectively, the radius size of the isolation disk in the via area is b, the coordinates of the intersection point between the via area and the isolation disk can be determined as (x1+b, y1) and (x2-b, y2).

[0060] It can be understood that by controlling the high-speed differential signal line to be routed along the determined tangent point between the via area and the isolation disk, the high-speed differential signal line can be routed in the via area in a manner that the high-speed differential signal line is tangent to the isolation disk at the center of the via area, thereby completing the routing of the high-speed differential signal line in the via area. This ensures that the high-speed differential line does not intersect the isolation disk and maximizes the line width of the high-speed differential line across the via area, thereby ensuring the transmission of subsequent signals of the high-speed differential signal line.

[0061] In step 140, based on the tangent line and the tangent point coordinates, the high-speed differential signal line in the via region is adjusted so that the high-speed differential signal line does not intersect the isolation plate when passing through the via region.

[0062] After determining the tangent line between the high-speed differential signal line and the isolation disk, and the tangent point coordinates between the via area and the isolation disk, the high-speed differential signal line is adjusted so that the high-speed differential signal line is routed along the tangent line between the high-speed differential signal line and the isolation disk, and the routing line that passes through the tangent point coordinates between the via area and the isolation disk, so that when the high-speed differential signal line passes through the via area, it is routed close to the isolation disk in the via area and does not intersect with the isolation disk.

[0063] The wiring adjustment method provided by the embodiment of the present invention obtains the high-speed differential signal line intersecting with the via area, and determines the tangent line between the high-speed differential signal line and the isolation disk, as well as the tangent point coordinates between the via area and the isolation disk based on the line width of the high-speed differential signal line, the width of the via area, the radius of the isolation disk, and the differential via coordinates of the isolation disk. When the high-speed differential signal line passes through the via area, it is routed along the isolation disk in the via area and does not intersect with the isolation disk, thereby ensuring the communication quality of the high-speed differential signal line, realizing automatic adjustment of the wiring of the via area, and improving the wiring adjustment efficiency.

[0064] In one embodiment, based on the tangent and the tangent point coordinates, the high-speed differential signal line in the via area is adjusted, including: based on the tangent and the tangent point coordinates, determining a plurality of key coordinates at which the high-speed differential signal line is tangent to the isolation disk in the via area when passing through the via area; based on the plurality of key coordinates, determining the routing of the high-speed differential signal line passing through the via area, and adjusting the high-speed differential signal line in the via area based on the routing.

[0065] After obtaining the tangent line between the high-speed differential signal line and the isolation disk and the tangent point coordinates between the via area and the isolation disk, multiple key coordinates where the high-speed differential signal line is tangent to the isolation disk in the via area when passing through the via area are determined based on the tangent line and tangent point coordinates.

[0066] Optionally, multiple key coordinates can be determined as follows Figure 2 As shown in the schematic diagram of key coordinate determination provided by the present invention, the differential via coordinates (x1, y1) and (x2, y2) of the isolation disk are obtained respectively, the radius size of the isolation disk in the via area is b, and the distance between the two vias is set itself, assumed to be a, a=x2-x1.

[0067] When a group of high-speed differential signal lines with a line width of d pass through the via area, in order to ensure impedance continuity, the line width needs to be fine-tuned and reduced to pass through the via area.

[0068] Since the radius size of the isolation disk in the via region is b, the coordinates of the tangent points between the via region and the isolation disk can be determined as (x1+b, y1) and (x2-b, y2).

[0069] After determining the coordinates of the tangent line between the high-speed differential signal line and the isolation disk and the tangent point between the via area and the isolation disk, it is possible to further determine that when the high-speed differential signal line passes through the via area, multiple key coordinates tangent to the isolation disk in the via area are: (x11, y11), (x11, y13), (x12, y12), (x12, y14; (x21, y11), (x21, y13), (x22, y12), (x22, y14).

[0070] High-speed differential signal lines can be passed through at a 45-degree angle, and the triangular area can be used to prove that Figure 2 The α angle is 45°, from which we can calculate:

[0071] x11=x1+b;

[0072] y11=y1+(b*tan22.5°);

[0073] y13=y1-(b*tan22.5°);

[0074] x21=x2-b;

[0075] It can be calculated that:

[0076] k=x11-{(ad) / 2}, and from the isosceles triangle we can also conclude that J=k.

[0077] y12=y11+J;

[0078] x12=x1+{(ad) / 2};

[0079] x22=x2-{(ad) / 2};

[0080] y14=y13-J;

[0081] The specific coordinate values ​​of the six key coordinates can be obtained above, and the routing of the high-speed differential signal line passing through the via area can be obtained by connecting them in sequence with straight lines, and the high-speed differential signal line in the via area can be adjusted based on the routing.

[0082] The wiring adjustment method provided by an embodiment of the present invention obtains the tangent line between the high-speed differential signal line and the isolation disk and the tangent point coordinates between the via area and the isolation disk, and then determines multiple key coordinates of the high-speed differential signal line that are tangent to the isolation disk in the via area when the high-speed differential signal line passes through the via area based on the tangent line and the tangent point coordinates, thereby realizing the determination of the routing of the high-speed differential signal line passing through the via area.

[0083] In one embodiment, obtaining a high-speed differential signal line intersecting with a via area in a printed circuit board design drawing includes: determining the high-speed differential signal line intersecting with the via area in the printed circuit board design drawing based on the width of the via area and the line width of the high-speed differential signal line.

[0084] After the printed circuit board design drawing is determined, the high-speed differential signal lines intersecting with the via area in the printed circuit board design drawing need to be determined first, so that the high-speed differential signal lines intersecting with the via area can be adjusted later.

[0085] Based on the width of the via area and the width of the high-speed differential signal line, all high-speed differential signal lines in the printed circuit board design are judged to determine the high-speed differential signal lines in the printed circuit board design that intersect with the via area.

[0086] The wiring adjustment method provided in the embodiment of the present invention determines all high-speed differential signal lines in the printed circuit board design drawing based on the width of the via area and the width of the high-speed differential signal line, thereby realizing the determination of the high-speed differential signal lines intersecting with the via area in the printed circuit board design drawing, and providing a basis for the subsequent adjustment of the determined high-speed differential signal lines.

[0087] In one embodiment, based on the width of the via area and the line width of the high-speed differential signal line, the high-speed differential signal line that intersects with the via area in the printed circuit board design drawing is determined, including: when the line width of the high-speed differential signal line is greater than the width of the via area, determining that the high-speed differential signal line is the high-speed differential signal line that intersects with the via area in the printed circuit board design drawing.

[0088] In the process of judging all high-speed differential signal lines in the printed circuit board design drawing based on the width of the via area and the width of the high-speed differential signal line, based on obtaining the high-speed differential signal line in the printed circuit board when the line width is greater than the width of the via area, the obtained high-speed differential signal line is used as the high-speed differential signal line in the printed circuit board that intersects with the via area, thereby realizing the determination of the high-speed differential signal line that intersects with the via area in the printed circuit board design drawing.

[0089] The wiring adjustment method provided in the embodiment of the present invention determines the high-speed differential signal line that intersects the via area in the printed circuit board design drawing by obtaining a high-speed differential signal line whose line width is greater than the width of the via area, and uses the obtained high-speed differential signal line as the high-speed differential signal line that intersects the via area in the printed circuit board, thereby providing a basis for subsequent adjustment of the determined high-speed differential signal line.

[0090] In one embodiment, after determining the tangent line between the high-speed differential signal line and the isolation disk, the method further includes: determining that the angle between the tangent line between the high-speed differential signal line and the isolation disk is 45 degrees.

[0091] When determining that the high-speed differential signal line is tangent to the isolation plate, the angle of the tangent is determined to be 45 degrees.

[0092] Specifically, when determining the tangent between the high-speed differential signal line and the isolation disk based on the line width of the high-speed differential signal line, the width of the via area, the radius of the isolation disk, and the differential via coordinates of the isolation disk, the angle of the tangent can be adjusted to a 45-degree angle where the high-speed differential signal line and the isolation disk are tangent. This can avoid the situation where the high-speed differential signal line cannot pass through the via area due to the angle being too small.

[0093] The wiring adjustment method provided in the embodiment of the present invention provides a basis for the subsequent high-speed differential signal to pass through the via area in a manner that is tangent to the isolation disk by first determining that the high-speed differential signal line is tangent to the isolation disk and the angle of the tangent is 45 degrees.

[0094] In one embodiment, based on the tangent and the tangent point coordinates, the high-speed differential signal line of the via area is adjusted, including: based on the tangent and the tangent point coordinates, generating a skill tool command for adjusting the high-speed differential signal line of the via area; based on the skill tool command, adjusting the high-speed differential signal line of the via area.

[0095] The skill tool is a tool for assisting in the design of PCB drawings. After determining the tangent line between the high-speed differential line and the isolation plate, and the tangent point coordinates between the via area and the isolation plate, the skill tool determines the command code for adjusting the high-speed differential signal line in the via area based on the tangent line and tangent point coordinates.

[0096] Based on the command code of the determined skill tool command, the high-speed differential signal line in the via area can be automatically adjusted.

[0097] The wiring adjustment method provided by an embodiment of the present invention generates a skill tool command for adjusting the high-speed differential signal line in the via area based on the tangent and tangent point coordinates, and adjusts the high-speed differential signal line in the via area based on the skill tool command, thereby realizing automatic adjustment of the high-speed differential signal line in the via area.

[0098] Figure 3 A schematic diagram of the structure of the wiring adjustment device provided by the present invention, such as Figure 3 As shown, the device comprises:

[0099] The screening module 310 is used to obtain the high-speed differential signal lines intersecting with the via area in the printed circuit board design drawing, and determine the isolation plates intersecting with the high-speed differential signal lines.

[0100] The printed circuit board PCB consists of an insulating base plate, connecting wires and pads for assembling and welding electronic components. It has the dual functions of a conductive circuit and an insulating base plate. It can replace complex wiring to achieve electrical connections between components in the circuit, which not only simplifies the assembly and welding of electronic products, reduces the wiring workload under traditional methods, and greatly reduces the labor intensity of workers; it also reduces the size of the whole machine, reduces product costs, and improves the quality and reliability of electronic equipment. The printed circuit board has good product consistency. It can adopt standardized design, which is conducive to mechanization and automation in the production process. At the same time, the entire assembled and debugged printed circuit board can be used as an independent spare part, which is convenient for the interchange and maintenance of the whole product.

[0101] When designing PCB, there are many signal vias on the PCB board. The space in this area is relatively narrow. When the high-speed differential signal line passes through this area, it is easy to cross the anti-pad isolation disk. It is necessary to manually adjust the line spacing to ensure that the high-speed differential signal line does not cross the isolation disk, otherwise it will cause the reference layer to be discontinuous and the impedance to suddenly change, which will seriously affect the impedance size and thus affect the signal quality. Therefore, when determining that the high-speed differential signal line passes through the via area, it is necessary to adjust the high-speed differential signal line so that the high-speed differential signal line does not overlap with the reference layer of the isolation disk to avoid affecting the signal in the high-speed differential signal line.

[0102] Get the high-speed differential line that intersects the reference layer of the via area in the drawn printed circuit board design. Intersecting the reference layer of the via area means that the line width of the high-speed differential line is greater than the width of the via area, so that when the high-speed differential line passes through the via area, it intersects with the isolation plate in the via area.

[0103] After obtaining a high-speed differential line intersecting with a reference layer of a via region in a design drawing of a printed circuit board, an isolation pad intersecting with the high-speed differential line is determined.

[0104] The tangent determination module 320 is used to determine the tangent between the high-speed differential signal line and the isolation disk based on the line width of the high-speed differential signal line, the width of the via area, the radius of the isolation disk and the differential via coordinates of the isolation disk.

[0105] Impedance is an important characteristic in high-speed transmission lines. High-speed differential signal lines require a complete reference layer. Discontinuous or disconnected reference layers will seriously affect the continuity and size of impedance. Impedance discontinuity will cause reflections to high-speed signals and affect signal quality. It is crucial to design a complete reference plane to ensure impedance continuity.

[0106] When determining that the high-speed differential signal line passes through the via area and intersects with the isolation plate, it is determined that the high-speed differential signal line crosses the reference layer. It is necessary to adjust the high-speed differential signal line so that the high-speed differential signal line does not overlap with the isolation plate to avoid affecting the signal in the high-speed differential signal line.

[0107] The high-speed differential signal line can be made tangent to the isolation disk of the via area so that the high-speed differential signal line does not intersect with the isolation disk of the differential via and the high-speed differential signal line can pass through the via area while ensuring the width of the high-speed differential signal line.

[0108] Based on the line width of the high-speed differential signal line, the width of the via area, the radius of the isolation disk and the differential via coordinates of the isolation disk, a tangent line between the high-speed differential signal line and the isolation disk is determined.

[0109] Optionally, the differential via coordinates (x1, y1) and (x2, y2) of the isolation disk are obtained respectively, the radius size of the isolation disk in the via area is b, and the distance between the two vias is set itself, assumed to be a, a=x2-x1.

[0110] When a group of high-speed differential signal lines with a line width of d pass through the via area, in order to ensure impedance continuity, the line width needs to be fine-tuned and reduced to pass through the via area. Based on the determined line width of the high-speed differential signal line, the width of the via area, the radius of the isolation disk, and the differential via coordinates of the isolation disk, the tangent line between the high-speed differential signal line and the isolation pad can be calculated.

[0111] The tangent point coordinate determination module 330 is used to determine the tangent point coordinates between the via region and the isolation disk based on the radius of the isolation disk and the differential via coordinates of the isolation disk.

[0112] The via area is the area between two pads. When determining that the high-speed differential signal line passes through the via area, the high-speed differential signal line intersects with the isolation disk. The coordinates of the tangent point between the via area and the isolation disk can be determined so that the high-speed differential signal line passes through the via area along the tangent line of the isolation disk.

[0113] The tangent point between the via region and the isolation disk may be determined based on the radius of the isolation disk, the differential via coordinates of the isolation disk, and the radius of the isolation disk to determine the tangent point coordinates between the via region and the isolation disk.

[0114] For example, after obtaining the differential via coordinates (x1, y1) and (x2, y2) of the isolation disk respectively, the radius size of the isolation disk in the via area is b, the coordinates of the intersection point between the via area and the isolation disk can be determined as (x1+b, y1) and (x2-b, y2).

[0115] It can be understood that by controlling the high-speed differential signal line to be routed along the determined tangent point between the via area and the isolation disk, the high-speed differential signal line can be routed in the via area in a manner that the high-speed differential signal line is tangent to the isolation disk at the center of the via area, thereby completing the routing of the high-speed differential signal line in the via area. This ensures that the high-speed differential line does not intersect the isolation disk and maximizes the line width of the high-speed differential line across the via area, thereby ensuring the transmission of subsequent signals of the high-speed differential signal line.

[0116] The adjustment module 340 is used to adjust the high-speed differential signal line in the via area based on the tangent line and the tangent point coordinates so that the high-speed differential signal line does not intersect the isolation plate when passing through the via area.

[0117] After determining the tangent line between the high-speed differential signal line and the isolation disk, and the tangent point coordinates between the via area and the isolation disk, the high-speed differential signal line is adjusted so that the high-speed differential signal line is routed along the tangent line between the high-speed differential signal line and the isolation disk, and the routing line that passes through the tangent point coordinates between the via area and the isolation disk, so that when the high-speed differential signal line passes through the via area, it is routed close to the isolation disk in the via area and does not intersect with the isolation disk.

[0118] The wiring adjustment device provided by the embodiment of the present invention obtains the high-speed differential signal line intersecting with the via area, and determines the tangent line between the high-speed differential signal line and the isolation disk, as well as the tangent point coordinates between the via area and the isolation disk based on the line width of the high-speed differential signal line, the width of the via area, the radius of the isolation disk, and the differential via coordinates of the isolation disk. When the high-speed differential signal line passes through the via area, the wiring is close to the isolation disk in the via area and does not intersect with the isolation disk, thereby ensuring the communication quality of the high-speed differential signal line, realizing automatic adjustment of the wiring of the via area, and improving the wiring adjustment efficiency.

[0119] In one embodiment, the adjustment module 340 is specifically used to:

[0120] Adjusting the high-speed differential signal line in the via area based on the tangent line and the tangent point coordinates includes:

[0121] Based on the tangent line and the tangent point coordinates, determining a plurality of key coordinates where the high-speed differential signal line is tangent to the isolation disk in the via region when passing through the via region;

[0122] Based on the multiple key coordinates, a routing of the high-speed differential signal line passing through the via area is determined, and the high-speed differential signal line in the via area is adjusted based on the routing.

[0123] In one embodiment, the screening module 310 is specifically used to:

[0124] Get high-speed differential signal lines that intersect with the via area in the printed circuit board design, including:

[0125] Based on the width of the via area and the line width of the high-speed differential signal line, a high-speed differential signal line intersecting with the via area in the printed circuit board design drawing is determined.

[0126] In one embodiment, the screening module 310 is further specifically configured to:

[0127] Based on the width of the via area and the line width of the high-speed differential signal line, determining the high-speed differential signal line intersecting with the via area in the printed circuit board design drawing includes:

[0128] In the case where the line width of the high-speed differential signal line is greater than the width of the via region, the high-speed differential signal line is determined to be a high-speed differential signal line intersecting with the via region in the printed circuit board design drawing.

[0129] In one embodiment, the tangent determination module 320 is specifically configured to:

[0130] After determining the tangent line between the high-speed differential signal line and the isolation disk, the method further includes:

[0131] The angle between the high-speed differential signal line and the tangent line of the isolation plate is determined to be 45 degrees.

[0132] In one embodiment, the adjustment module 340 is further specifically configured to:

[0133] Adjusting the high-speed differential signal line in the via area based on the tangent line and the tangent point coordinates includes:

[0134] Based on the tangent line and the tangent point coordinates, a skill tool command for adjusting the high-speed differential signal line in the via area is generated;

[0135] Based on the skill tool command, the high-speed differential signal line in the via area is adjusted.

[0136] Figure 4 An example of a physical structure diagram of an electronic device is shown in FIG. Figure 4 As shown, the electronic device may include: a processor 410, a communication interface 420, a memory 430 and a communication bus 440, wherein the processor 410, the communication interface 420 and the memory 430 communicate with each other through the communication bus 440. The processor 410 may call the logic instructions in the memory 430 to execute the wiring adjustment method, which includes:

[0137] Obtaining a high-speed differential signal line intersecting with a via area in a printed circuit board design drawing, and determining an isolation plate intersecting with the high-speed differential signal line;

[0138] Determining a tangent line between the high-speed differential signal line and the isolation disk based on the line width of the high-speed differential signal line, the width of the via area, the radius of the isolation disk, and the differential via coordinates of the isolation disk;

[0139] Determining the coordinates of the tangent point between the via area and the isolation disk based on the radius of the isolation disk and the differential via coordinates of the isolation disk;

[0140] Based on the tangent line and the tangent point coordinates, the high-speed differential signal line in the via region is adjusted so that the high-speed differential signal line does not intersect the isolation plate when passing through the via region.

[0141] In addition, the logic instructions in the above-mentioned memory 430 can be implemented in the form of a software functional unit and can be stored in a computer-readable storage medium when it is sold or used as an independent product. Based on such an understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk and other media that can store program codes.

[0142] On the other hand, the present invention further provides a computer program product, the computer program product comprising a computer program stored on a non-transitory computer-readable storage medium, the computer program comprising program instructions, when the program instructions are executed by a computer, the computer can execute the wiring adjustment method provided by the above methods, the method comprising:

[0143] Obtaining a high-speed differential signal line intersecting with a via area in a printed circuit board design drawing, and determining an isolation plate intersecting with the high-speed differential signal line;

[0144] Determining a tangent line between the high-speed differential signal line and the isolation disk based on the line width of the high-speed differential signal line, the width of the via area, the radius of the isolation disk, and the differential via coordinates of the isolation disk;

[0145] Determining the coordinates of the tangent point between the via area and the isolation disk based on the radius of the isolation disk and the differential via coordinates of the isolation disk;

[0146] Based on the tangent line and the tangent point coordinates, the high-speed differential signal line in the via region is adjusted so that the high-speed differential signal line does not intersect the isolation plate when passing through the via region.

[0147] In another aspect, the present invention further provides a non-transitory computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the wiring adjustment method provided above is implemented, and the method includes:

[0148] Obtaining a high-speed differential signal line intersecting with a via area in a printed circuit board design drawing, and determining an isolation plate intersecting with the high-speed differential signal line;

[0149] Determining a tangent line between the high-speed differential signal line and the isolation disk based on the line width of the high-speed differential signal line, the width of the via area, the radius of the isolation disk, and the differential via coordinates of the isolation disk;

[0150] Determining the coordinates of the tangent point between the via area and the isolation disk based on the radius of the isolation disk and the differential via coordinates of the isolation disk;

[0151] Based on the tangent line and the tangent point coordinates, the high-speed differential signal line in the via region is adjusted so that the high-speed differential signal line does not intersect the isolation plate when passing through the via region.

[0152] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative labor.

[0153] Through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a necessary general hardware platform, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solution is essentially or the part that contributes to the prior art can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0154] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wiring adjustment method, characterized in that: The method comprises: Obtaining a high-speed differential signal line intersecting with a via area in a printed circuit board design drawing, and determining an isolation plate intersecting with the high-speed differential signal line; Determining a tangent line between the high-speed differential signal line and the isolation disk based on the line width of the high-speed differential signal line, the width of the via area, the radius of the isolation disk, and the differential via coordinates of the isolation disk; Determining the coordinates of the tangent point between the via area and the isolation disk based on the radius of the isolation disk and the differential via coordinates of the isolation disk; Based on the tangent line and the tangent point coordinates, the high-speed differential signal line in the via region is adjusted so that the high-speed differential signal line does not intersect the isolation plate when passing through the via region.

2. The wiring adjustment method according to claim 1, characterized in that: The step of adjusting the high-speed differential signal line in the via area based on the tangent line and the tangent point coordinates includes: Based on the tangent line and the tangent point coordinates, determining a plurality of key coordinates where the high-speed differential signal line is tangent to the isolation disk in the via region when passing through the via region; Based on the multiple key coordinates, a routing of the high-speed differential signal line passing through the via area is determined, and the high-speed differential signal line in the via area is adjusted based on the routing.

3. The wiring adjustment method according to claim 1, characterized in that: The step of obtaining a high-speed differential signal line intersecting with a via area in a printed circuit board design drawing includes: Based on the width of the via area and the line width of the high-speed differential signal line, a high-speed differential signal line intersecting with the via area in the printed circuit board design drawing is determined.

4. The wiring adjustment method according to claim 3, characterized in that: The step of determining the high-speed differential signal line intersecting with the via area in the printed circuit board design drawing based on the width of the via area and the line width of the high-speed differential signal line comprises: In the case where the line width of the high-speed differential signal line is greater than the width of the via region, the high-speed differential signal line is determined to be a high-speed differential signal line intersecting with the via region in the printed circuit board design drawing.

5. The wiring adjustment method according to claim 1, characterized in that: After determining the tangent line between the high-speed differential signal line and the isolation disk, the method further includes: The angle between the high-speed differential signal line and the tangent line of the isolation plate is determined to be 45 degrees.

6. The wiring adjustment method according to claim 1, characterized in that: The step of adjusting the high-speed differential signal line in the via area based on the tangent line and the tangent point coordinates includes: Based on the tangent line and the tangent point coordinates, a skill tool command for adjusting the high-speed differential signal line in the via area is generated; Based on the skill tool command, the high-speed differential signal line in the via area is adjusted.

7. A wiring adjustment device, characterized in that: include: A screening module, used to obtain high-speed differential signal lines intersecting with the via area in the printed circuit board design drawing, and determine the isolation disk intersecting with the high-speed differential signal lines; A tangent determination module, configured to determine a tangent between the high-speed differential signal line and the isolation disk based on the line width of the high-speed differential signal line, the width of the via area, the radius of the isolation disk, and the differential via coordinates of the isolation disk; A tangent point coordinate determination module, used to determine the tangent point coordinates between the via area and the isolation disk based on the radius of the isolation disk and the differential via coordinates of the isolation disk; An adjustment module is used to adjust the high-speed differential signal line in the via area based on the tangent line and the tangent point coordinates so that the high-speed differential signal line does not intersect the isolation disk when passing through the via area.

8. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the wiring adjustment method according to any one of claims 1 to 6 is implemented.

9. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the wiring adjustment method according to any one of claims 1 to 6 is implemented.

10. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the wiring adjustment method according to any one of claims 1 to 6 is implemented.

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