A display module and a display device

Abstract

This invention discloses a display module and a display device. The display module includes a display panel and a photosensitive module located on the non-light-emitting side of the display panel. The display module also includes a first antistatic film layer located between the display panel and the photosensitive module. The first antistatic film layer is electrically connected to a fixed potential to avoid noise generated by parasitic capacitance between the signal traces of the photosensitive element in the photosensitive module and the first antistatic film layer. This reduces the electrical interference of the first antistatic film layer to the photosensitive element, ensures the stability of signal transmission of the photosensitive element in the photosensitive module, reduces the coupling difficulty between the optical sensor and the oscilloscope probe, facilitates the optical sensor signal analysis, improves the optical sensing function of the display module, and ensures the display effect of the display module.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and more particularly to a display module and a display device. Background Technology

[0002] In fingerprint display modules, the conductive underfilm attached to the back of the display panel can interfere with the fingerprint sensor signal, affecting the display function of the display panel. Summary of the Invention

[0003] The present invention provides a display module and a display device, wherein an antistatic film layer under the display panel is connected to a fixed potential to reduce the electrical interference of the first antistatic film layer to the photosensitive element and ensure the stability of signal transmission of the photosensitive element in the photosensitive module.

[0004] In a first aspect, embodiments of the present invention provide a display module, including a display panel and a photosensitive module located on the non-light-emitting side of the display panel;

[0005] The display module further includes a first antistatic film layer located between the display panel and the photosensitive module, the first antistatic film layer being electrically connected to a fixed potential.

[0006] Secondly, embodiments of the present invention also provide a display device, which includes the display module provided in the first aspect.

[0007] The display module provided in this embodiment of the invention has a first anti-static film layer between the display panel and the photosensitive module to prevent damage to the display panel from electrostatic discharge. The first anti-static film layer is then connected to a fixed potential in the display module to avoid noise generated by parasitic capacitance between the signal traces of the photosensitive element in the photosensitive module and the first anti-static film layer. This reduces the electrical interference of the first anti-static film layer to the photosensitive element, ensures the stability of signal transmission of the photosensitive element in the photosensitive module, reduces the coupling difficulty between the optical sensor and the oscilloscope probe, facilitates the optical sensor signal analysis, improves the optical sensing function of the display module, and ensures the display effect of the display module. Attached Figure Description

[0008] Figure 1 This is a cross-sectional schematic diagram of a display module provided by related technologies;

[0009] Figure 2 This is a cross-sectional schematic diagram of a display module provided in an embodiment of the present invention;

[0010] Figure 3 This is a cross-sectional schematic diagram of another display module provided in an embodiment of the present invention;

[0011] Figure 4 This is a cross-sectional schematic diagram of another display module provided in an embodiment of the present invention;

[0012] Figure 5 yes Figure 2 A cross-sectional schematic diagram of a photosensitive element provided in the embodiment;

[0013] Figure 6 This is a schematic diagram of the surface structure of a display module provided in an embodiment of the present invention;

[0014] Figure 7 This is a schematic diagram of the surface structure of a display module provided in an embodiment of the present invention;

[0015] Figure 8 yes Figure 3 A top view schematic diagram of the bonding structure of a flip-chip film for a photosensitive module is provided in the figure;

[0016] Figure 9 yes Figure 3 A top view schematic diagram of the bonding structure of another photosensitive module flip-chip film provided in the diagram;

[0017] Figure 10 yes Figure 4 A top view schematic diagram of the bonding structure of another photosensitive module flip-chip film provided in the diagram;

[0018] Figure 11 This is a cross-sectional schematic diagram of another display module provided in an embodiment of the present invention;

[0019] Figure 12 This is a cross-sectional schematic diagram of another display module provided in an embodiment of the present invention;

[0020] Figure 13 This is a cross-sectional schematic diagram of another display module provided in an embodiment of the present invention;

[0021] Figure 14 This is a cross-sectional schematic diagram of another display module provided in an embodiment of the present invention;

[0022] Figure 15 This is a cross-sectional schematic diagram of another display module provided in an embodiment of the present invention;

[0023] Figure 16 yes Figures 13-15 A cross-sectional schematic diagram of a photosensitive element provided in the embodiment;

[0024] Figure 17 This is a cross-sectional schematic diagram of another display module provided in an embodiment of the present invention;

[0025] Figure 18 This is a schematic diagram of another display device provided in an embodiment of the present invention. Detailed Implementation

[0026] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0027] Figure 1 This is a cross-sectional schematic diagram of a display module provided by related technologies. For example... Figure 1 As shown, a display module 100 in the related technology includes a display panel 101 and an optical sensor 103, such as a fingerprint sensor or an image acquisition device, disposed on the non-light-emitting side of the display panel 101 via optical adhesive (OCA) 102. To prevent electrostatic discharge (ESD), an antistatic material is typically added to the underfilm on the non-light-emitting side of the display panel 101 to form an antistatic film layer 104. The optical sensor 103 is not electrically interconnected with the antistatic film layer 104. Because the common electrode (Vcom) 105 on the photosensitive surface S0 side of the optical sensor 103 cannot completely cover the signal traces of the fingerprint sensor, parasitic capacitance exists between the signal traces of the optical sensor and the antistatic film layer 104, generating noise interference and affecting the stability of the optical sensor signal transmission. This can easily cause difficulty in coupling between the optical sensor and the oscilloscope probe, which is not conducive to the optical sensor signal resolution, thus reducing the optical sensing function of the display module and ultimately affecting the display effect of the display module.

[0028] Based on the aforementioned technical problems, the inventors further developed the technical solution of the embodiments of the present invention. Specifically, the embodiments of the present invention provide a display module including a display panel and a photosensitive module located on the non-light-emitting side of the display panel; the display module further includes a first antistatic film layer located between the display panel and the photosensitive module, the first antistatic film layer being electrically connected to a fixed potential. By adopting the above technical solution, by electrically connecting the first antistatic film layer between the display panel and the photosensitive module to a fixed potential, noise generated by the parasitic capacitance between the signal traces of the photosensitive element within the photosensitive module and the first antistatic film layer can be avoided, thus reducing electrical interference. This ensures the stability of signal transmission of the photosensitive element within the photosensitive module, improves the coupling between the optical sensor and the oscilloscope probe, facilitates optical sensor signal resolution, and guarantees the display effect of the display module.

[0029] The above is the core idea of ​​this invention. The technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0030] Figure 2This is a cross-sectional schematic diagram of a display module provided in an embodiment of the present invention; Figure 3 This is a cross-sectional schematic diagram of another display module provided in an embodiment of the present invention; Figure 4 This is a cross-sectional schematic diagram of another display module provided in an embodiment of the present invention. (Combined with...) Figures 2-4 As shown, the display module 200 provided in this embodiment of the invention includes a display panel 201 and a photosensitive module 300 located on the non-light-emitting side of the display panel 201; the display module 200 also includes a first antistatic film layer 202 located between the display panel 201 and the photosensitive module 300, and the first antistatic film layer 202 is electrically connected to a fixed potential.

[0031] Specifically, the display panel 201 includes an organic light-emitting diode (OLED) display panel, a light-emitting diode (LED) display panel, a micro light-emitting diode (Micro LED) display panel, etc. This embodiment of the invention does not impose specific limitations on the type of display panel 201. The photosensitive module 300 is disposed on the non-light-emitting side of the display panel 201. The photosensitive module 300 contains multiple photosensitive elements 301, including a fingerprint recognition sensor. Light emitted from the display panel 201 is reflected by the user terminal and enters the photosensitive module 300 to achieve light reception by devices such as image sensors and fingerprint recognition sensors. A first antistatic film layer 202 is disposed between the display panel 201 and the photosensitive module 300. The first antistatic film layer 202 is prepared by adding antistatic material to the conductive underfilm on the non-light-emitting side of the display panel. It is used to prevent damage to the display panel from electrostatic discharge (ESD). The antistatic material includes polyvinyl chloride, polycarbonate, etc. The first antistatic film layer 202 is connected to a fixed potential to avoid noise generated by parasitic capacitance between the signal traces within the photosensitive module 300 and the first antistatic film layer 202. This reduces electrical interference from the first antistatic film layer to the photosensitive element 301, ensuring the stability of signal transmission in the photosensitive module 300. The fixed potential refers to a voltage terminal in the display module with a stable voltage, such as the power supply voltage input terminal or power supply voltage output terminal.

[0032] It should be noted that the display module also includes other structures, such as the driving circuit and display light-emitting element of the display panel, the signal traces in the photosensitive module 300, the driving circuit, etc. Multiple structures work together to realize the image display of the display module, which will not be listed one by one here.

[0033] In summary, the display module provided in this embodiment of the invention has a first antistatic film layer disposed between the display panel and the photosensitive module, and the first antistatic film layer is then connected to a fixed potential in the display module. This avoids noise generated by the parasitic capacitance between the signal traces of the photosensitive element in the photosensitive module and the first antistatic film layer, thereby reducing the electrical interference of the first antistatic film layer to the photosensitive element, ensuring the stability of the signal transmission of the photosensitive element in the photosensitive module, reducing the coupling difficulty between the optical sensor and the oscilloscope probe, and facilitating the optical sensor signal analysis, thereby improving the optical sensing function of the display module and ensuring the display effect of the display module.

[0034] Based on the above embodiments, continue to combine Figures 2-4 As shown, the photosensitive module 300 includes a photosensitive element 301, the photosensitive element 301 includes a first electrode 302, and a fixed potential signal is transmitted in the first electrode 302; the fixed potential includes the first electrode 302.

[0035] Specifically, the photosensitive module 300 includes multiple photosensitive elements 301. Only a schematic diagram of one photosensitive element 301 is shown in the figure; other photosensitive elements 301 are not listed here. In a fingerprint recognition display module, the photosensitive element 301 is a fingerprint sensor; in an image recognition display module, the photosensitive element 301 is a fingerprint image sensor. Optionally, the photosensitive element 301 is attached to the side near the first antistatic film layer 202 using optical adhesive 203 (OCA). Optionally, the first electrode 302 is the common electrode (Vcom) of the photosensitive element 301, such as the anode or cathode of the photosensitive element 301, and the first electrode 302 transmits the anode voltage signal or cathode voltage signal of the photosensitive element 301. The first electrode 302 of the photosensitive element 301 is selected as a fixed potential. The first antistatic film layer 202 is directly or indirectly electrically connected to the first electrode 302 of the photosensitive element 301 to avoid noise generated by the parasitic capacitance between the signal trace of the photosensitive element in the photosensitive module 300 and the first antistatic film layer 202, thereby reducing the electrical interference of the first antistatic film layer 202 on the photosensitive performance of the photosensitive element 301.

[0036] It should be noted that only the first electrode 302 of the photosensitive element 301 is shown in the figure. The photosensitive element 301 also includes other structures, such as a detection diode and signal traces. Multiple structures work together to realize the light signal acquisition and analysis of the photosensitive element 301, which will not be listed here.

[0037] The following are some specific embodiments in which the first antistatic film layer is electrically connected to the first electrode of the photosensitive element.

[0038] Figure 5 yes Figure 2 A cross-sectional schematic diagram of a photosensitive element provided in the embodiment. One feasible implementation, combined with... Figure 2 and Figure 5 As shown, the display module 200 also includes a first electrical connection structure 21 located between the first antistatic film layer 202 and the photosensitive element 301, and the first antistatic film layer 202 is electrically connected to the first electrode 302 through the first electrical connection structure 21.

[0039] Specifically, in combination Figure 2 As shown, the first antistatic film layer 202 and the first electrode 302 of the photosensitive element 301 are directly electrically connected using the first electrical connection structure 21. Figure 5 Taking a cross-sectional schematic diagram of a photosensitive element 301 as an example, the photosensitive element 301 also includes an insulating layer 304 covering the first electrode 302. A hole is punched in the insulating layer 304 located on the first electrode 302, exposing a portion of the first electrode 302. The first electrical connection structure 21 fills the hole and is electrically connected to the first antistatic film layer 202 and the first electrode 302 respectively. At this time, the potentials of the first antistatic film layer 202 and the first electrode 302 are the same, which can avoid noise generated by parasitic capacitance and reduce the electrical interference of the first antistatic film layer 202 to the photosensitive element 301. The first electrical connection structure 21 can be made of a conductive adhesive material with good conductivity.

[0040] Based on the above embodiments, continue to combine Figure 5 As shown, the photosensitive element 301 includes a photosensitive area AA and a non-photosensitive area NA; the first electrode 302 includes a first electrode portion 31 and a second electrode portion 32 that are electrically connected to each other. The first electrode portion 31 is located in the photosensitive area AA, and the second electrode portion 32 is located in the non-photosensitive area NA. The first electrical connection structure 21 is electrically connected to the second electrode portion 32.

[0041] Specifically, the photosensitive element 301 includes a non-photosensitive area NA and a detection diode 303 disposed in the photosensitive area NA. The photosensitive surface of the detection diode 303 receives light reflected from the user end. The first antistatic film layer 201 is electrically connected to the second electrode portion 32 through the first electrical connection structure 21, which can reduce the obstruction of the incident light on the photosensitive surface of the detection diode 303 by the first electrical connection structure 21, and ensure that the first electrode portion 31 in the photosensitive area NA supplies power to the light-emitting diode 303 normally, thereby reducing the electrical interference of the first antistatic film layer 201 on the photosensitive element.

[0042] Figure 6 This is a schematic diagram of the surface structure of a display module provided in an embodiment of the present invention; Figure 7 This is a schematic diagram of the surface structure of a display module provided in an embodiment of the present invention. Based on the above embodiments, further combining... Figure 2 , Figures 5-7 As shown, along the thickness direction of the display module (as shown in the Z direction in the figure), the first electrical connection structure 21 is projected to at least partially surround the first electrode portion 31.

[0043] Specifically, in combination Figure 5 As shown, the insulating layer 304 on the second electrode portion 32 has an opening to expose the second electrode portion 32, and the first electrical connection structure 21 fills the opening and electrically connects to the second electrode portion 32. Combined with... Figure 6 and Figure 7 As shown, considering the small size of the second electrode portion 32 in the photosensitive element 301, in order to ensure the stability of the connection potential between the first electrical connection structure 21 and the second electrode portion 32, along the Z direction in the figure, the projection of the opening on the insulating layer 304 of the second electrode portion 32 can be arranged to surround the first electrode portion 31, or the projection of the opening on the insulating layer 304 of the second electrode portion 32 can be arranged to surround the first electrode portion 31, thereby increasing the electrical connection area between the first electrical connection structure 21 and the second electrode portion 32 and improving the electrical connection stability between the first electrical connection structure 21 and the second electrode portion 32; at the same time, the projection of the first electrical connection structure 21 and the photosensitive surface of the light-emitting diode 303 are arranged to not overlap, ensuring that the photosensitive surface of the photosensitive element 301 receives reflected light.

[0044] Figure 8 yes Figure 3 A top view schematic diagram of the bonding structure of a flip-chip film for a photosensitive module is provided in the figure; Figure 9 yes Figure 3 The diagram above shows a top view of another bonding structure for a flip-chip film in a photosensitive module. One possible implementation method, combined with... Figure 3 and Figure 8 As shown, the photosensitive module 300 also includes a flip-chip film 40, which is electrically connected to the photosensitive element 301 through a plurality of first-type connection terminals 41; the first-type connection terminals 41 include a first common signal transmission terminal 411, which is electrically connected to the first electrode 302; the display module also includes a second electrical connection structure 22 located between the first antistatic film layer 202 and the photosensitive element 301, which is electrically connected to the first common signal output terminal 411 through the second electrical connection structure 22.

[0045] Specifically, in combination Figure 3 and Figure 8As shown, the photosensitive module 300 also includes a chip-on-flex film 40. Chip-on-film (COF) technology is a chip-on-flex packaging technology that fixes integrated circuits onto a flexible circuit board. It uses a flexible additional circuit board as a chip carrier to combine the chip with the flexible substrate circuitry; that is, the integrated circuit is fixed on a flexible circuit board 50 manufactured using a polyimide process. Multiple first-type connection terminals 41 on the chip-on-flex film 40 are electrically connected to the photosensitive element 301. Among the multiple first-type connection terminals 41 is a first common signal transmission terminal 411, which is electrically connected to the first electrode 302 and used to provide a common voltage signal to the first electrode 302. One feasible implementation, combined with... Figure 3 As shown, holes can be made in the main body of the flip-chip film 40 corresponding to the first common signal transmission terminal 411, and the holes are filled with the second electrical connection structure 22 to electrically connect the first common signal transmission terminal 411 and the first antistatic film layer 202 respectively (e.g., Figure 3 (as shown); a feasible implementation method, combined with Figure 9 As shown, the area of ​​the first common signal transmission terminal 411 can be increased to expose the first common signal transmission terminal 411. A second electrical connection structure 22 can be directly electrically connected to the exposed portion of the first common signal transmission terminal 411 and the first antistatic film layer 202. In this case, the first antistatic film layer 202, the first common signal transmission terminal 411, and the first electrode 302 have the same fixed voltage potential. Optionally, the second electrical connection structure 22 can be made of the same material as the first electrical connection structure 21, such as a conductive adhesive material with good conductivity. Placing the first antistatic film layer 202 and the flip-chip film 40 in the bonding area between the first type of connection terminal 41 and the photosensitive element 301, located in the opening area of ​​the optical adhesive layer 203, reduces the difficulty of filling the second electrical connection structure 22. This location also facilitates bending the flip-chip film 40 to the back of the photosensitive element 301, reducing the area occupied by the flip-chip film 40 and increasing the display area of ​​the display panel.

[0046] Figure 10 yes Figure 4 The diagram above shows a top view of another bonding structure for a flip-chip film in a photosensitive module. One possible implementation method, combined with... Figure 4 and Figure 10As shown, the photosensitive module 300 also includes a flip-chip film 40 and a flexible circuit board 50. The flip-chip film 40 is electrically connected to the photosensitive element 301 through a plurality of first-type connection terminals 41 and to the flexible circuit board 50 through a plurality of second-type connection terminals 42. The second-type connection terminals 42 include a second common signal transmission terminal 421, which transmits a fixed potential signal of the first electrode 302. The display module 200 also includes a third electrical connection structure 23 located between the first antistatic film layer 202 and the photosensitive element 301. The first antistatic film layer 202 is electrically connected to the second common signal transmission terminal 421 through the third electrical connection structure 23.

[0047] Specifically, in combination Figure 4 and Figure 10 As shown, the flip-chip film 40 of the photosensitive module 300 is electrically connected to the flexible circuit board 50 via multiple second-type connection terminals 42. The second common signal transmission terminal 421 among the multiple second-type connection terminals 42 transmits a fixed potential signal of the first electrode 302 to the first common signal transmission terminal 411. The first antistatic film layer 202 can also be electrically connected to the second common signal transmission terminal 421 of the flip-chip film 40. In one feasible embodiment, by creating an opening in the main body of the flip-chip film 40 on the second common signal transmission terminal 421, a third electrical connection structure 23 is used to fill the opening and electrically connect it to both the second common signal transmission terminal 421 and the first antistatic film layer 202 (e.g., ...). Figure 4 (As shown in the figure); In one feasible implementation, the area of ​​the second common signal transmission terminal can be increased to expose the second common signal transmission terminal, and a second electrical connection structure can be used to directly connect the exposed portion of the second common signal transmission terminal and the first antistatic film layer (not shown in the figure). In this case, the first antistatic film layer 202, the second common signal transmission terminal 421, the first common signal transmission terminal 411, and the first electrode 302 have the same fixed voltage potential. Optionally, the third electrical connection structure 23, the second electrical connection structure 22, and the first electrical connection structure 21 are made of the same material, such as a conductive adhesive material with good conductivity.

[0048] Figure 11 This is a cross-sectional schematic diagram of another display module provided in an embodiment of the present invention; Figure 12 This is a cross-sectional schematic diagram of another display module provided in an embodiment of the present invention. One feasible implementation, combined with... Figure 11 and Figure 12 As shown, the display module 200 also includes a second antistatic film layer 204, which is located on the side of the photosensitive module 300 away from the display panel 201 and is electrically connected to a fixed potential.

[0049] Specifically, a second antistatic film layer 204 can also be provided on the side of the photosensitive module 300 away from the display panel 201, such as... Figure 11 As shown, a second antistatic film layer 204 is added to the surface of the photosensitive element 301 away from the light-emitting side. Optionally, the second antistatic film layer 204 is made of the same material as the first antistatic film layer 202. The second antistatic film layer 204 is electrically connected to a fixed potential, wherein the fixed potential includes any fixed potential or ground potential electrode in the display module 200. The second antistatic film layer 204 and the first antistatic film layer 202 form an electrical cavity, which can reduce electrical interference and ensure the stability of the signal transmission from the photosensitive element 301.

[0050] One feasible implementation method is to continue referring to... Figure 11 As shown, the photosensitive module 300 includes a flip-chip film 40 and a flexible circuit board 50; the flip-chip film 40 is electrically connected to the photosensitive element 301 through a plurality of first-type connection terminals 41, and electrically connected to the flexible circuit board 50 through a plurality of second-type connection terminals 42; the second-type connection terminals 42 include a second common signal transmission terminal 421, which transmits a fixed potential signal of the first electrode 302; the display module 200 also includes a fourth electrical connection structure 24 located between the second antistatic film layer 204 and the photosensitive element 301, and the second antistatic film layer 204 is electrically connected to the second common signal transmission terminal 421 through the fourth electrical connection structure 24.

[0051] Specifically, such as Figure 11 As shown, the flip-chip film 40 is bent away from the display panel 201 and placed at the location of the photosensitive element 301 of the photosensitive module 300. In one feasible implementation, an opening is made in the main body of the flip-chip film 40 at the position corresponding to the first common transmission terminal 411, and the opening is filled with a second electrical connection structure 22 to electrically connect to the first common signal transmission terminal 411 and the first antistatic film layer 202, respectively. An opening is made in the main body of the flip-chip film 40 at the position corresponding to the second common signal transmission terminal 421, and the opening is filled with a fourth electrical connection structure 24 to electrically connect to the second common signal transmission terminal 421 and the second antistatic film layer 204, respectively. At this time, the first antistatic film layer 202, the second antistatic film layer 204, the second common signal transmission terminal 421, the first common signal transmission terminal 411, and the first electrode 302 have the same fixed voltage potential. An electrical cavity is formed between the second antistatic film layer 204 and the first antistatic film layer 202, which can prevent the introduction of an electric field at both ends of the photosensitive element 301 and avoid interference with the photosensitive element 301. This further reduces the electrical interference of the second antistatic film layer 204 and the first antistatic film layer 202 on the photosensitive element 301, ensuring the stability of the signal transmission from the photosensitive element 301. Optionally, the fourth electrical connection structure 24 uses a conductive adhesive material with good conductivity.

[0052] Based on the above embodiments, continue to refer to Figure 11 and Figure 12 As shown, along the thickness direction of the display module (as indicated by the Z direction in the figure), the first antistatic film layer 202 and the second antistatic film layer 204 at least partially overlap. This structural arrangement ensures that the first antistatic film layer 202 and the second antistatic film layer 204 form an electrical cavity along the Z direction in the figure, and connects the electrical cavity to a fixed potential, thereby shielding the photosensitive element 301 and reducing electrical interference.

[0053] Figure 13 This is a cross-sectional schematic diagram of another display module provided in an embodiment of the present invention; Figure 14 This is a cross-sectional schematic diagram of another display module provided in an embodiment of the present invention; Figure 15 This is a cross-sectional schematic diagram of another display module provided in an embodiment of the present invention; Figure 16 yes Figures 13-15 A cross-sectional schematic diagram of a photosensitive element is provided in the embodiment. In one feasible implementation, the photosensitive module 300 further includes a driving circuit 305, and the first electrode 302 projects and covers the driving circuit 305 along the thickness direction of the display panel (as shown in the Z direction in the figure).

[0054] Specifically, the photosensitive module 300 also includes a driving circuit 305, which includes multilayer metal traces for transmitting driving signals to the photosensitive element. Figure 16 Taking the driving circuit 305 of the photosensitive element 301 as an example, when preparing the photosensitive element 301, the coverage area of ​​the first electrode 302 of the photosensitive element 301 can be expanded. Along the Z direction in the figure, the first electrode 302 of the photosensitive element 301 is set as a whole layer, so that the projection of the first electrode 302 covers the driving circuit 305, thereby reducing the coupling between the first antistatic film layer 202 and the metal lines in the driving circuit 305. At the same time, since the first antistatic film layer 202 is electrically connected to a fixed potential, the coupling between the first antistatic film layer 202 and the metal lines in the driving circuit 305 can be further reduced, reducing electrical interference and ensuring the stability of signal transmission of the photosensitive module 300.

[0055] Figure 17 This is a cross-sectional schematic diagram of another display module provided in an embodiment of the present invention. A feasible implementation is illustrated in the figure. Figure 12 and Figure 17 As shown, the image is grounded at a fixed potential. Both the first antistatic film layer 202 and the second antistatic film layer 204 are grounded to reduce electrical interference from the antistatic film layers to the photosensitive module 300 and ensure the stability of signal transmission of the photosensitive element within the photosensitive module.

[0056] One feasible implementation method, continuing to combine Figure 2 and Figure 5As shown, optionally, the sheet resistance of the first antistatic film layer 202 is β, 1MΩ / □<β<50MΩ / □.

[0057] Specifically, the interference in the data signal of the display module 200 mainly originates from the non-display area NA outside the display area AA of the photosensitive element 301. The metal traces in the driving circuit 305 within this area are not covered by the first electrode 302 (Vcom) of the photosensitive element 301, and thus couple with the conductive first antistatic film layer 202, generating parasitic capacitance. To reduce parasitic capacitance, the resistivity of the film should not be too low. Simultaneously, to prevent tearing voltage and control electrostatic discharge, the sheet resistance of the first antistatic film layer 202 is controlled between 1 MΩ / □ < β < 50 MΩ / □, which can effectively reduce the film resistivity and control electrostatic discharge.

[0058] Based on the same inventive concept, embodiments of the present invention also provide a display device. Figure 18 This is a schematic diagram of the structure of the display device provided in an embodiment of the present invention, such as... Figure 18 As shown, the display device includes any of the display modules provided in the above embodiments. For example, such as... Figure 18 As shown, the display device 400 includes a display module 200. Therefore, this display device also has the beneficial effects of the display module in the above embodiments. The similarities can be understood with reference to the explanation of the display module above, and will not be repeated below.

[0059] The display device 400 provided in this embodiment of the invention can be Figure 18 The mobile phone shown can also be any electronic product with display function, including but not limited to the following categories: television, laptop, desktop monitor, tablet computer, digital camera, smart bracelet, smart glasses, in-vehicle display, industrial control equipment, medical display screen, touch interactive terminal, etc. The embodiments of the present invention do not make any special limitations on this.

[0060] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A display module, characterized by The display module comprises a display panel and a photosensitive module located on a non-light-emitting side of the display panel. The display module further comprises a first anti-static film layer between the display panel and the photosensitive module, and the first anti-static film layer is electrically connected to the fixed potential through conductive adhesive. The sheet resistance of the first anti-static film layer is β, and 1MΩ / □<β<50MΩ / □. The photosensitive module comprises a photosensitive element, the photosensitive element comprises a first electrode and an insulating layer covering the first electrode, and a fixed potential signal is transmitted in the first electrode; the fixed potential comprises the first electrode; the display module further comprises a first electrical connection structure between the first anti-static film layer and the photosensitive element, the first electrical connection structure comprises the conductive adhesive, the conductive adhesive passes through the insulating layer, and the potential of the first anti-static film layer and the first electrode is the same.

2. The display module of claim 1, wherein, The photosensitive element comprises a photosensitive area and a non-photosensitive area. The first electrode comprises a first electrode part and a second electrode part electrically connected to each other, the first electrode part is located in the photosensitive area, the second electrode part is located in the non-photosensitive area, and the first electrical connection structure is electrically connected to the second electrode part.

3. The display module of claim 2, wherein, Along the thickness direction of the display module, the first electrical connection structure projects at least partially around the first electrode part.

4. The display module of claim 1, wherein, The photosensitive module further comprises a chip on film, and the chip on film is electrically connected to the photosensitive element through a plurality of first type connection terminals; The first type connection terminals comprise a first common signal transmission terminal, and the first common signal transmission terminal is electrically connected to the first electrode; The display module further comprises a second electrical connection structure between the first anti-static film layer and the photosensitive element, and the first anti-static film layer is electrically connected to the first common signal output terminal through the second electrical connection structure.

5. The display module of claim 1, wherein, The photosensitive module further comprises a chip on film and a flexible circuit board, the chip on film is electrically connected to the photosensitive element through a plurality of first type connection terminals and is electrically connected to the flexible circuit board through a plurality of second type connection terminals; The second type connection terminals comprise a second common signal transmission terminal, and the second common signal transmission terminal transmits the fixed potential signal of the first electrode; The display module further comprises a third electrical connection structure between the first anti-static film layer and the photosensitive element, and the first anti-static film layer is electrically connected to the second common signal transmission terminal through the third electrical connection structure.

6. The display module of claim 1, wherein, The display module further comprises a second anti-static film layer, the second anti-static film layer is located on a side of the photosensitive module away from the display panel, and the second anti-static film layer is electrically connected to the fixed potential.

7. The display module of claim 6, wherein, The photosensitive module comprises a chip on film and a flexible circuit board; the chip on film is electrically connected to the photosensitive element through a plurality of first type connection terminals and is electrically connected to the flexible circuit board through a plurality of second type connection terminals; The second type connection terminals comprise a second common signal transmission terminal, and the second common signal transmission terminal transmits the fixed potential signal of the first electrode; The display module further comprises a fourth electric connection structure between the second anti-static film layer and the photosensitive element, and the second anti-static film layer is electrically connected to the second common signal transmission terminal through the fourth electric connection structure.

8. The display module of claim 6, wherein, The first anti-static film layer and the second anti-static film layer at least partially overlap in a direction perpendicular to the thickness of the display module.

9. The display module of claim 1, wherein, The photosensitive module further comprises a driving circuit, and the first electrode projects to cover the driving circuit in the thickness direction of the display panel.

10. The display module of claim 1, wherein, The fixed potential is grounded.

11. A display device, characterized by comprising: The display module comprises any one of claims 1-10.

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