Array substrate and manufacturing method, display panel

Abstract

The present invention discloses an array substrate and a manufacturing method, and a display panel. The array substrate comprises: a fan-out routing, located on one side of a substrate, the fan-out routing comprises a first fan-out routing extending along a first direction and arranged in a second direction, and two adjacent first fan-out routings are insulated; the first fan-out routing comprises a first sub-segment and a second sub-segment, and along a third direction, the maximum distance from the first sub-segment to the substrate is d1, and the maximum distance from the second sub-segment to the substrate is d2, and d1<d2; a plurality of first sub-segments are continuously arranged along a fourth direction to form a first diffusion region; the first diffusion region comprises an insulating material, and along the fourth direction, the length of the first diffusion region is greater than or equal to a preset distance. The insulating material is guided out of the first region through the first diffusion region, so as to avoid the uneven thickness of the insulating layer formed by the insulating material due to the accumulation of the insulating material in the first region, and also to avoid the problem that the insulating layer formed by the insulating material is easy to fall off.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and more specifically, to an array substrate and a manufacturing method thereof, and a display panel. Background Art

[0002] With the development of display technology, display panels have been widely used in people's lives and work. In the design of display panels, the wiring design of array substrates is particularly important.

[0003] In the prior art, the array substrate includes a display area and a fan-out area. A plurality of data lines are arranged in parallel and at intervals in the display area. A driver chip and a fan-out trace are provided in the fan-out area. One end of the fan-out trace is electrically connected to the data line, and the other end is electrically connected to the driver chip. The fan-out traces are densely arranged, and the relative position of the data line and the driver chip will affect the length and extension direction of the fan-out trace connecting the two, resulting in that in some areas, the fan-out traces block the flow of subsequent film layer materials, especially thicker organic insulating materials, causing uneven thickness of subsequent film layers. If the adhesion of the material is weak, it is also easy to fall off.

[0004] Therefore, it is urgently necessary to provide a design of an array substrate that can avoid uneven thickness of subsequent film layers. Summary of the invention

[0005] In view of this, the present invention provides an array substrate and a manufacturing method thereof, and a display panel.

[0006] In one aspect, the present invention provides an array substrate, comprising a fan-out region, wherein the fan-out region comprises a first area;

[0007] substrate;

[0008] A fan-out routing line is located at one side of the substrate and in the fan-out area, wherein the fan-out routing line includes a first fan-out routing line located in the first area, the first fan-out routing line extends along a first direction and is arranged in a second direction, two adjacent first fan-out routing lines are insulated from each other, and the second direction intersects with the first direction;

[0009] The first fan-out routing includes a first sub-segment and a second sub-segment. Along a third direction, a maximum distance between the first sub-segment and the substrate is d1, and a maximum distance between the second sub-segment and the substrate is d2, d1<d2, and the third direction is a direction perpendicular to a plane where the substrate is located; a plurality of the first sub-segments are continuously arranged along a fourth direction to form a first diffusion region, and the fourth direction intersects the first direction and the third direction respectively;

[0010] The first diffusion region includes an insulating material, and along the fourth direction, a length of the first diffusion region is greater than or equal to a preset distance.

[0011] In another aspect, the present invention provides a method for manufacturing an array substrate, comprising:

[0012] Providing a substrate, the substrate comprising a fan-out region, the fan-out region comprising a first region;

[0013] A fan-out trace is formed on one side of the substrate, the fan-out trace includes a first fan-out trace, and the orthographic projection of the first fan-out trace on the substrate is located in the first region; the first fan-out trace extends along a first direction and is arranged in a second direction, two adjacent first fan-out traces are insulated, and the second direction intersects with the first direction; the first fan-out trace includes a first sub-segment and a second sub-segment, along a third direction, a maximum distance from the first sub-segment to the substrate is d1, a maximum distance from the second sub-segment to the substrate is d2, d1<d2, and the third direction is a direction perpendicular to the plane where the substrate is located;

[0014] A plurality of the first sub-segments are continuously arranged along a fourth direction to form a first diffusion region, and the fourth direction intersects the first direction and the third direction respectively; along the fourth direction, a length of the first diffusion region is greater than or equal to a preset distance;

[0015] An insulating material is coated on a side of the fan-out wiring away from the substrate, and part of the insulating material flows toward the first diffusion region.

[0016] In yet another aspect, the present invention further provides a display panel, comprising the above array substrate.

[0017] Compared with the prior art, the array substrate provided by the present invention achieves at least the following beneficial effects:

[0018] The array substrate provided by the present invention comprises a fan-out area, the fan-out area comprises a first area; a fan-out routing line is located on one side of a substrate and is located in the fan-out area, the fan-out routing line comprises a first fan-out routing line located in the first area, the first fan-out routing line extends along a first direction and is arranged in a second direction, two adjacent first fan-out routing lines are insulated, and the second direction intersects with the first direction; the first fan-out routing line comprises a first sub-segment and a second sub-segment, along a third direction, the maximum distance from the first sub-segment to the substrate is d1, the maximum distance from the second sub-segment to the substrate is d2, d1<d2, the third direction is a direction perpendicular to the plane where the substrate is located, and an insulating material is coated on a side of the fan-out routing line away from the substrate When the material is added, the accumulated insulating material will flow downward, that is, it can flow from the second sub-segment to the first sub-segment; multiple first sub-segments are continuously arranged along the fourth direction to form a first diffusion zone, and the fourth direction intersects with the first direction and the third direction respectively. Along the fourth direction, the length of the first diffusion zone is greater than or equal to the preset distance. At this time, the first diffusion zone is equivalent to a diffusion channel, and the insulating material accumulated around the first diffusion zone flows into the first diffusion zone, and even flows out of the first area along the extension direction of the first diffusion zone, thereby avoiding the uneven thickness of the insulating layer formed by the insulating material due to the accumulation of insulating material in the first area, and also avoiding the problem that the insulating layer formed by the insulating material is easy to fall off.

[0019] Of course, any product implementing the present invention does not necessarily need to achieve all of the technical effects described above at the same time.

[0020] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0022] Figure 1 It is a structural schematic diagram of an array substrate provided by the prior art;

[0023] Figure 2 is a structural schematic diagram of an array substrate provided by the present invention;

[0024] Figure 3 yes Figure 2 An enlarged view of the first region in FIG.

[0025] Figure 4 yes Figure 3 A cross-section along the A-A' direction;

[0026] Figure 5 yes Figure 2 Another enlarged view of the first area in the figure;

[0027] Figure 6 yes Figure 5 A cross-section in the B-B' direction;

[0028] Figure 7 yes Figure 2 Another enlarged view of the first area;

[0029] Figure 8 yes Figure 2 Another enlarged view of the first area;

[0030] Fig. 9 yes Figure 2 Another enlarged view of the first area in the figure;

[0031] Fig.10 yes Figure 2 Another enlarged view of the first area in the figure;

[0032] Fig.11 It is a flow chart of the method for manufacturing the array substrate provided by the present invention;

[0033] Fig.12 It is a structural schematic diagram of a display panel provided by the present invention. DETAILED DESCRIPTION

[0034] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0035] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0036] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0037] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0038] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0039] In order to solve the problem of uneven insulation layer on the side of the array substrate fan-out wiring away from the substrate, the inventors conducted the following research on the array substrate in the related art:

[0040] Reference Figure 1 , Figure 1 It is a structural schematic diagram of an array substrate provided by the prior art. The array substrate 000' in the prior art comprises: a display area 1' and a fan-out area 2' at least partially surrounding the display area 1';

[0041] Substrate 3';

[0042] The data line 4' is located on one side of the substrate 3' and in the display area 1';

[0043] A fan-out trace 5' is located on one side of the substrate 3' and in the fan-out region 2';

[0044] The driver chip 6' is located in the fan-out area 2', one end of the fan-out trace 5' is electrically connected to the data line 4', and the other end is electrically connected to the driver chip 6';

[0045] It is understandable that the different relative positions of the data line 4' and the driver chip 6' will affect the extension direction and length of the fan-out wiring 5' connecting the data line 4' and the driver chip 6'. Figure 1 Only one wiring design of the array substrate 000' is shown in FIG. Figure 1 It is only shown that the arrangement density of the fan-out wiring 5' is large. In the direction from the center of the fan-out area 2' to both sides, the inclination angle of the fan-out wiring 5' increases. When the insulating material is coated on the side of the fan-out wiring 5' away from the substrate 3' to form an insulating layer, since the extension direction of the fan-out wiring 5' at the edge of the fan-out area 2' has an angle with the vertical direction, when the insulating material is coated along the vertical direction, the dense fan-out wiring 5' at the edge of the fan-out area 2' will block the flow of the insulating material, resulting in the problem of insulating material accumulation at the edge of the fan-out area 2', so that the thickness of the insulating layer formed by the insulating material is uneven and even easy to peel off.

[0046] In view of this, the present invention proposes an array substrate and a manufacturing method, and a display panel. Specific embodiments of the array substrate and a manufacturing method, and a display panel provided by the present invention will be described in detail below.

[0047] Reference Figure 2 , Figure 3 and Figure 4 , Figure 2 is a structural schematic diagram of an array substrate provided by the present invention, Figure 3 yes Figure 2 An enlarged view of the first region in Figure 4 yes Figure 3 A cross-sectional view taken along the AA' direction is used to illustrate a specific embodiment of the array substrate 000 provided by the present invention, comprising: a fan-out area 2, the fan-out area 2 comprising a first area 21;

[0048] Substrate 3;

[0049] The fan-out trace 5 is located at one side of the substrate 3 and in the fan-out region 2. The fan-out trace 5 includes a first fan-out trace 7 located in the first region 21. The first fan-out trace 7 extends along the first direction X and is arranged in the second direction Y. Two adjacent first fan-out traces 7 are insulated from each other. The second direction Y intersects with the first direction X.

[0050] The first fan-out trace 7 includes a first sub-segment 71 and a second sub-segment 72. Along the third direction Z, the maximum distance between the first sub-segment 71 and the substrate 3 is d1, and the maximum distance between the second sub-segment 72 and the substrate 3 is d2, d1<d2, and the third direction Z is a direction perpendicular to the plane where the substrate 3 is located; a plurality of first sub-segments 71 are continuously arranged along a fourth direction U to form a first diffusion region 8, and the fourth direction U intersects the first direction X and the third direction Z respectively;

[0051] The first diffusion region 8 includes insulating material. Along the fourth direction U, the length of the first diffusion region 8 is greater than or equal to a preset distance.

[0052] It should be noted that in Figure 2 and Figure 3 In the figure, the number, extension and arrangement direction of the first fan-out wiring 7 are only for illustration, and are not limited thereto. Figure 2 and Figure 3 It is only shown that the first fan-out wiring 7 extends along the first direction X, but it is not limited thereto. The extension direction of part of the first fan-out wiring 7 may have an angle with the first direction X, and the angle is less than or equal to 2°. The extension direction of this part of the first fan-out wiring 7 is approximately parallel to the first direction X. This embodiment does not make a specific limitation on this. Figure 4 In the figure, only the first sub-segment 71 and the second sub-segment 72 are shown to be arranged on the same layer. Along the third direction Z, other film layers are also included between the substrate 3 and the first fan-out wiring 7. The other film layers may include a buffer layer, a metal layer, etc.

[0053] It can be understood that due to the limited area of ​​the fan-out area 2, the fan-out traces 5 are densely arranged in the fan-out area 2. Figure 3When the insulating material is coated along the seventh direction V, due to the large angle between the seventh direction V and the first direction X, the densely arranged first fan-out traces 7 will block the flow of the insulating material, resulting in the accumulation of the insulating material in the first region 21; in the first region 21, the maximum distance from the first sub-segment 71 to the substrate 3 is set to d1, and the maximum distance from the second sub-segment 72 to the substrate 3 is set to d2, d1 < d2, the insulating material has fluidity and will flow to a lower place, so the accumulated insulating material can flow from the corresponding position of the second sub-segment 72 to the corresponding position of the first sub-segment 71; multiple first sub-segments 71 are arranged along the The fourth direction U is continuously arranged to form a first diffusion region 8, which is a diffusion channel. The diffusion channel has little or no blocking effect on the flow of insulating materials. The accumulated insulating materials are gathered in the diffusion channel and can flow out along the diffusion channel, which can effectively improve the problem of uneven thickness of the insulating layer formed subsequently due to the accumulation of insulating materials in the first region 21, so that the insulating layer formed by the insulating material has higher reliability and avoids the insulating layer formed by the insulating material from falling off. The fourth direction U can be parallel to the second direction Y, and the fourth direction U can also intersect with the second direction Y. Along the fourth direction U, the length of the first diffusion region 8 is greater than or equal to the preset distance. Specifically, along the seventh direction V, the width of the fan-out region 2 is l1, and along the fourth direction U, the length of the first diffusion region 8 is l2, l2 ≥ 50% l1. When the first diffusion region 8 has a certain length, the insulating material gathered in the first diffusion region 8 can be led out of the first region 21 to improve the problem of uneven thickness of the insulating layer formed by the insulating material.

[0054] Compared with the prior art, the array substrate 000 provided in this embodiment has at least the following advantages:

[0055] The array substrate 000 provided by the present invention includes a fan-out area 2, the fan-out area 2 includes a first area 21; a fan-out routing 5, which is located on one side of the substrate 3 and in the fan-out area 2, and the fan-out routing 5 includes a first fan-out routing 7 located in the first area 21, the first fan-out routing 7 extends along a first direction X and is arranged in a second direction Y, two adjacent first fan-out routings 7 are insulated, and the second direction Y intersects with the first direction X; the first fan-out routing 7 includes a first sub-segment 71 and a second sub-segment 72, along a third direction Z, the maximum distance from the first sub-segment 71 to the substrate 3 is d1, the maximum distance from the second sub-segment 72 to the substrate 3 is d2, d1<d2, the third direction Z is a direction perpendicular to the plane where the substrate 3 is located, when the fan-out routing 5 is away from the substrate 3 When the insulating material is coated on one side, the accumulated insulating material will flow downward, that is, it can flow from the second sub-segment 72 to the first sub-segment 71; multiple first sub-segments 71 are continuously arranged along the fourth direction U to form a first diffusion area 8, and the fourth direction U intersects with the first direction X and the third direction Z respectively. Along the fourth direction U, the length of the first diffusion area 8 is greater than or equal to the preset distance. At this time, the first diffusion area 8 is equivalent to a diffusion channel, and the insulating material accumulated around the first diffusion area 8 flows into the first diffusion area 8, and even flows out of the first area 21 along the extension direction of the first diffusion area 8, thereby avoiding the uneven thickness of the insulating layer formed by the insulating material due to the accumulation of insulating material in the first area 21, and also avoiding the problem that the insulating layer formed by the insulating material is easy to fall off.

[0056] In some optional embodiments, reference Figure 2 , Figure 5 and Figure 6 , Figure 5 yes Figure 2 Another zoomed-in view of the first region in Figure 6 yes Figure 5 A cross-sectional view taken along the BB' direction, the array substrate 000 provided in this embodiment further includes:

[0057] A first metal layer 10 is located on one side of the substrate 3, and a first sub-segment 71 is located on the first metal layer 10;

[0058] The second metal layer 11 is located on a side of the first metal layer 10 away from the substrate 3 , and the second sub-segment 72 is located on the second metal layer 11 .

[0059] It is understandable that, referring to Figure 6, along the third direction Z, other film layers are also included between the substrate 3 and the first metal layer 10, and the other film layers include insulating layers, etc., which are not specifically described here. The first metal layer 10 and the second metal layer 11 are insulated, the first sub-segment 71 is located in the first metal layer 10, and the second sub-segment 72 is located in the second metal layer 11. In a first fan-out wiring 7, there is a gap between two adjacent second sub-segments 72, which reduces the wiring density of the second metal layer 11, thereby reducing the blocking effect of the wiring of the second metal layer 11. The gap is the corresponding position of the first sub-segment 71. Multiple first sub-segments 71 are continuously arranged along the fourth direction U to form a first diffusion area 8, that is, multiple gaps are continuously arranged along the fourth direction U to form a diffusion channel. When the second metal layer 11 is coated with insulating material on the side away from the substrate 3, the accumulated insulating material flows into the diffusion channel, and then flows out of the first area 21 along the diffusion channel to avoid the accumulation of insulating material causing the insulating layer formed by the insulating material to be uneven, which is convenient for the production of subsequent film layers.

[0060] In some optional embodiments, continue to refer to Figure 2 , Figure 5 and Figure 6 , the first sub-segment 71 and the second sub-segment 72 are connected through a via.

[0061] Understandably, Figure 6 It is only shown that the first sub-segment 71 is located in the first metal layer 10, and the second sub-segment 72 is located in the second metal layer 11. By setting vias, the electrical connection of the wiring of different film layers can be achieved, that is, the electrical connection of the first sub-segment 71 and the second sub-segment 72. The electrical connection of the first sub-segment 71 and the second sub-segment 72 through vias is more direct and the design is reasonable.

[0062] In some optional embodiments, referring to Figure 2 , Figure 7 and Figure 8 , Figure 7 yes Figure 2 Another enlarged view of the first area in Figure 8 yes Figure 2 Another enlarged view of the first area in FIG. 1 , the first fan-out trace 7 includes first sub-segments 71 and second sub-segments 72 that are alternately connected;

[0063] In the first region 21 , a plurality of first sub-segments 71 are continuously arranged along a fifth direction T to form a second diffusion region 9 . The fifth direction T intersects the first direction X and the third direction Z respectively, and the fifth direction T is parallel to or intersects the fourth direction U.

[0064] It is understandable that in Figure 7 It is only indicated that the fifth direction T is parallel to the fourth direction U, that is, the extension direction of the first diffusion region 8 is parallel to the extension direction of the second diffusion region 9. Of course, it is not limited to this. Figure 8, the fifth direction T may also be set to intersect with the fourth direction U, that is, the extension direction of the first diffusion region 8 intersects with the extension direction of the second diffusion region 9. The extension directions of the first diffusion region 8 and the second diffusion region 9 may be set according to actual needs. This embodiment does not impose any specific restrictions on this. The more diffusion regions there are, that is, the more diffusion channels there are, the more insulating material accumulated in the first region 21 can be guided out, so that the insulating material covers the fan-out region 2 more evenly, thereby avoiding uneven surface and easy falling off of the insulating layer formed by the insulating material.

[0065] In some optional embodiments, continue to refer to Figure 2 and Figure 7 , along the second direction Y, the minimum interval P between the first diffusion region 8 and the second diffusion region 9 is greater than 20 microns.

[0066] It can be understood that along the second direction Y, the minimum interval P between the first diffusion zone 8 and the second diffusion zone 9 is greater than 20 microns, and the minimum interval P between the first diffusion zone 8 and the second diffusion zone 9 can accommodate two vias, and will not affect the electrical connection between the first sub-segment 71 and the second sub-segment 72 of different film layers. At the same time, the position distribution of the diffusion zone is reasonable, which can play the role of the diffusion channel to the greatest extent.

[0067] In some optional embodiments, referring to Figure 2 and Fig. 9 , Fig. 9 yes Figure 2 Another enlarged view of the first area in FIG. 1 , the array substrate 000 provided in this embodiment further includes a display area 1, and the fan-out area 2 partially surrounds the display area 1;

[0068] The second diffusion region 9 is located on a side of the first diffusion region 8 away from the display region 1 . The fourth direction U is parallel to the fifth direction T. The first diffusion region 8 is offset from the second diffusion region 9 along the sixth direction R. The sixth direction R is perpendicular to the fourth direction U.

[0069] It is understandable that in Fig. 9It is only schematically shown that along the fourth direction U, the length of the first diffusion area 8 is equal to the length of the second diffusion area 9. Of course, the length of the first diffusion area 8 and the length of the second diffusion area 9 may also be unequal, or the extension direction of the first diffusion area 8 intersects with the extension direction of the second diffusion area 9, but it is not limited thereto. When the insulating material is coated in the seventh direction V, in the first area 21, a plurality of first fan-out wirings 7 inclined at large angles are densely arranged, which is equivalent to the function of a retaining wall to block the flow of the insulating material. The second diffusion area 9 is located on the side of the first diffusion area 8 away from the display area 1. Along the sixth direction R, the first diffusion area 8 and the second diffusion area 9 are staggered, that is, two shorter diffusion channels are staggered, which is equivalent to setting an opening in the "retaining wall", and the accumulated insulating material can also be guided out, and the arrangement of the shorter diffusion channels is more flexible. The first diffusion area 8 and the second diffusion area 9 are staggered, and the insulating material is diffused more evenly along the extension direction of the first fan-out wiring 7.

[0070] In some optional embodiments, referring to Figure 2 and Fig.10 , Fig.10 yes Figure 2 Another enlarged view of the first area in FIG. 1 , the array substrate 000 provided in this embodiment further includes a display area 1, and the fan-out area 2 partially surrounds the display area 1;

[0071] The second diffusion region 9 is located at a side of the first diffusion region 8 away from the display region 1;

[0072] In the first diffusion region 8 , the length of the first sub-segment 71 along the first direction X is k1 , and in the second diffusion region 9 , the length of the first sub-segment 71 along the first direction X is k2 , where k1 < k2 .

[0073] It can be understood that since the functions of the first diffusion zone 8 and the second diffusion zone 9 are to gather the accumulated insulating material and export the insulating material out of the first area 21, and the direction of exporting the insulating material is away from the display area 1, the second diffusion zone 9 is located on the side of the first diffusion zone 8 away from the display area 1, so along the first direction X, the width of the second diffusion zone 9 is greater than the width of the first diffusion zone 8, and the width of the second diffusion zone 9 depends on the length of the first sub-segment 71 along the first direction X, so k1 is set to be less than k2, so that along the first direction X, the width of the second diffusion zone 9 is greater than the width of the first diffusion zone 8, which is more conducive to exporting the insulating material to the side away from the display area 1, avoiding the situation where the insulating layer formed by the insulating material has uneven thickness.

[0074] In some optional embodiments, continue to refer to Figure 2 and Figure 5 , in the first diffusion region 8 , the lengths of the first sub-segments 71 along the first direction X are equal.

[0075] It is understandable that in Figure 5 It is only shown that the first region 21 only includes the first diffusion zone 8, of course, it is not limited to this. In the first diffusion zone 8, the lengths of the first sub-segments 71 along the first direction X are equal, that is, the width of the channel formed by the first diffusion zone 8 is constant, which is easy to manufacture.

[0076] Of course, in the first diffusion region 8, the lengths of the first sub-segments 71 along the first direction X may be different. Figure 8 In the first diffusion region 8, along the fourth direction U, the length of the first sub-segment 71 is continuously reduced, so the positive projection of the formed first diffusion region 8 on the substrate 3 is funnel-shaped, and the farther away from the display region 1, the more it expands outward, so that the insulating material accumulated in the first diffusion region 8 is guided away from the display region 1. By adjusting the length of the first sub-segment 71 in the diffusion region, the width of the formed diffusion channel can be changed. This embodiment does not make a specific limitation on this, and it can be selected according to actual needs.

[0077] In some optional embodiments, continue to refer to Figure 2 , Figure 5 and Figure 6 , along the first direction X, the width Q of the first diffusion region 8 is greater than or equal to 10 microns.

[0078] It can be understood that the larger the width Q of the first diffusion region 8 along the first direction X, the better the effect of collecting and conducting the insulating material, and the stronger the diffusion effect. If the width Q of the first diffusion region 8 along the first direction X is less than 10 microns, the diffusion effect will be poor. Of course, the width of the first diffusion region 8 along the first direction X can be set according to actual needs, and this embodiment does not impose any specific restrictions on this.

[0079] In some optional embodiments, continue to refer to Figure 2 and Figure 5 The fourth direction U has an angle θ with the coating direction of the insulating material, 0°≤θ≤45°.

[0080] It can be understood that the coating direction of the insulating material is the seventh direction V. Figure 5Only one possibility of the seventh direction V is illustrated. In the first area 21, multiple first fan-out wirings 7 with large angle inclinations are densely arranged, which have a retaining wall effect to block the flow of insulating materials. A first diffusion area 8 is set in the first area 21, which is equivalent to opening a channel in the retaining wall. The smaller the angle between the extension direction of the channel and the coating direction of the insulating material, the smaller the blocking effect on the insulating material and the better the diffusion effect. Therefore, the fourth direction U has an angle θ with the coating direction of the insulating material, 0°≤θ≤45, preferably, θ=0°, of course, θ=5°, θ=10°, θ=15°, θ=20°, θ=25°, θ=30°, θ=35°, θ=40°, θ=45° can also be set, and this embodiment does not make any specific restrictions on this.

[0081] In some optional embodiments, referring to Figure 2 , Figure 5 , Figure 6 and Fig.11 , Fig.11 is a flow chart of a method for manufacturing an array substrate provided by the present invention. This embodiment provides a specific method for manufacturing an array substrate 000, including:

[0082] S1: providing a substrate 3, the substrate 3 including a fan-out region 2, the fan-out region 2 including a first region 21;

[0083] S2: forming a fan-out trace 5 on one side of the substrate 3, the fan-out trace 5 includes a first fan-out trace 7, the orthographic projection of the first fan-out trace 7 on the substrate 3 is located in the first region 21; the first fan-out trace 7 extends along the first direction X and is arranged in the second direction Y, two adjacent first fan-out traces 7 are insulated, and the second direction Y intersects with the first direction X; the first fan-out trace 7 includes a first sub-segment 71 and a second sub-segment 72, along the third direction Z, the maximum distance from the first sub-segment 71 to the substrate 3 is d1, the maximum distance from the second sub-segment 72 to the substrate 3 is d2, d1<d2, and the third direction Z is a direction perpendicular to the plane where the substrate 3 is located;

[0084] The plurality of first sub-segments 71 are continuously arranged along a fourth direction U to form a first diffusion region 8, and the fourth direction U intersects the first direction X and the third direction Z respectively; along the fourth direction U, the length of the first diffusion region 8 is greater than or equal to a preset distance;

[0085] S3 : coating an insulating material on a side of the fan-out wiring 5 away from the substrate 3 , and part of the insulating material flows toward the first diffusion region 8 .

[0086] It is understandable that in Figure 6Only one relationship between d1 and d2 is illustrated. In step S2, since the insulating material has fluidity, d1<d2, the accumulated insulating material can flow from the corresponding position of the second sub-segment 72 to the corresponding position of the first sub-segment 71, and multiple first sub-segments 71 are continuously arranged along the fourth direction U to form a first diffusion area 8. The first diffusion area 8 is a diffusion channel. The diffusion channel has little or no blocking effect on the flow of the insulating material. In step S3, when the insulating material is coated on the side of the fan-out wiring 5 away from the substrate 3, the insulating material will diffuse in the diffusion channel to reduce material accumulation. The material accumulated at the position of the second sub-segment 72 will also flow to the diffusion channel and flow out along the diffusion channel, which can effectively improve the problem of uneven thickness of the insulating layer subsequently formed due to the accumulation of insulating material in the first region 21, so that the insulating layer formed by the insulating material has higher reliability and avoids the insulating layer formed by the insulating material from falling off.

[0087] Based on the same inventive concept, Fig.12 , Fig.12 It is a structural schematic diagram of the display panel provided by the present invention. The present invention also provides a display panel 100, including the array substrate 000 provided by any of the above embodiments. The display panel 100 can be a liquid crystal display panel 100. Of course, it is not limited to this. The display panel 100 provided by the embodiment of the present invention has the beneficial effects of the array substrate 000 provided by the embodiment of the present invention. For details, please refer to the specific description of the array substrate 000 in the above embodiments, and this embodiment will not be repeated here.

[0088] It can be seen from the above embodiments that the array substrate provided by the present invention achieves at least the following beneficial effects:

[0089] The array substrate provided by the present invention comprises a fan-out area, the fan-out area comprises a first area; a fan-out routing line is located on one side of a substrate and is located in the fan-out area, the fan-out routing line comprises a first fan-out routing line located in the first area, the first fan-out routing line extends along a first direction and is arranged in a second direction, two adjacent first fan-out routing lines are insulated, and the second direction intersects with the first direction; the first fan-out routing line comprises a first sub-segment and a second sub-segment, along a third direction, the maximum distance from the first sub-segment to the substrate is d1, the maximum distance from the second sub-segment to the substrate is d2, d1<d2, the third direction is a direction perpendicular to the plane where the substrate is located, and an insulating material is coated on a side of the fan-out routing line away from the substrate When the material is added, the accumulated insulating material will flow downward, that is, it can flow from the second sub-segment to the first sub-segment; multiple first sub-segments are continuously arranged along the fourth direction to form a first diffusion zone, and the fourth direction intersects with the first direction and the third direction respectively. Along the fourth direction, the length of the first diffusion zone is greater than or equal to the preset distance. At this time, the first diffusion zone is equivalent to a diffusion channel, and the insulating material accumulated around the first diffusion zone flows into the first diffusion zone, and even flows out of the first area along the extension direction of the first diffusion zone, thereby avoiding the uneven thickness of the insulating layer formed by the insulating material due to the accumulation of insulating material in the first area, and also avoiding the problem that the insulating layer formed by the insulating material is easy to fall off.

[0090] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. An array substrate, It is characterized in that comprising a fan-out region, the fan-out region comprising a first area; substrate; A fan-out routing line is located at one side of the substrate and in the fan-out area, wherein the fan-out routing line includes a first fan-out routing line located in the first area, the first fan-out routing line extends along a first direction and is arranged in a second direction, two adjacent first fan-out routing lines are insulated from each other, and the second direction intersects with the first direction; The first fan-out routing includes alternately connected first sub-segments and second sub-segments, along a third direction, a maximum distance between the first sub-segment and the substrate is d1, a maximum distance between the second sub-segment and the substrate is d2, d1<d2, and the third direction is a direction perpendicular to a plane where the substrate is located; a plurality of the first sub-segments are continuously arranged along a fourth direction to form a first diffusion region, and the fourth direction intersects the first direction and the third direction respectively; The first diffusion region comprises an insulating material, and along the fourth direction, a length of the first diffusion region is greater than or equal to a preset distance; In the first region, a plurality of the first sub-segments are continuously arranged along a fifth direction to form a second diffusion region, the fifth direction intersects the first direction and the third direction respectively, and the fifth direction is parallel to or intersects the fourth direction.

2. The array substrate according to claim 1, It is characterized in that Also includes: A first metal layer, located on one side of the substrate, wherein the first sub-segment is located on the first metal layer; The second metal layer is located on a side of the first metal layer away from the substrate, and the second sub-segment is located on the second metal layer.

3. The array substrate according to claim 2, It is characterized in that The first sub-segment and the second sub-segment are connected through a via.

4. The array substrate according to claim 1, It is characterized in that Along the second direction, a minimum interval between the first diffusion region and the second diffusion region is greater than 20 micrometers.

5. The array substrate according to claim 1, It is characterized in that Also comprising a display area, the fan-out area partially surrounding the display area; The second diffusion region is located on a side of the first diffusion region away from the display region, the fourth direction is parallel to the fifth direction, the first diffusion region is offset from the second diffusion region along the sixth direction, and the sixth direction is perpendicular to the fourth direction.

6. The array substrate according to claim 1, It is characterized in that Also comprising a display area, the fan-out area partially surrounding the display area; The second diffusion area is located at a side of the first diffusion area away from the display area; In the first diffusion region, the length of the first subsegment along the first direction is k1, and in the second diffusion region, the length of the first subsegment along the first direction is k2, where k1<k2.

7. The array substrate according to claim 1, It is characterized in that In the first diffusion region, lengths of the first sub-segments along the first direction are equal.

8. The array substrate according to claim 1, It is characterized in that Along the first direction, a width of the first diffusion region is greater than or equal to 10 micrometers.

9. The array substrate according to claim 1, It is characterized in that The fourth direction and the coating direction of the insulating material have an angle θ, 0°≤θ≤45°.

10. A method for manufacturing an array substrate, It is characterized in that include: Providing a substrate, the substrate comprising a fan-out region, the fan-out region comprising a first region; A fan-out trace is formed on one side of the substrate, the fan-out trace includes a first fan-out trace, the orthographic projection of the first fan-out trace on the substrate is located in the first region; the first fan-out trace extends along a first direction and is arranged in a second direction, two adjacent first fan-out traces are insulated, and the second direction intersects with the first direction; the first fan-out trace includes a first sub-segment and a second sub-segment that are alternately connected, along a third direction, a maximum distance from the first sub-segment to the substrate is d1, a maximum distance from the second sub-segment to the substrate is d2, d1<d2, and the third direction is a direction perpendicular to the plane where the substrate is located; A plurality of the first sub-segments are continuously arranged along a fourth direction to form a first diffusion region, and the fourth direction intersects with the first direction and the third direction respectively; Along the fourth direction, the length of the first diffusion area is greater than or equal to a preset distance; in the first region, a plurality of the first sub-segments are continuously arranged along a fifth direction to form a second diffusion area, the fifth direction intersects the first direction and the third direction respectively, and the fifth direction is parallel to or intersects the fourth direction; An insulating material is coated on a side of the fan-out wiring away from the substrate, and part of the insulating material flows toward the first diffusion region or the second diffusion region.

11. A display panel, It is characterized in that The invention comprises the array substrate according to any one of claims 1 to 9.

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