Grain removal device and grain removal method

Abstract

The present invention discloses a grain removal device, which is suitable for removing at least one grain that is predetermined to be removed on a carrier. The grain removal device includes a carrier, a light source, a light mask and a moving mechanism. The carrier is suitable for carrying the carrier. The light source is suitable for providing a light beam. The light mask is arranged between the carrier and the light source, and the light mask has a plurality of pattern units, each of which has at least one light-transmitting pattern, each of which corresponds to a grain, and the arrangement of the light-transmitting patterns of the pattern units is different. The moving mechanism is connected to the light mask and is suitable for moving the light mask so that the light beam passes through a pattern unit and irradiates at least one grain that is predetermined to be removed. The present invention also proposes a grain removal method.

Description

Technical Field

[0001] The present invention relates to a removal device and a method, and in particular to a grain removal device and a grain removal method. Background Art

[0002] Micro LED Display is a new display technology that has emerged in recent years. This technology thins, miniaturizes, and arrays light-emitting diodes (LEDs), and reduces the size of LEDs to the micron level. In the current process of micro LED display, mass transfer is one of the key steps, which mainly transfers the micro LED grains (hereinafter referred to as grains) on the wafer to the driving carrier. In order to ensure that the grains transferred to the driving carrier are good, before mass transfer, the defective grains on the wafer are often removed by a grain removal device.

[0003] The existing grain removal device removes the defective grains by irradiating the laser beam through the mask. The pattern of the mask is fixed, and the number of grains removed each time is one. It takes multiple removal steps to completely remove the defective grains on the wafer, which leads to poor removal efficiency. In addition, sometimes due to process defects, a small number of grains are offset from the predetermined position. To remove the grains that are offset from the predetermined position, there will be a problem of difficulty in alignment, and it is not easy to remove. Summary of the invention

[0004] The invention provides a grain removal device and a grain removal method to improve the efficiency of grain removal.

[0005] One embodiment of the present invention provides a grain removal device, which is suitable for removing at least one grain that is predetermined to be removed from a carrier, and the grain removal device includes a carrier, a light source, a light mask, and a moving mechanism. The carrier is suitable for carrying the carrier. The light source is suitable for providing a light beam. The light mask is arranged between the carrier and the light source, wherein the light mask has a plurality of pattern units, each pattern unit has at least one light-transmitting pattern, each light-transmitting pattern corresponds to one of the grains, and the arrangement of the light-transmitting patterns of the pattern units is different. The moving mechanism is connected to the light mask and is suitable for moving the light mask so that the light beam passes through one of the pattern units and irradiates at least one grain that is predetermined to be removed.

[0006] In one embodiment of the present invention, the above-mentioned die removal device further includes a lens, which is disposed between the mask and the stage and located on the transmission path of the light beam.

[0007] In one embodiment of the present invention, the light-transmitting patterns of each pattern unit are arranged in an M×N array, wherein M and N are positive integers, and at least one of the values ​​of M and N of any pattern unit is different from the values ​​of M and N of another pattern unit.

[0008] In an embodiment of the present invention, the values ​​of M and N of the pattern units are both odd numbers.

[0009] In one embodiment of the present invention, the values ​​of M and N of the pattern units are selected from 1×1, 1×3, 3×1, 1×5, 5×1, 1×7, 7×1, 3×3, 3×5, 5×3, 3×7, 7×3, 5×7, 7×5 and 7×7.

[0010] In an embodiment of the present invention, the light-transmitting patterns of each of the pattern units are integrated into a light-transmitting area.

[0011] In an embodiment of the present invention, the widths of each of the light-transmitting patterns and each of the die in the same direction are respectively D1 and D2 , wherein D1 is less than or equal to D2 .

[0012] In one embodiment of the present invention, the ratio D1:D2 is 0.5:1.

[0013] In one embodiment of the present invention, the above-mentioned carrier is a movable carrier.

[0014] In one embodiment of the present invention, the light source is a laser light source.

[0015] The present invention also provides a grain removal method, which is applicable to the grain removal device. The grain removal method includes placing a carrier plate on a carrier stage; selecting a suitable pattern unit from pattern units according to the distribution of at least one grain to be removed on the carrier plate; moving the mask by a moving mechanism so that the selected pattern unit is aligned with a light source; and allowing the light source to provide a light beam through the selected pattern unit to irradiate at least one grain to be removed.

[0016] In the grain removal device and the grain removal method of the embodiment of the present invention, since the mask has a plurality of pattern units, it is possible to select a suitable pattern unit for grain removal according to the distribution of bad grains, so as to improve the efficiency of grain removal and reduce the number of good grains sacrificed. In addition, if it is necessary to remove grains that are offset from a predetermined position, a pattern unit that can remove multiple grains at a time can be selected to increase the irradiation range of the light beam on the carrier, so that it is easy to remove the grains that are offset from the predetermined position. In addition, impurities within the irradiation range can also be removed.

[0017] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following specifically cites the preferred embodiments and describes them in detail with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 FIG. 1 is a three-dimensional schematic diagram of a grain removal device according to an embodiment of the present invention.

[0019] Figure 2 FIG. 4 is a schematic top view of a photomask of a die removal device according to another embodiment of the present invention.

[0020] Figure 3 FIG. 4 is a schematic flow chart of a grain removal method according to an embodiment of the present invention. DETAILED DESCRIPTION

[0021] Figure 1 This is a three-dimensional schematic diagram of a grain removal device according to an embodiment of the present invention. Figure 1 The grain removal device 10 of the present embodiment is suitable for removing at least one grain G that is predetermined to be removed on the carrier S. The grain removal device 10 includes a carrier 100, a light source 200, a light mask 300 and a moving mechanism 400. The carrier 100 is suitable for carrying the carrier S. The light source 200 is suitable for providing a light beam L. The light mask 300 is arranged between the carrier 100 and the light source 200, wherein the light mask 300 has a plurality of pattern units 310, each of which has at least one light-transmitting pattern 311, each of which corresponds to one of the grains G, and the arrangement of the light-transmitting patterns 311 of these pattern units 310 is different. The moving mechanism 400 is connected to the light mask 300, and is suitable for moving the light mask 300 so that the light beam L passes through one of the pattern units 310 and irradiates the grain G that is predetermined to be removed. In the present embodiment, the grain G is, for example, a micro-light-emitting diode grain, but is not limited thereto. In addition, the carrier S is, for example, a wafer substrate, or a carrier for temporarily carrying the die G during mass transfer, such as a tape, etc. The present invention does not limit the type of carrier S. In addition, in one embodiment, the carrier S can be a transparent substrate.

[0022] The moving mechanism 400 can, for example, move the mask 300 along a first direction X and a second direction Y that are perpendicular to each other. The light source 200 can be a laser light source or other high-energy light source, and the present invention does not limit the type of light source. The stage 100 can be a movable stage. In detail, the moving direction of the stage 100 is, for example, moving along the first direction X and the second direction Y, so that the grain G to be removed on the carrier S is moved to the transmission path of the light beam L. In addition, the grain removal device 10 may include a lens 500, which is arranged between the mask 300 and the stage 100 and is located on the transmission path of the light beam L to project the light beam L onto the grain G.

[0023] In the present embodiment, the light-transmitting patterns 311 of each pattern unit 310 on the mask 300 are arranged in an M×N array, for example, wherein M and N are positive integers, and at least one of the values ​​of M and N of any pattern unit is different from the values ​​of M and N of another pattern unit. In one embodiment, the values ​​of M and N of the pattern unit 310 are both odd numbers, such as 1, 3, 5, and 7, so as to facilitate the alignment of the pattern unit 310 and the light source 200 and improve the alignment accuracy. Specifically, the values ​​of M and N of the pattern unit 310 are selected from 1×1, 1×3, 3×1, 1×5, 5×1, 1×7, 7×1, 3×3, 3×5, 5×3, 3×7, 7×3, 5×7, 7×5, and 7×7. Figure 1 For example, the values ​​of M and N of the pattern units 310 on the mask 300 include 1×1, 1×3, 3×1, 1×5, 3×3, 3×5, 5×3, 1×7, and 3×7.

[0024] In this embodiment, the light-transmitting patterns 311 of each pattern unit 310 on the mask 300 are integrated into a light-transmitting area. Figure 2 The photomask 300a is shown. In the photomask 300a, the light-transmitting patterns 311a of each pattern unit 310a are, for example, separated from each other.

[0025] Figure 3 FIG. 1 is a flow chart of a grain removal method according to an embodiment of the present invention. Figure 1 and Figure 3 The grain removal method of this embodiment is applicable to the grain removal device 10 described above, and includes the following steps:

[0026] Step S1: placing the carrier S on the carrier 100;

[0027] Step S2: selecting a suitable pattern unit 310 from the pattern units 310 according to the distribution of at least one grain G to be removed on the carrier S;

[0028] Step S3: moving the mask 300 by the moving mechanism so that the selected pattern unit 310 is aligned with the light source 200; and

[0029] Step S4 : enabling the light source 200 to provide a light beam L that passes through the selected pattern unit 310 and irradiates at least one grain G to be removed.

[0030] by Figure 1For example, the grain G coated with oblique lines is indicated as a defective grain Gb. The grain removal device 10 of this embodiment can select a suitable pattern unit 310 according to the distribution of the defective grains Gb. Specifically, the carrier S is first placed on the carrier 100 (such as step S1). When the defective grains Gb in the block B1 are to be removed, a 1×1 pattern unit 310 can be selected (such as step S2). The 1×1 pattern unit 310 is moved to the transmission path of the light beam L by the moving mechanism 400 (such as step S3), and the carrier S is moved by the carrier 100 so that the block B1 is located in the irradiation range of the light beam L (corresponding to the range of the block B1). In this way, the defective grains Gb in the block B1 can be removed (such as step S4). In addition, when it is necessary to remove the defective grains Gb in block B2, a 3×3 pattern unit 310 can be selected (such as step S2), and the 3×3 pattern unit 310 can be moved to the transmission path of the light beam L by the moving mechanism 400 (such as step S3), and the carrier S can be moved by the stage 100 so that block B2 is located in the irradiation range of the light beam L (corresponding to the range of block B2), so that all the defective grains Gb in block B2 can be removed in one removal step (such as step S4). Although a small number of good grains G (such as grains G1 and G2) will be removed at the same time, the time cost saved is greater than the cost of the sacrificed grains G1 and G2 because the removal efficiency of the defective grains Gb in block B2 can be greatly improved. Moreover, because the appropriate pattern unit 310 can be selected according to the distribution of the defective grains Gb, the number of good grains G that are sacrificed can be reduced. Similarly, when the defective grains Gb in the block B3 are to be removed, a 5×3 pattern unit 310 may be selected; and when the defective grains Gb in the block B4 are to be removed, a 1×5 pattern unit 310 may be selected.

[0031] Furthermore, if the crystal grains G that are offset from the predetermined position are to be removed, a pattern unit 310 that can remove multiple crystal grains G at one time can be selected to increase the irradiation range of the light beam L on the carrier S, so that the crystal grains G that are offset from the predetermined position can be easily removed. In addition, impurities within the irradiation range can also be removed.

[0032] Although in the above-mentioned embodiment, the carrier S is moved by the carrier 100 so that the grain G to be removed is located within the irradiation range of the light beam L, in other embodiments, the light source 200 and the mask 300 may be moved so that the light beam L irradiates the grain G to be removed while the carrier S is fixed.

[0033] It is worth mentioning that in the existing photomask, the size of each pattern unit is larger than the size of the grain, and then used in conjunction with a zoom lens. In one embodiment of the present invention, the size of each light-transmitting pattern 311 on the photomask 300 can be designed to be equal to or smaller than the size of the grain G. Specifically, the width values ​​of each light-transmitting pattern 311 and each grain G in the same direction are D1 and D2, respectively, where D1 is less than or equal to D2. Taking the first direction X as an example, the width value of the width W1 of the light-transmitting pattern 311 in the first direction X is D1, and the width value of the width W2 of the grain G in the first direction X is D2, where D1 is less than or equal to D2; taking the second direction Y as an example, the width value of the width W3 of the light-transmitting pattern 311 in the second direction Y is D1, and the width value of the width W4 of the grain G in the second direction Y is D2, where D1 is less than or equal to D2. In one embodiment, D1:D2 can be 0.5:1. The magnification of the above-mentioned lens 500 is adjusted in conjunction with the size of the light-transmitting pattern 311. Thus, when a suitable pattern unit 310 is selected, the moving time of the mask 300 can be greatly shortened, further improving the grain removal efficiency.

[0034] In summary, in the grain removal device and the grain removal method of the embodiments of the present invention, since the mask has a plurality of pattern units, it is possible to select a suitable pattern unit for grain removal according to the distribution of defective grains, so as to improve the efficiency of grain removal and reduce the number of good grains sacrificed. In addition, if it is necessary to remove grains that are offset from a predetermined position, a pattern unit that can remove multiple grains at a time can be selected to increase the irradiation range of the light beam on the carrier, so that it is easy to remove the grains that are offset from the predetermined position. In addition, impurities within the irradiation range can also be removed. In one embodiment, the size of the pattern unit is designed to be equal to or smaller than the size of the grain, which can reduce the time for the mask to move and further improve the efficiency of grain removal.

[0035] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the methods and technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A die removal device, suitable for removing at least one die to be removed from a carrier, characterized in that: The grain removal device comprises: A carrier, suitable for carrying the carrier; a light source adapted to provide a light beam; a photomask disposed between the carrier and the light source, wherein the photomask has a plurality of pattern units, each of the pattern units has at least one light-transmitting pattern, each of the at least one light-transmitting pattern corresponds to one of the die, and the at least one light-transmitting pattern of the pattern units are arranged in different ways; and A moving mechanism connected to the photomask and adapted to move the photomask so that the light beam passes through one of the pattern units and irradiates the at least one crystal grain to be removed; The at least one light-transmitting pattern of each of the pattern units is arranged in an M×N array, M and N are positive integers, and at least one of the values ​​of M and N of any of the pattern units is different from the values ​​of M and N of another of the pattern units.

2. The grain removal device according to claim 1, characterized in that: The crystal grain removal device further comprises a lens, which is arranged between the light mask and the carrier and located on the transmission path of the light beam.

3. The grain removal device according to claim 1, characterized in that: The values ​​of M and N of the pattern units are all odd numbers.

4. The grain removal device according to claim 1, characterized in that: The values ​​of M and N of the pattern units are selected from 1×1, 1×3, 3×1, 1×5, 5×1, 1×7, 7×1, 3×3, 3×5, 5×3, 3×7, 7×3, 5×7, 7×5 and 7×7.

5. The grain removal device according to claim 1, characterized in that: The at least one light-transmitting pattern of each of the pattern units is integrated into a light-transmitting area.

6. The grain removal device according to claim 1, characterized in that: The widths of each of the at least one light-transmitting pattern and each of the grains in the same direction are respectively D1 and D2, wherein D1 is less than or equal to D2.

7. The grain removal device according to claim 6, characterized in that: D1:D2 is 0.5:

1.

8. The grain removal device according to claim 1, characterized in that: The carrier is a movable carrier.

9. A grain removal method, applicable to a grain removal device, characterized in that: The grain removal device is suitable for removing at least one grain to be removed on a carrier, and the grain removal device includes a carrier, a light source, a mask and a moving mechanism, wherein the mask is arranged between the carrier and the light source, wherein the mask has a plurality of pattern units, each of the pattern units has at least one light-transmitting pattern, each of the at least one light-transmitting pattern corresponds to one of the grains, and the arrangement of the at least one light-transmitting pattern of the pattern units is different, the moving mechanism is connected to the mask and is suitable for moving the mask, and the grain removal method includes: placing the carrier plate on the carrier stage; Selecting a suitable pattern unit from the pattern units according to the distribution of the at least one die to be removed on the carrier; Moving the light mask by the moving mechanism so that the selected pattern unit is aligned with the light source; and The light source provides a light beam through the selected pattern unit to irradiate the at least one crystal grain to be removed; The at least one light-transmitting pattern of each of the pattern units is arranged in an M×N array, M and N are positive integers, and at least one of the values ​​of M and N of any of the pattern units is different from the values ​​of M and N of another of the pattern units.

Images