Solder composition and electronic component

Abstract

The present invention provides a solder composition containing Sn. The composition contains 1.0 to 5.0 mass% of Cu, 0.1 to 0.5 mass% of Ni, and more than 0.01 mass% and 0.5 mass% or less of Ge.

Description

Technical Field

[0001] This invention relates to solder compositions and electronic components. Background Technology

[0002] Examples of lead-free solders that are substantially lead-free include Sn-Cu-Ni-P-Ga series (Patent Document 1).

[0003] However, when these lead-free solders are used in the manufacture of electronic components at high temperatures of 300–450°C, there is a problem during soldering where solder bulge (the solder protrudes from the solder joint towards the front end) can easily occur. Moreover, if solder bulge occurs, the design of electronic components must take this into account, resulting in larger external dimensions of the electronic components, making them unsuitable for high-density mounting.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2007-75836 Summary of the Invention

[0007] The technical problem that the invention aims to solve

[0008] The present invention was made in view of such practical circumstances, and its object is to provide a solder composition and electronic component suitable for high-density mounting.

[0009] Technical solutions for solving technical problems

[0010] To achieve the above objectives, the present invention provides a solder composition containing Sn, characterized in that...

[0011] Contains 1.0% or more but less than 5.0% by mass of Cu, 0.1% or more but less than 0.5% by mass of Ni, and more than 0.01% but less than 0.5% by mass of Ge.

[0012] The solder composition of the present invention contains Sn, as well as Cu, Ni, and Ge, thus enabling a substantially lead-free solder composition. Furthermore, the solder composition according to the present invention can suppress solder bulging during soldering in high-temperature regions (e.g., 300–450°C). By suppressing solder bulging, short circuits caused by solder bulging contacting other terminals (other circuit patterns or other electronic components) can be prevented.

[0013] Furthermore, by suppressing solder bulging, it is not necessary to factor in the occurrence of solder bulging and lengthen the terminal mounting portion, making it easier to reduce the size of electronic components, including the terminal mounting portion. Therefore, high-density mounting of electronic components becomes easier. For example, in the event of solder bulging, when connecting wire leads to the terminal wiring portion with a solder composition, it is necessary to factor in the occurrence of solder bulging and make the terminal mounting portion below the wiring portion longer than the wiring portion.

[0014] By using the solder composition of the present invention, solder bulging can be suppressed, thereby shortening the length of the mounting portion of the terminal in electronic components and reducing the size of the electronic components including the mounting portion of the terminal. Furthermore, the inspection of the mounting status at the terminal mounting portion becomes easier, facilitating automated installation inspections and contributing to automation of inspections and cost reduction of electronic components.

[0015] Furthermore, it can suppress solder balls that scatter around due to heating the solder to high temperatures. Therefore, it can effectively prevent short circuits with other circuits or between electronic components caused by solder balls scattering onto other circuit patterns or electronic components. Therefore, this solder composition is suitable for high-density mounting of electronic components. Additionally, this solder composition is suitable for use in high-temperature mounting applications.

[0016] Furthermore, according to this solder composition, even when used on the lead portion of an electrical wire, it can effectively prevent the copper or other metals of the wire from dissolving into the solder, thus preventing the wire from becoming thinner.

[0017] Preferably, the solder composition also contains 0.001 to 0.5% by mass of P. More preferably, it contains 0.001 to 0.5% by mass of Ga. In such a solder composition, solder ball scattering can be further suppressed. Furthermore, solder oxidation can be effectively prevented.

[0018] The electronic component of the present invention has a solder portion containing the solder composition described above. Alternatively, the electronic component may have terminal electrodes with connection portions for connecting wires, the wire portions being electrically connected to the solder portion and the connection portions. Alternatively, the wire portions may be wound around the connection portions.

[0019] Alternatively, the terminal electrode may also have a mounting portion, with the wiring portion positioned on the opposite side of the mounting portion. When soldering in the solder portion using the solder composition of the present invention at high temperatures of 300–450°C, solder bulging can be suppressed. Therefore, even if the wiring portion is positioned above the mounting portion, the length of the mounting portion can be set to the necessary minimum length, and the engagement state (e.g., solder joint) of the mounting portion can be observed from above the wiring portion using a camera for automatic installation inspection, making it suitable for automatic installation inspection. Attached Figure Description

[0020] Figure 1A This is a schematic front view of an electronic component according to one embodiment of the present invention.

[0021] Figure 1B yes Figure 1A Enlarged view of the main parts of the electronic component shown.

[0022] Figure 2 yes Figure 1A A top view of the electronic components shown.

[0023] Figure 3 This is a schematic perspective view of an electronic component according to another embodiment of the present invention.

[0024] Figure 4 This is a schematic diagram for measuring solder length.

[0025] Figure 5A This is a graph showing the change in the distance between the terminal electrode terminals before and after soldering the coil device according to an embodiment of the present invention.

[0026] Figure 5B This is a graph showing the change in the distance between the terminal electrode terminals before and after soldering the coil device of the comparative example of the present invention.

[0027] Figure 6 This is a graph showing the relationship between solder impregnation time and wire diameter changes in the embodiments and comparative examples of the present invention.

[0028] Figure 7A This is a cross-sectional view of the device used to evaluate the amount of solder balls.

[0029] Figure 7B yes Figure 7A Top view of the apparatus for evaluating solder ball quantity.

[0030] Figure 8 This is a schematic diagram showing the appearance of solder ball adhesion in the evaluation of solder ball quantity.

[0031] Explanation of reference numerals in the attached figures

[0032] 1, 2... Coil device

[0033] 10… Soldering Department

[0034] 11…Terminal Electrode

[0035] 12… Installation Department

[0036] 13…lead section

[0037] 14… Wiring section

[0038] 15…cover plate

[0039] 16…core

[0040] 17…Terminal Block

[0041] 18…Flange portion

[0042] 19… Coil section

[0043] 20…Spool section

[0044] 22… wires

[0045] 23… cameras

[0046] 31… Coil section

[0047] 31a…Intermediate coil section

[0048] 31b…End coil section

[0049] 32… Installation Department

[0050] 33…core

[0051] 33a…main core

[0052] 33b…secondary core

[0053] 40…Test wire

[0054] 40A…Electric wire front end

[0055] 40b… Solder front end

[0056] 41… Solder bath

[0057] 42… Solder bath

[0058] 42a… Solder surface

[0059] 43…Substrate

[0060] 44…Double-sided tape

[0061] 45…cage

[0062] 46… Through hole

[0063] 47… Solder ball Detailed Implementation

[0064] The present invention will now be described based on the embodiments shown in the accompanying drawings.

[0065] First Implementation Method

[0066] like Figure 1A As shown, the coil device 1, an electronic component according to one embodiment of the present invention, has two coil portions 19, 19, which function as a transformer. Each coil portion 19 is formed by winding an electric wire 22 around a spool portion 20. Furthermore, a (not shown) center leg portion of a core portion 16 is inserted into the spool portion 19. Additionally, each coil portion 19, 19 is separated by a flange portion 18. A cover 15 is mounted on the upper part of each coil portion 19, 19.

[0067] The wires that form the coil section 19 and connect to each terminal section are not particularly limited; for example, conductive wires such as copper, copper alloy, iron, iron alloy, and CP wire can be used. The insulating material that forms the insulating sheathing layer of the sheathed wire is not particularly limited; polyurethane, polyamide-imide, ETFE, etc., can be used.

[0068] There are no particular limitations on the raw materials used for the core 16. It is a magnetic material composed of ferrite compositions, metal compositions, or composite compositions of the same and resins, and is manufactured by methods such as compression molding followed by firing or conventional powder molding.

[0069] The spool portion 20 is formed, for example, by injection molding. There are no particular limitations on its raw material; it can be made of materials such as PBT, PET, LCP, PA, or, from the perspective of heat resistance, phenolic resin. The cover plate 15 can be made of the same material as the spool, but it can also be made of an insulating component other than resin. As long as it can be molded, the spool portion 20 can also be made of an insulating component other than resin.

[0070] Terminal blocks 17, 17 are integrally formed at both ends of the online shaft portion 20 in the Y-axis direction. For example... Figure 2 As shown, each terminal block 17 has an insert formed with a plurality of terminal electrodes 11 arranged side by side in the X-axis direction.

[0071] like Figure 1AAs shown, the terminal electrode 11 is formed in a U-shape with a mounting portion 12 and a wiring portion 14. The wiring portion 14 protrudes outward from the end face 17y of the terminal block 17 in the Y-axis direction. The mounting portion 12 extends downward from the bottom of the terminal block 17 in the Z-axis direction and then protrudes outward in the Y-axis direction. The mounting portion 12 protrudes slightly longer outward in the Y-axis direction than the wiring portion 14. The wiring portion 14 is positioned on the Z-axis at the opposite mounting side (upper side) of the mounting portion 12. Furthermore, in the figures, the X-axis, Y-axis, and Z-axis are perpendicular to each other.

[0072] like Figure 1B As shown, a lead portion 13 with an electrical wire 22 is wound around the connection portion 14. Additionally, a solder portion 10 is formed to cover the lead portion 13 and the connection portion 14. The connection portion 14 and the lead portion 13 are electrically connected via the solder portion 10.

[0073] The solder section 10 is composed of a solder composition, which may also contain flux or other components. The solder composition of this embodiment is substantially lead-free. The liquidus temperature of the solder composition of this embodiment is lower than the soldering temperature, for example, 220–380°C. Furthermore, in this embodiment, "substantially lead-free" means that the lead content of the solder composition is preferably 0.10% by mass or less, more preferably 0.05% by mass or less, and particularly preferably 0.01% by mass or less.

[0074] The solder composition of this embodiment contains Sn as a main component. The Sn content in the solder composition is not particularly limited, but is preferably 90% by mass or more, more preferably 93% by mass or more, and particularly preferably 94% by mass or more. Within this range, a lead-free solder composition can be easily achieved.

[0075] Furthermore, the Cu content in the solder composition of this embodiment is 1.0% by mass or more and 5.0% by mass or less, preferably 2.0% by mass or more, more preferably 2.5% by mass or more, and more preferably 3.5% by mass or less. By setting it within such a range, the suppression effect of wire diameter thinning is improved without causing a decrease in solderability.

[0076] The Ni content in the solder composition of this embodiment is 0.1% by mass or more and 0.5% by mass or less, preferably 0.15% by mass or more, more preferably 0.2% by mass or more, more preferably 0.4% by mass or less, and more preferably 0.3% by mass or less. By setting it within such a range, the effect of suppressing wire diameter thinning is improved.

[0077] In this embodiment, the total content of Cu and Ni is preferably more than 1.2% by mass, more preferably 2.0% by mass or more, and even more preferably 3.0% by mass or more.

[0078] The Ge content in the solder composition of this embodiment is more than 0.01% by mass and less than 0.5% by mass, preferably more than 0.015% by mass, more preferably more than 0.02% by mass, particularly preferably more than 0.04% by mass, or more than 0.05% by mass, preferably less than 0.3% by mass, more preferably less than 0.1% by mass, and particularly preferably less than 0.08% by mass. By setting it within such a range, the effect of suppressing solder bulging is improved.

[0079] The content of P in the solder composition of this embodiment can also be substantially 0, preferably more than 0.001% by mass and less than 0.5% by mass, more preferably more than 0.01% by mass and more than 0.02% by mass, preferably less than 0.3% by mass, and more preferably less than 0.1% by mass. By setting it to such a range, the effect of suppressing solder ball scattering is improved.

[0080] In this embodiment, the solder composition contains Sn, as well as Cu, Ni, and Ge, thus achieving a lead-free solder composition that is substantially lead-free. Furthermore, the solder composition according to this embodiment can suppress solder bulging during soldering in high-temperature regions (e.g., 300–450°C). By suppressing solder bulging, short circuits caused by solder bulging contacting other terminals (other circuit patterns or other electronic components) can be prevented.

[0081] Furthermore, by suppressing solder bulging, such as Figure 1B As shown, the mounting portion 12 of the terminal electrode 11 is lengthened along the Y-axis without needing to anticipate solder bulging. Therefore, it is easy to shorten... Figure 1A The coil assembly 1 shown includes a mounting portion 12 with terminal electrodes 11 along its entire length Ly0 of the Y-axis. Therefore, high-density mounting of the coil assembly 1 becomes easy.

[0082] For example, such as Figure 1B As shown, when solder bulges occur at the solder tip 52 of the solder portion 10, which protrudes outward along the Y-axis from the tip 14a of the terminal electrode 11's wiring portion 14, the solder length ΔL1 becomes longer. Therefore, when the lead portion 13 of the wire 22 is connected to the solder portion 10, which is composed of a solder composition, at the terminal electrode 11's wiring portion 14, it is necessary to consider the occurrence of solder bulge and make the mounting portion 12 of the terminal electrode 11 located below the wiring portion 14 longer along the Y-axis than the wiring portion 14.

[0083] That is, the length Ly3 of the mounting portion 12 along the Y-axis from the end face 17y of the terminal block 17 needs to be longer than the length Ly2 obtained by adding the solder length ΔL1 to the length Ly1 of the wiring portion 14 along the Y-axis from the end face 17y. This is because if this is not done, Figure 1B The solder tip 52 shown will become an obstacle, such as Figure 1A As shown, it is difficult to observe the mounting state of the mounting part 12 using a camera 23 or similar device located above the wiring part 14 on the Z-axis. That is, it is difficult to automatically check whether the front end of the mounting part 12 along the Y-axis is aligned with the circuit pattern such as the circuit board (not shown) using a camera 23 or similar device.

[0084] When the solder portion 10 is made of the solder composition of this embodiment, the occurrence of solder bulging can be suppressed. Therefore, the length of the solder tip Ly2 from the end face 17y of the terminal block can be shortened. Figure 1B The length Ly3 of the mounting portion 12 of the terminal electrode 11 shown can be reduced. Figure 1A The length along the Y-axis of the coil device 1, which includes the mounting portion 12 of the terminal electrodes 11, is shown as Ly0 (particularly the distance between the terminal electrodes 11). Furthermore, checking the mounting status of the terminal electrodes 11 on the mounting portion 12 becomes easier, and automated installation checks are also easier to handle, contributing to the automation of inspections and the reduction of the cost of the coil device 1.

[0085] Furthermore, in this embodiment, solder balls that scatter around the solder (solder composition) constituting the solder section 10 when heated to a high temperature can be suppressed. Therefore, short circuits with other circuits or between multiple coil devices 1 caused by solder balls scattering onto other circuit patterns, electronic components, etc., can be effectively prevented. Therefore, the solder composition of this embodiment is suitable for high-density mounting of coil devices 1, etc. Additionally, this solder composition is suitable for use in high-temperature mounting applications.

[0086] Furthermore, the solder composition constituting the solder portion 10 according to this embodiment can effectively prevent the wire thinning phenomenon, where the copper or other metals of the wire 22 dissolve into the solder and the lead portion 13 becomes thinner, even when used on the lead portion 13 of the wire 22. Therefore, the reliability of the mechanical connection and electrical connection between the lead portion 13 and the connection portion 14 is improved.

[0087] Furthermore, it is preferable that the liquidus temperature (or melting point) of the solder when the mounting portion 12 of the terminal electrode 11 is connected to the circuit board or the like is the same as or lower than the liquidus temperature (or melting point) of the solder composition of this embodiment.

[0088] Furthermore, the solder composition of this embodiment may contain other components, such as Ag, Zn, Sb, Au, etc., without affecting its effectiveness. Additionally, the solder composition of this embodiment also contains unavoidable impurities. The fewer unavoidable impurities, the better; more preferably, their total content is less than 1% by mass.

[0089] Second Implementation Method

[0090] like Figure 3As shown, the coil device 2 of this embodiment functions as, for example, a surface-mount inductor in a power supply circuit. The coil device 2 has a core 33 and a coil 31, a mounting portion 32 is formed in the coil portion 31, and a solder portion 10 is formed on the surface of the mounting portion 32. The structure of the solder portion 10 is the same as in the embodiment described above, and it performs the same function.

[0091] like Figure 3 As shown, core 33 has a main core 33a with a generally cuboid shape and a secondary core 33b with a generally cuboid shape disposed above it in the Z-axis direction.

[0092] The coil 31 is obtained by stamping a plate-shaped conductor. The intermediate coil portion 31a of the coil 31 extends linearly along the Y-axis direction. The two ends of the intermediate coil portion 31a in the Y-axis direction are connected to the end coil portions 31b respectively. The end coil portions 31b extend linearly downward in the Z-axis direction. A mounting portion 32 is formed at the lower end of the end coil portion 31b in the Z-axis direction, extending downward in the Z-axis direction and further bending outward in the Y-axis direction.

[0093] The intermediate coil portion 31a is sandwiched between cores 33a and 33b and disposed within a groove extending linearly in the Y-axis direction on the Z-axis surface of the main core 33a. In this embodiment, the Z-axis surface of the main core 33a and the Z-axis bottom surface of the secondary core 33b are fixed and integrated by an adhesive (not shown), with the intermediate coil portion 31a of the coil 31 sandwiched between them. The end coil portions 31b are disposed within grooves extending linearly downward in the Z-axis direction on both end faces of the main core 33a in the Y-axis direction.

[0094] The plate-shaped conductor constituting the coil 31 and the mounting portion 32 is not particularly limited, and metals such as copper, copper alloys, silver, and gold can be used. A metal plating layer is applied to the surface of the plate-shaped conductor, for example. Examples of metal plating layers include nickel plating, tin plating, solder plating, and silver plating; the plating layer can be a single layer or multiple layers. Preferably, at least the mounting surface of the mounting portion 32 has a metal plating layer formed on the surface of the plate-shaped conductor.

[0095] A solder portion 10 is formed on the surface of the mounting portion 32. The method of forming the solder portion 10 is not particularly limited, and examples include the immersion method and the reflow method. Furthermore, the solder portion 10 can be formed after the coil device 2 is assembled, before the coil device 2 is assembled, or when the coil device 2 is connected to the circuit board or the like.

[0096] Furthermore, the present invention is not limited to the embodiments described above, and various modifications can be made within the scope of the present invention.

[0097] For example, as an electronic component using the solder composition of the present invention, it is not limited to coil devices such as transformers, but can also be applied to coil devices for other purposes, or other electronic components with terminal electrodes, such as capacitors, rheostats, resistors, etc.

[0098] Example

[0099] The present invention will be further described below based on detailed embodiments, but the present invention is not limited to these embodiments.

[0100] Examples and Comparative Examples

[0101] Solder compositions were prepared by combining various elements. Various solder materials were prepared by mixing different solder compositions and flux (Senju Metal Industries SR-209). The component proportions of each solder composition are shown in Tables 1 to 3. The solder compositions were evaluated using the following methods.

[0102] [Determination of solder length]

[0103] like Figure 4 As shown, a test wire 40 made of copper wire (AIEIW) with an outer diameter of 1.0 mm after insulation coating is prepared, and the front end 40a of the wire is ground to make it flat. Various solder materials are heated to above the liquidus temperature and below 440°C. The front end 40a of the wire is immersed in the solder placement surface from a direction perpendicular to the vertical axis downwards, and then lifted in the opposite direction at a speed of 1 mm / s to 15 mm / s to cool it.

[0104] like Figure 4 As shown, the solder length ΔL2 (mm) from the wire tip 40a to the solder tip 40b was thus measured. This measurement was performed four times with different wires, and the maximum and minimum values ​​of the obtained solder length ΔL2 are shown in Table 1.

[0105] Table 1

[0106]

[0107] As shown in Table 1, in Examples 1 to 7 where the content of each component was within the specified range, the solder length ΔL2 was 0.2 to 0.4 mm. Additionally, as... Figure 4 As shown by the double-dotted line, in Examples 1 to 7, the solder end 52 becomes a gentle r-shape with almost no solder bulge.

[0108] In contrast, in Comparative Examples 1-5, where the Ni and Ge contents were outside the specified range, the minimum solder length ΔL2 (mm) was 0.5 mm, and the maximum was 0.9 mm. Furthermore, in Comparative Examples 1-5, such as... Figure 4As shown by the solid line, the solder tip 40b becomes conical, confirming the occurrence of solder bulging.

[0109] Furthermore, in Examples 11-15, the solder length ΔL2 was 0.2-0.7 mm, which was worse than in Examples 1-7, but better than in Comparative Examples 1-5. Additionally, as... Figure 4 As shown by the double-dotted line, in Examples 11-15, the solder end 52 also forms a gentle r-shape with almost no solder bulge.

[0110] Furthermore, using the solder composition of Example 1 described above, a practical formation is formed Figure 1A The distance (lead length) LyOa between the solder section 10 of the coil device 1 shown, which includes the solder section 10, and the two connecting sections 14 located on the outer side of the Y-axis, was measured. The change in length (mm) before and after soldering was investigated. Twenty pairs of test connecting sections 14 were investigated, and their frequency and length changes were measured. The results were presented in... Figure 5A As shown in [the image]. Figure 5A In the diagram, frequency is represented by the horizontal axis, and length variation is represented by the vertical axis.

[0111] In addition, similarly, using the solder composition of Comparative Example 1, a solder composition is actually formed. Figure 1A The distance (lead length) LyOa between the solder section 10 of the coil device 1 shown, which includes the solder section 10, and the two connecting sections 14 located on the outer side of the Y-axis, was measured. The change in length (mm) before and after soldering was investigated. Twenty pairs of test connecting sections 14 were investigated, and their frequency and length changes were measured. The results were presented in... Figure 5B As shown in the image.

[0112] like Figure 5A and Figure 5B As shown, compared with Comparative Example 1, it can be confirmed that the change in lead length is very small in Example 1.

[0113] [Evaluation of line fineness]

[0114] Two types of polyurethane copper wire (2UEWΦ0.16) with an outer diameter of 0.16 mm were prepared. Multiple wires were immersed for 10 seconds in solder material composed of the solder compositions and flux of Examples 2, 6, and 7 above, heated to 405–415°C. The wire diameter after immersion was measured, and the reduction rate relative to the wire diameter before immersion was calculated as the wire fineness. The results are shown in Table 2.

[0115] Table 2

[0116]

[0117] As shown in Table 2, in Example 2, compared with Comparative Examples 6 and 7, it can be confirmed that line thinning was significantly suppressed. To reduce line thinning, it is considered preferable to contain at least a specified proportion of Ni in the solder composition. Furthermore, the relationship between impregnation time and wire diameter when using the solder compositions of Example 1 and Comparative Example 1 is shown in Table 2. Figure 6 As shown in the image.

[0118] [Evaluation of solder ball quantity]

[0119] like Figure 7A and Figure 7B As shown, a 40×40mm square substrate 43 is prepared, and a 20×25mm square double-sided adhesive tape 44 is pasted on its lower surface in the center. A test wire 40, consisting of 1000 strands of two types of polyurethane copper wire (2UAE) with an outer diameter of 0.05mm, is passed through a through hole 46 in the center of the substrate.

[0120] Before and after it, containers are prepared to hold solder compositions containing respectively those of Example 1, Example 2, and Comparative Example 1. Figure 7A The solder bath 42 shown has a solder tank 41. Next, the wire 40 and the substrate 43 are fixed to the holder 45. In the solder bath 42 at a temperature of 380-390°C, the solder immersion depth Lz1 is 10 mm, and the wire is immersed for 5 seconds at a distance Lz2 of 5 mm from the double-sided tape 44 to the solder surface, so that the solder adheres to the tip of the wire 40. The flux used is Senju Metal Industries SR-209. Afterwards, as shown... Figure 8 As shown, the number of solder balls adhering to the surface of double-sided tape 44 was calculated. This experiment was conducted four times, and the average value was calculated. The results are shown in Table 3.

[0121] Table 3

[0122]

[0123] As shown in Table 3, compared with Comparative Example 1 which does not contain Ni and Ge, in Examples 1 and 2 where the contents of each component are within the specified range, it can be confirmed that the occurrence of solder balls is suppressed.

Claims

1. A solder composition containing Sn, wherein, The solder composition is used to suppress solder bulging and wire thinning during wiring. Containing 2.5% to 5.0% by mass of Cu, 0.1% to 0.5% by mass of Ni, and more than 0.01% to 0.5% by mass of Ge. Contains more than 0.001% by mass and less than 0.5% by mass of P. The liquid phase temperature is 220–380℃.

2. The solder composition according to claim 1, wherein, It contains more than 2.5% by mass and less than 3.5% by mass of Cu.

3. A solder composition containing Sn, wherein, The solder composition is used to suppress solder bulging and wire thinning during wiring. Containing 2.5% to 5.0% by mass of Cu, 0.1% to 0.5% by mass of Ni, and more than 0.01% to 0.5% by mass of Ge. Containing 0.001% by mass and less than 0.5% by mass of Ga, The liquid phase temperature is 220–380℃.

4. An electronic component having a solder portion comprising the solder composition according to any one of claims 1 to 3.

5. The electronic component according to claim 4, wherein, It has a terminal electrode, the terminal electrode having a lead portion for connecting an electrical wire, the lead portion being electrically connected to the solder portion and the lead portion.

6. The electronic component according to claim 5, wherein, The lead portion of the wire is wound around the connection point.

7. The electronic component according to claim 5 or 6, wherein, The terminal electrode also has a mounting portion, and the wiring portion is positioned on the opposite mounting side to the mounting portion.

Images