Resistor structure

Abstract

The present invention discloses a resistor structure, which includes a substrate; an electrode component for conducting current; the electrode component is arranged on the substrate; a resistor component is connected to the electrode component, and an adjustment port is provided on the resistor component, the adjustment port includes a first opening and a second opening connected to each other, and the first opening extends along the direction of the second opening close to the electrode component; wherein, there are at least two adjustment ports, and the at least two adjustment ports are arranged at intervals. The resistor structure of the present invention solves the problem of low heat dissipation efficiency of chip resistors in the prior art.

Description

Technical Field

[0001] The present invention relates to the field of resistor technology, and more particularly, to a resistor structure. Background Art

[0002] Resistors are an integral component of integrated circuits, used in various modules such as switching power supplies, minimum circuits, and current and voltage detection circuits. Consequently, resistors are extremely useful. Furthermore, in current products such as mobile phones, watches, and remote controls, product sizes are becoming increasingly smaller. Previous metal ring and ceramic resistors are no longer suitable for these applications, replaced by thin-film chip resistors. Thin-film chip resistors offer advantages such as a wide resistance range, compact size, high precision, and simple manufacturing.

[0003] However, the resistance of thin film chip resistors is greatly affected by temperature. During application, heat will accumulate at the weak points of the resistor body, and the temperature will become higher and higher. In mild cases, it will cause resistance drift, which in turn causes circuit instability. In severe cases, it will directly burn the structure and cause functional failure.

[0004] Currently, the resistance of chip resistors is adjusted through laser trimming. This is achieved by making an "L"-shaped single-sided cut in the middle of the resistor body. This cut reduces the cross-sectional area of ​​the resistor body, creating a weak point in the thin-film chip resistor when current flows through it. The small cross-sectional area of ​​the material at this weak point leads to high current density and significant heat accumulation, which significantly shortens the life of the thin-film chip resistor.

[0005] In existing technologies, heat dissipation is optimized by changing the packaging structure, but this cannot reduce the heat generated by the resistor from the source, and new materials need to be added, which will lead to higher costs. Summary of the Invention

[0006] The main purpose of the present invention is to provide a resistor structure to solve the problem of low heat dissipation efficiency of chip resistors in the prior art.

[0007] To achieve the above-mentioned objectives, the present invention provides a resistor structure, comprising: a substrate; an electrode component for conducting current; the electrode component is arranged on the substrate; a resistor component is connected to the electrode component, and an adjustment port is provided on the resistor component, the adjustment port comprising a first opening and a second opening connected to each other, the first opening extending along the direction of the second opening approaching the electrode component; wherein, there are at least two adjustment ports, and the at least two adjustment ports are arranged at intervals.

[0008] Furthermore, the electrode component includes a first electrode component and a second electrode component arranged at intervals; the adjustment port includes: a first adjustment port, the first opening of the first adjustment port extends along the second opening of the first adjustment port close to one end of the first electrode component; and a second adjustment port, the first opening of the second adjustment port extends along the second opening of the second adjustment port close to one end of the second electrode component.

[0009] Furthermore, the resistance component is a rectangular structure; one end of the resistance component is connected to the first electrode component, and the other end of the electrode component is connected to the second electrode component.

[0010] Furthermore, the resistance component has a first side and a second side arranged opposite to each other; the second opening of the first adjustment port extends to the first side away from one end of the first opening of the first adjustment port; the second opening of the second adjustment port extends to the second side away from one end of the first opening of the second adjustment port.

[0011] Furthermore, there are multiple first adjustment openings, and the multiple first adjustment openings are arranged at intervals along the first side; and / or there are multiple second adjustment openings, and the multiple second adjustment openings are arranged at intervals along the second side.

[0012] Furthermore, the first adjustment opening and the second adjustment opening are arranged at intervals along the length direction of the electrode component.

[0013] Furthermore, the substrate has a connection plane connected to the electrode component; the connection plane has a first boundary and a second boundary set opposite to each other, one end of the first electrode component is aligned with the first boundary, and the end of the second electrode component away from the first electrode component is aligned with the second boundary.

[0014] Further, the substrate has a connection plane connected to the electrode component; along the direction perpendicular to the connection plane, at least part of the projection of the first opening of the first adjustment port is located on the first electrode component; and / or, along the direction perpendicular to the connection plane, at least part of the projection of the first opening of the second adjustment port is located on the second electrode component.

[0015] Further, along a direction perpendicular to the connection plane, a cross-section of the first opening is a rectangular structure; and / or, along a direction perpendicular to the connection plane, a cross-section of the second opening is a rectangular structure.

[0016] Furthermore, the first openings of at least two adjustment ports are arranged parallel to each other; and / or, the second openings of at least two adjustment ports are arranged parallel to each other; and / or, the extending direction of the first opening and the extending direction of the second opening are arranged perpendicular to each other.

[0017] According to the technical solution of the present invention, a resistor structure includes a substrate; an electrode component for conducting current; the electrode component is disposed on the substrate; a resistor component is connected to the electrode component, and an adjustment port is provided on the resistor component. The adjustment port includes a first opening and a second opening connected to each other, the first opening extending along the direction of the second opening approaching the electrode component; wherein there are at least two adjustment ports, and the at least two adjustment ports are arranged at intervals. With the above arrangement, compared with the single adjustment port in the existing arrangement, two adjustment ports are provided on the resistor component, so that the current density at each adjustment port is reduced, and the heat generated by the adjustment port during operation can be dispersed. In addition, the first opening of the adjustment port is arranged to extend along the direction of the second opening approaching the electrode component. In this way, the heat generated by the adjustment port can be guided to the electrode component, so that the heat can be diffused from the electrode component, thereby increasing the heat dissipation efficiency of the resistor structure and solving the problem of low heat dissipation efficiency of chip resistors in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic diagram of the resistance structure of the present invention.

[0019] In the figure: 1. substrate; 11. connection plane; 111. first boundary; 112. second boundary; 2. electrode component; 21. first electrode component; 22. second electrode component; 3. resistor component; 31. first side; 32. second side; 4. adjustment port; 41. first opening; 42. second opening; 401. first adjustment port; 402. second adjustment port. DETAILED DESCRIPTION

[0020] In order to enable those skilled in the art to better understand the technical solution of the present invention, the technical solution of the present invention is clearly and completely described below in conjunction with the drawings of the present invention. Based on the embodiments in this application, other similar embodiments obtained by ordinary technicians in this field without making creative work should fall within the scope of protection of this application. In addition, the directional words mentioned in the following embodiments, such as "up", "down", "left", "right", etc., are only reference to the directions of the drawings. Therefore, the directional words used are used to illustrate rather than limit the invention.

[0021] The following is combined with Figure 1 The present invention will be further described.

[0022] The resistor structure of this embodiment includes a substrate 1; an electrode component 2 for conducting current; the electrode component 2 is disposed on the substrate 1; a resistor component 3 connected to the electrode component 2, and provided with an adjustment port 4. The adjustment port 4 includes a first opening 41 and a second opening 42 connected to each other, the first opening 41 extending along the direction of the second opening 42 approaching the electrode component 2; wherein there are at least two adjustment ports 4, and the at least two adjustment ports 4 are arranged at intervals. With the above arrangement, compared to the single adjustment port in the existing arrangement, the two adjustment ports 4 are provided on the resistor component 3, so that the current density at each adjustment port 4 is reduced, and the heat generated by the adjustment port 4 during operation can be dispersed. In addition, the first opening 41 of the adjustment port 4 is arranged to extend along the direction of the second opening 42 approaching the electrode component 2. In this way, the heat generated by the adjustment port 4 can be guided to the electrode component 2, allowing the heat to diffuse from the electrode component 2, thereby increasing the heat dissipation efficiency of the resistor structure and solving the problem of low heat dissipation efficiency of chip resistors in the prior art.

[0023] In the resistor structure of this embodiment, the electrode component 2 includes a first electrode component 21 and a second electrode component 22 arranged at intervals; the adjustment port 4 includes: a first adjustment port 401, the first opening 41 of the first adjustment port 401 extends along the second opening 42 of the first adjustment port 401 close to one end of the first electrode component 21; a second adjustment port 402, the first opening 41 of the second adjustment port 402 extends along the second opening 42 of the second adjustment port 402 close to one end of the second electrode component 22.

[0024] In this embodiment, by setting the position of the adjustment port 4 so that the first adjustment port 401 and the second adjustment port 402 are respectively close to the first electrode component 21 and the second electrode component 22 on both sides, the heat dissipation capacity of the thin film chip resistor is improved.

[0025] As a preferred embodiment, in the resistor structure of this embodiment, the resistor component 3 is a rectangular structure; one end of the resistor component 3 is connected to the first electrode component 21 , and the other end of the electrode component 2 is connected to the second electrode component 22 .

[0026] In the resistor structure of this embodiment, the resistor component 3 has a first side 31 and a second side 32 arranged opposite to each other; the second opening 42 of the first adjustment port 401 extends to the first side 31 away from one end of the first opening 41 of the first adjustment port 401; the second opening 42 of the second adjustment port 402 extends to the second side 32 away from one end of the first opening 41 of the second adjustment port 402.

[0027] In this embodiment, the first adjustment port 401 and the second adjustment port 402 are set to a bilaterally staggered laser resistance adjustment structure, which can effectively reduce the "heat accumulation effect" of the resistor body and does not increase the manufacturing process, thereby improving the reliability and service life of the chip resistor.

[0028] In the resistor structure of this embodiment, there are multiple first adjustment openings 401, and the multiple first adjustment openings 401 are arranged at intervals along the first side 31; and / or, there are multiple second adjustment openings 402, and the multiple second adjustment openings 402 are arranged at intervals along the second side 32.

[0029] In the resistor structure of this embodiment, the first adjustment opening 401 and the second adjustment opening 402 are arranged at intervals along the length direction of the electrode component 2 .

[0030] In the resistor structure of this embodiment, the substrate 1 has a connection plane 11 connected to the electrode component 2; the connection plane 11 has a first boundary 111 and a second boundary 112 arranged opposite to each other, one end of the first electrode component 21 is aligned with the first boundary 111, and the end of the second electrode component 22 away from the first electrode component 21 is aligned with the second boundary 112.

[0031] In the resistor structure of this embodiment, the base 1 has a connection plane 11 connected to the electrode component 2. Along a direction perpendicular to the connection plane 11, at least a portion of the projection of the first opening 41 of the first adjustment port 401 is located on the first electrode component 21. And / or, along a direction perpendicular to the connection plane 11, at least a portion of the projection of the first opening 41 of the second adjustment port 402 is located on the second electrode component 22. This arrangement changes the heat dissipation path of the resistor structure from "resistor body to ceramic substrate to air" to "resistor body to metal resistor component to circuit board," significantly improving the heat dissipation capability of the resistor structure.

[0032] In the resistor structure of this embodiment, the cross section of the first opening 41 along the direction perpendicular to the connection plane 11 is a rectangular structure; and / or the cross section of the second opening 42 along the direction perpendicular to the connection plane 11 is a rectangular structure.

[0033] In the resistor structure of this embodiment, the first openings 41 of at least two adjustment ports 4 are arranged parallel to each other; and / or, the second openings 42 of at least two adjustment ports 4 are arranged parallel to each other; and / or, the extension direction of the first opening 41 and the extension direction of the second opening 42 are arranged perpendicular to each other.

[0034] The resistor structure of this embodiment is described as follows:

[0035] See also Figure 1 The base of this embodiment is made of ceramic, the main material of which is aluminum oxide, which has good thermal conductivity and insulation properties, can provide a carrier for the resistor component 3, and is the main heat dissipation path for the heat generated in the middle part of the resistor component 3.

[0036] The material of the electrode component 2 of this embodiment is mainly silver / palladium electrode, which is attached to the two poles on the positive and negative sides of the ceramic substrate 1 by printing. The addition of palladium can improve the adhesion between the electrode material and the ceramic substrate 1, forming a better contact, and the internal electrode is formed after drying and sintering.

[0037] Specifically, during production, printing is performed on the front side of the ceramic substrate 1 to connect the resistor component 3, conduct the current on the resistor component 3 to the external electrode, and finally conduct the current to the welded and fixed circuit board. Printing is performed on the back side of the ceramic substrate 1 to facilitate better connection between the resistor structure and the circuit board after it is formed.

[0038] In this embodiment, the material used to make the resistor component 3 is mainly R paste (RuO2). Similarly, it is fixed on the ceramic substrate 1 by screen printing, and then dried and sintered to solidify. The two ends are connected to the internal electrodes. The size and thickness of the resistor component 3 are controlled by the size and thickness of the screen.

[0039] In this embodiment, after adding a glass protective layer above the resistor component 3 (to reduce damage to the resistor component 3 caused by laser cutting), the resistor component 3 is cut by a laser spot to form an adjustment port 4 to change the aspect ratio of the resistor component 3, so that the resistance value of the resistor component 3 is increased to the required value.

[0040] It should be noted that traditional chip resistors usually use an 'L'-shaped trim port in the middle of the resistor body. Although the current flowing through the resistor is the same, the presence of the laser trim port causes different current densities when the current flows through different positions of the resistor structure, so the heat generation is naturally different. The current density at the laser trim port is greater than that at other places. Therefore, after-sales failure due to overcurrent or aging failure after long-term use of conventional chip resistors are all caused by burning at the laser trim port. The laser trim port is the weak point of the thin-film chip resistor, which greatly limits the service life of the resistor structure. The resistor structure of this embodiment adopts the method of bilateral staggered laser trimming, which can improve the reliability of the resistor structure.

[0041] Specifically, although the adjustment port 4 of this embodiment reduces the current density and heat at the adjustment port, it is still the "weak point" of the entire resistor structure. During operation, the heat at the adjustment port 4 is still higher than that at other positions. The adjustment port 4 is set to be close to the electrode components 2 on both sides. Because the electrode components 2 are made of metal material, the heat transfer performance is higher than that of ceramics. This will change the heat dissipation path at the adjustment port, which is beneficial to the heat dissipation function of the resistor structure.

[0042] From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects:

[0043] The resistor structure of this embodiment includes a substrate 1; an electrode component 2 for conducting current; the electrode component 2 is disposed on the substrate 1; a resistor component 3 connected to the electrode component 2, and provided with an adjustment port 4. The adjustment port 4 includes a first opening 41 and a second opening 42 connected to each other, the first opening 41 extending along the direction of the second opening 42 approaching the electrode component 2; wherein there are at least two adjustment ports 4, and the at least two adjustment ports 4 are arranged at intervals. With the above arrangement, compared to the single adjustment port in the existing arrangement, the two adjustment ports 4 are provided on the resistor component 3, so that the current density at each adjustment port 4 is reduced, and the heat generated by the adjustment port 4 during operation can be dispersed. In addition, the first opening 41 of the adjustment port 4 is arranged to extend along the direction of the second opening 42 approaching the electrode component 2. In this way, the heat generated by the adjustment port 4 can be guided to the electrode component 2, allowing the heat to diffuse from the electrode component 2, thereby increasing the heat dissipation efficiency of the resistor structure and solving the problem of low heat dissipation efficiency of chip resistors in the prior art.

[0044] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiment. All technical solutions based on the concept of the present invention are within the scope of protection of the present invention. It should be noted that for those skilled in the art, various improvements and modifications that do not depart from the principles of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. A resistor structure, characterized in that: include: Matrix (1); An electrode component (2) for conducting current; the electrode component (2) is arranged on the substrate (1); a resistance component (3) connected to the electrode component (2); an adjustment port (4) is provided on the resistance component (3); the adjustment port (4) comprises a first opening (41) and a second opening (42) connected to each other; the first opening (41) extends in a direction close to the electrode component (2) along the second opening (42); There are at least two regulating ports (4), and the at least two regulating ports (4) are arranged at intervals; The electrode component (2) comprises a first electrode component (21) and a second electrode component (22) arranged at intervals; the regulating port (4) comprises: a first regulating port (401), wherein a first opening (41) of the first regulating port (401) extends along a second opening (42) of the first regulating port (401) close to one end of the first electrode component (21); a second regulating port (402), wherein a first opening (41) of the second regulating port (402) extends along a second opening (42) of the second regulating port (402) close to one end of the second electrode component (22); The base body (1) has a connection plane (11) connected to the electrode component (2); At least part of the projection of the first opening (41) of the first regulating port (401) is located on the first electrode component (21) in a direction perpendicular to the connecting plane (11); and / or Along a direction perpendicular to the connection plane (11), at least part of the projection of the first opening (41) of the second regulating port (402) is located on the second electrode component (22).

2. The resistor structure according to claim 1, wherein: The resistance component (3) is a rectangular structure; one end of the resistance component (3) is connected to the first electrode component (21), and the other end of the electrode component (2) is connected to the second electrode component (22).

3. The resistor structure according to claim 2, characterized in that: The resistance component (3) has a first side (31) and a second side (32) arranged opposite to each other; the second opening (42) of the first regulating port (401) extends from one end of the first opening (41) of the first regulating port (401) to the first side (31); and the second opening (42) of the second regulating port (402) extends from one end of the first opening (41) of the second regulating port (402) to the second side (32).

4. The resistor structure according to claim 3, characterized in that: There are multiple first adjustment openings (401), and the multiple first adjustment openings (401) are arranged at intervals along the first side (31); and / or there are multiple second adjustment openings (402), and the multiple second adjustment openings (402) are arranged at intervals along the second side (32).

5. The resistor structure according to claim 2, wherein: The first adjustment port (401) and the second adjustment port (402) are arranged at intervals along the length direction of the electrode component (2).

6. The resistor structure according to claim 1, wherein: The substrate (1) has a connection plane (11) connected to the electrode component (2); the connection plane (11) has a first boundary (111) and a second boundary (112) arranged opposite to each other, one end of the first electrode component (21) is aligned with the first boundary (111), and one end of the second electrode component (22) away from the first electrode component (21) is aligned with the second boundary (112).

7. The resistor structure according to claim 1, wherein: Along a direction perpendicular to the connection plane (11), the cross-section of the first opening (41) is a rectangular structure; and / or, Along a direction perpendicular to the connection plane (11), the cross-section of the second opening (42) is a rectangular structure.

8. The resistor structure according to claim 1, wherein: The first openings (41) of at least two of the regulating ports (4) are arranged parallel to each other; and / or, The second openings (42) of at least two of the regulating ports (4) are arranged parallel to each other; and / or, The extending direction of the first opening (41) and the extending direction of the second opening (42) are arranged perpendicular to each other.

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