Cooling device and charger

Abstract

An embodiment of the present application provides a heat dissipation device and a charger, wherein the heat dissipation device includes: a carrier plate, a plurality of first guide structures are provided on the carrier plate, and a first heat dissipation channel is formed between two adjacent first guide structures; an induced air outlet is provided on the first side of the carrier plate; a first fan, having a first fan outlet, the first fan outlet is provided on the second side of the carrier plate, the second side of the carrier plate is opposite to the first side of the carrier plate, the first fan outlet is opposite to the induced air outlet, so as to form an induced air channel on the carrier plate; the first heat dissipation channel is connected to the induced air channel. The heat dissipation device is used to dissipate heat from a heat dissipation component, and the heat dissipation device has the characteristics of a large air intake and a good heat dissipation effect. The charger includes the heat dissipation device.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation device and a charger. Background Art

[0002] In some scenarios where heat dissipation is required from heat sinks, cooling fans are often used. The working principle of a cooling fan can be understood as blowing air toward the heat sink, removing heat from the heat sink using the airflow from the fan. However, using a cooling fan to dissipate heat from the heat sink has the problem of low heat dissipation efficiency. Summary of the Invention

[0003] The embodiments of the present application provide a heat dissipation device and a charger to solve the problem of how to improve the heat dissipation efficiency of the heat dissipation device.

[0004] In a first aspect, an embodiment of the present application provides a heat dissipation device.

[0005] The heat dissipation device provided in the embodiment of the present application includes: a supporting plate, on which a plurality of first air guide structures are provided, and a first heat dissipation channel is formed between two adjacent first air guide structures; a first side of the supporting plate is provided with an induced air outlet; a first fan, having a first fan air outlet, the first fan air outlet being provided on the second side of the supporting plate, the second side of the supporting plate being opposite to the first side of the supporting plate, the first fan air outlet being opposite to the induced air outlet, so as to form an induced air channel on the supporting plate; the first heat dissipation channel is connected to the induced air channel.

[0006] Optionally, the multiple first air guide structures form multiple first heat dissipation channels, the multiple first air guide structures are all located on the same side of the induced air channel, and the multiple first heat dissipation channels are all connected to the induced air channel.

[0007] Optionally, a plurality of second guide structures are further provided on the supporting plate, and a second heat dissipation channel is formed between two adjacent second guide structures. The second heat dissipation channel is connected to the induced air channel, and the plurality of second guide structures and the plurality of first guide structures are respectively located on opposite sides of the induced air channel.

[0008] Optionally, the plurality of second air-guiding structures are respectively opposite to the plurality of first air-guiding structures, so that the openings of the first heat dissipation channels are opposite to the openings of the second heat dissipation channels.

[0009] Optionally, the first guide structure includes a first guide section and a second guide section, the second guide section is connected to one end of the first guide section close to the induced air channel, and the second guide section is bent toward the induced air outlet relative to the first guide section.

[0010] Optionally, the first guide sections in the plurality of first guide structures are arranged in parallel; and / or the extension direction of the first guide sections is perpendicular to the extension direction of the induced air channel.

[0011] Optionally, a plurality of second guide structures are further provided on the supporting plate, and a second heat dissipation channel is formed between two adjacent second guide structures, the second heat dissipation channel is connected to the induced air channel, and the plurality of second guide structures and the plurality of first guide structures are respectively located on opposite sides of the induced air channel; the second guide structure includes a third guide section and a fourth guide section, the fourth guide section is connected to one end of the third guide section close to the induced air channel, and the fourth guide section is bent toward the induced air outlet relative to the first guide section.

[0012] Optionally, the second guide section and the fourth guide section are respectively located on both sides of the induced air channel, and the second guide section and the fourth guide section are opposite to each other, so that the opening of the first heat dissipation channel is opposite to the opening of the second heat dissipation channel; and / or, the first guide section and the third guide section are parallel and oppositely arranged.

[0013] Optionally, the flow area of ​​the induced air channel along its own extension direction first gradually decreases and then gradually increases.

[0014] Optionally, multiple first air guide structures are arranged at intervals along the extension direction of the induced air channel, and the multiple first air guide structures are aligned at one end away from the induced air channel; along the extension direction of the induced air channel, the lengths of the multiple first air guide structures first gradually increase and then gradually decrease.

[0015] Optionally, multiple first air guide structures are arranged at intervals along the extension direction of the induced air channel, and multiple second air guide structures are arranged at intervals along the extension direction of the induced air channel. Along the extension direction of the induced air channel, the distance between the first air guide structure and the adjacent second air guide structure first gradually decreases and then gradually increases.

[0016] Optionally, a wind shield is provided on the first side of the supporting plate, and the induced air outlet is provided on the wind shield; the multiple first air guide structures are arranged at intervals between the wind shield and the first fan along the extension direction of the induced air channel; and / or at least a part of the multiple first air guide structures is perpendicular to the extension direction of the induced air channel.

[0017] Optionally, the first fan further has a first fan air inlet, and the first fan air inlet and the first fan air outlet are arranged along the extension direction of the induced air channel.

[0018] Optionally, the heat dissipation device further includes a second fan having a second fan air inlet and a second fan air outlet, the second fan air inlet is connected to the induced wind channel, and the first fan air outlet is opposite to the second fan air inlet.

[0019] Optionally, the second fan is arranged on the first side of the supporting plate, and the second fan air inlet and the second fan air outlet are arranged along the extension direction of the induced air channel; and / or, the second fan has multiple second fan air outlets, and the multiple second fan air outlets are distributed at intervals.

[0020] In a second aspect, an embodiment of the present application provides a charger.

[0021] The charger provided in the embodiment of the present application includes any one of the heat dissipation devices provided in the embodiment of the present application.

[0022] At least one of the above technical solutions adopted in the embodiments of the present application can achieve the following beneficial effects:

[0023] In an embodiment of the present application, the first fan outlet is disposed opposite the induced air outlet. This allows the airflow from the first fan outlet to be blown out of the induced air outlet relatively quickly, thereby forming an induced air flow in the induced air channel. Because the velocity of the induced air flow is higher than the velocity of the gas in the first heat dissipation channel, the induced air flow forms a low-pressure area in the induced air channel. Consequently, the gas in the first heat dissipation channel spontaneously replenishes into the induced air channel under the influence of atmospheric pressure. This increases the amount of cooling gas delivered to the heat dissipation device, thereby improving the heat dissipation efficiency of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are only some embodiments recorded in this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0025] Figure 1 A schematic diagram of a heat dissipation device provided in an embodiment of the present application;

[0026] Figure 2 A schematic diagram of a heat dissipation device and a heat dissipation component provided in an embodiment of the present application;

[0027] Figure 3 for Figure 2 A partial enlarged schematic diagram of the middle area A;

[0028] Figure 4 for Figure 1 Schematic diagram of the air flow path of the heat dissipation device shown in FIG;

[0029] Figure 5 A schematic diagram of another air flow channel provided in an embodiment of the present application;

[0030] Figure 6 A schematic diagram of another heat dissipation device provided in an embodiment of the present application;

[0031] Figure 7 for Figure 6 Schematic diagram of the air flow path of the heat dissipation device shown in FIG;

[0032] Figure 8 A schematic diagram of another heat dissipation device provided in an embodiment of the present application.

[0033] Description of reference numerals:

[0034] 100 - heat dissipation device; 110 - carrier plate; 111 - first side of carrier plate; 112 - induced air outlet; 113 - second side of carrier plate; 114 - induced air channel; 1141 - third end; 1142 - middle portion; 1143 - fourth end; 115 - windshield; 120 - first air guide structure; 121 - first heat dissipation channel; 1211 - first end; 1212 - second end; 122 - first guide section; 123 - second guide section ;130-first fan;131-first fan air outlet;132-first fan air inlet;133-first fan housing;140-second air guide structure;141-second heat dissipation channel;142-third air guide section;143-fourth air guide section;150-second fan;151-second fan air inlet;152-second fan air outlet;153-second fan housing;160-first magnetic part;200-heat dissipation part;210-second magnetic part. DETAILED DESCRIPTION

[0035] To make the purpose, technical solutions, and advantages of this application more clear, the technical solutions of this application will be clearly and completely described below in conjunction with the specific embodiments of this application and the corresponding drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0036] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections, indirect connections through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0037] In addition, although the terms used in this application are selected from well-known and commonly used terms, some terms mentioned in the specification of this application may be selected by the applicant at his or her discretion, and their detailed meanings are explained in the relevant parts of the description of this article.

[0038] Furthermore, it is required that the application be understood not only by the actual terms used but also by the meanings connoted by each term.

[0039] The following describes in detail the technical solutions provided by various embodiments of the present application in conjunction with the accompanying drawings.

[0040] The embodiment of the present application provides a heat dissipation device. Figures 1 to 8 The heat dissipation device 100 provided in the embodiment of the present application may include: a carrier plate 110 , a first air guide structure 120 and a first fan 130 .

[0041] The first air guide structure 120 is disposed on the carrier plate 110 , and a first heat dissipation channel 121 is formed between two adjacent first air guide structures 120 . An air outlet 112 is disposed on the first side 111 of the carrier plate 110 .

[0042] The first fan 130 has a first fan outlet 131. The first fan outlet 131 is located on the second side 113 of the carrier plate 110. The second side 113 of the carrier plate 110 is opposite the first side 111 of the carrier plate 110. The first fan outlet 131 is opposite the induced air outlet 112, forming an induced air passage 114 on the carrier plate 110. The first heat dissipation passage 121 is in communication with the induced air passage 114.

[0043] Combine Figure 1 In the embodiment of the present application, the first fan outlet 131 is disposed opposite the induced air outlet 112. Thus, the airflow blown out of the first fan outlet 131 can be blown out of the induced air outlet 112 relatively quickly, thereby forming an induced air flow in the induced air passage 114. The opening of the first fan outlet 131 is opposite to the opening of the induced air outlet 112, and is connected through the induced air passage 114. This allows the opening of the first fan outlet 131 to face the direction opposite to the direction of the opening of the induced air outlet 112, facilitating the rapid discharge of the induced air from the induced air outlet 112.

[0044] The first fan 130 may be a centrifugal fan that can provide high-speed induced airflow.

[0045] Because the velocity of the induced airflow is higher than the velocity of the gas in the first heat dissipation channel 121, the induced airflow creates a low-pressure area in the induced air channel 114. Consequently, the gas in the first heat dissipation channel 121 is automatically replenished to the induced air channel 114 under the influence of atmospheric pressure. This increases the flow rate of cooling gas (air) delivered to the heat dissipation device 100, thereby improving the heat dissipation efficiency of the heat dissipation device 100.

[0046] For example, in combination Figure 2 When the heat dissipation element 200 is covered on the side of the first guide structure 120 facing away from the carrier plate 110, the cooling gas (air) can flow along the outer surface of the heat dissipation element 200, so that the flowing gas can be used to take away the heat of the heat dissipation element 200 to dissipate heat.

[0047] It should be noted that, exemplarily, when the heat dissipation element 200 is covered on the side of the first air guide structure 120 facing away from the supporting plate 110, the supporting plate 110, the first air guide structure 120 and the heat dissipation element 200 can together form an induced air channel 114 and a first heat dissipation channel 121.

[0048] Furthermore, by way of example, in other embodiments of the present application, a heat conducting plate may be provided on the side of the first flow-guiding structure 120 facing away from the carrier plate 110, and the heat dissipation element 200 may be attached to the heat conducting plate. In this way, heat from the heat dissipation element 200 may be transferred to the heat conducting plate, where it may be dissipated by cooling gas. The cooling gas may include air. In this way, heat dissipation from the heat dissipation element 200 attached to the heat conducting plate may also be indirectly dissipated by the heat dissipation device 100 dissipating heat from the heat conducting plate.

[0049] In order to enable those skilled in the art to better implement the solutions provided in the embodiments of the present application, a more detailed solution is provided below for reference by those skilled in the art.

[0050] refer to Figure 1 In an embodiment of the present application, multiple first air guide structures 120 form multiple first heat dissipation channels 121 , and the multiple first air guide structures 120 are all located on the same side of the induced air channel 114 , and the multiple first heat dissipation channels 121 are all connected to the induced air channel 114 .

[0051] For example, in combination Figure 1The multiple first air guide structures 120 are all located to the left of the induced air duct 114. The first heat dissipation channels 121 formed by the first air guide structures 120 can be connected to the induced air duct 114. In this way, the airflow blown out from the first fan outlet 131 can form an induced air flow in the induced air duct 114. Consequently, the induced air flow causes the gas in the first heat dissipation channels 121 to spontaneously replenish the induced air duct 114 under the influence of atmospheric pressure. This can increase the amount of cooling gas (air) delivered to the heat dissipation device 100, thereby improving the heat dissipation efficiency of the heat dissipation device 100.

[0052] refer to Figure 1 In an embodiment of the present application, the first air guide structure 120 may include a first air guide section 122 and a second air guide section 123. The second air guide section 123 is connected to the end of the first air guide section 122 near the induced air channel 114. The second air guide section 123 is curved relative to the first air guide section 122 toward the induced air outlet 112. This allows the air outlet of the first heat dissipation channel 121 to be curved toward the induced air outlet 112, allowing the air in the first heat dissipation channel 121 to be better transported to the induced air channel 114 and then discharged through the induced air outlet 112. This can further enhance the heat dissipation effect of the heat dissipation device 100.

[0053] refer to Figure 1 In an embodiment of the present application, the first guide sections 122 in the plurality of first guide structures 120 are arranged in parallel; and / or, the extension direction of the first guide sections 122 is perpendicular to the extension direction of the induced air channel 114.

[0054] In other words, in one embodiment of the present application, the first guide sections 122 are arranged parallel to each other. In another embodiment of the present application, the extension direction of the first guide sections 122 is perpendicular to the extension direction of the induced air channel 114. In another embodiment of the present application, the first guide sections 122 are parallel to each other, and the extension direction of the first guide sections 122 is perpendicular to the extension direction of the induced air channel 114. In this way, the gas in the first heat dissipation channel 121 can be better transported to the induced air channel 114, and then discharged through the induced air outlet 112, thereby further improving the heat dissipation effect of the heat dissipation device 100.

[0055] refer to Figure 5In the embodiment of the present application, the flow area of ​​the first heat dissipation channel 121 gradually decreases in the direction toward the induced air channel 114. In other words, if the end of the first heat dissipation channel 121 away from the induced air channel 114 is the first end 1211, and the end close to the induced air channel 114 is the second end 1212, the flow area of ​​the first heat dissipation channel 121 between the first end 1211 and the second end 1212 gradually decreases. In this way, a low-pressure area can be formed in the portion of the first heat dissipation channel 121 close to the induced air channel 114, thereby causing the gas in the first heat dissipation channel 121 to spontaneously flow from the first end 1211 to the second end 1212, thereby allowing the gas in the first heat dissipation channel 121 to be better replenished to the induced air channel 114, thereby further improving the heat dissipation effect of the heat dissipation device 100.

[0056] It should be noted that, in the embodiments of the present application, the flow area of ​​the flow channel may refer to the cross-sectional area of ​​the inner wall of the flow channel along the flow direction of the fluid, which will not be explained one by one hereinafter.

[0057] refer to Figure 1 In the embodiment of the present application, the carrier plate 110 is further provided with a plurality of second air guide structures 140 , with second heat dissipation channels 141 formed between adjacent second air guide structures 140 . The second heat dissipation channels 141 are connected to the induced air channel 114 , and the plurality of second air guide structures 140 and the plurality of first air guide structures 120 are located on opposite sides of the induced air channel 114 .

[0058] For example, in combination Figure 1 and Figure 4 The first guide structures 120 are all located on the left side of the induced air channel 114, and the second guide structures 140 are all located on the right side of the induced air channel 114. The first guide structure 120 forms a plurality of first heat dissipation channels 121 on the left side of the induced air channel 114, and the second guide structure 140 forms a plurality of second heat dissipation channels 141 on the right side of the induced air channel 114. In this way, the airflow blown out from the first fan outlet 131 can form an induced air flow in the induced air channel 114, so that the induced air flow will cause the gas in the heat dissipation channels on the left and right sides to spontaneously replenish the induced air channel 114 under the action of atmospheric pressure. In this way, the airflow rate of the cooling gas (air) delivered to the heat dissipation device 100 can be further increased, so as to achieve the effect of improving the heat dissipation efficiency of the heat dissipation device 100.

[0059] refer to Figure 1 and Figure 4In the embodiment of the present application, the plurality of second air guide structures 140 are arranged opposite the plurality of first air guide structures 120, such that the openings of the first heat dissipation channels 121 are aligned with the openings of the second heat dissipation channels 141. This allows for more uniform airflow on both sides of the induced air channel 114, thereby improving the heat dissipation performance of the heat dissipation device 100.

[0060] refer to Figure 1 In an embodiment of the present application, the second air guide structure 140 may include a third air guide section 142 and a fourth air guide section 143. The fourth air guide section 143 is connected to an end of the third air guide section 142 near the induced air channel 114, and the fourth air guide section 143 is curved relative to the first air guide section 122 toward the induced air outlet 112.

[0061] The second guide section 123 and the fourth guide section 143 are respectively located on both sides of the induced air channel 114, and the second guide section 123 and the fourth guide section 143 are opposite to each other, so that the opening of the first heat dissipation channel 121 is opposite to the opening of the second heat dissipation channel 141; and / or, the first guide section 122 and the third guide section 142 are parallel and oppositely arranged.

[0062] It should be noted that the second air guiding structure 140 can be configured with reference to the first air guiding structure 120 . For the sake of brevity, the specific structure of the second air guiding structure 140 will not be described in detail here.

[0063] refer to Figure 6 and Figure 7 In the embodiment of the present application, the flow area of ​​the induced air channel 114 along its own extension direction first gradually decreases and then gradually increases.

[0064] In other words, combined Figure 7 The induced air channel 114 may have a third end portion 1141, a middle portion 1142, and a fourth end portion 1143 distributed along its extension direction. It should be noted that the middle portion 1142 may be located anywhere between the third end portion 1141 and the fourth end portion 1143. The embodiment of the present application does not limit the middle portion 1142 to being located exactly in the center between the third end portion 1141 and the fourth end portion 1143.

[0065] In one embodiment of the present application, the flow area of ​​the induced air channel 114 from the third end 1141 to the middle portion 1142 gradually decreases, and the flow area of ​​the induced air channel 114 from the middle portion 1142 to the fourth end 1143 gradually increases.

[0066] In this way, the gas transported from the third end portion 1141 to the middle portion 1142 will experience a higher flow rate due to the reduced flow area, thereby enhancing the suction effect between the third end portion 1141 and the middle portion 1142. The gas transported from the middle portion 1142 to the fourth end portion 1143 will be less likely to experience a squeezing effect due to the increased flow area, thereby facilitating the gas to overflow and discharge from between the middle portion 1142 and the fourth end portion 1143.

[0067] Optionally, in an embodiment of the present application, the middle portion 1142 may be disposed opposite to the heat source portion of the heat dissipation element 200. For example, if the portion of the heat dissipation element 200 where the battery is disposed is the heat source portion, the middle portion 1142 may be disposed opposite to the portion of the heat dissipation element 200 where the battery is disposed.

[0068] The following provides a more detailed solution for gradually reducing and then increasing the flow area of ​​the induced air channel 114 along its own extension direction.

[0069] refer to Figure 6 In the embodiment of the present application, multiple first air guide structures 120 are spaced apart along the extension direction of the ejected air channel 114, with their ends facing away from the ejected air channel 114 aligned. Along the extension direction of the ejected air channel 114, the lengths of the multiple first air guide structures 120 gradually increase and then decrease. This allows the flow area of ​​the ejected air channel 114 to gradually decrease and then increase along its own extension direction.

[0070] refer to Figure 6 In the embodiment of the present application, when multiple second air guide structures 140 are provided on the carrier plate 110, the multiple first air guide structures 120 are spaced apart along the extension direction of the ejected air channel 114, and the multiple second air guide structures 140 are spaced apart along the extension direction of the ejected air channel 114. Along the extension direction of the ejected air channel 114, the distance between a first air guide structure 120 and an adjacent second air guide structure 140 first gradually decreases and then gradually increases. In this way, the flow area of ​​the ejected air channel 114 along its own extension direction can first gradually decrease and then gradually increase.

[0071] In the embodiment of the present application, a wind shield 115 is provided on the first side 111 of the supporting plate 110 , and an induced air outlet 112 is formed on the wind shield 115 .

[0072] Multiple first air guide structures 120 are spaced apart between the wind shield 115 and the first fan 130 along the extension direction of the induced air channel 114; and / or, at least a portion of the multiple first air guide structures 120 is perpendicular to the extension direction of the induced air channel 114.

[0073] In other words, in one embodiment of the present application, a plurality of first air guide structures 120 are arranged between the wind shield 115 and the first fan 130 at intervals along the extension direction of the induced wind channel 114. In another embodiment of the present application, at least a portion of the plurality of first air guide structures 120 is perpendicular to the extension direction of the induced wind channel 114. For example, when the first air guide structure 120 includes a first air guide section 122, the first air guide section 122 may be perpendicular to the extension direction of the induced wind channel 114. In another embodiment of the present application, a plurality of first air guide structures 120 are arranged between the wind shield 115 and the first fan 130 at intervals along the extension direction of the induced wind channel 114, and at least a portion of the plurality of first air guide structures 120 is perpendicular to the extension direction of the induced wind channel 114. In this way, the heat dissipation effect of the heat dissipation device 100 can be improved.

[0074] In the embodiment of the present application, the first fan 130 further includes a first fan air inlet 132. The first fan air inlet 132 and the first fan air outlet 131 are arranged along the extension direction of the induced air channel 114. In this way, air outside the heat dissipation device 100 can be better transported into the induced air channel 114 and discharged through the induced air channel 114.

[0075] refer to Figure 8 For example, the first fan 130 may include a first fan housing 133 and a first fan. The first fan housing 133 has a first accommodating cavity, and the first fan is disposed within the first accommodating cavity. A first side of the first fan housing 133 is connected to the carrier plate 110, and a first fan outlet 131 is defined on the first side of the first fan housing 133, while a first fan inlet 132 is defined on the second side of the first fan housing 133. The second side of the first fan housing 133 is opposite to the first side of the first fan housing 133, such that the first fan inlet 132 and the first fan outlet 131 are opposite each other.

[0076] Of course, illustratively, combined Figure 8 In other embodiments of the present application, the first fan air inlet 132 may be arranged upwardly tilted and communicate with the induced air inlet of the induced air channel 114. The first fan air outlet 131 may be arranged on the left and right sides of the first fan 130. In the embodiment of the present application, it is sufficient for the first fan 130 to extract cooling air from the outside of the heat dissipation device 100 through the first fan air inlet 132. The embodiment of the present application does not limit the specific location of the first fan air inlet 132.

[0077] refer to Figure 8In an embodiment of the present application, the heat dissipation device may further include a second fan 150. The second fan 150 has a second fan inlet 151 and a second fan outlet 152. The second fan inlet 151 is connected to the induced air passage 114, and the first fan outlet 131 is opposite the second fan inlet 151. In this way, the second fan 150 can be used to draw air from the induced air passage 114, allowing the air that has absorbed heat in the induced air passage 114 to be more effectively discharged from the heat dissipation device 100.

[0078] In an embodiment of the present application, the second fan 150 is disposed on the first side 111 of the carrier plate 110, with the second fan inlet 151 and the second fan outlet 152 arranged along the extension direction of the induced air channel 114. Alternatively, the second fan 150 may include multiple second fan outlets 152, which are spaced apart. In this manner, the second fan 150 can be used to better discharge the heat-absorbing gas in the induced air channel 114 from the heat dissipation device 100.

[0079] For example, in one embodiment of the present application, the second fan 150 may include a second fan housing 153 and a second fan. The second fan housing 153 has a second accommodating cavity, and the second fan is disposed within the second accommodating cavity. A first side of the second fan housing 153 is connected to the support plate 110 and protrudes from the surface of the support plate 110 to form a windshield structure. A second fan air inlet 151 is defined on the first side of the second fan housing 153.

[0080] A first side of the second fan housing 153 is recessed toward the direction away from the first fan 130 to form a recessed portion. The second fan air inlet 151 is located on a surface of the recessed portion facing away from the first fan 130. The opening of the recessed portion toward the first fan 130 forms the induced air outlet 112. The induced air outlet 112 is opposite and connected to the second fan air inlet 151, connecting the second fan air inlet 151 to the induced air duct 114.

[0081] In some embodiments, the first side of the second fan housing 153 is connected to the supporting plate 110 and protrudes from the surface of the supporting plate 110 to form a wind shield structure. The first side of the second fan housing 153 is directly provided with an induced air outlet 112, and the induced air outlet 112 is reused as the second fan air inlet 151, so that the second fan air inlet 151 is connected to the induced air channel 114.

[0082] It is understandable that a wind shield 115 can also be added between the supporting plate 110 and the second fan housing 153, and the induced air outlet 112 can be set on the wind shield 115, so that the second fan air inlet 151 and the induced air outlet 112 are independently and relatively connected, thereby connecting the second fan air inlet 151 to the induced air channel 114.

[0083] A second fan outlet 152 is defined on the second side of the second fan housing 153 . The second side of the second fan housing 153 is opposite to the first side of the second fan housing 153 , so that the first fan inlet 132 and the first fan outlet 131 are opposite to each other.

[0084] For example, in one embodiment of the present application, the first fan housing 133 , the second fan housing 153 and the supporting plate 110 may be integrally connected, thereby improving the integrity of the heat dissipation device 100 .

[0085] In one embodiment of the present application, the end of the first air guide structure 120 facing away from the carrier plate 110 can be a flexible material portion. The heat dissipation element 200 can be aligned with the side of the first air guide structure 120 facing away from the carrier plate 110. In this way, the heat dissipation element 200 can be aligned with the flexible material portion of the first air guide structure 120. The elastic deformation of the flexible material portion allows the heat dissipation element 200 to be sealed to the flexible material portion of the first air guide structure 120, thereby improving the sealing effect between the first heat dissipation channel 121 and the induced air channel 114.

[0086] For example, in one embodiment of the present application, the first flow-guiding structure 120 may be made of a flexible material such as silicone or rubber. For example, the first flow-guiding structure 120 may be integrally formed on the carrier plate 110 by injection molding. For example, in one embodiment of the present application, the first flow-guiding structure 120 may be made of the same material as the carrier plate 110, and the first flow-guiding structure 120 may be integrally formed with the carrier plate 110; further, a flexible material layer may be provided on the side of the first flow-guiding structure 120 facing away from the carrier plate 110 to form a flexible material portion. In addition, in an embodiment of the present application, the first flow-guiding structure 120 may also be a separate structure from the carrier plate 110. For example, the first flow-guiding structure 120 may be bonded to the carrier plate 110 using an adhesive.

[0087] In addition, when the heat dissipation device 100 further includes a second air guiding structure 140 , the second air guiding structure 140 may be configured with reference to the first air guiding structure 120 , and the specific structure of the second air guiding structure 140 will not be described in detail here.

[0088] refer to Figure 2 and Figure 3 In an embodiment of the present application, the heat dissipation device 100 may further include a first magnetic member 160, and the heat dissipation element 200 may be provided with a second magnetic member 210. When the heat dissipation element 200 is disposed in the heat dissipation element accommodation area of ​​the heat dissipation device 100, the first magnetic member 160 and the second magnetic member 210 are magnetically connected. This can improve the tightness of the heat dissipation element 200 and the first and second guide structures 120 and 140.

[0089] Of course, in other embodiments of the present application, the heat dissipation element 200 can also be tightly attached to the first and second guide structures 120 and 140 respectively under the action of its own gravity. Therefore, if the heat dissipation element 200 can be tightly attached to the first and second guide structures 120 and 140 under the action of its own gravity, the heat dissipation device 100 can be provided with the first magnetic member 160, and the heat dissipation element 200 can be provided with the second magnetic member 210.

[0090] Furthermore, in other embodiments of the present application, other methods known in the related art may be used to ensure that the heat dissipation element 200 is closely fitted to the first and second guide structures 120 and 140, respectively. For example, the heat dissipation device 100 may be provided with a snap-fit ​​structure, and the heat dissipation element 200 may be snap-fitted to the snap-fit ​​structure to ensure that the heat dissipation element 200 is closely fitted to the first and second guide structures 120 and 140, respectively.

[0091] The embodiment of the present application provides a charger. The charger provided by the embodiment of the present application may include any one of the heat dissipation devices 100 provided by the embodiment of the present application.

[0092] Furthermore, the charger provided in the embodiment of the present application may also include a power transmission coil. For example, the power transmission coil may be built into the carrier plate 110, and the heat dissipation element 200 is provided with a power receiving coil, and the power transmission coil is used to connect to the power receiving coil for wireless charging. Figure 2 In an embodiment of the present application, the power transmission coil may be disposed on the carrier plate 110 at a position opposite to the power receiving coil in the heat dissipation element 200 , so that the power transmission coil can be wirelessly connected to the power receiving coil for charging.

[0093] In the embodiments of the present application, to maintain good power transmission efficiency between the power transmitting coil and the power receiving coil, when the heat dissipation device 100 includes a first flow guiding structure 120 and a second flow guiding structure 140, the height of the first flow guiding structure 120 and the second flow guiding structure 140 can be 1 to 5 mm. Of course, if the power transmission efficiency between the power transmitting coil and the power receiving coil is not required to be high, the height of the first flow guiding structure 120 and the second flow guiding structure 140 can be appropriately increased. If the power transmission efficiency between the power transmitting coil and the power receiving coil is required to be high, the height of the first flow guiding structure 120 and the second flow guiding structure 140 can be appropriately reduced.

[0094] Furthermore, the efficiency of power transmission between the power transmission coil and the power receiving coil can be improved by increasing the corresponding areas of the power transmission coil and the power receiving coil. Therefore, the embodiments of the present application do not limit the height dimensions of the first and second flow-guiding structures 120 and 140 to only 1 to 5 mm. Those skilled in the art can reasonably adjust the height dimensions of the first and second flow-guiding structures 120 and 140 based on actual needs.

[0095] For example, in the embodiments of the present application, the heat dissipation element 200 may be an electronic device such as a mobile phone, tablet computer, laptop computer, electronic watch, or electronic bracelet. If the heat dissipation device 100 is provided with a power transmission coil, the heat dissipation element 200 may be an electronic device such as a mobile phone, tablet computer, laptop computer, electronic watch, or electronic bracelet provided with a power reception coil. Those skilled in the art may refer to related wireless charging solutions for configuring the power transmission coil and the power reception coil. Therefore, the operating principles and specific structures of the power transmission coil and the power reception coil will not be further described here.

[0096] In an embodiment of the present application, the heat dissipation device 100 of the charger may further include a base, which may be connected to the carrier plate 110. The carrier plate 110 may be supported by the base. Optionally, a control circuit may be provided in the base. The control circuit may be connected to an external power supply. Of course, in other embodiments of the present application, other solutions in the relevant art may also be used to power the heat dissipation device 100 or the charger. The power supply solution for powering the heat dissipation device 100 or the charger will not be described in detail here.

[0097] Furthermore, in other embodiments of the present application, the power receiving coil of the heat element 200 to be cooled can be used to transmit electrical energy to the heat dissipation device 100 via the power transmitting coil, thereby activating the first fan 130. In this way, if the heat element 200 to be cooled has sufficient power and the charger is powered off, the heat element 200 can be used to supply power to the charger, allowing the charger to dissipate heat from the heat element 200 to be cooled. For example, if a user is watching a high-definition movie on their mobile phone during a power outage, which generates considerable heat, the mobile phone can be used to supply power to the charger, allowing the charger to dissipate heat from the heat element 200 to be cooled.

[0098] It should be noted that in the embodiments of the present application, the charger may also include a charging plug, which can be connected to the charging interface of the heat dissipation element 200. For example, when the heat dissipation element 200 is a mobile phone, the mobile phone may be provided with a Type-C charging interface, and the charger may be provided with a Type-C charging plug. The mobile phone can be charged using the charger by electrically connecting the Type-C charging plug to the Type-C charging interface. At the same time, during the charging process, the heat dissipation device 100 of the charger can be used to dissipate heat from the heat dissipation element 200.

[0099] It is understood that during the charging process of the heat dissipation element 200, the temperature of the heat dissipation element 200 will increase; the higher the charging power of the heat dissipation element 200, the higher the temperature of the heat dissipation element 200. Therefore, to prevent the temperature of the heat dissipation element 200 from being too high, it is generally necessary to limit the charging power of the heat dissipation element 200. However, by using the solution provided in the embodiment of the present application, the charging power of the heat dissipation element 200 can be appropriately increased by using the heat dissipation device 100 to dissipate heat from the heat dissipation element 200.

[0100] It should also be noted that in the embodiments of the present application, the charger may primarily include a charging plug, so that the electronic device can be charged by plugging the charging plug into the charging port of the electronic device. Alternatively, the charger may primarily include a power transmission coil, so that the electronic device can be charged via wireless charging. Alternatively, the charger may include both a charging plug and a power transmission coil. Of course, with technological advancements, other charging devices will appear in the future. Therefore, in the embodiments of the present application, the charger may also include other charging devices that may appear in the future.

[0101] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0102] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the embodiments of the present application, and the scope of the embodiments of the present application is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation device, characterized in that: include: A carrier plate (110), wherein a plurality of first flow-guiding structures (120) are provided on the carrier plate (110), and a first heat dissipation channel (121) is formed between two adjacent first flow-guiding structures (120); a windshield (115) is provided on the first side (111) of the carrier plate (110), and an induced air outlet (112) is provided on the windshield (115); A first fan (130) has a first fan air outlet (131), the first fan air outlet (131) is provided on the second side (113) of the carrier plate (110), the second side (113) of the carrier plate (110) is opposite to the first side (111) of the carrier plate (110), the first fan air outlet (131) is opposite to the induced air outlet (112), so as to form an induced air channel (114) on the carrier plate (110), and a middle portion (1142) is provided between two ends of the induced air channel (114) for being arranged opposite to a heat source portion of the heat element (200) to be dissipated; The first heat dissipation channel (121) is in communication with the induced air channel (114), and the flow rate of the induced air flow formed by the first fan (130) in the induced air channel (114) is higher than the flow rate of the gas in the first heat dissipation channel (121).

2. The heat dissipation device according to claim 1, characterized in that: The plurality of first air guide structures (120) form a plurality of first heat dissipation channels (121); the plurality of first air guide structures (120) are all located on the same side of the induced air channel (114); and the plurality of first heat dissipation channels (121) are all in communication with the induced air channel (114).

3. The heat dissipation device according to claim 1, wherein: A plurality of second flow-guiding structures (140) are further provided on the carrier plate (110), a second heat dissipation channel (141) is formed between two adjacent second flow-guiding structures (140), the second heat dissipation channel (141) is communicated with the induced air channel (114), and the plurality of second flow-guiding structures (140) and the plurality of first flow-guiding structures (120) are respectively located on opposite sides of the induced air channel (114).

4. The heat dissipation device according to claim 3, characterized in that: The plurality of second air-guiding structures (140) are respectively opposite to the plurality of first air-guiding structures (120), so that the opening of the first heat dissipation channel (121) is opposite to the opening of the second heat dissipation channel (141).

5. The heat dissipation device according to any one of claims 1 to 4, characterized in that: The first guide structure (120) comprises a first guide section (122) and a second guide section (123); the second guide section (123) is connected to an end of the first guide section (122) close to the induced air channel (114); the second guide section (123) is bent relative to the first guide section (122) toward the induced air outlet (112).

6. The heat dissipation device according to claim 5, characterized in that: The first flow guiding sections (122) in the plurality of first flow guiding structures (120) are arranged in parallel; and / or, The extension direction of the first guide section (122) is perpendicular to the extension direction of the induced air channel (114).

7. The heat dissipation device according to claim 5, characterized in that: A plurality of second flow-guiding structures (140) are further provided on the carrier plate (110), a second heat dissipation channel (141) is formed between two adjacent second flow-guiding structures (140), the second heat dissipation channel (141) is communicated with the induced air channel (114), and the plurality of second flow-guiding structures (140) and the plurality of first flow-guiding structures (120) are respectively located on opposite sides of the induced air channel (114); The second guide structure (140) comprises a third guide section (142) and a fourth guide section (143); the fourth guide section (143) is connected to an end of the third guide section (142) close to the induced air channel (114); and the fourth guide section (143) is bent relative to the first guide section (122) toward the induced air outlet (112).

8. The heat dissipation device according to claim 7, characterized in that: The second guide section (123) and the fourth guide section (143) are respectively located on both sides of the induced air channel (114), and the second guide section (123) and the fourth guide section (143) are opposite to each other, so that the opening of the first heat dissipation channel (121) is opposite to the opening of the second heat dissipation channel (141); and / or, The first guide section (122) and the third guide section (142) are arranged in parallel and opposite to each other.

9. The heat dissipation device according to claim 1, wherein: The flow area of ​​the induced air channel (114) along its own extension direction first gradually decreases and then gradually increases.

10. The heat dissipation device according to claim 1, wherein: A plurality of the first air guide structures (120) are arranged at intervals along the extension direction of the induced air channel (114), and ends of the plurality of first air guide structures (120) away from the induced air channel (114) are aligned; Along the extension direction of the induced air channel (114), the lengths of the plurality of first flow-guiding structures (120) first gradually increase and then gradually decrease.

11. The heat dissipation device according to claim 3, characterized in that: A plurality of the first flow guide structures (120) are arranged at intervals along the extension direction of the induced air channel (114), and a plurality of the second flow guide structures (140) are arranged at intervals along the extension direction of the induced air channel (114). Along the extension direction of the induced air channel (114), the distance between the first air guide structure (120) and the adjacent second air guide structure (140) first gradually decreases and then gradually increases.

12. The heat dissipation device according to claim 1, wherein: The plurality of first air guide structures (120) are arranged at intervals between the wind shield (115) and the first fan (130) along the extension direction of the ejected air channel (114); and / or, At least a portion of the plurality of first air guide structures (120) is perpendicular to the extension direction of the induced air channel (114).

13. The heat dissipation device according to claim 1, wherein: The first fan (130) further comprises a first fan air inlet (132), wherein the first fan air inlet (132) and the first fan air outlet (131) are arranged along the extension direction of the induced air channel (114).

14. The heat dissipation device according to claim 1, wherein: The heat dissipation device further comprises a second fan (150), the second fan (150) having a second fan air inlet (151) and a second fan air outlet (152), the second fan air inlet (151) being in communication with the induced air channel (114), and the first fan air outlet (131) being opposite to the second fan air inlet (151).

15. The heat dissipation device according to claim 14, characterized in that: The second fan (150) is provided on the first side (111) of the supporting plate (110), and the second fan air inlet (151) and the second fan air outlet (152) are provided along the extension direction of the induced air channel (114); and / or, The second fan (150) has a plurality of second fan air outlets (152), and the plurality of second fan air outlets (152) are distributed at intervals.

16. A charger, characterized in that: include: The heat dissipation device according to any one of claims 1 to 15.

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