A method for preparing double-sided EMI pattern

Abstract

The present invention relates to the technical field of building waterproofing, and specifically to a method for preparing a double-sided EMI pattern. The double-sided EMI pattern sequentially comprises the following structures: a photosensitive film, a conductive layer, a substrate, and a protective film. The preparation method comprises the following steps: first applying a photosensitive film to a single side of a conductive material; covering the back side with a protective film, and exposing the photosensitive film; preparing a single-sided conductive circuit by developing, etching, and stripping the film; then etching / dissolving the substrate of the film material with a solution; further etching the conductive material circuit of the product, removing the photosensitive film, and then tearing off the protective film on the back side; then etching the conductive material on the back side from the front side, laser-irradiating the double-sided conductive material by laser, and adjusting the laser energy so that the laser can penetrate the entire material of the front conductive material + substrate + back conductive material. The present invention can solve the problems of reduced shielding effectiveness and moiré caused by the non-overlapping of the front and back patterns.

Description

Technical Field

[0001] The present invention relates to the field of electromagnetic shielding, and in particular to a method for preparing a double-sided EMI pattern. Background Art

[0002] Research has shown that creating a layer of identical conductive material on both sides of a substrate can increase the shielding effectiveness of a shielding film, even surpassing the effect of creating a conductive material pattern twice as thick on the same side. Traditional methods for creating double-sided conductive material circuits involve first creating a double-sided conductive film, then coating the conductive material with a photosensitive film, then exposing both sides simultaneously or separately, and finally creating the conductive material circuit through development, etching, and film stripping. Alternatively, two shielding films with identical patterns can be created and then bonded together.

[0003] The traditional process for preparing double-sided conductive material circuits requires exposing both the front and back sides, which has certain precision errors. Or, when two shielding films are bonded together, there are also bonding errors, and the bonding precision is lower than the exposure precision, resulting in the patterns on the front and back sides not being able to completely overlap, which not only affects the shielding effectiveness, but also produces moiré patterns, affecting the visual effect. Summary of the Invention

[0004] The object of the present invention is to provide a method for preparing a double-sided EMI pattern to solve the problem that the patterns on both sides cannot be completely overlapped and moiré patterns are produced.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a method for preparing a double-sided EMI pattern, wherein the double-sided EMI pattern comprises the following structures from top to bottom: a photosensitive film, a conductive layer, a substrate, and a protective film, and the preparation method comprises the following steps:

[0006] (1) First, apply a single-sided photosensitive film to the conductive material;

[0007] (2) Cover the reverse side with a protective film and expose the photosensitive film;

[0008] (3) preparing single-sided conductive circuits by developing, etching, and stripping;

[0009] (4) etching / dissolving the base material of the film material with a chemical solution to form an upper conductive material circuit;

[0010] (5) Further etching the conductive material circuit of the product, removing the photosensitive film and then tearing off the back protective film;

[0011] (6) Etching the conductive material on the back from the front to achieve the overlap of the conductive material circuits on the front and back sides;

[0012] (7) Using a laser, refer to the design pattern and laser the double-sided conductive material to laser away the unnecessary areas;

[0013] (8) By adjusting the energy of the laser, the laser can penetrate the entire material of the front conductive material + substrate + back conductive material, so that the patterns on the front and back sides are completely consistent.

[0014] Preferably, the conductive material in step (1) is one of a metal material and an organic conductive material.

[0015] Preferably, the application method in step (1) is one of hot pressing and coating.

[0016] Preferably, the substrate in step (4) is a glass substrate, and the solution is hydrofluoric acid.

[0017] Preferably, the substrate in step (4) is COP, and the solution is any one of xylene, dichloromethane, tetralin, and decalin.

[0018] Preferably, the substrate in step (4) is PET, and the potion uses an organic solvent, which is any one of cresol, nitrobenzene, trichloroacetic acid, and chlorophenol.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. The present invention protects the substrate by using a photosensitive film and a conductive material, so that the pattern of the substrate is consistent with the conductive material circuit; the conductive material circuit is further etched on the product, and finally the photosensitive film is removed and the back protective film is torn off. Since the front conductive material circuit and the substrate pattern are consistent, the conductive material on the back is etched from the front, and the etched pattern will also be consistent with the front conductive material circuit pattern, thereby achieving perfect overlap of the front and back conductive material circuits, avoiding the reduction of shielding effectiveness and moiré patterns.

[0021] 2. This invention uses a laser to laser-cut the double-sided conductive material based on the design pattern, removing unwanted areas. By adjusting the laser energy, the laser can penetrate the entire material, including the front conductive material, the substrate, and the back conductive material. This allows for simultaneous creation of patterns on both sides, ensuring a completely consistent pattern. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Schematic diagram of the preparation of the structure of the present invention.

[0023] In the figure: substrate 1, conductive layer 2, photosensitive film 3, protective film 4. DETAILED DESCRIPTION

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] See also Figure 1 The present invention provides a technical solution: a method for preparing a double-sided EMI pattern, wherein the double-sided EMI pattern comprises the following structures from top to bottom: a photosensitive film 3, a conductive layer 2, a substrate 1, and a protective film 4, and the preparation method comprises the following steps:

[0026] (1) First, a single-sided photosensitive film is applied to the conductive material; the conductive material can be a metal material such as copper, silver, including silver paste, nano silver wire, etc., or an organic conductive material, etc.; the application method can be hot pressing, coating, etc.;

[0027] (2) Covering the back with a protective film to protect the conductive material from scratches and chemical etching; then exposing the photosensitive film;

[0028] (3) preparing single-sided conductive circuits by developing, etching, and stripping;

[0029] (4) etching / dissolving the base material of the film material with a chemical solution to form an upper conductive material circuit;

[0030] Specifically, if the substrate is a glass substrate, hydrofluoric acid or the like can be used to etch the glass substrate. If the substrate is COP, xylene, dichloromethane, tetralin, decalin and other organic solvents can be used to dissolve it. If the substrate is PET, cresol, nitrobenzene, trichloroacetic acid, chlorophenol and other organic solvents can be used to dissolve it.

[0031] Since the upper conductive material circuit has been completed, the photosensitive film and conductive material protect the substrate, and the pattern of the substrate is consistent with the conductive material circuit;

[0032] (5) Further etching the conductive material circuit of the product, removing the photosensitive film and then tearing off the back protective film;

[0033] (6) Etching the conductive material on the back from the front to achieve the overlap of the conductive material circuits on the front and back sides;

[0034] Specifically, because the front conductive material circuit and the substrate pattern are consistent, etching the back conductive material from the front will also produce a pattern that is consistent with the front conductive material circuit pattern. This achieves perfect overlap of the front and back conductive material circuits, avoiding reduced shielding effectiveness and moiré patterns.

[0035] (7) Using a laser, refer to the design pattern and laser the double-sided conductive material to laser away the unnecessary areas;

[0036] (8) By adjusting the energy of the laser, the laser can penetrate the entire material of the front conductive material + substrate + back conductive material, so that the patterns on the front and back sides are completely consistent.

[0037] Specifically, by means of laser, the patterns on both sides can be made simultaneously, and the patterns on both sides are completely consistent.

[0038] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A method for preparing a double-sided EMI pattern, characterized in that: The double-sided EMI pattern includes the following structures from top to bottom: a photosensitive film, a front conductive material, a substrate, a back conductive material, and a protective film, and the preparation method includes the following steps: (1) First, apply a single-sided photosensitive film to the front conductive material; (2) Cover the reverse side with a protective film of conductive material and expose the photosensitive film; (3) Prepare single-sided conductive circuits by developing, etching, and stripping; (4) The substrate of the film material is then etched / dissolved by a solution, and the pattern of the substrate is consistent with the front conductive material circuit to form a front conductive material circuit; (5) Further etching the conductive material on the reverse side, removing the photosensitive film and then tearing off the back protective film; (6) Etching the conductive material on the back from the front to achieve the overlap of the conductive material circuits on the front and back sides; (7) Using a laser method, refer to the design pattern and laser the double-sided conductive material to laser away the unnecessary areas; (8) By adjusting the energy of the laser, the laser can penetrate the entire material of the front conductive material + substrate + back conductive material, so that the patterns on the front and back sides are completely consistent.

2. The method for preparing a double-sided EMI pattern according to claim 1, wherein: The conductive material in step (1) is a metal material or an organic conductive material.

3. The method for preparing a double-sided EMI pattern according to claim 1, wherein: The application method in step (1) is one of hot pressing and coating methods.

4. The method for preparing a double-sided EMI pattern according to claim 1, wherein: The substrate in step (4) is a glass substrate, and the solution is hydrofluoric acid.

5. The method for preparing a double-sided EMI pattern according to claim 1, wherein: The base material in step (4) is COP, and the solution is any one of xylene, dichloromethane, tetralin, and decalin.

6. The method for preparing a double-sided EMI pattern according to claim 1, wherein: The substrate in step (4) is PET, and the potion uses an organic solvent, which is any one of cresol, nitrobenzene, trichloroacetic acid, and chlorophenol.

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