Glazing thermal sensor

Abstract

This invention relates to an embedded glass comprising a temperature sensing device for measuring the temperature of the embedded glass. The temperature sensing device is fixed to the embedded glass using thermally conductive double-sided tape. The invention also relates to the temperature sensing device itself.

Description

Technical Field

[0001] This invention generally relates to the field of mounted glass equipped with a sensing device. More particularly, this invention relates to a mounted glass including a temperature sensing device for measuring the temperature of the mounted glass.

[0002] The present invention also relates to a temperature sensing device for measuring the temperature of an inlaid glass. Background Technology

[0003] Today, the ability to heat-mounted glass is very useful. This type of glass can be used in a wide variety of applications, such as buildings and automobiles. Heating the glass allows for the removal of fog and frost. Removing fog and / or frost from glass is crucial in the field of autonomous driving. Sensors behind the glass (cameras, radar, rain sensors, light sensors, etc.) must be able to detect objects without being affected by the perturbations caused by fog and / or frost on the glass.

[0004] In conjunction with heating the mounting glass, knowing the temperature of the mounting glass allows for the determination of when to activate or deactivate the heating function. To measure the temperature of the mounting glass itself, a temperature sensor is typically soldered onto the glass. As explained in EP2896269, although leaded solders have high ductility and can compensate for mechanical stresses between electrical connections and the mounting glass, the End of Life Vehicles Directive 2000 / 53 / EC prohibits the use of leaded solders. The purpose of this directive is to prohibit the use of highly problematic components in products resulting from a significant increase in disposable electronic devices. While this directive applies to the automotive industry, it can also have significant advantages in other applications, as the use of lead-free solders is more environmentally friendly.

[0005] Numerous electrical connection elements for lead-free soldering to conductive structures have been proposed. Examples include US20070224842, EP 1942703, WO 2007110610, EP1488972, and EP 2365730. Regarding the avoidance of thermal stress, the shape (thickness, size, etc.) and material of the workpiece to be soldered, as well as the solder, are of great importance. Inappropriate selection can lead to poor connections, potentially causing cracks at the solder joint or even detachment of the workpiece. In practice, soldering a temperature sensor onto an embedded glass is indeed a complex process.

[0006] Temperature measurement also requires sensors that are small enough to be used in a wide variety of applications. Today, especially (but not only) in the automotive industry, the trend is towards miniaturization of electronic components. Miniaturization allows these electronic components to be placed in previously inaccessible locations and / or to house more electronics in one place.

[0007] Therefore, a solution for measuring the temperature of mounted glass is needed that does not have the drawbacks of existing technologies. Summary of the Invention

[0008] This invention relates to an inlaid glass comprising a temperature sensing device for measuring the temperature of the inlaid glass. The temperature sensing device includes a first printed circuit board having a first side and a second side. The temperature sensing device also includes a thermistor fixed to the first side of the printed circuit board. The temperature sensing device further includes a first pair of connectors connected to the thermistor and exposed on the second side of the printed circuit board. The temperature sensing device also includes thermally conductive double-sided tape fixed to the first side of the printed circuit board. The temperature sensing device is fixed to the inlaid glass by the thermally conductive double-sided tape.

[0009] The present invention also proposes a temperature sensing device. Attached Figure Description

[0010] The invention will now be further described by way of example and with reference to the accompanying drawings, in which similar reference numerals denote similar elements. These examples are provided by way of illustration rather than limitation. The drawings are schematic and not to scale. These drawings do not limit the invention in any way. Further advantages will be illustrated by example.

[0011] Figure 1a The first embodiment of the present invention is shown.

[0012] Figure 1b A cross-sectional view of the first embodiment of the present invention is shown.

[0013] Figure 2 A second embodiment of the present invention is shown. Detailed Implementation

[0014] The invention will be described with reference to specific embodiments and certain accompanying drawings; however, the invention is not limited thereto but is limited only by the claims.

[0015] While some embodiments described herein include features that are not included in other embodiments, combinations of features from different embodiments are intended to be within the scope of the invention and to form different embodiments, as will be understood by those skilled in the art. For example, any claimed embodiment may be used in any combination as described in the appended claims.

[0016] The present invention proposes an inlaid glass including a temperature sensing device for measuring the temperature of the inlaid glass.

[0017] The temperature sensing device includes a first printed circuit board (PCB) having a first side and a second side. The PCB mechanically supports and electrically connects electrical or electronic components using conductive tracks, conductive pads, or other features etched from one or more copper sheet layers laminated to and / or between sheet layers on a non-conductive substrate. Typically, components are soldered onto the PCB to electrically connect and mechanically secure them to the PCB.

[0018] The PCB is not specifically positioned at the warmest point on the mounting glass, but rather at the most suitable point to avoid interfering with the final optical and / or heating functions. Based on the thermal stimulus, the temperature threshold of the control system is adjusted for the PCB positioning on the mounting glass to ensure that the mounting glass temperature does not exceed a safe level during heating.

[0019] The advantages of using PCBs are the very simple and low-cost components. They also allow for the easy addition of any components, such as chips that can regulate temperature, or processors that add additional features to temperature sensing devices.

[0020] The temperature sensing device also includes a thermistor fixed to the first surface of the printed circuit board. A thermistor is a type of resistor whose resistance depends on temperature. Therefore, the thermistor can provide information about the temperature. An electronic thermistor is also present, which provides a signal whose frequency changes with temperature. The thermistor can be soldered to the first printed circuit board, or any other mechanism known to those skilled in the art for securing components to a printed circuit board. Thermistors are low-cost components.

[0021] The temperature sensing device also includes a first pair of connectors. These connectors are connected to a thermistor and mounted on the second side of a printed circuit board. These connectors allow connection to the thermistor to, for example, supply current to the thermistor and / or retrieve information about temperature from the thermistor.

[0022] The temperature sensing device also includes thermally conductive double-sided tape. The thermally conductive double-sided tape is attached to the first side of the printed circuit board. The thermally conductive double-sided tape allows the printed circuit board to be secured to the mounting glass, and thus the temperature sensing device to the mounting glass. The thermally conductive double-sided tape contacts the mounting glass, causing a thermistor to measure the temperature of the mounting glass.

[0023] Thermally conductive double-sided tape is a low-cost component. It also allows for the very simple mounting of temperature sensors onto the mounting glass, especially compared to temperature sensors soldered to the mounting glass. Another advantage is the very low constraint imposed on the mounting glass itself.

[0024] The advantages of this invention are low cost, as the components themselves are low-cost. This invention also presents a relatively small footprint, which may be particularly important in the automotive industry.

[0025] According to an embodiment of the present invention, the volume of the printed circuit board is less than 0.22 cm³. 3 Furthermore, the maximum area of ​​the printed circuit board is less than 1.1 cm². 2 .

[0026] According to a second embodiment of the invention, the mounting glass further includes a silver printout distributed on the mounting glass. The silver printout is connected to a second pair of connectors, the second pair of connectors having their surfaces exposed on a second side of the printed circuit board. This second pair of connectors allows an electric current to be applied to the silver printout, and thus heats the mounting glass.

[0027] Other methods of heating the mounted glass, as known to those skilled in the art, exist, such as using embedded conductive lines or conductive coatings distributed on the mounted glass. These other methods can also be used instead of the previously mentioned silver printing.

[0028] According to embodiments of the present invention, the mounting glass is a cover glass for a camera or radar. The mounting glass can also be a cover glass for any type of sensor (e.g., a rain sensor, a light sensor, etc.) that uses a cover glass.

[0029] According to embodiments of the present invention, the embedded glass is the windshield, side door glass, or rear window glass of a motor vehicle. Motor vehicles include cars, vans, trucks, construction and mining machinery, industrial vehicles, motorcycles, buses, trams, trains, airplanes, helicopters, etc. Embedded glass can also be used in unmanned aerial vehicles, wind turbines, metering equipment, weather stations, traffic analysis systems, security and / or crowd analysis systems, or industrial robots.

[0030] According to embodiments of the present invention, embedded glass is a decorative element of a motor vehicle. A decorative element refers to an item that can be added to the interior or exterior of a motor vehicle to increase its attractiveness or to conceal unsightly parts. Some decorative elements are used to protect certain parts of the vehicle's interior or exterior from undesirable damage that may be caused by passengers, while others are purely for aesthetic purposes. For example, glass decorative elements can be used as trunk lids, covers for A-pillars, B-pillars, C-pillars, D-pillars (vertical or near-vertical supports for the window areas of a vehicle, which are designated as A-pillar, B-pillar, C-pillar, or (in larger vehicles) D-pillar respectively, moving from front to rear in the outline drawing), interior decorative elements on the dashboard, console trim, door trim, etc. Such glass decorative elements are described in patent applications EP3325417, EP 3325418, and EP3429893, which are incorporated herein by reference.

[0031] The present invention also proposes a temperature sensing device as previously described.

[0032] refer to Figure 1a The embedded glass (1) includes a temperature sensing device (2).

[0033] The temperature sensing device (2) includes a first printed circuit board (3) having a first side and a second side.

[0034] Thermistor (4) is fixed on the first side of the printed circuit board (3). Thermistor (4) is indicated by a dashed rectangle in the figure to show that the thermistor is under the first printed circuit board (3) in this view.

[0035] The temperature sensing device (2) also includes at least a first pair of connectors (5) connected to a thermistor (4). These connectors (5) are lateral to the first printed circuit board (3) and exposed on the second side of the first printed circuit board (3).

[0036] A thermistor (4) is fixed to a first surface of a printed circuit board (3), which is at least partially covered by thermally conductive double-sided tape (6). The thermally conductive double-sided tape (6) is indicated by a dashed rectangle in the accompanying drawings to show the thermally conductive double-sided tape under the first printed circuit board (3) in this view.

[0037] Figure 1b The figure shows a cross-sectional view of a temperature sensing device (2) fixed to a mounting glass (1) by thermally conductive double-sided tape (6). As can be seen from this figure, the thermistor (4) does not contact the mounting glass (1) directly, but rather through the thermally conductive double-sided tape (6).

[0038] Figure 2A second embodiment of the invention is shown. The mounting glass (1) still includes a temperature sensing device (2). The mounting glass (1) further includes a silver printout (7) distributed on the mounting glass. This silver printout is connected to a second pair of connectors, the second pair of connectors having their surfaces exposed on the second side of the printed circuit board (3).

[0039] While the invention has been shown and described in detail in the accompanying drawings and the foregoing description, such showing and description should be considered illustrative or exemplary, not restrictive. The foregoing description details certain embodiments of the invention. However, it should be understood that, however detailed the foregoing may appear in textual terms, the invention can be practiced in many ways. The invention is not limited to the disclosed embodiments.

Claims

1. A glazing (1) comprising a temperature sensing device (2) for measuring the temperature of the glazing (1), the temperature sensing device (2) comprising: a. a first printed circuit board (3) having a first face and a second face; b. a thermistor (4) fixed to the first face of the printed circuit board (3); c. a first pair of connectors (5) connected to the thermistor (4) and exposed to the second face of the printed circuit board (3); d. a thermally conductive double-sided tape (6) fixed to the first face of the printed circuit board (3); the temperature sensing device (2) being fixed to the glazing (1) by the thermally conductive double-sided tape (6).

2. Glazing (1) according to claim 1, characterized in that The printed circuit board (3) has a volume of less than 0.22 cm 3 and a maximum area of less than 1.1 cm 2 .

3. Glazing (1) according to claim 1 or 2, characterized in that the glazing (1) further comprising: - a silver print (7) distributed on the glazing; and characterized in that the temperature sensing device further comprises: - a second pair of connectors connected to the silver print and exposed to the second face of the printed circuit board (3).

4. Glazing (1) according to claim 1, 2 or 3, characterized in that the glazing (1) being a cover glass of a camera or a radar.

5. Glazing (1) according to claim 1, 2 or 3, characterized in that the glazing (1) being a windshield, a side door glass, or a rear window glass of a motor vehicle.

6. Glazing (1) according to claim 1, 2 or 3, characterized in that the glazing (1) being a decorative element of a motor vehicle.

7. A temperature sensing device for measuring the temperature of a glazing, the temperature sensing device comprising: a. a first printed circuit board having a first face and a second face; b. a thermistor fixed to the first face of the printed circuit board; c. a pair of connectors connected to the thermistor and exposed to the second face of the printed circuit board; d. a thermally conductive double-sided tape fixed to the first face of the printed circuit board; the temperature sensing device being able to be fixed to the glazing by the thermally conductive double-sided tape.

8. The temperature sensing device of claim 7, wherein, The volume of the printed circuit board (3) is less than 0.22 cm 3 and the maximum area of the printed circuit board is less than 1.1 cm 2 .

9. The temperature sensing device of claim 7 or 8, wherein, the temperature sensing device further comprising a second pair of connectors exposed to the second face of the printed circuit board (3).

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