Semiconductor device soldering tooling

Abstract

The present invention provides a soldering tooling for semiconductor devices, comprising: an outer frame which can be positioned and installed on the substrate of the semiconductor device, the outer frame defining a soldering area on the substrate, and the soldering area being used for arranging a plurality of liners to be soldered; and a positioning member which can be placed in the positioning gap between two adjacent liners and the width of which is not less than the width of the positioning gap, the positioning member being capable of positioning the plurality of liners to be soldered at intervals with respect to each other and making the outermost liner abut against the outer frame. Based on the technical solution of the present invention, the outer frame can be installed by using the original positioning holes on the substrate, and then the positioning member only needs to be placed between adjacent liners, so that the relative positioning between all the liners within the soldering area can be achieved in combination with the outer frame. There is no additional fixed connection structure between the entire tooling and the substrate and they can be directly disassembled from each other. The tooling can be directly disassembled after soldering, effectively avoiding the problem of interference after soldering.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and particularly to a soldering tooling for semiconductor devices. Background Art

[0002] In the preparation process of semiconductor devices such as IGBT modules, first, a backing plate needs to be soldered on a substrate, and the backing plate needs to be positioned before soldering. The current positioning method is hard positioning with a metal tooling, that is, first, a metal tooling fixedly connected to the substrate is set in the backing plate soldering area on the substrate, then a solder sheet and the backing plate are sequentially set in the area defined by the metal tooling, and finally soldering is performed. Such positioning and soldering methods mainly have the following defects:

[0003] 1. It is not applicable to large-area soldering scenarios. With an increase in the number of backing plates required for large-area soldering, the number of positioning points of the corresponding metal tooling increases, and the probability of problems such as interference between the backing plate and the tooling after soldering, resulting in difficult disassembly of the tooling, will increase significantly.

[0004] 2. Since the metal tooling needs to be fixedly connected to the substrate, and both the metal tooling and the substrate will expand thermally during the soldering process, the material selection of the metal tooling is limited and difficult. It needs to match the thermal expansion coefficient of the substrate material.

[0005] Therefore, in order to solve the above problems existing in the prior art, the present invention proposes a soldering tooling for semiconductor devices. Summary of the Invention

[0006] In order to solve the problems of easy interference and difficult disassembly and limited material selection existing in the positioning tooling for semiconductor device soldering in the prior art, the present invention proposes a soldering tooling for semiconductor devices.

[0007] A soldering tooling for semiconductor devices proposed by the present invention includes:

[0008] An outer frame, which can be positioned and installed on the substrate of the semiconductor device. The outer frame defines a soldering area on the substrate, and the soldering area is used to arrange a plurality of backing plates to be soldered; and

[0009] A positioning member, which can be placed in the positioning gap between two adjacent backing plates and whose width is not less than the width of the positioning gap. The positioning member can position the plurality of backing plates to be soldered at intervals from each other and make the outermost backing plate abut against the outer frame.

[0010] In one embodiment, the positioning member includes a positioning pin and two spacers. The two spacers can respectively contact two adjacent ones of the lining plates, and the positioning pin can be placed between the two spacers so that the two spacers respectively abut against the corresponding lining plates and define a buffer gap therebetween.

[0011] In one embodiment, the position where the positioning pin is located corresponds to the midpoint position of the width of the corresponding lining plate.

[0012] In one embodiment, the multiple lining plates to be welded are arranged in an array in the welding area, and the spacer extends continuously along the arrangement direction of the lining plates in the transverse or longitudinal direction; along the extension direction of the spacer, a positioning pin is provided at a position corresponding to each pair of adjacent lining plates.

[0013] In one embodiment, two ends of the continuously extending spacer respectively cooperate with the inner side surface of the outer frame, and the end of the spacer and the inner side surface of the outer frame are in interference fit, screw connection fit, pin connection fit or welding fit.

[0014] In one embodiment, the positioning member includes a transverse spacer extending in the transverse direction and a longitudinal spacer extending in the longitudinal direction, and the transverse spacer and the longitudinal spacer intersect with each other to form a grid structure.

[0015] In one embodiment, the multiple lining plates to be welded are arranged in an array in the welding area, the positioning member is composed of two intersecting spacers and has a cross-shaped structure, and the positioning member is arranged at the intersection point of every four adjacent lining plates.

[0016] In one embodiment, the spacer has a linear structure, a wavy structure or a zigzag structure along its length direction.

[0017] In one embodiment, the height of the positioning member relative to the substrate is greater than the thickness of the solder paste between the lining plate and the substrate.

[0018] In one embodiment, the bottom of the outer frame has a positioning portion, and the positioning portion can be fitted into a positioning hole on the substrate to realize the positioning and installation of the outer frame on the substrate.

[0019] The above technical features can be combined in various suitable ways or replaced by equivalent technical features as long as the object of the present invention can be achieved.

[0020] A semiconductor device welding tool provided by the present invention, compared with the prior art, at least has the following

[0021] Advantageous effects:

[0022] A welding tool for semiconductor devices according to the present invention. The outer frame can be installed by using the original positioning holes on the substrate. Then, the positioning member only needs to be placed between adjacent liner plates, so that the relative positioning of all the liner plates within the welding area can be achieved in combination with the outer frame. There is no additional fixed connection structure between the entire tooling and the substrate, and they can be directly disassembled from each other. The tooling can be directly disassembled after welding, effectively avoiding the problem of interference after welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Hereinafter, the present invention will be described in more detail based on embodiments and with reference to the drawings. Among them:

[0024] Figure 1 Shows a schematic diagram of one structure of the welding tooling of the present invention;

[0025] Figure 2 Shows a schematic diagram of another structure of the welding tooling of the present invention.

[0026] In the drawings, the same components are denoted by the same reference numerals. The drawings are not drawn to actual scale.

[0027] Reference Numerals:

[0028] 1 - Outer frame, 2 - Positioning member, 21 - Spacer, 211 - Horizontal spacer, 212 - Vertical spacer, 22 - Positioning pin, 23 - Buffer gap, 3 - Positioning gap, 4 - Substrate, 5 - Liner plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0029] The present invention will be further described below with reference to the drawings.

[0030] Embodiment 1

[0031] An embodiment of the present invention provides a welding tool for semiconductor devices, including:

[0032] An outer frame 1, which can be positioned and installed on the substrate 4 of the semiconductor device. The outer frame 1 defines a welding area on the substrate 4, and the welding area is used to arrange a plurality of liner plates 5 to be welded; and

[0033] A positioning member 2, which can be placed in the positioning gap 3 between two adjacent liner plates 5 and whose width is not less than the width of the positioning gap 3. The positioning member 2 can positionally space a plurality of liner plates 5 to be welded from each other and make the outermost liner plate 5 abut against the outer frame 1; the height of the positioning member 2 relative to the substrate 4 is greater than the thickness of the solder paste between the liner plate 5 and the substrate 4.

[0034] Specifically, the present invention mainly aims at the welding of the substrate 5 of semiconductor devices and designs a welding tooling. The outer frame 1 of the welding tooling can be positioned and installed by relying on the original positioning holes (not shown in the attached drawings) on the substrate 4. The bottom of the outer frame 1 has a positioning portion (not shown in the attached drawings), and the positioning portion can be fitted into the positioning holes to realize the positioning and installation of the outer frame 1 on the substrate 4. As shown in the attached drawings Figure 1 As shown, in this embodiment, the outer frame 1 of the square structure 1 defines a rectangular welding area on the substrate 4, and a plurality of substrates 5 to be welded are distributed in the welding area. There is a positioning gap 3 between adjacent substrates 5. The positioning member 2 of the welding tooling is placed in the positioning gap 3, and the positioning member 2 can respectively abut against two adjacent substrates 5, so that the adjacent substrates 5 maintain a stable spaced state, realizing the positioning of the substrates 5. After the plurality of positioning members 2 respectively position the corresponding substrates 5, the outermost substrate 5 among the plurality of substrates 5 in the welding area abuts against the outer frame 1, thus realizing the positioning of all the substrates 5 in the entire welding area.

[0035] The size of the outer frame 1 can be determined according to the size of the welding area previously delimited on the substrate 4, and the size of the positioning member 2 can be determined according to the size of the positioning gap 3 determined by the size of the substrate 5 and the size of the welding area.

[0036] For the welding tooling proposed by the present invention, the outer frame 1 is installed by using the original positioning holes on the substrate 4, and then the positioning member 2 only needs to be placed between adjacent substrates 5, so that the relative positioning between all the substrates 5 in the welding area can be realized in combination with the outer frame 1. There is no additional fixed connection structure between the entire tooling and the substrate 4 and they can be directly disassembled from each other. The tooling can be directly disassembled after welding, effectively avoiding the problem of interference after welding.

[0037] Further, the positioning member 2 includes a positioning pin 22 and two spacers 21. The two spacers 21 can respectively contact two adjacent substrates 5, and the positioning pin 22 can be placed between the two spacers 21, so that the two spacers 21 respectively abut against the corresponding substrates 5 and define a buffer gap 23 between the spacers 21.

[0038] Specifically, referring to the attached drawings Figure 1 As shown, for further design of the positioning member 2, a structure of two spacers 21 plus a positioning pin 22 is adopted to realize positioning. The spacers 21 respectively contact two adjacent substrates 5, and the positioning pin 22 is inserted between the spacers 21. In this way, the two spacers 21 on both sides can be respectively abutted against the corresponding substrates 5 by using the positioning pin 22, and the positioning pin 22 and the spacers 21 are only in layout contact. In this way, a buffer gap 23 can be defined between the two spacers 21, and this buffer gap 23 can provide space for possible local expansion during the welding process to a certain extent, avoiding the problem that the corresponding structural components are difficult to disassemble due to hard interference during the welding process.

[0039] It should be noted that in theory, the positioning effect can also be achieved only by one or more positioning pins 22. However, in this case, the contact area and range between the positioning pins 22 and the lining plate 5 are too small, and the contacted areas are discontinuous, resulting in an unsatisfactory positioning effect. By means of the spacer 21, the direct contact area with the lining plate 5 can be increased, and the contacted areas are continuous, which can improve the positioning stability.

[0040] The length of the spacer 21 is preferably the same as the width of the corresponding lining plate 5, and the thickness of the spacer 21 is not greater than 1 mm. The positioning posts are preferably cylindrical or square posts, and other columnar structures with a regular polygon cross-section can also be used.

[0041] Preferably, the position where the positioning pin 22 is located corresponds to the midpoint position of the width of the corresponding lining plate 5, which can also improve the positioning stability.

[0042] Furthermore, a plurality of lining plates 5 to be welded are arranged in an array in the welding area, and the spacer 21 extends continuously along the transverse or longitudinal arrangement direction of the lining plates 5; along the extension direction of the spacer 21, a positioning pin 22 is arranged at the position corresponding to each pair of adjacent lining plates 5.

[0043] Specifically, as shown in the attached drawing Figure 1 As shown, based on the fact that a plurality of lining plates 5 to be welded are arranged in an array in the welding area, the spacer 21 can be arranged as a long strip extending continuously along the arrangement direction of the lining plates 5. In this way, one spacer 21 can correspond to all the lining plates 5 in one row or one column. Compared with the scheme of arranging a pair of spacers 21 corresponding to each pair of adjacent lining plates 5, the continuously extending spacer 21 is more convenient for installation and has better positioning stability. Specifically, for the continuously extending spacer 21, a plurality of positioning pins 22 are arranged in sequence in the extension direction. In this way, one spacer 21 has multiple positioning points, which can further improve the stability of its own structure and installation position, thereby improving the positioning effect.

[0044] Furthermore, the two ends of the continuously extending spacer 21 are respectively matched with the inner side surfaces of the mating outer frame 1, and the end portions of the spacer 21 and the inner side surfaces of the outer frame 1 are in interference fit, screw connection fit, pin connection fit or welding fit.

[0045] Specifically, on the basis of the above-mentioned advantages, the two ends of the continuously extending spacer 21 can also be matched with the outer frame 1, so that it can be relatively fixed to the outer frame 1 in its extension direction, and further the entire positioning tooling can form an integral body. The end portions of the spacer 21 can be directly in interference fit with the outer frame 1, which is also the most preferred method. Of course, assembly holes can also be opened at the end portions of the spacer 21 and connected to the outer frame 1 by screws or pins; direct welding connection can also be used.

[0046] Further, the positioning member 2 includes a transverse partition 211 extending in the transverse direction and a longitudinal partition 212 extending in the longitudinal direction. The transverse partition 211 and the longitudinal partition 212 intersect with each other to form a grid structure.

[0047] Specifically, according to the distribution and quantity of the backing plates 5 within the welding area, the overall structure of the positioning member 2 will vary. In the layout structure of the backing plates 5 shown in the attached drawings Figure 1 The positioning member 2 is a grid structure formed by the transverse partition 211 and the longitudinal partition 212. The transverse partition 211 and the longitudinal partition 212 can be an integral structure or an assembled structure that can be separated from each other. For the split structure, limiting grooves can be respectively provided at the intersection positions of the transverse partition 211 and the longitudinal partition 212, and the limiting grooves of the two correspond to each other and are clamped, so that the cooperation and transition of the two can be achieved at the intersection.

[0048] Further, the partition 21 is in a straight-line structure, a wavy structure or a broken-line structure along its length direction.

[0049] Specifically, according to different requirements, the shape structure of the partition 21 can be adjusted. As shown in the attached drawings Figure 1 and Figure 2 the partition 21 shown is in a straight-line structure. If it is considered necessary to reserve some space between the partition 21 and the backing plate 5 to cope with expansion, or to cope with the expansion deformation of the partition 21 itself at the same time, the partition 21 can be set as a wavy structure or a broken-line structure.

[0050] Further, the material of the outer frame 1 can be titanium alloy or other hard alloys, the material of the partition 21 can be stainless steel or other metal materials, and the material of the positioning pin 22 can be stainless steel, other metal materials or high-temperature resistant polymer materials.

[0051] Embodiment 2

[0052] This embodiment is another design of the structure of the positioning member. Some of its contents are the same as those of Embodiment 1, and will not be elaborated in this embodiment.

[0053] An embodiment of the present invention provides a semiconductor device welding tooling, including:

[0054] An outer frame 1, which can be positioned and installed on the substrate 4 of the semiconductor device. The outer frame 1 defines a welding area on the substrate 4, and the welding area is used to arrange a plurality of backing plates 5 to be welded; and

[0055] A positioning member 2, which can be placed in the positioning gap 3 between two adjacent backing plates 5 and whose width is not less than the width of the positioning gap 3. The positioning member 2 can space and position a plurality of backing plates 5 to be welded from each other, and make the outermost backing plate 5 abut against the outer frame 1;

[0056] Multiple liners 5 to be welded are arranged in an array in the welding area. The positioning member 2 is composed of two intersecting partitions 21 and has a cross-shaped structure. The positioning member 2 is arranged at the intersection of every four adjacent liners 5.

[0057] Specifically, as shown in the attached drawings Figure 2 As shown, in this embodiment, the positioning member 2 is directly designed as a cross shape and is composed of two intersecting partitions 21. These two intersecting partitions 21 can be an integral structure or an assembled structure that can be separated from each other. The cross-shaped positioning member 2 can be directly arranged at the intersection of four adjacent liners 5, that is, at the cross-shaped positioning gap 3 at the intersection, so that the positioning of the liner 5 can also be realized.

[0058] In this solution, the length of the part of the partition 21 of the positioning member 2 in contact with the liner 5 should be less than half of the width of the liner 5 in the corresponding direction. In this way, two adjacent positioning members 2 are also spaced from each other in the same positioning gap 3, so that a part of the space can be left in the positioning gap 3 as a buffer gap 23.

[0059] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "bottom", "top", "front", "rear", "inner", "outer", "left", "right", etc. is based on the orientation or positional relationship shown in the attached drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0060] Although the present invention has been described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the present invention. Therefore, it should be understood that many modifications can be made to the exemplary embodiments, and other arrangements can be designed, as long as they do not deviate from the spirit and scope of the present invention defined by the appended claims. It should be understood that different dependent claims and the features described herein can be combined in a manner different from that described in the original claims. It should also be understood that the features described in connection with a single embodiment can be used in other described embodiments.

Claims

1. A semiconductor device soldering tooling, characterized in that, Comprising: An outer frame which can be positioned and installed on the substrate of a semiconductor device, the outer frame defining a soldering area on the substrate, and the soldering area is used for arranging a plurality of liners to be soldered; And A positioning member which can be placed in the positioning gap between two adjacent liners and whose width is not less than the width of the positioning gap. The positioning member can position the plurality of liners to be soldered at intervals from each other and make the outermost liner abut against the outer frame. The positioning member includes a transverse spacer extending in the transverse direction and a longitudinal spacer extending in the longitudinal direction, and the transverse spacer and the longitudinal spacer are staggered with each other to form a grid structure; Wherein, the positioning member includes a positioning pin and two spacers. The two spacers can respectively contact two adjacent liners, and the positioning pin can be placed between the two spacers so that the two spacers respectively press against the corresponding liners and define a buffer gap between the spacers. The position where the positioning pin is located corresponds to the midpoint position of the width of the corresponding liner; The plurality of liners to be soldered are arranged in an array in the soldering area, and the spacer extends continuously along the arrangement direction of the liner in the transverse or longitudinal direction; along the extending direction of the spacer, a positioning pin is arranged at each position corresponding to each pair of adjacent liners.

2. The semiconductor device soldering tooling according to claim 1, wherein Both ends of the continuously extending spacer are respectively in fit with the inner side surface of the outer frame. The end of the spacer and the inner side surface of the outer frame are in interference fit, screw connection fit, pin connection fit or welding fit.

3. The semiconductor device soldering tooling according to claim 1 or 2, characterized in that, The spacer is in a straight-line structure, a wavy structure or a broken-line structure along its length direction.

4. The semiconductor device soldering tooling according to claim 1, characterized in that, The height of the positioning member relative to the substrate is greater than the thickness of the solder pad between the liner and the substrate.

5. The semiconductor device soldering tooling according to claim 1, wherein, The bottom of the outer frame has a positioning portion which can be fitted into the positioning hole on the substrate to realize the positioning and installation of the outer frame on the substrate.

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