Electronic Devices

Abstract

An electronic device includes a substrate, side conductors, a protective film, and a first filler. The substrate has a first surface, a second surface, and a side surface connecting the first and second surfaces. Side conductors are disposed on the substrate and extend from the first surface through the side surface to the second surface. The protective film is disposed on the side conductors. The side conductors are sandwiched between the substrate and the protective film. The edge of the protective film extends beyond the sidewall of the side conductor, and the protective film, the sidewall of the side conductor, and the substrate define a gap. The first filler is disposed on the protective film and in the gap, wherein the first filler includes a first material and a plurality of particles mixed with the first material.

Description

Technical Field

[0001] The invention relates to an electronic device. Background Art

[0002] With the advancement of technology, the screen-to-body ratio of display panels has become an important reference indicator for many consumers when purchasing display devices. To improve the screen-to-body ratio, a driver chip without a display function can be set on the back of the substrate of the display panel, and then the side wires set on the side of the substrate are used to electrically connect the driver chip on the back and the pixels on the front. In order to protect the side wires, generally speaking, a water-vapor barrier material is formed on the side wires. However, due to the structure of the display panel itself, the water-vapor barrier material cannot completely cover the side wires, resulting in poor reliability of the display panel. Summary of the invention

[0003] The invention provides an electronic device with good reliability.

[0004] The electronic device of the present invention comprises a substrate, a side wire, a protective film and a first filler. The substrate has a first surface, a second surface and a side surface connected between the first surface and the second surface. The side wire is arranged on the substrate and extends from the first surface through the side surface to the second surface. The protective film is arranged on the side wire. The side wire is sandwiched between the substrate and the protective film. The edge of the protective film exceeds the side wall of the side wire, and the protective film, the side wall of the side wire and the substrate define a gap. The first filler is arranged on the protective film and in the gap, wherein the first filler comprises a first material and a plurality of particles mixed with the first material.

[0005] In one embodiment of the present invention, the gap has a width a in a direction perpendicular to the side of the substrate, one of the plurality of particles is disposed in the gap, one of the plurality of particles has a height b in the direction, and a≥b>0.5a.

[0006] In one embodiment of the present invention, the viscosity of the first material of the first filler is less than or equal to 50000 cP.

[0007] In one embodiment of the present invention, the electronic device further includes a second filler disposed on the first filler, wherein the water vapor permeability of the second filler is lower than the water vapor permeability of the first filler.

[0008] In an embodiment of the present invention, the electronic device further includes a second filler disposed on the first filler, wherein the viscosity of the first filler is lower than the viscosity of the second filler.

[0009] In one embodiment of the present invention, one of the plurality of particles is in a spherical, rod-shaped or irregular shape.

[0010] In one embodiment of the present invention, one of the plurality of particles is a sphere, and the spherical surface of the sphere has a plurality of protrusions. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figures 1A to 1E FIG. 4 is a cross-sectional schematic diagram of a manufacturing process of an electronic device according to an embodiment of the present invention.

[0012] Figure 2 FIG. 4 is a three-dimensional schematic diagram of an electronic device according to an embodiment of the present invention.

[0013] Figure 3 FIG. 4 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present invention.

[0014] Figure 4 FIG. 1 is a diagram showing a particle in a gap of an electronic device according to an embodiment of the present invention.

[0015] Figure 5 Another particle in the gap of the electronic device according to an embodiment of the present invention is shown.

[0016] Figure 6 The cross-section of the substrate, the side wires, the protective film, and the first filler photographed using an electron microscope is shown.

[0017] Figure 7 The cross-section of the substrate, the side wires, the protection film 0, and the first filler photographed using an electron microscope is shown.

[0018] Figure 8 The cross-section of the substrate, the side wires, the protective film, and the first filler photographed using an electron microscope is shown.

[0019] Fig. 9 The cross-section of the substrate, the side wires, the protective film, and the first filler photographed using an electron microscope is shown.

[0020] Fig.10 The cross-section of the substrate, the side wires, the protective film, and the first filler photographed using an electron microscope is shown.

[0021] Fig.11 The cross-section of the substrate, the side wires, the protective film, and the first filler photographed using an electron microscope is shown.

[0022] Fig.12 The high temperature and high humidity test results of an electronic device of a comparative example are shown.

[0023] Fig.13 The high temperature and high humidity test results of the electronic device according to one embodiment of the present invention are shown.

[0024] Fig.14 FIG. 4 is a schematic three-dimensional diagram of an electronic device according to another embodiment of the present invention.

[0025] Fig.15 FIG. 4 is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention.

[0026] Fig.16 FIG. 4 is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention.

[0027] Fig.17 FIG. 4 is a schematic diagram of particles of a first filler of an electronic device according to another embodiment of the present invention.

[0028] Fig.18 FIG. 4 is a schematic diagram of particles of a first filler of an electronic device according to another embodiment of the present invention.

[0029] Fig.19 FIG. 4 is a schematic diagram of particles of a first filler of an electronic device according to an embodiment of the present invention.

[0030] Description of reference numerals:

[0031] 10, 10A: Electronic devices

[0032] 110: Substrate

[0033] 112: First surface

[0034] 112a: Active Zone

[0035] 112b: Marginal Area

[0036] 114: Second Surface

[0037] 116: Side

[0038] 120: Pixel driving circuit structure

[0039] 122: Pixel pad

[0040] 130: Edge pad

[0041] 140: Side wire

[0042] 140a, 150a: Edge

[0043] 140s: Sidewall

[0044] 142: One end

[0045] 150: Protective film

[0046] 160: First filler

[0047] 162: First Material

[0048] 164, 164B, 164C, 164D: Microparticles

[0049] 164s: spherical

[0050] 164sa: bulge

[0051] 170: Second filler

[0052] A-A', B-B', C-C', D-D': Section lines

[0053] a: width

[0054] b: Height

[0055] d: size

[0056] g: gap

[0057] P: Printing tools

[0058] T150: Thickness

[0059] x, y, z: direction DETAILED DESCRIPTION

[0060] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0061] It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it may be directly on or connected to another element, or an intermediate element may also exist. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intermediate elements. As used herein, "connection" may refer to physical and / or electrical connection. Furthermore, "electrical connection" or "coupling" may refer to the presence of other elements between two elements.

[0062] As used herein, "about", "approximately", or "substantially" includes the stated value and the average value within an acceptable deviation range of the particular value determined by one of ordinary skill in the art, taking into account the measurement in question and the particular amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, as used herein, "about", "approximately", or "substantially" can select a more acceptable deviation range or standard deviation depending on the optical property, etching property or other property, and can apply to all properties without a single standard deviation.

[0063] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and the present invention, and will not be interpreted as an idealized or overly formal meaning unless explicitly defined as such herein.

[0064] Figures 1A to 1E FIG. 4 is a cross-sectional schematic diagram of a manufacturing process of an electronic device according to an embodiment of the present invention. Figure 2 FIG. 4 is a three-dimensional schematic diagram of an electronic device according to an embodiment of the present invention. Figures 1A to 1E correspond Figure 2 The section line A-A'. Figure 3 FIG. 4 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present invention. Figure 3 correspond Figure 2 For the purpose of clear expression, the figure shows the directions x, y and z which are interlaced with each other.

[0065] Please refer to Figure 1A and Figure 2 First, a substrate 110 , a pixel driving circuit structure 120 , an edge pad 130 , a side wire 140 and a protective film 150 are provided.

[0066] The substrate 110 has a first surface 112, a second surface 114, and a side surface 116 connected between the first surface 112 and the second surface 114. The normal direction of the first surface 112 (e.g., direction z), the normal direction of the second surface 114 (e.g., the opposite direction of direction z), and the normal direction of the side surface 116 (e.g., direction y) are different from each other. The first surface 112 has an active area 112a and an edge area 112b outside the active area 112a. The pixel driving circuit structure 120 is disposed in the active area 112a of the first surface 112. The edge pad 130 is disposed in the edge area 112b of the first surface 112 and is electrically connected to the pixel driving circuit structure 120.

[0067] In the present embodiment, the pixel driving circuit structure 120 may include a pixel pad 122 and a pixel driving circuit (not shown) electrically connected to the pixel pad 122, and the edge pad 130 is electrically connected to the pixel driving circuit. For example, in the present embodiment, the pixel driving circuit may include a signal line, an active element, a passive element, etc., wherein the active element is, for example, a transistor and the passive element is, for example, a capacitor structure, and the edge pad 130 may be electrically connected to the signal line, but the present invention is not limited thereto. In the present embodiment, the pixel pad 122 may be used to be coupled to a light-emitting element (not shown), and the light-emitting element is, for example, a micro light-emitting diode (μLED), but the present invention is not limited thereto.

[0068] The side wire 140 is disposed on the substrate 110 and extends from the first surface 112 through the side surface 116 to the second surface 114. For example, in the present embodiment, one end 142 of the side wire 140 covers the edge pad 130 and is electrically connected to the edge pad 130, while the other end (not shown) of the side wire 140 is disposed on the second surface 114 of the substrate 110 and is electrically connected to an electronic component (such as but not limited to: a fan-out trace, a driver chip, etc.) disposed on the second surface 114.

[0069] The protective film 150 is disposed on the side wire 140, wherein the side wire 140 is sandwiched between the substrate 110 and the protective film 150. The edge 140a of the side wire 140 may be retracted relative to the edge 150a of the protective film 150 to form an undercut structure. In other words, the edge 150a of the protective film 150 exceeds the side wall 140s of the side wire 140, and the protective film 150, the side wall 140s of the side wire 140 and the substrate 110 define a gap g. In addition, in the present embodiment, the thickness T150 of the protective layer 150 may be non-uniform. For example, in the present embodiment, the thickness T150 of the protective layer 150 may be thinner toward the edge 150a.

[0070] Please refer to Figures 1B to 1E , then, a first filler 160 is formed on the protective film 150 and in the gap g. For example, in this embodiment, the first filler 160 can be formed on the protective film 150 and in the gap g by printing. In detail, the first filler 160 can be first coated or applied to a printing tool P, and then the printing tool P is pressed against the side 116 of the substrate 110, so that the first filler 160 on the printing tool P adheres to the protective film 150 and penetrates into the gap g through capillary phenomenon. Then, after removing the printing tool P, the first filler 160 is cured. At this point, the electronic device 100 is completed.

[0071] Please refer to Figure 1C and Figure 1DIt is worth noting that the first filler 160 includes a first material 162 and a plurality of particles 164 mixed into the first material 162. In the process of using the printing tool P to press the substrate 110 so that the first filler 160 thereon is attached to the protective film 150 and penetrates into the gap g through the capillary phenomenon, part of the particles 164 will penetrate into the gap g along with the first material 162 with fluidity. When the printing tool P presses the substrate 110 to bend and deform both sides of the protective film 150, part of the particles 164 that penetrate into the gap g can play a role in supporting the protective film 150, so that there is still a gap g between the protective film 150 and the substrate 110, and the first filler 160 can continue to penetrate toward the side wall 140s of the side wire 140 through the capillary phenomenon, and then contact the side wall 140s of the side wire 140 and fill the entire gap g. In short, adding particles 164 to the first material 162 allows the first filler 160 to smoothly fill the gap g between the protective film 150, the sidewall 140s of the side wire 140, and the substrate 110, thereby increasing the reliability of the electronic device 100. In this embodiment, the particles 164 may be selectively irregular in shape. However, the present invention does not limit the shape of the particles 164, and in other embodiments, the particles 164 may also be in other shapes.

[0072] Figure 4 FIG. 1 is a diagram showing a particle in a gap of an electronic device according to an embodiment of the present invention. Figure 5 FIG. 2 shows another particle in the gap of an electronic device according to an embodiment of the present invention. Figure 4 and Figure 5 , the particle 164 is disposed in the gap g, the particle 164 has a height b in the direction y, the particle 164 has a maximum size d, and the height b of the particle 164 in the direction y may be smaller than d (e.g. Figure 4 as shown) or equal to d (as shown Figure 5 In this embodiment, the gap g has a width a in the direction y perpendicular to the side surface 116 of the substrate 110, the particle 164 is disposed in the gap g, the particle 164 has a height b in the direction y, and a ≥ b > 0.5a. Therefore, the particle 164 can smoothly enter the gap g and Figure 1C The protective film 150 is supported during the process, so that the first filler 160 fills the entire gap g. Figure 6 , Figure 7 and Figure 8 Confirm it.

[0073] Figure 6 The cross-section of the substrate 110 , the side wire 140 , the protection film 150 , and the first filler 160 is photographed using an electron microscope. Figure 6The width a of the particles 164 of the first filler 160 in the direction y perpendicular to the side surface 116 of the substrate 110 is 0.471 μm, and the height b of the gap g in the direction y is 0.761 μm, that is, b=1.62a. Figure 6 It can be seen that when b=1.62a (ie, b>a), the particles 164 do not enter the gap g, and the first filler 160 cannot completely fill the gap g.

[0074] Figure 7 The cross-section of the substrate 110 , the side wire 140 , the protection film 150 , and the first filler 160 is photographed using an electron microscope. Figure 7 The width a of the particles 164 of the first filler 160 in the direction y perpendicular to the side surface 116 of the substrate 110 is 1.439 μm, and the height b of the gap g in the direction y is 1.079 μm, that is, b=0.75a. Figure 7 It can be seen that when b=0.75a (ie, a≥b>0.5a), the particles 164 can enter the gap g and support the protection film 150 , thereby allowing the first filler 160 to completely fill the gap g.

[0075] Figure 8 The cross-section of the substrate 110 , the side wire 140 , the protection film 150 , and the first filler 160 is photographed using an electron microscope. Figure 8 The width a of the particles 164 of the first filler 160 in the direction y perpendicular to the side surface 116 of the substrate 110 is 0.655 μm, and the height b of the gap g in the direction y is 0.326 μm, that is, b=0.50a. Figure 8 It can be seen that when b=0.5a, the particles 164 cannot provide a good support for the protective film 150 and are not effective on the printing tool P (drawn on Figure 1C ) maintains a sufficient gap g when pressing against the substrate 110, but the first filler 160 cannot completely fill the gap g.

[0076] Please refer to Figure 1C, the particles 164 of the first filler 160 have supporting force and are compressible. In the present embodiment, the material of the particles 164 can be an organic material, an inorganic material, other materials or a combination thereof. For example, the material of the particles 164 can be silicon oxide, epoxy resin, carbon black or polyester fiber, but the present invention is not limited thereto. For example, the material of the first material 162 can be polyester resins, phenolic resins, alkyd resins, polycarbonate resins, polyamide resins, polyurethane resins, silicone resins, epoxy resins, polyethylene resins, acrylic resins, polystyrene resins, polypropylene resins or any other material with protective and waterproof capabilities, but the present invention is not limited thereto. In this embodiment, the first material 162 of the first filler 160 preferably has a low viscosity so that the first filler 160 can penetrate into the gap g through capillary phenomenon. For example, the viscosity of the first material 162 of the first filler 160 is preferably less than or equal to 50000 cP. Fig. 9 , Fig.10 and Fig.11 Confirm it.

[0077] Fig. 9 The cross-section of the substrate 110 , the side wire 140 , the protection film 150 , and the first filler 160 is photographed using an electron microscope. Fig. 9 The viscosity of the first material 162 of the first filler 160 = 53000 cP (ie, the viscosity of the first material 162 of the first filler 160 is greater than 50000 cP). Fig. 9 It can be seen that when the viscosity of the first material 162 of the first filler 160 is greater than 50000 cP, the first filler 160 cannot fully penetrate into and fill the gap g.

[0078] Fig.10 The cross-section of the substrate 110 , the side wire 140 , the protection film 150 , and the first filler 160 is photographed using an electron microscope. Fig.10 The viscosity of the first material 162 of the first filler 160 is 50000 cP. Fig.10 It can be seen that when the viscosity of the first material 162 of the first filler 160 is equal to 50000 cP, the first filler 160 can fully penetrate into and fill the gap g.

[0079] Fig.11 The cross-section of the substrate 110 , the side wire 140 , the protection film 150 , and the first filler 160 is photographed using an electron microscope. Fig.11 The viscosity of the first material 162 of the first filler 160 is 12000 cP (ie, the viscosity of the first material 162 of the first filler 160 is less than 50000 cP). Fig.11 It can be seen that when the viscosity of the first material 162 of the first filler 160 is less than 50000 cP, the first filler 160 can fully penetrate into and fill the gap g.

[0080] Please refer to Figure 1E In addition to helping the first filler 160 fill the gap g, the plurality of particles 164 can also improve the water vapor barrier capability of the first filler 160, thereby improving the reliability of the electronic device 10. Specifically, the first filler of the comparative example includes the first material 162 of the first filler 160 of the present embodiment but does not include the particles 164. The water vapor permeability of the first filler of the comparative example and the first filler 160 of the present embodiment with the same thickness (e.g., 30 μm) is measured, and the water vapor permeability of the first filler of the comparative example is 57 g / m 2 ·day, the water vapor permeability of the first filler 160 in this embodiment is 27g / m 2 That is, the water vapor transmission rate of the first filler 160 of the present embodiment is lower than that of the first filler of the comparative example, and the water vapor barrier capability of the first filler 160 of the present embodiment is better than that of the first filler of the comparative example.

[0081] Fig.12 The high temperature and high humidity test results of an electronic device of a comparative example are shown. Fig.13 The high temperature and high humidity test results of the electronic device of one embodiment of the present invention are shown. The difference between the electronic device of the comparative example and the electronic device 10 of the present embodiment is that the first filler of the comparative example does not include a plurality of particles 164 .

[0082] Please refer to Fig.12 After 168 hours of high temperature 85°C and high humidity 85% test, the resistance values ​​measured at the three electrodes PAM, PWM and VSS of the electronic device samples 1, 2 and 3 of the comparative example are obviously larger and higher. Please refer to Fig.13After 168 hours of high temperature 85°C and high humidity 85% test, the resistance values ​​measured at the three electrodes PAM, PWM and VSS of the electronic device 10 of the present embodiment, sample I, sample II and sample III, remain substantially unchanged and low. This proves that by adding the particles 164, the electronic device 10 of the present embodiment is more resistant to high temperature and humidity and has better reliability.

[0083] It must be noted that the following embodiments use the component numbers and some contents of the previous embodiments, wherein the same number is used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can refer to the previous embodiments, and the following embodiments will not be repeated.

[0084] Fig.14 FIG. 4 is a schematic three-dimensional diagram of an electronic device according to another embodiment of the present invention. Fig.15 FIG. 4 is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention. Fig.15 correspond Fig.14 Section line C-C'. Fig.16 FIG. 4 is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention. Fig.16 correspond Fig.14 The section line D-D'.

[0085] Fig.14 , Fig.15 and Fig.16 The electronic device 10A and Figure 1E , Figure 2 and Figure 3 The electronic device 10 is similar to the electronic device 10, and the difference between the two is: Fig.12 , Fig.13 and Fig.14 The electronic device 10A further includes a second filler 170 .

[0086] Please refer to Fig.14 , Fig.15 and Fig.16, the second filler 170 is disposed on the first filler 160. Part of the first filler 160 is disposed between the second filler 170 and the protective film 150. The second filler 170 does not have the particles 164. The water vapor permeability of the second filler 170 is lower than the water vapor permeability of the first filler 160. The viscosity of the first material 162 of the first filler 160 is lower than the viscosity of the second filler 170. In other words, the fluidity of the first filler 160 is better than that of the second filler 170, and the water vapor barrier capability of the second filler 170 is better than that of the first filler 160. The first filler 160 can fully penetrate and fill the gap g between the protective film 150 and the substrate 110 during the manufacturing process of the electronic device 10A, and the second filler 170 can make up for the deficiency of the first filler 160 with low viscosity but weak water vapor barrier capability, thereby further improving the reliability of the electronic device 10A.

[0087] Fig.17 FIG. 1 is a schematic diagram of particles of a first filler of an electronic device according to another embodiment of the present invention. Fig.17 In the embodiment of the present invention, the particles 164B may be spherical. The spherical particles 164B may be used to replace the irregular particles 164 in the aforementioned electronic devices 10 and 10A, and the electronic devices constructed in this manner are also within the scope of the present invention.

[0088] Fig.18 FIG. 1 is a schematic diagram of particles of a first filler of an electronic device according to another embodiment of the present invention. Fig.18 In the embodiment of the present invention, the particles 164C may be rod-shaped. The rod-shaped particles 164C may be used to replace the irregular particles 164 in the aforementioned electronic devices 10 and 10A, and the electronic devices constructed in this manner are also within the scope of the present invention.

[0089] Fig.19 FIG. 1 is a schematic diagram of particles of a first filler of an electronic device according to an embodiment of the present invention. Fig.19 In the embodiment, the particle 164D may be a sphere, and the spherical surface 164s of the sphere has a plurality of protrusions 164sa. The particle 164D may be used to replace the irregular particle 164 in the aforementioned electronic device 10, 10A, and the electronic device constructed in this way is also within the scope of the present invention.

Claims

1. An electronic device, comprising: A substrate having a first surface, a second surface and a side surface connected between the first surface and the second surface; A side wire is disposed on the substrate and extends from the first surface through the side surface to the second surface; a protective film disposed on the side wire, wherein the side wire is sandwiched between the substrate and the protective film, an edge of the protective film exceeds a side wall of the side wire, and the protective film, the side wall of the side wire and the substrate define a gap; and A first filler is disposed on the protective film and in the gap, wherein the first filler includes a first material and a plurality of particles mixed with the first material, wherein the plurality of particles are compressible, wherein the gap has a width in a direction perpendicular to the side surface of the substrate, the width is a, one of the particles is disposed in the gap, the one of the particles has a height in the direction, the height is b, and a≥b>0.5a, wherein the viscosity of the first material of the first filler is less than or equal to 50000 cP, wherein the first filler penetrates toward the side wall of the side wire, thereby contacting the side wall of the side wire and filling the entire gap.

2. The electronic device as claimed in claim 1, further comprising: A second filler is disposed on the first filler, wherein the water vapor permeability of the second filler is lower than the water vapor permeability of the first filler.

3. The electronic device as claimed in claim 1, further comprising: A second filler is disposed on the first filler, wherein the viscosity of the first filler is lower than the viscosity of the second filler. The electronic device as claimed in claim 1 , wherein one of the particles is in a spherical, rod-shaped or irregular shape. The electronic device as claimed in claim 1 , wherein one of the particles is a sphere, and a spherical surface of the sphere has a plurality of protrusions.

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