A method of manufacturing a ceramic package and a ceramic package

Abstract

The application provides a manufacturing method of a ceramic shell package, which comprises at least two layers of bottom flow-cast sheets, at least two layers of middle flow-cast sheets, an upper flow-cast sheet and a sealing ring flow-cast sheet, forming a through hole in each layer of the middle flow-cast sheets, then printing a corresponding conductor layer on each layer of the middle flow-cast sheets, and then performing a punching and slurry hanging operation on each layer of the middle flow-cast sheets; printing a corresponding conductor layer on each layer of the bottom flow-cast sheets; and performing a punching and slurry injection operation; performing an isostatic laminating operation on all the bottom flow-cast sheets, performing an isostatic laminating operation on all the middle flow-cast sheets and the upper flow-cast sheet, then performing an isostatic laminating operation on the isostatic laminated bottom flow-cast sheets, the isostatic laminated middle flow-cast sheets and the upper flow-cast sheet and the sealing ring flow-cast sheet, to obtain a semi-finished product; and performing sintering on the semi-finished product to obtain the ceramic shell package, so that the conduction resistance is greatly reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to a manufacturing method of a ceramic housing package and the ceramic housing package. BACKGROUND

[0002] The existing ceramic housing package, after the chip is put in, the pin is connected with the heat sink, and then the heat sink is connected to the external back plate through the line in the ceramic housing package, which needs to be perforated on the ceramic housing package, and then grouting is carried out, so that the inside and outside of the ceramic housing package are communicated, and the material of the grouting is mostly silver copper paste. The resistance of the ceramic housing package obtained by the above method is still relatively large. In addition, the material of the lead wire used in the ceramic housing package is basically iron-nickel alloy, and the resistance of the lead wire is large. If the resistance is large, the current passing through the chip is small during use, and a compensation circuit needs to be designed in the chip, which increases the difficulty of chip design and increases the size of the chip. For example, the ceramic housing package of CBIP type. SUMMARY

[0003] The technical problem to be solved by the present application is to provide a manufacturing method of a ceramic housing package and the ceramic housing package, which reduces the resistance of the ceramic housing package.

[0004] In a first aspect, the present application provides a manufacturing method of a ceramic housing package, the ceramic housing package comprising a plurality of heat sinks and a plurality of back plates, the heat sinks being connected to corresponding back plates, and comprising at least two layers of bottom flow sheets, at least two layers of middle flow sheets, an upper flow sheet and a sealing ring flow sheet, and the manufacturing method comprises the following steps:

[0005] Step 1: forming a through hole in each layer of middle flow sheet, then printing a corresponding conductor layer on each layer of middle flow sheet, and then performing a punching and grouting operation on each layer of middle flow sheet;

[0006] Step 2: printing a corresponding conductor layer on each layer of bottom flow sheet; and performing a punching and grouting film operation, the heat sink of the ceramic housing package being connected to the back plate through the conductor layer, each layer of the conductor layer comprising at least one conductor line, and the conductor line being used to connect the heat sink and the back plate of the ceramic housing package;

[0007] Step 3: performing an isostatic layer pressing operation on all the bottom flow sheets, performing an isostatic layer pressing operation on all the middle flow sheets and the upper flow sheet, and then performing an isostatic layer pressing operation on the isostatic layer pressed bottom flow sheet, the isostatic layer pressed middle flow sheet and the upper flow sheet and the sealing ring flow sheet to obtain a semi-finished product;

[0008] Step 4: sintering the semi-finished product to obtain a ceramic housing package.

[0009] Furthermore, the printing paste includes the following components:

[0010] Tungsten powder 50-60 parts by mass;

[0011] Copper powder 7-10 parts by mass;

[0012] Terpineol 14.3-16 parts by mass;

[0013] Diethylene glycol butyl ether 13.02-15.7 parts by mass.

[0014] Furthermore, the particle size of the tungsten powder is in the range of 3 to 4.5 microns, and the particle size of the copper powder is in the range of 20 to 50 nanometers.

[0015] Furthermore, the thickness of the conductor layer is less than 20 microns.

[0016] In a second aspect, the present invention provides a ceramic shell package, which is obtained by the manufacturing method of the ceramic shell package in the first aspect.

[0017] The present invention has the following advantages: a method for manufacturing a ceramic shell package and a ceramic shell package, according to the present invention, a conductor layer is provided between the middle layer and the bottom layer, and a conductive circuit can be formed after sintering. The parallel connection between the multiple layers and the external and internal leads are connected, so that the on-resistance of the ceramic shell package is reduced, and by designing a new printing paste, the resistance of the ceramic shell package of the same size is reduced to two-thirds of the original, which makes it unnecessary to design a supplementary circuit for the chip, and the chip volume can be designed to be smaller, and the ceramic shell package can also be reduced in size accordingly, which greatly facilitates the development of the industry and does not lead to a substantial increase in cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0019] Figure 1 The present invention is a flowchart of the method. DETAILED DESCRIPTION

[0020] like Figure 1 As shown, the present invention provides a method for manufacturing a ceramic shell package, wherein the ceramic shell package includes multiple heat sinks and multiple back plates, wherein the heat sinks are connected to corresponding back plates, and includes at least two layers of bottom cast sheets, at least two layers of middle cast sheets, an upper cast sheet, and a sealing ring cast sheet, specifically comprising the following steps:

[0021] Step 1, forming a through hole in each layer of the middle layer of the cast sheet, then printing a corresponding conductor layer on each layer of the middle layer of the cast sheet, and then punching and slurry hanging operation is performed on each layer of the middle layer of the cast sheet; wherein printing is performed by printing, and a corresponding printing screen can be set to print the required conductor layer on the cast sheet; the slurry hanging operation is that after punching, the slurry passes through the through hole, and the slurry will stick to the side wall of the through hole, so that the circuit is conductive;

[0022] Step 2, printing a corresponding conductor layer on each layer of the bottom layer of the cast sheet; and performing a punching and slurry injection film operation, the thickness of the conductor layer is less than or equal to 20 microns, by controlling the thickness of the conductor layer, the stability of the product after isostatic pressing is ensured, and the risk of cracking during sintering is eliminated; wherein printing is performed by printing, and a corresponding printing screen can be set to print the required conductor layer on the cast sheet; the slurry injection film operation is to fill the slurry into the punched through hole, so that the circuit is conductive; the heat sink of the ceramic housing package is connected to the back plate through the conductor layer, and at least one conductor line is included in each layer of the conductor layer, which is used to connect the heat sink and the back plate of the ceramic housing package;

[0023] Step 3, performing isostatic pressing operation on all bottom layer cast sheets, performing isostatic pressing operation on all middle layer cast sheets and upper layer cast sheets, and then performing isostatic pressing operation on the isostatic pressed bottom layer cast sheets, isostatic pressed middle layer cast sheets, upper layer cast sheets and sealing ring cast sheets to obtain a semi-finished product;

[0024] Step 4, sintering the semi-finished product to obtain a ceramic housing package.

[0025] Through the multi-layer bottom layer cast sheet and the multi-layer middle layer cast sheet, a plurality of conductor layers are arranged therein, and each layer of the conductor layer is connected to the same heat sink and back plate in parallel, which further reduces the resistance of the internal to external conduction of the ceramic housing package; that is, each layer of the conductor layer is provided with a set of conductor lines, and the set of conductor lines of the upper and lower layers are connected in parallel through the through hole; the conductor lines in each layer of the conductive layer are connected to the internal heat sink, that is, the electrode plate connected to the chip inside the ceramic housing package; this makes the electrodes on the outside of the ceramic housing package connected to the internal heat sink in a parallel manner through multiple conductor lines, which further reduces the overall conduction resistance.

[0026] In the manufacture of CBIP type ceramic housing package, the bottom layer can be divided into 4 layers of bottom layer cast sheet, and the middle layer can be divided into 8 layers of middle layer cast sheet, and a corresponding conductor layer is printed on the bottom layer cast sheet and the middle layer cast sheet; after the above manufacturing method, the resistance of the finished product can be greatly reduced, the current passing through can be increased under the same voltage, and the yield can be ensured to be high.

[0027] The printed slurry comprises the following components:

[0028] Tungsten powder 50-60 parts by mass;

[0029] Copper powder 7-10 parts by mass;

[0030] Terpineol 14.3-16 parts by mass;

[0031] Diethylene glycol butyl ether 13.02-15.7 parts by mass;

[0032] The particle size of the tungsten powder ranges from 3 to 4.5 microns, and the particle size of the copper powder ranges from 20 to 50 nanometers.

[0033] The greater the mass fraction of copper powder, the lower the resistance will be, but in the existing sintering process, the copper powder cannot be increased unlimitedly, otherwise, the cast sheet will not be able to be sintered with the circuit; during the sintering process, the terpineol and diethylene glycol butyl ether will volatilize.

[0034] Example 1

[0035] Take 50 kg of tungsten powder, 7 kg of copper powder, 14.3 kg of terpineol and 13.2 kg of diethylene glycol butyl ether, wherein the copper powder and the tungsten powder need to be filtered through a 1000 mesh screen to remove impurities;

[0036] Mix the tungsten powder, copper powder, terpineol and diethylene glycol butyl ether and stir them, which can be done using a stirring barrel at a stirring speed of 25 to 35 r / min; the stirring time is 4 hours;

[0037] Put the slurry after stirring into a rolling barrel and roll it; the rolling speed is 50 to 100 r / min; the temperature is 25 to 35°C; at this time, part of the copper powder can be attached to the surface of the tungsten powder, and the manufacturing of the slurry is completed, after which it can be printed; during the sintering process, the sintering temperature is reduced, and the copper powder of the sintered circuit is combined with the tungsten powder, so that the resistance can be effectively reduced, improving the competitiveness of the enterprise.

[0038] Example 2

[0039] Take 55 kg of tungsten powder, 8.5 kg of copper powder, 15.15 kg of terpineol and 14.36 kg of diethylene glycol butyl ether, wherein the copper powder and the tungsten powder need to be filtered through a 1000 mesh screen to remove impurities;

[0040] Mix the tungsten powder, copper powder, terpineol and diethylene glycol butyl ether and stir them, which can be done using a stirring barrel at a stirring speed of 25 to 35 r / min; the stirring time is 4 hours;

[0041] The completed slurry after stirring is put into a rolling barrel for rolling, the rolling speed is 50-100r / min, the temperature is 25-35 DEG C, at this time, part of the copper powder can be attached to the surface of the tungsten powder, and the manufacturing of the slurry is completed, then printing is carried out; in the sintering process, the sintering temperature is reduced, and the resistance of the sintered circuit copper powder and tungsten powder is effectively reduced, and the competitiveness of the enterprise is improved.

[0042] Example 3

[0043] The tungsten powder 60kg, copper powder 10kg, terpineol 16kg and diethylene glycol butyl ether 15.7kg are weighed, wherein the copper powder and the tungsten powder need to be filtered through a 1000 mesh screen to remove impurities;

[0044] The tungsten powder, copper powder, terpineol and diethylene glycol butyl ether are mixed and stirred, a stirring barrel can be used for stirring, the stirring speed is 25-35r / min, and the stirring time is 4 hours;

[0045] The completed slurry after stirring is put into a rolling barrel for rolling, the rolling speed is 50-100r / min, the temperature is 25-35 DEG C, at this time, part of the copper powder can be attached to the surface of the tungsten powder, and the manufacturing of the slurry is completed, then printing is carried out; in the sintering process, the sintering temperature is reduced, and the resistance of the sintered circuit copper powder and tungsten powder is effectively reduced, and the competitiveness of the enterprise is improved.

[0046] The ceramic housing package is obtained by the manufacturing method of the ceramic housing package.

[0047] Although the specific embodiments of the present application are described above, those skilled in the art should understand that the specific embodiments described are only illustrative, and are not intended to limit the scope of the present application, and equivalent modifications and changes made by those skilled in the art in accordance with the spirit of the present application should be covered within the scope of the claims of the present application.

Claims

1. A method for manufacturing a ceramic shell package, wherein the ceramic shell package comprises a plurality of heat sinks and a plurality of back plates, wherein the heat sinks are connected to corresponding back plates, characterized in that: The method comprises at least two layers of bottom cast sheets, at least two layers of middle cast sheets, an upper cast sheet and a sealing ring cast sheet, and specifically comprises the following steps: Step 1: Form through holes on each middle layer of cast sheet, then print the corresponding conductor layer on each middle layer of cast sheet, and then perform punching and slurry hanging operations on each middle layer of cast sheet; Step 2: Print a corresponding wire layer on each bottom cast sheet; and perform a punching and grouting operation, wherein the heat sink of the ceramic shell package is connected to the back plate through the wire layer, and each wire layer includes at least one wire line, and the wire line is used to connect the heat sink of the ceramic shell package and the back plate; Step 3, performing an isostatic lamination operation on all bottom cast sheets, performing an isostatic lamination operation on all middle cast sheets and upper cast sheets, and then performing an isostatic lamination operation on the isostatically laminated bottom cast sheet, the isostatically laminated middle cast sheet and the upper cast sheet, and the sealing ring cast sheet to obtain a semi-finished product; Step 4: sintering the semi-finished product to obtain a ceramic shell package; The printing paste comprises the following components: Tungsten powder 50-60 parts by mass; Copper powder 7-10 parts by mass; Terpineol 14.3-16 parts by mass; Diethylene glycol butyl ether 13.02-15.7 parts by mass.

2. The method for manufacturing a ceramic shell package according to claim 1, wherein: The particle size of the tungsten powder is in the range of 3 to 4.5 microns, and the particle size of the copper powder is in the range of 20 to 50 nanometers.

3. The method for manufacturing a ceramic shell package according to claim 1, wherein: The thickness of the conductor layer is less than 20 microns.

4. A ceramic shell package, characterized in that: The ceramic shell package is obtained by the manufacturing method of the ceramic shell package according to any one of claims 1 to 3.

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