LED lamp bead packaging module and display screen control system

Abstract

This invention discloses an LED chip packaging module and a display screen control system. The LED chip packaging module includes a packaging substrate, a driver chip packaged on the packaging substrate, and multiple LED chip groups. The driver chip integrates a control module, a communication module, a storage module, a current configuration module, and three constant current drive modules. The control module is connected to the three constant current drive modules through the current configuration module. The LED chip groups are arranged in an array on the same side of the packaging substrate. The red, green, and blue LED chips in each LED chip group are connected to the three constant current drive modules respectively. This invention enables good light emission uniformity and color accuracy of each LED chip group, thereby improving the display effect of the display screen.

Description

Technical Field

[0001] This invention relates to the field of LED displays, and in particular to an LED lamp bead packaging module and a display control system. Background Technology

[0002] Currently, most LED display devices use dynamic driving because it is relatively inexpensive and easy to implement technically.

[0003] With technological advancements, the number of LED chips per unit area in LED displays is increasing, leading to higher resolutions. However, if a dynamic driving method is used, this requires a larger number of LED chips, increasing the number of traces on the PCB. Since PCB space is limited, more LED chips make wiring more difficult, making it hard to ensure the PCB meets the electrical performance requirements of the LEDs. This results in issues like uneven grayscale, grayscale color shift, high / low grayscale contrast coupling, and cross-board color differences. Furthermore, dynamic driving methods directly interconnect the anodes (anodes of the LED chips) of LEDs in the same row and the cathodes (cathodes of the LED chips) of LEDs in the same column. This structure causes various abnormal phenomena such as uneven row brightness, uneven column brightness, constantly lit columns, and inconsistent column colors.

[0004] Therefore, it is necessary to develop an LED bead packaging module with good display effect and a display control system that uses the LED bead packaging module. Summary of the Invention

[0005] The purpose of this invention is to provide an LED chip packaging module with good display effect and a display screen control system using the LED chip packaging module.

[0006] To achieve the above objectives, the solution of the present invention is:

[0007] An LED chip packaging module includes a packaging substrate and LED chip groups and a driver chip packaged on the packaging substrate. The driver chip integrates a control module, a communication module, a storage module, a current configuration module, and three constant current driving modules. The control module is connected to the communication module and the storage module respectively, and the control module is connected to the three constant current driving modules respectively through the current configuration module. There are multiple LED chip groups arranged in an array on the same side of the packaging substrate. Each LED chip group includes red LED chips, green LED chips, and blue LED chips. The red LED chips, green LED chips, and blue LED chips of each LED chip group are respectively connected to the output terminals of the three constant current driving modules of the driver chip. Furthermore, the red LED chips of each LED chip group are respectively connected to different output terminals of the same constant current driving module, the green LED chips of each LED chip group are respectively connected to different output terminals of the same constant current driving module, and the blue LED chips of each LED chip group are respectively connected to different output terminals of the same constant current driving module.

[0008] The driver chip also integrates three chip identification modules, each corresponding to one of the three constant current driving modules. The input and ground terminals of each chip identification module are connected to the power and ground terminals of the corresponding constant current driving module, respectively. The output terminals of the three chip identification modules are connected to the control module. The anodes of the red, green, and blue LEDs in each LED chip group are connected to the output terminals of the three constant current driving modules, and the cathodes of the red, green, and blue LEDs in each LED chip group are grounded. Furthermore, the anodes of the red LEDs in each LED chip group are connected to different output terminals of the same constant current driving module, the anodes of the green LEDs in each LED chip group are connected to different output terminals of the same constant current driving module, and the anodes of the blue LEDs in each LED chip group are connected to different output terminals of the same constant current driving module.

[0009] The chip identification module includes a voltage sampling circuit, a subtractor circuit, and a threshold signal generation circuit. The input terminal and ground terminal of the voltage sampling circuit are respectively connected to the input terminal and ground terminal of the chip identification module. The output terminal of the voltage sampling circuit is connected to the first input terminal of the subtractor circuit. The output terminal of the threshold signal generation circuit is connected to the second input terminal of the subtractor circuit. The output terminal of the subtractor circuit is connected to the output terminal of the chip identification module.

[0010] The driver chip also integrates three voltage regulation modules connected to the control module. The output terminals of the three voltage regulation modules are respectively connected to the power supply terminals of the three constant current drive modules.

[0011] The voltage regulation module includes a PWM power drive circuit and a voltage regulator circuit connected to the output terminal of the PWM power drive circuit; the PWM power drive circuit of each voltage regulation module is connected to the control module, and the output terminal of the voltage regulator circuit of each voltage regulation module is connected to the output terminal of the voltage regulation module.

[0012] The PWM power drive circuit of each voltage regulation module is also connected to the control module via a current-limiting comparator.

[0013] The driver chip also integrates a temperature detection module that is connected to the control module.

[0014] The LED bead packaging module further includes a packaging layer covering each LED chip group; the packaging substrate is one of a glass substrate, PCB board, ceramic substrate or FPC board.

[0015] A display screen control system includes a sending card and multiple splicing cabinets. Each cabinet has a receiving card and multiple display modules connected to the receiving card. Each display module includes a display circuit board and multiple LED lamp bead packaging modules as described above. The LED lamp bead packaging modules are arranged in an array on the same side of the display circuit board. The driver chip of the LED lamp bead packaging module of each display module in each cabinet is connected to the receiving card of the cabinet.

[0016] The driver chip of the LED chip package module has an SDIOA pin for receiving serial data signals, an SDIOB pin for outputting serial data signals, and a CLK pin for receiving clock signals. The LED chip packages of the display module are cascaded, with the SDIOB pin of the first LED chip package module connected to the SDIOA pin of the second LED chip package module, the SDIOB pin of the second LED chip package module connected to the SDIOA pin of the third LED chip package module, and so on, with the SDIOB pin of the second-to-last LED chip package module connected to the SDIOA pin of the last LED chip package module. The receiving card of the enclosure is connected to the SDIOA pin of the first LED chip package module of each display module in the enclosure, and the receiving card is also connected to the CLK pin of each LED chip package module of each display module in the enclosure.

[0017] After adopting the above solution, the present invention has the following characteristics:

[0018] 1. The storage module of the driver chip in the LED bead packaging module of the present invention stores three current setting values ​​for setting the output current of the constant current driving module. These three current setting values ​​correspond to the red LED current setting value for the red LED chip, the green LED current setting value for the green LED chip, and the blue LED current setting value for the blue LED chip. The control module of the driver chip can read the three current setting values ​​stored in the storage module, and the control module controls the current configuration module according to the red, green, and blue LED current setting values, thereby controlling the output current of the three constant current driving modules of the driver chip, so that... The constant current drive module connected to the red LED chip of each LED chip group outputs the operating current required by the red LED chip, so that the constant current drive module connected to the green LED chip of each LED chip group outputs the operating current required by the green LED chip, and so that the constant current drive module connected to the blue LED chip of each LED chip group outputs the operating current required by the blue LED chip. In this way, the light emission consistency of each LED chip group in the LED chip package module is good, and the light emission colors of the red, green and blue LED chips in the LED chip group are accurate, resulting in a good display effect of the LED chip package module, and thus a better display effect of the display screen.

[0019] 2. The control module of the LED bead packaging module of the present invention can detect the type of LED chip connected to the three constant current drive modules through three chip identification modules. This can reduce the limitation on the connection method between each LED chip group and the driver chip, making the wiring of the LED bead packaging module more flexible, and making the LED bead packaging module A more flexible and convenient to use.

[0020] 3. The control module of the LED lamp bead packaging module of the present invention can adjust the power supply voltage of the three constant current drive modules through three voltage adjustment modules, so that the voltage drop of the three constant current drive modules will not be too high, thereby reducing the power consumption and heat generation of the drive chip. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the LED lamp bead packaging module of the present invention;

[0022] Figure 2 This is a schematic block diagram of the driver chip for the LED bead packaging module of the present invention;

[0023] Figure 3 This invention relates to a partial principle of the driver chip for the LED bead packaging module. Figure 1 ;

[0024] Figure 4This invention relates to a partial principle of the driver chip for the LED bead packaging module. Figure 2 ;

[0025] Figure 5 This is a schematic diagram of the display screen control system of the present invention;

[0026] Figure 6 This is a schematic diagram of the display module of the present invention;

[0027] Figure 7 This is a schematic diagram of the circuit connection between the receiver card and the display module of the present invention;

[0028] Label Explanation:

[0029] LED chip packaging module A, packaging substrate 1, LED chip group 2, red LED chip 21, green LED chip 22, blue LED chip 23, driver chip 3, control module 31, communication module 32, storage module 33, current configuration module 34, constant current drive module 35, chip identification module 36, voltage sampling circuit 361, first sampling resistor 3611, second sampling resistor 3612, subtractor circuit 362, threshold signal generation circuit 363, voltage regulation module 37, PWM power drive circuit 371, first power MOSFET 3711, second power MOSFET 3712, power resistor 3713, voltage regulator circuit 372, voltage regulator inductor 3721, voltage regulator capacitor 3722, Zener diode 3723, current limiting comparator 38, temperature detection module 39.

[0030] Box B, Receiver Card B1, Display Module B2, Display Circuit Board B21

[0031] Send card C. Detailed Implementation

[0032] To further explain the technical solution of the present invention, the present invention will be described in detail below through specific embodiments.

[0033] like Figures 1 to 4As shown, this invention discloses an LED chip packaging module A, which includes a packaging substrate 1, LED chip groups 2 packaged on the packaging substrate 1, and a driver chip 3. The driver chip 3 integrates a control module 31, a communication module 32, a storage module 33, a current configuration module 34, and three constant current drive modules 35. The control module 31 is connected to the communication module 32 and the storage module 33, respectively, and is connected to the three constant current drive modules 35 through the current configuration module 34. The LED chip groups 2 are multiple and arranged in an array on the same side of the packaging substrate 1. Each LED chip group 2 includes... The LED chip group 2 consists of a red LED chip 21, a green LED chip 22, and a blue LED chip 23. Each of these LED chip groups 2 is connected to the output terminals of three constant current driving modules 35 of the driver chip 3. Furthermore, the red LED chips 21 of each LED chip group 2 are connected to different output terminals of the same constant current driving module 35, the green LED chips 22 of each LED chip group 2 are connected to different output terminals of the same constant current driving module 35, and the blue LED chips 23 of each LED chip group 2 are connected to different output terminals of the same constant current driving module 35. Figure 1 As shown, the LED chip group 2 of the LED lamp bead packaging module A can be four, and the four LED chip groups 2 are distributed in a 2*2 array.

[0034] In this invention, the storage module 33 of the driver chip 3 stores three current setting values ​​for setting the output current of the constant current driving module 35. These three current setting values ​​correspond to the red LED current setting value for the red LED chip 21, the green LED current setting value for the green LED chip 22, and the blue LED current setting value for the blue LED chip 23. The control module 31 of the driver chip 3 reads the three current setting values ​​stored in the storage module 33 and controls the current configuration module 34 according to the red, green, and blue LED current setting values, thereby controlling the output current of the three constant current driving modules 35 of the driver chip 3, so that the current is consistent with the output current of each LED chip group. The constant current drive module 35 connected to the red LED chip 21 of LED chip 2 outputs the operating current required by the red LED chip 21, so that the constant current drive module 35 connected to the green LED chip 22 of each LED chip group 2 outputs the operating current required by the green LED chip 22, so that the constant current drive module 35 connected to the blue LED chip 23 of each LED chip group 2 outputs the operating current required by the blue LED chip 23. In this way, the light emission consistency of each LED chip group 2 in LED chip package module A is good, and the light emission colors of the red LED chip 21, green LED chip 22 and blue LED chip 23 of LED chip group 2 are accurate. Therefore, LED chip package module A has a good display effect and also has the effects of energy saving and heat reduction.

[0035] In this invention, the driver chip 3 of the LED bead packaging module A also integrates three chip identification modules 36. Each chip identification module 36 corresponds to one of three constant current driving modules 35. The input and ground terminals of each chip identification module 36 are connected to the power supply and ground terminals of the corresponding constant current driving module 35, respectively. The output terminals of the three chip identification modules 36 are connected to the control module 31. The LED chip group 2 adopts a common cathode structure, wherein the anodes of the red LED chip 21, green LED chip 22, and blue LED chip 23 in each LED chip group 2 are respectively connected to the power supply and ground terminals of the driver chip 3. The output terminals of the three constant current driving modules 35 are connected, and the cathodes of the red LED chip 21, green LED chip 22 and blue LED chip 23 of each LED chip group 2 are connected to the GND pin of the driving chip 3 and grounded; and the anodes of the red LED chip 21 of each LED chip group 2 are respectively connected to different output terminals of the same constant current driving module 35, the anodes of the green LED chip 22 of each LED chip group 2 are respectively connected to different output terminals of the same constant current driving module 35, and the anodes of the blue LED chip 23 of each LED chip group 2 are respectively connected to different output terminals of the same constant current driving module 35. The control module 31 of the LED chip packaging module A uses three chip identification modules 36 to detect the type of LED chips connected to the three constant current drive modules 35, specifically detecting which of the red LED chip 21, green LED chip 22, and blue LED chip 23 is connected to the output terminal of the constant current drive module 35. The control module 31 adjusts the output current of the three constant current drive modules 35 based on the detection results and the three current setting values ​​stored in the storage module 33. Thus, when LED chip groups 2 with different structures are installed on the LED chip packaging module A, it is only necessary to control the connection relationship between each LED chip group 2 and the driver chip 3 to satisfy: "The red LED chip 21, green LED chip 22, and blue LED chip 23 of each LED chip group 2 are respectively connected to the three constant current drive modules 35..." The output terminals of the constant current driving module 35 are connected, and the red LED chips 21 of each LED chip group 2 are respectively connected to different output terminals of the same constant current driving module 35, the green LED chips 22 of each LED chip group 2 are respectively connected to different output terminals of the same constant current driving module 35, and the blue LED chips 23 of each LED chip group 2 are respectively connected to different output terminals of the same constant current driving module 35. This eliminates the requirement that the red LED chips 21, green LED chips 22, and blue LED chips 23 of each LED chip group 2 be precisely connected to a specific constant current driving module 35, making the wiring of the LED lamp bead packaging module A more flexible. Moreover, the driver chip 3 can automatically match the LED chip groups 2 with different structural settings, making the LED lamp bead packaging module A more flexible and convenient to use.

[0036] In this invention, the chip identification module 36 of the driver chip 3 of the LED lamp bead packaging module A specifically includes a voltage sampling circuit 361, a subtractor circuit 362, and a threshold signal generation circuit 363; the input terminal and ground terminal of the voltage sampling circuit 361 are respectively connected to the input terminal and ground terminal of the chip identification module 36, the output terminal of the voltage sampling circuit 361 is connected to the first input terminal of the subtractor circuit 362, the output terminal of the threshold signal generation circuit 363 is connected to the second input terminal of the subtractor circuit 362, and the output terminal of the subtractor circuit 362 is connected to the output terminal of the chip identification module 36; wherein, the voltage sampling circuit 361 may include a first sampling resistor 3611 and a second sampling resistor 3612. The working principle of the chip identification module 36 is as follows: When the LED bead packaging module A is used for the first time, the same voltage is applied to the power supply terminals of the three constant current driving modules 35, so that the output current of the three constant current driving modules is the same. Since the on-state voltage drop of the red LED chip 21, green LED chip 22 and blue LED chip 23 of the LED chip group 2 is different, the voltage drop of the three constant current driving modules 35 will be different. The voltage sampling circuit 361 of each chip identification module 36 collects the voltage drop of the constant current driving module 35 corresponding to that chip identification module 36, and performs a subtraction operation on the collected voltage drop of the constant current driving module 35 and the voltage output by the threshold signal generation circuit 363 through the subtractor circuit 362. Finally, the operation result is output to the control module 31. Because the voltage drop of the three constant current driving modules 35 is different, the operation result of the three chip identification modules 36 will also be different. The control module 31 compares the operation results of the three chip identification modules 36 to determine the type of LED chip connected to the output terminal of the three constant current driving modules 35. The subtractor circuit 362 is designed to prevent excessive voltage input to the control module 31 from damaging the control module 31.

[0037] In this invention, the driver chip 3 of the LED lamp bead packaging module A also integrates three voltage regulation modules 37 connected to the control module 31. The output terminals of the three voltage regulation modules 37 are respectively connected to the power supply terminals of the three constant current drive modules 35. The three voltage regulation modules 37 are used to control the power supply terminal voltage of the three constant current drive modules 35. When the LED chip packaging module A is used for the first time, the control module 31 first controls the power supply voltage of the three constant current driving modules 35 of the driver chip 3 to be the same through the three voltage adjustment modules 37 of the driver chip 3. Then, the control module 31 detects the type of LED chip connected to the three constant current driving modules 35 through the three chip identification modules 36. Next, the control module 31 adjusts the output current of the three constant current driving modules 35 according to the detection results and the three current setting values ​​stored in the storage module 33 to ensure the light emission consistency and color accuracy of each LED chip group 2 in the LED chip packaging module A. At the same time, the control module 31 also controls the three voltage adjustment modules 37 according to the detection results to adjust the power supply voltage of the three constant current driving modules 35, so that the voltage drop of the three constant current driving modules 35 is not too high, thereby reducing the power consumption and heat generation of the driver chip 3.

[0038] In this invention, the voltage regulation module 37 of the driving chip 3 of the LED lamp bead packaging module A includes a PWM power driving circuit 371 and a voltage regulator circuit 372 connected to the output terminal of the PWM power driving circuit 371. The PWM power driving circuit 371 may include a first power MOSFET 3711, a second power MOSFET 3712 and a power resistor 3713. The voltage regulator circuit 372 may include a voltage regulator inductor 3721, a voltage regulator capacitor 3722 and a voltage regulator diode 3723. The PWM power driving circuit 371 of each voltage regulation module 37 is connected to the control module 31. The control module 31 controls the switching on and off of the first power MOSFET 3711 and the second power MOSFET 3712. The output terminal of the voltage regulator circuit 372 of each voltage regulation module 37 is connected to the output terminal of the voltage regulation module 37. The voltage regulator circuit 372 converts the pulse signal output by the PWM power drive circuit 371 into a DC signal to supply power to the power supply terminal of the constant current drive module 35. The control module 31 controls the frequency and duty cycle of the pulse signal output by the PWM power drive circuit 371 by controlling the switching frequency and switching time of the PWM power drive circuit 371, thereby adjusting the voltage supplied to the power supply terminal of the constant current drive module 35 and controlling the voltage of the power supply terminal of the constant current drive module 35.

[0039] In this invention, the PWM power drive circuit 371 of each voltage regulation module 37 of the driver chip 3 of the LED lamp bead packaging module A is also connected to the control module 31 through a current limiting comparator 38. The current limiting comparator 38 is used to detect whether the operating current of the PWM power drive circuit 371 exceeds a set threshold and feeds back the corresponding detection result to the control module 31. The control module 31 controls the PWM power drive circuit 371 according to the detection result, thereby preventing the PWM power drive circuit 371 from being damaged due to excessive operating current.

[0040] In this invention, the driver chip 3 of the LED lamp bead packaging module A also integrates a temperature detection module 39 connected to the control module 31. The control module 31 detects the temperature of the driver chip 3 itself through the temperature detection module 39. When the temperature of the driver chip 3 is too high, the control module 31 controls the output voltage of each voltage regulation module 37 to reduce the temperature of the driver chip 3 and reduce the risk of overheating and damage to the driver chip 3.

[0041] In this invention, the driver chip 3 of the LED bead packaging module A can lead out a VCC pin, a GND pin, an SDIOA pin, an SDIOB pin, a CLK pin, multiple OUT1 pins, multiple OUT2 pins, and multiple OUT3 pins. The VCC pin is used to connect to the power supply to power the internal module of the driver chip 3, the GND pin is used for grounding, the SDIOA pin is used to connect to the serial data signal, the SDIOB pin is used to output the serial data signal, and the CLK pin is used to connect to the clock signal. The communication module 32 is connected to the SDIOA pin, the SDIOB pin, and the CLK pin. Each OUT1 pin is used to output the current of the first constant current driving module 35 among the three constant current driving modules 35, each OUT2 pin is used to output the current of the second constant current driving module 35 among the three constant current driving modules 35, and each OUT3 pin is used to output the current of the third constant current driving module 35 among the three constant current driving modules 35.

[0042] In this invention, the LED bead packaging module A may further include a packaging layer (not shown) covering each LED chip group 2. The packaging layer can prevent the LED chip group 2 from shifting and protect the LED chip group 2. The packaging layer adopts a light-transmitting structure and may specifically adopt light guide adhesive. The packaging substrate 1 of the LED bead packaging module A may be one of a glass substrate, PCB board, ceramic substrate or FPC board.

[0043] Cooperate Figures 5 to 7As shown, the present invention also discloses a display screen control system, which includes a sending card C and multiple spliced ​​cabinets B. Each cabinet B has a receiving card B1 and multiple display modules B2 connected to the receiving card B1. Each display module B2 includes a display circuit board B21 and multiple LED lamp bead packaging modules A as described above. The LED lamp bead packaging modules A are arranged in an array on the same side of the display circuit board B21. The driving chip 3 of the LED lamp bead packaging module A of each display module B2 in each cabinet B is connected to the receiving card B1 of the cabinet B. Specifically, the LED chip packaging modules A of the display module B2 are cascaded. The SDIOB pin of the first LED chip packaging module A is connected to the SDIOA pin of the second LED chip packaging module A, the SDIOB pin of the second LED chip packaging module A is connected to the SDIOA pin of the third LED chip packaging module A, and so on, with the SDIOB pin of the second-to-last LED chip packaging module A connected to the SDIOA pin of the last LED chip packaging module A. The receiving card B1 of the enclosure B is connected to the SDIOA pin of the first LED chip packaging module A of each display module B2 of the enclosure B, and the receiving card B1 of the enclosure B is also connected to the CLK pin of each LED chip packaging module A of each display module B2 of the enclosure B.

[0044] In this invention, the sending card C is used to send instructions to the receiving card B1 of each cabinet B. The receiving card B1 of each cabinet B controls the LED lamp bead packaging module A of each display module B2 of that cabinet according to the received instructions. The receiving card B1 can read the three current setting values ​​stored in the storage module 33 of each LED bead packaging module A. When a certain LED bead packaging module A is replaced after the display is manufactured, the receiving card B1 can read the three current setting values ​​stored in the storage module 33 of the LED bead packaging module A that has not been replaced. Then, the receiving card B1 writes these three current setting values ​​into the storage module 33 of the replaced LED bead packaging module A, realizing the automatic setting of the three current setting values ​​stored in the storage module 33 of the replaced LED bead packaging module A, which is convenient for replacing LED bead packaging module A. In addition, after the display is manufactured, the user can send a command to the receiving card B1 through the sending card C, so that the receiving card B1 writes the required three current setting values ​​into the storage module 33 of the LED bead packaging module A, thereby allowing the user to flexibly configure the lighting effect of the LED bead packaging module A.

[0045] The above embodiments and figures are not intended to limit the product form and style of the present invention. Any appropriate changes or modifications made by those skilled in the art should be considered as not departing from the patent scope of the present invention.

Claims

1. An LED bead packaging module, characterized in that: This includes a packaging substrate and LED chip assemblies and driver chips packaged on the packaging substrate. The driver chip integrates a control module, a communication module, a storage module, a current configuration module, and three constant current drive modules. The control module is connected to the communication module and the storage module respectively, and the control module is connected to the three constant current drive modules respectively through the current configuration module. The number of LED chip groups is multiple and each LED chip group is arranged in an array on the same side of the packaging substrate. Each LED chip group includes a red LED chip, a green LED chip and a blue LED chip. The red, green, and blue LEDs of each LED chip group are connected to the output terminals of the three constant current driving modules of the driver chip, respectively. Furthermore, the red LEDs of each LED chip group are connected to different output terminals of the same constant current driving module, the green LEDs of each LED chip group are connected to different output terminals of the same constant current driving module, and the blue LEDs of each LED chip group are connected to different output terminals of the same constant current driving module. The driver chip also integrates three chip identification modules, each corresponding to one of the three constant current driving modules. The input and ground terminals of each chip identification module are connected to the power and ground terminals of the corresponding constant current driving module, respectively. The output terminals of the three chip identification modules are connected to the control module. The anodes of the red, green, and blue LEDs in each LED chip group are connected to the output terminals of the three constant current driving modules, and the cathodes of the red, green, and blue LEDs in each LED chip group are grounded. Furthermore, the anodes of the red LEDs in each LED chip group are connected to different output terminals of the same constant current driving module, the anodes of the green LEDs in each LED chip group are connected to different output terminals of the same constant current driving module, and the anodes of the blue LEDs in each LED chip group are connected to different output terminals of the same constant current driving module. The chip identification module includes a voltage sampling circuit, a subtractor circuit, and a threshold signal generation circuit. The input terminal and ground terminal of the voltage sampling circuit are respectively connected to the input terminal and ground terminal of the chip identification module. The output terminal of the voltage sampling circuit is connected to the first input terminal of the subtractor circuit. The output terminal of the threshold signal generation circuit is connected to the second input terminal of the subtractor circuit. The output terminal of the subtractor circuit is connected to the output terminal of the chip identification module.

2. The LED lamp bead packaging module as described in claim 1, characterized in that: The driver chip also integrates three voltage regulation modules connected to the control module. The output terminals of the three voltage regulation modules are respectively connected to the power supply terminals of the three constant current drive modules.

3. The LED lamp bead packaging module as described in claim 2, characterized in that: The voltage regulation module includes a PWM power drive circuit and a voltage regulator circuit connected to the output terminal of the PWM power drive circuit. The PWM power drive circuit of each voltage regulation module is connected to the control module, and the output terminal of the voltage regulator circuit of each voltage regulation module is connected to the output terminal of the voltage regulation module.

4. The LED lamp bead packaging module as described in claim 3, characterized in that: The PWM power drive circuit of each voltage regulation module is also connected to the control module via a current-limiting comparator.

5. The LED lamp bead packaging module as described in claim 2, characterized in that: The driver chip also integrates a temperature detection module that is connected to the control module.

6. The LED lamp bead packaging module as described in claim 1, characterized in that: It also includes an encapsulation layer covering each LED chip group; the encapsulation substrate is one of a glass substrate, PCB board, ceramic substrate or FPC board.

7. A display screen control system, characterized in that: The device includes a transmitting card and multiple interconnected housings. Each housing has a receiving card and multiple display modules connected to the receiving card. Each display module includes a display circuit board and multiple LED bead packaging modules as described in any one of claims 1 to 6. The LED bead packaging modules are arranged in an array on the same side of the display circuit board. The driver chip of the LED bead packaging module of each display module in each housing is connected to the receiving card of that housing.

8. The display screen control system as described in claim 7, characterized in that: The driver chip of the LED bead packaging module has an SDIOA pin for receiving serial data signals, an SDIOB pin for outputting serial data signals, and a CLK pin for receiving clock signals. The LED chip packaging modules of the display module are cascaded together, wherein the SDIOB pin of the first LED chip packaging module is connected to the SDIOA pin of the second LED chip packaging module, the SDIOB pin of the second LED chip packaging module is connected to the SDIOA pin of the third LED chip packaging module, and so on, with the SDIOB pin of the second-to-last LED chip packaging module connected to the SDIOA pin of the last LED chip packaging module. The receiving card of the enclosure is connected to the SDIOA pin of the first LED bead package module of each display module of the enclosure, and the receiving card of the enclosure is also connected to the CLK pin of each LED bead package module of each display module of the enclosure.

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