Deposition device

Abstract

The deposition apparatus includes: a crucible having a space formed therein; a nozzle plate covering the space and provided with nozzles; a guide member inserted into the crucible and having an internal thread formed on its inner circumferential surface; and an inner plate having an external thread formed on its outer circumferential surface that is threadedly coupled to the guide member, and the inner plate is height-adjusted inside the guide member.

Description

Technical Field

[0001] The present invention relates to a deposition apparatus, and more particularly to a deposition apparatus for depositing a deposition material onto a deposition target. Background Art

[0002] Deposition refers to a method of forming a thin solid film on the surface of an object such as metal or glass using gaseous particles.

[0003] In recent years, with the increasing use of OLED (Organic Light Emitting Diodes) displays in electronic devices such as TVs and mobile phones, research on devices and processes for manufacturing OLED display panels has been very active. In particular, the OLED display panel manufacturing process includes a process of depositing an organic material onto a substrate such as a glass substrate in a vacuum state.

[0004] Specifically, the deposition process includes a process of evaporating an organic material into a gaseous state by heating a crucible containing the organic material and a process of depositing the gaseous organic material onto a substrate via a nozzle.

[0005] At this time, in order to ensure excellent OLED characteristics, it is necessary to uniformly deposit the gaseous organic material onto the substrate.

[0006] Therefore, the deposition apparatus needs to uniformly guide the gaseous organic material passing through the nozzle to each region of the substrate.

[0007] If the gaseous organic material passing through the nozzle cannot be properly guided, a film with a non-uniform surface is formed.

[0008] Korean Patent Publication No. 10-2016-0017671A (published on February 17, 2016) discloses an evaporation source for thin film formation, which can obtain a thin film with a uniform composition ratio by uniformly mixing the components of a deposition material in a vapor state, and includes: a crucible for containing the deposition material; and a plurality of inner plates, which are internally connected to the crucible and are spaced apart in the vertical direction of the crucible, and each is formed with at least one opening. Summary of the Invention

[0009] Problems to be Solved

[0010] An object of the present invention is to provide a deposition apparatus that can improve the film uniformity by easily adjusting the gap between inner plates.

[0011] Another object of the present invention is to relate to a deposition apparatus that can ensure optimal film uniformity by adjusting the gap of the inner plate even when the deposited material changes and can be easily adjusted.

[0012] Technical solution for solving the problem

[0013] The deposition apparatus of this embodiment may include: a crucible having a space formed therein; a nozzle plate covering the space and provided with nozzles; a guide tab inserted into the crucible and having an internal thread formed on its inner peripheral surface; and an inner plate having an external thread formed on its outer peripheral surface that is threadedly engaged with the guide tab, and the inner plate adjusts its height inside the guide tab.

[0014] The inner plate may include: an upper plate spaced apart from the nozzle plate by a first gap; and a lower plate spaced apart from the upper plate by a second gap.

[0015] The through holes of the upper plate and the lower plate may not be aligned in the vertical direction.

[0016] The crucible may include: a lower crucible; and an upper crucible formed on the upper part of the lower crucible, and the inner diameter of the upper crucible is larger than that of the lower crucible.

[0017] The upper crucible may surround the outer peripheral surface of the guide tab.

[0018] The outer diameter of the guide tab may be larger than the inner diameter of the lower crucible.

[0019] A nozzle plate receiving portion for inserting and receiving the nozzle plate may be formed on the upper part of the crucible.

[0020] The nozzle plate receiving portion may include: a placement portion for placing the nozzle plate; and a cover portion formed larger than the nozzle plate and surrounding the outer peripheral surface of the nozzle plate.

[0021] The nozzle plate may be received inside the cover portion.

[0022] The inner peripheral surface of the cover portion may extend upward from the top surface of the placement portion.

[0023] The gap between the inner peripheral surface of the cover portion and the outer peripheral surface of the nozzle plate may be open upward.

[0024] An upper internal thread may be formed on the inner peripheral surface of the cover portion, and an upper external thread for threadedly fastening with the upper internal thread may be formed on the outer peripheral surface of the nozzle plate.

[0025] The outer peripheral surface of the nozzle plate may include a separation portion that is separated from the inner peripheral surface of the cover portion and forms a gap with the inner peripheral surface of the cover portion.

[0026] Technical effects

[0027] According to an embodiment of the present invention, even when the deposition raw material is changed, the gap of the inner plate can be easily changed, and the thickness of the thin film can be formed with the best uniformity.

[0028] In addition, a plurality of inner plates may be combined with the guide member.

[0029] In addition, the nozzle plate accommodating portion formed in the crucible can guide the deposition material upward to supply the deposition material to the substrate to the maximum extent, thereby minimizing the damage to the heater caused by the deposition material.

[0030] In addition, the nozzle plate accommodating portion can protect the nozzle plate.

[0031] In addition, the nozzle plate can be replaced while maintaining the guide member and the inner plate.

[0032] In addition, the nozzle plate is threadedly fastened to the nozzle plate accommodating portion, making it easy to assemble the nozzle plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a cross-sectional view showing a deposition apparatus according to an embodiment of the present invention.

[0034] Figure 2 is Figure 1 an enlarged view of the nozzle block shown in

[0035] Figure 3 is an adjustment Figure 2 cross-sectional view of the gap of the inner plate shown in

[0036] Figure 4 is a replacement Figure 2 cross-sectional view of the nozzle shown in

[0037] Figure 5 is a cross-sectional view showing a deposition apparatus according to another embodiment of the present invention.

[0038] Figure 6 is Figure 5 an enlarged view of the nozzle plate and the guide member shown in

[0039] Figure 7 is a perspective view showing an example in which a nozzle plate according to another embodiment of the present invention is inserted into a crucible. DETAILED DESCRIPTION

[0040] Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings.

[0041] Figure 1 is a cross-sectional view showing an example of a deposition apparatus according to an embodiment of the present invention. Figure 2 is Figure 1 an enlarged view of the nozzle block shown in

[0042] The deposition apparatus includes: a crucible 2 having a space S1 formed therein; a nozzle block 10 covering the space S1; and an inner plate 20 coupled to the nozzle block 10 and having a through hole H formed therein.

[0043] The crucible 2, the nozzle block 10, and the inner plate 20 may constitute an evaporation source 30 for thin film formation.

[0044] The deposition apparatus may include: a heater 40 capable of heating the evaporation source 30 for thin film formation; and a reflector 50 surrounding the heater 40. The deposition apparatus further includes a cooler 60 that houses the evaporation source 30 for thin film formation, the heater 40, and the reflector 50.

[0045] The crucible 2 may accommodate a deposition raw material 8 in the space S. If the crucible 2 is heated, the deposition raw material 8 accommodated in the crucible 2 may evaporate into a deposition substance.

[0046] The deposition raw material 8 may be silver (Ag), magnesium (Mg), lithium fluoride (LiF), etc., or the deposition raw material 8 may also be determined according to the structure of the OLED.

[0047] When the deposition raw material 8 is different, the density, boiling point, etc. of the deposition substance may change, and the deposition substance may exhibit an evaporation mode according to the height, gap, etc. of the inner plate 20, whereby the uniformity of the thin film formed on the substrate may be different.

[0048] An outer internal thread 3 may be formed on the upper inner peripheral surface of the crucible 2.

[0049] The crucible 2 may include a lower crucible 4 and an upper crucible 5.

[0050] The cross-sectional shape of the lower crucible 4 may be formed in a cup shape with an open top surface.

[0051] The upper crucible 5 may be formed in a hollow cylindrical shape, and in particular, may be formed in a hollow circular cylindrical shape.

[0052] An outer internal thread 3 may be formed on the inner peripheral surface of the upper crucible 5.

[0053] The upper crucible 5 may be formed above the lower crucible 4, and its inner diameter D1 may be larger than the inner diameter D2 of the lower crucible 4.

[0054] The crucible 2 may include a lid portion 6.

[0055] The lid portion 6 may protrude upward from the upper crucible 5 toward the upper side of the heater 40, and may be spaced apart from the heater 40 in the vertical direction.

[0056] The lid portion 6 may protrude horizontally outward from the upper end of the upper crucible 5.

[0057] The nozzle block 10 may include a nozzle plate 11.

[0058] The nozzle plate 11 may be in the shape of a plate. Nozzles 12 may be provided in the nozzle plate 11.

[0059] The nozzles 12 may be integrally formed with the nozzle plate 11, or may be detachably coupled to the nozzle plate 11.

[0060] When the nozzles 12 are integrally formed with the nozzle plate 11, the nozzles 12 may protrude from the top surface of the nozzle plate 11.

[0061] When the nozzles 12 are detachably coupled to the nozzle plate 11, the nozzles 12 may be fastened to nozzle fastening openings 13 formed in the nozzle plate 11. The nozzles 12 are threadedly fastened to the nozzle fastening openings 13, thereby enabling detachable coupling.

[0062] Nozzles 12 with different diameters D3 may be replaceable in the nozzle plate 11. The outer diameters of the nozzles 12 detachably fastened to the nozzle plate 11 may be the same, but the inner diameters D3 may be different.

[0063] The nozzle plate 11 may be generally in the shape of a disk and may be formed to be larger than the upper crucible 5. The nozzle plate 11 may include a placement portion 14a placed on the lid portion 6.

[0064] The nozzle plate 11 may be divided into a placement portion 14a and a central portion 14b based on a guide member 15 described later.

[0065] The central portion 14b may be the inner portion where the nozzles 12 are provided, and the placement portion 14a may be the outer portion that is in contact with the lid portion 6 and where nozzles 12 are not provided. The placement portion 14a may be in the shape of a ring.

[0066] The nozzle block 10 may include a guide member 15. The guide member 15 may be provided protruding from the bottom surface of the nozzle plate 11. The size of the guide member 15 may be smaller than the upper crucible 5 and may be inserted into the crucible 2, particularly into the interior of the upper crucible 5.

[0067] The guide member 15 may be formed in the shape of a hollow cylinder, particularly in the shape of a hollow circular cylinder.

[0068] The guide member 15 may guide the deposited material evaporated from below the nozzle plate 11 to the nozzles 12.

[0069] Outer external threads 16 that are threadedly engaged with the outer internal threads 3 may be formed on the outer peripheral surface of the guide member 15. Additionally, the outer external threads 16 of the guide member 15 may be threadedly fastened to the outer internal threads 3 and may be inserted into the interior of the upper crucible 5.

[0070] When the outer external threads 16 are threadedly fastened to the outer internal threads 3, the upper crucible 5 may surround the outer periphery of the guide member 15 and protect the guide member 15.

[0071] The outer diameter D4 of the guide member 15 may be larger than the inner diameter D2 of the lower crucible 4.

[0072] On the other hand, an inner plate fastening portion for fastening the inner plate 20 with adjustable height may be formed on the inner peripheral surface of the guide member 15.

[0073] An inner-side internal thread 17 may be formed on the inner peripheral surface of the guide member 15.

[0074] The inner-side internal thread 17 may be formed to have a width larger than the maximum clearance between the upper plate 24 and the lower plate 26 described later.

[0075] An inner-side external thread 22 that is thread-fastened to the inner-side internal thread 17 may be formed on the outer peripheral surface of the inner plate 20.

[0076] A plurality of inner plates 20 may be provided on the inner peripheral surface of the guide member 15, and may include: an upper plate 24, separated from the nozzle plate 11 by a first gap G1; and a lower plate 26, separated from the upper plate 24 by a second gap G2.

[0077] The inner-side external thread 22 of the upper plate 24 may be thread-fastened to the inner-side internal thread 17, and the height of the upper plate 2 may be determined.

[0078] The higher the height at which the upper plate 24 is thread-fastened, the narrower the first gap G1 between the nozzle plate 11 and the upper plate 24 may be.

[0079] In the deposition device, if the first gap G1 is adjusted, the flow pattern of the deposited material may be different.

[0080] The inner-side external thread 22 of the lower plate 26 may be thread-fastened to the inner-side internal thread 17 and separated from the upper plate 24, and the height of the lower plate 26 may be determined.

[0081] The higher the height at which the lower plate 26 is thread-fastened, the narrower the second gap G2 between the upper plate 24 and the lower plate 26 may be.

[0082] In the deposition device, if the second gap G2 is adjusted, the flow pattern of the deposited material may be different.

[0083] The through hole H1 of the upper plate 24 and the through hole H2 of the lower plate 26 may be formed at positions that do not coincide in the vertical direction.

[0084] The heater 40 may heat the crucible 2 from the outside of the crucible 2. The heater 40 includes an upper heater 42 and a lower heater 44.

[0085] The upper heater 42 may be disposed on the upper outer periphery of the crucible 2 and heat the upper portion of the crucible 2.

[0086] The lower heater 44 may be disposed on the lower outer periphery of the crucible 2 and heat the lower part of the crucible 2.

[0087] The upper heater 42 and the lower heater 44 may be spaced apart in the vertical direction.

[0088] The upper heater 42 and the lower heater 44 may be supported by a heater bracket 46.

[0089] The reflector 50 may reflect the heat released from the heater 40 toward the crucible 2. The reflector 50 may form the outer surface of the heater 40.

[0090] The cooler 60 may block the heat released from the heater 40 from being released to the outside of the deposition apparatus.

[0091] An accommodation space may be formed inside the cooler 60, and the heater 40 may be disposed in the accommodation space of the cooler 60.

[0092] The cooler 60 may include a refrigerant pipe or a refrigerant passage through which a refrigerant such as cooling water passes. The cooler 60 includes a cooling water block having a refrigerant pipe or a refrigerant passage.

[0093] The upper plate 24 and the lower plate 26 of the deposition apparatus as described above may be height-adjusted by the guide 15, and the evaporation mode of the evaporation material may vary depending on the heights of the upper plate 24 and the lower plate 26.

[0094] Figure 3 is an adjustment Figure 2 cross-sectional view of the gap between the inner plates shown in Figure 4 is a replacement Figure 2 cross-sectional view of the nozzle shown in

[0095] When the material of the deposition raw material 8 is changed during the use of the deposition apparatus, the thickness of the thin film formed on the substrate may be confirmed and the optimum inner plate gaps G1 and G2 may be confirmed.

[0096] For example, Figure 3 is a view showing that the first gap G1 is made smaller than Figure 2 and the second gap G2 is made larger than Figure 2 by rotating the inner plates 24 and 26.

[0097] When adjusting the gaps G1 and G2 between the inner plates 24 and 26, it is confirmed whether the thickness of the thin film formed on the substrate is within the set range, and the deposition apparatus is additionally used in a state where the inner plates 24 and 26 are arranged to have the gaps G1 and G2 that adjust the thickness of the thin film to within the set range.

[0098] On the other hand, when the uniformity of the thin film formed on the substrate is different, asFigure 4 As shown, a new nozzle 12 can be installed, for example, a nozzle 12 with a smaller inner diameter can be installed to replace the nozzle 12 with a larger inner diameter, and the uniformity can be improved by adjusting the gaps G1 and G2 between the inner plates 24 and 26.

[0099] Figure 5 FIG. is a cross-sectional view showing another example of the deposition apparatus according to an embodiment of the present invention. Figure 6 is Figure 5 an enlarged view of the nozzle plate and the guide shown in Figure 7 FIG. is a perspective view showing an example in which the nozzle plate according to another embodiment of the present invention is inserted into the crucible.

[0100] This embodiment includes a crucible 2, a nozzle plate 11, a guide 15′, and an inner plate 20.

[0101] A space S1 can be formed inside the crucible 2.

[0102] The crucible 2 includes: a lower crucible 4; and an upper crucible 5 formed on the lower crucible 4 and having an inner diameter larger than that of the lower crucible 4, and the upper crucible 5 can surround the outer peripheral surface of the guide 15′.

[0103] A nozzle plate receiving portion 6′ can be formed at the upper part of the crucible 2.

[0104] The nozzle plate receiving portion 6′ can be defined as a portion for inserting and receiving the nozzle plate 11.

[0105] The nozzle plate receiving portion 6′ can include: a placement portion 6a for placing the nozzle plate 11; and a cover portion 6b formed larger than the nozzle plate 11 and surrounding the outer peripheral surface 11a of the nozzle plate 11.

[0106] The placement portion 6a can horizontally extend at the upper end of the upper crucible 5.

[0107] Figure 6 As shown, the inner peripheral surface 6c of the cover portion 6b can extend upward in the upper side direction U from the top surface of the placement portion 6a. The inner peripheral surface 6c of the cover portion 6b can be orthogonal to the top surface of the placement portion 6a.

[0108] The gap S2 between the inner peripheral surface 6c of the cover portion 6b and the outer peripheral surface 11a of the nozzle plate 11 can be open upward.

[0109] An upper internal thread (not shown) is formed on the inner peripheral surface 6c of the cover portion 6b, and the upper internal thread is threadedly fastened to the upper external thread 11b formed on the outer peripheral surface 11a of the nozzle plate 11 (refer to Figure 7 ).

[0110] The structure of the crucible 2 other than the nozzle plate accommodating portion 6' is the same as or similar to that of the crucible 2 in an embodiment of the present invention. The same reference numerals are used for the same structures and the repeated description thereof is omitted.

[0111] The nozzle plate 11 can cover the space S1 and is provided with nozzles 12.

[0112] The nozzle plate 11 can be inserted into the inside of the lid portion 6b and accommodated therein.

[0113] An external thread 11b that is thread-fastened to the upper internal thread can be formed on the outer peripheral surface 11a of the nozzle plate 11.

[0114] The outer peripheral surface 11a of the nozzle plate 11 can include a separating portion 11c that is horizontally spaced apart from the inner peripheral surface 6c of the lid portion 6b. The separating portion 11c can form a gap S2 with the inner peripheral surface 6c of the lid portion 6b. A curved surface portion having a curved shape and a straight portion having a straight shape can be alternately formed on the outer peripheral surface 11a of the nozzle plate 11. The external thread 11b can be formed on the curved surface portion, and the straight portion can constitute the separating portion 11c.

[0115] The nozzle plate 11 can be accommodated in the nozzle plate accommodating portion 6' and protected by the nozzle plate accommodating portion 6'.

[0116] A part of the deposited material evaporated from the space S1 of the crucible 2 can leak through the gap S2 between the nozzle plate accommodating portion 6' and the nozzle plate 11, but such deposited material can be guided by the inner peripheral surface 6c of the lid portion 6b and the separating portion 11c of the nozzle plate 11 and guided upward in the upward direction U.

[0117] As described above, when the deposited material is guided upward in the upward direction U, the deposited material leaking from the crucible 2 to the heater 40 can be minimized, and the damage to the heater 40 caused by the deposited material can be minimized.

[0118] The nozzle plate 11 is the same as or similar to the nozzle plate 11 in an embodiment of the present invention except for the structure of being inserted and accommodated in the nozzle plate accommodating portion 6'. Therefore, the same reference numerals are used for the description and the repeated description thereof is omitted.

[0119] The guide member 15' can be inserted into the crucible 2, and an internal thread 17 can be formed on the inner peripheral surface of the guide member 15'. The outer diameter of the guide member 15' can be larger than the inner diameter of the lower crucible 4. The internal thread 17 can be the same as the internal thread 17 on the inner side in an embodiment of the present invention.

[0120] The guide member 15' can be placed at the upper end of the lower crucible 4 and can be disposed in the upper crucible 5 so as to be liftable.

[0121] The vertical length of the guide member 15' can be smaller than the vertical length of the upper crucible 5.

[0122] The guide member 15' can be spaced apart from the nozzle plate 11 in the vertical direction, and a gap G3 can be formed between the upper end of the guide member 15' and the bottom surface of the nozzle plate 11.

[0123] In the case where the guide member 15' is not integrally formed with the nozzle plate 11, the nozzle plate 11 can be replaced while maintaining the state of the guide member 15'.

[0124] The guide member 15' is the same as or similar to the guide member 15 of an embodiment of the present invention except for the configuration of being disposed on the lower crucible 4 and spaced apart from the nozzle plate 11. Therefore, the same reference numerals are used for description, and repeated description thereof is omitted.

[0125] External threads 22 that are threadedly coupled to the guide member 15' can be formed on the outer circumferential surface of the inner plate 20, and the inner plate 20 can be adjusted in height inside the guide member 15'. The inner plate 20 can include: an upper plate 24 that is spaced apart from the nozzle plate 11 by a first gap; and a lower plate 26 that is spaced apart from the upper plate 24 by a second gap G2, and the through hole H1 of the upper plate 24 and the through hole H2 of the lower plate 26 can be non-aligned in the vertical direction.

[0126] The external threads 22 can be the same as the inner external threads 22 of an embodiment of the present invention.

[0127] The upper plate 24 and the lower plate 26 can adjust the height and the gaps G1 and G2 according to the thickness of the thin film formed on the substrate, and the uniformity of the thin film on the substrate can be improved by adjusting the gaps G1 and G2.

[0128] The inner plate 20 is the same as or similar to the inner plate 20 of an embodiment of the present invention. Therefore, the same reference numerals are used for description, and repeated description thereof is omitted.

[0129] The above description is only an example of the technical idea of the present invention, and those of ordinary skill in the art to which the present invention pertains will be able to make various modifications and variations without departing from the essential features of the present invention.

[0130] Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain the technical idea, and the scope of the technical idea of the present invention is not limited by these embodiments.

[0131] The protection scope of the present invention should be interpreted by the appended claims, and all technical ideas within the equivalent scope thereof should be interpreted as being included within the scope of the present invention.

Claims

1. A deposition device, Among them, including: a crucible with a space formed inside it; a nozzle plate covering the space and provided with nozzles; a guide member inserted into the crucible and having internal threads formed on its inner peripheral surface; and an inner plate having external threads threadedly engaged with the guide member formed on its outer peripheral surface, and the inner plate being height-adjusted inside the guide member, a nozzle plate receiving portion is formed on the upper part of the crucible for inserting and receiving the nozzle plate, the nozzle plate receiving portion includes: a placement portion for placing the nozzle plate; and a cover portion formed larger than the nozzle plate and surrounding the outer peripheral surface of the nozzle plate, the nozzle plate is received inside the cover portion, the outer peripheral surface of the nozzle plate includes; a separation portion separated from the inner peripheral surface of the cover portion and forming a gap with the inner peripheral surface of the cover portion.

2. The deposition device according to claim 1, wherein, the inner plate includes: an upper plate separated from the nozzle plate by a first gap; and a lower plate separated from the upper plate by a second gap.

3. The deposition device according to claim 2, wherein, the through holes of the upper plate and the through holes of the lower plate are not aligned in the vertical direction.

4. The deposition device according to claim 1, wherein, the crucible includes: a lower crucible; and an upper crucible formed on the upper part of the lower crucible, and the inner diameter of the upper crucible is larger than the inner diameter of the lower crucible.

5. The deposition device according to claim 4, wherein, the upper crucible surrounds the outer peripheral surface of the guide member.

6. The deposition device according to claim 4, wherein, the outer diameter of the guide member is larger than the inner diameter of the lower crucible.

7. The deposition device according to claim 1, wherein, the inner peripheral surface of the cover portion extends upward from the top surface of the placement portion.

8. The deposition device according to claim 1, wherein, the gap between the inner peripheral surface of the cover portion and the outer peripheral surface of the nozzle plate is open upward.

9. The deposition device according to claim 1, wherein, upper internal threads are formed on the inner peripheral surface of the cover portion, and upper external threads threadedly fastened to the upper internal threads are formed on the outer peripheral surface of the nozzle plate.

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