Pumping ring structure and plasma processing device

Abstract

The present application relates to the field of semiconductor technology, and in particular to an exhaust ring structure and a plasma processing device. The exhaust ring structure is an annular cavity structure with an internal cavity, and an exhaust surface is provided along the circumferential wall of the exhaust ring structure. The exhaust surface is a corrugated exhaust surface with convex parts and concave parts continuously and alternately, and two adjacent convex parts and concave parts are connected by a corrugated inclined surface, and each corrugated inclined surface is provided with a through first exhaust hole; an exhaust hole is provided through the wall surface of the annular cavity structure opposite to the exhaust surface. The plasma processing device is provided with the exhaust ring structure. The exhaust ring structure and the plasma processing device solve the technical problem of low exhaust efficiency of the existing exhaust ring structure.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a pumping ring structure and a plasma processing device. Background Art

[0002] At present, in the field of semiconductor device manufacturing, plasma processing devices are widely used. In such plasma processing devices, an exhaust ring structure is generally set in the reaction chamber thereof to separate the plasma processing space and the exhaust space up and down, and to prevent the plasma in the plasma processing space from being discharged while exhausting the gas. However, the exhaust surface of the existing exhaust ring structure is basically a plane, and the exhaust surface is also set on a plane, and the exhaust holes are basically vertical through holes set up up and down, resulting in the exhaust effect of the existing exhaust ring structure being average, and at the same time, it is not very good to prevent the plasma in the plasma processing space from escaping from the exhaust holes. Summary of the invention

[0003] The purpose of the present application is to provide an exhaust ring structure and a plasma processing device to solve the technical problem of low exhaust efficiency of the existing exhaust ring structure.

[0004] In a first aspect, the present application provides an air pumping ring structure,

[0005] The exhaust ring structure is an annular cavity structure with an internal cavity, and an exhaust surface is provided along the circumferential wall of the exhaust ring structure. The exhaust surface is a corrugated exhaust surface with convex parts and concave parts continuously and alternately, and two adjacent convex parts and concave parts are connected by a corrugated inclined surface, and each of the corrugated inclined surfaces is provided with a through first exhaust hole; an exhaust hole is provided on the wall surface of the annular cavity structure opposite to the exhaust surface.

[0006] Furthermore, the corrugated exhaust surface is arranged on the circumferential top surface of the air pumping ring structure;

[0007] Correspondingly, a plurality of air extraction holes are provided on the circumferential bottom surface of the air extraction ring structure.

[0008] Furthermore, the exhaust ring structure is formed by a circumferential top surface, a circumferential inner wall, a circumferential bottom surface and a circumferential outer wall connected to each other, the diameter of the circumferential inner wall is smaller than the diameter of the circumferential outer wall, the circumferential inner wall is arranged toward the interior of the reaction chamber, and the corrugated exhaust surface is arranged on the circumferential inner wall; correspondingly, a plurality of exhaust holes are provided on the circumferential outer wall.

[0009] Furthermore, each of the air extraction holes is arranged corresponding to each of the convex openings of the corrugated exhaust surface.

[0010] Furthermore, the diameter of the first exhaust hole is less than 0.1 mm.

[0011] Furthermore, each of the first exhaust holes is along the same horizontal annular axis.

[0012] Furthermore, the recessed portion between two adjacent corrugated inclined surfaces is provided with a through second exhaust hole.

[0013] Furthermore, the diameter of the second exhaust hole is less than 0.1 mm.

[0014] Furthermore, the inclination angle of the corrugated inclined surfaces on both sides of each convex portion of the corrugated exhaust surface toward the convex portion 21 is 5° to 85°.

[0015] In a second aspect, the present application provides a plasma processing device, comprising the pumping ring structure described in any one of the preceding items, and also comprising a reaction chamber, wherein the pumping ring structure is arranged on a substrate support portion in the reaction chamber, one side of the pumping ring structure is a plasma processing space, and the other side is an exhaust space.

[0016] Compared with the prior art, the pumping ring structure provided by the present application is an annular cavity structure with an internal cavity, and a corrugated exhaust surface with convex and concave portions continuously and alternately arranged is provided along the circumferential wall surface of the pumping ring structure, and two adjacent convex portions and concave portions are connected by a corrugated inclined surface, and each corrugated inclined surface is provided with a through first exhaust hole, and the wall surface of the annular cavity structure opposite to the exhaust surface is provided with an exhaust hole for extracting the gas in the annular cavity structure. Compared with the existing flat exhaust surface, this corrugated curved exhaust surface greatly increases the exhaust area, thereby increasing the area where the exhaust holes can be set and increasing the number of exhaust holes, thereby improving the exhaust efficiency; and the first exhaust hole is set on the corrugated inclined surface, and the gas is inclined at an angle to enter the cavity for discharge, so that the fluidity of the exhaust gas is better, and at the same time, the corrugated exhaust surface can prevent the escape of plasma to a certain extent, and help the exhaust hole to prevent the discharge of plasma. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 A schematic structural diagram of an air pumping ring structure provided in the first embodiment of the present application;

[0019] Figure 2 A top view of a portion of the air pumping ring structure provided in the first embodiment of the present application;

[0020] Figure 3for Figure 2 AA cross-section shown in;

[0021] Figure 4 A schematic diagram of the air flow direction of the air pumping ring structure provided in the first embodiment of the present application;

[0022] Figure 5 A schematic structural diagram of an air pumping ring structure provided in the second embodiment of the present application;

[0023] Figure 6 A top view of a portion of the air pumping ring structure provided in the second embodiment of the present application;

[0024] Figure 7 for Figure 6 BB cross section shown in;

[0025] Figure 8 A schematic diagram of the air flow direction of the air pumping ring structure provided in the second embodiment of the present application;

[0026] Fig. 9 This is a cross-sectional view of a plasma processing device provided in an embodiment of the present application.

[0027] Reference numerals:

[0028] 100-air pumping ring structure;

[0029] 11-circumferential top surface;

[0030] 12-circumferential medial wall;

[0031] 13- circumferential bottom surface;

[0032] 14-circumferential lateral wall;

[0033] 20-corrugated exhaust surface;

[0034] 21-Protrusion;

[0035] 22-concave;

[0036] 23-corrugated slope;

[0037] 31- first exhaust hole;

[0038] 32- second exhaust hole;

[0039] 33-air extraction hole;

[0040] 200- plasma treatment device;

[0041] 201-reaction chamber;

[0042] 202- substrate support portion;

[0043] 203- plasma treatment space;

[0044] 204-Exhaust space. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0046] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0047] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0048] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0049] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0050] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0051] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0052] like Figures 1 to 8 As shown, the embodiment of the present application provides an air pumping ring structure 100, which is used to improve Fig. 9 As shown, an embodiment of the present application also provides a plasma processing device 200 using the pumping ring structure 100, the plasma processing device 200 also includes a reaction chamber 201, the pumping ring structure 100 is arranged on a substrate support portion 202 in the reaction chamber 201, one side of the pumping ring structure 100 is a plasma processing space 203, and the other side is an exhaust space 204.

[0053] like Figures 1 to 8 As shown, the aforementioned air pumping ring structure 100 is an annular cavity structure with an internal cavity, and an exhaust surface is provided along the circumferential wall of the air pumping ring structure 100. The exhaust surface is a corrugated exhaust surface 20 with convex portions 21 and concave portions 22 continuously and alternately provided. Two adjacent convex portions 21 and concave portions 22 are connected by a corrugated slope 23, and each corrugated slope 23 is provided with a through first exhaust hole 31. The wall of the annular cavity structure opposite to the corrugated exhaust surface 20 is provided with an air pumping hole 33.

[0054] Furthermore, the aperture of the aforementioned first exhaust hole 31 is set to be less than 0.1 mm, and the opening size of the first exhaust hole 31 is limited to effectively prevent the plasma in the plasma processing space 203 from leaking from the pumping ring structure 100 into the exhaust space 204, thereby achieving a balance between the exhaust efficiency of the pumping ring structure 100 and the confinement effect of the plasma.

[0055] Compared with the prior art, the pumping ring structure 100 provided in the embodiment of the present application is an annular cavity structure with an internal cavity, and a corrugated exhaust surface 20 with continuous and alternating convex portions 21 and concave portions 22 is provided along the circumferential wall surface of the pumping ring structure 100, and two adjacent convex portions 21 and concave portions 22 are connected by a corrugated inclined surface 23, and each corrugated inclined surface 23 is provided with a through first exhaust hole 31, and the wall surface of the annular cavity structure opposite to the exhaust surface is through-set with an exhaust hole 33 for extracting the gas in the annular cavity structure. Compared with the existing flat exhaust surface, this corrugated curved exhaust surface greatly increases the exhaust area, thereby increasing the area where the exhaust holes can be set and increasing the number of exhaust holes, thereby improving the exhaust efficiency; and the first exhaust hole 31 is set on the corrugated inclined surface 23, and the gas is inclined at an angle to enter the cavity for discharge, so that the fluidity of the exhaust gas is better, and at the same time, the corrugated exhaust surface can prevent the escape of plasma to a certain extent, and help the exhaust hole to prevent the discharge of plasma.

[0056] like Figure 1 and Figure 5 As shown, the vacuum ring structure 100 provided in the embodiment of the present application is composed of a circumferential top surface 11, a circumferential inner wall 12, a circumferential bottom surface 13 and a circumferential outer wall 14 connected to each other, the diameter of the circumferential inner wall 12 is smaller than the diameter of the circumferential outer wall 14, and the circumferential inner wall 12 is arranged toward the interior of the reaction chamber.

[0057] like Figures 1 to 4 As shown, the first embodiment provided by the present application is that the aforementioned corrugated exhaust surface 20 of the pumping ring structure 100 is arranged on the circumferential top surface 11 of the pumping ring structure 100, so that the gas to be exhausted in the plasma processing space 203 can be exhausted from each exhaust hole 33 of the corrugated exhaust surface 20 on the top surface of the pumping ring structure 100. Correspondingly, the circumferential bottom surface 13 of the pumping ring structure 100 can be provided with a plurality of the aforementioned exhaust holes 33, and specifically each exhaust hole 33 can be arranged at intervals. Preferably, the openings of each exhaust hole 33 can be respectively arranged toward each convex portion 21 of the aforementioned corrugated exhaust surface 20, so that the gas entering from the exhaust hole can be directly discharged vertically from the bottom surface of the cavity, thereby improving the exhaust efficiency and reducing the gas retention time in the cavity to prevent deposition.

[0058] like Figures 5 to 8As shown, the second embodiment provided by the present application is that the corrugated exhaust surface 20 of the pumping ring structure 100 is arranged on the aforementioned circumferential inner side wall 12, so that the gas to be exhausted in the plasma processing space 203 can be exhausted from each exhaust hole 33 of the corrugated exhaust surface 20 on the side of the pumping ring structure 100. Correspondingly, a plurality of the aforementioned exhaust holes 33 can be provided on the circumferential outer side wall 14 of the pumping ring structure 100, and each exhaust hole 33 can be arranged at intervals. Preferably, the openings of each exhaust hole 33 are respectively arranged toward each convex portion 21 of the corrugated exhaust surface 20, so that the gas entering from the exhaust hole can be directly discharged horizontally from the side of the cavity, thereby improving the exhaust efficiency and reducing the gas retention time in the cavity to prevent deposition.

[0059] In order to prevent the accumulation of particles on the surface of the exhaust ring structure 100, a preferred embodiment is that a through second exhaust hole 32 can be provided on each recessed portion 22 between two adjacent corrugated slopes 23 of the corrugated exhaust surface 20. This can not only effectively prevent the accumulation of particles in the recessed places where particulate impurities are easily accumulated, but also further increase the number of exhaust holes on the exhaust surface, thereby further improving the exhaust efficiency.

[0060] Furthermore, in order to effectively balance the exhaust efficiency of the pumping ring structure 100 and the confinement effect of the plasma, the opening size of the second exhaust hole 32 can be restricted, and the aperture of the second exhaust hole 32 is set to be less than 0.1 m, so as to effectively prevent the plasma in the plasma processing space 203 from leaking from the pumping ring structure 100 to the exhaust space 204. While improving the exhaust efficiency of the pumping ring structure 100, it can also confine the plasma in the plasma processing space 203, effectively preventing the plasma from escaping.

[0061] Another preferred embodiment is as follows Figure 2 and Figure 6 As shown, the aforementioned first exhaust holes 31 can be arranged along the same horizontal annular axis on the same horizontal plane, so that the first exhaust holes 31 circumferentially arranged on the corrugated exhaust surface 20 are on the same horizontal plane, which is not only convenient for unified hole arrangement and processing, but also convenient for airflow. In particular, the first exhaust holes 31 on both sides of the same convex portion 21 can communicate with each other without being blocked by the corrugated inclined surfaces 23 opposite to each other, thereby facilitating gas circulation.

[0062] Another preferred embodiment is, Figure 3 As shown, the inclination angle a of the corrugated inclined surface 23 on both sides of each convex portion 21 of the corrugated exhaust surface 20 toward the convex portion 21 can be set to 5° to 85°, so that each first exhaust hole 31 can achieve a better exhaust effect. Preferably, the protruding heights of each convex portion 21 of the corrugated exhaust surface 20 are the same, and preferably, the spacing between each convex portion 21 of the corrugated exhaust surface 20 is the same as the spacing between each concave portion 22.

[0063] The embodiment of the present application also provides a plasma processing device 200 using the aforementioned pumping ring structure 100. Not only is the exhaust efficiency of the gas to be exhausted in the plasma processing space 203 in the reaction chamber 201 in the plasma processing device 200 improved, but the plasma in the plasma processing space 203 can also be effectively prevented from escaping from the pumping ring structure 100 to the exhaust space 204.

[0064] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A pumping ring structure, characterized in that: The exhaust ring structure is an annular cavity structure with an internal cavity, and an exhaust surface is provided along the circumferential wall of the exhaust ring structure. The exhaust surface is a corrugated exhaust surface with convex parts and concave parts continuously and alternately, and two adjacent convex parts and concave parts are connected by a corrugated slope, and each corrugated slope is provided with a through first exhaust hole, and the concave part between two adjacent corrugated slopes is provided with a through second exhaust hole, and the aperture of the second exhaust hole is less than 0.1mm; an exhaust hole is provided on the wall of the annular cavity structure opposite to the exhaust surface.

2. The air pumping ring structure according to claim 1, characterized in that: The corrugated exhaust surface is arranged on the circumferential top surface of the air pumping ring structure; Correspondingly, a plurality of air extraction holes are provided on the circumferential bottom surface of the air extraction ring structure.

3. The air pumping ring structure according to claim 1, characterized in that: The exhaust ring structure is formed by a circumferential top surface, a circumferential inner wall, a circumferential bottom surface and a circumferential outer wall connected to each other. The diameter of the circumferential inner wall is smaller than the diameter of the circumferential outer wall. The circumferential inner wall is arranged toward the interior of the reaction chamber, and the corrugated exhaust surface is arranged on the circumferential inner wall; correspondingly, a plurality of exhaust holes are arranged on the circumferential outer wall.

4. The air pumping ring structure according to claim 2 or 3, characterized in that: The openings of the air extraction holes are respectively arranged corresponding to the convex portions facing the corrugated exhaust surface.

5. The air pumping ring structure according to claim 2 or 3, characterized in that: The diameter of the first exhaust hole is less than 0.1 mm.

6. The air pumping ring structure according to claim 2 or 3, characterized in that: Each of the first exhaust holes is arranged along the same horizontal annular axis on the same horizontal plane.

7. The air pumping ring structure according to claim 2 or 3, characterized in that: The inclination angle of the corrugated inclined surfaces on both sides of each convex portion of the corrugated exhaust surface toward the convex portion is 5°~85°.

8. A plasma processing device, characterized in that: It comprises the pumping ring structure according to any one of claims 1 to 7, and also comprises a reaction chamber, wherein the pumping ring structure is arranged on a substrate supporting portion in the reaction chamber, one side of the pumping ring structure is a plasma processing space, and the other side is an exhaust space.

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