Apparatus for processing a substrate

Abstract

The present inventive concepts provide a substrate processing apparatus. The substrate processing apparatus includes a housing for providing a processing space for processing a substrate therein, a support unit for supporting the substrate in the processing space, a bottom supply port for supplying a process fluid to the processing space, and a filling member located below the substrate supported on the support unit in the processing space, wherein the filling member forms a buffer space facing the bottom supply port, and a passage is formed between the filling member and an inner wall of the housing, which passage causes the process fluid introduced into the buffer space to flow in a direction of the substrate.

Description

Technical Field

[0001] The embodiments of the inventive concept described herein relate to a substrate processing apparatus, and more specifically, to a substrate processing apparatus for performing a drying process on a substrate. Background Technology

[0002] Typically, various processes, such as photolithography, etching, ion implantation, and deposition, are performed to manufacture semiconductor devices. Furthermore, these processes generate various impurities, such as particles, organic contaminants, and metallic impurities. These impurities cause defects in the substrate, thus directly affecting the performance and yield of semiconductor devices. Therefore, cleaning processes for removing these impurities must be included in the semiconductor device manufacturing process.

[0003] Recently, supercritical fluids have been used in processes for cleaning or developing substrates. According to one embodiment, an anti-tipping liquid such as isopropyl alcohol (IPA) can be used to wet the top surface of the substrate, and then carbon dioxide (CO2) can be supplied to the top surface of the substrate in a supercritical state to remove any remaining anti-tipping liquid.

[0004] Within the processing space where a supercritical fluid is used in the process, an environment above the critical temperature and critical pressure should be maintained. Furthermore, the supercritical fluid should be uniformly distributed within the processing space. However, due to structural issues within the processing space, the supercritical fluid cannot flow uniformly. In one embodiment, if the supply port for supplying the supercritical fluid is offset towards the center of the processing space, the supercritical fluid becomes relatively concentrated in the area where the supply port is located. That is, the supercritical fluid flows asymmetrically within the processing space. If the supercritical fluid is supplied to the processing space at high speed, this asymmetry is further exacerbated. Therefore, uniform processing of the substrate arranged within the processing space is not possible. Furthermore, due to the asymmetry of the supercritical fluid, a large number of particles appear in specific areas of the substrate where a relatively large amount of supercritical fluid has been supplied. Summary of the Invention

[0005] An embodiment of the present invention provides a substrate processing apparatus for uniformly supplying process fluids to a processing space.

[0006] An embodiment of the present invention provides a substrate processing apparatus for making the process fluid flow uniformly in the processing space when the process fluid is supplied to the processing space at high speed.

[0007] An embodiment of the present invention provides a substrate processing apparatus for suppressing particle concentration in a specific region when processing a substrate using a process fluid.

[0008] The technical objectives of this invention are not limited to those described above. Other unmentioned technical objectives will be apparent to those skilled in the art from the following description.

[0009] The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a housing for providing a processing space for processing a substrate therein; a support unit for supporting the substrate in the processing space; a bottom supply port for supplying process fluid to the processing space; and a filling member located below the substrate supported on the support unit in the processing space, wherein the filling member forms a buffer space facing the bottom supply port, and a channel is formed between the filling member and an inner wall of the housing, the channel allowing the process fluid introduced into the buffer space to flow along the direction of the substrate.

[0010] In one implementation, the bottom supply port is positioned to overlap with the buffer space when viewed from above.

[0011] In one embodiment, the housing includes a top housing and a bottom housing, the top housing forming a recess with an open top, and at least a portion of the filling member is inserted into the recess.

[0012] In one embodiment, the filling member includes: a base; and a protrusion extending downward from the bottom surface of the base.

[0013] In one embodiment, the base is configured to be spaced apart from the inner wall of the housing.

[0014] In one embodiment, at least one support pin is formed on the top surface of the base to space the substrate from the support unit by a predetermined distance by contacting the bottom surface of the substrate placed on the support unit.

[0015] In one embodiment, a slit with a spiral shape is formed along the inner surface of the protrusion defining the buffer space.

[0016] In one embodiment, the filling member includes: a base; and a protrusion extending downward from the bottom surface of the base, wherein at least a portion of the protrusion is inserted into the groove, and the base is located above the groove and configured to be larger than the area of ​​the groove when viewed from above.

[0017] In one embodiment, a plurality of support protrusions spaced apart from each other are formed at the bottom end of the protrusion, the support protrusions space the bottom end of the protrusion from the bottom surface defining the groove, and the top end of the protrusion is positioned above the top end of the groove, and the space between the support protrusions is configured as the channel.

[0018] In one embodiment, the process fluid is a supercritical fluid.

[0019] The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a housing for providing a processing space for processing a substrate therein; a support unit for supporting the substrate in the processing space; a supply port for supplying process fluid to the processing space; and a buffer plate forming a buffer space by being coupled to a groove formed in the housing, and having an opening for communicating between the processing space and the buffer space.

[0020] In one embodiment, the substrate processing apparatus further includes a filling member located below the substrate supported on the support unit in the processing space, and the filling member is located below the buffer plate.

[0021] In one embodiment, the housing includes a first housing and a second housing, the second housing having the groove formed recessed in a direction away from the substrate supported on the support unit.

[0022] In one embodiment, the buffer plate is located at the groove, and the area of ​​the buffer plate facing the process fluid supplied from the supply port is a blocking area.

[0023] In one embodiment, the filling member is configured to have an area larger than that of the groove when viewed from above.

[0024] In one embodiment, the bottom surface of the filling member is configured to be higher than the top surface of the buffer plate.

[0025] In one embodiment, the process fluid is a supercritical fluid.

[0026] The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a housing for providing a processing space for processing a substrate therein, and including a top housing and a bottom housing, the bottom housing having a recess with an open top; a support unit for supporting the substrate in the processing space; a top supply port for supplying process fluid from above the processing space; a bottom supply port for supplying the process fluid from below or to the side of the processing space; and a filling member located below the substrate supported on the support unit in the processing space, wherein the filling member has a buffer space formed facing the bottom supply port, and a channel is formed between the filling member and an inner wall of the housing, the channel allowing the process fluid introduced into the buffer space through the bottom supply port to flow along the direction of the substrate.

[0027] In one embodiment, the filling member includes: a base; and an annular protrusion extending downward from the bottom surface of the base, wherein the base is located above the groove and is larger than the area of ​​the groove when viewed from above, and wherein the protrusion is located within the groove and spaced apart from the side surface of the groove toward the center of the groove.

[0028] In one embodiment, a support protrusion is formed at the bottom end of the protrusion, the bottom end of the protrusion being spaced upward from the bottom surface of the groove, and the top end of the protrusion being positioned higher than the top end of the groove.

[0029] According to the embodiments conceived in this invention, the substrate can be processed effectively.

[0030] According to an embodiment of the present invention, process fluid can be supplied uniformly to the processing space.

[0031] According to an embodiment of the present invention, when process fluid is supplied to the processing space at high speed, the process fluid can flow uniformly in the processing space.

[0032] According to embodiments of the present invention, particle concentration in specific areas of the substrate can be suppressed when the substrate is treated with process fluids.

[0033] The effects of this invention are not limited to those described above. Other effects not mentioned will be apparent to those skilled in the art from the following description. Attached Figure Description

[0034] The above and other objects and features will become apparent from the following description with reference to the accompanying drawings, unless otherwise specified, the same reference numerals in the various drawings refer to the same parts, and wherein:

[0035] Figure 1 A substrate processing apparatus according to an embodiment of the present invention is illustrated schematically.

[0036] Figure 2 schematically shown Figure 1 An embodiment of the liquid treatment chamber of the substrate processing apparatus.

[0037] Figure 3 schematically shown Figure 1 One embodiment of the drying chamber of the substrate processing apparatus.

[0038] Figure 4 It is shown schematically. Figure 3 A perspective view of an embodiment of the filling component.

[0039] Figure 5 schematically shown Figure 3 The flow of process fluids in the drying chamber.

[0040] Figure 6 It is shown schematically. Figure 3 A cross-sectional perspective view of another embodiment of the filling member.

[0041] Figure 7 schematically shown Figure 1 Another embodiment of the drying chamber of the substrate processing apparatus.

[0042] Figure 8 schematically shown Figure 7 The flow of process fluids in the drying chamber.

[0043] Figure 9 schematically shown Figure 1 Another embodiment of the drying chamber of the substrate processing apparatus.

[0044] Figure 10 schematically shown Figure 9 The flow of process fluids in the drying chamber.

[0045] Figure 11 schematically shown Figure 1 Another embodiment of the drying chamber of the substrate processing apparatus.

[0046] Figure 12 schematically shown Figure 11 The flow of process fluids in the drying chamber.

[0047] Figure 13 It shows Figure 1 Another embodiment of the drying chamber of the substrate processing apparatus.

[0048] Figure 14 It shows Figure 1 Another embodiment of the drying chamber of the substrate processing apparatus. Detailed Implementation

[0049] Various modifications can be made to the inventive concept, and the inventive concept can take many forms, the specific embodiments of which will be illustrated and described in detail in the accompanying drawings. However, the embodiments according to the inventive concept are not intended to limit the specific forms of disclosure, and it should be understood that the inventive concept includes all variations, equivalents, and substitutions included within the spirit and scope of the inventive concept. Embodiments are provided to more fully explain the inventive concept to those skilled in the art. Therefore, the forms of the components in the drawings have been exaggerated for clarity of description.

[0050] It should be understood that when an element or layer is referred to as "on another element or layer," "connected to another element or layer," "attached to another element or layer," or "covering another element or layer," it can be directly on, connected to, attached to, or cover another element or layer, or there may be intermediate elements or layers present. Conversely, when an element is referred to as "directly on another element or layer," "directly connected to another element or layer," or "directly attached to another element or layer," there are no intermediate elements or layers present. The same reference numerals refer to the same elements throughout this specification. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0051] For ease of description, spatially relative terms (e.g., "below," "under," "above," "upper," etc.) may be used herein to describe the relationship of an element or feature to other elements or features shown in the figures. It should be understood that, in addition to the orientations shown in the figures, spatially relative terms are intended to cover different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as "below" or "under" other elements or features would be oriented "above" other elements and features. Therefore, the term "below" can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein may be interpreted accordingly.

[0052] In this embodiment, a liquid processing process for treating a substrate by supplying a liquid (e.g., a cleaning liquid) onto the substrate is described as an example. However, this embodiment is not limited to a cleaning process and can be applied to various processes that use processing liquids to treat substrates, such as etching processes, ashing processes, developing processes, etc.

[0053] In the following text, reference will be made to Figures 1 to 10 The embodiments of the substrate processing apparatus 1 according to the present invention are described in detail below. The substrate processing apparatus 1 according to the embodiments of the present invention can perform a cleaning process including a supercritical drying step.

[0054] Figure 1 A substrate processing apparatus according to one embodiment of the present invention is illustrated schematically. (Reference) Figure 1 The substrate processing apparatus 1 includes a transposition module 10 and a processing module 20. According to one embodiment, the transposition module 10 and the processing module 20 are arranged along one direction. Hereinafter, the arrangement direction of the transposition module 10 and the processing module 20 is referred to as the first direction 2, the direction perpendicular to the first direction 2 when viewed from above is referred to as the second direction 4, and the direction perpendicular to the plane including the first direction 2 and the second direction 4 is defined as the third direction 6.

[0055] The transposition module 10 transfers the substrate W from the container F for storing the substrate W to the processing module 20 for processing the substrate W. The transposition module 10 receives the substrate W that has been processed in the processing module 20 and stores the substrate W in the container F. The longitudinal direction of the transposition module 10 is arranged along the second direction 4. The transposition module 10 has a loading port 120 and a transposition frame 140.

[0056] A container F for storing the substrate W is mounted on the loading port 120. The loading port 110 and the processing module 300 are arranged on two opposite sides of the indexing frame 140. Multiple loading ports 120 can be provided, and the multiple loading ports 120 can be arranged along the direction of the second direction 4. The number of loading ports 120 can be increased or decreased according to the processing efficiency and duty cycle of the processing module 20.

[0057] Multiple slots (not shown) are formed in container F to store substrate W in a horizontal arrangement relative to the ground. As container F, a sealed container, such as a front-opening standard box (FOUP), can be used. Container F can be placed on loading port 120 by a conveying device (not shown) such as an overhead conveyor, overhead transport vehicle, or automated guided vehicle, or by an operator.

[0058] An indexing track 142 and an indexing robot 144 are provided within the indexing frame 140. Within the indexing frame 140, the indexing track 141 is configured such that its longitudinal direction is along a second direction 4. The indexing robot 144 can transfer the substrate W between the indexing module 10 and the buffer unit 220. The indexing robot 144 may include an indexing hand 1440.

[0059] The substrate W can be placed on the indexing hand 1440. The indexing hand 1440 may include an indexing base 1442 having an annular hole, wherein a portion of the periphery is symmetrically cut; and an indexing support unit 1444 for moving the indexing base 1442. The configuration of the indexing hand 1440 is the same as or similar to that of the transfer hand described later. The indexing hand 1440 is configured to be movable along the indexing track 142 in the second direction 4. Therefore, the indexing hand 1440 can move back and forth along the indexing track 142. Furthermore, the indexing hand 1440 may be configured to be rotatable about a third direction 6 and movable along the third direction 6.

[0060] The processing module 20 includes a buffer unit 220, a transfer chamber 240, a liquid processing chamber 260, and a drying chamber 280. The buffer unit 220 provides space for the substrate W placed into and removed from the processing module 20 to temporarily reside. The transfer chamber 240 provides space between the buffer unit 220, the liquid processing chamber 260, and the drying chamber 280 for transferring the substrate W.

[0061] The liquid processing chamber 260 performs a liquid processing process on the substrate W by supplying liquid onto the substrate W. For example, the liquid processing process can be a cleaning process of cleaning the substrate with a cleaning solution. Chemical treatment, rinsing, and drying of the substrate can all be performed in the processing chamber. The drying chamber 280 performs a drying process to remove liquid residue from the substrate.

[0062] A buffer unit 220 may be arranged between the indexing frame 140 and the transfer chamber 240. The buffer unit 220 may be located at the end of the transfer chamber 240. A slot (not shown) is provided within the buffer unit 220, on which the substrate W is placed. Multiple slots (not shown) are spaced apart from each other along a third direction 6. The front and back sides of the buffer unit 220 are open. The front side faces the indexing module 10, and the back side faces the transfer chamber 240. The indexing robot 144 can enter the buffer unit 220 through the front side, and the transfer robot 244 (described later) can enter the buffer unit 220 through the back side.

[0063] The longitudinal direction of the transfer chamber 240 can be arranged along the first direction 2. The liquid processing chamber 260 and the drying chamber 240 can be arranged on both sides of the transfer chamber 240. The liquid processing chamber 260 and the transfer chamber 240 can be arranged along the second direction 4. The drying chamber 280 and the transfer chamber 240 can be arranged along the second direction 4.

[0064] According to one embodiment, the liquid processing chamber 260 can be arranged on both sides of the transfer chamber 240, and the drying chamber 280 can be arranged on both sides of the transfer chamber 240. The liquid processing chamber 260 can be positioned closer to the buffer unit 220 than the drying chamber 280. On one side of the transfer chamber 240, the liquid processing chamber 260 can be arranged in an A×B (A and B are natural numbers greater than 1 or 1) arrangement along the first direction 2 and the third direction 6, respectively. Furthermore, on one side of the transfer chamber 240, the drying chamber 280 can be arranged in a C×D (C and D are natural numbers greater than 1 or 1) arrangement along the first direction 2 and the third direction 6, respectively. Unlike the above, the liquid processing chamber 260 can be arranged only on one side of the transfer chamber 240, and the drying chamber 280 can be arranged only on the other side of the transfer chamber 240.

[0065] The transfer chamber 240 includes a guide rail 242 and a transfer robot 244. Within the transfer chamber 240, the guide rail 242 is configured such that its longitudinal direction is along a second direction 2. The transfer robot 242 can be configured to move linearly along the guide rail 242 in a first direction 2. The transfer robot 244 transfers the substrate W between the buffer unit 220, the liquid handling chamber 260, and the drying chamber 280.

[0066] The transfer robot 2440 includes a base 2442, a body 2444, and an arm 2446. The base 2442 is mounted to be movable along a guide rail 242 in a first direction 2. The body 2444 is coupled to the base 2442. The body 2442 is configured to be movable on the base 2442 in a third direction 6. Furthermore, the body 2444 is configured to be rotatable on the base 2442. The arm 2446 is coupled to the body 2444 and is configured to be movable back and forth relative to the body 2444. Multiple arms 2446 are provided, each individually driven. The arms 2446 are arranged stacked on top of each other and spaced apart along the third direction 6.

[0067] The liquid processing chamber 260 performs a liquid processing process on the substrate W. For example, the liquid processing chamber 260 may be a chamber that performs a cleaning process by supplying a cleaning solution to the substrate W. In contrast, the liquid processing chamber 260 may be a chamber that performs a wet etching process to remove a thin film from the substrate by supplying liquid plasma.

[0068] Depending on the type of process used to process the substrate W, the liquid processing chambers 260 may have different structures. Alternatively, each liquid processing chamber 260 may have the same structure. Selectively, the liquid processing chambers 260 may be divided into multiple groups, with one group consisting of liquid processing chambers 260 that perform either a cleaning process or a wet etching process, and another group consisting of liquid processing chambers 260 that perform either a cleaning process or a wet etching process.

[0069] In the following embodiments of the present invention, a liquid processing process for processing substrate W by supplying liquid from liquid processing chamber 260 to substrate W will be described as an example.

[0070] Figure 2 schematically shown Figure 1 An embodiment of the liquid handling chamber 260. (See reference) Figure 2 The liquid handling chamber 260 includes a housing 2610, a handling container 2620, a support unit 2630, a lifting / lowering unit 2640, a liquid supply unit 2650, a discharge unit 2660, and an airflow supply unit 2680.

[0071] The housing 2610 has a space therein. The housing 2610 is generally in the form of a cuboid. The processing container 2620, the support unit 2630 and the liquid supply unit 2640 are arranged inside the housing 2610.

[0072] The processing container 2620 has a processing space with an open top. Liquid processing is performed on the substrate W within the processing space. A support unit 2630 supports and rotates the substrate W within the processing space. A liquid supply unit 2640 supplies liquid to the substrate W supported by the support unit 2620. Multiple types of liquids can be provided and supplied sequentially to the substrate W.

[0073] According to one embodiment, the processing container 2620 has a guide wall 2621 and a plurality of recovery containers 2623, 2625, and 2627. The recovery containers 2623, 2625, and 2627 each separate and recover different liquids from the liquid used for substrate processing. Each of the recovery containers 2623, 2625, and 2627 has a recovery space for recovering the liquid used for substrate processing. The guide wall 2621 and the respective recovery containers 2623, 2625, and 2627 are arranged in the form of an annular hole surrounding the support unit 2630. When the liquid processing process is performed, liquid spilled by the rotation of the substrate W is introduced into the recovery space through the inlets 2623a, 2625a, and 2627a of the recovery containers 2623, 2625, and 2627, which will be described later. Different types of processing liquids can flow into the respective recovery containers.

[0074] According to one embodiment, the processing container 2620 has a guide wall 2621, a first recycling container 2623, a second recycling container 2625, and a third recycling container 2627. The guide wall 2622 is arranged in the form of an annular hole surrounding the support unit 2630, and the first recycling container 2623 is arranged in the form of an annular hole surrounding the guide wall 2621. The second recycling container 2625 is arranged in the form of an annular hole surrounding the first recycling container 2623, and the third recycling container 2627 is arranged in the form of an annular hole surrounding the second recycling container 2625. The space between the first recycling container 2623 and the guide wall 2621 serves as a first inlet 2623a for introducing liquid. The space between the first recycling container 2623 and the second recycling container 2625 serves as a second inlet 2625a for introducing liquid. The space between the second recycling container 2625 and the third recycling container 2627 serves as a third inlet 2627a for introducing liquid. The second inlet 2625a is located above the first inlet 2623a, and the third inlet 2627a may be located above the second inlet 2625a.

[0075] The space between the bottom end of the guide wall 2621 and the first recycling container 2623 serves as a first outlet 2623b, through which fumes and gaseous gases generated by the liquid are discharged. The space between the bottom end of the first recycling container 2623 and the second recycling container 2625 serves as a second outlet 2625b, through which fumes and gaseous gases generated by the liquid are discharged. The space between the bottom end of the second recycling container 2625 and the third recycling container 2627 serves as a third outlet 2627b, through which fumes and gaseous gases generated by the liquid are discharged. The fumes and gaseous gases discharged from the first outlet 2623b, the second outlet 2625b, and the third outlet 2627b are discharged through the discharge unit 2650, which will be described later.

[0076] A recycling line (not shown) extending vertically along the bottom of the bottom surface is connected to each recycling container 2623, 2625, 2627.

[0077] The support unit 2630 includes a rotary chuck 2631, a support pin 2633, a chuck pin 2635, a rotation shaft 2637, and a drive component 2639. The rotary chuck 2631 has a top surface that is generally circular when viewed from above. The diameter of the top surface of the rotary chuck 2631 may be larger than the diameter of the substrate W.

[0078] Multiple support pins 2633 may be provided. The support pins 2633 are arranged on the edge portion of the top surface of the rotary chuck 2631, spaced apart from each other at predetermined intervals to define annular holes, and protrude upward from the rotary chuck 2631. The support pins 2633 support the edge of the rear surface of the substrate W, such that the substrate W is spaced apart from the top surface of the rotary chuck 2631 by a predetermined distance.

[0079] Multiple chuck pins 2635 may be provided. The chuck pins 2635 are arranged further from the center of the rotary chuck 2631 than the support pins 2633. The chuck pins 2635 protrude from the top surface of the rotary chuck 2631. The chuck pins 2635 support the sides of the substrate W, thereby preventing the substrate W from moving laterally or wobbling when it rotates. The chuck pins 2635 are movable between a standby position and a support position along the radial direction of the rotary chuck 2631. The standby position is the position furthest from the center of the rotary chuck 2631 relative to the support position. When the substrate W is loaded onto or unloaded from the support unit 2630, the chuck pins 2635 are positioned in the standby position; when a process is performed on the substrate W, the chuck pins 2635 are in the support position to support the substrate W and prevent lateral movement or wobbling of the substrate W. In the support position, the chuck pins 2635 are in contact with the sides of the substrate W.

[0080] Rotating shaft 2637 is connected to rotating chuck 2631. Rotating shaft 2627 can be connected to the bottom surface of rotating chuck 2631. Rotating shaft 2637 is configured to rotate by receiving power from drive member 2639. Drive member 2638 rotates rotating shaft 2637, thereby rotating rotating chuck 2631. Drive member 2639 can change the rotational speed of rotating shaft 2637. Drive member 2629 can be a motor providing driving force. However, the inventive concept is not limited thereto, and drive member 2639 can be modified in various ways to use known devices that provide driving force.

[0081] Liquid supply unit 2640 supplies liquid to substrate W supported by support unit 2630. Multiple liquid supply units 2640 are provided, each supplying a different type of liquid. According to one embodiment, liquid supply unit 2640 includes a first liquid supply member 2642 and a second liquid supply member (not shown).

[0082] The first liquid supply component 2642 includes a support shaft 2642a, a support arm 2642b, an arm actuator 2642c, and a nozzle 2642d. The support shaft 2642a is arranged near the side wall of the processing container 2620. The support shaft 2642a has a vertically extending rod shape. The support shaft 2642a is configured to be rotatable by the arm actuator 2642c. The support arm 2642b is connected to the top end of the support shaft 2642a. The support arm 2642b extends horizontally from the support shaft 2642a. The nozzle 2642d is fixedly connected to the end of the support arm 2642b. When the support shaft 2642a rotates, the nozzle 2642d can swing together with the support arm 2642b. The nozzle 2642d can swing to a process position and a standby position. Here, the process position is the position where the nozzle 2642d faces the substrate W supported by the support unit 2630, and the standby position is the position where the nozzle 2642d is not in the process position.

[0083] In some embodiments, the support arm 2642b may be configured to move back and forth along its longitudinal direction. When viewed from above, the nozzle 2642d may swing to coincide with the central axis of the substrate W.

[0084] A second liquid supply member (not shown) supplies a second liquid to the substrate W supported by the support unit 2630. The second liquid supply member is configured to have the same configuration as the first liquid supply member 2642. Therefore, a detailed description of the second liquid supply member will be omitted.

[0085] The first and second treatment solutions can be any of chemicals, rinsing solutions, or organic solvents. For example, chemicals may include dilute sulfuric acid peroxide (H₂SO₄), phosphoric acid (P₂O₅), hydrofluoric acid (HF), and ammonium hydroxide (NH₄OH). For example, rinsing solutions may include water or deionized water (DIW). For example, organic solvents may include alcohols, such as isopropanol (IPA).

[0086] The discharge device 2650 discharges fumes and gases generated in the processing space. The discharge device 2650 discharges fumes and gases generated during liquid processing of the substrate W. The discharge unit 2650 can be connected to the bottom surface of the processing container 2620. In one embodiment, the discharge unit 2660 can be located between the rotation axis 2637 of the support unit 2630 and the inner wall of the processing container 2630. A pressure-reducing unit (not shown) is provided at the discharge unit 2680. The pressure-reducing unit discharges fumes and gases generated during liquid processing of the substrate W from the processing space to the outside of the processing space.

[0087] Airflow supply unit 2660 supplies airflow to the interior space of housing 2610. Airflow supply unit 2660 can supply downward airflow to the interior space. Airflow supply unit 2660 can be mounted on housing 2610. Airflow supply unit 2660 can be mounted above processing container 2620 and support unit 2630. The gas supplied to the interior space of housing 2610 through airflow supply unit 2660 forms a downward airflow in the interior space. Gas byproducts generated by the processing within the processing space are discharged to the outside of housing 2610 through discharge unit 2650 via the downward airflow. Airflow supply unit 2660 can be configured as a fan filter unit.

[0088] The substrate processing apparatus 1 can use a supercritical fluid as the process fluid to perform a supercritical process for processing the substrate W. The supercritical process is performed by utilizing the properties of the supercritical fluid. Typical examples include supercritical drying and supercritical etching processes. In the following description, the supercritical process will be based on the supercritical drying process. However, since this is only for ease of description, the substrate processing apparatus 1 can perform other supercritical processes besides the supercritical drying process.

[0089] The supercritical drying process is performed by dissolving the organic solvent remaining on the circuit pattern of substrate W with a supercritical fluid to dry substrate W. Supercritical drying not only offers excellent drying efficiency but also prevents pattern tilting. Materials miscible with organic solvents can be used as supercritical fluids in the supercritical drying process. For example, supercritical carbon dioxide (scCO2) can be used as a supercritical fluid.

[0090] Figure 3 schematically shown Figure 1 One embodiment of the drying chamber. (See reference) Figure 3 In a drying chamber 280 according to one embodiment of the present invention, a process fluid can be used to remove residual processing liquid on the substrate W. Supercritical carbon dioxide (CO2) gas can be used as the process fluid. Carbon dioxide can be converted to a supercritical state by raising the temperature to 30°C or higher and maintaining the pressure at 7.4 MPa or higher. Hereinafter, carbon dioxide gas is used as an example to describe the process fluid. Furthermore, the process fluid can be converted to a supercritical state before being introduced into the processing space of the drying chamber 280, or it can be converted to a supercritical state after being introduced into the processing space of the drying chamber 280.

[0091] The drying chamber 280 includes a shell 2810, a heating unit 2820, a support unit 2830, a fluid supply unit 2840, a fluid discharge unit 2850, and a filling member 3000.

[0092] Housing 2810 provides a processing space in which supercritical processes are performed. Housing 2810 provides a processing space for processing substrate W. Housing 2810 is made of a material capable of withstanding temperatures and pressures above those of supercritical fluids. Housing 2810 may include a top housing 2812 (exemplary first housing) and a bottom housing 2814 (exemplary second housing). In one embodiment, the top housing 2812 and the bottom housing 2814 may be combined with each other to provide processing space therein. Alternatively, housing 2810 may be formed integrally without being divided into top and bottom portions, and openings (not shown) may be formed in the sidewalls, which serve as entrances for substrate W to enter and exit. Hereinafter, the case in which the top housing 2812 and the bottom housing 2814 are combined with each other to provide processing space therein is described as an example.

[0093] The top housing 2812 may be cylindrical with an open bottom. The top housing 2812 may have a space with an open bottom surface. The top wall of the top housing 2812 may be the same as the top wall of the housing 2810. Furthermore, the side walls in the top housing 2812 may be part of the side walls of the housing 2810.

[0094] A bottom housing 2814 is disposed below a top housing 2812. The bottom housing 2813 may be cylindrical with an open top. The bottom housing 2814 may have a space therein with an open top surface. The open top surface of the bottom housing 2814 may face the open bottom surface of the top housing 2812. The bottom wall of the bottom housing 2815 may be configured as the bottom wall of the housing 2810. The side walls of the bottom housing 2814 may be part of the side walls of the housing 2810.

[0095] The bottom housing 2814 may be stepped. In one embodiment, the bottom housing 2814 may have a top surface 2814a, a bottom surface 2814b, a side surface 2814c, and a recess 2816. The top surface 2814a may contact the sidewall of the top housing 2812. The bottom surface 2814b may be disposed below the top surface 2814a. The side surface 2814c connects the top surface 2814a and the bottom surface 2814b. In one embodiment, the side surface 2814c may extend vertically downward from the top surface 2814a to the bottom surface 2814b. Conversely, the side surface 2814c may be formed to slope downward, such that the height of the side surface 2814c from the top surface 2814a to the bottom surface 2814b gradually decreases. The top surface 2814a, bottom surface 2814b, side surface 2814c, and top housing 2812 may be combined with each other to provide processing space therein.

[0096] A groove 2816 can be formed in the bottom surface 2814b. The groove 2816 can be formed to have a predetermined depth. The groove 2816 can be formed by recessing from the bottom surface 2814b of the bottom housing 2814 in a direction away from the substrate W supported by the support unit 2830 (i.e., from top to bottom). For example, the groove 2816 can be formed at a second height h2, which is lower than the first height h1 from the bottom surface 2814b of the bottom housing 2814 to the bottom surface 2814d. The groove 2816 can be formed in a basically cylindrical shape.

[0097] The top housing 2812 and the bottom housing 2814 can open or seal the processing space through relative movement between them. One of the top housing 2812 or the bottom housing 2814 can be coupled to a driver 2860 for up / down movement. For example, the bottom housing 2814 can be coupled to the driver 2860 for up / down movement via the driver 2860. Therefore, the processing space of housing 2810 can be selectively sealed. In one embodiment, the processing space is opened if the bottom housing 2814 is spaced apart from the top housing 2812. In this case, the substrate W can be inserted or removed. During the process, the bottom housing 2814 can be in close contact with the top housing 2812 to isolate the processing space from the outside.

[0098] The above example illustrates the combination of the bottom housing 2814 and the actuator 2860 for movement in the up / down direction, but the inventive concept is not limited thereto. For example, the top housing 2812 may be coupled to the actuator 2860 for movement in the up / down direction. In the following description, for ease of description, the case in which the bottom housing 2814 is coupled to the actuator 2860 and moves in the up / down direction will be used as an example.

[0099] Heating unit 2820 can heat the process fluid supplied to the processing space. Heating unit 2820 can increase the temperature within the processing space. In one embodiment, heating unit 2820 can be configured as a heater. However, the inventive concept is not limited thereto, and heating unit 2820 can be converted to various known devices capable of increasing the temperature of the processing space. Because heating unit 2820 increases the temperature of the processing space, the process fluid supplied to the processing space can be converted to a supercritical state, or can be maintained in a supercritical state.

[0100] Heating unit 2820 can be embedded in housing 2810. For example, heating unit 2810 can be disposed within the wall of housing 2810. For example, heating unit 2828 can be disposed in at least one of top housing 2812 or bottom housing 2814. Heating unit 2830 can be disposed at various locations capable of increasing the temperature of the processing space.

[0101] Support unit 2830 supports substrate W within the processing space of housing 2810. Support unit 2820 can be configured to support an edge region of substrate W within the processing space. For example, support unit 2830 can be configured to support the bottom surface of an edge region of substrate W within the processing space.

[0102] The support unit 2830 may include a fixing rod 2832 and a retaining part 2834. The fixing rod 2833 may protrude downward from the bottom surface of the top housing 2812. The fixing rod 2832 may be fixedly mounted to the top housing 2812. The fixing rod 28332 may be configured such that its longitudinal direction is along the up / down direction. Multiple fixing rods 2832 are provided and may be positioned to be spaced apart from each other. When the substrate W is placed in or removed from the space surrounded by the fixing rods 2832, the fixing rods 2832 are arranged in a position that does not interfere with the substrate W.

[0103] The retaining portion 2834 can be connected to the bottom end of each fixing rod 2832. The retaining portion 2834 can extend from the bottom end of the fixing rod 2833 in a direction horizontal to the ground. In one embodiment, the retaining portion 2834 can be extended into a shape capable of supporting the bottom edge of the substrate W.

[0104] Fluid supply unit 2840 supplies process fluid to the processing space. The process fluid may include carbon dioxide (CO2). The process fluid may be supplied to the processing space in a supercritical state. Alternatively, the process fluid may be supplied to the processing space in a gaseous state and may be converted to a supercritical state within the processing space. Fluid supply unit 2840 may include a top supply port 2842 and a bottom supply port 2844.

[0105] The top supply port 2842 can supply process fluid to the processing space. The top supply port 2842 can be located in the central region of the top wall of the housing 2810. The top supply port 2842 can supply process fluid to the space corresponding to the top of the substrate W. The process fluid supplied from the top supply port 2842 can be supplied to the top surface of the substrate W.

[0106] Bottom supply port 2844 can supply process fluid to the processing space. Bottom supply port 2844 can supply process fluid to the buffer space, which will be described later. Bottom supply port 2844 can be disposed on the bottom surface of housing 2810. In one embodiment, bottom supply port 2844 can be disposed on the bottom surface 2814d of bottom housing 2814. In one embodiment, bottom supply port 2844 can be disposed at a position offset from the center of bottom surface 2814 by a predetermined distance. When viewed from above, the position of bottom supply port 2844 can overlap with the buffer space, which will be described later. In one embodiment, the center of bottom surface 2814d can be a position corresponding to the center of substrate W supported by support unit 2830. The discharge port of bottom supply port 2844 can be disposed in groove 2816. In one embodiment, the discharge port of bottom supply port 2844 can be formed on the bottom surface 2816b of groove 2816. The discharge port of bottom supply port 2844 can be disposed at a position offset from the center of bottom surface 2816b of groove 2816 by a predetermined distance. The bottom supply port 2844 can penetrate the bottom body 2814 from the bottom surface 2816b of the groove 2816 to the bottom surface 2814d of the bottom housing 2814 in the up / down direction.

[0107] Top supply port 2842 can be connected to top branch line 2843. Top branch line 2843 can branch from the end of main line 2846. The other end of main line 2846 can be connected to a fluid supply source (not shown). The fluid supply source (not shown) can store and / or supply process fluid. The fluid supply source (not shown) can be a reservoir. Bottom supply port 2844 can be connected to bottom branch line 2845. Bottom branch line 2845 can branch from the end of main line 2846.

[0108] Fluid discharge unit 2850 discharges process fluid from the processing space. Fluid discharge unit 2850 can discharge process fluid supplied to the processing space to the outside of housing 2810. Fluid discharge unit 2850 may include discharge port 2852.

[0109] Discharge port 2852 may be disposed on the bottom surface of housing 2810. In one embodiment, discharge port 2852 may be disposed on the bottom surface 2814d of bottom housing 2814. Discharge port 2862 may be arranged adjacent to bottom supply port 2844. In one embodiment, discharge port 2852 may be disposed at the center of bottom surface 2814d. Discharge outlet of discharge port 2852 may be disposed in groove 2816. In one embodiment, discharge outlet of discharge port 2852 may be formed on bottom surface 2816b of groove 2816. Discharge outlet of discharge port 2852 may be formed at the center of bottom surface 2816b of groove 2816. Discharge port 2852 may penetrate bottom body 2814 from bottom surface 2816b of groove 2816 to bottom surface 2814b of bottom housing 2814 in an up / down direction.

[0110] The diameter of the discharge port 2852 can be set to be smaller than the diameter of the bottom supply port 2844. The process fluid discharged from the discharge port 2852 may include a supercritical fluid containing dissolved organic solvents. The process fluid discharged from the discharge port 2852 may be conveyed to a regeneration device (not shown). The regeneration device (not shown) may separate the process fluid into supercritical fluid and organic solvents. Alternatively, the process fluid discharged from the discharge port 2852 may be discharged to the atmosphere through discharge line 2853.

[0111] Figure 4 It is shown schematically. Figure 3 A perspective view of an embodiment of the filling component. (Reference) Figure 3 and Figure 4 The filling member 3000 is located within the processing space. The filling member 3000 may be located below the support unit 2830. In one embodiment, the filling member 300 may be arranged in the processing space of the housing 2810 below the substrate W supported by the support unit 2820.

[0112] A buffer space facing the bottom supply port 2844 can be formed in the filling member 3000. For example, the bottom of the filling member 3000 can be recessed in an upward direction to form the buffer space. The base 3200 and protrusion 3400 of the filling member 3000, which will be described later, can be combined with each other to provide the buffer space. For example, the buffer space can be defined by the enclosure of the base 3200, the protrusion 3400, and the bottom surface 2816b of the groove 2816. Furthermore, when viewed from above, the bottom supply port 2844 can be positioned to overlap with the buffer space. The bottom supply port 2844 can be arranged below the buffer space. In one embodiment, the bottom supply port 2844 can be located between the inner surfaces of the protrusion 3400.

[0113] The filling member 3000 may include a base 3200 and a protrusion 3400. In one embodiment, the base 3200 and the protrusion 3400 may be integrally formed.

[0114] The base 3200 may be located at the top of the recess 2816. When viewed from above, the base 3200 may be configured to have an area larger than that of the recess 2816. The base 3200 may be configured as a disc shape with a predetermined thickness. The base 3200 has a top surface, a bottom surface, and a side surface. The top surface is positioned to face the bottom surface of the substrate W supported by the support unit 2830. A support pin 3202 may be formed on the top surface of the base 3200. The support pin 3202 may contact the bottom surface of the substrate W supported by the retaining portion 2834 to separate the substrate W by a predetermined distance in the upward direction. However, the inventive concept is not limited thereto, and the support pin 3202 may not contact the substrate W. The substrate W and the top surface of the base 3200 may be spaced apart from each other by a predetermined distance by the support pin 3201.

[0115] The protrusion 3400 may be located on the bottom surface of the base 3200. The protrusion 3400 may extend downward from the bottom surface of the base 3200. At least a portion of the protrusion 3400 may be inserted into the recess 2816. At least a portion of the protrusion 3400 may be disposed within the recess 2816. The top end of the protrusion 3400 may be positioned above the top end of the recess 2816, and the bottom end of the protrusion 3400 may be inserted into the recess 2816. The protrusion 2400 may be configured to be annular and generally extend in an up / down direction.

[0116] A support protrusion 3402 may be formed at the bottom end of the protrusion 3400. Multiple support protrusions 3402 may be provided. The multiple support protrusions 3402 may be spaced apart from each other circumferentially along the protrusion 3400. The support protrusions 3402 may contact the bottom surface 2816b of the groove 2816. The support protrusions 3402 may support the filling member 3000 on the bottom surface 2816b of the groove 2816. The bottom end of the protrusion 3400 may be separated from the bottom surface 2816b of the groove 2816 in an upward direction by the support protrusions 3402. Furthermore, the space between the support protrusions 3402 may be used as a channel for process fluid to flow through.

[0117] The top of the protrusion 3400 can be positioned higher than the top of the recess 2816. The height from the bottom surface 2814b of the bottom housing 2814 to the bottom surface 2814d of the bottom housing 2814 is defined as a first height h1. The height from the top of the recess 2816 to the bottom of the recess 2816 is defined as a second height h2. The height from the top of the protrusion 3400 to the bottom of the protrusion 340 is defined as a third height h3. In one embodiment, the first height h1 can be higher than the second height h2 and the third height h3, and the third height h3 can be higher than the second height h2.

[0118] Therefore, the protrusion 3400 of the filling member 3000 can be spaced apart from the bottom housing 2814 in the upward direction. The base 3200 can be spaced apart from the bottom surface 2814b of the bottom housing 2814 in the upward direction. The protrusion 3400 can be spaced apart from the bottom surface 2816b of the groove 2816 in the upward direction. The space between the base 3200 and the bottom housing 2814 is configured as a channel for the flow of process fluid.

[0119] The space between the protrusion 3400 and the bottom surface 2816b of the groove 2816 is configured as a channel for the flow of process fluid.

[0120] The protrusion 3400 may be spaced apart from the inner surface of the groove 2816. The outer surface of the protrusion 3400 may also be spaced apart from the inner surface of the groove 2816. In one embodiment, the outer surface of the protrusion 3400 may be positioned at a predetermined distance from the center of the groove 2816 and from the inner surface of the groove 2816. Therefore, the filling member 3000 may be spaced apart from the groove 2816. The space between the outer surface of the protrusion 3400 and the inner surface of the groove 2816 is configured as a channel for the flow of process fluid.

[0121] In other words, a channel can be formed between the filling member 3000 and the inner wall of the housing 2810. The channel allows the process fluid introduced into the buffer space to flow in the direction of the substrate W as described below.

[0122] Figure 5 schematically shown Figure 3 The flow of process fluids in the drying chamber. In the following text, reference will be made to... Figure 5 Describe in detail the flow of process fluids in housing 2810.

[0123] Process fluid is supplied to the interior of housing 2810 from bottom supply port 2844. Bottom supply port 2844 supplies process fluid into groove 2816. Process fluid supplied to housing 2810 flows into buffer space formed by filling member 3000. Process fluid introduced into buffer space contacts bottom surface of base 3200. Process fluid in contact with bottom surface of base 3200 flows along bottom surface of base 3200 and inner surface of protrusion 3400. Thus, vortex of process fluid is formed in buffer space. Process fluid flowing in buffer space flows into space formed between bottom end of protrusion 3400 and bottom surface 2816b of groove 2816. That is, process fluid flowing in buffer space flows through first channel, which is the space between multiple support protrusions 3402 formed at bottom end of protrusion 3400. The process fluid flows through a first channel to a second channel, which is the space between the outer surface of the protrusion 3400 and the inner surface of the groove 2816. The second channel flows along the outer surface of the annular protrusion 3400 to the bottom surface of the base 3200. The process fluid that has passed through the second channel flows through a third channel, which is the space between the bottom surface of the base 3200 and the bottom surface 2814b of the bottom housing 2814. The process fluid flowing through the third channel is uniformly supplied to the processing space.

[0124] According to the embodiments of the present invention described above, the process fluid can flow uniformly within the housing 2810. The process fluid supplied from the bottom supply port 2844 can be induced to flow primarily within the buffer space formed by the filling member 3000. The process fluid primarily residing in the buffer space can be uniformly distributed throughout the processing space via the space between the filling member 3000 and the groove 2816. Therefore, the concentration of the process fluid in the processing space can be resolved.

[0125] Furthermore, asymmetrical flow of process fluid in the processing space caused by various components installed within the housing 2810, or by space constraints or structural issues, can be minimized. In one embodiment, even if the bottom supply port 2844 is eccentrically mounted at a certain distance from the central axis of the housing 2810, symmetrical flow of process fluid can be formed within the processing space. Therefore, the substrate W arranged in the processing space can be processed uniformly. Furthermore, the concentration of process fluid within the processing space can be minimized, thereby minimizing the appearance of a large number of particles in specific areas of the substrate where a relatively large amount of process fluid is supplied.

[0126] In particular, in the semiconductor field at that time, where high throughput was required, supplying process fluids to the housing 2810 at high speed would exacerbate the asymmetry of the process fluids. Accordingly, according to an embodiment of the present invention, even when the process fluids are supplied to the housing 2810 at high speed, the process fluids can be uniformly supplied to the processing space through buffer spaces and filling members.

[0127] The description of the substrate processing apparatus according to another embodiment described below is similar to the description of the substrate processing apparatus according to the above embodiments, except for additional descriptions, redundant descriptions will be omitted.

[0128] Figure 6 It is shown schematically. Figure 3 A cross-sectional perspective view of another embodiment of the filling component. (Reference) Figure 6 According to one embodiment of the present invention, a slit 3600 may be formed in the filling member 3000. A slit 3600 may be formed in the protrusion 3400. A slit 3600 may be formed on the inner surface of the protrusion 3400. The slit 3600 may be formed circumferentially along the inner surface of the protrusion 3400. In one embodiment, the slit 3600 may be configured to be spiral-shaped. However, the present invention is not limited thereto, and the slit 3600 may be configured to be transformed into various shapes.

[0129] The slit 3600 can create a relatively complex flow direction for the process fluid. Therefore, the slit 3600 can form vortices in the process fluid flowing within the buffer space. Thus, the flow rate of the process fluid through the first channel arranged in the region adjacent to the bottom supply port 2844 can be minimized. The process fluid supplied from the bottom supply port 2844 flows along the slit 3600 formed in the buffer space, thereby flowing symmetrically into the space formed between the filling member 3000 and the bottom housing 2814.

[0130] In the above embodiment, the slit 3600 is formed on the inner surface of the protrusion 3400, but the inventive concept is not limited thereto. In one embodiment, the slit 3600 may also be formed on the bottom surface of the base 3200 located above the buffer space.

[0131] Figure 7 schematically shown Figure 1 Another embodiment of the drying chamber of the substrate processing apparatus.

[0132] refer to Figure 7 According to an embodiment of the present invention, the drying chamber 280 may include a housing 2810, a heating unit 2820, a support unit 2830, a fluid supply unit 2840, a fluid discharge unit 2850, a filling member 3000, and a buffer plate 4000.

[0133] According to one embodiment of the inventive concept described below, the drying chamber 280 is configured to be in conjunction with... Figure 3 The housing 2810, heating unit 2820, support unit 2830, fluid supply unit 2840, and fluid discharge unit 2850 described herein are the same as or similar to those in the previous section. Therefore, further details regarding similar improved configurations will be omitted below.

[0134] A filling member 3000 is arranged in the processing space. The filling member 3000 may be located below the support unit 2830. In one embodiment, if the substrate W is supported by the support unit 2820, the filling member 3000 may be arranged below the substrate W. The filling member 3000 may be configured as a plate shape with a predetermined thickness. In one embodiment, the filling member 3000 may be configured as a disc shape. When viewed from above, the filling member 3000 may have an area larger than the area of ​​the recess 2816.

[0135] The filling member 3000 has a top surface, a bottom surface, and side surfaces. The top surface of the filling member 3000 is positioned to face the bottom surface of the substrate W supported by the support unit 2830. The bottom surface of the filling member 3000 is positioned to face the top surface of the buffer plate 4000, which will be described later. When viewed from above, the top surface and the bottom surface of the filling member 3000 may have corresponding areas. When viewed from above, the top surface and / or bottom surface of the filling member 3000 may be set to be larger than the area of ​​the groove 2816. The side surfaces of the filling member 3000 may be formed substantially perpendicular to the ground.

[0136] However, the present invention is not limited thereto; the top surface of the filling member 3000 may have a larger area than the bottom surface of the filling member 3000. Furthermore, the side surfaces of the filling member 300 extend from the bottom surface and slope upwards, such that the cross-sectional portion of the filling member 3000 gradually increases towards the top. When viewed from above, the bottom surface of the filling member 3000 may be configured to have an area larger than that of the groove 2816.

[0137] A support pin 3202 may be formed on the top surface of the filling member 3000. The support pin 3202 may contact the bottom surface of the substrate W supported by the holding portion 2834 to separate the substrate W by a predetermined distance in the upward direction. However, the present invention is not limited to this, and the support pin 3202 may not contact the substrate W. The top surface of the substrate W and the top surface of the filling member 3000 may be spaced apart from each other by a predetermined distance by the support pin 3201.

[0138] In addition, at least one support pin 3202 may be formed. For example, multiple support pins 3202 may be provided. The support pins 3202 may be formed in the top edge region of the base 3200. When viewed from above, the support pins 3202 may be formed to be spaced apart from each other in the circumferential direction in the top edge region of the base 3200.

[0139] A support member 3204 can be formed on the bottom surface of the filling member 3000. The support member 3204 can be positioned at a predetermined distance from the inner surface of the groove 2816, away from the center of the groove 2816. The support member 3204 can be formed downwards from the bottom surface of the filling member 3000. The filling member 3000 can be spaced upwards from the bottom surface 2814b of the bottom housing 2814 via the support member 3204. The bottom surface of the filling member 3000 can be separated from the bottom surface 2814b of the bottom housing 2814 in an upward direction. The space between them is configured as a channel for the flow of process fluid.

[0140] A buffer plate 4000 is disposed within the processing space. The buffer plate 4000 may be located below the filling member 3000. The top surface of the buffer plate 4000 may be disposed below the bottom surface of the filling member 3000. The buffer plate 4000 may be disposed in a recess 2816. In one embodiment, the buffer plate 4000 may be mounted in a bottom housing 2814, or may be integrally formed with a bottom housing 2815. When viewed from above, the buffer plate 4000 may be configured to correspond to the area of ​​the recess 2816. The buffer plate 4000 and the recess 2816 may engage with each other to provide a buffer space therein. In one embodiment, the bottom surface of the buffer plate 4000 and the inner surface of the recess 2816 may engage with each other to provide a buffer space therein.

[0141] An opening 4002 is formed in the buffer plate 4000. The opening 4002 can be formed to vertically penetrate the buffer plate 4000. The opening 4002 allows fluid communication between the processing space and the buffer space. The opening 4002 can be formed in a region including the center of the buffer plate. However, the inventive concept is not limited thereto, and the opening 4002 can be formed along the circumferential direction of the edge of the buffer plate 4000. Furthermore, a plurality of openings 4002 can be arranged along the circumferential direction of the edge of the buffer plate 4000 to be spaced apart from each other. The aforementioned bottom supply port 2844 can be located in a position that does not overlap with the opening 4002 when viewed from above. That is, the region of the buffer plate 4000 facing the process fluid supplied from the bottom supply port 2844 can be a blocking region in which no opening 4002 is formed. Furthermore, when viewed from above, the aforementioned discharge port 2852 can be located in a position that overlaps with the opening 4002.

[0142] Figure 8 schematically shown Figure 7The flow of process fluids within the drying chamber. (Refer to...) Figure 8 Describe in detail the flow of process fluid within the housing 2810.

[0143] Bottom supply port 2844 supplies process fluid into housing 2810. Bottom supply port 2844 also supplies process liquid into recess 2816. The process fluid supplied to housing 2810 flows into a buffer space formed by the bottom surface of buffer plate 4000 and the inner surface of recess 2816. The process fluid introduced into the buffer space contacts the bottom surface of buffer plate 4000. The process fluid in contact with the bottom surface of buffer plate 4000 flows along the inner surface of buffer plate 4000 and recess 2816. Thus, a vortex of process fluid is formed in the buffer space. The process fluid flowing in the buffer space flows to an opening 4002 formed in buffer plate 4000. The process fluid flows through opening 4002 into the space formed between the bottom surface of filling member 3000 and bottom surface 2814b of bottom housing 2814. The process liquid flowing into this space is uniformly supplied into the processing space.

[0144] According to the embodiments of the present invention described above, the process fluid can flow uniformly within the housing 2810. The process fluid supplied from the bottom supply port 2844 can be induced to flow primarily within the buffer space formed by the buffer plate 4000. The process fluid primarily residing in the buffer space can be uniformly distributed into the processing space through the opening 4002 and the space between the filling member 3000 and the bottom housing 2814. Therefore, the concentration of the process fluid in the processing space can be resolved.

[0145] Furthermore, asymmetrical flow of process fluid in the processing space caused by various components installed within the housing 2810, or by space constraints or structural issues, can be minimized. In one embodiment, even if the bottom supply port 2844 is eccentrically mounted at a certain distance from the central axis of the housing 2810, symmetrical flow of process fluid can be formed within the processing space. Therefore, the substrate W arranged in the processing space can be processed uniformly. Furthermore, the concentration of process fluid within the processing space can be minimized, thereby minimizing the appearance of a large number of particles in specific areas of the substrate where a relatively large amount of process fluid is supplied.

[0146] In particular, in the semiconductor field where high throughput is currently required, supplying process fluids to the housing 2810 at high speeds exacerbates the asymmetry of the process fluids. Accordingly, according to an embodiment of the present invention, even when process fluids are supplied to the housing 2810 at high speeds, the process fluids can be uniformly supplied to the processing space through buffer spaces and filling members.

[0147] Figure 9 schematically shown Figure 1 Another embodiment of the drying chamber of the substrate processing apparatus. (See reference...) Figure 9 The drying chamber 280 described below according to the embodiment of the present invention is configured in a manner largely similar to that of the reference. Figure 7 The drying chambers 280 described in the embodiments of the inventive concept are similar to each other, except for the buffer plate 4000. Hereinafter, the buffer plate 4000 according to one embodiment of the inventive concept will be described in detail.

[0148] A buffer plate 4000 is arranged within the processing space. The buffer plate 4000 may be located below the filling member 3000. The buffer plate 4000 includes a main body 4200 and support legs 4400.

[0149] The top surface of the main body 4200 can be disposed below the bottom surface of the filling member 3000. The top surface of the main body 4200 and the bottom surface of the filling member 3000 can be spaced apart from each other. The main body 4200 can be located at the top of the groove 2816. The main body 4200 can be configured to correspond to the area of ​​the groove 2816 when viewed from above. The main body 4200 can be configured to be substantially disc-shaped. The support leg 4400 can be disposed on the bottom surface of the main body 4200.

[0150] The support leg 4400 extends downward from the bottom surface of the main body 4200. The support leg 4400 can be disposed within the groove 2816. The support leg 4400 can be configured to be substantially annular. A support protrusion 4402 can be formed at the bottom end of the support leg 4400. Multiple support protrusions 442 can be provided. The multiple support protrusions 4402 can be configured to be spaced apart from each other along the circumference of the support leg 4400. The support protrusions 442 can contact the bottom surface 2816b of the groove 2816. The support protrusions 4402 can support the buffer plate 4000 on the bottom surface 2816b of the groove 2816. The bottom end of the support leg 4400 can be spaced upward from the bottom surface 2816b of the groove 2816 via the support protrusions 4402. This space can be used as a first channel for the flow of process fluid.

[0151] The support leg 4400 can be positioned spaced apart from the inner surface of the recess 2816. The outer surface of the support leg 4400 can also be spaced apart from the inner surface of the recess 2816. In one embodiment, the outer surface of the support leg 4400 can be positioned at a predetermined distance from the inner surface of the recess 2816, towards the center of the recess 2816. This space can be used as a second channel for process fluid to flow through.

[0152] A buffer plate 4000 can provide a buffer space therein. The main body 4200 and the support leg 4400 can be joined together to provide a buffer space therein. In one embodiment, the space surrounded by the protrusion 4400 at the bottom end of the main body 4200 can be a buffer space. The aforementioned bottom supply port 2844 can be positioned to overlap with the buffer space. The bottom supply port 2844 can be arranged below the buffer space. In one embodiment, the bottom supply port 2844 can be located between the inner surfaces of the protrusion 3400.

[0153] An opening 4002 is formed on the top surface of the main body 4200. The opening 4002 may be formed to vertically penetrate the main body 4200. The opening 4002 may be formed in the edge region of the main body 4200. In one embodiment, the opening 4002 may be formed between the outer surface of the leg portion 4400 and the inner surface of the groove 2816 of the bottom housing 2814. The opening 4002 may be formed along the circumferential direction of the main body 4200. However, the invention is not limited thereto, and a plurality of openings 4002 may be arranged along the circumferential direction of the edge of the main body 4200 to be spaced apart from each other.

[0154] Figure 10 schematically shown Figure 9 The flow of process fluids in the drying chamber. (Refer to...) Figure 10 Describe in detail the flow of process fluid within the housing 2810.

[0155] Bottom supply port 2844 supplies process fluid into housing 2810. Bottom supply port 2844 also supplies process liquid into groove 2816. The process fluid supplied to housing 2810 contacts the bottom surface of main body 4200. The process fluid in contact with the bottom surface of main body 4200 flows along the bottom surface of main body 4200 and the inner surface of support leg 4400. Thus, a vortex of process fluid is formed in the buffer space. The process fluid flowing in the buffer space flows into the space formed between the bottom end of support leg 4400 and the bottom surface 2816b of groove 2816. That is, the process liquid flowing in the buffer space flows through a first channel, which is the space between a plurality of support protrusions 4402 formed at the bottom end of support leg 4400. The process fluid flows through the first channel to a second channel, which is the space between the outer surface of support leg 4400 and the inner surface of groove 2816. The second channel flows along the outer surface of the annular support leg 440 to the opening 4002 in the main body 4200. The process fluid that has passed through the opening 4002 flows through the third channel, which is the space between the bottom surface of the main body 4200 and the bottom surface 2814b of the bottom housing 2814. The process fluid flowing through the third channel is uniformly supplied to the processing space.

[0156] According to the embodiments of the present invention described above, the process fluid can flow uniformly within the housing 2810. The process fluid supplied from the bottom supply port 2844 can be induced to flow primarily within the buffer space formed by the buffer plate 4000. The process fluid primarily residing in the buffer space can be uniformly distributed within the processing space through channels formed between the bottom end of the support leg 4400 and the bottom surface 2816b of the groove 2816, channels formed between the outer surface of the support leg 4000 and the inner surface of the groove 2816, and openings 4002 formed in the main body 4200. Therefore, the concentration of the process fluid within the processing space can be resolved.

[0157] Furthermore, asymmetrical flow of process fluid in the processing space caused by various components installed within the housing 2810, or by space constraints or structural issues, can be minimized. In one embodiment, even if the bottom supply port 2844 is eccentrically mounted at a certain distance from the central axis of the housing 2810, symmetrical flow of process fluid can be formed within the processing space. Therefore, the substrate W arranged in the processing space can be processed uniformly. Furthermore, the concentration of process fluid within the processing space can be minimized, thereby minimizing the appearance of a large number of particles in specific areas of the substrate where a relatively large amount of process fluid is supplied.

[0158] In particular, in the semiconductor field where high throughput is currently required, supplying process fluids to the housing 2810 at high speeds exacerbates the asymmetry of the process fluids. Accordingly, according to an embodiment of the present invention, even when process fluids are supplied to the housing 2810 at high speeds, the process fluids can be uniformly supplied to the processing space through buffer spaces and filling members.

[0159] In the above example, as an example, a filling member 3000 is arranged above the buffer plate 4000, but it is not limited to this. For example, such as Figure 11 and Figure 12 As shown, the filling member 3000 is omitted, and only a buffer plate 4000 is placed in the processing space. The buffer plate 4000 can be combined with the bottom housing 2814 to provide a buffer space. Furthermore, when viewed from above, the opening 4002 of the buffer plate 4000 does not need to overlap with the bottom supply port 2844. That is, the area of ​​the buffer plate 4000 facing the process fluid supplied from the bottom supply port 2844 can be a blocking area. Because of the buffer plate 4000, even if the positions of the bottom supply port 2844 and the discharge port 2852 are changed, the process fluid can be centrally supplied and centrally discharged, thus offering advantages in design convenience.

[0160] In the above example, the housing 2810 includes a top housing 2812 and a bottom housing 2814, but the inventive concept is not limited thereto. For example, as... Figure 13 As shown, the drying chamber 300 according to another embodiment may include a housing 310, a first supply port 320, a second supply port 330, an exhaust port 340, a first buffer plate 4000a, and a second buffer plate 4000b.

[0161] The housing 310 may include a first housing 312 and a second housing 314. The first housing 312 and the second housing 314 may be combined with each other to form a processing space 311. The first housing 312 may have a cylindrical shape with open sides. The second housing 314 may be configured to move in a lateral direction. The second housing 314 may selectively shield the processing space 311. A support member 316 for supporting the substrate W may be mounted in the second housing 314. The support member 316 is mounted in the second housing 314 and may be inserted into or removed from the processing space 311 when the second housing 314 moves. Flow holes 318 may be formed in the support member 316 to facilitate the flow of process fluid in a supercritical state.

[0162] A first groove 312a and a second groove 314b can be formed in the first housing 312. The first groove 312a can be formed on the bottom surface of the first housing 312. The first groove 312a can be combined with the first buffer plate 4000a to form a first buffer space. Furthermore, the second groove 312b can be formed on the side surface of the first housing 312. The second groove 312b can be combined with the second buffer plate 4000b to form a second buffer space. A first opening 4002a can be formed in the first buffer plate 4000a for fluid communication between the first buffer space and the processing space 311. Furthermore, a second opening 4002b can be formed in the second buffer plate 4000b for fluid communication between the second buffer space and the processing space 311.

[0163] although Figure 13 As an example, a buffer plate is shown disposed on the housing 310, but the inventive concept is not limited thereto. For example, as Figure 14 As shown, a filling member 3000a can be provided in the processing space 311 of the housing 310. A buffer space can be formed in the filling member 3000a. Since the structure of the filling member 3000a is the same as or similar to the structure of the filling member 3000 described above, a repeated description of it will be omitted.

[0164] The effects of this invention are not limited to those described above. Those skilled in the art can clearly understand the effects not mentioned based on the specification and drawings.

[0165] Although preferred embodiments of the present invention have been described and illustrated to date, the present invention is not limited to the specific embodiments described above. It should be noted that those skilled in the art to which the present invention pertains may implement the present invention differently without departing from the essence of the present invention as claimed in the claims, and such modifications should not be construed as unrelated to the technical spirit or prospects of the present invention.

Claims

1. A substrate processing apparatus, comprising: A housing for providing processing space for processing a substrate therein; A support unit is used to support the substrate in the processing space; A bottom supply port for supplying process fluids to the processing space; and A filling member is located below the substrate supported on the support unit within the processing space. The filling member forms a buffer space facing the bottom supply port, and, A channel is formed between the filling member and the inner wall of the housing, the channel allowing the process fluid introduced into the buffer space to flow along the direction of the substrate. The filling member includes: Base; and A protrusion extending downward from the bottom surface of the base, and having a plurality of spaced-apart support protrusions formed at the bottom end of the protrusion. A slit with a spiral shape is formed along the inner surface of the protrusion that defines the buffer space.

2. The substrate processing apparatus of claim 1, wherein the bottom supply port is positioned to overlap with the buffer space when viewed from above.

3. The substrate processing apparatus according to claim 1, wherein the housing comprises a top housing and a bottom housing. The bottom housing forms a recess with an open top, and, At least a portion of the filling member is inserted into the groove.

4. The substrate processing apparatus according to claim 2, wherein the base is configured to be spaced apart from the inner wall of the housing.

5. The substrate processing apparatus according to claim 1, wherein at least one support pin is formed at the top surface of the base to space the substrate from the support unit by a predetermined distance by contacting the bottom surface of the substrate placed on the support unit.

6. The substrate processing apparatus according to claim 3, At least a portion of the protrusion is inserted into the groove, and The base is located above the groove and is configured to be larger than the area of ​​the groove when viewed from above.

7. The substrate processing apparatus of claim 6, wherein the support protrusion spacees the bottom end of the protrusion from the bottom surface defining the groove, and the top end of the support protrusion is positioned higher than the top end of the groove, and, The space between the support protrusions is configured as the channel.

8. The substrate processing apparatus according to any one of claims 1-7, wherein the process fluid is a supercritical fluid.

9. A substrate processing apparatus, comprising: A housing for providing processing space for processing a substrate therein; A support unit is used to support the substrate in the processing space; A supply port for supplying process fluids to the processing space; A buffer plate, which forms a buffer space by being connected to a groove formed in the housing, and has an opening for communicating the processing space with the buffer space; and A filling member is located below the substrate supported on the support unit in the processing space and above the buffer plate.

10. The substrate processing apparatus of claim 9, wherein the housing comprises a first housing and a second housing, and the second housing has the groove formed recessed in a direction away from the substrate supported on the support unit.

11. The substrate processing apparatus of claim 10, wherein the buffer plate is located at the groove, and the region of the buffer plate facing the process fluid supplied from the supply port is a blocking region.

12. The substrate processing apparatus of claim 11, wherein the filling member, when viewed from above, is configured to have an area larger than that of the groove.

13. The substrate processing apparatus according to claim 12, wherein the bottom surface of the filling member is configured to be higher than the top surface of the buffer plate.

14. The substrate processing apparatus according to any one of claims 9-13, wherein the process fluid is a supercritical fluid.

15. A substrate processing apparatus, comprising: A housing that provides a processing space for processing a substrate therein, and includes a top housing and a bottom housing, the bottom housing having a recess with an open top; A support unit is provided for supporting the substrate in the processing space; A top supply port for supplying process fluid from above the processing space; A bottom supply port for supplying the process fluid from below or to the side of the processing space; and A filling member is located below the substrate supported on the support unit within the processing space, and The filling member has a buffer space formed facing the bottom supply port, and a channel is formed between the filling member and the inner wall of the housing, the channel allowing the process fluid introduced into the buffer space through the bottom supply port to flow along the direction of the substrate. The filling member includes: Base; and A protrusion extending downward from the bottom surface of the base, and having a plurality of spaced-apart support protrusions formed at the bottom end of the protrusion. A slit with a spiral shape is formed along the inner surface of the protrusion that defines the buffer space.

16. The substrate processing apparatus according to claim 15, The base is located above the groove and, when viewed from above, is larger than the area of ​​the groove. The protrusion is located within the groove and is spaced apart from the side surface of the groove toward the center of the groove.

17. The substrate processing apparatus according to claim 16, wherein the bottom end of the protrusion is spaced apart from the bottom surface of the groove in an upward direction, and, The top of the protrusion is positioned higher than the top of the groove.

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