Method for manufacturing a joint body

Abstract

The bonding process in the manufacturing method of the bonded body includes: a first bonding process, irradiating the sealing material (6) belonging to the inner group (IG) with a laser (L) to form a sealing layer (4); and a second bonding process, after the first bonding process, irradiating the sealing material (6) belonging to the outer group (OG) with a laser (L) to form a sealing layer (4).

Description

Technical Field

[0001] The present invention relates to a method for producing a bonded structure by bonding substrates. Background Art

[0002] As is well known, LED elements and other electronic components are housed in an airtight package to prevent degradation. The airtight package is formed as a bonded body in which a second substrate (glass substrate) is bonded to a first substrate (base material).

[0003] For example, Patent Document 1 discloses a method for manufacturing an airtight package, which comprises preparing a plurality of containers as a first substrate and a plurality of glass covers as a second substrate, placing a glass frit as a sealing material between the containers and the glass covers, irradiating the glass frit with a laser to form a sealing layer, and bonding the containers and the glass covers.

[0004] In this manufacturing method, a container and a glass cover are first stacked and held by a first jig and a second jig. The second jig includes a plunger for pressing the container against the glass cover. While the container is pressed against the glass cover by the plunger of the second jig, a laser is irradiated onto the glass frit interposed between them, thereby producing an airtight package in which the container and the glass cover are hermetically sealed.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2018-199600 Summary of the Invention

[0008] Problems to be solved by the invention

[0009] In the above-mentioned manufacturing method, a plurality of stacked bodies formed by overlapping a plurality of containers and a plurality of glass covers are held by a first clamp and a second clamp, and each stacked body is joined separately. In order to efficiently mass-produce airtight packages, for example, the following method is considered: a first substrate from which a plurality of containers can be cut out, and a second substrate from which a plurality of glass covers can be cut out are prepared. After joining the first substrate and the second substrate, the joined body is cut into individual airtight packages.

[0010] In this case, a plurality of sealing materials are interposed between the first substrate and the second substrate, and each sealing material is sequentially irradiated with laser light. Figure 12 This shows an example in which the sealing materials 6 arranged in a predetermined arrangement pattern in the laminated body LM are heated in the order of arrows indicated by reference numeral B.

[0011] The laminate LM has sealing materials 6 arranged in nine rows (M1 to M9) and nine columns (N1 to N9). In this example, the laser heating is started from the outermost sealing material 6 among the plurality of sealing materials 6. That is, Figure 12 After heating the sealing material 6 located in the first row M1 and the first column N1, the remaining sealing materials 6 arranged in the first row M1 are heated sequentially from the second column N2 to the ninth column N9. The sealing materials 6 arranged in the second row M2 are then heated sequentially, starting from the outermost sealing material 6 (the first column N1). The sealing materials 6 arranged in the third row M3 to the ninth row M9 are heated in the same manner. By heating all the sealing materials 6, the bonded body is completed.

[0012] The sealing material shrinks when heated by laser. The inventors discovered that, when manufacturing a bonded structure as described above, this shrinkage during the heating of multiple sealing materials causes a difference in the distance between the already bonded first and second substrates and the unbonded first and second substrates, resulting in displacement between the sealing material and the substrates. It was found that when this displacement increases, defects in the bonded areas caused by the sealing material occur.

[0013] The present invention has been made in view of the above circumstances, and a technical object of the present invention is to reduce the occurrence of defects in a joined portion of a joined body.

[0014] Means used to solve problems

[0015] The present invention, which is intended to solve the above-mentioned problems, relates to a method for manufacturing a bonded body, characterized in that the method manufactures a bonded body comprising a first substrate, a second substrate, and a plurality of sealing layers bonding the first substrate to the second substrate, the method comprising: a lamination step of forming a bonded body by interposing a plurality of sealing materials between the first substrate and the second substrate and overlapping the first substrate and the second substrate; and a bonding step of forming the plurality of sealing layers by irradiating the plurality of sealing materials in the bonded body with laser light, wherein the plurality of sealing materials in the bonded body are interposed between the first substrate and the second substrate in a predetermined arrangement pattern, the arrangement pattern comprising an outer group to which the outermost sealing materials of the plurality of sealing materials belong and an inner group to which the sealing materials located further inward than the sealing materials belonging to the outer group belong, the bonding step comprising: a first bonding step of forming the sealing layers by irradiating the sealing materials belonging to the inner group with laser light; and a second bonding step of forming the sealing layers by irradiating the sealing materials belonging to the outer group with laser light after the first bonding step.

[0016] According to this method, in the first bonding step, laser irradiation is performed on the sealing material belonging to the inner group before the sealing material belonging to the outer group. This reduces displacement of the substrates caused by shrinkage of the sealing material during the first bonding step. Furthermore, in the second bonding step following the first bonding step, the sealing material belonging to the outer group can be heated without being affected by the shrinkage of the sealing layer formed in the inner group. This reduces the risk of poor bonding in either the inner or outer group sealing layers.

[0017] In this method, it is preferable that, in the first bonding step, the laser beam is first irradiated onto the sealing material located closest to the center of the arrangement pattern among the sealing materials belonging to the inner group.

[0018] In this manner, by starting the first bonding step (laser irradiation) from the sealing material closest to the center of the arrangement pattern, displacement of the substrates can be appropriately reduced even when heating other sealing materials thereafter.

[0019] In this method, the arrangement pattern may be such that the plurality of sealing materials are arranged in three or more rows and three or more columns.

[0020] In this method, the second substrate may be a glass substrate.

[0021] In the bonding step of the present method, the stacked body may be supported by a supporting device that presses the first substrate and the second substrate. This allows the sealing material to adhere closely to the first and second substrates, and can more effectively reduce bonding defects in the sealing layer.

[0022] Furthermore, the support device may include a pressing member that presses the first substrate against the second substrate, and a support plate disposed between the first substrate and the pressing member.

[0023] According to this configuration, the support device can press the first substrate with uniform force using the pressing member and the support plate, thereby more effectively reducing the occurrence of poor bonding of the sealing layer caused by displacement of the first and second substrates.

[0024] Effects of the Invention

[0025] According to the present invention, the occurrence of defects in the joined portion of the joined body can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a top view of the joint.

[0027] Figure 2 yes Figure 1The cross-sectional view of the II-II arrow sight line.

[0028] Figure 3 It is a bottom view of the second substrate.

[0029] Figure 4 This is a cross-sectional view showing one step of a method for manufacturing a bonded body.

[0030] Figure 5 This is a cross-sectional view showing one step of a method for manufacturing a bonded body.

[0031] Figure 6 It is a plan view showing one step of a method for manufacturing a bonded body.

[0032] Figure 7 It is a plan view showing another example of the method for producing a bonded body.

[0033] Figure 8 It is a plan view showing another example of the method for producing a bonded body.

[0034] Figure 9 It is a plan view showing another example of the method for producing a bonded body.

[0035] Figure 10 It is a plan view showing another example of the method for producing a bonded body.

[0036] Figure 11 This is a cross-sectional view showing another example of a support device used in the method for manufacturing a bonded body.

[0037] Figure 12 It is a plan view showing a method for producing a bonded body according to a comparative example. DETAILED DESCRIPTION

[0038] Hereinafter, this specific embodiment will be described with reference to the drawings. Figures 1 to 11 One embodiment of the method for producing a bonded body of the present invention will be described.

[0039] Figure 1 and Figure 2 As an example of a bonded body manufactured by the present invention, an airtight package is shown. The bonded body 1 comprises: a first substrate 2 serving as a base material, a second substrate 3 superimposed on the first substrate 2, a plurality of sealing layers 4 bonding the first substrate 2 and the second substrate 3, and an element 5 accommodated between the first substrate 2 and the second substrate 3.

[0040] The first substrate 2 is rectangular, but is not limited to this shape. Other possible shapes for the first substrate 2 include polygonal and circular shapes. The first substrate 2 includes a first principal surface 2a on which the element 5 is disposed, and a second principal surface 2b opposite the first principal surface 2a. The first principal surface 2a may include a recessed portion capable of accommodating the element 5.

[0041] The first substrate 2 is formed of a highly thermally conductive substrate, such as a silicon substrate, but is not limited thereto. It may also be formed of other metal substrates, ceramic substrates, semiconductor substrates, or other substrates. The thickness of the first substrate 2 is within the range of 0.1 to 5.0 mm, but is not limited to this range.

[0042] The thermal conductivity of the first substrate 2 may be higher than that of the second substrate 3. The thermal conductivity of the first substrate 2 at 20°C is preferably 10 to 500 W / m·K, more preferably 30 to 300 W / m·K, further preferably 70 to 250 W / m·K, and particularly preferably 100 to 200 W / m·K, but is not limited to this range.

[0043] The second substrate 3 is formed of, for example, a rectangular transparent glass substrate, but is not limited to this shape. Other shapes of the second substrate 3 include, for example, polygonal or circular. The second substrate 3 has a first principal surface 3a and a second principal surface 3b located opposite the first principal surface 3a.

[0044] Examples of glass that can be used to form the second substrate 3 include alkali-free glass, borosilicate glass, soda-lime glass, quartz glass, and crystallized glass with a low thermal expansion coefficient. The thickness of the second substrate 3 is not particularly limited; for example, a thickness in the range of 0.01 to 2.0 mm can be used. The thermal conductivity of the second substrate 3 at 20°C is preferably 0.5 to 5 W / m·K, but is not limited to this range.

[0045] The plurality of sealing layers 4 are formed in a predetermined arrangement pattern on the bonded body 1. In this embodiment, a bonded body 1 having a total of nine sealing layers 4 formed in an arrangement pattern of three rows and three columns is exemplified, but the number and arrangement pattern of the sealing layers 4 are not limited to this embodiment. Figure 1 , the arrangement pattern (row and column arrangement) of the sealing layer 4 is described as row numbers M1 to M3 and column numbers N1 to N3.

[0046] like Figure 1 As shown, the arrangement pattern of the sealing layers 4 is divided into an outer group OG to which the outermost sealing layers 4 among the plurality of sealing layers 4 belong, and an inner group IG to which the sealing layers 4 located further inward than the sealing layers 4 belonging to the outer group OG belong.

[0047] The sealing layer 4 is formed by interposing a plurality of sealing materials between the first substrate 2 and the second substrate 3 , and irradiating the sealing materials with laser light to soften and flow by heating.

[0048] As sealing material, various materials can be used. Among them, from the viewpoint of improving sealing strength, it is preferred to use a composite material (glass frit) comprising bismuth-based glass powder and refractory filler powder. Generally speaking, the thermal expansion coefficient of bismuth-based glass is large. Therefore, if mixed with refractory filler powder, the thermal expansion coefficient of the sealing layer 4 is easily matched with the thermal expansion coefficient of the first substrate 2 and the second substrate 3. As a result, after the first substrate 2 is bonded to the second substrate 3, it is not easy to occur in the situation where improper stress remains in the region of the sealing layer 4.

[0049] If the proportion of refractory filler powder in the composite material is too low, as mentioned above, the thermal expansion coefficient of the sealing layer 4 becomes difficult to match with that of the first and second substrates 2 and 3. Furthermore, the viscosity of the glass frit decreases significantly during bonding, resulting in a difference in the gap between the already bonded first and second substrates and the gap between the unbonded first and second substrates, which can cause displacement between the sealing material and the substrates. On the other hand, if the proportion of refractory filler powder in the composite material is too high, the content of bismuth-based glass powder decreases, resulting in a decrease in the surface smoothness of the sealing material before laser sealing, and a decrease in bonding accuracy. Therefore, as a composite material, it is preferred to use a composite material containing 55 to 100 volume% of bismuth-based glass powder and 0 to 45 volume% of refractory filler powder, it is more preferred to use a composite material containing 60 to 99 volume% of bismuth-based glass powder and 1 to 40 volume% of refractory filler powder, it is further preferred to use a composite material containing 60 to 95 volume% of bismuth-based glass powder and 5 to 40 volume% of refractory filler powder, and it is particularly preferred to use a composite material containing 60 to 85 volume% of bismuth-based glass powder and 15 to 40 volume% of refractory filler powder.

[0050] Bismuth-based glass preferably contains, in mol%, 28-60% Bi₂O₃, 15-37% B₂O₃, 0-30% ZnO, and 1-40% CuO + MnO (the combined amount of CuO and MnO). The following explains the reasons for limiting the content ranges of each component as described above. It should be noted that the percentages expressed in the glass composition ranges refer to mole percentages.

[0051] Bi2O3 is the main component used to lower the softening point of glass, and is also a component that can adjust the viscosity of glass during softening and flowing by irradiating the composite material with laser. The content of Bi2O3 is preferably 28-60%, 33-55%, and particularly 35-45%. When the content of Bi2O3 is too low, the softening point becomes too high, and the softening fluidity of the glass is easily reduced. On the other hand, when the content of Bi2O3 is too high, the viscosity of the glass during bonding is significantly reduced, and a difference occurs between the gap between the first substrate and the second substrate that have been bonded, and the gap between the first substrate and the second substrate that have not yet been bonded, which becomes a cause of displacement between the sealing material and each substrate. In addition, the glass becomes easily devitrified during bonding, and due to this devitrification, the softening fluidity is easily reduced.

[0052] B2O3 is an essential component for forming glass. The content of B2O3 is preferably 15-37%, 19-33%, and particularly 22-30%. When the content of B2O3 is too low, it is difficult to form a glass network, and therefore the glass becomes easily devitrified. In addition, the viscosity of the glass during bonding becomes low, and a difference occurs between the gap between the first and second substrates that have already been bonded and the gap between the first and second substrates that have not yet been bonded, which causes displacement between the sealing material and each substrate. On the other hand, when the content of B2O3 is too high, the viscosity of the glass becomes high, and the softening fluidity is easily reduced.

[0053] ZnO is a component that improves the devitrification resistance of glass. The ZnO content is preferably 0-30%, 3-25%, 5-22%, and particularly 5-20%. Excessive ZnO content can cause imbalance in the glass composition, which can lead to a decrease in devitrification resistance.

[0054] CuO and MnO are components that greatly improve the laser absorption ability of glass. The combined amount of CuO and MnO is preferably 1-40%, 3-35%, 10-30%, and especially 15-30%. When the combined amount of CuO and MnO is too small, the laser absorption ability is likely to decrease. On the other hand, when the combined amount of CuO and MnO is too high, the softening point becomes too high, and even if irradiated with laser, it is difficult for the glass to soften and flow. Moreover, the glass becomes thermally unstable and easily loses transparency. It should be noted that the CuO content is preferably 1-30%, especially 10-25%. The MnO content is preferably 0-25%, 1-25%, and especially 3-15%.

[0055] Furthermore, not only bismuth-based glass but also glass powders such as silver phosphate glass and tellurium-based glass can be used as sealing materials. Compared to bismuth-based glass, silver phosphate glass and tellurium-based glass soften and flow more easily at low temperatures, reducing the thermal strain generated by laser heating. Furthermore, similar to bismuth-based glass, silver phosphate glass and tellurium-based glass can be mixed with refractory filler powder to improve the mechanical strength of sealing layer 4 and reduce its thermal expansion coefficient.

[0056] The silver phosphate-based glass preferably contains, in mol%, 10 to 50% of Ag2O, 10 to 35% of P2O5, 3 to 25% of ZnO, and 0 to 30% of a transition metal oxide as a glass composition.

[0057] The tellurium-based glass preferably contains, in mol%, 30 to 80% of TeO2, 5 to 50% of MoO3, 0 to 15% of P2O5, and 0 to 40% of a transition metal oxide (excluding MoO3) as a glass composition.

[0058] As the refractory filler powder, various materials can be used, among which it is preferably composed of one or more materials selected from cordierite, zircon, tin oxide, niobium oxide, zirconium phosphate ceramics, willemite, β-eucryptite, and β-quartz solid solution.

[0059] Average particle size D of refractory filler powder 50 The average particle size D of the refractory filler powder is preferably less than 2 μm, particularly not less than 0.1 μm and less than 1.5 μm. 50 If the average particle size D is too large, the surface smoothness of the sealing layer 4 is likely to be reduced, and the average thickness of the sealing layer 4 is likely to be increased, resulting in a decrease in the bonding accuracy. 50 This is a value measured by laser diffraction, and refers to the particle size at which the cumulative amount from the smallest particle reaches 50% on a volume-based cumulative particle size distribution curve when measured by laser diffraction.

[0060] 99% particle size D of refractory filler powder 99 The 99% particle size D of the refractory filler powder is preferably less than 5 μm, 4 μm or less, and particularly 0.3 μm or more and 3 μm or less. 99 If the diameter is too large, the surface smoothness of the sealing layer 4 is likely to be reduced, and the average thickness of the sealing layer 4 is likely to be increased, resulting in a decrease in the accuracy of laser bonding. 99 This is a value measured by laser diffraction, and refers to the particle size at which the cumulative amount from the smallest particle reaches 99% on a volume-based cumulative particle size distribution curve when measured by laser diffraction.

[0061] The softening point of the sealing material is preferably 300° C. to 550° C. The softening point of the sealing material corresponds to the fourth inflection point when measured using a Macro DTA apparatus.

[0062] like Figure 1 As shown, the sealing layer 4 is formed in a closed curve shape so as to connect the space of the accommodating element 5. In the present invention, the term "closed curve" includes not only shapes consisting of a curve alone, but also shapes consisting of a combination of a curve and a straight line, and shapes consisting of only straight lines (for example, a square or other polygonal shapes).

[0063] The thickness of the sealing layer 4 is preferably 1 μm to 20 μm, more preferably 3 to 8 μm. The width W1 of the sealing layer 4 is preferably 50 to 2000 μm, more preferably 100 to 1000 μm.

[0064] The element 5 is mounted on the first principal surface 2a of the first substrate 2. Furthermore, the element 5 is arranged in a space (cavity) defined by the first principal surface 2a of the first substrate 2, the first principal surface 3a of the second substrate 3, and the sealing layer 4. As the element 5, various elements such as light-emitting elements such as deep ultraviolet LEDs (light emitting diodes), MEMS (micro electromechanical systems) elements, and CCD (charge coupled device) elements can be used.

[0065] Hereinafter, a method for manufacturing the above-mentioned bonded body 1 will be described with reference to Figures 3 to 6 This method includes a preparation step of overlapping the first substrate 2 and the second substrate 3 to form a laminate, and a bonding step of heating the sealing material in the laminate after the preparation step to bond the first substrate 2 and the second substrate 3 together.

[0066] In the preparation step, a plurality of sealing materials for forming a plurality of sealing layers 4 are formed on the first main surface 3 a of the second substrate 3 in an arrangement pattern including an outer group OG and an inner group IG corresponding to the arrangement pattern of the sealing layers 4 .

[0067] Figure 3 , the arrangement pattern of the nine sealing materials 6a to 6i formed on the second substrate 3 is described as row numbers M1 to M3 and column numbers N1 to N3. In the following description, the position of a specific sealing material 6 (6a to 6i) may be described using these row numbers and column numbers.

[0068] The preparation step includes a fixing step of fixing the sealing materials 6 a to 6 i to the first main surface 3 a of the second substrate 3 , and a lamination step of laminating the first substrate 2 and the second substrate 3 to form a laminate after the fixing step.

[0069] The fixing step includes a step of applying a sealing material to the first main surface 3 a of the second substrate 3 (applying step) and a step of heating the sealing material after the applying step (heating step).

[0070] In the coating process, a paste-like sealing material is applied to the first main surface 3a of the second substrate 3, for example, in a manner forming a square closed curve, using, for example, screen printing or a dispenser. The sealing material is typically formed into a paste by kneading the composite material described above with a vehicle using a three-axis roller or the like. The vehicle typically comprises an organic resin and a solvent. The organic resin is added to adjust the viscosity of the paste.

[0071] In the heating process, the sealing material applied to the second substrate 3 is heated to a temperature above the softening temperature using an electric furnace or the like. This heating process decomposes the organic resin and softens and flows the glass powder contained in the sealing material, thereby enabling the sealing material to be fixed to the first main surface 3a of the second substrate 3. In this heating process, the sealing material can also be heated (fired) by a laser instead of using an electric furnace or the like. Thus, Figure 3 As shown, nine sealing materials 6 a to 6 i are fixed to the first main surface 3 a of the second substrate 3 .

[0072] In the lamination process, by using Figure 4 The support device 8 shown in the figure overlaps the first substrate 2 and the second substrate 3 to form a laminated body LM.

[0073] The support device 8 mainly includes: a frame 9 that holds the first substrate 2 and the second substrate 3, a first support tool 10 that supports the first substrate 2, a second support tool 11 that supports the second substrate 3, a support plate 12 between the first support tool 10 and the first substrate 2, and an intermediate member 13 between the first support tool 10 and the second support tool 11.

[0074] The frame 9 is formed of a rectangular plate member having a predetermined thickness, but is not limited to this shape. The frame 9 has an opening 9 a capable of accommodating the first substrate 2 and the second substrate 3 .

[0075] The first support 10 includes a pressing member 14 for pressing the first substrate 2 via a support plate 12 , a holding plate 15 for holding the pressing member 14 , and a supporting member (hereinafter referred to as “first supporting member”) 16 for supporting the holding plate 15 .

[0076] The pressing member 14 may be composed of, for example, a plurality of plungers, but is not limited to this configuration. The plunger may be a spring member, but is not limited to this configuration. The pressing member 14 may be, for example, a pneumatic plunger. The pressing member 14 includes a rod portion 14a, which is biased by the spring member, and a main body portion 14b, which supports the rod portion 14a and the spring member.

[0077] The retaining plate 15 has a retaining hole 15a for retaining the main body 14b of the pressing member 14, and a hole 15b for inserting a fixing member 17, such as a screw member. The first supporting member 16 has an opening 16a, a screw hole 16b for inserting the fixing member 17, and a hole 16c for inserting a fixing member 18 for securing the intermediate member 13 to the first supporting member 16. The retaining plate 15 is secured to the first supporting member 16 by inserting the fixing member 17 into these holes 15b and 16b, so that the hole 15b aligns with the screw hole 16b of the first supporting member 16.

[0078] The support plate 12 is interposed between the first substrate 2 and the rod portion 14a of the pressing member 14, thereby supporting the first substrate 2. The support plate 12 preferably has an area larger than the second main surface 2b of the first substrate 2 so as to contact the second main surface 2b. The support plate 12 is formed of a metal plate other than stainless steel, but the material of the support plate 12 is not limited to this embodiment.

[0079] The second support 11 includes a support substrate 19 that supports the second substrate 3 and the frame 9 , and a support member (hereinafter referred to as a “second support member”) 20 that supports the support substrate 19 .

[0080] The support substrate 19 is made of, for example, a transparent glass substrate to allow the laser beam to pass through during the bonding process. The second support member 20 has a recess 20a for receiving the support substrate 19, an opening 20b for allowing the laser beam to pass through, and a hole 20c for inserting the fixing member 21 therethrough.

[0081] The intermediate member 13 is formed of a rectangular plate member of a predetermined thickness, but is not limited to this shape. The intermediate member 13 has an opening 13a that accommodates the support base plate 19 and frame 9 of the second support member 11, and screw holes 13b that engage with the fixing members 18 and 21. The opening 13a extends through the thickness of the intermediate member 13. Furthermore, the screw holes 13b extend through the thickness of the intermediate member 13.

[0082] like Figure 4 As shown, in the lamination process, first, the first substrate 2 and the second substrate 3 are overlapped so that the first principal surface 2a of the first substrate 2 faces the first principal surface 3a of the second substrate 3. It should be noted that the element 5 is previously provided on the first principal surface 2a of the first substrate 2.

[0083] Then, the first substrate 2 and the second substrate 3 are inserted into the opening 9a of the frame 9. Thus, the frame 9 holds the first substrate 2 and the second substrate 3. The intermediate member 13 is fixed to the second support member 20 of the second support tool 11 by the fixing member 21.

[0084] Next, the frame 9 is inserted into the recess 20a of the second support member 20 of the second support tool 11. As a result, the frame 9 and the second substrate 3 are supported by the support substrate 19. The support plate 12 is then inserted into the recess 20a of the second support member 20. As a result, the support plate 12 comes into contact with the second main surface 2b of the first substrate 2 held by the frame 9.

[0085] Then, the first support 10 and the second support 11 are overlapped, and the fixing member 18 is inserted into the hole 16 c of the first support member 16 and the screw hole 13 b of the intermediate member 13 , thereby connecting the first support 10 and the intermediate member 13 .

[0086] In this case, the rod portion 14a of the pressing member 14 contacts the support plate 12. As a result, the support plate 12 is pressed by the rod portion 14a. The pressing force of the pressing member 14 presses the support plate 12 against the second main surface 2b of the first substrate 2, thereby pressing the first substrate 2 against the second substrate 3.

[0087] Thus, during the lamination step, the laminated body LM formed by stacking the first substrate 2 and the second substrate 3 is held between the first support 10 and the second support 11 of the support device 8. Furthermore, the support device 8 supports the laminated body LM while the sealing materials 6a to 6i interposed between the first substrate 2 and the second substrate 3 are brought into close contact with the first substrate 2 and the second substrate 3 due to the pressing force of the pressing member 14.

[0088] like Figure 5 As shown, during the bonding step, laser light L is irradiated from the laser irradiation device 7 onto the sealing materials 6a to 6i of the laminate LM, thereby heating the sealing materials 6a to 6i (heating step). The laser light L is transmitted through the support substrate 19 of the second support member 11 and the second substrate 3 and irradiates the sealing materials 6a to 6i. During the bonding step, the irradiation with the laser light L heats the sealing materials 6a to 6i to a temperature above their softening point or to a temperature at which the sealing materials 6a to 6i soften and flow.

[0089] The wavelength of the laser light L is preferably 600 to 1600 nm. As the laser light used, a semiconductor laser can be used as appropriate, but the present invention is not limited thereto, and various lasers such as a YAG laser, a green laser, and an ultrashort pulse laser can be used.

[0090] The bonding process includes a first bonding process of irradiating the sealing material 6a belonging to the inner group IG with laser light L to form the sealing layer 4; and a second bonding process of irradiating the sealing materials 6b to 6i belonging to the outer group OG with laser light L to form the sealing layer after the first bonding process.

[0091] In the first bonding step, the sealing material 6a located at a position overlapping with the center O (the position of the second row M2 and the second column N2) in the inner group IG of the arrangement pattern is irradiated with the laser light L. Figure 6 The laser light L is scanned in a circular manner along the circumferential direction of the closed curve shape of the sealing material 6a as shown by arrow A. The frequency of the laser light L in this case is preferably 2 to 500.

[0092] In the first bonding step, the glass component of the sealing material 6a softens and flows due to heating by the laser light L, thereby fusing to the first substrate 2. After the irradiation of the laser light L is completed and the sealing material 6a cools, the sealing material 6a is fixed, thereby bonding the first substrate 2 and the second substrate 3 together, and forming a closed curved sealing layer 4 that hermetically seals the element 5.

[0093] If the sealing layer 4 involving the sealing material 6a is formed, then Figure 6 The second bonding process is performed in the order indicated by arrow B.

[0094] That is, in the second bonding process, the sealing material 6b located at the position adjacent to (closest to) the sealing material 6a belonging to the inner group IG in the outer group OG of the arrangement pattern (the position of the first row M1 and the second column N2) is irradiated with laser light L. After the heating of the sealing material 6b is completed, the sealing material 6c located at the position adjacent to the sealing material 6b (the position of the first row M1 and the third column N3) is irradiated with laser light L. Then, the remaining sealing materials 6d to 6i are sequentially irradiated with laser light L. By heating all the sealing materials 6b to 6i belonging to the outer group OG, the sealing layer 4 is formed, and the second bonding process is completed. Through the above operations, a bonded body 1 having a plurality of sealing layers 4 is manufactured.

[0095] Figures 7 to 10 Another example of the bonding process is shown. Figure 6 In the example shown, a laminated body LM is shown in which nine sealing materials 6 a to 6 i are arranged in three rows and three columns. However, the number of sealing materials 6 may be larger than this example.

[0096] exist Figure 7, a total of forty-nine sealing materials 6 are arranged in seven rows (M1-M7) and seven columns (N1-N7). In this case, twenty-four sealing materials 6 belong to the outer group OG, and twenty-five sealing materials 6 belong to the inner groups IG1-IG3. In this example, the inner groups IG1-IG3 include a first inner group IG1, to which the sealing materials 6a are arranged so as to overlap with the center O of the arrangement pattern; a second inner group IG2, which is positioned outside the first inner group IG1 and surrounds it; and a third inner group IG3, which is positioned outside the second inner group IG2 and surrounds it.

[0097] In this example, when manufacturing the bonded body 1, in the first bonding step, the laser light L is first irradiated onto the single sealing material 6a in the first inner group IG1, located at a position overlapping with the center O of the arrangement pattern (the position in the fourth row M4 and the fourth column N4). After heating of this sealing material 6a is completed, the sealing material 6 belonging to the second inner group IG2 and located adjacent to the sealing material 6a in the first inner group IG1 (the position in the third row M3 and the fourth column N4) is irradiated with the laser light L. Then, the sealing material 6 located adjacent to this sealing material 6 (the position in the third row M3 and the fifth column N5) is irradiated with the laser light L. Subsequently, the remaining sealing materials 6 belonging to the second inner group IG2 are sequentially irradiated with the laser light L.

[0098] When the heating of the sealing material 6 belonging to the second inner group IG2 is completed, the sealing material 6 belonging to the third inner group IG3 is heated. In this case, the sealing material 6 heated first in the third inner group IG3 (the sealing material located in the second row M2 and the third column N3) is located adjacent to the sealing material 6 heated last in the second inner group IG2 (the sealing material located in the third row M3 and the third column N3).

[0099] The second bonding process is performed after heating of the sealing material 6 belonging to the third inner group IG3 is completed. In this case, the sealing material 6 heated first in the second bonding process (the sealing material located in the first row M1 and the second column N2) is located adjacent to the sealing material 6 heated last in the third inner group IG3 (the sealing material located in the second row M2 and the second column N2). The sealing materials 6 belonging to the outer group OG are heated sequentially, and the second bonding process ends when heating of all the sealing materials 6 is completed.

[0100] exist Figure 8In the example shown, in the first bonding process, a sealing material 6a (sealing material belonging to the first inner group IG1) located at a position overlapping with the center O of the arrangement pattern (fourth row M4, fourth column N4) is first irradiated with laser L, and then the eight sealing materials 6 (sealing materials belonging to the second inner group IG2) arranged on the outside in a manner surrounding the sealing material 6a are heated in turn by the laser L.

[0101] Then, the laser light L sequentially heats the sixteen sealing materials 6 (sealing materials belonging to the third inner group IG3 ) arranged on the outside so as to surround the eight sealing materials 6 .

[0102] In this case, the sealing material 6x heated first in the third inner group IG3 (the sealing material located at the sixth row M6 and sixth column N6) and the sealing material 6i heated last in the second inner group IG2 (the sealing material located at the third row M3 and third column N3) are not adjacent to each other but are located separately. This can reduce the difference in the spacing between the first substrate 2 and the second substrate 3.

[0103] Furthermore, the sealing material 6y heated last in the third inner group IG3 (the sealing material located at the fifth row M5 and sixth column N6) is not adjacent to the sealing material 6z heated first in the outer group OG during the second bonding process (the sealing material located at the first row M1 and first column N1), but is located separately. This can mitigate the difference in the spacing between the first substrate 2 and the second substrate 3.

[0104] Figure 9 The arrangement pattern shown is eight rows (M1 to M8) and eight columns (N1 to N8), with a total of sixty-four sealing materials 6 arranged. Figure 7 In the example of , the arrangement pattern has one sealing material 6 a overlapping with the center O thereof, but the arrangement pattern of this example has four sealing materials 6 j to 6 m at positions closest to the center O thereof.

[0105] The arrangement pattern includes: a first inner group IG1 to which the above-mentioned four sealing materials 6j~6m belong, a second inner group IG2 to which twelve sealing materials 6 are arranged on the outside in a manner surrounding the first inner group IG1, a third inner group IG3 to which twenty sealing materials 6 are arranged on the outside in a manner surrounding the second inner group IG2, and an outer group OG to which twenty-eight sealing materials 6 belong.

[0106] When there are a plurality of sealing materials 6j to 6m located closest to the center O of the arrangement pattern as in this example, in the first bonding step, any one of the sealing materials 6j may be irradiated with the laser light L first.

[0107] exist Figure 10 In the example of the arrangement pattern shown (eight rows and eight columns), the inner group is divided into four groups (first to fourth inner groups) IG1 to IG4. Each inner group IG1 to IG4 is arranged symmetrically with respect to the center O of the arrangement pattern. Each inner group IG1 to IG4 includes nine sealing materials 6.

[0108] In this case, in the first bonding step, any one sealing material 6 belonging to each inner group IG1 to IG4 may be irradiated with the laser light L. Alternatively, the sealing materials 6 belonging to each inner group IG1 to IG4 may be irradiated with the laser light L simultaneously using a plurality of laser irradiation devices 7 .

[0109] Figure 11 Another example of the support device is shown. The support plate 12 of the support device 8 in this example is constructed similarly to Figure 4 and Figure 5 The examples in are different. Figure 4 and Figure 5 The support device 8 shown in the figure includes one support plate 12 , but the support device 8 of the present embodiment includes a plurality of support plates 12 a to 12 c .

[0110] In this manner, by pressing the first substrate 2 with the plurality of support plates 12 a to 12 c , displacement of the substrates 2 and 3 caused by shrinkage of the sealing materials 6 during heating can be effectively reduced.

[0111] According to the manufacturing method of the joint body 1 of the present embodiment described above, by irradiating the sealing material 6 belonging to the inner group IG (IG1 to IG4) with laser L before the sealing material 6 belonging to the outer group OG in the first joining process, the displacement of each substrate 2 and 3 caused by the shrinkage of the sealing material 6 in the first joining process can be reduced.

[0112] Furthermore, by irradiating the sealing material 6 belonging to the outer group OG with laser light L in the second bonding step following the first bonding step, the sealing material 6 belonging to the outer group OG can be heated without being affected by the shrinkage of the sealing layer 4 formed in the inner group IG (IG1 to IG4). This reduces the occurrence of bonding defects in both the sealing layers 4 belonging to the inner group IG (IG1 to IG4) and the sealing layers 4 belonging to the outer group OG.

[0113] It should be noted that the present invention is not limited to the configuration of the above-described embodiment, nor is it limited to the above-described effects, and various modifications can be made to the present invention without departing from the spirit of the present invention.

[0114] In the above embodiment, a bonded body 1 including a plurality of sealing layers 4 arranged in three or more rows and three or more columns is exemplified, but the present invention is not limited to this configuration. For example, the present invention can also be applied to a bonded body 1 in which sealing layers 4 are arranged in two rows and three or more columns.

[0115] In this case, by allocating the sealing material 6 located in the outermost row to the outer group OG and allocating the sealing material 6 located closer to the inner group IG than the outer group OG, it is possible to manufacture a bonded body 1 without bonding defects. Similarly, the present invention can also be applied when the sealing layer 4 is formed in three or more rows and two columns on the bonded body 1.

[0116] In the above embodiment, an airtight package including the element 5 is illustrated as an example of the bonded body 1, but the present invention is not limited to this configuration. The present invention can also be applied to, for example, manufacturing a bonded body having a functional film or the like between the first substrate 2 and the second substrate 3, or manufacturing a micropump in which the second substrate 3 functions as a diaphragm.

[0117] In the above embodiment, a high thermal conductivity substrate is exemplified as the first substrate 2, but the present invention is not limited to this configuration. The first substrate 2 may be formed of a substrate other than a glass substrate.

[0118] Example

[0119] Hereinafter, examples according to the present invention will be described, but the present invention is not limited to these examples.

[0120] The present inventors conducted an experiment to confirm the effects of the present invention. In this experiment, a plurality of laminates (Examples and Comparative Examples) were prepared by interposing a plurality of sealing materials between a first substrate and a second substrate, and each sealing material was heated with a laser to bond the first substrate to the second substrate.

[0121] The first substrate used in the Examples and Comparative Examples was a rectangular silicon substrate. The thickness of the first substrate was 0.4 mm. The second substrate used in the Examples and Comparative Examples was a rectangular glass substrate made of borosilicate glass. The thickness of the second substrate was 0.2 mm.

[0122] The sealing material used in the Examples and Comparative Examples is a composite material (glass frit) containing bismuth-based glass powder and refractory filler powder. It should be noted that the sealing material used in the Examples and Comparative Examples is the same. The composition and properties of the sealing material are shown in Table 1.

[0123] [Table 1]

[0124]

[0125] The sealing material is formed on the second substrate as described below. First, the sealing material and the vehicle (a resin composed of ethyl cellulose and a solvent composed of terpineol) are mixed in a weight ratio of 60% to 40% and kneaded using a three-axis roller to obtain a paste. Then, a second substrate coated with the square closed curve-shaped paste of the embodiment and the comparative example is obtained by screen printing. It should be noted that in the embodiment and the comparative example, the shape (width, thickness) of the paste applied to the second substrate is the same.

[0126] Then, the second substrate coated with the paste was heated at 480°C in an electric furnace for 20 minutes to form a square closed curve-shaped sealing material on the glass substrate. A total of eighty-one sealing materials were formed on the second substrate of the embodiment and the comparative example in an arrangement pattern of nine rows and nine columns. Then, the second substrate with the sealing material formed was covered on the specified position of the first substrate to form a stacked body, and the stacked body was installed on the above-mentioned supporting device. It should be noted that in the embodiment and the comparative example, the shape (width, thickness) of the sealing material formed on the second substrate is the same.

[0127] Next, a near-infrared semiconductor laser with a wavelength of 808 nm is circulated (scanned) twice along the circumference of the sealing material of the stack supported by the support device to heat the sealing material, thereby forming a sealing layer and bonding the first substrate to the second substrate.

[0128] The order of irradiating the sealing material of the embodiment with laser light is as follows: Figure 7 The same way as the example.

[0129] For the sealing material of the comparative example, Figure 12 The laser is irradiated in the order of the arrow B shown. That is, first, the sealing material 6 located at the outermost position, that is, the first row M1 and the first column N1, among the nine rows and nine columns of sealing materials 6 arranged in the laminated body LM of the comparative example is irradiated with laser and heated. Then, the sealing material 6 arranged in the first row M1 is heated in sequence from the second column N2 to the ninth column N9. When the heating of the sealing material 6 located in the first row M1 is completed, the sealing material 6 located in the second row M2 and the first column N1 is irradiated with laser and heated. Then, the sealing material 6 located in the second row M2 is irradiated with laser in sequence from the second column N2 to the ninth column N9. Similarly, the sealing material 6 arranged from the third row M3 to the ninth row M9 is also irradiated with laser in sequence from the first column N1 toward the ninth column N9. All the sealing materials 6 are heated to produce the bonded body of the comparative example.

[0130] The airtight reliability of the bonded bodies of the prepared examples and comparative examples was evaluated by an accelerated degradation test based on the PCT (Pressure Cooker Test). Specifically, the bonded bodies were kept in an environment of 121°C, 2 atmospheres, and 100% relative humidity for 24 hours, and then the area near the sealing layer of the bonded bodies was observed using an optical microscope (100x magnification). This observation was used to evaluate the presence of bonding defects caused by the sealing layer.

[0131] The test results showed that in the bonded bodies of the examples, no bonding failure occurred in any of the sealing layers. On the other hand, in the bonded bodies of the comparative examples, bonding failure occurred in approximately 30% of the sealing layers.

[0132] Description of Reference Numerals

[0133] 1 Conjugate

[0134] 2. First substrate

[0135] 3 Second substrate

[0136] 4 Sealing layer

[0137] 6 Sealing materials

[0138] 6a Sealing material located closest to the center of the arrangement pattern

[0139] 6j Sealing material located closest to the center of the arrangement pattern

[0140] 6k Sealing material located closest to the center of the pattern

[0141] 6l Sealing material located closest to the center of the arrangement pattern

[0142] 6m Sealing material located closest to the center of the arrangement pattern

[0143] 8 Support device

[0144] 11 Support plate

[0145] IG medial group

[0146] IG1 First inner group

[0147] IG2 Second inner group

[0148] IG3 Third inner group

[0149] IG4 Fourth Inner Group

[0150] L Laser

[0151] LM laminate

[0152] O Arrange the center of the pattern

[0153] OG Outer Group

Claims

1. A method for manufacturing a joint body, characterized in that: A method for manufacturing a bonded structure including a first substrate, a second substrate, and a plurality of sealing layers bonding the first substrate and the second substrate, comprising: a lamination step of interposing a plurality of sealing materials between the first substrate and the second substrate and overlapping the first substrate and the second substrate to form a laminate; and a bonding step of irradiating the plurality of sealing materials in the stacked body with laser light to form the plurality of sealing layers; The plurality of sealing materials in the stacked body are interposed between the first substrate and the second substrate in a predetermined arrangement pattern. The arrangement pattern includes an outer group to which the outermost sealing material among the plurality of sealing materials belongs, and an inner group to which the sealing materials located further inward than the sealing materials belonging to the outer group belong, The inner group includes a first inner group, a second inner group, and a third inner group. The first inner group includes the sealing material arranged so as to overlap with the center of the arrangement pattern. The second inner group includes a plurality of the sealing materials arranged on the outside so as to surround the sealing materials belonging to the first inner group. The third inner group includes a plurality of the sealing materials arranged on the outside so as to surround the sealing materials belonging to the second inner group. The bonding process includes: a first bonding process of irradiating the sealing material belonging to the inner group with the laser to form the sealing layer; and a second bonding step of irradiating the sealing material belonging to the outer group with the laser beam to form the sealing layer after the first bonding step. In the first bonding step, when the sealing materials belonging to the third inner group are irradiated with the laser, the sealing materials of the third inner group that are not adjacent to but located apart from the sealing material irradiated last with the laser in the second inner group are irradiated with the laser first.

2. The method for producing a bonded body according to claim 1, wherein: In the first bonding step, the laser beam is first irradiated onto the sealing material located closest to the center of the arrangement pattern among the sealing materials belonging to the inner group.

3. The method for producing a joined body according to claim 1 or 2, wherein: The second substrate is a glass substrate.

4. The method for producing a joined body according to claim 1 or 2, wherein: In the bonding step, the stacked body is supported by a support device that presses the first substrate and the second substrate. The support device includes: a plurality of pressing members for pressing the first substrate against the second substrate; and a support plate disposed between the first substrate and the pressing members. The plurality of pressing members press the one support plate, so that the one support plate presses the first substrate onto the second substrate.

Images